Integrated circuit chip packaging structure and method

Abstract

The invention provides an integrated circuit chip packaging structure and method, and relates to the technical field of chip packaging, and the integrated circuit chip packaging structure comprises a housing, a mounting plate, a lead, a pin, and an adjusting mechanism. The shell comprises a lower shell and an upper shell which are sealed and packaged, and the shell is provided with a mounting cavity and two storage cavities; the mounting plate is slidably mounted in the storage cavity; the lead is electrically connected with the mounting plate and the chip main body respectively; the pins are connected with the mounting plate and can penetrate out of the accommodating cavity; the adjusting mechanism comprises a first supporting plate, a second supporting plate and an adjusting assembly, the first supporting plate and the second supporting plate are installed in the containing cavity and located on the two sides of the installing plate correspondingly, and the adjusting assembly is in driving connection with the installing plate. The mounting plate is driven by the adjusting assembly to slide in the storage cavity, so that the extension length of the pins is shortened to a proper distance, or the pins are completely hidden in the storage cavity, and oxidation corrosion of the pins and short circuit between the pins caused by the fact that moisture in air is attached to the surfaces of the pins are avoided.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to an integrated circuit chip packaging structure and method. Background Technology

[0002] Chip packaging, as a key process in integrated circuit manufacturing, plays a crucial role in providing placement, fixation, sealing, and protection for chips and related components. It also ensures a stable electrical connection between the chip and external circuits, directly affecting the chip's lifespan, operational stability, and applicable scenarios.

[0003] In existing technologies, the packaging structure of integrated circuit chips faces several pressing problems: First, chip pins are typically directly exposed to the external environment. During soldering, packaging, transportation, and production processes, pins are highly susceptible to impacts such as collisions and compression, leading to bending, breakage, and other damage, significantly increasing the chip scrap rate. Second, when chips are used on circuit boards with short pin requirements, the excess pins are exposed to the air for extended periods. If the working environment has high humidity, moisture in the air will adhere to the pin surface, easily causing oxidation and corrosion, and potentially leading to short circuits between pins, ultimately causing the chip to burn out. Third, if the pin length is too long, the chip will be suspended on the circuit board. When the circuit board vibrates, the vibration will be directly transmitted to the chip. Since pins are mostly made of hard metal materials, they lack effective shock absorption and cushioning capabilities. Long-term vibration can cause the connection between the chip and the pins to loosen or detach, resulting in the chip malfunctioning. Summary of the Invention

[0004] In view of this, the present invention proposes an integrated circuit chip packaging structure and method to solve the technical problems mentioned in the background art, such as the chip pins being directly exposed to the external environment, the excessive pin length causing moisture in the air to adhere to the pin surface, which not only easily leads to pin oxidation and corrosion but may also cause short circuits between pins, and the chip being suspended on the circuit board, which can cause the connection between the chip and the pins to loosen or fall off when the circuit board is vibrated, thus causing the chip to malfunction.

[0005] The technical solution of this invention is implemented as follows: In a first aspect, the present invention provides an integrated circuit chip packaging structure, including a housing, a mounting plate, leads, pins, and an adjustment mechanism, wherein: The housing includes a sealed lower housing and an upper housing. The housing is provided with a mounting cavity and two storage cavities. The mounting cavity is used to mount the chip body, and the two storage cavities are respectively located on both sides of the mounting cavity. The mounting plate is slidably installed in the storage cavity; The leads are electrically connected to the mounting plate and the chip body, respectively. The pin is connected to the mounting plate and can extend out of the storage cavity; The adjustment mechanism includes a first support plate, a second support plate, and an adjustment component. The first support plate and the second support plate are installed in the storage cavity and are located on both sides of the mounting plate, respectively. The adjustment component is installed on the first support plate and the second support plate and is drivenly connected to the mounting plate.

[0006] In some optional embodiments, preferably, the adjustment mechanism further includes a first spring, one end of which is fixed to the first support plate and the other end is connected to the mounting plate; the mounting plate is provided with slots along the length of the outer casing; The adjustment assembly includes a lifting plate and a limiting rod. The lifting plate is slidably installed between the first support plate and the second support plate in a direction perpendicular to the bottom surface of the storage cavity, and passes through the slot. The lifting plate has multiple limiting holes along its length. The limiting rod is disposed in the slot and is used to insert into one of the limiting holes.

[0007] In some alternative embodiments, preferably, the adjustment mechanism further includes an unlocking component, which includes a first wedge block, a second spring, a first push rod, and a second wedge block; The first wedge block is installed at one end of the top surface of the lifting plate, and the first wedge block has a first wedge surface that slopes upward; The second spring is installed on the bottom surface of the storage cavity and connected to the first wedge block. In its natural state, the second spring is in an extended state, pushing the lifting plate to remain in a high position. At this time, the limiting rod is inserted into the corresponding limiting hole. The first push rod is slidably mounted in the storage cavity and one end extends out of the outer shell; The second wedge block is installed at one end of the first push rod and has a downward-sloping second wedge surface. The second wedge surface is used to squeeze the first wedge surface during the sliding of the first push rod to drive the lifting plate down, so that the limiting rod moves out of the limiting hole.

[0008] In some optional embodiments, preferably, the unlocking assembly further includes a second push rod, a round rod, a guide rod, and a guide plate; the second push rod connects the first push rod and the round rod respectively, with one end of the round rod extending out of the housing; the guide rod is fixedly installed in the storage cavity, and the guide rod is parallel to the second push rod; the guide plate is slidably installed on the guide rod and connected to the second push rod.

[0009] In some alternative embodiments, preferably, the unlocking assembly further includes a third spring, one end of which is connected to one end of the guide rod, and the other end of which is connected to the guide plate for resetting the guide plate.

[0010] In some alternative embodiments, preferably, the adjustment mechanism further includes a buffer column, one end of which is mounted on the second support plate and the other end of which abuts against the mounting plate.

[0011] In some alternative embodiments, preferably, the adjustment assembly includes a support plate, a threaded rod, and a transmission mechanism; the support plate is fixedly installed in the storage area; the threaded rod is rotatably installed between the support plate and the second support plate, and the mounting plate is threadedly connected to the threaded rod; the transmission mechanism is installed on the support plate and drivenly connected to the threaded rod.

[0012] In some optional embodiments, preferably, the transmission mechanism includes a first transmission shaft, a second transmission shaft, a first bevel gear, a second bevel gear, and a knob. The two ends of the first transmission shaft are rotatably mounted on the bracket plate and the first support plate, respectively, and are fixedly connected to the threaded rod. The two ends of the second transmission shaft are rotatably mounted on the bracket plate and the lower housing, respectively, and one end of the second transmission shaft extends out of the housing and is connected to the knob. The first bevel gear is mounted on the first transmission shaft, and the second bevel gear is mounted on the second transmission shaft and meshes with the first bevel gear.

[0013] In some optional embodiments, preferably, the top surface of the chip body is inlaid with a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged at equal intervals, and the top of the heat dissipation fins are tightly fitted to the inner wall of the upper housing.

[0014] In a second aspect, the present invention provides an integrated circuit chip packaging method using the integrated circuit chip packaging structure described in the first aspect, the packaging method comprising: After the chip body is installed in the mounting cavity, the lower and upper housings are sealed and encapsulated. By adjusting the component to drive the mounting plate to slide away from the mounting cavity in the storage cavity, the pins are moved, thus achieving the adjustment of the pin extension; By adjusting the component to drive the mounting plate to slide closer to the mounting cavity, the pins are moved, thereby achieving pin retraction adjustment, shortening the pin extension length, or making the pins completely hidden in the mounting cavity.

[0015] The integrated circuit chip packaging structure and method of the present invention have the following advantages over the prior art: (1) The outer shell is provided with an installation cavity and two storage cavities. The installation plate is slidably installed in the storage cavity. The lead wires are electrically connected to the installation plate and the chip body respectively. The pins are connected to the installation plate and can pass through the storage cavity. The adjustment component is driven to the installation plate. The adjustment component drives the installation plate to slide in the storage cavity, thereby moving the pins and adjusting the extension length of the pins. This avoids the pins from being too long. The extension length of the pins is shortened to a suitable distance, or the pins are completely hidden in the storage cavity. This prevents moisture in the air from adhering to the pin surface, which would cause pin oxidation and corrosion and short circuits between the pins. The chip body and the pins are connected by the lead wires and the installation plate. When the circuit board is vibrated, the connection between the chip body and the pins will not be loosened or detached, ensuring that the chip body can work normally. (2) The mounting plate has a slot along the length of the outer shell. The lifting plate is slidably installed between the first support plate and the second support plate in a direction perpendicular to the bottom surface of the storage cavity and passes through the slot. The lifting plate has multiple limiting holes along the length. The limiting rod is set in the slot and is used to insert into one of the limiting holes. When adjusting, the lifting plate is lowered so that the limiting rod is disengaged from the limiting hole, releasing the limitation of the mounting plate. The mounting plate is moved to adjust the pin extension length. After adjustment, the limiting rod is inserted into the limiting hole to fix the mounting plate. (3) The first wedge block is installed on one end of the top surface of the lifting plate. The first wedge block has an upwardly inclined first wedge surface. The second spring is installed on the bottom surface of the storage cavity and connected to the first wedge block. In its natural state, the second spring is in an extended state, pushing the lifting plate to remain in a high position. At this time, the limiting rod is inserted into the corresponding limiting hole. The first push rod is slidably installed in the storage cavity and one end extends out of the outer shell. The second wedge block is installed on one end of the first push rod and has a downwardly inclined second wedge surface. The second wedge surface is used to squeeze the first wedge surface during the sliding of the first push rod to drive the lifting plate down, so that the limiting rod moves out of the limiting hole and unlocks the lifting plate. This structure is simple and reliable and can improve the convenience of operation. (4) The adjustment assembly includes a support plate, a threaded rod, and a transmission mechanism; the support plate is fixedly installed in the storage area; the threaded rod is rotatably installed between the support plate and the second support plate, and the mounting plate is threadedly connected to the threaded rod; the transmission mechanism is installed on the support plate and driven by the threaded rod, thereby realizing the rotation of the threaded rod and driving the mounting plate to slide in the storage cavity, thereby realizing the adjustment of the protrusion length of the pin. The transmission mechanism can realize the self-locking of the threaded rod, eliminating the need for separate locking and unlocking devices, resulting in a simpler solution. Furthermore, the threaded rod driving method has higher sensitivity and can be infinitely adjusted. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the integrated circuit chip packaging structure (first type of adjustment component) in an embodiment of the present invention; Figure 2 This is a schematic diagram of the integrated circuit chip packaging structure with the upper shell hidden in an embodiment of the present invention; Figure 3 This is a schematic diagram of the integrated circuit chip packaging structure in an embodiment of the present invention, showing the hidden upper shell and chip body. Figure 4 This is a schematic diagram of the structure of the first wedge block and the second wedge block in an embodiment of the present invention; Figure 5 This is a schematic diagram of the mounting plate in an embodiment of the present invention; Figure 6 This is a schematic diagram of the lifting plate and the first wedge block in an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the first push rod and the second wedge block in an embodiment of the present invention; Figure 8 This is a schematic diagram of the integrated circuit chip packaging structure (second type of adjustment component) in an embodiment of the present invention; Figure 9 This is a schematic diagram of the lower shell structure in an embodiment of the present invention; Figure 10 This is a schematic diagram of the structure of the support plate and threaded rod in an embodiment of the present invention; Figure 11 This is a schematic diagram of the structure of the adjustment mechanism (second type of adjustment component) in an embodiment of the present invention; Figure 12 This is a flowchart illustrating the integrated circuit chip packaging method in an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached drawings: 1-Lower housing; 2-Upper housing; 3-Chip body; 4-Mounting cavity; 5-Receiving cavity; 6-First support plate; 7-Mounting plate; 8-First spring; 9-Lead wire; 10-Slot; 11-Limiting rod; 12-Lifting plate; 13-Limiting hole; 14-First wedge block; 15-Support block; 16-Second spring; 17-Second push rod; 18-First push rod; 19-Second wedge block; 20-Guide plate; 21-Guide rod; 22-Circular plate; 23-Third spring; 24-Circular rod; 25-Pressing plate; 26-Second support plate; 27-Buffer column; 28-Pin; 29-Heat dissipation fin; 30-Bracket plate; 31-Threaded rod; 32-First drive shaft; 33-Second drive shaft; 34-Bevel gear; 35-Knob. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0020] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0021] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0024] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. Additionally, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0025] The technical solution will now be explained in detail: Reference Figures 1-11 As shown, a first aspect of the present invention provides an integrated circuit chip packaging structure, including a housing, a mounting plate 7, leads 9, pins 28, and an adjustment mechanism, wherein: The outer casing includes a sealed lower casing 1 and an upper casing 2. The outer casing has a mounting cavity 4 and two storage cavities 5. The mounting cavity 4 is used to mount the chip body 3, and the two storage cavities 5 are located on both sides of the mounting cavity 4. The lower casing 1 and the upper casing 2 are fixedly mounted to form a closed encapsulation outer casing, which divides two functional areas: the mounting cavity 4 located in the middle and the two storage cavities 5 symmetrically distributed on both sides of the mounting cavity 4. The mounting cavity 4 is specifically used to fix and mount the chip body 3, providing a stable mounting environment for the chip. The two storage cavities 5 are used to accommodate the mounting plate 7 and related components, realizing the storage and adjustment functions of the pins 28. The mounting plate 7 is slidably installed in the storage cavity 5; there are two mounting plates 7, and the two storage cavities 5 and the corresponding mounting plates 7 are provided to ensure the symmetry and stability of the connection between the chip and the external circuit, so that the electrical signal transmission is more balanced. The lead 9 is electrically connected to the mounting plate 7 and the chip body 3 respectively; ensuring that the electrical signal of the chip body 3 can be transmitted to the pin 28 through the lead 9, and then the pin 28 establishes a connection with the external circuit. The pin 28 is connected to the mounting plate 7 and can extend out of the storage cavity 5; An adjustment mechanism is installed on the lower housing 1 to precisely control the sliding position of the mounting plate 7 within the storage cavity 5, thereby adjusting the extension length of the pin 28. The adjustment mechanism includes a first support plate 6, a second support plate 26, and an adjustment component. The first support plate 6 and the second support plate 26 are installed in the storage cavity 5 and are located on both sides of the mounting plate 7, forming a limiting support structure for the mounting plate 7. The adjustment component is installed on the first support plate 6 and the second support plate 26 and is drivenly connected to the mounting plate 7.

[0026] The integrated circuit chip packaging structure proposed in this embodiment is driven by the adjustment component and the mounting plate 7. The adjustment component drives the mounting plate 7 to slide in the housing cavity 5, thereby moving the pins 28 and adjusting the extension length of the pins 28. This avoids the pins 28 from extending too far, shortens the extension length of the pins 28 to a suitable distance, or completely hides the pins 28 in the housing cavity 5. This prevents moisture in the air from adhering to the surface of the pins 28, which could lead to oxidation and corrosion of the pins 28 and short circuits between the pins 28. The chip body 3 and the pins 28 are connected by the lead wire 9 and the mounting plate 7. When the circuit board is vibrated, the connection between the chip body 3 and the pins 28 will not become loose or fall off, ensuring that the chip body 3 can work normally.

[0027] In some embodiments, the adjustment mechanism further includes a first spring 8, one end of which is fixed to the first support plate 6, and the other end is connected to the mounting plate 7; the mounting plate 7 has a slot 10 along the length direction of the outer shell; the adjustment assembly includes a lifting plate 12 and a limiting rod 11, the lifting plate 12 is slidably installed between the first support plate 6 and the second support plate 26 in a direction perpendicular to the bottom surface of the storage cavity 5, and passes through the slot 10, the lifting plate 12 has a plurality of limiting holes 13 along the length direction; the limiting rod 11 is disposed in the slot 10, and the limiting rod 11 is used to insert into one of the limiting holes 13.

[0028] In this embodiment, the other end of the first spring 8 is connected to the mounting plate 7. When the mounting plate 7 is in the retracted state, the first spring 8 is in a compressed state, providing an outward elastic force to the mounting plate 7, facilitating the adjustment of the extension of the pin 28. Simultaneously, the first spring 8 also provides initial cushioning when the chip is subjected to vibration, reducing the impact of vibration on the mounting plate 7. When adjustment is required, the lifting plate 12 is lowered, causing the limiting rod 11 to disengage from the limiting hole 13, releasing the limitation of the mounting plate 7. The mounting plate 7 is then moved to adjust the extension length of the pin 28. After adjustment, the limiting rod 11 is inserted into the limiting hole 13 to fix the mounting plate 7.

[0029] In some embodiments, the adjustment mechanism further includes an unlocking component, which includes a first wedge block 14, a second spring 16, a first push rod 18, and a second wedge block 19. The first wedge block 14 is installed at one end of the top surface of the lifting plate 12 and is connected to the second spring 16 via a support block 15. The first wedge block 14 has a first wedge surface that slopes upward. The second spring 16 is installed on the bottom surface of the storage cavity 5 and is connected to the first wedge block 14. In its natural state, the second spring 16 is in an extended state, pushing the lifting plate 12 to remain in a high position. At this time, the limiting rod 11 is inserted into the corresponding limiting hole 13. The first push rod 18 is slidably installed in the storage cavity 5 and one end extends out of the outer shell. The second wedge block 19 is installed at one end of the first push rod 18 and has a second wedge surface that slopes downward. The second wedge surface is used to squeeze the first wedge surface during the sliding of the first push rod 18 to drive the lifting plate 12 down, so that the limiting rod 11 moves out of the limiting hole 13.

[0030] In this embodiment, the first push rod 18 slides in the receiving cavity 5, causing the second wedge surface to press against the first wedge surface, converting the horizontal thrust into a vertical force that drives the lifting plate 12 to move downward, ensuring smooth transmission of the adjustment action. The fit design of the inclined surfaces of the two ensures the effectiveness of force transmission and avoids jamming, so as to drive the first wedge block 14 and the lifting plate 12 to descend together, so that the limiting rod 11 moves out of the limiting hole 13, thereby unlocking the lifting plate 12. This structure is simple and reliable and can improve the convenience of operation. After the mounting plate 7 moves to the designated position, the first push rod 18 is reset, the limiting rod 11 is inserted into the corresponding limiting hole 13, the second spring 16 is in the extended state, pushing the lifting plate 12 to be held in the high position, thereby fixing the lifting plate 12.

[0031] In some embodiments, the unlocking assembly further includes a second push rod 17, a round rod 24, a guide rod 21, a guide plate 20, and a pressing plate 25; the second push rod 17 connects the first push rod 18 and the round rod 24 respectively, and one end of the round rod 24 extends out of the housing and is connected to the pressing plate 25; the guide rod 21 is fixedly installed in the storage cavity 5, and the guide rod 21 is parallel to the second push rod 17; the guide plate 20 is slidably installed on the guide rod 21 and connected to the second push rod 17.

[0032] In this embodiment, by pressing the pressing plate 25, the operator can drive the round rod 24, the first push rod 18, and the second push rod 17 to slide inward simultaneously, thereby driving the second wedge block 19. The pressing plate 25 increases the operating contact area, making manual operation more convenient and effortless. The sliding cooperation between the round rod 24 and the lower housing 1 ensures the accuracy of horizontal movement. The guide rod 21 provides sliding support for the guide plate 20. The guide plate 20 is fixedly connected to the second push rod 17, which restricts the second push rod 17 to move only along the horizontal direction of the guide rod 21, preventing the second push rod 17 from deviating or tilting during movement, and ensuring the precise fit between the second wedge block 19 and the first wedge block 14.

[0033] In some embodiments, the unlocking assembly further includes a third spring 23, one end of which is connected to one end of the guide rod 21, and the other end of which is connected to the guide plate 20 for resetting the guide plate 20. A circular plate 22 is provided at one end of the guide rod 21 to fix the third spring 23. The third spring 23 is located between the guide plate 20 and the circular plate 22. When the pressing plate 25 is pressed, the guide plate 20 compresses the third spring 23. After the pressing plate 25 is released, the elastic restoring force of the third spring 23 pushes the guide plate 20, the first push rod 18, the second push rod 17, and the pressing plate 25 back to their initial positions, preparing for the next adjustment.

[0034] In some embodiments, the adjustment mechanism further includes a buffer post 27, one end of which is mounted on the second support plate 26, and the other end abuts against the mounting plate 7. When the mounting plate 7 slides outward under the action of the first spring 8, the buffer post 27 can buffer and decelerate the mounting plate 7, preventing the limiting rod 11 from misaligning with the limiting hole 13 due to the sliding speed of the mounting plate 7, thereby improving the reliability and stability of the device.

[0035] The working principle of the adjustment mechanism in the above embodiments is as follows: Pin 28 extension adjustment process: When it is necessary to increase the extension length of pin 28, press the pressing plate 25 inward. The pressing plate 25 drives the round rod 24, the first push rod 18 and the second push rod 17 to slide inward simultaneously. At this time, the guide plate 20 slides along the guide rod 21 and compresses the third spring 23; the second wedge block 19 at the end of the second push rod 17 squeezes the first wedge block 14 through the inclined surface, converting the horizontal thrust into a vertical downward force, driving the lifting plate 12 to move downward, and the support block 15 compresses the second spring 16; when the lifting plate 1... When the limiting hole 13 on the 2 is completely disengaged from the limiting rod 11 in the mounting plate 7, the limiting on the mounting plate 7 is released. At this time, the elastic restoring force of the first spring 8 pushes the mounting plate 7 to slide out of the receiving cavity 5, causing the pin 28 to extend. When the pin 28 extends to the required length, the pressing plate 25 is released, the third spring 23 pushes the guide plate 20 and related components to reset, the second spring 16 pushes the lifting plate 12 to move upward, and the limiting rod 11 is re-inserted into the limiting hole 13 at the corresponding height, thus completing the fixation of the pin 28 length. Pin 28 retraction process: When it is necessary to shorten the protruding length of pin 28 or completely retract it, press the pressing plate 25 inward and repeat the above-mentioned release operation. Then, push pin 28 inward by hand, causing the mounting plate 7 to slide into the storage cavity 5, while compressing the first spring 8. When the mounting plate 7 slides to the desired position, release the pressing plate 25. The lifting plate 12 is reset under the action of the second spring 16, and the limiting rod 11 is inserted into the corresponding limiting hole 13 to fix the position of pin 28. If complete retraction is required, the mounting plate 7 can be pushed to the innermost side of the storage cavity 5 so that pin 28 is completely hidden inside the storage cavity 5, achieving a protective effect.

[0036] In other embodiments, the adjustment assembly includes a support plate 30, a threaded rod 31, and a transmission mechanism. The support plate 30 is fixedly installed in the storage area. The support plate 30 is L-shaped, with one side for mounting the threaded rod 31 and the other side for mounting the transmission mechanism. The threaded rod 31 is rotatably mounted between the support plate 30 and the second support plate 26, and the mounting plate 7 is threadedly connected to the threaded rod 31. The transmission mechanism is mounted on the support plate 30 and driven by the threaded rod 31. The rotation of the threaded rod 31 is achieved through the transmission mechanism, and the threaded rod 31 drives the mounting plate 7 to slide in the storage cavity 5, thereby adjusting the extension length of the pin 28. The transmission mechanism can achieve self-locking of the threaded rod 31, eliminating the need for separate locking and unlocking devices, resulting in a simpler design. Furthermore, the driving method of the threaded rod 31 provides higher sensitivity and stepless adjustment.

[0037] In some embodiments, the transmission mechanism includes a first transmission shaft 32, a second transmission shaft 33, a first bevel gear 34, a second bevel gear 34, and a knob 25. The two ends of the first transmission shaft 32 are rotatably mounted on the bracket plate 30 and the first support plate 6, respectively, and are fixedly connected to the threaded rod 31. The two ends of the second transmission shaft 33 are rotatably mounted on the bracket plate 30 and the lower housing 1, respectively, and one end of the second transmission shaft 33 extends out of the housing and is connected to the knob 25. The first bevel gear 34 is mounted on the first transmission shaft 32, and the second bevel gear 34 is mounted on the second transmission shaft 33 and meshes with the first bevel gear 34. Rotating knob 25 drives the second drive shaft 33 to rotate, which in turn drives the first bevel gear 34 to rotate via the second bevel gear 34. This rotation of the first drive shaft 32 and the threaded rod 31 causes the threaded rod 31 to drive the mounting plate 7 to slide within the receiving cavity 5. When knob 25 is not driven by external force, the first and second bevel gears 34 can self-lock, and the mounting plate 7 can be locked, eliminating the need for separate locking and unlocking devices. In practical designs, knob 25 can be replaced with a micro motor to automate the rotation of the second drive shaft 33.

[0038] The working principle of the adjustment mechanism in this embodiment is as follows: When it is necessary to increase the extension length of pin 28, turn knob 25 clockwise. Knob 25 can drive the second drive shaft 33 to rotate clockwise. The second drive shaft 33 can drive the bevel gear 34, the first drive shaft 32, and the threaded rod 31 to rotate. The rotation of the threaded rod 31 can drive the mounting plate 7 and pin 28 to move outward along the threaded rod 31, thereby increasing the extension length of pin 28. When it is necessary to reduce the protrusion length of pin 28, simply turn knob 25 counterclockwise to move mounting plate 7 and pin 28 inward along threaded rod 31, thereby reducing the protrusion length of pin 28.

[0039] In some optional embodiments, preferably, the top surface of the chip body 3 is inlaid with a plurality of heat dissipation fins 29, which are arranged at equal intervals, and the top of the heat dissipation fins 29 are tightly fitted to the inner wall of the upper housing 2. The heat dissipation fins 29 are made of a material with excellent thermal conductivity. Their tops are tightly fitted to the inner wall of the upper housing 2, and the heat generated when the chip body 3 is working is quickly conducted to the heat dissipation fins 29, and then transferred to the upper housing 2 through the heat dissipation fins 29, and finally dissipated into the external environment. The design of equidistant arrangement can ensure uniform heat distribution, improve heat dissipation efficiency, and avoid local overheating of the chip body 3.

[0040] Based on the same concept, a second aspect of the present invention, combined with... Figure 12 As shown, an integrated circuit chip packaging method is provided, using the integrated circuit chip packaging structure described in the first aspect, the packaging method comprising: Step S1: After installing the chip body 3 into the mounting cavity 4, seal and encapsulate the lower housing 1 and the upper housing 2; Step S2: By adjusting the component driving the mounting plate 7 to slide away from the mounting cavity 4 in the storage cavity 5, the pin 28 is moved, thereby realizing the extension adjustment of the pin 28; Step S3: The mounting plate 7 is slid towards the mounting cavity 4 within the receiving cavity 5 by adjusting the mounting component, thereby moving the pin 28 to achieve retraction adjustment of the pin 28, shortening the protruding length of the pin 28, or making the pin 28 completely hidden in the receiving cavity 5. The specific adjustment process of the adjusting component is described in the first aspect embodiment.

[0041] The integrated circuit chip packaging method proposed in this embodiment adjusts the extension length of the pins 28 by adjusting the sliding motion of the mounting plate 7 in the housing cavity 5. This prevents the pins 28 from extending too far and shortens them to a suitable distance, or completely hides them in the housing cavity 5. This prevents moisture from the air from adhering to the surface of the pins 28, which could lead to oxidation and corrosion or short circuits between the pins. The chip body 3 and the pins 28 are connected by leads 9 and the mounting plate 7. When the circuit board is vibrated, the connection between the chip body 3 and the pins 28 will not become loose or fall off, ensuring that the chip body 3 can work normally.

[0042] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated circuit chip packaging structure, characterized in that, Includes housing, mounting plate, leads, pins, and adjustment mechanism, wherein: The housing includes a sealed lower housing and an upper housing. The housing is provided with a mounting cavity and two storage cavities. The mounting cavity is used to mount the chip body, and the two storage cavities are respectively located on both sides of the mounting cavity. The mounting plate is slidably installed in the storage cavity; The leads are electrically connected to the mounting plate and the chip body, respectively. The pin is connected to the mounting plate and can extend out of the storage cavity; The adjustment mechanism includes a first support plate, a second support plate, and an adjustment component. The first support plate and the second support plate are installed in the storage cavity and are located on both sides of the mounting plate, respectively. The adjustment component is installed on the first support plate and the second support plate and is drivenly connected to the mounting plate.

2. The integrated circuit chip packaging structure as described in claim 1, characterized in that, The adjustment mechanism further includes a first spring, one end of which is fixed to the first support plate and the other end is connected to the mounting plate; the mounting plate is provided with slots along the length of the outer shell; The adjustment assembly includes a lifting plate and a limiting rod. The lifting plate is slidably installed between the first support plate and the second support plate in a direction perpendicular to the bottom surface of the storage cavity, and passes through the slot. The lifting plate has multiple limiting holes along its length. The limiting rod is disposed in the slot and is used to insert into one of the limiting holes.

3. The integrated circuit chip packaging structure as described in claim 2, characterized in that, The adjustment mechanism further includes an unlocking component, which includes a first wedge block, a second spring, a first push rod, and a second wedge block. The first wedge block is installed at one end of the top surface of the lifting plate, and the first wedge block has a first wedge surface that slopes upward; The second spring is installed on the bottom surface of the storage cavity and connected to the first wedge block. In its natural state, the second spring is in an extended state, pushing the lifting plate to remain in a high position. At this time, the limiting rod is inserted into the corresponding limiting hole. The first push rod is slidably mounted in the storage cavity and one end extends out of the outer shell; The second wedge block is installed at one end of the first push rod and has a downward-sloping second wedge surface. The second wedge surface is used to squeeze the first wedge surface during the sliding of the first push rod to drive the lifting plate down, so that the limiting rod moves out of the limiting hole.

4. The integrated circuit chip packaging structure as described in claim 3, characterized in that, The unlocking assembly further includes a second push rod, a round rod, a guide rod, and a guide plate; the second push rod is connected to the first push rod and the round rod respectively, and one end of the round rod extends out of the outer shell; the guide rod is fixedly installed in the storage cavity, and the guide rod is parallel to the second push rod; the guide plate is slidably installed on the guide rod and connected to the second push rod.

5. The integrated circuit chip packaging structure as described in claim 4, characterized in that, The unlocking assembly also includes a third spring, one end of which is connected to one end of the guide rod, and the other end of which is connected to the guide plate for resetting the guide plate.

6. The integrated circuit chip packaging structure as described in claim 1, characterized in that, The adjustment mechanism also includes a buffer column, one end of which is mounted on the second support plate and the other end of which abuts against the mounting plate.

7. The integrated circuit chip packaging structure as described in claim 1, characterized in that, The adjustment assembly includes a support plate, a threaded rod, and a transmission mechanism; the support plate is fixedly installed in the storage area; the threaded rod is rotatably installed between the support plate and the second support plate, and the mounting plate is threadedly connected to the threaded rod; the transmission mechanism is installed on the support plate and is drivenly connected to the threaded rod.

8. The integrated circuit chip packaging structure as described in claim 7, characterized in that, The transmission mechanism includes a first transmission shaft, a second transmission shaft, a first bevel gear, a second bevel gear, and a knob. The two ends of the first transmission shaft are rotatably mounted on the bracket plate and the first support plate, respectively, and are fixedly connected to the threaded rod. The two ends of the second transmission shaft are rotatably mounted on the bracket plate and the lower housing, respectively, and one end of the second transmission shaft extends out of the housing and is connected to the knob. The first bevel gear is mounted on the first transmission shaft, and the second bevel gear is mounted on the second transmission shaft and meshes with the first bevel gear.

9. The integrated circuit chip packaging structure according to any one of claims 1-8, characterized in that, The chip body has multiple heat dissipation fins embedded on its top surface. The heat dissipation fins are arranged at equal intervals, and the top of the heat dissipation fins is tightly attached to the inner wall of the upper shell.

10. A method for packaging an integrated circuit chip, characterized in that, Using the integrated circuit chip packaging structure according to any one of claims 1-9, the packaging method includes: After the chip body is installed in the mounting cavity, the lower and upper housings are sealed and encapsulated. By adjusting the component to drive the mounting plate to slide away from the mounting cavity in the storage cavity, the pins are moved, thus achieving the adjustment of the pin extension; By adjusting the component to drive the mounting plate to slide closer to the mounting cavity, the pins are moved, thereby achieving pin retraction adjustment, shortening the pin extension length, or making the pins completely hidden in the mounting cavity.

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