Radiator, electronic equipment and communication equipment

Abstract

The invention provides a radiator, electronic equipment and communication equipment. The radiator comprises a bottom plate, a jet flow pore plate and a cover plate, wherein the jet flow pore plate is arranged between the cover plate and the bottom plate; at least two liquid inlet cavities are formed between the jet flow pore plate and the cover plate, and the liquid inlet cavities used for introducing working media with different temperatures are not communicated with one another; at least two heat exchange cavities are formed between the jet flow hole plate and the bottom plate, and each heat exchange cavity is communicated with one liquid inlet cavity through a jet flow hole formed in the jet flow hole plate. By using the radiator, the chip can be cooled in different areas by using working media with different temperatures, the working reliability of the chip is improved, and the energy consumption is reduced.

Description

Technical Field

[0001] This application relates to the field of heat dissipation, specifically to a heat sink, electronic equipment, and communication equipment. Background Technology

[0002] With the increasing integration of chips and the further improvement of computing power, chip power consumption has increased significantly, and the demand for heat dissipation has also increased. Direct chip jet cooling solutions, characterized by high convective heat transfer coefficients, can avoid the additional thermal resistance introduced by thermally conductive materials, and have great application potential in solving chip heat dissipation problems. Currently, high-power chips often have a zoned design, and different regions have different operating temperature specifications. Electronic components in some areas of the chip can withstand lower operating temperatures; these components can be referred to as low-temperature components. Electronic components in other areas are less affected by temperature and can withstand higher operating temperatures; these components are referred to as high-temperature components. In this scenario, when cooling the chip, different incoming flow temperatures of the working fluid can be used to cool different areas of the chip: low-temperature working fluids are used to dissipate heat from low-temperature components, and higher-temperature working fluids are used to dissipate heat from high-temperature components. This ensures normal chip operation and reduces the overall energy consumption of the liquid cooling system. Under these conditions, it is necessary to solve the crosstalk problem between working fluids of different temperatures, suppress the impact of higher-temperature incoming flow on low-temperature components, and prevent low-temperature components from failing due to overheating. Summary of the Invention

[0003] This application provides a heat sink, electronic device, and communication device. The heat sink can be used to cool the chip in sections using working fluids at different temperatures, thereby improving chip reliability and reducing energy consumption.

[0004] In a first aspect, this application provides a radiator, which includes a base plate, a jet orifice plate, and a cover plate, wherein the jet orifice plate is disposed between the cover plate and the base plate; at least two liquid inlet chambers are provided between the jet orifice plate and the cover plate, and the liquid inlet chambers for introducing working fluids at different temperatures are not interconnected; at least two heat exchange chambers are provided between the jet orifice plate and the base plate, and each heat exchange chamber is connected to one of the liquid inlet chambers through a jet hole provided in the jet orifice plate.

[0005] The heat sink of this application forms at least two liquid inlet chambers between the cover plate and the jet orifice plate, allowing working fluids of different temperatures to enter different inlet chambers. Simultaneously, at least two heat exchange chambers are formed between the jet orifice plate and the base plate, allowing the working fluid in each inlet chamber to enter its corresponding heat exchange chamber through the jet holes in the jet orifice plate. When using this heat sink to cool heat-generating components, such as chips, each heat exchange chamber can correspond to different areas of the chip, thereby achieving the purpose of cooling different areas of the chip using working fluids with different incoming flow temperatures. For example, in the high-temperature component heat dissipation area of ​​the chip, a high-temperature working fluid can be used to cool that area, and in the low-temperature component heat dissipation area, a low-temperature working fluid can be used to cool that area, ensuring effective utilization of the working fluid and preventing the high-temperature working fluid from failing to effectively cool the low-temperature component heat dissipation area. At the same time, it avoids over-cooling of the high-temperature component heat dissipation area, which would increase working fluid energy consumption.

[0006] In one alternative implementation, a flow guide is provided on the side of the jet orifice plate facing the base plate, dividing the heat exchange space between the jet orifice plate and the base plate into different heat exchange chambers. The division of the heat exchange chambers by the flow guide allows working fluids at different temperatures to cool different temperature zones of the heating element. The flow guide includes various forms of thin plates, such as straight plates, curved plates, or annular plates. When dividing the heat exchange chambers using the flow guide, different flow guides can be used to create the division according to the different heat dissipation zones.

[0007] In one alternative implementation, the flow guide is a flow guide ring, with each flow guide ring enclosing a heat exchange cavity, and the area between adjacent flow guide rings forming another heat exchange cavity. Using flow guide rings to form heat exchange cavities results in a simple structure and facilitates the division of heat exchange cavities. The shape of the flow guide ring can be rectangular, circular, elliptical, etc., without specific limitations.

[0008] In one alternative implementation, at least a portion of the sides of the guide ring are provided with guide holes. By providing guide holes, the working fluid in the heat exchange chamber can be easily discharged outwards. The shape of the guide holes can be a circular through hole or a strip-shaped through hole, etc., and the shape of the through hole is not specifically limited here.

[0009] In one alternative implementation, the diameter of the guide orifice gradually decreases from the area enclosed by the guide ring to the area outside the area enclosed by the guide ring. This structure, with its guide orifice resembling a nozzle, increases the flow velocity of the working fluid and prevents the working fluid outside the guide orifice from flowing back into the heat exchange chamber corresponding to the guide ring.

[0010] In one alternative implementation, along the direction from the base plate to the jet orifice plate, the guide ring elastically abuts against both the jet orifice plate and the heating element for fixing to the surface of the base plate. One side of the guide ring abuts against both the jet orifice plate and the heating element for fixing to the base plate, thus restricting the outflow of the working fluid from that side within the heat exchange chamber corresponding to the guide ring.

[0011] In one alternative implementation, the side of the guide ring for elastic contact with the jet orifice plate includes a fixed portion and a movable portion. An elastic connector is provided between the fixed portion and the movable portion. The elastic connector is in a charged state so that one of the fixed portion and the movable portion contacts the jet orifice plate, and the other contacts the heating element. By providing elastic contact, the guide ring can be prevented from affecting the heating element located on the base plate.

[0012] In one alternative implementation, a sealing strip is provided between the fixed part and the moving part to prevent the working fluid from flowing out from the gap between the fixed part and the moving part.

[0013] In one alternative implementation, the side of the guide ring for elastic contact with the jet orifice plate includes a fixed part and a movable part. The fixed part is connected to the jet orifice plate and has a groove, while the movable part is an elastic column disposed within the groove. At least one end of the elastic column protrudes from the groove and abuts against the jet orifice plate or the heating element. Using an elastic column to achieve elastic contact with the jet orifice plate and the base plate results in a simple structure and effectively prevents the working fluid from flowing out. During assembly, the elastic column can be directly placed within the groove, preventing assembly issues.

[0014] In one optional implementation, a partition is provided between adjacent liquid inlet chambers, and the thermal conductivity of the partition is less than 20 W / (m·K). By providing a partition with a thermal conductivity of less than 20 W / (m·K) between adjacent liquid inlet chambers, temperature crosstalk between working fluids at different temperatures between adjacent liquid inlet chambers can be avoided.

[0015] In one alternative implementation, the partition is a porous structure or has an internal insulation cavity. By incorporating a porous structure or insulation cavity into the partition, the thermal insulation performance of the partition can be improved, and a partition with a low thermal conductivity can be obtained even using materials with high thermal conductivity.

[0016] In one alternative implementation, a return liquid chamber is formed between the cover plate and the bottom plate, and each heat exchange chamber is connected to the return liquid chamber. Each inlet liquid chamber is also connected to the return liquid chamber through a heat exchange chamber. This connection between the heat exchange chambers and the return liquid chamber facilitates the recovery and reuse of the working fluid, as well as its extraction.

[0017] In one optional implementation, the cover plate includes multiple sub-covers spaced apart from each other. Some of the sub-covers are respectively sealed to a jet orifice plate, forming a liquid inlet chamber with each. The remaining sub-covers are connected to a base plate, forming a liquid return chamber with the base plate. Each liquid inlet chamber communicates with the liquid return chamber via a heat exchange chamber. When the cover plate is divided into multiple independent sub-covers, each sub-cover can form a liquid inlet chamber with the jet orifice plate, thus allowing each liquid inlet chamber to operate independently, eliminating the need for a partition.

[0018] Secondly, this application provides an electronic device, which includes a heating component and a heat sink of this application. The heating component is connected to a base plate and includes at least two heat dissipation areas, which are respectively arranged in a one-to-one correspondence with at least two heat exchange chambers.

[0019] The electronic device of this application can, when dissipating heat from a heat-generating component, introduce working fluids of different temperatures into each heat exchange chamber through different liquid inlet chambers of the heat sink to cool different heat dissipation areas of the heat-generating component. This enables efficient utilization of the working fluid and allows each electronic component within the heat-generating component to operate within a suitable temperature range.

[0020] Thirdly, this application provides a communication device, which includes multiple communication units. Each communication unit includes a chip and a heat sink of this application. The chip is connected to a base plate and includes at least two heat dissipation areas. The at least two heat dissipation areas are arranged in a one-to-one correspondence with at least two heat exchange chambers.

[0021] The technical effects that can be achieved in the third aspect mentioned above can be referred to the corresponding effect descriptions in the second aspect mentioned above, and will not be repeated here. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a server;

[0023] Figure 2 This is a schematic diagram of the heat dissipation area of ​​a chip according to one embodiment;

[0024] Figure 3 This is a schematic diagram of the structure of an electronic device;

[0025] Figure 4 This is an exploded structural diagram of an electronic device;

[0026] Figure 5 This is a schematic cross-sectional view of a heat sink according to one embodiment.

[0027] Figure 6 This is a schematic diagram of the structure of a cover plate;

[0028] Figure 7 This is a schematic diagram of the structure of a jet orifice plate according to one embodiment;

[0029] Figure 8 This is a schematic diagram of the jet orifice plate according to another embodiment;

[0030] Figure 9 This is a schematic diagram of a partition structure according to one embodiment;

[0031] Figure 10 This is a schematic diagram of a partition structure according to another embodiment;

[0032] Figure 11 This is a schematic diagram of a partition structure according to another embodiment;

[0033] Figure 12 This is a partial structural schematic diagram of a heat exchanger according to one embodiment;

[0034] Figure 13 This is a schematic diagram of the flow guide ring according to one embodiment;

[0035] Figure 14 This is a schematic diagram of the flow guide ring in another embodiment;

[0036] Figure 15 This is a schematic diagram of the flow guide ring in another embodiment;

[0037] Figure 16 This is a schematic diagram of the structure of a heat exchange cavity according to one embodiment;

[0038] Figure 17 This is a schematic diagram of the connection structure between the flow guide, the jet orifice plate, and the heating element in one embodiment.

[0039] Figure 18 This is a schematic diagram of the side structure of a flow guide in one embodiment;

[0040] Figure 19 This is a schematic diagram of the side structure of the guide member according to another embodiment of this application;

[0041] Figure 20 This is a schematic diagram of the side structure of the guide member according to another embodiment of this application;

[0042] Figure 21 This is a schematic diagram of the side structure of the guide member according to another embodiment of this application;

[0043] Figure 22 This is a schematic diagram of the structure of a heat sink according to another embodiment of this application;

[0044] Figure 23 This is a cross-sectional structural diagram of a heat sink according to one embodiment.

[0045] Figure label:

[0046] 02-Heating component; 021-Heating element; 022-Encapsulating ring; 02a-Low-temperature element heat dissipation area; 02b-High-temperature element heat dissipation area;

[0047] 01-Radiator; 1-Base plate; 10-Sealing ring;

[0048] 2-Jet plate; 20-Jet hole; 21-Separator; 210-Air insulation layer; 211-First separator; 212-Second separator; 22-Substrate;

[0049] 3-Cover plate; 301-Sub-cover; 30-Frame; 31-Boss; 311-First boss; 312-Second boss; 32-Liquid inlet channel;

[0050] 321 - First inlet channel; 322 - Second inlet channel; 323 - Third inlet channel; 33 - Outlet channel;

[0051] 4-Flow guide; 41-Flow guide ring; 42-Flow guide hole; 43-Fixing part; 44-Moving part; 45-Sealing strip; 46-Elastic connector; 401-Groove;

[0052] 402 - Fixing hole; 403 - Groove; 404 - Elastic column;

[0053] 100 - Liquid inlet chamber; 101 - First liquid inlet chamber; 102 - Second liquid inlet chamber; 200 - Heat exchange chamber; 201 - First heat exchange chamber; 202 - Second heat exchange chamber;

[0054] 203 - Third heat exchange chamber; 300 - Liquid return chamber. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0056] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0057] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0058] Figure 1 This is a schematic diagram of the structure of a server. For example... Figure 1As shown, the server comprises multiple computing nodes. Each computing node includes at least one chip. With the increasing integration of chips and further improvements in computing power, chip power consumption has significantly increased. Furthermore, each chip may include various electronic components with different operating temperature specifications. Figure 2 This is a schematic diagram of the heat dissipation area of ​​a chip according to one embodiment. Figure 2 As shown, the chip can include two heat dissipation zones. One heat dissipation zone is the high-temperature component heat dissipation zone 02b, where the electronic components are high-temperature components that generate a lot of heat and can withstand a relatively high operating temperature range, for example, a maximum operating temperature of 50-60℃. The other zone is the low-temperature component heat dissipation zone 02a, where the electronic components are low-temperature components and can withstand a relatively low maximum operating temperature, for example, operating within a temperature range below 20℃. If the same working fluid is used to cool the chip, the temperature of the working fluid needs to be controlled below the maximum operating temperature of the low-temperature zone, for example, below 20℃. Therefore, using a working fluid at this temperature to cool the high-temperature component heat dissipation zone will increase the total energy consumption of the liquid cooling system, and the high-temperature incoming working fluid may affect the low-temperature components, reducing the reliability of the low-temperature components.

[0059] Based on this, this application provides an electronic device. Figure 3 This is a schematic diagram of the structure of an electronic device. Figure 4 This is an exploded structural diagram of an electronic device. (Example) Figure 3 and Figure 4 As shown, the electronic device includes a heat-generating component 02 and a heat sink 01. The heat-generating component 02 is located within the heat sink 01. The heat-generating component includes a heat-generating element 021 and a molding ring 022. The molding ring 022 encapsulates and fixes the heat-generating element 021 along its circumference, protecting the edges of the heat-generating element 021 and preventing moisture, dust, and other impurities from penetrating from the sides of the heat-generating element 021. The heat-generating element 021 can be, for example, a chip. The molding ring 022 fixes and protects the heat-generating element 021. The size and material of the molding ring 022 are not limited. A cooling medium can be introduced into the heat sink 01 as a working fluid to cool the heat-generating element.

[0060] Reference Figure 4 The heat sink in this embodiment includes a base plate 1, a jetting plate 2, and a cover plate 3. The jetting plate 2 and the cover plate 3 form multiple liquid inlet chambers 100, and the jetting plate 2 and the base plate 1 form multiple heat exchange chambers 200. A heating element 021 is connected to the base plate 1, and the heating element 021 includes at least two heat dissipation areas, which are correspondingly arranged with at least two heat exchange chambers 200. When cooling the chip, working fluids of different temperatures can be introduced into different heat exchange chambers 200 through different liquid inlet chambers 100 to cool different locations of the heating element 021, such as the chip. Figure 4 In the structure shown, the high-temperature element heat dissipation area 02b is located in the middle region of the heating element 021, and the low-temperature element heat dissipation area 02a is located on both sides of the high-temperature element heat dissipation area 02b. It is understood that the relative positional relationship between the high-temperature element heat dissipation area 02b and the low-temperature element heat dissipation area 02a is only an illustrative example, and there may be other positional relationships between them, depending on the structure and function of the heating element 021.

[0061] Figure 5 This is a schematic cross-sectional view of a heat sink according to one embodiment. Figure 4 and Figure 5 As shown, in this radiator, a cover plate 3 and a base plate 1 are arranged opposite each other. The cover plate 3 has a receiving groove on the side facing the base plate 1, and the base plate 1 can be a plate-like structure. The cover plate 3 and the base plate 1 are closed to form a receiving space. Alternatively, the base plate 1 can also be a base plate with a grooved structure, i.e., it has raised sidewalls around its perimeter, to close with the cover plate 3 and form a receiving space. A sealing ring 10 can be provided at the connection between the cover plate 3 and the base plate 1 to achieve a sealed connection between them.

[0062] The jet orifice plate 2 is disposed within the receiving space formed by the cover plate 3 and the bottom plate 1. Figure 5 Taking the indicated orientation as an example, the jet orifice plate 2 is located below the cover plate 3, and its edge is connected to the cover plate 3, such as by riveting, bolting, bonding, snap-fitting, or welding. At least two liquid inlet chambers 100 can be formed between the jet orifice plate 2 and the cover plate 3, and at least two heat exchange chambers 200 can be formed between the jet orifice plate 2 and the base plate 1. Figure 4 and Figure 5 As shown, the heating element 021 in the heating assembly is arranged corresponding to the heat exchange chamber 200. When cooling the heating assembly, mainly the heating element 021, the working fluid in the heat exchange chamber 200 can be used to cool the heating element 021. Different heat exchange chambers 200 can correspond to different areas of the heating element 021, so as to realize the cooling of the heating element using working fluids at different temperatures.

[0063] The structure of the cover plate, jet orifice plate, and base plate will be further described in detail below with reference to the accompanying drawings.

[0064] Figure 6 This is a structural schematic diagram of a cover plate. Please refer to it as well. Figures 4 to 6 The cover plate 3 can be a metal cover plate, and its outline can be a cuboid structure. The cover plate 3 may include a cover plate body and multiple channels located on the top of the cover plate body. The cover plate body and the multiple channels can be an integral structure. Of the multiple channels located on the top of the cover plate 3, one portion serves as a liquid inlet channel 32, and another portion serves as a liquid outlet channel 33. There can be multiple liquid inlet channels 32 to allow different working fluids at different temperatures to be introduced. There can be a single liquid outlet channel 33, from which working fluids at various temperatures can ultimately converge and exit. Figures 4 to 6 Taking the structure shown as an example, there are four channels: three liquid inlet channels 32, which are respectively designated as the first liquid inlet channel 321, the second liquid inlet channel 322, and the third liquid inlet channel 323. There is one liquid outlet channel 33. Each channel extends through the cover plate 3 in the direction from the cover plate 3 to the bottom plate 1.

[0065] Reference Figure 5 and Figure 6 The cover plate 3 faces the base plate 1, and its edge is provided with a frame 30. The frame 30 extends towards the base plate 1, forming a receiving groove in the middle. The frame 30 of the cover plate 3 is used to connect with the base plate 1. Inside the receiving groove of the cover plate 3, the side of the cover plate 3 facing the base plate 1 is provided with a boss 31 protruding towards the base plate 1, such as an annular boss. This boss 31 can be used to connect the jet orifice plate 2 and to separate the space between the cover plate 3 and the jet orifice plate 2, thus assisting in the formation of the liquid inlet chamber 100. The number of bosses 31 can be one, two, or more. The shape of the boss 31 can be designed according to the structure of the jet orifice plate and the position and shape of the formed liquid inlet chamber, and is not specifically limited here.

[0066] exist Figure 5 and Figure 6 In the structure shown, there are two bosses 31: a first boss 311 and a second boss 312. Both the first boss 311 and the second boss 312 are rectangular annular bosses. The second boss 312 surrounds the first boss 311. The edge of the jet orifice plate 2 is sealed to the second boss 312, and the first boss 311 is located within the area enclosed by the second boss 312 and the jet orifice plate 2. The height of the first boss 311 is less than the height of the second boss 312. The height of the first boss 311 is the dimension by which it protrudes towards the base plate 1. The height of the second boss 312 is the dimension by which it protrudes towards the base plate 1.

[0067] Refer to together Figure 5 and Figure 6 The first liquid inlet channel 321 can be configured corresponding to the enclosed area of ​​the first protrusion 311. The second liquid inlet channel 322 and the third liquid inlet channel 323 can be configured corresponding to the annular area between the first protrusion 311 and the second protrusion 312. The enclosed area corresponding to the first protrusion 311 can form a liquid inlet cavity 100, denoted as the first liquid inlet cavity 101. The annular area between the second protrusion 312 and the first protrusion 311 can form a liquid inlet cavity 100, denoted as the second liquid inlet cavity 102. The first liquid inlet cavity 101 and the second liquid inlet cavity 102 are not interconnected. When a working medium is introduced, the first liquid inlet cavity 101 can be introduced with a working medium of one temperature, and the second liquid inlet cavity 102 can be introduced with a working medium of another temperature. To ensure that the liquid inlet cavities 100 used for introducing different working media are not interconnected, the cover plate 3 and the jet orifice plate 2 can be connected to each other to form unconnected liquid inlet cavities 100.

[0068] Reference Figure 5 The area between the frame 30 of the cover plate 3 and the second protrusion 312 can form part of the space of the return liquid chamber 300. The return liquid chamber 300 can be located between the cover plate 3 and the bottom plate 1. Each inlet chamber 100 and the return liquid chamber 300 must be isolated and not interconnected. The outlet channel 33 of the cover plate 3 can communicate with the return liquid chamber 300. Therefore, the protrusion 31 at the bottom of the cover plate 3, in addition to being used to connect with the jet orifice plate 2, can also serve as a separator between the inlet chamber 100 and the return liquid chamber 300, preventing them from communicating.

[0069] Figure 7 This is a schematic diagram of the structure of a jet orifice plate according to one embodiment. Figure 7 As shown, the jet orifice plate 2 may include a substrate 22 and a partition 21. The partition 21 is disposed on the side of the substrate 22 facing the cover plate 3. The partition 21 extends from the substrate 22 toward the cover plate 3 and is substantially perpendicular to the substrate 22. Figure 7 As shown, the baffle 21 can be a straight plate or an annular baffle, and the number of baffles 21 can be set according to the number of liquid inlet chambers. The position of the baffle 21 can be set according to the position of the heat dissipation area of ​​the heating element. Figure 6 and Figure 7 In the illustrated embodiment, the partitions 21 are all annular partitions, and there are two partitions 21, referred to as the first partition 211 and the second partition 212. The first partition 211 is located within the area enclosed by the second partition 212. In the direction perpendicular to the substrate 22, the height of the first partition 211 is greater than the height of the second partition 212.

[0070] Refer to together Figure 6 and Figure 7 The edge of the substrate 22 of the jet orifice plate 2 can be correspondingly disposed with the second protrusion 312 of the cover plate 3. For example, the substrate 22 can be connected to the surface of the second protrusion 312 facing the bottom plate 1, and the connection method includes, but is not limited to, screw connection, snap-fit, bonding, welding, etc. The first partition 211 of the jet orifice plate 2 and the first protrusion 311 of the cover plate 3 can have an overlapping area in the height direction of the first partition 211, and the outer side of the first partition 211 and the inner side of the first protrusion 311 are in contact, for example, they can be sealed together. The outer side of the first partition 211 is the surface of the first partition 211 facing the edge of the jet orifice plate 2. The inner side of the first protrusion 311 is the surface of the first protrusion 311 facing away from the frame 30 of the cover plate 3. The top surface of the first partition 211 can be in contact with the bottom surface of the cover plate 3, or it can maintain a certain distance from the bottom surface of the cover plate 3, as long as the first protrusion 311 and the first partition 211 cooperate to form a closed barrier wall. Therefore, refer to the following. Figure 5The first protrusion 311 and the first partition 211 enclose a first liquid inlet cavity 101. Similarly, in the height direction of the second partition 212, the second partition 212 of the jet orifice plate 2 and the second protrusion 312 of the cover plate 3 may have an overlapping area, and the outer side of the second partition 212 may contact the inner side of the second protrusion 312, for example, the two may be sealed together. Thus, the area between the second partition 212 and the first partition 211 can form a second liquid inlet cavity 102. The first liquid inlet cavity 101 and the second liquid inlet cavity 102 are not interconnected.

[0071] Continue to refer to Figure 5 , Figure 6 and Figure 7 To achieve communication between the liquid inlet chamber 100 and the heat exchange chamber 200, the jet orifice plate 2 of this embodiment has jet holes 20 at the substrate positions corresponding to each liquid inlet chamber 100. These jet holes 20 penetrate the substrate 22 in the thickness direction of the substrate 22. The jet holes 20 can be uniformly or non-uniformly arranged on the jet orifice plate 2. Each liquid inlet chamber 100 communicates with at least one heat exchange chamber 200 through a corresponding jet hole 20. The diameters of the jet holes 20 corresponding to different liquid inlet chambers 100 can be the same or different. Figure 7 Taking the shown orientation as an example, along the x-direction, jet holes 20 are respectively provided in the second liquid inlet chambers 102 located on both sides of the first liquid inlet chamber 101. In this direction, the distance between the second partition 212 and the first partition 211 can be relatively large to form an effective area of ​​the second liquid inlet chamber 102 in this region. Along the y-direction, no jet holes 20 are provided in the positions of the second liquid inlet chambers 102 located on both sides of the first liquid inlet chamber 101. In this direction, the distance between the second partition 212 and the first partition 211 can be set relatively small. In some embodiments, along the y-direction, the distance between the second partition 212 and the first partition 211 can be zero, that is, in this direction, the first partition 211 and the second partition 212 are closely connected.

[0072] Understandable, Figure 7 The structure shown only illustrates one form of partition 21 arrangement. The partition 21 can also be arranged in other ways. Furthermore, the liquid inlet cavity formed between multiple partitions 21 and between the partitions 21 and the cover plate 3 can also be in other structural forms. Figure 8 This is a schematic diagram of the jet orifice plate according to another embodiment. Figure 8 As shown, in the jet perforated plate 2 of this embodiment, a plurality of partitions 21 may be provided on the surface of the substrate 22. (Refer to...) Figure 8When setting the partitions, a second partition 212 with a U-shaped structure can be set on both sides of the first partition 211 with an annular structure. For example, along the x-direction, the second partition 212 is set on both sides of the first partition 211. Alternatively, an annular partition can be set first, and multiple straight-plate partitions can be set on the inner side of the annular partition to divide it into multiple parallel liquid inlet chambers. Alternatively, there are various ways to divide the liquid inlet chambers. When the structure and position of the partitions change, the structure and position of the boss on the cover plate can also be adjusted accordingly so that the partitions and bosses form the required liquid inlet chambers.

[0073] Continue to refer to Figure 5 The liquid inlet chamber 100 can be connected to liquid inlet channels to introduce working fluid. The first liquid inlet channel 321 can communicate with the first liquid inlet chamber 101, and the second liquid inlet channel 322 and the third liquid inlet channel 323 can communicate with the second liquid inlet chamber 102. When cooling the heating element 021, a working fluid of one temperature can be introduced into the first liquid inlet channel 321, while a working fluid of another temperature can be introduced into the second liquid inlet channel 322 and the third liquid inlet channel 323 simultaneously. Furthermore, when the distance between the second partition 212 and the first partition 211 is zero in the y-direction, the second liquid inlet chamber 102 can be divided into two non-communicating liquid inlet chambers, which are respectively connected to the second liquid inlet channel 322 and the third liquid inlet channel 323. Therefore, the liquid inlet chambers used for introducing working fluids of different temperatures need to be isolated and not interconnected. Conversely, the liquid inlet chambers used for introducing working fluids of the same temperature can be interconnected or not.

[0074] To prevent temperature crosstalk between working fluids at different temperatures, which could affect the cooling effect of the working fluid, the partition in this embodiment can be a partition with a thermal conductivity of less than 20 W / (m·k). Figures 9-11 These are schematic diagrams of a partition structure according to one embodiment. Figure 9 As shown, in one embodiment, the partition 21 is a solid structure, which can be formed using a material with a thermal conductivity of less than 20 W / (m·K), such as foamed plastic, gypsum board, or polyvinyl chloride. Figure 10 As shown, in one embodiment, the partition 21 has a porous structure, which allows for low thermal conductivity. Figure 11 As shown, in one embodiment, the partition 21 has a hollow structure with an air insulation layer 210 in the middle to achieve low thermal conductivity of the partition.

[0075] The structure and formation of the liquid inlet chamber have been explained above. The structure of the heat exchange chamber will be explained below.

[0076] Continue to refer to Figure 5After the working fluid enters the inlet chamber 100, it enters the heat exchange chamber 200 through the jet holes 20 of the jet orifice plate 2, where it cools the heating element 021. At least two heat exchange chambers 200 are provided between the jet orifice plate 2 and the base plate 1. Each heat exchange chamber 200 is connected to one of the inlet chambers 100 through the jet holes 20 provided in the jet orifice plate 2. (Refer to...) Figure 5 The number of heat exchange chambers 200 can be three, designated as the first heat exchange chamber 201, the second heat exchange chamber 202, and the third heat exchange chamber 203. The first heat exchange chamber 201 is connected to the first liquid inlet chamber 101, while the second heat exchange chamber 202 and the third heat exchange chamber 203 are both connected to the second liquid inlet chamber 102. Figure 5 In the vertical direction shown, the second heat exchange chamber 202 corresponds to the second liquid inlet channel 322, and the third heat exchange chamber 203 corresponds to the third liquid inlet channel 323.

[0077] In one embodiment, a flow guide 4 is provided on the side of the jet orifice plate 2 facing the base plate 1. The flow guide 4 divides the heat exchange space between the jet orifice plate 2 and the base plate 1 into different heat exchange chambers 200. In the radiator where the heating element 021 is installed, the heat exchange space is the space formed by the heating element 021 and the flow guide 1. The flow guide 4 can be provided according to different heat dissipation areas of the heating element 021 to form different heat exchange chambers 200. The shape of the flow guide 4 is not limited in this application and can be set according to the shape of the heat dissipation area of ​​the heating element 021. The frame of the flow guide 4 is provided in the non-perforated area of ​​the jet orifice plate 2. The diameters of the jet holes 20 provided on the jet orifice plate 2 corresponding to different flow guides 4 can be the same or different.

[0078] In one embodiment, the flow guide 4 may be a flow guide ring 41, and the number of flow guide rings 41 is at least one. Figure 4 and Figure 5 In the structure shown, there are two guide rings 41. The two guide rings 41 are spaced apart, and the area enclosed by each guide ring 41 can form a heat exchange chamber 200. The area between adjacent guide rings 41 can form another heat exchange chamber 200. Adjacent heat exchange chambers 200 can be interconnected. Each heat exchange chamber 200 is connected to the return liquid chamber 300. Thus, working fluids of various temperatures can flow through different areas of the heating element 021 and then converge before flowing out of the return liquid chamber 300.

[0079] Figure 12 This is a partial structural schematic diagram of a heat exchanger according to one embodiment. Figure 5 and Figure 12As shown, the guide ring 41 is connected to the bottom surface of the jet orifice plate 2. The high-temperature element heat dissipation area 02b of the heating element 021 corresponds to the first heat exchange chamber 201. The low-temperature element heat dissipation area 02a of the heating element 021 corresponds to the second heat exchange chamber 202 and the third heat exchange chamber 203. The area enclosed by the guide ring 41 forms the second heat exchange chamber 202 and the third heat exchange chamber 203. The area between the two guide rings 41 is the first heat exchange chamber 201. At least one side of the guide ring 41 has a certain distance from the heating element 021, so that the first heat exchange chamber 201 and the second heat exchange chamber 202, as well as the first heat exchange chamber 201 and the third heat exchange chamber 203, are interconnected, and the second heat exchange chamber 202 and the third heat exchange chamber 203 are connected to the return liquid chamber 300. Therefore, the working fluid in the second heat exchange chamber 202 and the third heat exchange chamber 203 flows through the low-temperature element heat dissipation area 02a of the heating element 021 and then flows to the return liquid chamber 300 and the first heat exchange chamber 201.

[0080] Figure 13 This is a schematic diagram of the structure of a flow guide ring according to one embodiment, wherein (a) is a top view of the flow guide ring, and (b) is a three-dimensional view of the flow guide ring. Figure 13 As shown, the guide ring 41 has a rectangular frame structure, and its sidewalls can be thin plates. See also... Figure 12 The height of the guide ring 41 is less than the distance between the jet orifice plate 2 and the heating element 021. After the guide ring 41 is connected to the bottom surface of the jet orifice plate 2, the end of the guide ring 41 facing the heating element 021 maintains a certain distance from the heating element 021, so that the working fluid in this area flows outward. To allow the working fluid in the area enclosed by the guide ring 41 to flow into the adjacent heat exchange chamber, the diameter of the jet orifice 20 on the jet orifice plate 2 corresponding to the guide ring 41 can be set to be relatively large, forming an enlarged orifice structure to increase the flow rate and velocity of the working fluid in this area. The diameter of the jet orifice 20 on the jet orifice plate 2 corresponding to the heat exchange chamber adjacent to the guide ring 41 can be set to be relatively small to reduce the flow rate and velocity of the working fluid in this area, so that the flow velocity of the working fluid in this area is lower than the flow velocity of the working fluid in the area enclosed by the guide ring 41, preventing the working fluid in this area from flowing back into the area enclosed by the guide ring 41.

[0081] Figure 14 Figure 4 shows a schematic diagram of the flow guide ring according to another embodiment, wherein (a) is a top view of the flow guide ring and (b) is a three-dimensional view of the flow guide ring. In this embodiment, a flow guide hole 42 may be provided on the side wall of the flow guide ring 41. The flow guide hole 42 penetrates the side wall of the flow guide ring 41 in the wall thickness direction. The flow guide hole 42 may be provided on one side wall, two side walls, or all three or all side walls of the flow guide ring 41. Figure 14As shown in this embodiment, the flow guide ring 41 has flow guide holes 42 on its two opposite sidewalls, and the two opposite sidewalls are respectively adjacent to the heat exchange chamber and the liquid return chamber. In the height direction of the flow guide ring, the flow guide hole 42 can be a through hole. That is, in the height direction of the flow guide ring 41, the flow guide hole 42 is a longitudinal slit.

[0082] Figure 15 This is a schematic diagram of the flow guide ring according to another embodiment, wherein (a) is a top view of the flow guide ring, and (b) is a three-dimensional view of the flow guide ring. Figure 14 The difference shown is that the flow guide ring is... Figure 15 In the flow guide ring structure shown, the diameter of the flow guide hole 42 gradually decreases from the area enclosed by the flow guide ring 41 to the outside of the area enclosed by the flow guide ring 41, thus forming an enlarged hole structure. In this configuration, the flow guide hole 42 can form a nozzle structure. An enlarged hole nozzle structure is provided in the low-temperature element heat dissipation area to increase the jet velocity, improve the peripheral working fluid pressure, and facilitate the flow of the working fluid to the high-temperature element heat dissipation area.

[0083] It should be noted that the structure and shape of the guide holes on different sidewalls of the same guide ring can be the same or different. No specific restrictions are imposed here.

[0084] In one embodiment, in order to make full use of the working fluid in the low-temperature element heat dissipation area, it can be allowed to flow through the low-temperature element heat dissipation area of ​​the heating element and then continue to flow through the high-temperature element heat dissipation area of ​​the heating element, so as to make full use of the temperature of this part of the working fluid to dissipate heat from the heating element. Figure 16 This is a schematic diagram of the structure of a heat exchange cavity according to one embodiment. Figure 16 As shown, in this embodiment, the frame of the flow guide ring 41 is connected to the plastic sealing ring 022 in the heating assembly. In this connection structure, the working fluid in the second heat exchange chamber 202 and the third heat exchange chamber 203 flows through the low-temperature element heat dissipation area 02a of the heating element 021 and then flows to the adjacent high-temperature element heat dissipation area 02b, and finally flows from the first heat chamber flow 201 corresponding to the high-temperature element heat dissipation area 02b to the return liquid chamber.

[0085] Figure 17 This is a schematic diagram illustrating the connection structure of the flow guide, jet orifice plate, and heating element according to one embodiment. Figure 17 Taking the orientation shown as an example, along the direction from the jet orifice plate 2 to the heating element 02, the upper and lower surfaces of the frame of the guide member 4 abut against the jet orifice plate 2 and the heating element 02, respectively. In order to protect the heating element 021 from being crushed by the guide member 4, the guide member 4 abuts against the plastic sealing ring 022 of the heating element 02, for example, it can be elastic abutment.

[0086] Figure 18 This is a schematic diagram of the side structure of a flow guide according to one embodiment. (In conjunction with...) Figure 17 and Figure 18As shown, the side of the guide ring 41 that elastically abuts against the jet orifice plate 2 includes a fixed part 43 and a movable part 44. The fixed part 43 can be fixedly connected to the jet orifice plate 2. An elastic connector 46, such as a spring, is provided between the fixed part 43 and the movable part 44. When the guide ring 41 is fixed between the jet orifice plate 2 and the heating element 02, the elastic connector 46 is in a charged state so that the fixed part 43 abuts against the jet orifice plate 2, and the movable part 44 abuts against the heating element 02 fixed to the surface of the base plate 1. Specifically, to prevent the heating element 021 from being crushed, the movable part 44 abuts against the plastic sealing ring 022 in the heating element 02.

[0087] Reference Figure 17 and Figure 18 The structure shown has an I-shaped cross-section for the fixed part 43, which connects to the jet orifice plate 2. The movable part 44 has a U-shaped cross-section with a groove 401 in the middle, and the fixed part 43 is placed within this groove 401. A sealing strip 45 is provided between the fixed part 43 and the movable part 44 to achieve a sealed connection. The sealing strip 45 can be located between the notch formed by the I-shape of the fixed part 43 and the inner wall of the movable part 44. The sealing strip 45 can be either a strip or a ring. A fixing hole 402 is provided in the middle of the fixed part 43 for placing an elastic connector 46, such as a spring. This fixing hole 402 can be a through hole or a blind hole. When it is a through hole, one end of the spring abuts against the jet orifice plate 2, and the other end abuts against the bottom surface of the groove 401 of the movable part. When the fixing hole 402 is a blind hole, one end of the spring abuts against the fixing part 43, and the other end abuts against the bottom surface of the groove 401. The movable part 44 and the fixing part 43 can be relatively displaced in the extension and contraction direction of the spring, thereby achieving elastic contact with the jet orifice plate 2 and the heating component 02.

[0088] Figure 19 This is a schematic diagram of the side structure of the guide member according to another embodiment of this application. Figure 19 As shown, the fixed part 43 has an I-shaped cross-section and is connected to the jet orifice plate 2. The movable part 44 has a U-shaped cross-section with a groove 401 in the middle, and the fixed part 43 is placed in the groove 401 of the movable part. A sealing strip 45 is provided between the fixed part 43 and the movable part 44 to achieve a sealed connection between them. The movable part 44 and the fixed part 43 can move relative to each other in the direction of the elastic connector 46, such as a spring, thereby achieving elastic contact with the jet orifice plate and the heating element. This embodiment is similar to... Figure 18 The difference is that the fixing part 43 does not have a fixing hole. Figure 19Taking the shown orientation as an example, the spring is disposed between the bottom surface of the fixed part 43 and the bottom surface of the groove 401 of the movable part 44. One end of the spring can be connected to the bottom surface of the fixed part 43, and the other end can be connected to the bottom surface of the groove 401 of the movable part 44. During installation, one end of the spring can be fixedly connected to the fixed part 43, or the other end of the spring can be fixedly connected to the bottom surface of the groove 401 of the movable part 44. When the guide member 4 is fixed between the jet orifice plate and the heating element, the spring is in a compressible state, so that the fixed part 43 abuts against the jet orifice plate, and the movable part 44 abuts against the heating element.

[0089] Figure 20 This is a schematic diagram of the side structure of the guide member according to another embodiment of this application. Figure 20 As shown, the flow guide in this embodiment has a side plate comprising a fixed portion 43 and a movable portion 44. The fixed portion 43 has a U-shaped cross-section with its opening facing downwards. The movable portion 44 has an I-shaped cross-section. The movable portion 44 is located within the groove 401 of the fixed portion 43. The fixed portion 43 is connected to the jet orifice plate. The movable portion 44 abuts against the heating element. An elastic connector 46, such as a spring, is located within the groove 401 of the fixed portion 43, and its two ends abut against the fixed portion 43 and the movable portion 44, respectively. The movable portion 44 and the fixed portion 43 can undergo relative displacement in the extension and contraction direction of the spring, thereby achieving elastic contact with the jet orifice plate and the heating element. Figure 20 In the structure shown, a fixing hole (not shown in the figure) can also be provided in the middle position of the movable part 44 so that part of the spring is located in the fixing hole to fix the spring.

[0090] Figure 21 This is a schematic diagram of the side structure of the guide member according to another embodiment of this application. Figure 21 As shown, in this embodiment of the flow guide, the fixing part 43 is fixedly connected to the jet orifice plate. The fixing part 43 has a groove 403 in the middle of its cross-sectional structure. The movable part 44 is an elastic column 404, which is assembled in the groove 403 of the fixing part 43. The elastic column 404 can be made of elastic rubber. The elastic column 404 is inserted into the groove 403 of the fixing part 43, and at least one end of the elastic column 404 protrudes from the groove 403 and abuts against the jet orifice plate or heating element. Figure 21 Taking the orientation shown as an example, when there is no external pressure, the vertical dimension of the elastic column 404 is larger and the horizontal dimension is smaller. A certain gap can be left between the elastic column 404 and the groove 403 of the fixing part 43, such as... Figure 21 The solid line portion of the elastic column 404 is shown. When the elastic column 404 is subjected to vertical compressive force, its vertical dimension decreases and its horizontal dimension increases. Within the groove 403 of the fixing part 43, the elastic column 404 abuts against the side wall of the groove 403, as shown... Figure 21 The dashed line portion of the medium elastic column 404 is shown.

[0091] In the above embodiments, the cover plate is a one-piece structure. The heat sink of this application is also applicable to a cover plate structure formed by multiple sub-covers. Figure 22 This is a schematic diagram of the structure of a heat sink according to another embodiment of this application. Figure 22 As shown, in one embodiment, the cover plate 3 includes a plurality of sub-covers 301. The sub-covers 301 are spaced apart from each other. Figure 23 This is a schematic cross-sectional view of a heat sink according to one embodiment. Figure 23 As shown, when the cover plate 3 includes multiple sub-covers 301, some of the sub-covers 301, such as the middle sub-cover 301, are respectively sealed to the jet orifice plate 2 and form a liquid inlet chamber 100 with the jet orifice plate 2. Each sub-cover 301 forming the liquid inlet chamber may be provided with a liquid inlet channel 32. The remaining sub-covers 301, such as the edge sub-covers 301, are connected to the base plate 1 and form a liquid return chamber 300 with the base plate 1. Each liquid inlet chamber 100 is connected to the liquid return chamber 300 through a heat exchange chamber 200. The jet orifice plate 2 located in the liquid return chamber 300 may also have a liquid return hole so that the working fluid between the jet orifice plate 2 and the base plate 1 flows into the liquid outlet channel 33 through the liquid return hole.

[0092] Among them, such as Figure 5 and Figure 23 As shown, all spaces between the cover plate 3 and the base plate 1, except for the inlet chamber 100 and the heat exchange chamber 200, can form return chambers 300. The working fluid in the heat exchange chamber 200 flows out through the outlet channel 33 via the return chamber 300. During the heat dissipation process of the heating element 021, the working fluid forms a jet through the jet holes 20 of the jet orifice plate 2, impacting the heat dissipation surface of the heating element 021 and carrying away the heat generated by the heating element 021 through strong convection. The flow rate of the working fluid entering the low-temperature element heat dissipation zone 02a is higher than that of the working fluid in the high-temperature element heat dissipation zone 02b and the working fluid in the return chamber 300, to prevent the working fluid in the high-temperature element heat dissipation zone 02b and the return chamber 300 from flowing back into the heat exchange chamber 200 corresponding to the low-temperature element heat dissipation zone 02a, thus affecting the heat dissipation of that area.

[0093] Based on the same technical purpose, this application also provides an electronic device, which includes a heating component and a heat sink according to the present application. The heating component is connected to a base plate and includes at least two heat dissipation areas, which are respectively arranged in a one-to-one correspondence with at least two heat exchange chambers.

[0094] For the same technical purpose, embodiments of this application also provide a communication device, referring to... Figure 1The communication device includes multiple computing nodes, each computing node including a chip and a heat sink according to the present application embodiment. The chip is connected to the base plate and includes at least two heat dissipation areas, and the at least two heat dissipation areas are arranged in a one-to-one correspondence with at least two heat exchange cavities.

[0095] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A radiator, characterized in that, It includes a base plate, a jet orifice plate, and a cover plate, wherein the jet orifice plate is disposed between the cover plate and the base plate; At least two liquid inlet chambers are provided between the jet orifice plate and the cover plate, and the liquid inlet chambers are not interconnected with each other, for introducing working fluids at different temperatures. At least two heat exchange chambers are provided between the jet orifice plate and the base plate, and each heat exchange chamber is connected to one of the liquid inlet chambers through a jet hole provided in the jet orifice plate.

2. The radiator according to claim 1, characterized in that, The jet orifice plate has a flow guide on the side facing the base plate, which divides the heat exchange space between the jet orifice plate and the base plate into different heat exchange chambers.

3. The radiator according to claim 2, characterized in that, The flow guide is a flow guide ring, and the area enclosed by each flow guide ring forms a heat exchange cavity, while the area between adjacent flow guide rings forms another heat exchange cavity.

4. The radiator according to claim 3, characterized in that, The flow guide ring has flow guide holes on at least a portion of its sides.

5. The radiator according to claim 4, characterized in that, The diameter of the flow guide hole gradually decreases from the area enclosed by the flow guide ring towards the outside of the area enclosed by the flow guide ring.

6. The radiator according to any one of claims 3-5, characterized in that, Along the direction from the base plate to the jet orifice plate, the guide ring elastically abuts against the jet orifice plate and the heating element for fixing to the surface of the base plate.

7. The radiator according to claim 6, characterized in that, The side of the guide ring for elastic contact with the jet orifice plate includes a fixed part and a movable part. An elastic connector is provided between the fixed part and the movable part. The elastic connector is in a stored state so that one of the fixed part and the movable part abuts against the jet orifice plate and the other abuts against the heating component.

8. The radiator according to claim 7, characterized in that, A sealing strip is provided between the fixed part and the movable part.

9. The radiator according to claim 6, characterized in that, The side of the guide ring for elastic contact with the jet orifice plate includes a fixed part and a movable part. The fixed part is connected to the jet orifice plate and is provided with a groove. The movable part is an elastic column and is provided in the groove. At least one end of the elastic column protrudes from the groove and abuts against the jet orifice plate or the heating component.

10. The radiator according to any one of claims 1-9, characterized in that, A partition is provided between adjacent liquid inlet chambers, and the thermal conductivity of the partition is less than 20 W / (m·K).

11. The radiator according to claim 10, characterized in that, The partition is a porous structure or has an internal heat insulation cavity.

12. The radiator according to any one of claims 1-11, characterized in that, A return liquid cavity is formed between the cover plate and the bottom plate. Each heat exchange cavity is connected to the return liquid cavity, and each liquid inlet cavity is connected to the return liquid cavity through the heat exchange cavity.

13. The radiator according to any one of claims 1-12, characterized in that, The cover plate includes multiple sub-covers, which are spaced apart from each other. Some of the multiple sub-caps are respectively sealed to the jet orifice plate and form a liquid inlet chamber with the jet orifice plate; The remaining sub-covers among the plurality of sub-covers are connected to the base plate and form a return liquid chamber with the base plate. Each of the liquid inlet chambers is connected to the return liquid chamber through the heat exchange chamber.

14. An electronic device, characterized in that, It includes a heating element and a radiator as described in any one of claims 1-13, wherein the heating element is connected to the base plate, and the heating element includes at least two heat dissipation zones, wherein the at least two heat dissipation zones are arranged in a one-to-one correspondence with the at least two heat exchange chambers.

15. A communication device, characterized in that, It includes multiple computing nodes, each computing node including a chip and a heat sink as described in any one of claims 1-13, the chip being connected to the base plate, the chip including at least two heat dissipation areas, the at least two heat dissipation areas being configured in a one-to-one correspondence with the at least two heat exchange chambers.

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