Wafer position calibration equipment

Abstract

The invention provides wafer position calibration equipment, relates to the technical field of semiconductor processing equipment, and is designed for solving the problems that the existing equipment for carrying out center searching and positioning on a wafer is poor in calibration effect and the position of the wafer cannot be well determined. Comprising a machine table, a movement module, a chuck, an auxiliary tool and a laser sensor, the movement module is installed on the machine table, and the output end of the movement module has the movement freedom degree in the X direction, the movement freedom degree in the Y direction and the rotation freedom degree in the Z direction; the chuck is detachably mounted at the output end of the motion module; the auxiliary tool is in a disc shape, the auxiliary tool can be detachably connected to the output end of the movement module, and the diameter of the auxiliary tool is larger than that of the chuck; the laser sensor is installed on the machine table and comprises a transmitting end and a receiving end which are spaced in the Z direction, and a detection space is formed between the transmitting end and the receiving end. According to the invention, the circle center position of the wafer can be accurately determined.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing equipment technology, and more specifically, to a wafer position calibration device. Background Technology

[0002] In the semiconductor device manufacturing process, there are situations where it is necessary to center and position the wafer. Existing solutions achieve this by detecting the position of the wafer's center point and the position of the notch.

[0003] However, existing equipment used for wafer centering and positioning has poor calibration performance and cannot accurately determine the wafer's position. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer position calibration device to solve the technical problem that existing devices used for wafer centering and positioning have poor calibration effects and cannot accurately determine the position of the wafer.

[0005] The wafer position calibration equipment provided by this invention includes a machine base, a motion module, a chuck, an auxiliary fixture, and a laser sensor. The motion module is mounted on the machine base, and its output end has a degree of freedom of movement along the X-axis, a degree of freedom of movement along the Y-axis, and a degree of freedom of rotation about the Z-axis. The chuck is detachably mounted on the output end of the motion module and is used to fix the wafer. The auxiliary fixture is disk-shaped and detachably connected to the output end of the motion module, and its diameter is larger than that of the chuck. The laser sensor is mounted on the machine base and includes a transmitting end and a receiving end spaced apart along the Z-axis, forming a detection space between the transmitting end and the receiving end to accommodate the contour of the auxiliary fixture.

[0006] Furthermore, the wafer position calibration equipment also includes an adjustment component, which is mounted on the machine base. The laser sensor is mounted on the adjustment component, and the adjustment component is used to adjust the horizontal deflection angle and vertical pitch angle of the laser sensor.

[0007] Furthermore, the adjustment assembly includes a fixing frame, a sensor mounting base, a fixing screw, and a first set screw. One of the fixing frame and the sensor mounting base has a strip-shaped hole extending along the Z-direction, and the other of the fixing frame and the sensor mounting base has a fixing screw hole. The fixing screw passes through the strip-shaped hole and is screwed into the fixing screw hole. The fixing frame also has a first set screw hole with its axis along the Z-direction. The first set screw is disposed in the first set screw hole and abuts against the sensor mounting base. The laser sensor is fixedly mounted on the sensor mounting base.

[0008] Furthermore, the adjustment assembly also includes a second set screw, and the fixing bracket also has a second set screw hole. The sensor mounting base has a connecting screw hole for fixed connection with the laser sensor, and the axis of the connecting screw hole is along the Y direction. The axis of the second set screw hole is along the X direction, and the second set screw is disposed in the second set screw hole and abuts against the laser sensor.

[0009] Furthermore, the motion module includes a linear motion component and a rotary motion component mounted on the linear motion component. The linear motion component is used to move the rotary motion component along the X-axis and along the Y-axis. The rotary motion component includes a bracket, an auxiliary mounting base, a drive motor, a drive wheel, a driven wheel, and a flexible transmission body. The bracket is fixedly connected to the linear motion component. The drive wheel and the driven wheel are arranged along a first direction. The flexible transmission body is sleeved on and supported by the drive wheel and the driven wheel. The auxiliary mounting base is adjustablely mounted on the bracket along the first direction. The drive wheel is rotatably mounted on the auxiliary mounting base. The drive motor is mounted on the bracket and drivenly connected to the drive wheel. The chuck is coaxially fixedly connected to the driven wheel.

[0010] Furthermore, the rotary motion assembly also includes a tension plate and a tension screw. The tension plate is fixedly mounted on the bracket and is located on the side of the driving wheel away from the driven wheel. The tension screw is mounted on the tension plate and fixedly connected to the auxiliary mounting base.

[0011] Furthermore, the rotary motion assembly also includes a fastening screw, one of the bracket and the auxiliary mounting base has an adjustment elongated hole extending along the first direction, and the other of the bracket and the auxiliary mounting base has a fastening screw hole, the fastening screw passing through the adjustment elongated hole and screwed into the fastening screw hole.

[0012] Furthermore, the chuck is provided with adsorption holes for adsorbing wafers and adsorption air channels communicating with the adsorption holes, and the driven wheel is provided with a medium air channel, which is opposite to and communicates with the adsorption air channel.

[0013] Furthermore, the rotary motion assembly also includes a support plate and an intermediate support block. The support plate is spaced apart from the bracket along the Z direction and is located above the bracket. The intermediate support block is located between the support plate and the bracket and is arranged around the driven wheel. The intermediate support block has a notch on the side facing the driving wheel, and the notch is used to allow the flexible transmission body to pass through. The driven wheel is also rotatably connected to the support plate.

[0014] Furthermore, the machine tool has an installation space and a first opening and a second opening that are both connected to the installation space. The first opening and the second opening are both located on the top of the machine tool. The motion module and the laser sensor are at least partially accommodated in the installation space and are exposed from the first opening and the second opening, respectively.

[0015] The beneficial effects of the wafer position calibration device of this invention are:

[0016] By setting up a wafer position calibration device mainly composed of a machine base, motion module, chuck, auxiliary fixtures and laser sensors, when the wafer position needs to be calibrated, that is, when the wafer needs to be centered and positioned, the auxiliary fixture can be installed on the output end of the motion module, so that the auxiliary fixture can move along the X direction, move along the Y direction and rotate around the Z direction.

[0017] The following explanation uses the distance between the output end of the motion module and the laser sensor along the Y-axis as an example. By moving the auxiliary fixture along the Y-axis, its contour can be positioned within the detection space formed between the transmitter and receiver. Since the diameter of the auxiliary fixture is fixed, its reciprocating movement along the X-axis and the changes in the laser sensor readings can be used to find the farthest point of its contour on the side facing the laser sensor—that is, to find the diameter position of the auxiliary fixture. This ensures that the center of the auxiliary fixture is aligned with the laser sensor's light-emitting array, and consequently, the rotation center of the motion module's output end is aligned with the laser sensor's light-emitting array. After removing the auxiliary fixture and installing the chuck, the rotation center of the chuck is aligned with the laser sensor's light-emitting array, achieving the centering purpose. Once the wafer is fixed to the chuck, the rotation of the motion module's output end around the Z-axis causes the wafer to rotate, allowing the laser sensor to detect the notch on the wafer.

[0018] The wafer position calibration device, through the above settings, can accurately determine the center position of the wafer, achieving good calibration results and effectively solving the technical problems in the prior art. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the wafer position calibration device provided in an embodiment of the present invention after calibration.

[0021] Figure 2 This is a schematic diagram of the wafer position calibration device provided in an embodiment of the present invention during the calibration process;

[0022] Figure 3 This is a partial structural schematic diagram of the wafer position calibration device provided in an embodiment of the present invention;

[0023] Figure 4 This is a partial structural diagram of the motion module of the wafer position calibration device provided in an embodiment of the present invention mounted on the frame base plate;

[0024] Figure 5 A schematic diagram of the rotating motion component of the motion module of the wafer position calibration device provided in an embodiment of the present invention;

[0025] Figure 6 This is a structural cross-sectional view of the rotating motion component of the motion module of the wafer position calibration device provided in an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of the intermediate support block of the rotating motion component of the motion module of the wafer position calibration device provided in an embodiment of the present invention;

[0027] Figure 8 One of the installation diagrams of the laser sensor in the wafer position calibration device provided in the embodiment of the present invention;

[0028] Figure 9 This is the second schematic diagram of the installation of the laser sensor in the wafer position calibration device provided in this embodiment of the invention.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100 - Machine tool; 200 - Motion module; 300 - Chuck; 400 - Auxiliary tooling; 500 - Laser sensor; 600 - Adjustment component;

[0031] 110 - Installation space; 120 - First opening; 130 - Second opening; 140 - Frame base plate; 150 - Interface assembly; 160 - Sensor housing;

[0032] 210 - X-axis motion component; 220 - Y-axis motion component; 230 - Rotational motion component;

[0033] 211-X-axis base plate; 212-X-axis motor; 213-X-axis drive wheel; 214-X-axis driven wheel; 215-X-axis mounting plate; 216-X-axis lead screw module;

[0034] 221 - Y-axis motor; 222 - Coupling; 223 - Y-axis lead screw module;

[0035] 231-Bracket; 2311-Base plate; 2312-Column; 2313-Mounting plate; 232-Auxiliary mounting base; 233-Drive motor; 234-Driving wheel; 235-Driven wheel; 2351-Air duct; 2352-Encoder; 2353-Air pipe connector; 236-Adapter block; 237-Tensioning plate; 238-Support plate; 239-Intermediate support block; 2391-Notch;

[0036] 310 - Adsorption pore; 320 - Adsorption air passage;

[0037] 410 - Weight reduction hole;

[0038] 510 - Transmitter; 520 - Receiver; 530 - Detection space;

[0039] 610 - Mounting bracket; 620 - Sensor mounting base; 621 - Connecting screw hole; 630 - Strip hole;

[0040] 611-First vertical plate; 612-Second vertical plate; 613-Connecting horizontal plate; 614-First set screw block; 6141-First set screw hole; 6142-First fixing hole; 615-Connecting block; 616-Second set screw block; 6161-Second set screw hole; 6162-Second fixing hole. Detailed Implementation

[0041] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0042] Figure 1 This is a schematic diagram of the wafer position calibration device provided in this embodiment after calibration. Figure 2 This is a schematic diagram of the wafer position calibration device provided in this embodiment during the calibration process. Figure 1 and Figure 2As shown, this embodiment provides a wafer position calibration device, including a machine base 100, a motion module 200, a chuck 300, an auxiliary fixture 400, and a laser sensor 500. The motion module 200 is mounted on the machine base 100, and its output has a translational degree of freedom along the X-axis, a translational degree of freedom along the Y-axis, and a rotational degree of freedom about the Z-axis. The chuck 300 is detachably mounted on the output of the motion module 200 and is used to fix the wafer. The auxiliary fixture 400... The auxiliary tooling 400 is disc-shaped and can be detachably connected to the output end of the motion module 200. The diameter of the auxiliary tooling 400 is larger than the diameter of the chuck 300. The laser sensor 500 is mounted on the machine tool 100 and is spaced apart from the output end of the motion module 200 along the Y direction. The laser sensor 500 includes a transmitting end 510 and a receiving end 520 spaced apart along the Z direction. A detection space 530 for accommodating the contour of the auxiliary tooling 400 is formed between the transmitting end 510 and the receiving end 520.

[0043] By setting up a wafer position calibration device mainly composed of a machine base 100, a motion module 200, a chuck 300, an auxiliary fixture 400, and a laser sensor 500, when it is necessary to calibrate the position of the wafer, that is, when it is necessary to center and position the wafer, the auxiliary fixture 400 can be installed at the output end of the motion module 200, so that the auxiliary fixture 400 can move along the X direction, move along the Y direction, and rotate around the Z direction.

[0044] By moving the auxiliary fixture 400 along the Y-axis, its outline can be positioned within the detection space 530 formed between the transmitter 510 and the receiver 520. Since the diameter of the auxiliary fixture 400 is already determined, the reciprocating movement of the auxiliary fixture 400 along the X-axis and the numerical changes of the laser sensor 500 can be used to find the farthest point of the auxiliary fixture 400's outline on the side facing the laser sensor 500, i.e., to find the diameter position of the auxiliary fixture 400. This ensures that the center of the auxiliary fixture 400 is aligned with the light-emitting linear array of the laser sensor 500, which in turn aligns the rotation center of the output end of the motion module 200 with the light-emitting linear array of the laser sensor 500. Consequently, after removing the auxiliary fixture 400 and installing the chuck 300, the rotation center of the chuck 300 is aligned with the light-emitting linear array of the laser sensor 500, achieving the goal of finding the center. After the wafer is fixed in the chuck 300, the output of the motion module 200 rotates around the Z direction, causing the wafer to rotate, so that the notch of the wafer can be detected by the laser sensor 500.

[0045] The wafer position calibration device, through the above settings, can accurately determine the center position of the wafer, achieving good calibration results and effectively solving the technical problems in the prior art.

[0046] In this embodiment, the chuck 300 may be equipped with a self-centering structure, that is: after the center position of the chuck 300 is determined by the above scheme, the wafer is placed on the chuck 300, and the center of the wafer is automatically determined.

[0047] Please continue to refer to Figure 2 In this embodiment, the auxiliary tooling 400 is provided with multiple weight reduction holes 410.

[0048] Figure 3 This is a partial structural diagram of the wafer position calibration device provided in this embodiment; Figure 4 This is a partial structural diagram of the motion module 200 of the wafer position calibration equipment provided in this embodiment, mounted on the frame base plate 140. Figure 3 and Figure 4 As shown, the motion module 200 of the wafer position calibration device includes a linear motion component and a rotary motion component 230 mounted on the linear motion component. The linear motion component is used to move the rotary motion component 230 along the X-direction and along the Y-direction. The linear motion component includes an X-direction motion component 210 and a Y-direction motion component 220.

[0049] Please continue to refer to Figure 4 In this embodiment, the Y-axis motion component 220 is mounted on the machine base 100, specifically on the frame base plate 140 of the machine base 100; the X-axis motion component 210 is mounted on the output end of the Y-axis motion component 220 and is driven by the Y-axis motion component 220 to move along the Y direction; the rotary motion component 230 is mounted on the output end of the X-axis motion component 210. Specifically, the Y-axis motion component 220 includes a Y-axis motor 221, a coupling 222, and a Y-axis lead screw module 223. The housing of the Y-axis motor 221 is fixedly mounted on the frame base plate 140, and the motor shaft of the Y-axis motor 221 is connected to the Y-axis lead screw module 223 through the coupling 222, so as to enable the Y-axis lead screw module 223 to generate power output along the Y direction, thereby realizing the movement of the X-axis motion component 210 mounted thereon along the X direction.

[0050] Please continue to refer to Figure 4In this embodiment, the X-axis motion component 210 includes an X-axis base plate 211, an X-axis motor 212, an X-axis drive wheel 213, an X-axis driven wheel 214, an X-axis mounting plate 215, and an X-axis lead screw module 216. Specifically, the X-axis base plate 211 is fixedly connected to the output end of the Y-axis lead screw module 223; the X-axis mounting plate 215 is perpendicularly fixedly connected to the X-axis base plate 211; the housing of the X-axis motor 212 is fixedly connected to the X-axis mounting plate 215. The drive wheel 213 is fixedly mounted on the motor shaft of the X-axis motor 212, and the driven wheel 214 is rotatably mounted on the X-axis mounting plate 215. The drive wheel 213 and the driven wheel 214 are connected by a synchronous belt. The X-axis lead screw module 216 is mounted on the X-axis base plate 211, and its input end is fixedly connected to the driven wheel 214 so that the rotation of the driven wheel 214 can realize the power output of the X-axis lead screw module 216 along the X direction.

[0051] This arrangement of the X-axis motion component 210 and the Y-axis motion component 220 enables the rotary motion component 230 to move along the X and Y axes with high motion accuracy.

[0052] It should be noted that the specific structures of the X-axis lead screw module 216 and the Y-axis lead screw module 223 are all obtainable by those skilled in the art based on existing technology, and are not the focus of this application's improvement, so they will not be described in detail here.

[0053] In other embodiments, the X-axis motion component 210 may be mounted on the frame base plate 140 of the machine tool 100, and the Y-axis motion component 220 may be mounted on the output end of the X-axis motion component 210. In this case, the rotational motion component 230 may be mounted on the output end of the Y-axis motion component 220.

[0054] Figure 5 A schematic diagram of the rotating motion component 230 of the motion module 200 of the wafer position calibration device provided in this embodiment; Figure 6 This is a cross-sectional view of the rotating motion component 230 of the motion module 200 of the wafer position calibration device provided in this embodiment. Figure 5 and Figure 6As shown, in this embodiment, the rotary motion component 230 includes a bracket 231, an auxiliary mounting base 232, a drive motor 233, a drive wheel 234, a driven wheel 235, and a flexible transmission body. The bracket 231 is fixedly connected to the linear motion component, specifically to the output end of the X-axis lead screw module 216 of the X-axis motion component 210. The drive wheel 234 and the driven wheel 235 are arranged along a first direction. The flexible transmission body is sleeved on and supported by the drive wheel 234 and the driven wheel 235. The auxiliary mounting base 232 is adjustablely mounted on the bracket along the first direction. The drive wheel 234 is rotatably mounted on the auxiliary mounting base 232. The drive motor 233 is mounted on the bracket 231 and is drivenly connected to the drive wheel 234. The chuck 300 is coaxially fixedly connected to the driven wheel 235.

[0055] When the chuck 300 needs to rotate, the drive motor 233 can be started, and the drive motor 233 outputs rotational power to the drive wheel 234. This allows the drive wheel 234 to drive the driven wheel 235 to rotate via the flexible transmission body, thereby achieving the rotation of the chuck 300, which is coaxially fixed to the driven wheel 235. When the flexible transmission body needs to be installed, the position of the auxiliary mounting base 232 along the first direction can be adjusted to tension the flexible transmission body. After tensioning, the drive motor 233 is then mounted on the bracket 231 and connected to the drive wheel 234. This arrangement prevents excessive radial load pressure on the motor shaft of the drive motor 233, thus providing some protection for the drive motor 233.

[0056] In this embodiment, both the driving pulley 234 and the driven pulley 235 can be pulleys, in which case the flexible transmission element is a synchronous belt. In other embodiments, both the driving pulley 234 and the driven pulley 235 can be sprockets, in which case the flexible transmission element is a chain.

[0057] In this embodiment, the first direction is the X direction.

[0058] In this embodiment, the rotary motion component 230 may further include a fastening screw, one of the bracket 231 and the auxiliary mounting base 232 is provided with an adjustment elongated hole extending in the first direction, and the other of the bracket 231 and the auxiliary mounting base 232 is provided with a fastening screw hole, and the fastening screw passes through the adjustment elongated hole and is screwed into the fastening screw hole.

[0059] After adjusting the position of the auxiliary mounting base 232 to tension the flexible transmission body, the auxiliary mounting base 232 can be fixed on the bracket 231 by passing a fastening screw through the adjustment elongated hole and screwing it into the fastening screw hole. This setting allows the auxiliary mounting base 232 to be adjusted and fixed at any position within a certain range, thereby ensuring that the driving wheel 234 and the driven wheel 235 meet the tension requirements.

[0060] Please continue to refer to Figure 5 and Figure 6 In this embodiment, the rotary motion assembly 230 may further include a tension plate 237 and a tension screw. Specifically, the tension plate 237 is fixedly mounted on the bracket 231, and the tension plate 237 is located on the side of the drive wheel 234 away from the driven wheel 235. The tension screw is mounted on the tension plate 237 and fixedly connected to the auxiliary mounting base 232.

[0061] During the assembly of the flexible transmission body, the auxiliary mounting base 232 can be moved away from the driven wheel 235 by tightening the tension screw, thereby tightening the auxiliary mounting base 232 and achieving the purpose of tensioning the flexible transmission body. This method of tensioning the flexible transmission body by using the tension screw ensures reliable tension as the tension screw bears the axial tension.

[0062] Please continue to refer to Figure 6 In this embodiment, the chuck 300 is provided with an adsorption hole 310 for adsorbing wafers and an adsorption air channel 320 communicating with the adsorption hole 310. The driven wheel 235 is provided with an intermediate air channel 2351, which is opposite to and communicates with the adsorption air channel 320.

[0063] The above configuration allows the vacuum effect to be transmitted sequentially through the central air channel 2351 and the adsorption air channel 320 to the adsorption hole 310 of the chuck 300, thereby achieving reliable adsorption and fixation of the wafer by the chuck 300.

[0064] Please continue to refer to Figure 6 In this embodiment, the end of the central air passage 2351 facing away from the chuck 300 is connected to an air pipe connector 2353, which is used to apply vacuum adsorption force to the central air passage 2351.

[0065] Please continue to refer to Figure 5 and Figure 6 In this embodiment, the bracket 231 may include a base plate 2311, columns 2312 and mounting plate 2313. The base plate 2311 and mounting plate 2313 are spaced apart along the Z direction. There are multiple columns 2312, which are fixedly connected to the base plate 2311 and the mounting plate 2313 to provide support for the mounting plate 2313.

[0066] Figure 7 This is a schematic diagram of the intermediate support block 239 of the rotational motion component 230 of the motion module 200 of the wafer position calibration equipment provided in this embodiment. Please continue to refer to... Figure 6 and combined Figure 7In this embodiment, the rotary motion component 230 may further include a support plate 238 and an intermediate support block 239. The support plate 238 and the bracket 231 are spaced apart along the Z direction and are located above the bracket 231. The intermediate support block 239 is located between the support plate 238 and the bracket 231. The intermediate support block 239 is arranged around the driven wheel 235. The intermediate support block 239 has a notch 2391 on the side facing the driving wheel 234. The notch 2391 is used to allow the flexible transmission body to pass through. The driven wheel 235 is also rotatably connected to the support plate 238.

[0067] In this embodiment, the top end of the driven wheel 235 is rotatably connected to the support plate 238, and the bottom end of the driven wheel 235 is rotatably connected to the mounting plate 2313 of the bracket 231, so that both ends of the driven wheel 235 are subjected to rotational support. By setting an intermediate support block 239 on the outer periphery of the driven wheel 235, the intermediate support block 239 supports the support plate 238. The intermediate support block 239 acts as a shaft support, which can further ensure the concentric rotation of the shaft system. Furthermore, by setting an opening in the intermediate support block 239 towards the driving wheel 234, the flexible transmission body can smoothly connect the driving wheel 234 and the driven wheel 235 without affecting the normal operation of the flexible transmission body.

[0068] Please continue to refer to Figure 6 In this embodiment, the driven wheel 235 is also coaxially fixed with an encoder 2352, which is used to record the number of rotations of the driven wheel 235, thereby realizing the determination of the number of rotations of the chuck 300.

[0069] Please continue to refer to Figure 6 In this embodiment, the driven wheel 235 and the chuck 300 are fixedly connected by a transition block 236, wherein the central air passage 2351 passes through the transition block axially.

[0070] Figure 8 This is one of the installation diagrams of the laser sensor 500 in the wafer position calibration device provided in this embodiment; Figure 9 This is the second schematic diagram showing the installation of the laser sensor 500 in the wafer position calibration device provided in this embodiment. Please continue to refer to... Figure 3 and combined Figure 8 and Figure 9 In this embodiment, the wafer position calibration device may further include an adjustment component 600, wherein the adjustment component 600 is mounted on the machine base 100, the laser sensor 500 is mounted on the adjustment component 600, and the adjustment component 600 is used to adjust the horizontal deflection angle and the vertical pitch angle of the laser sensor 500.

[0071] By incorporating the aforementioned adjustment component 600 into the wafer position calibration equipment, the horizontal deflection angle and vertical pitch angle of the laser sensor 500 can be adjusted. Specifically, in this embodiment, this means adjusting the deflection angle of the laser sensor 500 around the Z-axis and the deflection angle around the X-axis. This configuration ensures that after the laser sensor 500 is assembled onto the machine tool 100, it can be adjusted to a suitable angle and position, thereby guaranteeing the reliability of wafer position calibration.

[0072] Please continue to refer to Figure 8 and Figure 9 In this embodiment, the adjustment component 600 may include a fixing frame 610, a sensor mounting base 620, a fixing screw, and a first set screw. One of the fixing frame 610 and the sensor mounting base 620 has a strip-shaped hole 630 extending along the Z direction, and the other of the fixing frame 610 and the sensor mounting base 620 has a fixing screw hole. The fixing screw passes through the strip-shaped hole 630 and is screwed into the fixing screw hole. The fixing frame 610 also has a first set screw hole 6141 with the hole axis along the Z direction. The first set screw is disposed in the first set screw hole 6141 and abuts against the sensor mounting base 620. The laser sensor 500 is fixedly mounted on the sensor mounting base 620.

[0073] When it is necessary to adjust the pitch angle of the laser sensor 500, the first set screw can be turned. The contact between the first set screw and the sensor mounting base 620 causes the sensor mounting base 620 to be polarized around the X direction, thereby adjusting the pitch angle of the sensor mounting base 620, and thus achieving the purpose of adjusting the pitch angle of the laser sensor 500.

[0074] Since the sensor mounting base 620 is fixed in the screw hole by a fixing screw passing through the slotted hole 630, the above assembly relationship allows the sensor mounting base 620 to deflect around the X-axis during the movement of the sensor mounting base 620 by the first set screw abutting against it, thereby achieving the purpose of adjusting the pitch angle of the sensor mounting base 620. After the pitch angle of the laser sensor 500 is adjusted, the fixing screw can be used to fix the sensor mounting base 620 to the mounting bracket 610 to ensure the stability of the laser sensor 500.

[0075] Please continue to refer to Figure 8 and Figure 9In this embodiment, the fixing frame 610 may include a first vertical plate 611, a second vertical plate 612, a connecting horizontal plate 613, and a first set screw block 614. The first vertical plate 611 and the second vertical plate 612 are spaced apart along the X direction, and the connecting horizontal plate 613 is fixedly connected to the first vertical plate 611 and the second vertical plate 612. The first set screw block 614 is connected to the connecting horizontal plate 613, and a first set screw hole 6141 is formed in the first set screw block 614. The sensor mounting base 620 is located between the first vertical plate 611 and the second vertical plate 612.

[0076] After adjusting the pitch angle of the laser sensor 500 using the first set screw, the first set screw block 614 can be fixedly connected to the connecting cross plate 613 to prevent it from falling off. First fixing holes 6142 are provided on both sides of the first set screw hole 6141, and these holes are used to fix the first set screw block 614 to the sensor mounting base 620.

[0077] Please continue to refer to Figure 8 and Figure 9 In this embodiment, the adjustment component 600 may further include a second set screw, and the fixing bracket 610 may also have a second set screw hole 6161. The sensor mounting base 620 may have a connecting screw hole 621 for fixed connection with the laser sensor 500. The axis of the connecting screw hole 621 is along the Y direction. The axis of the second set screw hole 6161 is along the X direction. The second set screw is disposed in the second set screw hole 6161 and abuts against the laser sensor 500.

[0078] When it is necessary to adjust the horizontal deflection angle of the laser sensor 500, the second set screw can be screwed on. The contact action between the second set screw and the laser sensor 500 causes the laser sensor 500 to be subjected to a deflection force. Since the laser sensor 500 is connected to the sensor mounting base 620 through the connecting screw hole 621 along the Y direction of the hole axis, the assembly gap of the connecting screw hole 621 allows the laser sensor 500 to generate polarization around the Z direction, thereby realizing the adjustment of the horizontal deflection angle of the laser sensor 500.

[0079] Please continue to refer to Figure 8 and Figure 9 In this embodiment, the fixing frame 610 may further include a connecting block 615 and a second set screw block 616. Specifically, the connecting block 615 is located at the top of the first vertical plate 611 and the second vertical plate 612, and the connecting block 615 is fixedly connected to the sensor mounting base 620. The second set screw hole 6161 is opened in the connecting block 615, and the second set screw block 616 is located between the connecting block 615 and the laser sensor 500. The second set screw abuts against the laser sensor 500 through the second set screw block 616.

[0080] By setting a second setter block 616, the horizontal deflection angle of the laser sensor 500 can be adjusted by moving the second setter block 616 during the tightening of the second setter, eliminating the need for the second setter to directly contact the laser sensor 500 and avoiding wear caused by the second setter. After adjusting the horizontal deflection angle of the laser sensor 500, the second setter block 616 can be fixedly connected to the connecting block 615 to prevent the second setter block 616 from falling off. Second fixing holes 6162 are provided on both sides of the second setter hole 6161, and the second fixing holes 6162 are used to fix the second setter block 616 to the connecting block 615.

[0081] Please continue to refer to Figure 1 and Figure 3 In this embodiment, the machine tool 100 has an installation space 110 and a first opening 120 and a second opening 130 that are both connected to the installation space 110. The first opening 120 and the second opening 130 are both located on the top of the machine tool 100. The motion module 200 and the laser sensor 500 are at least partially accommodated in the installation space 110 and exposed from the first opening 120 and the second opening 130, respectively.

[0082] The above-mentioned setup enables the concealed installation of the motion module 200 and the laser sensor 500, which provides a certain degree of protection for the motion module 200 and the laser sensor 500. At the same time, it also ensures the neat appearance of the wafer position calibration equipment in this embodiment.

[0083] Please continue to refer to Figure 1 and Figure 2 In this embodiment, the machine tool 100 is also provided with an interface component 150 for realizing electrical connection between the internal structure and the external structure. In addition, the machine tool 100 also includes a sensor cover 160, which covers the laser sensor 500.

[0084] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

[0085] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the term "comprising" or any other variations thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0086] In the above embodiments, descriptions of directions such as "up", "down", and "side" are based on the accompanying drawings.

[0087] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer position calibration device, characterized in that, The system includes a machine base (100), a motion module (200), a chuck (300), auxiliary fixtures (400), and a laser sensor (500). The motion module (200) is mounted on the machine base (100), and its output has a degree of freedom of movement along the X-axis, a degree of freedom of movement along the Y-axis, and a degree of freedom of rotation about the Z-axis. The chuck (300) is detachably mounted on the output of the motion module (200) and is used to fix the wafer. The auxiliary fixtures (400)... The auxiliary tooling (400) is disc-shaped and can be detachably connected to the output end of the motion module (200). The diameter of the auxiliary tooling (400) is larger than the diameter of the chuck (300). The laser sensor (500) is mounted on the machine tool (100) and includes a transmitter (510) and a receiver (520) spaced apart along the Z direction. A detection space (530) is formed between the transmitter (510) and the receiver (520) to accommodate the contour of the auxiliary tooling (400).

2. The wafer position calibration device according to claim 1, characterized in that, The wafer position calibration equipment further includes an adjustment component (600), which is mounted on the machine base (100). The laser sensor (500) is mounted on the adjustment component (600), and the adjustment component (600) is used to adjust the horizontal deflection angle and vertical pitch angle of the laser sensor (500).

3. The wafer position calibration device according to claim 2, characterized in that, The adjustment assembly (600) includes a fixing bracket (610), a sensor mounting base (620), a fixing screw, and a first set screw. One of the fixing bracket (610) and the sensor mounting base (620) has a strip-shaped hole (630) extending along the Z-direction, and the other of the fixing bracket (610) and the sensor mounting base (620) has a fixing screw hole. The fixing screw passes through the strip-shaped hole (630) and is screwed into the fixing screw hole. The fixing bracket (610) also has a first set screw hole (6141) with its axis along the Z-direction. The first set screw is disposed in the first set screw hole (6141) and abuts against the sensor mounting base (620). The laser sensor (500) is fixedly mounted on the sensor mounting base (620).

4. The wafer position calibration device according to claim 3, characterized in that, The adjustment assembly (600) further includes a second set screw, and the fixing bracket (610) also has a second set screw hole (6161). The sensor mounting base (620) has a connecting screw hole (621) for fixed connection with the laser sensor (500). The axis of the connecting screw hole (621) is along the Y direction. The axis of the second set screw hole (6161) is along the X direction. The second set screw is disposed in the second set screw hole (6161) and abuts against the laser sensor (500).

5. The wafer position calibration device according to claim 1, characterized in that, The motion module (200) includes a linear motion component and a rotary motion component (230) mounted on the linear motion component. The linear motion component is used to move the rotary motion component (230) along the X-axis and the Y-axis. The rotary motion component (230) includes a bracket (231), an auxiliary mounting base (232), a drive motor (233), a drive wheel (234), a driven wheel (235), and a flexible transmission body. The bracket (231) is fixedly connected to the linear motion component; the drive wheel (234) and the driven wheel (235) are mounted on the linear motion component. The driven wheel (235) is arranged along the first direction. The flexible transmission body is sleeved and supported on the driving wheel (234) and the driven wheel (235). The auxiliary mounting seat (232) is adjustablely mounted on the bracket (231) along the first direction. The driving wheel (234) is rotatably mounted on the auxiliary mounting seat (232). The drive motor (233) is mounted on the bracket (231) and drivenly connected to the driving wheel (234). The chuck (300) is coaxially fixed to the driven wheel (235).

6. The wafer position calibration device according to claim 5, characterized in that, The rotary motion assembly (230) further includes a tension plate (237) and a tension screw. The tension plate (237) is fixedly mounted on the bracket (231) and is located on the side of the drive wheel (234) away from the driven wheel (235). The tension screw is mounted on the tension plate (237) and is fixedly connected to the auxiliary mounting base (232).

7. The wafer position calibration device according to claim 5, characterized in that, The rotary motion assembly (230) also includes a fastening screw. One of the bracket (231) and the auxiliary mounting base (232) has an adjustment elongated hole extending along the first direction, and the other of the bracket (231) and the auxiliary mounting base (232) has a fastening screw hole. The fastening screw passes through the adjustment elongated hole and is screwed into the fastening screw hole.

8. The wafer position calibration device according to claim 5, characterized in that, The chuck (300) is provided with an adsorption hole (310) for adsorbing wafers and an adsorption air passage (320) communicating with the adsorption hole (310). The driven wheel (235) is provided with a medium air passage (2351), which is opposite to and communicates with the adsorption air passage (320).

9. The wafer position calibration device according to claim 5, characterized in that, The rotary motion assembly (230) further includes a support plate (238) and an intermediate support block (239). The support plate (238) is spaced apart from the bracket (231) along the Z direction and is located above the bracket (231). The intermediate support block (239) is located between the support plate (238) and the bracket (231). The intermediate support block (239) is arranged around the driven wheel (235). The intermediate support block (239) has a notch (2391) on the side facing the driving wheel (234). The notch (2391) is used to allow the flexible transmission body to pass through. The driven wheel (235) is also rotatably connected to the support plate (238).

10. The wafer position calibration device according to claim 1, characterized in that, The machine tool (100) has an installation space (110) and a first opening (120) and a second opening (130) that are both connected to the installation space (110). The first opening (120) and the second opening (130) are both located on the top of the machine tool (100). The motion module (200) and the laser sensor (500) are at least partially accommodated in the installation space (110) and exposed from the first opening (120) and the second opening (130), respectively.

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