Support carrier and semiconductor process equipment

Abstract

The invention discloses a supporting carrier and semiconductor process equipment, the supporting carrier is applied to the semiconductor process equipment and used for supporting a bearing boat in a process pipe of the semiconductor process equipment, the supporting carrier comprises a carrier body and a supporting part arranged on the carrier body, the carrier body is used for being arranged in the process pipe, and the supporting part is used for supporting the bearing boat in the process pipe. And the supporting part is used for supporting the bearing boat. According to the scheme, the problem that the process pipe of the semiconductor process equipment in the related technology is easy to damage can be solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and more particularly to a support carrier and semiconductor process equipment. Background Technology

[0002] In semiconductor manufacturing processes, boron diffusion is one of the key steps in forming a PN junction, playing a central role, especially in the preparation of the P-type doped layer. This process is typically carried out in a semiconductor process chamber capable of performing boron diffusion. By placing the N-type silicon wafer in a high-temperature environment, the boron source gas decomposes and diffuses into the silicon wafer, thereby forming a P-type doped layer on the silicon wafer surface, which ultimately forms a PN junction with the N-type substrate.

[0003] In the boron diffusion process, the carrier boat acts as a support for the silicon wafer, carrying it into the high-temperature process tube. At high temperatures, in addition to the successful diffusion of boron atoms, a series of byproducts are generated, such as liquid boron oxide (B₂O₃) and borosilicate glass (BSG). These byproducts are highly reactive at high temperatures and easily react chemically with the surface of the carrier boat or process tube, causing adhesion at the connection between the carrier boat and the process tube. When the carrier boat completes the boron diffusion process and needs to be lifted and removed from the process tube, if the carrier boat and process tube adhere due to the reaction with byproducts, mechanical stress will be applied to the process tube, potentially leading to damage. Summary of the Invention

[0004] This invention discloses a support carrier and semiconductor process equipment to solve the problem that process transistors in semiconductor process equipment in related technologies are easily damaged.

[0005] To solve the above-mentioned technical problems, the present invention is implemented as follows: In a first aspect, this application discloses a support carrier applied to semiconductor process equipment, used to support a carrier boat within a process tube of the semiconductor process equipment. The support carrier includes a carrier body and a support portion disposed on the carrier body. The carrier body is used to be disposed within the process tube, and the support portion is used to support the carrier boat.

[0006] Secondly, this application also discloses a semiconductor process apparatus, which includes a process tube, a carrier boat, and the support carrier described in the first aspect, wherein the carrier body is disposed inside the process tube.

[0007] The technical solution adopted in this invention can achieve the following technical effects: This application embodiment provides a support carrier that can be placed inside the process tube. The support portion of the support carrier supports the carrier boat, thereby preventing direct contact between the carrier boat and the process tube and thus preventing adhesion between them. Therefore, when the carrier boat needs to be removed from the process tube and lifted, the process tube will not be damaged due to adhesion between the carrier boat and the process tube. Attached Figure Description

[0008] Figure 1 This is an overall schematic diagram of the semiconductor process equipment disclosed in an embodiment of the present invention; Figure 2 This is a cross-sectional schematic diagram of the semiconductor process equipment disclosed in an embodiment of the present invention; Figure 3 This is a partially enlarged schematic diagram of the semiconductor process equipment disclosed in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the first type of vehicle body disclosed in the embodiments of the present invention; Figure 5 for Figure 4 A magnified view of a portion of the image; Figure 6 This is a schematic diagram of the structure of the first type of support disclosed in an embodiment of the present invention; Figure 7 This is a schematic diagram of the cooperation between the first type of vehicle body and the first type of support part disclosed in the embodiments of the present invention; Figure 8 This is a schematic diagram of the structure of the first support vehicle disclosed in an embodiment of the present invention from a first perspective; Figure 9 This is a schematic diagram of the structure of the first support vehicle disclosed in an embodiment of the present invention from a second perspective; Figure 10 This is a schematic diagram of the structure of the second type of support vehicle disclosed in the embodiments of the present invention from a first perspective; Figure 11 This is a schematic diagram of the second type of support structure; Figure 12 This is a structural schematic diagram of the second type of support vehicle disclosed in an embodiment of the present invention from a second perspective.

[0009] Explanation of reference numerals in the attached figures: 100-Process Pipe 200 - Load-bearing boat, 210 - Boat foot, 211 - Support mating surface 300-Supporting vehicle, 310-Vehicle body, 311-Mounting slot, 320-Supporting part, 321-Supporting body, 321a-Supporting surface, 322-Mounting mating part, 330-Limiting mounting part, 331-Side wall, 332-Eaves, 340-Operating part. Detailed Implementation

[0010] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0011] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0012] Please refer to Figures 1 to 12 This invention discloses a support carrier 300, which is applied to semiconductor process equipment and is used to support a carrier boat 200 within the process tube 100 of the semiconductor process equipment.

[0013] The support carrier 300 includes a carrier body 310 and a support portion 320 disposed on the carrier body 310. The carrier body 310 is used to be disposed inside the process tube 100, and the support portion 320 is used to support the carrier boat 200, which is used to support the silicon wafer.

[0014] Specifically, the support carrier 300 can be set inside the process tube 100. When the silicon wafer needs to undergo the corresponding process inside the process tube 100, the carrier boat 200 can carry the silicon wafer into the process tube 100. The carrier boat 200 is supported on the support part 320 of the carrier body 310.

[0015] This embodiment of the application provides a support carrier 300, which can be placed inside the process tube 100. The support portion 320 of the support carrier 300 supports the carrier boat 200, thereby preventing the carrier boat 200 from directly contacting the process tube 100 and thus preventing the carrier boat 200 from sticking to the process tube 100. Therefore, when the carrier boat 200 needs to be removed from the process tube 100 and lifted, the process tube 100 will not be damaged due to sticking between the carrier boat 200 and the process tube 100.

[0016] Since the carrier 300 does not need to be moved after the process is completed, it remains internally within the process tube 100 and does not move frequently. Therefore, adhesion between the carrier body 310 and the process tube 100 will not damage the process tube 100 or the supporting carrier 300. By setting up the supporting carrier 300, the original structure of the process tube 100 and the carrier boat 200 is not altered, thus avoiding the problems of process complexity and high cost associated with modifying the process tube 100 and the carrier boat 200.

[0017] The vehicle body 310 and the support portion 320 can be a single-piece molded structure. By making the vehicle body 310 and the support portion 320 a single-piece molded structure, the overall strength of the supporting vehicle 300 can be improved.

[0018] In order to avoid or alleviate the problem of severe adhesion between the support 320 and the carrier boat 200 due to chemical reactions between the support 320 and the process gas or by-products generated during the process under different process conditions, it is necessary to replace the support carrier 300 with different support carriers under different process conditions to adapt to different process conditions.

[0019] If a different support carrier 300 is provided for each process condition, the number of support carriers 300 will be too large, which will be inconvenient for storage. To reduce the number of support carriers 300, the support part 320 and the carrier body 310 can be detachably connected, so that under different process conditions, only the support part 320 needs to be replaced to meet the corresponding process conditions, thereby helping to reduce the number of support carriers 300.

[0020] It should be noted that the support vehicle 300 may include a vehicle body 310 and multiple support parts 320. Of course, there may be multiple support vehicles 300, but the number of support vehicles 300 is less than the number of support parts 320.

[0021] To improve the stability of the installation of the support part 320 and the vehicle body 310, the vehicle body 310 may optionally have a mounting groove 311, at least a portion of the support part 320 may be disposed in the mounting groove 311, and the shape of the portion of the support part 320 located in the mounting groove 311 is adapted to the shape of the mounting groove 311.

[0022] The support carrier disclosed in this application provides a mounting groove 311 on the carrier body 310, so that the shape of the part of the support 320 located in the mounting groove 311 is adapted to the shape of the mounting groove 311, thereby improving the stability of the installation of the support 320 and the carrier body 310.

[0023] Specifically, the support 320 can be detachably installed in the mounting slot 311 by means of quartz or ceramic screws, bayonets, etc.

[0024] Of course, the support part 320 can also be installed in the mounting groove 311 by interference fit, or the support part 320 can be installed in the mounting groove 311 by welding or bonding. This application embodiment does not impose specific restrictions on the way the support part 320 is installed in the mounting groove 311.

[0025] In another embodiment, the support carrier 300 may further include a limiting mounting portion 330, which may include two side walls 331 and a retaining wall 332. The two side walls 331 may be spaced apart from the carrier body 310. The first end of each side wall 331 may be connected to the carrier body 310, and the retaining wall 332 may be located at the second end of each side wall 331. The retaining walls 332 extend toward the area between the two side walls 331. The two side walls 331 and the retaining wall 332 may form a limiting space, and a first opening communicating with the limiting space may be formed between the retaining walls 332. The orientation of the first opening is away from the carrier body 310. The support portion 320 can be connected to the carrier body 310 through the limiting mounting portion 330.

[0026] The support portion 320 may include a support body 321 and a mounting fitting portion 322, which can be connected to the support body 321. The mounting fitting portion 322 can be inserted into the limiting space and make limiting contact with the eaves 332 in the direction of the first opening. The support body 321 can extend out of the limiting space along the first opening. The support body 321 is used to support the carrier boat 200.

[0027] When the support portion 320 and the limiting mounting portion 330 are installed, the mounting mating portion 322 of the support portion 320 can be inserted into the limiting space from the second openings at both ends of the limiting space, with the support body 321 positioned above the first opening. Specifically, the support body 321 and the mounting mating portion 322 can be clamped onto the retaining edge 332, thereby improving the stability of the support portion 320 and the limiting mounting portion 330. Of course, the shape of the support body 321 can be adapted to the shape of the limiting space, thereby improving the stability of the support portion 320 and the limiting mounting portion 330.

[0028] The support carrier 300 disclosed in this application embodiment is configured with a limiting mounting part 330, which includes two side walls 331 and a retaining wall 332. The two side walls 331 are spaced apart and positioned on the carrier body 310. The first end of each side wall 331 is connected to the carrier body 310, and the retaining wall 332 is positioned at the second end of each side wall 331. This forms a limiting space between the two side walls 331 and the retaining wall 332, creating a first opening that communicates with the limiting space. This allows the mounting fitting part 322 of the support part 320 to be inserted into the limiting space and to make limiting contact with the retaining wall 332 in the direction of the first opening. The support body 321 extends out of the limiting space along the first opening to support the carrier boat 200. Because the mounting fitting part 322 is inserted into the limiting space, the connection between the support part 320 and the limiting mounting part 330 is relatively easier, and the support part 320 is also easier to replace.

[0029] To mitigate the issue of adhesion between the support portion 320 and the carrier boat 200 during the process of carrying the silicon wafer within the process tube 100, the support portion 320 may optionally have a support surface 321a. The carrier boat 200 may include a boat foot 210, which may have a support mating surface 211. One of the support surface 321a and the support mating surface 211 may be a plane, and the other may be an arc-shaped convex surface. The support portion 320 and the carrier boat 200 can be supported and mated by the arc-shaped convex surface and the plane, with the arc-shaped convex surface being tangent to the plane.

[0030] The support carrier 300 disclosed in this application sets one of the support surface 321a of the support part 320 and the support mating surface 211 of the boat foot 210 as a plane and the other as an arc-shaped convex surface. This allows the support part 320 and the carrier boat 200 to support and mate with the plane through the arc-shaped convex surface. The arc-shaped convex surface is tangent to the plane. Since the contact between the arc-shaped convex surface and the plane is similar to point contact, the contact area between the support part 320 and the carrier boat 200 during the support mating can be reduced. This helps to alleviate the situation where the support part 320 and the carrier boat 200 stick together when the carrier boat 200 carries the silicon wafer in the process tube 100 for processing.

[0031] Of course, in other embodiments, the support surface 321a of the support portion 320 and the support mating surface 211 of the boat foot 210 can be flat, or one can be an arc-shaped convex surface and the other an arc-shaped concave surface, etc. The embodiments of this application do not impose specific restrictions on the type of the support surface 321a and the support mating surface 211.

[0032] To ensure the stable placement of the carrier body 310 within the process tube 100, the process tube 100 can optionally be a cylindrical structure, and the carrier body 310 can be an arc-shaped plate structure. When the carrier body 310 is placed within the process tube 100, its outer surface can be in contact with the inner surface of the process tube 100. The outer surface of the carrier body 310 refers to the surface of the arc-shaped plate structure facing away from its center. The contact between the outer surface of the carrier body 310 and the inner surface of the process tube 100 means that the entire outer surface of the carrier body 310 is in contact with the inner surface of the process tube 100. Specifically, the outer diameter of the carrier body 310 can be smaller than the inner diameter of the process tube 100; for example, the outer diameter of the carrier body 310 can be 2 mm smaller than the inner diameter of the process tube 100. This allows for a better fit between the outer surface of the carrier body 310 and the inner surface of the process tube 100, preventing large gaps and suspension. The vehicle body 310 can be fixed by the friction between itself and the process pipe 100, or it can be fixed by welding or by bolts.

[0033] The support carrier 300 disclosed in this application sets the process tube 100 into a cylindrical structure and the carrier body 310 into an arc-shaped plate structure. This allows the outer surface of the carrier body 310 to fit against the inner surface of the process tube 100 when the carrier body 310 is placed inside the process tube 100. Since the curvature of the outer surface of the carrier body 310 matches the curvature of the inner surface of the process tube 100, the contact area between the outer surface of the carrier body 310 and the inner surface of the process tube 100 is large, which helps to improve the stability of the carrier body 310 when it is placed inside the process tube 100.

[0034] Of course, the support carrier 300 can also be supported in the process tube 100 by multiple carrier support feet, or it can be supported in the process tube 100 by other means. This application embodiment does not impose specific restrictions on the cooperation method between the support carrier 300 and the process tube 100.

[0035] In one specific embodiment, the included angle of the center of the support carrier 300 can be 150°, the inner diameter of the process tube 100 can be 500mm, the outer diameter of the support carrier 300 can be 496mm, the inner diameter of the support carrier 300 can be 486mm, and the thickness of the support carrier 300 can be 5mm.

[0036] To facilitate placing the support carrier 300 into or out of the process tube 100, the support carrier 300 may optionally include an operation unit 340. The operation unit 340 may be provided on the carrier body 310, and when the carrier body 310 is provided inside the process tube 100, the operation unit 340 may be located at the end of the carrier body 310 facing the opening of the process tube 100.

[0037] The support carrier 300 disclosed in this application provides an operation part 340 on the carrier body 310, which facilitates placing the support carrier 300 into or removing it from the process tube 100.

[0038] It should be noted that when the carrier boat 200 enters and exits the process tube 100, the carrier body 310 does not enter or exit the process tube 100 along with it. The carrier body 310 is usually disassembled only when the maintenance cycle is reached (each maintenance cycle may involve multiple entries and exits of the carrier boat 200 into and out of the process tube 100), or the carrier body 310 remains inside the process tube 100 throughout its entire lifespan. In other words, the carrier body 310 does not frequently enter or exit the process tube 100, and does not frequently disassemble from the process tube 100. Therefore, this also alleviates the possibility of damage to the process tube 100 when the carrier body 310 is disassembled from the process tube 100.

[0039] To further alleviate the adhesion between the support part 320 and the carrier boat 200, the chemical stability of the material constituting the support part 320 may optionally be higher than that of the material constituting the carrier boat 200.

[0040] It should be noted that the comparison of the chemical stability of the materials constituting the support portion 320 with that constituting the carrier boat 200 is conducted under the same conditions, such as the same temperature, pressure, chemical environment (e.g., the same acidic, alkaline, or neutral environment), reaction conditions, and exposure time. The statement that the chemical stability of the materials constituting the support portion 320 is higher than that of the materials constituting the carrier boat 200 means that, under the same conditions, the material constituting the support portion 320 has a lower capacity to react chemically with other substances than the material constituting the carrier boat 200. More specifically, the chemical stability of the material constituting the support portion 320 relative to acidic or alkaline substances can be higher than that of the material constituting the carrier boat 200 relative to acidic or alkaline substances.

[0041] The support carrier 300 disclosed in this application selects materials whose chemical stability is higher than that of ...

[0042] To alleviate the adhesion between the carrier body 310 and the process tube 100, the chemical stability of the material constituting the carrier body 310 may optionally be higher than that of the material constituting the process tube 100.

[0043] It should be noted that the comparison of the chemical stability of the material constituting the carrier body 310 with the chemical stability of the material constituting the process pipe 100 can be referenced to the comparison of the chemical stability of the material constituting the support part 320 with the chemical stability of the material constituting the carrier boat 200, and will not be repeated here.

[0044] The support carrier 300 disclosed in this application selects materials whose chemical stability is higher than that of ...

[0045] Specifically, when the support boat 200 is made of quartz, the material that makes up the support part 320 is a non-oxide ceramic that does not contain metal elements.

[0046] In the embodiment of this application, when the support boat 200 is made of quartz, the support part 320 is made of non-oxide ceramic quartz without metal elements. This results in the support part 320 having higher hardness, better heat resistance, and stronger chemical stability compared to oxide ceramics (such as quartz). Because the support part 320 has higher hardness, better heat resistance, and stronger chemical stability, the byproducts (such as liquid boron oxide and borosilicate glass) generated during the boron diffusion process in the process tube 100 are less likely to chemically react with the support part 320, thus making it less likely for the connection between the support part 320 and the support boat 200 to stick.

[0047] Furthermore, the material constituting the support portion 320 can be one of silicon carbide, silicon nitride, and boron nitride.

[0048] Because silicon carbide, silicon nitride, and boron nitride are resistant to acid and alkali corrosion, have high hardness, and are resistant to high temperatures (melting point greater than 1200℃), they have high stability, which helps to alleviate the adhesion between the carrier body 310 and the process pipe 100.

[0049] Of course, the material constituting the support part 320 can be other metal-free materials in addition to non-oxide ceramics that do not contain metal elements. The specific materials can be adjusted according to the process gas and the by-products generated during the process. The material constituting the support part 320 should not easily react chemically with the process gas and the by-products generated during the process.

[0050] To prevent the support portion 320 from denting at the support position with the carrier boat 200 due to prolonged support, which could lead to the carrier boat 200 tilting, the support portion 320 may optionally have a higher hardness than the carrier boat 200. This would alleviate the degree of denting at the support position with the carrier boat 200, thereby helping to mitigate the tilting problem of the carrier boat 200.

[0051] This application also discloses a semiconductor process apparatus, which includes a process tube 100, a carrier boat 200, and a support carrier 300 disclosed in the above embodiments, with the carrier body 310 disposed inside the process tube 100.

[0052] The semiconductor process equipment disclosed in this application provides a support carrier 300 as described in the above embodiments. This allows the support carrier 300 to be disposed inside the process tube 100. The support portion 320 of the support carrier 300 supports the carrier boat 200, thereby preventing direct contact between the carrier boat 200 and the process tube 100. This also prevents the carrier boat 200 from sticking to the process tube 100. Therefore, when the carrier boat 200 needs to be removed from the process tube 100 and lifted, the process tube 100 will not be damaged due to sticking between the carrier boat 200 and the process tube 100.

[0053] The above embodiments of the present invention focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0054] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A support carrier, applied to semiconductor process equipment, for supporting a carrier boat (200) within a process tube (100) of the semiconductor process equipment, characterized in that, The support carrier (300) includes a carrier body (310) and a support portion (320) disposed on the carrier body (310). The carrier body (310) is used to be disposed inside the process tube (100), and the support portion (320) is used to support the carrier boat (200).

2. The support carrier according to claim 1, characterized in that, The vehicle body (310) has a mounting groove (311), and at least a portion of the support (320) is disposed in the mounting groove (311). The shape of the portion of the support (320) located in the mounting groove (311) is adapted to the shape of the mounting groove (311).

3. The support carrier according to claim 1, characterized in that, The support carrier (300) further includes a limiting installation part (330), which includes two side walls (331) and a retaining wall (332). The two side walls (331) are spaced apart from the carrier body (310). The first end of the side wall (331) is connected to the carrier body (310). The retaining wall (332) is located at the second end of the side wall (331) and extends toward the area between the two side walls (331). The two side walls (331) and the retaining wall (332) form a limiting space. A first opening communicating with the limiting space is formed between the retaining walls (332). The support part (320) includes a support body (321) and an installation mating part (322). The installation mating part (322) is connected to the support body (321). The installation mating part (322) is inserted into the limiting space and makes limiting contact with the eaves (332) in the direction of the first opening. The support body (321) extends out of the limiting space along the first opening to support the carrier boat (200).

4. The support carrier according to any one of claims 1 to 3, characterized in that, The support part (320) has a support surface (321a), and the carrier boat (200) includes a boat foot (210). The boat foot (210) has a support mating surface (211). One of the support surface (321a) and the support mating surface (211) is a plane, and the other is an arc-shaped convex surface. The support part (320) and the carrier boat (200) are supported and mated by the arc-shaped convex surface and the plane. The arc-shaped convex surface is tangent to the plane.

5. The support carrier according to claim 1, characterized in that, The process tube (100) has a cylindrical structure, and the carrier body (310) has an arc-shaped plate structure. When the carrier body (310) is placed inside the process tube (100), the outer surface of the carrier body (310) is in contact with the inner surface of the process tube (100).

6. The support carrier according to claim 1, characterized in that, The support carrier (300) also includes an operation unit (340), which is provided in the carrier body (310). When the carrier body (310) is located inside the process tube (100), the operation unit (340) is located at the end of the carrier body (310) facing the opening of the process tube (100).

7. The support carrier according to claim 1, characterized in that, The chemical stability of the material constituting the support (320) is higher than that of the material constituting the carrier boat (200).

8. The support carrier according to claim 1, characterized in that, The chemical stability of the material constituting the carrier body (310) is higher than that of the material constituting the process tube (100).

9. The support carrier according to claim 1, characterized in that, When the carrier boat (200) is made of quartz, the material constituting the support part (320) is a non-oxide ceramic that does not contain metal elements.

10. The support carrier according to claim 9, characterized in that, The material constituting the support (320) is one of silicon carbide, silicon nitride, and boron nitride.

11. The support carrier according to claim 1, characterized in that, The hardness of the support (320) is greater than that of the bearing boat (200).

12. A semiconductor process apparatus, characterized in that, It includes a process tube (100), a support boat (200), and a support carrier (300) as described in any one of claims 1 to 11, wherein the carrier body (310) is disposed inside the process tube (100).

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