Crystal suction device and method

Abstract

The invention discloses a crystal suction device and method, and relates to the technical field of die bonders. The crystal suction device comprises a shell, and further comprises an air inlet pipe, an air outlet pipe and an air outlet pipe, the suction nozzle is installed in the shell, and an inner side spring is arranged between the suction nozzle and the air inlet pipe; the synchronous ring is located in the shell, and the synchronous ring slides relative to the shell due to inertia in the downward moving process of the shell; the pressure sensor is located at the upper end of the inner side spring. The pressure sensor with the first detection area and the second detection area is arranged, the inertia force of the synchronous ring is obtained through the first detection area, the pressure of the suction nozzle is obtained through the second detection area, the relative position of the suction nozzle and the air inlet pipe is automatically locked when the ratio of the pressure to the inertia is not changed, and automatic unlocking is achieved when the ratio is changed. Therefore, the suction nozzle is prevented from compressing the spring on the inner side to generate tiny movement in the process of moving up and down along with the shell.

Description

Technical Field

[0001] This invention relates to the field of crystal bonding machine technology, specifically to a crystal suction device and method. Background Technology

[0002] In existing die bonding equipment, the nozzle is usually driven by a mechanical force to move up and down in the vertical direction to pick up and place the wafer. The contact force between the nozzle and the wafer is difficult to control precisely, which can easily lead to excessive contact force causing wafer damage or insufficient contact force causing poor adhesion.

[0003] The patent application with application number CN202211645570.7 proposes a crystal-absorbing device. This device controls the movement of an adjustment plate to adjust the pressing force of the crystal by using the buffering effect of an elastic compression member and the monitoring of a pressure sensor, so as to avoid a sharp increase in pressure and to move the adjustment plate up to reduce the pressure when the pressure exceeds the maximum value.

[0004] However, since the nozzle itself has a certain weight, and the elastic element will deform when subjected to force, when the nozzle moves at high speed in the vertical direction, it will be affected by inertial force and compress the elastic element upward. When the nozzle contacts the wafer, the nozzle will be in a brief state of stillness or change the direction of acceleration, causing the inertial force to disappear or change direction. This causes the elastic element to apply pressure to the nozzle, resulting in the nozzle being subjected to additional impact force when it contacts the wafer, affecting the control of the contact force. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a crystal-absorbing device and method, which solves the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a crystal suction device, comprising a housing, and further comprising: an air inlet pipe fixedly disposed at the top of the housing; a suction nozzle installed inside the housing, the upper end of the suction nozzle inserted into the lower end of the air inlet pipe, and an inner spring between the suction nozzle and the air inlet pipe; a synchronization ring located inside the housing, which slides relative to the housing due to inertia during the downward movement of the housing; a pressure sensor located at the upper end of the inner spring, having a first detection area and a second detection area, the first detection area and the second detection area being used to detect the pressure of the suction nozzle on the inner spring and the inertial force of the synchronization ring, respectively; a pressing component disposed inside the housing for adjusting the height of the suction nozzle; a locking component for locking the relative position of the air inlet pipe and the suction nozzle when the ratio of pressure to inertial force remains constant, and unlocking when the ratio of pressure to inertial force changes; and a controller for receiving electrical signals from the pressure sensor and for controlling the action of the locking component.

[0007] Furthermore, the projection of the inner spring in the vertical direction is located in the first detection area; an outer spring is provided between the synchronization ring and the inner spring, and the projection of the outer spring in the vertical direction is located in the second detection area; a lower support ring is provided on the lower side of the synchronization ring and is supported by the lower support ring, and the lower support ring is fixedly connected to the housing.

[0008] Furthermore, the locking assembly includes: a transverse frame disposed within the housing and capable of sliding relative to the housing along a horizontal plane; a first slide groove and a second slide groove, the first slide groove being disposed on the transverse frame and the second slide groove being disposed on the nozzle, with the lower side of the second slide groove being an open end, and the length directions of the first and second slide grooves forming an angle with the axis of the nozzle in the same direction; and a slider slidably disposed within the first slide groove, with one end of the slider capable of being inserted into the second slide groove.

[0009] Furthermore, the locking assembly also includes: a mounting bracket fixed inside the housing; a coil disposed on the mounting bracket and near the side of the transverse frame, the controller being able to control the coil to be energized or de-energized; a magnet disposed on the transverse frame and near the side of the mounting bracket, the magnetic poles of the magnet being vertically distributed; and a spring piece disposed between the mounting bracket and the transverse frame.

[0010] Furthermore, the pressing assembly includes: an adjusting disc, which is slidably disposed within the housing in a vertical direction, and the pressure sensor is fixedly disposed on the lower side of the adjusting disc; a nut portion, which is fixedly disposed on the upper side of the adjusting disc; and a rotating shaft, which is disposed in the housing in a vertical direction and rotatably mounted on the housing, with a threaded portion at one end of the rotating shaft near the nut portion, the threaded portion engaging with the nut portion.

[0011] Furthermore, the pressing assembly also includes: a gear fixed to the outer circumferential surface of the rotating shaft; a gear ring rotatably disposed within the housing, with the gear located inside the gear ring; the inner side of the gear ring has an internal tooth portion that meshes with the gear; the outer side of the gear ring has an external tooth portion, and a worm gear is provided on the side of the gear ring, which meshes with the external tooth portion; and a micro motor mounted on the housing, which drives the worm gear to rotate, and the controller controls the micro motor's operation based on the pressure of the suction nozzle on the inner spring.

[0012] Furthermore, the inner wall of the air intake pipe is provided with a cylindrical cavity, and a retaining ring is fixed on the outer peripheral surface of the nozzle located in the cylindrical cavity. The retaining ring can slide vertically within the cylindrical cavity.

[0013] Furthermore, it also includes: a vertical drive device, which is located on one side of the housing, and the housing is fixed to the drive part of the vertical drive device; a swing arm, which is located on the side of the vertical drive device away from the housing, and the vertical drive device is fixedly connected to the swing arm; a lateral drive device, which is located at the end of the swing arm away from the vertical drive device, and the end of the swing arm is fixedly connected to the output end of the lateral drive device; both the lateral drive device and the vertical drive device are electrically connected to the controller.

[0014] The present invention also provides a crystal-attracting method applicable to the above-mentioned crystal-attracting device, comprising the following steps: Raw data acquisition stage: Acquire the minimum pressure and maximum safe pressure values ​​for the chip when the nozzle can pick it up; The pressure value in the first detection zone is obtained. When the nozzle is not in contact with the chip and is in a stationary state, the pressure value of the first detection zone is sent to the controller through the pressure sensor. The controller drives the pressing component to adjust the height of the nozzle so that the pressure value is less than the minimum pressure value. The inertial force value within the second detection area is obtained and compared with the pressure value to obtain the pressure ratio. During the crystal pickling stage: control the pickling nozzle to move directly above the wafer and control the pickling nozzle to approach the wafer vertically; During the downward movement of the nozzle, the controller outputs a locking signal to lock the relative position of the air inlet pipe and the nozzle. When the nozzle contacts the chip, the controller outputs an unlocking signal to unlock the locking component. Based on the pressure value in the first detection zone, control the action of the pressing component to keep the contact force between the nozzle and the wafer between the minimum pressure value and the maximum safe pressure value, so that the nozzle can hold the wafer. Control the nozzle to move in the opposite direction in the vertical direction, so that the nozzle can carry the wafer away from the die bond ring.

[0015] Furthermore, during the crystal absorption stage, the controller acquires the state of the ratio in real time. When the ratio remains unchanged, the controller outputs the locking signal; when the ratio changes, the controller outputs the unlocking signal.

[0016] The present invention has the following beneficial effects: (1) The crystal suction device and method, by setting a locking component and a pressure sensor with a first detection area and a second detection area and a synchronization ring, uses the first detection area to obtain the inertial force of the synchronization ring and uses the second detection area to obtain the pressure of the suction nozzle. When the pressure-inertia ratio remains unchanged, the relative position of the suction nozzle and the air inlet pipe is automatically locked, and when the ratio changes, the suction nozzle is automatically unlocked to avoid the suction nozzle compressing the inner spring and causing a small movement during the up-and-down movement with the housing. As a result, when in contact with the wafer, the pressure between the suction nozzle and the wafer cannot be accurately controlled due to the small distance difference, thereby improving the control accuracy of the contact force.

[0017] (2) The crystal suction device and method, by setting a first sliding groove on the transverse frame and a second sliding groove on the suction nozzle, and the first and second sliding grooves are arranged at an angle, when the suction nozzle contacts the wafer, if the pressure between the two is too large, the slider can be pushed back along the first sliding groove, thereby allowing the suction nozzle to move upward, avoiding the situation where the suction nozzle gets stuck when it contacts the wafer when the controller malfunctions, thus improving the safety and reliability of use.

[0018] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 Enlarged diagram of area A in the middle; Figure 3 This is a schematic diagram of the internal structure of the housing of the present invention; Figure 4 This is a front view of the internal structure of the housing of the present invention; Figure 5 This is a schematic diagram of the cooperation between the pressing component and the adjusting plate of the present invention; Figure 6 This is a front view of the pressing component and the adjusting plate of the present invention in action; Figure 7 This is a schematic diagram of the toothed ring structure of the present invention; Figure 8 This is a schematic diagram of the synchronization ring and the outer spring of the present invention. Figure 9 This is a schematic diagram illustrating the working principle of the pressure sensor of the present invention; Figure 10 This is a schematic diagram of the locking component and the suction nozzle of the present invention. Figure 11 This is a schematic diagram of the locking component structure of the present invention; Figure 12 This is a cross-sectional view of the locking component structure of the present invention; Figure 13Schematic diagram of the position of the second slide groove in this invention; Figure 14 This is a schematic diagram showing the fit between the retaining ring and the cylindrical cavity of the present invention; Figure 15 This is a flowchart of the locking component control process of the present invention; Figure 16 This is a flowchart of the control process for the pressure-down component of the present invention.

[0020] In the diagram, 1. Horizontal drive device; 2. Swing arm; 3. Vertical drive device; 4. Housing; 5. Air inlet pipe; 6. Suction nozzle; 7. Micro motor; 8. Gear ring; 81. Internal gear; 82. External gear; 83. Ring groove; 9. Worm gear; 10. Gear; 11. Shaft; 12. Threaded part; 13. Adjusting plate; 14. Nut part; 15. Pressure sensor; 16. Inner spring; 17. Outer spring; 18. Synchronization ring; 19. Retaining ring; 20. Lower support ring; 21. Mounting bracket; 22. Lateral movement bracket; 23. Spring; 24. Magnet; 25. Coil; 26. First slide groove; 27. Slider; 28. Slide rod; 29. ​​Sleeve; 30. Second slide groove; 31. Cylindrical cavity; 32. Retaining ring; 34. Upper support ring; 35. Guide rod; 36. Ball bearing; 37. Fixing ring. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0023] The following is based on Figure 1 - Figure 16 This invention describes the crystal-absorbing device and method provided in the embodiments of the present invention.

[0024] On the one hand, the present invention provides a crystal-absorbing device.

[0025] Please see Figure 1 - Figure 9The crystal suction device provided in this embodiment of the invention includes a housing 4 and an air inlet pipe 5. The air inlet pipe 5 is fixed to the top of the housing 4 and moves up and down synchronously with the housing 4. A suction nozzle 6 is also provided inside the housing 4, with the upper end of the suction nozzle 6 inserted into the lower end of the air inlet pipe 5.

[0026] It also includes a vertical drive device 3, which is located on one side of the housing 4 and the housing 4 is fixed to the drive part of the vertical drive device 3. The vertical drive device 3 can be a voice coil motor or a piezoelectric ceramic linear motor to control the position of the nozzle 6 in the vertical direction. The figure shows a voice coil motor.

[0027] Furthermore, a swing arm 2 and a transverse drive device are provided on one side of the vertical drive device 3. The vertical drive device 3 is fixed to one end of the swing arm 2, and the transverse drive device 1 is located at the end of the swing arm 2 away from the vertical drive device 3. The end of the swing arm 2 is fixedly connected to the output end of the transverse drive device 1. The transverse drive device 1 is used to drive the swing arm 2 to swing in the plane so that the suction nozzle 6 reciprocates between the suction position and the die bonding position.

[0028] In addition, a controller (not shown in the figure) is included. Both the lateral drive device 1 and the vertical drive device 3 are electrically connected to the controller to control the operation of the vertical drive device 3 and the lateral drive device 1.

[0029] like Figure 4 and Figure 9 As shown, the suction nozzle 6 can also move in the vertical direction. There is an inner spring 16 between the suction nozzle 6 and the air inlet pipe 5. A retaining ring 19 is fixed on the outer circumference of the suction nozzle 6 and below the inner spring 16. The lower end of the inner spring 16 is supported on the retaining ring 19. A pressure sensor 15 is also provided on the upper end of the inner spring 16. The pressure sensor 15 can detect the pressure of the suction nozzle 6 on the inner spring 16. When the position of the pressure sensor 15 remains unchanged, the detected value is the pressure between the suction nozzle 6 and the chip. In order to make the inner spring 16 apply pressure to the pressure sensor 15 evenly, a fixing ring 37 can be fixed on the surface of the pressure sensor 15, and the upper end of the inner spring 16 is fixed to the fixing ring 37.

[0030] The pressure sensor 15 is preferably a thin-film sensor or a ring-shaped quartz piezoelectric sensor.

[0031] Furthermore, a synchronization ring 18 is provided inside the housing 4. When the vertical drive device 3 drives the housing 4 to move in the vertical direction, the synchronization ring 18 slides relative to the housing 4 due to inertia. For example, when the housing 4 moves downward, the synchronization ring 18 will move upward relative to the housing 4, thereby applying force to the pressure sensor 15.

[0032] Specifically, a lower support ring 20 is provided on the lower side of the synchronization ring 18. The lower support ring 20 is fixed inside the housing 4, and the lower end of the synchronization ring 18 is supported by the lower support ring 20. An upper support ring 34 is also provided on the upper side of the inner spring 16. A guide rod 35 is fixed vertically between the lower support ring 20 and the upper support ring 34. The guide rod 35 is located close to the outer surface of the lower support ring 20 and the upper support ring 34 to avoid the internal suction nozzle 6 and the inner spring 16. The edge of the synchronization ring 18 passes through the guide rod 35 and can move along the guide rod. The synchronous ring 18 slides within the housing 4, and an outer spring 17 is provided between the synchronous ring 18 and the pressure sensor 15. The outer spring 17 is used to push the synchronous ring 18 to the lower support ring 20 and make it close to the housing 4 when the housing 4 is stationary, so as to avoid the synchronous ring 18 directly colliding with the pressure sensor 15 and generating a sudden force. Correspondingly, a fixing ring 37 can also be provided between the outer spring 17 and the pressure sensor 15 so that the outer spring 17 can apply pressure to the pressure sensor 15 evenly.

[0033] In addition, a locking component is included. The operation of the locking component is controlled by the controller. The locking component is used to lock the relative position of the air intake pipe 5 and the mouthpiece 6 when the pressure-to-inertial force ratio remains constant, and to unlock when the pressure-to-inertial force ratio changes.

[0034] Specifically, when the housing 4 is in a descending state, the suction nozzle 6, under the action of inertial force, applies an upward force to the inner spring 16, thereby generating pressure on the pressure sensor 15. Under the action of its own inertial force, the synchronization ring 18 applies an upward force to the outer spring 17 and applies an inertial force to the pressure sensor 15. Since the suction nozzle 6 and the synchronization ring 18 are not disturbed by external forces during the descent, the pressure and inertial force change synchronously with the acceleration of the housing 4's descent, and the ratio of pressure to inertial force remains unchanged. When the suction nozzle 6 contacts the wafer, the pressure also changes, and the ratio of pressure to inertial force changes.

[0035] When the housing 4 is in the rising state, the suction nozzle 6 is at the lowest point under the action of inertial force and inner spring 16. The synchronizing ring 18 is close to the surface of the lower support ring 20 under its own inertial force and the pressure of the outer spring 17. At this time, the force of both on the pressure sensor 15 remains unchanged, so the ratio of inertial force to pressure remains unchanged.

[0036] When the controller receives the electrical signal from the pressure sensor 15, it can obtain the ratio data of inertial force to pressure, thereby controlling the action of the locking component. This is characterized by locking the relative position of the suction nozzle 6 and the air inlet pipe 5 before the suction nozzle 6 contacts the wafer, and unlocking the relative position of the suction nozzle 6 and the air inlet pipe 5 when the suction nozzle 6 contacts the wafer. This is to prevent the suction nozzle 6 from compressing the inner spring 16 and causing a slight movement as it moves up and down with the housing 4. As a result, the pressure between the suction nozzle 6 and the wafer cannot be accurately controlled due to the slight distance difference when it contacts the wafer.

[0037] like Figure 9 As shown, in order to facilitate the acquisition of the ratio of inertial force to pressure through the pressure sensor 15, the pressure sensor 15 has a first detection area and a second detection area. Specifically, the pressure sensor 15 can be composed of two annular thin film sensors, one of which is located in the inner ring as the first detection area and the other is located in the outer ring as the second detection area.

[0038] Optionally, the pressure sensor 15 consists of a single sensor, with the side closer to the inner ring serving as the first detection area and the side closer to the outer ring serving as the second detection area. The controller groups the data in the first detection area into one group and the data in the second detection area into another group.

[0039] Furthermore, the projection of the inner spring 16 in the vertical direction is located in the first detection area, thereby obtaining the pressure value through the first detection area, and the projection of the outer spring 17 in the vertical direction is located in the second detection area, thereby obtaining the inertial force value through the second detection area.

[0040] like Figure 9 - Figure 13 As shown, the aforementioned locking assembly includes a transverse frame 22, which is disposed within the housing 4 and can slide relative to the housing 4 along a horizontal plane. Preferably, the transverse frame 22 is frame-shaped. A first slide groove 26 is provided on the transverse frame 22, and a slider 27 is slidably disposed within the first slide groove 26. The slider 27 can change its height when sliding. Optionally, two first slide grooves 26 are provided and symmetrically disposed on both sides of the transverse frame 22. A second slide groove 30 is provided on the suction nozzle 6, and the lower side of the second slide groove 30 is an open end. The length directions of the first slide groove 26 and the second slide groove 30 form an angle with the axis of the suction nozzle 6 in the same direction, preferably 45°, that is, the first slide groove 26 and the second slide groove 30 are both inclined in the same direction. One end of the slider 27 can be inserted into or slide out of the second slide groove 30 through the open end. (Refer to...) Figure 12 and Figure 13When the transverse frame 22 moves horizontally, it can drive the slider 27 to move. At the same time, the slider 27 moves upward under the guidance of the first slide groove 26 and the second slide groove 30. At this time, the vertical movement of the nozzle 6 is restricted by the slider 27, thereby locking the relative position of the air inlet pipe 5 and the nozzle 6. When the transverse frame 22 moves in the opposite direction, the slider 27 can be disengaged from the second slide groove 30, thereby unlocking.

[0041] like Figure 10 - Figure 12 As shown, to facilitate the movement of the transverse frame 22, the locking assembly further includes a mounting bracket 21, which is fixed inside the housing 4. A coil 25 is provided on the mounting bracket 21 near the transverse frame 22, and a magnet 24 is provided on the transverse frame 22 near the mounting bracket 21, with the magnetic poles of the magnet 24 vertically distributed. The magnet 24 is mounted on the side of the transverse frame 22 without the first slide groove 26. A slide rod 28 is fixed on the side of the transverse frame 22 near the magnet 24, and the mounting bracket 21 is positioned corresponding to the slide rod 28. A sleeve 29 is fixedly provided, and a sliding rod 28 is inserted into the sleeve 29 and can slide on the sleeve 29, thereby causing the transverse frame 22 to move along the fixed direction. The controller can control the coil 25 to be energized or de-energized. When the coil 25 is energized, according to the left-hand rule, the coil 25 is subjected to a horizontal force. When the coil 25 is fixed, the magnet 24 is subjected to a reaction force, thereby pushing the transverse frame 22 to move horizontally. A spring piece 23 is provided between the mounting frame 21 and the transverse frame 22. When the coil 25 is de-energized, the spring piece 23 can push the transverse frame 22 to reset.

[0042] In this embodiment, the first slide 26 and the second slide 30 are arranged at an angle. Compared with the first slide 26 and the second slide 30 being arranged horizontally, when the controller receives the unlock signal, that is, when the nozzle 6 contacts the chip, if the pressure between the two is too great, the slider 27 can be pushed back along the first slide 26, so that the nozzle 6 can move upward. This avoids the situation where the nozzle 6 gets stuck when it contacts the chip when the controller or circuit fails.

[0043] like Figure 6 As shown, in order to adjust the pressure between the nozzle 6 and the wafer, a pressing assembly is also provided. The pressing assembly includes an adjustment plate 13, which is slidably disposed in the housing 4 in the vertical direction. Specifically, the adjustment plate 13 is slidably mounted on the guide rod 35, and the pressure sensor 15 is fixed on the lower side of the adjustment plate 13. A nut part 14 is fixed on the upper side of the adjustment plate 13.

[0044] Furthermore, a rotating shaft 11 is provided in the housing 4 along the vertical direction, and the rotating shaft 11 is rotatably mounted on the housing 4. The end of the rotating shaft 11 near the nut part 14 is provided with a threaded part 12, which is engaged with the nut part 14. When the rotating shaft 11 rotates, it can drive the adjusting plate 13 to move in the vertical direction.

[0045] like Figure 3 - Figure 7 As shown, in order to facilitate the rotation of the rotating shaft 11, the pressing assembly also includes a gear 10. The gear 10 is fixed on the outer circumferential surface of the rotating shaft 11. A gear ring 8 is also rotatably provided inside the housing 4. The inner side of the gear ring 8 is provided with an inner tooth portion 81. The gear 10 is located inside the gear ring 8. The inner tooth portion 81 meshes with the gear 10. The outer side of the gear ring 8 is provided with an outer tooth portion 82. A worm 9 is provided on the side of the gear ring 8. The worm 9 meshes with the outer tooth portion 82.

[0046] Furthermore, a micro motor 7 is installed on the housing 4. The micro motor 7 drives the worm gear 9 to rotate, and the controller controls the operation of the micro motor 7 according to the pressure of the suction nozzle 6 on the inner spring 16. When the pressure between the suction nozzle 6 and the wafer is too high, the micro motor 7 drives the worm gear 9 to rotate, thereby driving the gear ring 8 to rotate, which in turn drives the rotating shaft 11 through the gear 10. The threaded part 12 of the rotating shaft 11 cooperates with the nut part 14 on the adjusting plate 13, causing the adjusting plate 13 to move upward, thereby reducing the pressure of the inner spring 16 on the suction nozzle 6. When it is necessary to increase the pressure between the suction nozzle 6 and the wafer, the micro motor 7 reverses, thereby reducing the control error of the adjusting plate 13 through the cooperation of the worm gear 9 with the outer gear part 82 and the threaded part 12 with the nut part 14, thereby improving the control accuracy.

[0047] like Figure 4 , Figure 7 and Figure 8 As shown in this embodiment, in order to facilitate the rotatable installation of the toothed ring 8 inside the housing 4, an annular groove 83 can be opened on the end face of the toothed ring 8, and ball bearings 36 can be installed on the upper surface of the upper support ring 34 and the inner wall of the housing 4, so that the toothed ring 8 is supported by the ball bearings 36 on both sides and can rotate.

[0048] like Figure 14 As shown, in order to limit the vertical movement of the nozzle 6, a cylindrical cavity 31 is provided on the inner wall of the air inlet pipe 5. A retaining ring 32 is fixed on the outer peripheral surface of the nozzle 6 located in the cylindrical cavity 31. The retaining ring 32 can slide vertically within the cylindrical cavity 31, thereby limiting the movement range of the retaining ring 32 to within the height of the cylindrical cavity 31.

[0049] On the other hand, combining Figure 15 and Figure 16 The present invention also provides a crystal-absorbing method, comprising the following steps: Raw data acquisition stage: Based on the type of wafer to be operated, the wafer suction process is simulated using a pressure testing machine to obtain the minimum pressure value and maximum safe pressure value of the wafer when the suction nozzle 6 can pick up the wafer. The minimum pressure value refers to the minimum contact force required between the suction nozzle 6 and the wafer to stably pick up the wafer. The maximum safe pressure value refers to the maximum contact force that the wafer and the suction nozzle 6 can withstand without damaging the wafer. The pressure value in the first detection zone is obtained. When the nozzle 6 is not in contact with the wafer and is in a stationary state, the pressure value of the first detection zone is sent to the controller through the pressure sensor 15. The controller drives the pressing component to adjust the height of the adjusting plate 13 so that the pressure value is less than the minimum pressure value. This makes the nozzle 6 located at the lowest point of its own range of motion, so as to determine the stroke of the vertical drive device 3. It also ensures that when the nozzle 6 contacts the wafer, the contact force between the two will not immediately reach the minimum pressure value at the moment of contact, thus having a certain buffer space. The inertial force value in the second detection area is obtained and compared with the pressure value to obtain the pressure ratio. During the crystal suction stage: control the horizontal drive device 1 to move so that the suction nozzle 6 is directly above the wafer, and control the vertical drive device 3 to move so that the suction nozzle 6 approaches the wafer in the vertical direction. During the downward movement of the nozzle 6, the controller outputs a locking signal to energize the control coil 25, causing the locking component to lock the relative position of the air inlet pipe 5 and the nozzle 6, preventing the nozzle 6 from compressing the inner spring 16 under the action of inertial force. When the nozzle 6 contacts the chip, the controller outputs an unlocking signal to de-energize the control coil 25, causing the locking component to unlock. Based on the pressure value in the first detection zone, control the action of the pressing component to keep the contact force between the nozzle 6 and the wafer between the minimum pressure value and the maximum safe pressure value, so that the nozzle 6 can hold the wafer. The vertical drive device 3 is controlled to move, causing the suction nozzle 6 to move in the opposite direction in the vertical direction, so that the suction nozzle 6 can drive the wafer to detach from the die bond ring.

[0050] During the crystal absorption stage, the controller acquires the status of the ratio in real time. When the ratio remains unchanged, the controller outputs a lock signal; when the ratio changes, the controller outputs an unlock signal.

[0051] During use (operation), first move the nozzle 6 directly above the wafer and bring it closer to the wafer. During this process, the controller receives data from the pressure sensor 15. The ratio of the first detection area to the second detection area remains unchanged. The controller controls the locking component to lock the relative position of the nozzle 6 and the air inlet pipe 5. When the nozzle 6 contacts the wafer, the ratio of the first detection area to the second detection area changes, and the controller controls the locking component to unlock. Then, based on the pressure value detected in the first detection area, the controller controls the pressing component to adjust the pressure between the nozzle 6 and the wafer, so that the pressure between the nozzle 6 and the wafer is between the minimum pressure value and the maximum safe pressure value.

[0052] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0053] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A crystal-attracting device, comprising a housing (4), characterized in that, Also includes: Air intake pipe (5), which is fixed to the top of housing (4); The suction nozzle (6) is installed inside the housing (4). The upper end of the suction nozzle (6) is inserted into the lower end of the air inlet pipe (5). There is an inner spring (16) between the suction nozzle (6) and the air inlet pipe (5). Synchronization ring (18), which is located inside the housing (4), slides relative to the housing (4) due to inertia during the downward movement of the housing (4); Pressure sensor (15), the pressure sensor (15) is located at the upper end of the inner spring (16), the pressure sensor (15) has a first detection area and a second detection area, the first detection area and the second detection area are respectively used to detect the pressure of the nozzle (6) on the inner spring (16) and the inertial force of the synchronization ring (18); A pressing component, which is located inside the housing (4), is used to adjust the height of the suction nozzle (6); A locking component is used to lock the relative position of the air intake pipe (5) and the mouthpiece (6) when the pressure-to-inertial force ratio remains constant, and to unlock when the pressure-to-inertial force ratio changes. The controller is used to receive electrical signals from the pressure sensor (15) and also to control the action of the locking component.

2. The crystal-attracting device according to claim 1, characterized in that, The projection of the inner spring (16) in the vertical direction is located in the first detection area; An outer spring (17) is provided between the synchronization ring (18) and the inner spring (16), and the projection of the outer spring (17) in the vertical direction is located in the second detection area; The lower side of the synchronization ring (18) is provided with a lower support ring (20) and is supported by the lower support ring (20). The lower support ring (20) is fixedly connected to the housing (4).

3. The crystal-attracting device according to claim 1, characterized in that, The locking component includes: A transverse frame (22) is disposed inside the housing (4) and is capable of sliding relative to the housing (4) along a horizontal plane; The first slide (26) and the second slide (30) are provided on the transverse frame (22) and the second slide (30) is provided on the suction nozzle (6). The lower side of the second slide (30) is an open end. The length direction of the first slide (26) and the second slide (30) has the same angle with the axis of the suction nozzle (6). The slider (27) is slidably disposed in the first groove (26), and one end of the slider (27) can be inserted into the second groove (30).

4. The crystal-attracting device according to claim 3, characterized in that, The locking component also includes: Mounting bracket (21), which is fixed inside the housing (4); The coil (25) is mounted on the mounting bracket (21) and is located on one side near the transverse frame (22). The controller can control the coil (25) to be energized or de-energized. Magnet (24), the magnet (24) is disposed on the transverse frame (22) and close to the side of the mounting frame (21), and the magnetic poles of the magnet (24) are vertically distributed; Spring (23) is disposed between mounting frame (21) and transverse frame (22).

5. The crystal-attracting device according to claim 1, characterized in that, The pressing component includes: Adjustment disc (13), the adjustment disc (13) is slidably disposed in the housing (4) in the vertical direction, and the pressure sensor (15) is fixedly disposed on the lower side of the adjustment disc (13); Nut part (14), said nut part (14) is fixed on the upper side of the adjusting plate (13); A rotating shaft (11) is located in the housing (4) in a vertical direction and is rotatably mounted on the housing (4). The end of the rotating shaft (11) near the nut (14) is provided with a threaded part (12), which is engaged with the nut (14).

6. The crystal-attracting device according to claim 5, characterized in that, The pressing component also includes: Gear (10), the gear (10) is fixed on the outer circumferential surface of the rotating shaft (11); A gear ring (8) is rotatably disposed within a housing (4), and a gear (10) is located inside the gear ring (8); The inner side of the toothed ring (8) is provided with an internal tooth portion (81), which meshes with the gear (10); The outer side of the toothed ring (8) is provided with an external toothed portion (82), and the side of the toothed ring (8) is provided with a worm (9), which meshes with the external toothed portion (82); A micro motor (7) is mounted on the housing (4). The micro motor (7) is used to drive the worm gear (9) to rotate. The controller controls the micro motor (7) to move according to the pressure of the suction nozzle (6) on the inner spring (16).

7. The crystal-attracting device according to claim 1, characterized in that, The inner wall of the air intake pipe (5) is provided with a cylindrical cavity (31), and the nozzle (6) is fixed with a retaining ring (32) on the outer peripheral surface of the cylindrical cavity (31). The retaining ring (32) can slide vertically inside the cylindrical cavity (31).

8. The crystal-attracting device according to claim 1, characterized in that, Also includes: A vertical drive device (3) is provided on one side of the housing (4), and the housing (4) is fixed to the drive part of the vertical drive device (3); The swing arm (2) is located on the side of the vertical drive device (3) away from the housing (4), and the vertical drive device (3) is fixedly connected to the swing arm (2); A lateral drive device (1) is located at one end of the swing arm (2) away from the vertical drive device (3), and the end of the swing arm (2) is fixedly connected to the output end of the lateral drive device (1). Both the lateral drive device (1) and the vertical drive device (3) are electrically connected to the controller.

9. A crystal-attracting method, applicable to the crystal-attracting device according to any one of claims 1 to 8, characterized in that, Includes the following steps: Raw data acquisition stage: Acquire the minimum pressure value and maximum safe pressure value of the chip when the nozzle (6) can pick up the chip; The pressure value in the first detection zone is obtained. When the nozzle (6) is not in contact with the wafer and is in a stationary state, the pressure value of the first detection zone is sent to the controller through the pressure sensor (15). The controller drives the pressing component to adjust the height of the nozzle (6) so that the pressure value is less than the minimum pressure value. The inertial force value within the second detection area is obtained and compared with the pressure value to obtain the pressure ratio. Crystal suction stage: control the suction nozzle (6) to move directly above the wafer, and control the suction nozzle (6) to approach the wafer in the vertical direction; During the downward movement of the nozzle (6), the controller outputs a locking signal to lock the relative position of the air inlet pipe (5) and the nozzle (6). When the nozzle (6) contacts the chip, the controller outputs an unlocking signal to unlock the locking component. Based on the pressure value in the first detection zone, control the action of the pressing component to make the contact force between the nozzle (6) and the wafer between the minimum pressure value and the maximum safe pressure value, so that the nozzle (6) can hold the wafer. Control the nozzle (6) to move in the opposite direction in the vertical direction, so that the nozzle (6) can drive the wafer to detach from the die bond ring.

10. The crystal-absorbing method according to claim 9, characterized in that, During the crystal absorption stage, the controller acquires the status of the ratio in real time. When the ratio remains unchanged, the controller outputs the locking signal. When the ratio changes, the controller outputs the unlocking signal.

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