Masking device for packaging tray

Abstract

The present invention relates to a masking device for a package tray, and more particularly, to a masking device for a package tray, which is provided on a package tray in a state in which a chip placed on the package tray is vertically lifted by a heating block, thereby enabling laser processing of the chip while preventing thermal damage to the package tray. The present invention may include a mask portion provided in a lattice shape on an upper side of a package tray to protect the package tray from a heat source, the package tray being formed with placement portions constituting a plurality of rows and columns, the placement portions being used to place chips.

Description

Technical Field

[0001] The present invention relates to a masking device for a packaging tray, and more specifically, to a masking device for a packaging tray in which a chip placed on the packaging tray is in a vertically rising state due to a heating block, and the masking device is provided on the packaging tray, thereby enabling laser processing of the chip while preventing thermal damage to the packaging tray. Background Technology

[0002] A packaging tray is a standardized tray used to store and transfer multiple semiconductor packages.

[0003] Typically, a packaging tray is used to load semiconductor packages onto a process tray for entry into a pre-processing process. Alternatively, it can be used to unload semiconductor packages from a process tray after a process has been completed, or to hold semiconductor packages for inspection processes such as vision testing.

[0004] Furthermore, in order to process semiconductor packages with shielding films formed by sputtering evaporation, a post-processing step is required to separate the semiconductor packages with shielding films formed from the process tray and unload the separated semiconductor packages from the process tray onto the packaging tray.

[0005] In the post-processing step, after the semiconductor package with a masking film formed on it is separated from the process tray by vacuum adsorption using a pick and place picker, the separated semiconductor package is unloaded individually from the process tray to the packaging tray using the picker.

[0006] As described above, the loading of semiconductor packages for forming the shielding film and the unloading of semiconductor packages with shielding films are achieved individually for each semiconductor package via a process tray or a package tray. Therefore, loading a large number of semiconductor packages housed in a package tray onto a process tray or unloading a large number of semiconductor packages from a process tray onto a package tray not only consumes a lot of time, but also reduces production efficiency.

[0007] In particular, the smaller the size of the semiconductor package, the more semiconductor packages can be accommodated in the packaging tray and the process tray. Therefore, as the time required to load or unload semiconductor packages from the process tray gradually increases before or after the sputtering process, production efficiency will decrease.

[0008] Furthermore, during the loading and unloading of the semiconductor package between the packaging tray and the process tray, the semiconductor package may be damaged. Therefore, there is a need for a method that allows laser processing and other processes to be performed while the semiconductor package is contained in the packaging tray, without having to unload the semiconductor package separately from the packaging tray to the process tray.

[0009] Existing technical documents

[0010] Patent documents

[0011] Patent Document 1: Korean Patent No. 10-0874610 (December 11, 2008) Summary of the Invention

[0012] (a) Technical problems to be solved

[0013] The present invention is proposed to solve the prior art problems as described above. The object of the present invention is to provide a masking device for a packaging tray, wherein when a chip placed on the packaging tray is in a state of vertical rise due to a heating block, the masking device is provided on the packaging tray, thereby enabling laser processing of the chip while preventing thermal damage to the packaging tray.

[0014] (II) Technical Solution

[0015] To achieve the objectives described above, the present invention may include a mask portion arranged in a grid shape on the upper side of a packaging tray to protect the packaging tray from heat sources, wherein the packaging tray has placement portions forming multiple rows and columns for placing chips.

[0016] Furthermore, the mask portion may include: a first mask, which is laterally disposed on the upper side of the packaging tray; and a second mask, which is longitudinally disposed on the upper side of the packaging tray so as to intersect with the first mask.

[0017] Furthermore, the first mask may be formed in the shape of a rod and disposed between the vertical components of the heating block that enters the placement portion of the packaging tray.

[0018] Furthermore, a protrusion may be formed on the first mask.

[0019] Furthermore, the second mask may be configured to penetrate the first mask or overlap with the first mask.

[0020] Furthermore, the second mask can be composed of multiple rods, with one end of each rod forming a single unit through a connecting part.

[0021] Furthermore, the mask portion is composed of a third mask and a fourth mask stacked on top of each other. The third mask and the fourth mask can be formed such that the through holes are arranged in a grid pattern with multiple rows and columns. The through holes have at least a shape and size that allow the chip placed on the vertical component of the heating block to pass through.

[0022] Furthermore, the third and fourth masks are moved parallel to each other in opposite directions, such that one side of the through-hole in the moving direction is covered by the other mask, thereby covering the packaging tray exposed from the periphery of the chip placed on the vertical component.

[0023] (III) Beneficial Effects

[0024] The present invention has the following effect: when the chip placed on the packaging tray is in a vertically rising state due to the heating block, and the masking device is set on the packaging tray, the chip can be laser processed while preventing thermal damage to the packaging tray. Attached Figure Description

[0025] Figure 1 This is a perspective view showing the state in which the masking device for the packaging tray of the present invention is installed on the packaging tray.

[0026] Figure 2 A perspective view showing the separated state of the masking device for the packaging tray of the present invention.

[0027] Figure 3 A diagram illustrating the first mask of the packaging tray masking device of the present invention.

[0028] Figure 4 A diagram illustrating the second mask of the packaging tray masking device of the present invention.

[0029] Figure 5 for Figure 1 A-A' sectional view.

[0030] Figure 6 for Figure 5 A magnified view of a portion of the image.

[0031] Figure 7 A top view showing the installation state of the masking device for the packaging tray of the present invention.

[0032] Figures 8 to 12 The diagram illustrates the process of setting up the masking device for the packaging tray of the present invention and performing the laser process.

[0033] Figure 13 A diagram illustrating a masking device for a packaging tray according to another embodiment of the present invention.

[0034] Figure 14 To show Figure 13A diagram showing the setup status of the mask section.

[0035] Explanation of reference numerals in the attached figures:

[0036] 10: Packaging tray

[0037] 12: Placement Section

[0038] 20: Chip

[0039] 30: Heating block

[0040] 32: Vertical components

[0041] 50: Masking device for packaging trays

[0042] 100, 200: Mask section

[0043] 110: First Mask

[0044] 112: Protrusion

[0045] 114: Through hole

[0046] 116: Inclined surface

[0047] 118: Support Port

[0048] 120: Second Mask

[0049] 122: Connecting part

[0050] 130: Moving Unit

[0051] 132: Connecting Main Body

[0052] 134: Linear guide rail

[0053] 136: Anti-floating guide rail

[0054] 210: Third Mask

[0055] 212, 222: Through holes

[0056] 220: Fourth Mask Detailed Implementation

[0057] The embodiments of this invention are examples used to illustrate the technical concept of this invention. The scope of protection of this invention is not limited to the embodiments disclosed below or the specific description of those embodiments.

[0058] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. All terms used in this invention are for further clarification only and are not intended to limit the scope of the invention.

[0059] The expressions “comprising,” “having,” “possessing,” etc., used in this invention should be understood as open-ended terms that include the possibility of including other embodiments, unless otherwise stated in the statement or text that includes such expressions.

[0060] Unless otherwise defined, the singular expressions described in this invention may include plural meanings, which may also apply to the singular expressions recorded within the scope of the invention claims.

[0061] Hereinafter, a preferred embodiment of the packaging tray masking device of the present invention will be described in detail with reference to the accompanying drawings.

[0062] Figure 1 A perspective view showing the state in which the masking device for the packaging tray of the present invention is installed on the packaging tray. Figure 2 A perspective view showing the separated state of the masking device for the packaging tray of the present invention. Figure 3 A diagram illustrating the first mask of the packaging tray masking device of the present invention, Figure 4 A diagram illustrating the second mask of the packaging tray masking device of the present invention, Figure 5 for Figure 1 Sectional view A-A' Figure 6 for Figure 5 A magnified view of a portion of the image. Figure 7 A top view showing the installation state of the masking device for the packaging tray of the present invention. Figures 8 to 12 The diagram illustrates the process of setting up the masking device for the packaging tray of the present invention and performing the laser process. Figure 13 A diagram illustrating a masking device for a packaging tray according to another embodiment of the present invention is provided. Figure 14 To show Figure 13 A diagram showing the setup status of the mask section.

[0063] This invention relates to a masking device 50 for a packaging tray, wherein when a chip placed on the packaging tray is in a vertically rising state due to a heating block, the masking device is provided on the packaging tray, thereby allowing laser processing of the chip to be performed while preventing thermal damage to the packaging tray. Figures 1 to 7 As shown, the structure may include a mask portion 100 arranged in a grid shape on the upper side of the packaging tray 10 to protect the packaging tray 10 from the influence of heat sources. The packaging tray 10 has a placement portion 12 that forms multiple rows and columns for placing the chip 20.

[0064] As the vertical component 32 of the heating block 30 enters from below through the placement portion 12, the chip 20 placed in the placement portion 12 of the packaging tray 10 is fixed to the upper part of the heating block 30 during the upward movement.

[0065] The area of ​​the chip 20 is larger than the upper area of ​​the vertical component 32, and therefore it is positioned to protrude outwards from the upper periphery of the vertical component 32.

[0066] In this case, the mask portion 100 is disposed in the space between the packaging tray 10 and the chip 20, preventing the packaging tray 10 from being exposed on a plane, and protecting the packaging tray 10 from the influence of heat sources when the chip 20 is laser-processed.

[0067] More specifically, the mask portion 100 may include: a first mask 110, which is laterally disposed on the packaging tray 10; and a second mask 120, which is longitudinally disposed on the packaging tray 10 and intersects with the first mask 110.

[0068] In this case, the first mask 110 is formed in the shape of a rod and is disposed between the vertical members 32 of the heating block 30 that enter the placement portion 12 of the packaging tray 10, and protrusions 112 are formed on both sides in the width direction.

[0069] When the first mask 110 is placed on the packaging tray 10, the protrusion 112 is formed protruding toward the vertical member 32 and located on the underside of the chip 20 placed on the adjacent vertical member 32.

[0070] On the other hand, the second mask 120 is composed of a plurality of rods, one end of each rod being formed into one piece by a connecting part 112.

[0071] The width of the rod portion may be greater than the spacing between the chips 20 placed in the vertical component 32, and the second mask 120 may penetrate the first mask 110 and intersect with each other.

[0072] That is, as the rod portion of the second mask 120 passes through the through hole 114 formed along the width direction of the first mask 110, the first mask 1120 and the second mask 120 can be arranged crosswise.

[0073] In this case, the second mask 120 enters the through hole 114 of the first mask 110 and supports the first mask 110. Preferably, the second mask 120 is made of a material with a specified rigidity and can stably support the first mask 110.

[0074] According to the structure described above, the first mask 110 and the second mask 120 are combined to form a lattice shape. The rod portion of the second mask 120 and the protrusion 112 of the first mask 110 are close to the bottom surface of the chip 20, such as... Figure 7As shown, to prevent the packaging tray 10 from being exposed between the configured chips 20 on a flat surface, in the case of laser processing of the chips 20, the laser beam L irradiating toward the upper surface of the chips 20 can be effectively blocked from reaching the packaging tray 10 through the first mask 110 and the second mask 120 to prevent the laser from causing heat loss to the packaging tray.

[0075] The following is for reference Figures 8 to 12 This describes the series of processes.

[0076] First, such as Figure 8 As shown, the packaging tray 10 on which the chip 20 is placed on the placement section 12 is placed on the heating block 30.

[0077] In this case, such as Figure 9 As shown, as the vertical component 32 of the heating block 30 enters through the placement portion 12, the chip 20 is vertically raised to separate it from the packaging tray 10.

[0078] Next, as Figure 10 As shown, the first mask 110 is positioned between the vertical components 32 of the heating block 30.

[0079] In this case, the protrusion 112 of the first mask 110 is located on the underside of the chip 20.

[0080] Subsequently, as Figure 11 As shown, the second mask 120 passes through the through hole 114 of the first mask 110 and forms a grid, thereby completing the installation of the mask part 100 of the present invention.

[0081] Then, Figure 12 Part (a) is Figure 7 The B-B' section, Figure 12 Part (b) is Figure 7 The C-C' section, such as Figure 12 As shown in part (a), when laser processing is performed on chip 20, the laser beam L irradiating toward the upper surface of chip 20 is blocked from reaching the packaging tray 10 by the protrusion 112 of the first mask 110, as... Figure 12 As shown in part (b), the laser beam L is blocked from reaching the packaging tray 10 by the second mask 120 to prevent thermal damage to the packaging tray 10 caused by the laser (heat source).

[0082] On the other hand, an inclined surface 116 is formed on the protrusion 112 of the first mask 110, such that the two ends of the through hole 114 are inclined downward toward the outside of the width direction of the first mask 110.

[0083] Therefore, when the second mask 120 enters the through hole 114 of the first mask 110, the second mask 120 can be easily guided to combine with the first mask 110 along the inclined surface 116.

[0084] On the other hand, the second mask 120 can be combined with or decoupled from the first mask 110 by the moving unit 130.

[0085] In this case, the moving unit 130 includes: a connecting body 132, a connecting portion 122 of the second mask 120 is provided; and a linear guide rail 134, which is combined with the connecting body 132 to allow the connecting body 132 to move back and forth.

[0086] Therefore, as the linear guide 134 operates, the connecting body 132 and the second mask 120 connected to it can be moved back and forth to engage with or disengage from the first mask 110.

[0087] It also includes an anti-floating guide rail 136, which is used to guide the connecting body 132 to prevent it from floating when the connecting body 132 and the second mask 120 connected thereto move.

[0088] On the other hand, although not shown, the rod portion of the second mask 120 enters the lower side of the first mask 110, and as it overlaps with and supports the first mask 110, the first mask 110 and the second mask 120 can be arranged crosswise.

[0089] In this case, the first mask 110 has an upwardly recessed groove (not shown) on its bottom surface, the size of which corresponds to the width of the rod portion of the second mask 120. When the first mask 110 is arranged to cross the second mask 120, it can be used to prevent the two masks from floating together.

[0090] On the other hand, according to yet another embodiment of the present invention, such as Figure 13 As shown, the mask portion 200 is composed of a third mask 210 and a fourth mask 220 stacked on top of each other. The third mask 210 and the fourth mask 220 are formed such that the through holes 212 and 222 are arranged in a grid pattern corresponding to the position of the placement portion 12 of the packaging tray 10, forming multiple rows and columns. The through holes 212 and 222 have a shape and size through which the chip 20 can pass.

[0091] Therefore, with the through holes 212 and 222 of the third mask 210 and the fourth mask 220 stacked on top of each other, the mask part 200 can place the chip 20 on the packaging tray 10 through the through holes 212 and 222.

[0092] That is, such as Figure 14As shown in parts (a) to (b), the mask part 200 is set when the chip 20 is placed on the vertical part 32 of the heating block 30 that enters through the placement part 12 of the packaging tray 10.

[0093] Next, as Figure 14 As shown in part (c), if the third mask 210 and the fourth mask 220 are moved parallel to each other in opposite directions, that is, if the third mask 210 and the fourth mask 220 are moved parallel to each other in left-right, up-down or opposite diagonal directions, one side of the through holes 212, 222 in the moving direction is covered by the other masks 210, 220.

[0094] Therefore, when the third mask 210 and the fourth mask 220 are moved in parallel, the packaging tray 10 exposed from the periphery of the chip 20 placed on the vertical component 32 can be covered by other masks 210 and 220 covering the through holes 212 and 222. Thus, the laser beam used to process the chip 20 can be effectively blocked from reaching the packaging tray 10 by the mask portion 200 to prevent thermal damage to the packaging tray 10 caused by the laser.

[0095] Therefore, the packaging tray masking device 100 of the present invention, as described above, has many advantages. When the chip placed on the packaging tray is in a state of vertical rise due to the heating block, the masking device is provided on the packaging tray, thereby enabling laser processing of the chip while preventing thermal damage to the packaging tray.

[0096] While the preferred embodiments of the present invention have been described above through examples, it is obvious that the present invention is not limited to the described embodiments, and those skilled in the art can make various modifications without departing from the technical concept of the present invention.

Claims

1. A masking device for packaging trays, characterized in that, It includes a mask portion arranged in a grid shape on the upper side of the packaging tray to protect the packaging tray from heat sources. The packaging tray has placement portions arranged in multiple rows and columns for placing chips. The mask portion includes: A first mask is laterally disposed on the upper side of the packaging tray; and The second mask is vertically disposed on the upper side of the packaging tray so as to intersect with the first mask. The second mask is configured to penetrate the first mask or overlap with the first mask.

2. The masking device for packaging trays according to claim 1, characterized in that, The first mask is formed in the shape of a rod and is disposed between the vertical components of the heating block that enters the placement portion of the packaging tray.

3. The masking device for packaging trays according to claim 1, characterized in that, A protrusion is formed in the first mask.

4. The masking device for packaging trays according to claim 1, characterized in that, The second mask is composed of multiple rods, with one end of each rod forming a single unit through a connecting part.

5. A masking device for packaging trays, characterized in that, It includes a mask portion arranged in a grid shape on the upper side of the packaging tray to protect the packaging tray from heat sources. The packaging tray has placement portions arranged in multiple rows and columns for placing chips. The mask section is composed of a third mask and a fourth mask stacked on top of each other. The third and fourth masks are formed such that the vias are arranged in a grid pattern with multiple rows and columns, and the vias have at least a shape and size that allow a chip placed on a vertical component of the heating block to pass through.

6. The masking device for packaging trays according to claim 5, characterized in that, The third and fourth masks are moved parallel to each other in opposite directions, such that one side of the through-hole in the moving direction is covered by the other mask, thereby covering the packaging tray exposed from the periphery of the chip placed on the vertical component.

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