A wafer edge integrity detection device

Abstract

This invention relates to a wafer edge integrity inspection device, comprising a photoelectric sensor, a wafer stage, multiple suspended pillars disposed on the wafer stage, and multiple slidable clamping pillars. The detection end of the photoelectric sensor is arranged relative to the wafer edge, and the relative position between the photoelectric sensor and the wafer stage is adjustable. The tops of the multiple suspended pillars are arranged relative to the wafer surface. The multiple clamping pillars are driven and extended by a crank-slider mechanism disposed on the wafer stage to selectively abut against the wafer edge. This invention has the advantages of reducing device cost, improving inspection efficiency and accuracy, and being suitable for medium- to large-batch inspection of wafers of different specifications.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor device manufacturing, and in particular to a wafer edge integrity detection device. Background Technology

[0002] A wafer is a thin sheet with a single-crystal structure. Wafers with different crystal orientations differ in chemical, electrical, and physical properties. Therefore, wafers typically require a specific crystal orientation, which is used as a reference for processes such as ion implantation and photolithography. Before semiconductor equipment can etch and measure the wafer, its orientation must be determined. Notches or diced edges serve as visible markers of the crystal orientation. Semiconductor equipment identifies these notches or edges and transports the wafer at a specific angle to a precision moving platform for processing and measurement. However, wafer edges may contain defects such as particles, dents, or cracks. During the grinding process to form notches or edges, edge damage or crack expansion may occur. Therefore, wafer edge inspection is usually necessary.

[0003] Chinese Patent Publication No. CN120824225A discloses a wafer edge detection mechanism, including a wafer calibrator. A soft rubber suction cup is slidably connected inside the wafer calibrator, and a wafer is movably connected to the top of the soft rubber suction cup. A support frame is provided at the end away from the wafer calibrator, and a camera is slidably connected to the top of the support frame. A focusing cylinder is fixedly connected to the bottom of the camera, and a lifting cylinder is fixedly connected to one end of the support frame. A ring light source is fixedly connected to the top end of the support frame. An auxiliary support assembly is sleeved on the bottom of the soft rubber suction cup. The device includes a support component for assisting the bottom of the wafer, the support component being connected to the bottom of the soft rubber chuck; a drive alignment component for providing rotational force to the wafer, the drive alignment component being connected to the support component; the support component includes a lifting plate sleeved on the bottom of the soft rubber chuck, a drive cylinder fixedly connected to the bottom of the lifting plate, the output end of the drive cylinder fixedly connected to the bottom of the lifting plate, and multiple sliding brackets fixedly connected to the top surface of the lifting plate, the multiple sliding brackets being symmetrically distributed about the axis of the lifting plate on the surface of the lifting plate.

[0004] The existing technical solutions described above have the following drawbacks: 1) The structure of the aforementioned testing mechanism is relatively complex. The inclusion of multiple components, such as auxiliary support components and drive alignment components, increases the manufacturing cost and maintenance difficulty of the equipment. Too many moving parts are prone to failure. Once a component is damaged, it may affect the normal operation of the entire testing mechanism, causing the testing work to stop and increasing the company's operating costs and time costs; 2) Although the camera can capture images of the wafer edge, it may not be able to clearly and accurately identify some extremely small particles, dents, or cracks due to factors such as camera resolution, focusing accuracy, and lighting conditions. This may lead to some defects being missed, thereby affecting the quality of the wafer and subsequent production processing; 3) When a large number of wafers need to be tested, the operation steps of the auxiliary support components and drive alignment components are relatively cumbersome. Each test requires a series of actions, such as the support of the ball pin, the clamping and calibration of the U-shaped clamp, and the rotation of the wafer. This will make the testing time longer, reduce the overall testing efficiency, and fail to meet the needs of large-scale production. Summary of the Invention

[0005] The problem to be solved by the present invention is to provide a wafer edge integrity inspection device that addresses the above-mentioned shortcomings of the prior art. This device has the advantages of reducing device cost, improving inspection efficiency and accuracy, and being suitable for medium and large batch inspection of wafers of different specifications.

[0006] The above-mentioned objective of this invention is achieved through the following technical solutions:

[0007] A wafer edge integrity detection device includes a photoelectric sensor, a wafer stage, a plurality of suspended columns disposed on the wafer stage, and a plurality of slidable clamping columns. The detection end of the photoelectric sensor is arranged relative to the wafer edge, and the relative position between the photoelectric sensor and the wafer stage is adjustable. The top ends of the plurality of suspended columns are arranged relative to the wafer surface. The plurality of clamping columns are driven and extended by a crank-slider mechanism disposed on the wafer stage to selectively abut against the wafer edge.

[0008] Furthermore, the photoelectric sensor is configured as a line laser scanning sensor or a reflective fiber optic sensor.

[0009] Furthermore, the top of the clamping column is provided with an annular concave groove, and there is a height difference between the bottom of the groove and the top of the suspension column.

[0010] Furthermore, the opening of the groove is provided with a guide surface.

[0011] Furthermore, it also includes a rotary displacement module, wherein the rotation axis of at least one rotary drive member and the moving direction of at least one displacement drive member in the rotary displacement module are parallel to the axis of the wafer, and the wafer stage is disposed at the output end of the rotary displacement module.

[0012] Furthermore, the rotary displacement module includes a linear drive, several vertical rails, a lifting plate disposed on the moving end of the linear drive and slidably connected to the several vertical rails, and a rotary drive disposed on the lifting plate, wherein the wafer stage is disposed on the output shaft of the rotary drive.

[0013] Furthermore, the rotary drive component is configured as one of a rotary motor, a rotary cylinder, and a rotary hydraulic cylinder;

[0014] Alternatively, the rotary drive component may be configured as one of a rotary motor, a rotary cylinder, and a rotary hydraulic cylinder, as well as one or more of a composite transmission pair of a gear transmission pair, a worm gear transmission pair, a belt transmission pair, and a chain transmission pair.

[0015] Alternatively, the rotary drive component may be configured as one of a linear motor, an electric actuator, a cylinder, and a hydraulic cylinder, as well as one or more of a lead screw drive and a rack and pinion drive.

[0016] And / or, the linear drive is configured as one of a linear motor, an electric actuator, a pneumatic cylinder, and a hydraulic cylinder;

[0017] Alternatively, the linear drive component may be configured as one of a linear motor, an electric push rod, a cylinder, and a hydraulic cylinder, as well as one or more of a composite transmission pair of a scissor lift support transmission pair and an inclined plane slider transmission pair.

[0018] Alternatively, the linear drive component may be configured as one of a rotary motor, a rotary cylinder, and a rotary hydraulic cylinder, as well as one or more of a lead screw drive and a rack and pinion drive.

[0019] Furthermore, the rotary displacement module includes a lifting cylinder, at least two vertical rails arranged in parallel, a lifting plate disposed on the moving end of the lifting cylinder and slidably connected to the at least two vertical rails, a rotary motor disposed on the lifting plate, a drive wheel disposed on the output shaft of the rotary motor, a driven wheel rotatably connected to the lifting plate, and a transmission belt sleeved on the drive wheel and the driven wheel, wherein the wafer stage is disposed on the output shaft of the driven wheel.

[0020] Furthermore, it also includes a data processing module and a control module, which are connected in communication.

[0021] The crank-slider mechanism and the rotary displacement module establish communication connections with the control module to move the wafer stage to a predetermined clamping position and selectively complete the contact of the multiple clamping posts with the wafer edge.

[0022] The photoelectric sensor and the rotation displacement module establish communication connections with the control module to move the wafer stage to a predetermined detection position. The data processing module associates the optical information, image information, and corresponding coordinate positions of the detection points to complete the construction of the wafer edge integrity detection map.

[0023] Furthermore, the crank-slider mechanism includes a crank ring rotatably connected to the wafer stage, multiple connecting rods respectively hinged to the crank ring, a linear actuator and multiple guide rails disposed on the wafer stage, guide sliders hinged to the connecting rods and slidably connected to the guide rails, and at least two photoelectric switches. One guide slider is disposed at the moving end of the linear actuator, and the moving paths of the remaining guide sliders pass through the detection ends of the at least two photoelectric switches respectively. The multiple clamping posts are respectively disposed on these guide sliders, and the linear actuator and the at least two photoelectric switches respectively establish communication connections with the control module.

[0024] Furthermore, the linear actuator is configured as one of a linear motor, an electric actuator, a pneumatic cylinder, and a hydraulic cylinder;

[0025] Alternatively, the linear actuator may be configured as one of a linear motor, an electric actuator, a cylinder, and a hydraulic cylinder, as well as one or more of a composite transmission pair of a scissor lift support transmission pair and a ramp slider transmission pair.

[0026] Alternatively, the linear actuator may be configured as one of a rotary motor, a rotary cylinder, and a rotary hydraulic cylinder, as well as one or more of a lead screw drive and a rack and pinion drive.

[0027] Furthermore, the position of the photoelectric switch on the wafer carrier is adjustable. Specifically, the photoelectric switch has a strip-shaped groove, and the wafer carrier is provided with a fastener that slides and locks onto the strip-shaped groove.

[0028] Alternatively, the crank-slider mechanism includes a crank ring rotatably connected to the wafer stage, multiple connecting rods respectively hinged to the crank ring, multiple guide rails disposed on the wafer stage, guide sliders hinged to the connecting rods and slidably connected to the guide rails, and multiple locking switches. The wafer stage and the crank ring are respectively disposed on the output shaft of the rotary drive component of the rotary displacement module through one-way bearings, and the locking directions of the one-way bearings are opposite. The hinges at both ends of the connecting rods are configured as spring-loaded hinges. The movement paths of these guide sliders pass through the limiting ends of the multiple locking switches. The multiple clamping posts are respectively disposed on these guide sliders. The multiple locking switches establish communication connections with the control module.

[0029] Furthermore, the position of the locking switch on the wafer stage is adjustable.

[0030] Furthermore, the locking switch is configured as a magnetic base, and the guide slider is composed of ferromagnetic material.

[0031] In summary, the beneficial technical effects of this invention are as follows: Through the unique structural design and collaborative control method described above, this invention achieves efficient and accurate detection of wafer edge integrity. In practical applications, it can significantly improve detection efficiency, reduce errors and uncertainties caused by manual operation, and allow for rapid adjustment of the clamping state for wafers of different sizes and specifications to adapt to diverse production needs, greatly enhancing the flexibility and compatibility of the production line. Simultaneously, the stable clamping effect ensures the positional accuracy of the wafer during detection, making the detection results more reliable and providing accurate data support for subsequent production decisions. Furthermore, the device has a high degree of automation, reducing labor costs, minimizing direct contact between operators and wafers, reducing the risk of wafer damage, and improving product yield. In long-term use, the stability and reliability of its structure can also effectively reduce equipment maintenance costs and downtime, bringing significant economic and social benefits to enterprises. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the wafer edge integrity detection device according to Embodiment 1 of the present invention.

[0033] Figure 2 This is a partial structural schematic diagram of the wafer edge integrity detection device in the rear view direction according to Embodiment 2 of the present invention.

[0034] Figure 3 This is a partial structural diagram of the wafer edge integrity detection device in the front view direction according to Embodiment 2 of the present invention.

[0035] Figure 4This is a schematic diagram showing the connection relationship between the data processing module, control module, photoelectric sensor, crank-slider mechanism and rotary displacement module in Embodiment 3 of the present invention.

[0036] Figure 5 This is a schematic diagram of the connection relationship between the wafer stage and the crank-slider mechanism in Embodiment 4 of the present invention.

[0037] Figure 6 This is a schematic diagram of the connection relationship between the wafer stage and the crank-slider mechanism in Embodiment 5 of the present invention.

[0038] Figure 7 This is a partial structural schematic diagram of the clamping column in Embodiment 6 of the present invention.

[0039] In the diagram, 1. Photoelectric sensor; 2. Wafer stage; 3. Suspension column; 4. Clamping column; 41. Groove; 42. Guide surface; 5. Rotary displacement module; 51. Lifting cylinder; 52. Vertical rail; 53. Lifting pallet; 54. Rotary motor; 55. Driving wheel; 56. Driven wheel; 57. Transmission belt; 6. Data processing module; 7. Control module; 8. Crank-slider mechanism; 81. Crank ring; 82. Connecting rod; 83. Linear actuator; 84. Guide rail; 85. Guide slider; 86. Photoelectric switch; 87. Locking switch; 9. Frame. Detailed Implementation

[0040] To make the technical means, creative features, objectives and effects of this invention clearer and easier to understand, the invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0041] Example 1: Refer to Figure 1 This invention discloses a wafer edge integrity detection device, comprising a frame 9, a photoelectric sensor 1 mounted on the frame 9, a wafer stage 2, three suspension columns 3 mounted on the wafer stage 2, and three sliding clamping columns 4. The detection end of the photoelectric sensor 1 is arranged relative to the wafer edge. The wafer stage 2 is driven by a rotational displacement module 5 mounted on the frame 9 to rotate and / or move, thereby adjusting its relative position with the photoelectric sensor 1. The tops of the three suspension columns 3 are arranged relative to the wafer surface. The three clamping columns 4 are driven by a crank-slider mechanism 8 (not shown in the figure) mounted on the wafer stage 2 to extend and retract, selectively contacting the wafer edge.

[0042] Example 2: Refer to Figure 2 and Figure 3This invention discloses a wafer edge integrity detection device, which differs from Embodiment 1 in that the rotation axis of at least one rotary drive component and the moving direction of at least one displacement drive component in the rotary displacement module 5 are parallel to the wafer axis, and the wafer stage 2 is disposed at the output end of the rotary displacement module 5. The rotary drive component is configured as a rotary motor 54 and a belt drive pair, and the linear drive component is configured as a cylinder.

[0043] Specifically, the rotary displacement module 5 includes a lifting cylinder 51 mounted on the frame 9, two parallel vertical rails 52, a lifting support plate 53 mounted on the moving end of the lifting cylinder 51 and slidably connected to the two vertical rails 52, a rotary motor 54 mounted on the lifting support plate 53, a drive wheel 55 mounted on the output shaft of the rotary motor 54, a driven wheel 56 rotatably connected to the lifting support plate 53, and a transmission belt 57 sleeved on the drive wheel 55 and the driven wheel 56. The wafer stage 2 is mounted on the output shaft of the driven wheel 56.

[0044] When the lifting cylinder 51 is activated, its moving end drives the lifting pallet 53 to move linearly up and down along the parallel vertical rails 52, thereby adjusting the position of the wafer stage 2 in the vertical direction. After the rotary motor 54 is activated, its output shaft drives the drive wheel 55 to rotate. The drive wheel 55 transmits power to the driven wheel 56 through the transmission belt 57. The driven wheel 56 rotates accordingly, thereby driving the wafer stage 2 mounted on its output shaft to rotate. This design of the rotary displacement module 5 enables the wafer stage 2 to flexibly realize lifting and rotation functions along the wafer axis, providing support for wafer edge integrity inspection. The device possesses multi-dimensional position adjustment capabilities. During the inspection process, the stroke of the lifting cylinder 51 and the speed of the rotary motor 54 can be precisely controlled according to actual needs to ensure that the wafer is in the optimal inspection position and posture. At the same time, at least two parallel vertical rails 52 ensure the stability and accuracy of the movement of the lifting pallet 53, avoiding swaying or deviation during the lifting process, thereby improving the reliability and inspection accuracy of the entire inspection device. The use of the transmission belt 57 enables smooth transmission between the driving wheel 55 and the driven wheel 56, reducing noise and vibration during the transmission process and further improving the performance of the device.

[0045] Example 3: Reference Figure 4 This invention discloses a wafer edge integrity detection device, which differs from Embodiment 2 in that it further includes a data processing module 6 and a control module 7, and the data processing module 6 and the control module 7 are connected in communication.

[0046] The photoelectric sensor 1 is configured as a line laser scanning sensor or a reflective fiber optic sensor;

[0047] The crank-slider mechanism 8 and the rotary displacement module 5 (lifting cylinder 51 and / or rotary motor 54) establish communication connections with the control module 7 respectively, so that the wafer stage 2 moves to the predetermined clamping position and selectively completes the contact of the three clamping posts 4 with the wafer edge;

[0048] The photoelectric sensor 1 and the rotation displacement module 5 (lifting cylinder 51 and rotary motor 54) establish communication connections with the control module 7 respectively, so that the wafer stage 2 moves to the predetermined detection position. The data processing module 6 associates the optical information, image information and corresponding coordinate position of the detection point to complete the construction of the wafer edge integrity detection map.

[0049] Line laser scanning sensors have an emitter and a receiver. They emit a linear laser line, which is reflected off the wafer surface. The receiver then receives the reflected light. The sensor integrates an algorithm to convert the received light signal into an image. Therefore, after rotating and scanning the wafer edge on the wafer stage 2, an image of the wafer edge can be generated. Reflective fiber optic sensors also have a receiver and an output. The output emits a light spot onto the wafer surface. Part of the light is reflected by the wafer. When the receiver receives the reflected light, the reflective fiber optic sensor is triggered and outputs a presence / absence signal, which can be 0 or 1, or a high or low level. Both types of sensors support transparent wafers and can adapt to the high-precision detection requirements of different types of wafer edge integrity.

[0050] The control module 7 can dynamically regulate the crank-slider mechanism 8, the rotary displacement module 5, and the photoelectric sensor 1. After receiving the optical and image information from the photoelectric sensor 1, the data processing module 6 analyzes and processes it. Based on the coordinate position of the detection point obtained by the rotary displacement module 5, it matches the optical and image information output by the photoelectric sensor 1 one-to-one, thereby accurately identifying potential defects and damage at the wafer edge. During the detection process, the control module 7 can dynamically adjust the motion parameters of the rotary displacement module 5 based on the feedback information from the data processing module 6. For example, when an anomaly is detected in a certain area, the control module 7 can reduce the speed of the rotary motor 54, causing the wafer stage 2 to remain in that area. The longer dwell time allows the photoelectric sensor 1 to acquire clearer and more accurate information, while also enabling fine-tuning of the stroke of the lifting cylinder 51 to ensure detection accuracy. Furthermore, the integrity detection map constructed by the data processing module 6 visually displays the overall condition of the wafer edge. This map not only presents the outline of the wafer edge but also highlights problematic areas with different colors or markings, which is very helpful for subsequent processing and analysis. Operators can quickly locate problematic areas based on the detection map and take corresponding repair or treatment measures. Moreover, the data processing module 6 can store and record the detection results, facilitating subsequent quality traceability and data analysis, and contributing to continuous optimization of production processes and improvement of product quality.

[0051] Example 4: Reference Figure 5 This invention discloses a wafer edge integrity detection device, which differs from Embodiment 3 in that the crank-slider mechanism 8 includes a crank ring 81 rotatably connected to the wafer stage 2, three connecting rods 82 respectively hinged to the crank ring 81, a linear actuator 83 and three guide rails 84 disposed on the wafer stage 2, guide sliders 85 hinged to the connecting rods 82 and slidably connected to the guide rails 84, and two photoelectric switches 86. The photoelectric switches 86 have strip-shaped grooves (not shown in the figure), and the wafer stage 2 is provided with fasteners (not shown in the figure) that slide and lock onto the strip-shaped grooves, so that the position of the photoelectric switches 86 on the wafer stage 2 is adjustable. One guide slider 85 is disposed at the moving end of the linear actuator 83, and the moving paths of the other guide sliders 85 pass through the detection ends of the two photoelectric switches 86 respectively. Three clamping posts 4 are respectively disposed on these guide sliders 85. The linear actuator 83 and the two photoelectric switches 86 establish communication connections with the control module 7.

[0052] The linear actuator 83 is preferably configured as a linear motor. When the linear actuator 83 is started, its moving end drives the guide slider 85 connected to it to slide on the guide rail 84. Since the guide slider 85 is hinged to the connecting rod 82, and the connecting rod 82 is hinged to the crank ring 81, the linear motion of the guide slider 85 is transmitted to the crank ring 81 through the connecting rod 82, causing the crank ring 81 to rotate around its rotational connection point with the wafer stage 2. The rotation of the crank ring 81 will drive the other connecting rods 82 to move, thereby causing the other guide sliders 85 to slide on their respective guide rails 84. The movement of the guide slider 85 can drive the clamping post 4 to move, realizing the clamping and releasing operation of the wafer; during this process, when the guide slider When the guide slider 85 passes the detection end of the photoelectric switch 86, the photoelectric switch 86 detects the position information of the guide slider 85 and feeds this information back to the control module 7. The control module 7 can precisely control the opening and closing of the linear driver 83 based on the information fed back by the photoelectric switch 86, thereby achieving precise adjustment of the position of the guide slider 85. Through the coordinated control of the linear driver 83 and the photoelectric switch 86 by the control module 7, it can be ensured that the clamping post 4 accurately reaches the predetermined position and stably clamps the wafer, avoiding displacement or shaking of the wafer during the detection process, thereby ensuring the accuracy and stability of the detection, and making the clamping operation more flexible and efficient, and able to adapt to the detection needs of wafers of different sizes and specifications.

[0053] Example 5: Refer to Figure 6 The present invention discloses a wafer edge integrity detection device, which differs from embodiment 3 in that the crank-slider mechanism 8 includes a crank ring 81 rotatably connected to the wafer stage 2, three connecting rods 82 respectively hinged to the crank ring 81, three guide rails 84 disposed on the wafer stage 2, a guide slider 85 hinged to the connecting rods 82 and slidably connected to the guide rails 84, and three locking switches 87. The locking switch 87 is a magnetic base, the guide slider 85 is made of ferromagnetic material, and the locking switch 87 has a strip groove (not shown in the figure). The wafer stage 2 is provided with a fastener (not shown in the figure) that slides and locks onto the strip groove so that the position of the locking switch 87 on the wafer stage 2 is adjustable. The wafer stage 2 and the crank ring 81 are respectively set on the output shaft of the rotary drive of the rotary displacement module 5 through one-way bearings, and the locking directions of the one-way bearings are opposite. The hinges at both ends of the connecting rod 82 are set as spring-loaded hinges. The movement paths of these guide sliders 85 pass through the limiting ends of the three locking switches 87. The three clamping posts 4 are respectively set on these guide sliders 85. The three locking switches 87 are respectively connected to the control module 7.

[0054] When the rotary drive component of the rotary displacement module 5 rotates in the forward direction, its rotating end drives the crank ring 81, which is locked to it by a one-way bearing, to rotate. The rotation of the crank ring 81 then drives the remaining connecting rods 82 to move, thereby causing the remaining guide sliders 85 to slide on their respective guide rails 84. The movement of the guide sliders 85 can drive the clamping post 4 to move, realizing the clamping and releasing operation of the wafer. During this process, when the guide slider 85 passes the limit end of the locking switch 87, the locking switch 87 will detect the position information of the guide slider 85 and feed this information back to the control module 7. The control module 7 can precisely control the magnetic opening and closing of the locking switch 87 based on the information fed back by the locking switch 87. This enables magnetic locking and unlocking of the guide slider 85. After locking, the clamping post 4 maintains its grip on the wafer, and the rotation drive of the rotary displacement module 5 rotates in the opposite direction to cooperate with wafer edge detection. After unlocking, the spring-loaded hinges at both ends of the connecting rod 82 can drive the clamping post 4 to reset, and the clamping post 4 disengages from the wafer. Through the coordinated control of the rotary displacement module 5 and the locking switch 87 by the control module 7, it can be ensured that the clamping post 4 accurately reaches the predetermined position and stably clamps the wafer, avoiding wafer displacement or shaking during the detection process. This ensures the accuracy and stability of the detection and makes the clamping operation more flexible and efficient, adapting to the detection needs of wafers of different sizes and specifications.

[0055] Example 6: Refer to Figure 7 This invention discloses a wafer edge integrity detection device, which differs from Embodiment 1 in that the top end of the clamping column 4 is provided with an annular concave groove 41, and there is a drop between the bottom of the groove 41 and the top end of the suspension column 3. The opening of the groove 41 is provided with a guide surface 42.

[0056] Because the suspension columns 3 have a certain height, they can be adapted to different wafer loading and unloading robots. Preferably, they can be evenly distributed on the wafer stage 2 and fixed relative to the wafer stage 2 for pre-mounting of the wafers. In addition, the crank-slider mechanism 8 drives these clamping columns 4 to retract and expand, moving them closer to or away from the wafer. The wafer can be guided by the guide surface 42 to slide into or out of the groove 41, selectively abutting the wafer edge, reducing the possibility of collision or misalignment between the wafer and the opening of the groove 41, and improving the accuracy and stability of wafer placement. Moreover, the tilt angle and curvature of this guide surface 42 are carefully designed to match the edge shape of the wafer, ensuring that the wafer remains stable during the process of falling into the groove 41. Meanwhile, due to the height difference between the bottom of the groove 41 and the top of the suspension column 3, when the wafer falls into the groove 41, the bottom of the wafer will detach from the suspension column 3, thereby avoiding wafer deformation and further improving the accuracy of detection. In addition, this height difference design also allows the wafer to have a certain amount of room to move within the groove 41 to accommodate possible small size deviations and reduce detection errors caused by size errors. Furthermore, this structural design facilitates subsequent positioning and adjustment of the wafer, creating favorable conditions for the wafer edge integrity detection device to more accurately detect the wafer edge integrity. In practical applications, this groove 41 structure with guide surface 42 can significantly improve the operating efficiency and detection accuracy of the device, making the entire detection process smoother and more reliable.

[0057] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer edge integrity detection device, characterized in that: The device includes a photoelectric sensor (1), a wafer stage (2), a plurality of floating pillars (3) disposed on the wafer stage (2), and a plurality of sliding clamping pillars (4). The detection end of the photoelectric sensor (1) is arranged relative to the edge of the wafer, and the relative position between the photoelectric sensor (1) and the wafer stage (2) is adjustable. The tops of the plurality of floating pillars (3) are arranged relative to the wafer surface. The plurality of clamping pillars (4) are driven and extended by a crank-slider mechanism (8) disposed on the wafer stage (2) to selectively abut against the edge of the wafer. It also includes a rotary displacement module (5), wherein the rotation axis of at least one rotary drive member and the moving direction of at least one displacement drive member in the rotary displacement module (5) are parallel to the axis of the wafer, and the wafer stage (2) is disposed at the output end of the rotary displacement module (5). The crank-slider mechanism (8) includes a crank ring (81) rotatably connected to the wafer stage (2), a plurality of connecting rods (82) respectively hinged to the crank ring (81), a linear actuator (83) and a plurality of guide rails (84) disposed on the wafer stage (2), a guide slider (85) hinged to the connecting rods (82) and slidably connected to the guide rails (84), and at least two photoelectric switches (86). One of the guide sliders (85) is disposed at the moving end of the linear actuator (83), and the moving paths of the other guide sliders (85) pass through the detection ends of the at least two photoelectric switches (86). The plurality of clamping posts (4) are respectively disposed on these guide sliders (85). Alternatively, the crank-slider mechanism (8) includes a crank ring (81) rotatably connected to the wafer stage (2), multiple connecting rods (82) respectively hinged to the crank ring (81), multiple guide rails (84) disposed on the wafer stage (2), guide sliders (85) hinged to the connecting rods (82) and slidably connected to the guide rails (84), and multiple locking switches (87). The wafer stage (2) and the crank ring (81) are respectively disposed on the output shaft of the rotary drive of the rotary displacement module (5) through one-way bearings, and the locking directions of the one-way bearings are opposite. The hinges at both ends of the connecting rods (82) are configured as spring-loaded hinges. The movement paths of these guide sliders (85) respectively pass through the limiting ends of the multiple locking switches (87). The multiple clamping posts (4) are respectively disposed on these guide sliders (85).

2. The wafer edge integrity detection device according to claim 1, characterized in that: The photoelectric sensor (1) is configured as a line laser scanning sensor or a reflective fiber optic sensor.

3. The wafer edge integrity detection device according to claim 1, characterized in that: The top of the clamping column (4) is provided with an annular concave groove (41), and there is a drop between the bottom of the groove (41) and the top of the suspension column (3).

4. The wafer edge integrity detection device according to claim 1, characterized in that: The rotary displacement module (5) includes a linear drive, several vertical rails (52), a lifting plate (53) disposed on the moving end of the linear drive and slidably connected to the several vertical rails (52), and a rotary drive disposed on the lifting plate (53). The wafer stage (2) is disposed on the output shaft of the rotary drive.

5. The wafer edge integrity detection device according to claim 1, characterized in that: It also includes a data processing module (6) and a control module (7), which are connected in communication. The crank-slider mechanism (8) and the rotary displacement module (5) establish communication connections with the control module (7) respectively, so that the wafer stage (2) moves to the predetermined clamping position and selectively completes the contact of the multiple clamping posts (4) with the wafer edge; The photoelectric sensor (1) and the rotation displacement module (5) establish communication connections with the control module (7) respectively, so that the wafer stage (2) moves to the predetermined detection position. The data processing module (6) associates the optical information, image information and corresponding coordinate position of the detection point to complete the construction of the wafer edge integrity detection map.

6. The wafer edge integrity detection device according to claim 5, characterized in that: The linear driver (83) and at least two photoelectric switches (86) establish communication connections with the control module (7), respectively.

7. The wafer edge integrity detection device according to claim 6, characterized in that: The position of the photoelectric switch (86) on the wafer stage (2) is adjustable.

8. The wafer edge integrity detection device according to claim 5, characterized in that: The plurality of locking switches (87) establish communication connections with the control module (7) respectively.

9. The wafer edge integrity detection device according to claim 8, characterized in that: The position of the locking switch (87) on the wafer stage (2) is adjustable.

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