Packaging body and welding bridge structure thereof
By introducing a locking structure with limiting pins and limiting holes into the welding bridge structure, the displacement problem of the welding bridge during solder melting is solved, thus achieving stability of the welding bridge position and ease of assembly.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-14
- Publication Date
- 2026-03-13
AI Technical Summary
When the solder melts, the weld bridge may shift due to factors such as boiling and tension, resulting in misalignment or displacement, which can affect product assembly or even cause failure.
The welding bridge is locked into the limiting hole of the lead frame by a limiting pin. The displacement of the welding bridge is restricted by the locking structure of the limiting hole and the limiting pin, so as to ensure that the welding bridge is in the same position.
This effectively prevents the displacement of the weld bridge after the solder melts, ensuring that the position of the weld bridge is consistent with the design, facilitating assembly, and preventing product failure.
Smart Images
Figure CN121666136A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip manufacturing technology, and more specifically, to a lead frame bonding bridge structure. Furthermore, this invention also provides a package including the above-described bonding bridge structure. Background Technology
[0002] For products that use solder to weld bridges, the bridges are placed independently on the solder and are connected to the connecting chip and lead frame through the welding areas at both ends of the bridge. When the solder melts into a liquid state, the bridges placed above the solder can be displaced due to factors such as the boiling and surface tension of the liquid solder. This can lead to problems such as misalignment, displacement, and tilting of the bridges, which can significantly affect subsequent assembly and even cause product failure.
[0003] In conclusion, how to prevent the movement of weld bridges is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention
[0004] In view of this, the purpose of the present invention is to provide a welding bridge structure in which the welding bridge can be locked into the limiting hole of the lead frame by a limiting pin, and the displacement of the welding bridge after the solder melts is restricted by the snap-fit structure, so as to ensure that the actual position of the welding bridge is consistent with the design position.
[0005] In addition, the present invention also provides a package including the above-described weld bridge structure.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] A welding bridge structure includes a lead frame and a welding bridge, wherein the welding connection area of the lead frame is provided with at least one limiting hole, and the welding bridge is provided with a limiting pin for engaging with the limiting hole.
[0008] Preferably, the limiting hole extends through the welding connection area of the lead frame, and the height of the limiting pin is less than the thickness of the lead frame, so as to prevent the limiting pin from rubbing against the working platform after it passes through the lead frame.
[0009] Preferably, the welding connection area of the lead frame is provided with at least three limiting holes, and the three limiting holes are not collinear.
[0010] Preferably, at least three of the limiting holes are distributed in a three-point manner, with the middle limiting hole being relatively close to the chip pad, and the limiting holes on both sides being symmetrically arranged about the middle limiting hole.
[0011] Preferably, the welding bridge has welding positions for welding connection with the lead frame, the number of welding positions is greater than or equal to the number of welding bridges, the welding positions are all located between the limiting holes on both sides, and the welding positions are all located between the limiting holes on both sides and the limiting hole in the middle.
[0012] Preferably, the welding positions are identical in shape and size, and are symmetrically arranged about the limiting hole located in the middle.
[0013] Preferably, the bottom of the welding bridge is provided with a plurality of external pins, which extend out of the package body after encapsulation.
[0014] Preferably, the external pins have the same shape and size, and the external pins are evenly arranged along the length direction of the solder bridge.
[0015] A package, characterized in that it includes a solder bridge structure as described in any one of the preceding claims and at least one chip, the chip being soldered to a chip pad of a lead frame via the solder bridge.
[0016] Preferably, a connecting rib is provided between the outer pins of two adjacent weld bridges, the connecting rib being used to connect the two adjacent weld bridges.
[0017] The welding bridge structure provided by this invention allows the welding bridge to be locked into the limiting hole of the lead frame by a limiting pin. The locking fit between the limiting hole and the limiting pin restricts the position of the welding bridge relative to the lead frame, preventing displacement of the welding bridge after the solder melts and ensuring that the actual position of the welding bridge is consistent with the design position.
[0018] In addition, the present invention provides a package including the above-mentioned weld bridge structure, which solves the problem of weld bridge displacement caused by solder melting, facilitates assembly, and effectively avoids product failure caused by weld bridge displacement. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0020] Figure 1 A schematic diagram of a specific embodiment of the weld bridge structure provided by the present invention;
[0021] Figure 2 for Figure 1 A schematic diagram of the lead frame structure;
[0022] Figure 3 for Figure 1 A schematic diagram of the structure of the weld bridge.
[0023] Figures 1-3 middle:
[0024] 10-Lead frame; 11-Limiting hole; 12-Chip pad; 20-Solder bridge; 21-Limiting pin; 22-Soldering position; 23-External pin; 30-Chip. Detailed Implementation
[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0026] The core of this invention is to provide a welding bridge structure in which the welding bridge can be locked into the limiting hole of the lead frame by a limiting pin. The displacement of the welding bridge after the solder melts is restricted by the snap-fit structure, ensuring that the actual position of the welding bridge is consistent with the design position.
[0027] In addition, the present invention also provides a package including the above-described weld bridge structure.
[0028] The welding bridge structure provided by the present invention includes a lead frame 10 and a welding bridge 20. The welding connection area of the lead frame 10 is provided with at least one limiting hole 11, and the welding bridge 20 is provided with a limiting pin 21 for engaging with the limiting hole 11.
[0029] The shape of the limiting hole 11 is not limited, but to facilitate the machining of the limiting hole 11, it is preferred to set it as follows: Figure 1 The rectangular or circular hole shown; the shape of the limiting pin 21 is determined according to the shape of the limiting hole 11 to ensure the locking and limiting effect of the two.
[0030] The size and distribution of the limiting holes 11 need to be determined based on the shape, structure, and size of the lead frame 10 in actual production. For example, please refer to... Figure 1 The limiting hole 11 is usually located away from the chip pad 12 of the lead frame 10 to prevent the limiting hole 11 from interfering with the soldering of the chip pad 12, the solder bridge 20 and the chip 30.
[0031] The distribution of the limiting holes 11 is also related to the distribution of the welding positions 22 between the lead frame 10 and the solder bridge 20 in actual production. For example, when the welding position 22 is located in the center of the welding connection area outside the chip pad 12 of the lead frame 10, the limiting holes 11 can be located at both ends of the welding connection area.
[0032] The number of limiting holes 11 is related to the layout of the lead frame 10 in actual production. When there is only one chip pad 12 in the lead frame 10 and the lead frame 10 is only soldered to one chip 30, the number of limiting holes 11 can be set to one, but it is preferred to set it to two or more.
[0033] When the lead frame 10 has n chip pads 12 (n≥2, and n is a positive integer), the number of limiting holes 11 is greater than or equal to n, so as to ensure that the displacement of the solder bridge 20 relative to the lead frame 10 is limited by multiple snap-fit structures.
[0034] In this embodiment, the welding bridge 20 can be locked into the limiting hole 11 of the lead frame 10 by the limiting pin 21. The position of the welding bridge 20 relative to the lead frame 10 is restricted by the snap-fit cooperation of the limiting hole 11 and the limiting pin 21, which avoids the displacement of the welding bridge 20 after the solder melts and ensures that the actual position of the welding bridge 20 is consistent with the design position.
[0035] Preferably, a limiting hole 11 can be provided to pass through the welding connection area of the lead frame 10, and the height of the limiting pin 21 is less than the thickness of the lead frame 10, so as to prevent the limiting pin 21 from rubbing against the working platform after it passes through the lead frame 10, which could cause problems such as material jamming, wear, and displacement during the installation operation.
[0036] Of course, the limiting hole 11 on the lead frame 10 can also be set as a blind hole. Compared with setting the limiting hole 11 as a through hole, the machining accuracy of the limiting hole 11 and the limiting pin 21, especially the height machining accuracy, is more important.
[0037] Based on the above embodiments, the distribution of the limiting holes 11 is limited, and the welding connection area of the lead frame 10 is provided with at least three limiting holes 11, and the three limiting holes 11 are not collinear.
[0038] Please refer to Figure 1 Two chip pads 12 are arranged side by side inside the lead frame 10. At least three limiting holes 11 are provided at the soldering connection area outside the chip pads 12. At least two limiting holes 11 are provided on the outside of the chip pads 12 to limit the position of the solder bridge 20 corresponding to the inner chip pads 12. At least one limiting hole 11 is provided on the outside of the connection between the two chip pads 12.
[0039] The aforementioned limiting holes 11 are not collinear, so that the positions of the limiting holes 11 on the lead frame 10 are relatively dispersed, thus better fulfilling the limiting function of the welding bridge 20.
[0040] In this embodiment, the lead frame 10 is provided with at least three non-collinear limiting holes 11. The design of the three limiting holes 11 can effectively limit the welding bridge 20 in the direction of the center line connecting any two limiting holes 11, and can also effectively limit the welding bridge 20 in the direction perpendicular to the center connection direction. Therefore, the welding bridge 20 can be accurately positioned in the plane where the lead frame 10 is located, ensuring the precise assembly of the welding bridge 20 and the lead frame 10.
[0041] Preferably, at least three limiting holes 11 can be provided in a three-point distribution. The limiting hole 11 in the middle is set relative to the chip pad 12, and the limiting holes 11 on both sides are symmetrically set about the middle limiting hole 11. The three-point distribution makes the distribution of the limiting holes 11 on the lead frame 10 relatively dispersed, which not only facilitates the layout of the soldering position 22, but also allows the limiting holes 11 to be set as far as possible on the outer edge of the lead frame 10. Compared with the limiting holes 11 being concentrated in one place on the lead frame 10, the overall limiting effect on the solder bridge 20 is better.
[0042] Based on the above embodiments, the position of the welding position 22 connecting the welding bridge 20 and the lead frame 10 is defined. The welding bridge 20 is provided with a welding position 22 for welding connection with the lead frame 10. The welding position 22 is used to enhance the connection strength between the welding bridge 20 and the lead frame 10, so as to prevent the welding bridge 20 from being displaced relative to the lead frame 10 due to external force during subsequent operations.
[0043] The number of welding positions 22 is greater than or equal to the number of welding bridges 20. Especially in the design of multiple welding bridges 20, considering that the overall mass of multiple welding bridges 20 is relatively heavy, a single welding position 22 cannot drive the welding bridge 20 to slide and engage with the lead frame 10.
[0044] The welding positions 22 are all located between the limiting holes 11 on both sides, and the welding positions 22 are located between the limiting holes 11 on both sides and the limiting hole 11 in the middle, so as to use the sliding of the solder 20 when the solder melts at the welding positions 22 to lock the welding bridge 20 with the lead frame 10.
[0045] Please refer to Figure 1 and Figure 2 The welding position 22 is located between the limiting holes 11 on both sides in the X direction, and between the limiting holes 11 at both ends in the Y direction. Therefore, when the solder at the welding position 22 melts, the welding bridge 20 can be used to make the limiting pin 21 smoothly lock into the limiting hole 11 of the lead frame 10.
[0046] In this embodiment, the welding position 22 between the welding bridge 20 and the lead frame 10 can not only enhance the connection strength between the welding bridge 20 and the lead frame 10 and prevent the welding bridge 20 from being displaced relative to the lead frame 10 due to external forces during subsequent operations, but also make the welding bridge 20 and the lead frame 10 slide and snap together by utilizing the melting effect of the solder.
[0047] The shape and size of the welding position 22 are affected by both the quality and distribution of the welding bridge 20 and the distribution of the limiting hole 11. In order to facilitate the processing and assembly of the welding bridge 20, it is preferable that the shape and size of the welding position 22 are the same, and the welding position 22 is symmetrically arranged about the limiting hole 11 located in the middle.
[0048] Based on the above embodiments, in order to improve the limiting effect of the solder bridge 20, a plurality of external pins 23 can be provided extending from the bottom of the solder bridge 20. After packaging, the external pins 23 extend out of the package body, and the external pins 23 can be connected to external objects such as PCB boards. Figure 3 As shown.
[0049] The specific number, shape, structure, and size of the external pins 23 can be determined by referring to existing technologies according to actual production needs, and will not be elaborated here.
[0050] In this embodiment, the external pins 23 extending from the bottom of each welding bridge 20 can be connected by connecting ribs, thereby connecting each welding bridge 20 into an integral structure. The overall mass of the welding bridge 20 increases, which on the one hand increases the difficulty of the welding bridge 20 sliding relative to the lead frame 10, and on the other hand, the mutual traction between the connecting ribs further restricts the movement of the welding bridge 20 relative to the lead frame 10.
[0051] In addition to the above-described solder bridge structure, the present invention also provides a package including the solder bridge structure disclosed in the above embodiments. The package includes the solder bridge structure disclosed in the above embodiments and at least one chip 30. The chip 30 is soldered to the chip pad 12 of the lead frame 10 through the solder bridge 20.
[0052] The specific number, shape, structure, size, and spacing of the chip pads 12 on the lead frame 10 are determined according to the design requirements in actual production and will not be elaborated here; the specific type and model of the chip 30 also need to be determined according to the design requirements in actual production and will not be elaborated here.
[0053] In this embodiment, the solder bridge 20 of the package is connected to the lead frame 10 by snap-fit and welding, which solves the problem of solder bridge 20 displacement caused by solder melting, facilitates assembly, and effectively avoids product failure caused by solder bridge 20 displacement.
[0054] Preferably, a connecting rib can be provided between the external pins 23 of two adjacent solder bridges 20. The connecting rib is used to connect the two adjacent solder bridges 20, and the movement of the solder bridge 20 relative to the lead frame 10 is further restricted by the traction between the two adjacent solder bridges 20.
[0055] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0056] The foregoing has provided a detailed description of the package and its solder bridge structure provided by this invention. Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this invention.
Claims
1. A weld bridge structure, characterized in that, It includes a lead frame (10) and a welding bridge (20). The welding connection area of the lead frame (10) is provided with at least one limiting hole (11), and the welding bridge (20) is provided with a limiting pin (21) for engaging with the limiting hole (11).
2. The weld bridge structure according to claim 1, characterized in that, The limiting hole (11) passes through the welding connection area of the lead frame (10), and the height of the limiting pin (21) is less than the thickness of the lead frame (10) so as to prevent the limiting pin (21) from rubbing against the working platform after it passes through the lead frame (10).
3. The weld bridge structure according to claim 1, characterized in that, The welding connection area of the lead frame (10) is provided with at least three limiting holes (11), and the three limiting holes (11) are not collinear.
4. The weld bridge structure according to claim 3, characterized in that, At least three of the limiting holes (11) are distributed in a three-point manner, with the middle limiting hole (11) being relatively close to the chip pad (12), and the limiting holes (11) on both sides being symmetrically arranged with respect to the middle limiting hole (11).
5. The weld bridge structure according to claim 4, characterized in that, The welding bridge (20) is provided with welding positions (22) for welding connection with the lead frame (10). The number of welding positions (22) is greater than or equal to the number of welding bridges (20). The welding positions (22) are all located between the limiting holes (11) on both sides, and the welding positions (22) are all located between the limiting holes (11) on both sides and the limiting hole (11) in the middle.
6. The weld bridge structure according to claim 5, characterized in that, The welding positions (22) are identical in shape and size, and are symmetrically arranged about the limiting hole (11) located in the middle.
7. The weld bridge structure according to any one of claims 1-6, characterized in that, The bottom of the solder bridge (20) is provided with several external pins (23), which extend out of the package body after encapsulation.
8. The weld bridge structure according to claim 7, characterized in that, The external pins (23) are all the same in shape and size, and the external pins (23) are uniformly arranged along the length direction of the solder bridge (20).
9. A package, characterized in that, The invention includes the solder bridge structure as described in any one of claims 1-8 and at least one chip (30), the chip (30) being soldered to the chip pad (12) of the lead frame (10) via the solder bridge (20).
10. The package according to claim 9, characterized in that, A connecting rib is provided between the external pins (23) of two adjacent weld bridges (20), the connecting rib being used to connect the two adjacent weld bridges (20).