Electronic device including acoustic module

Abstract

An electronic device according to an embodiment of the present invention may include a housing and an acoustic module disposed inside the housing. The acoustic module may include: a speaker unit including a vibration plate; a speaker housing for accommodating the speaker unit; the porous air adsorption component is arranged in the loudspeaker shell; and an air-permeable damping member disposed inside the speaker housing and stacked with the air-absorbing member.

Description

Technical Field

[0001] Embodiments of this disclosure relate to electronic devices including acoustic devices. Background Technology

[0002] Due to the significant development of information and communication technologies and semiconductor technologies, the distribution and use of various electronic devices are rapidly increasing. In particular, recent electronic devices are being developed to be portable and capable of communication.

[0003] The term "electronic device" can refer to a device that performs a specific function based on installed programs, such as home appliances, electronic schedulers, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop PCs, or vehicle navigation systems. These electronic devices can output, for example, information stored therein as audio or video.

[0004] An electronic device may include at least one speaker module to output various sounds. The speaker module can output audible sound signals by converting electrical signals generated in the electronic device into sound signals using the vibration of a diaphragm.

[0005] The information provided above is offered as relevant technology for the purpose of aiding understanding of this disclosure. No statement or determination is made as to whether any of the foregoing content can be used as prior art in relation to this disclosure. Summary of the Invention

[0006] Technical solution

[0007] An electronic device according to an embodiment of the present disclosure may include a housing and an acoustic module disposed inside the housing. The acoustic module may include: a speaker unit including a diaphragm; a speaker enclosure housing the speaker unit; a porous air-absorbing member disposed inside the speaker enclosure; and a breathable cushioning member disposed inside the speaker enclosure and stacked with the air-absorbing member.

[0008] An electronic device according to an embodiment of the present disclosure may include a housing and an acoustic module disposed within the housing. The acoustic module may include: a speaker unit including a diaphragm; a speaker housing housing the speaker unit; a resonant space formed within the speaker housing; a porous air-adsorption member disposed within the speaker housing and configured to perform negative or positive air adsorption in the resonant space by vibration of the diaphragm; and a breathable cushioning member including a foaming agent and disposed within the speaker housing between the air-adsorption member and the speaker housing. Attached Figure Description

[0009] Figure 1 This is a block diagram of an electronic device in a network environment according to embodiments disclosed herein.

[0010] Figure 2 This is a perspective view showing the front side of an electronic device according to an embodiment disclosed herein.

[0011] Figure 3 This illustrates an embodiment according to the disclosure herein. Figure 3 A perspective view of the rear side of the electronic device.

[0012] Figure 4a This illustrates an embodiment according to the disclosure herein. Figure 2 An exploded perspective view of the front of the electronic device.

[0013] Figure 4b This illustrates an embodiment according to the disclosure herein. Figure 2 An exploded perspective view of the rear of the electronic device.

[0014] Figure 5 This is an exploded perspective view of an acoustic module according to an embodiment disclosed herein.

[0015] Figure 6 It is based on the embodiments disclosed herein. Figure 5 A cross-sectional view of the acoustic module taken from line A-A'.

[0016] Figure 7 This is a partial enlarged view of the acoustic module according to the embodiments disclosed herein.

[0017] Figure 8 This is a view showing the molecular structure of an air adsorption component according to various embodiments of the present disclosure.

[0018] Figures 9 to 11 This is a cross-sectional view showing the air adsorption component and the buffer component inside the acoustic module according to the embodiments disclosed herein.

[0019] Figures 12 to 14 This is a cross-sectional view showing a portion of an electronic device in which the speaker housing and casing are integrally formed according to an embodiment disclosed herein. Detailed Implementation

[0020] The electronic device according to the embodiments disclosed herein may be in the form of a single device. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to the embodiments disclosed herein is not limited to the devices described above.

[0021] The various embodiments of this disclosure and the terminology used herein are not intended to limit the technical features disclosed herein to the particular embodiments, but should be understood to include various modifications, equivalents, or substitutions thereof. Regarding the description of the drawings, similar reference numerals may be used for similar or related components. Unless the context clearly indicates otherwise, the singular form of a noun corresponding to an item may include one or more items. In this disclosure, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase or all possible combinations of said items. Terms such as “first,” “second,” “first,” and “second” may be used simply to distinguish a given component from other corresponding components without otherwise limiting the corresponding component (e.g., in terms of importance or order). When a component (e.g., the first) is referred to as “connected” or “linked” to another component (e.g., the second), whether or not the terms “functionally” or “communically” are used, it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or via a third component.

[0022] The term "module" as used in embodiments of this disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as "logic," "logic block," "component," or "circuit." A module may be a component of an overall configuration performing one or more functions, or the smallest unit or part of said component. For example, according to an embodiment, a module may be implemented as an application-specific integrated circuit (ASIC).

[0023] According to embodiments, each of the above-described components (e.g., modules or programs) may include a single entity or multiple entities, and some of the multiple entities may be separately located in other components. According to embodiments, one or more of the above-described components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as the corresponding components in the multiple components before integration. According to embodiments, operations performed by modules, programs, or other components may be performed sequentially, in parallel, repeatedly, or heuristically, and one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added.

[0024] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0025] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0026] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0027] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0028] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0029] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0030] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0031] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0032] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0033] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0034] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0035] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0036] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0038] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0039] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0040] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0041] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0042] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0043] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0044] According to an embodiment, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0045] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0046] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0047] The electronic device according to the embodiments can be one of various types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0048] It should be understood that the embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish the corresponding component from another component and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0049] When used in connection with embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0050] The embodiments described herein can be implemented as software (e.g., a program) containing one or more instructions readable by a machine (e.g., an electronic device) stored in a storage medium (e.g., internal or external memory). For example, under the control of a processor, the processor of the machine (e.g., an electronic device) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0051] According to embodiments, methods according to embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0052] According to embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0053] Figure 2 This is a perspective view showing the front side of an electronic device 101 according to various embodiments disclosed herein.

[0054] Figure 3 This illustrates an embodiment according to the disclosure herein. Figure 3 A perspective view of the rear side of the electronic device 101.

[0055] Reference Figure 2 and Figure 3 According to the embodiment, the electronic device 101 (e.g., Figure 1 The electronic device 101 may include a housing 110, which includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding the space between the first surface 110A and the second surface 110B. In an embodiment (not shown), the housing 110 may refer to a structure formed by... Figure 2 First surface 110A and Figure 3 The structure of a portion of the second surface 110B and the side surface 110C.

[0056] According to an embodiment, at least a portion of the first surface 110A may be defined by a substantially transparent front surface panel 122 (e.g., a glass plate or a polymer plate including various coatings). The second surface 110B may be defined by a substantially opaque rear surface panel 111. The rear surface panel 111 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of two or more of these materials. The side surface 110C may be defined by a side surface structure (or “side surface frame structure”) 118 that is coupled to the front surface panel 122 and the rear surface panel 111 and includes metal and / or polymer. In an embodiment, the rear surface panel 111 and the side surface structure 118 may be integrally formed and may include the same material (e.g., a metallic material such as aluminum).

[0057] According to an embodiment, the front surface panel 122 may include one or more regions that curve and extend seamlessly toward the rear surface panel 111 from at least a portion of its edge. For example, the front surface panel 122 (or the rear surface panel 111) may include only one of the regions that curve and extend toward the rear surface panel 111 (or the front surface panel 122) at a side edge of the first surface 110A. According to an embodiment, the front surface panel 122 or the rear surface panel 111 may have a substantially flat shape, in which case the curved and extending regions may not be included. When the front surface panel 122 or the rear surface panel 111 includes curved and extending regions, the thickness of the electronic device 101 at the portion including the curved and extending region may be less than the thickness at other portions.

[0058] According to an embodiment, the electronic device 101 may include at least one of the following: a display 115; an audio module (e.g., a microphone hole 103, an external speaker hole 107, and a call receiver hole 114); a sensor module (e.g., a first sensor module 124, a second sensor module (not shown), and a third sensor module 119); a camera module (e.g., a first camera device 105, a second camera device 112, and a flash 113); a key input device 117; a light-emitting element 106; and connector holes (e.g., a first connector hole 128 and a second connector hole 109). In an embodiment, at least one of the components (e.g., the key input device 117 or the light-emitting element 106) may be omitted from the electronic device 101, or other components may be additionally included.

[0059] Display 115 can output an image through, for example, a large portion of the first surface 110A (e.g., the front surface panel 122), or can be visually exposed through, for example, a large portion of the first surface 110A (e.g., the front surface panel 122). In embodiments, at least a portion of display 115 can be visually exposed through the front surface panel 122 forming the first surface 110A or through a portion of the side surface 110C. In embodiments, corners of display 115 can be formed to have a substantially similar external shape to the adjacent front surface panel 122. In embodiments (not shown), the distance between the periphery of display 115 and the periphery of front surface panel 122 can be substantially constant to increase the visual exposure area of ​​display 115.

[0060] According to an embodiment, a recess or opening 333 may be provided in some portion of the screen display area of ​​the display 115, and at least one of an audio module (e.g., call receiver hole 114), a sensor module (e.g., first sensor module 124), a camera module (e.g., first camera module 105), and a light-emitting element 106 may be aligned with the recess or opening 333. In an embodiment (not shown), the rear surface of the screen display area of ​​the display 115 may include at least one of an audio module (e.g., call receiver hole 114), a sensor module (e.g., first sensor module 124), a camera module (e.g., first camera device 105), a fingerprint sensor (not shown), and a light-emitting element 106. In an embodiment (not shown), the display 115 may be coupled to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digital converter configured to detect a magnetic field type stylus, or may be configured to be adjacent to the touch-sensitive circuit, the pressure sensor capable of measuring touch intensity (pressure), and / or a digital converter configured to detect a magnetic field type stylus.

[0061] According to embodiments, audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (e.g., an external speaker hole 107 and a call receiver hole 114). A microphone configured to acquire external sound may be disposed within the microphone hole 103. In embodiments, multiple microphones may be provided to detect the direction of sound. The speaker hole may include an external speaker hole 107 and a call receiver hole 114. In embodiments, the speaker hole (e.g., external speaker hole 107 and call receiver hole 114) and the microphone hole 103 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without a speaker hole (e.g., external speaker hole 107 and call receiver hole 114).

[0062] According to embodiments, the sensor module can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. The sensor module may include, for example, a first sensor module 124 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 110A of the housing 110, and / or a third sensor module 119 disposed on a second surface 110B of the housing 110. The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed not only on the first surface 110A of the housing 110 (e.g., a display 115), but also on the second surface 110B or side surface 110C of the housing 110. The electronic device 101 may further include at least one of, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 124.

[0063] According to an embodiment, the camera module may include a first camera device 105 disposed on a first surface 110A of the electronic device 101 and a second camera device 112 and / or a flash 113 disposed on a second surface 110B of the electronic device 101. The camera devices (e.g., the first camera device 105 and the second camera device 112) may include one or more lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light-emitting diode or a xenon lamp. In an embodiment, one or more lenses (e.g., an infrared camera lens, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 101. In an embodiment, the flash 113 may emit infrared light, and the infrared light emitted by the flash 113 and reflected by an object may be received by a third sensor module 119. The electronic device 101 or the processor of the electronic device 101 (e.g., Figure 1 The processor 120 in the middle can detect the depth information of the object based on the time point when the infrared light is received by the third sensor module 119.

[0064] According to an embodiment, the key input device 117 may be disposed on the side surface 110C of the housing 110. In an embodiment, the electronic device 101 may not include some or all of the aforementioned key input devices 117, and the un-included key input devices 117 may be implemented on the display 115 in another form, such as soft keys. In an embodiment, the key input device may include a sensor module disposed on the second surface 110B of the housing 110.

[0065] According to an embodiment, the light-emitting element 106 may be disposed on, for example, a first surface 110A of the housing 110. The light-emitting element 106 may provide, for example, status information of the electronic device 101 in the form of light. In an embodiment, the light-emitting element 106 may provide a light source that operates in conjunction with, for example, the operation of a camera module (e.g., a first camera device 105). The light-emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.

[0066] According to an embodiment, the connector hole (e.g., first connector hole 128 and second connector hole 109) may include: a first connector hole 128 configured to receive an external electronic device (e.g., Figure 1 The electronic device 1002 in the middle has a connector (e.g., a USB connector) for transmitting / receiving power and / or data; and / or a second connector hole (e.g., a headphone jack) 109, configured to accommodate a connector configured to transmit / receive audio signals with an external electronic device.

[0067] Figure 4a This illustrates an embodiment according to the disclosure herein. Figure 2 Exploded perspective view of the front side of electronic device 101.

[0068] Figure 4b This illustrates an embodiment according to the disclosure herein. Figure 2 An exploded perspective view of the rear side of the electronic device 101.

[0069] Reference Figure 4a and Figure 4b Electronic device 101 (e.g., Figure 1 , Figure 2 or Figure 3 The electronic device 101 may include a side surface structure 210, a first support member 211 (e.g., a bracket), and a front surface panel 220 (e.g., Figure 2 Front panel 122), display 230 (e.g., Figure 2 and Figure 3 The display 115), printed circuit board (or substrate assembly) 240, battery 250, second support member 260 (e.g., rear housing), antenna, camera assembly 207, and rear surface panel 280 (e.g., Figure 3 Rear surface plate 111).

[0070] According to embodiments, at least one of the components (e.g., the first support member 211 or the second support member 260) may be omitted from the electronic device 101, or other components may be additionally included. At least one of the components of the electronic device 101 may be combined with... Figure 2 or Figure 3 At least one of the components of the electronic device 101 shown is the same or similar, and further description is omitted below.

[0071] According to an embodiment, the first support member 211 may be disposed inside the electronic device 101 to connect to the side surface structure 210, or may be integrated with the side surface structure 210. The first support member 211 may be made of, for example, metallic and / or non-metallic (e.g., polymeric) materials. When at least partially made of metallic materials, a portion of the side surface structure 210 or the first support member 211 may serve as an antenna. The first support member 211 may include one surface coupled to the display 230 and another surface to which the printed circuit board 240 is coupled. A processor (e.g., Figure 1 The processor 120 in the memory (e.g., Figure 1 The memory 130 in the memory) and / or interface (e.g., Figure 1 Interface 177 can be mounted on printed circuit board 240. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor central processor, or a communication processor.

[0072] According to an embodiment, the first support member 211 and the side surface structure 210 may be combined to be referred to as a front housing or outer casing 201. According to an embodiment, the casing 201 can generally be understood as a structure for housing, protecting, or positioning the printed circuit board 240 or the battery 250. In an embodiment, it is understood that the casing 201 includes structures that can be visually or tactilely identified by a user outside the electronic device 101, such as the side surface structure 210, the front surface panel 220, and / or the rear surface panel 280. In an embodiment, "front or rear surface of casing 201" can be understood as... Figure 2 The first surface 110A or Figure 3 The second surface 110B in the middle. In an embodiment, the first support member 211 may be provided on the front surface plate 220 (e.g., Figure 2 The first surface 110A and the rear surface plate 280 (e.g., Figure 3 Between the second surface 110B, and can be used as a structure on which electrical / electronic components such as printed circuit board 240 or camera assembly 207 are arranged.

[0073] According to an embodiment, the display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231. The flexible printed circuit board 233 can be understood as being electrically connected to, for example, the display panel 231, while being at least partially disposed on the rear surface of the display panel 231. In an embodiment, the reference numeral "231" can be understood as indicating a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise categorized in the detailed description below, the protective sheet can be understood as part of the display panel 231. In an embodiment, the protective sheet can serve as a buffer structure absorbing external forces (e.g., a low-density elastic material such as sponge) or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to an embodiment, the display 230 may be disposed on the inner surface of the front surface panel 220 and may include a light-emitting layer to transmit light through... Figure 2 The display 230 outputs a screen image from at least a portion of the first surface 110A or the front surface panel 220. As described above, the display 230 can... Figure 2 The first surface 110A or the front surface panel 220 outputs the image over essentially the entire area.

[0074] According to embodiments, the memory may include, for example, volatile memory or non-volatile memory.

[0075] According to embodiments, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface can electrically or physically connect electronic device 101 to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0076] According to an embodiment, the second support member 260 may include, for example, an upper support member 260a and a lower support member 260b. In an embodiment, the upper support member 260a may be configured to surround a printed circuit board 240 together with a portion of the first support member 211. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memory) or various electrical / electronic components may be disposed on the printed circuit board 240, and in some embodiments, the printed circuit board 240 may provide an electromagnetic shielding environment from the upper support member 260a. In an embodiment, the lower support member 260b may serve as a structure for positioning electrical / electronic components such as speaker modules and interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors). In an embodiment, electrical / electronic components such as speaker modules and interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors) may be disposed on an additional printed circuit board (not shown). In this case, the lower support member 260b may be configured to surround an additional printed circuit board together with another portion of the first support member 211. The speaker module or interface mounted on the additional printed circuit board (not shown) or the lower support member 260b can be arranged to correspond to Figure 2 The audio module (e.g., microphone hole 103 or speaker hole (e.g., external speaker hole 107 and call receiver hole 114)) or connector hole (e.g., first connector hole 128 and second connector hole 109).

[0077] According to an embodiment, battery 250 can be used as a means of powering at least one component of electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 250 may be disposed on a plane substantially the same as, for example, printed circuit board 240. Battery 250 may be integrally disposed inside electronic device 101, or may be detachably disposed relative to electronic device 101.

[0078] Although not shown, the antenna may include a conductor pattern implemented on the surface of the second support member 260 by, for example, a laser direct forming method. In embodiments, the antenna may include a printed circuit pattern provided on the surface of a thin film, and a thin-film antenna may be disposed between the rear surface panel 280 and the battery 250. The antenna may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna may, for example, perform near-field communication with an external device, or wirelessly transmit and receive power required for charging. In embodiments, the antenna structure may be configured with a portion or combination of the side surface structure 210 and / or the first support member 211.

[0079] According to an embodiment, camera assembly 207 may include at least one camera module. Inside electronic device 101, camera assembly 207 may receive at least some of the light incident through optical apertures or camera windows 212, 213, and 219. In an embodiment, camera assembly 207 may be disposed on a first support member 211 at a location adjacent to printed circuit board 240. In an embodiment, the camera module of camera assembly 207 may be substantially aligned with one of camera windows 212, 213, and 219, and may be at least partially surrounded by a second support member 260 (e.g., upper support member 260a).

[0080] Figure 5 This is an exploded perspective view of the acoustic module 300 according to the embodiments disclosed herein. Figure 6 It is based on the embodiments disclosed herein. Figure 5 A cross-sectional view of line A-A' taken from acoustic module 300. Figure 7 This is a partial enlarged view of the acoustic module 300 according to the embodiments disclosed herein.

[0081] Reference Figures 5 to 7 The electronic device 101 may include a housing 301 and an acoustic module 300 disposed inside the housing 301. Figures 5 to 7 The configuration of the housing 301 and the acoustic module 300 can be fully or partially integrated with... Figures 2 to 4b The housings 110 and 201 and Figure 1 The configuration of the acoustic output module 155 is the same. Figures 5 to 7 The structure shown can be selectively combined with Figures 2 to 4b The structural combination shown.

[0082] According to an embodiment, the acoustic module 300 may include a speaker unit 310 configured to generate sound based on an electrical signal and a speaker housing 330 configured to house the speaker unit 310.

[0083] According to an embodiment, the loudspeaker unit 310 can convert electrical signals into sound. According to an embodiment, the loudspeaker unit 310 may include at least one of the following: a coil (e.g., a voice coil) (not shown) configured to vibrate a diaphragm 311 based on pulse width modulation (PWM); the diaphragm 311 configured to vibrate; a damping member (e.g., a spring) (not shown) formed of a conductive material and configured to transmit signals (e.g., electricity) transmitted from outside the acoustic module 300 to the coil; a magnet (not shown); or a conductive plate (not shown) configured to collect a magnetic field generated from the magnet.

[0084] According to an embodiment, the diaphragm 311 may be positioned toward the lower side of the speaker unit 310 (in the -Z axis direction).

[0085] According to an embodiment, the speaker housing 330 may form at least a portion of the outer surface of the acoustic module 300. For example, the speaker housing 330 may house the speaker unit 310. For example, the internal space and external space of the speaker housing 330 housing the speaker unit 310 may be acoustically separated from each other. For example, the speaker housing 330 may prevent sound emitted in the direction in which the diaphragm 311 of the speaker unit 310 is positioned from overlapping sound emitted in the opposite direction. According to an embodiment, the speaker housing 330 may include a first housing 331 disposed on the lower side (in the -Z direction) and a second housing 332 disposed on the upper side (in the +Z direction) and connected to the first housing 331. For example, the first housing 331 and the second housing 332 may have a structure connected by vibration. For example, the first housing 331 and the second housing 332 may have a structure connected by adhesive. For example, the first housing 331 and the second housing 332 may be connected by external force.

[0086] According to an embodiment, the speaker housing 330 may further include a protective cover (not shown) configured to protect the diaphragm 311, a yoke configured to protect components (e.g., magnets) of the speaker unit 310, or a radiation aperture (not shown) configured to transmit vibrations generated by the speaker unit 310 to the outside of the electronic device. For example, the speaker housing 330 may refer to a shell or enclosure surrounding the speaker unit 310.

[0087] According to an embodiment, the second housing 332 may further include an opening 333 in the portion that contacts the speaker unit 310. The opening 333 may be covered by the diaphragm 311 and may serve as a sound output port, providing space to facilitate the vibration of the diaphragm 311 while allowing sound to be emitted to the outside of the acoustic module 300.

[0088] According to an embodiment, at least a portion of the speaker housing 330 can serve as a resonator configured to accumulate at least a portion of the sound generated by the speaker unit 310. According to an embodiment, the acoustic module 300 may include a resonant space 320 formed within the speaker housing 330. According to an embodiment, the resonant space 320 may be a space surrounded by the inner surface of the speaker housing 330 and the speaker unit 310 within the speaker housing 330. According to an embodiment, the resonant space 320 may be an empty space within the speaker housing 330 in which sound resonance can occur. At least a portion of the amplitude of the vibrations generated from the speaker unit 310 can be amplified within the resonant space 320.

[0089] According to an embodiment, the acoustic module 300 may further include an air-adsorption member 340 disposed inside the speaker housing 330 and configured to minimize air resistance to the vibration of the diaphragm 311.

[0090] According to an embodiment, the air adsorption member 340 may be disposed on the first housing 331 or the second housing 332. For example, the air adsorption member 340 may be disposed on the first housing 331. For example, the air adsorption member 340 may be disposed on the second housing 332. The air adsorption member 340 may be disposed on the same plane (XY plane) as the speaker unit 310 and spaced apart from the speaker unit 310. For example, the speaker unit 310 may be disposed on the left side inside the speaker housing 330 (in the -X axis direction), and the air adsorption member 340 may be disposed on the right side inside the speaker housing 330 (in the +X axis direction).

[0091] According to the implementation, when the air in the internal resonant space 320 of the acoustic module 300 is compressed by the vibration of the diaphragm 311 of the speaker unit 310, the air adsorption member 340 can perform negative air adsorption to minimize the resistance of the air applied to the diaphragm 311.

[0092] According to the implementation, when the air in the internal resonant space 320 of the acoustic module 300 relaxes and / or expands due to the vibration of the diaphragm 311 of the speaker unit 310, the air adsorption member 340 can perform positive air adsorption to minimize the resistance of the air applied to the diaphragm 311.

[0093] According to an embodiment, the acoustic module 300 may further include a buffer member 350 disposed between the air-adsorption member 340 and the second housing 332. According to an embodiment, the buffer member 350 may absorb and / or suppress vibrations introduced from the outside of the acoustic module 300. According to an embodiment, the buffer member 350 may support the air-adsorption member 340. By providing the buffer member 350 between the air-adsorption member 340 and the speaker housing 330, the amount of vibrational energy transmitted through the speaker housing 330 to the air-adsorption member 340 can be minimized and damage to the air-adsorption member 340 can be prevented.

[0094] According to an embodiment, the buffer member 350 can be a ventilated member. By using a ventilated buffer member 350, the volume of the resonant space 320 inside the speaker housing 301 can be prevented from decreasing.

[0095] According to an embodiment, the cushioning member 350 may include a foaming agent (e.g., a gas foaming mixture). The foaming agent may be an agent added to a material such as rubber, plastic, or concrete to impart a sponge-like or honeycomb structure and can generate bubbles to cause the material to expand. For example, the cushioning member 350 may include any of melamine foam or high-density polyurethane foam (Poron).

[0096] According to an embodiment, the acoustic module 300 may further include: a first adhesive member 360 for fixing the position between the air-adsorption member 340 and the buffer member 350; and a second adhesive member 370 for fixing the position between the buffer member 350 and the lower plate of the speaker housing 301. For example, the first adhesive member 360 and the second adhesive member 370 may be adhesive materials such as adhesive tape or adhesive.

[0097] Figure 8 This is a view showing the molecular structure of an air adsorption member 340 according to various embodiments of the present disclosure.

[0098] According to an embodiment, the air adsorption member 340 may be a porous member. According to an embodiment, the air adsorption member 340 may have a fine structure that promotes the adsorption and / or desorption of nitrogen and oxygen constituting the air. (See also...) Figure 8 The air adsorption component 340 according to embodiments of the present disclosure may include a mixture comprising particles and a binder, the molecular structure of which is configured to perform both air adsorption and desorption.

[0099] According to embodiments, the air adsorption component 340 may include a zeolite composite. According to embodiments, the air adsorption component 340 may be constructed by mixing a binder with at least one selected from granular activated carbon, powdered activated carbon, or ARCP, wherein the granular activated carbon, powdered activated carbon, or ARCP is an activated carbon-based material. According to embodiments, the air adsorption component 340 may be configured by mixing a binder with Cu, Po1, Zr1, Zr2, or Al particles having a metal-organic framework (MOF) structure. According to embodiments, the air adsorption component 340 may be configured by mixing a binder with at least one selected from diatomaceous earth-based elements, perlite- or silica-based elements, or zeolite-based elements. According to embodiments, the air adsorption component 340 may be configured to have a specific surface area larger than that of a single solid. The air adsorption component 340 may have a structure capable of improving the adsorption efficiency for specific elements constituting air, such as nitrogen (N2) and / or oxygen (O2). According to embodiments, the air adsorption component 340 may include an activated carbon polymer and a porous surface polymer structure having a metal-organic framework structure.

[0100] According to an embodiment, in order to overcome the effects of limited space during the movement of the diaphragm 311 of the speaker unit 310 within the acoustic module 300, an air-adsorption member 340 that facilitates air adsorption and desorption can be provided in the resonant space 320 within the acoustic module 300 to minimize the reproduction resistance caused by air during speaker playback (e.g., the movement resistance of the diaphragm 311). By minimizing the air resistance within the acoustic module 300, the movement of the diaphragm 311 can be smoother and performance can be ensured.

[0101] Figures 9 to 11 This is a cross-sectional view showing the air adsorption member 340 and the buffer member 350 inside the acoustic module 300 according to the embodiments disclosed herein.

[0102] Reference Figures 9 to 11 The electronic device 101 may include a housing 301 and an acoustic module 300 disposed inside the housing 301. Figures 5 to 7 The construction of the housing 301 and acoustic module 300 shown can be compared with... Figures 5 to 7 The housing 301 and acoustic module 300 shown are all or partially identical in construction. Figures 9 to 11 The structure can optionally be with Figures 5 to 7 The structural combination.

[0103] According to an embodiment, air adsorption components 440 and 540 may include a first air adsorption component 441 or 541 disposed on the first outer housing 331 and a second air adsorption component 442 or 542 disposed on the second outer housing 332. The first air adsorption component 441 or 541 and the second air adsorption component 442 or 542 may face each other.

[0104] According to an embodiment, buffer members 450, 550, and 650 may include a first buffer member 451 or 551 disposed between the first outer housing 331 and the first air adsorption member 441 or 541, and a second buffer member 452 or 552 disposed between the second outer housing 332 and the second air adsorption member 442 or 542. When the number of air adsorption members 440 and 540 increases, compared to the case of providing only one air adsorption member (e.g.,...),... Figure 6 Compared to this, it can enhance the effect of minimizing the reproduction drag caused by air (e.g., the movement drag of the diaphragm 311).

[0105] According to the embodiments, refer to Figure 9 The buffer member 450 may have a cuboid shape similar in size to the air adsorption member 340.

[0106] According to the embodiments, refer to Figure 10The buffer member 550 can be formed of a membrane material to reduce its volume. The buffer member 550 made of membrane material can have a folded shape that alternates between a first direction and a second direction opposite to the first direction. For example, the buffer member 550 made of membrane material can be arranged in a sawtooth (W-shaped) fold. When folded into a sawtooth shape, air can flow through the empty spaces formed between the folds.

[0107] According to the embodiments, refer to Figure 11 The cushioning member 650 can be constructed in the form of multiple bags forming empty spaces therein. For example, the cushioning member 650 can have a bag-shaped shape that contains air. For example, the cushioning member 650 can have a structure surrounding both the upper and lower surfaces of the air adsorption member 640. For example, the cushioning member 650 can include a first (1-1) cushioning member 651 disposed on the lower surface of the air adsorption member 640 and a first (1-2) cushioning member 652 disposed on the upper surface of the air adsorption member 640.

[0108] Figures 12 to 14 This is a cross-sectional view showing a portion of an electronic device in which a speaker housing 330 and a housing 301 are integrally formed according to an embodiment disclosed herein.

[0109] Reference Figures 12 to 14 The electronic device 101 may include a housing 301 and an acoustic module 300 disposed inside the housing 301. Figures 12 to 14 The construction of the housing 301 and acoustic module 300 shown can be compared with... Figures 5 to 11 The housing 301 and acoustic module 300 shown are all or partially identical in construction. Figures 12 to 14 The structure can be selectively combined with Figures 5 to 11 The structural combination.

[0110] According to an embodiment, the speaker housing 330 and the casing 301 of the electronic device can be integrally formed. According to an embodiment, refer to... Figure 12 The first outer casing 331 may be connected to the second surface (or rear surface) 301b of the casing 301 (e.g., Figure 2 The first outer casing 331 is integrally formed with the second outer casing 301b. The lower surface of the first outer casing 331 may be substantially coplanar with the lower surface of the second outer casing 301b. According to an embodiment, refer to... Figure 13 The second outer casing 332 can be connected to the first surface (or front surface) 301a of the casing 301 (e.g., Figure 2The second housing 332 is integrally formed with the lower surface of the second surface 301b. The upper surface of the second housing 332 may be substantially coplanar with the lower surface of the second surface 301b. The lower surface of the first housing 331 may contact the second surface 301b of the housing. The second surface 301b of the housing may include an opening 333 having the same size and shape as the opening 333 corresponding to the first housing 331. The opening 333 may be formed to penetrate both the first housing 331 and the second surface 301b. For example, the opening 333 may be formed at the junction with the diaphragm of the speaker unit 310 (e.g., Figure 5 The opening 333 is located at a position corresponding to the position of the diaphragm 311. For example, the opening 333 can be covered by the diaphragm 311 and can be used as a sound output port, which provides space to facilitate the vibration of the diaphragm 311 while allowing sound to be emitted to the outside of the acoustic module 300. According to an embodiment, refer to Figure 14 The first outer casing 331 may be connected to the second surface (or rear surface) 301b of the casing 301 (e.g., Figure 2 The second outer casing 332 may be integrally formed with the first surface (or front surface) 301a of the casing 301 (e.g., 110B), Figure 2 It is formed as a whole (110A).

[0111] Electronic devices according to embodiments of this disclosure may include a housing (e.g., Figures 2 to 3 The housings 110A and 110B, and the housing 201 in Figure 4 or Figures 12 to 14 The acoustic module 300 includes a housing 301 and an acoustic module 300 disposed inside the housing 301. The acoustic module 300 may include: a loudspeaker unit 310 including a diaphragm 311; a loudspeaker housing 330 for housing the loudspeaker unit 310; a porous air adsorption member 340 disposed inside the loudspeaker housing 330; and a breathable buffer member 350 disposed inside the loudspeaker housing 330 and stacked with the air adsorption member 340.

[0112] According to an embodiment, the speaker housing 330 may include a first housing 331 and a second housing 332 connected to the first housing 331 and disposed above the first housing 331.

[0113] According to an embodiment, the acoustic module 300 may further include a resonant space 320 formed inside the speaker housing 330.

[0114] According to an embodiment, the air adsorption member 340 can be configured to perform negative air adsorption when the air in the resonant space 320 is compressed due to the vibration of the diaphragm 311, and the air adsorption member 340 can be configured to perform positive air adsorption when the air in the resonant space 320 expands due to the vibration of the diaphragm 311.

[0115] According to an embodiment, the buffer member 350 may be disposed between the air adsorption member 340 and the speaker housing 330.

[0116] According to an embodiment, the cushioning member 350 may include a foaming agent.

[0117] According to an embodiment, the cushioning member 350 may include at least one of melamine foam or high-density polyurethane foam (Poron).

[0118] According to an embodiment, the buffer member 350 may be formed of a membrane material.

[0119] According to an embodiment, a first adhesive member 360 may be further included between the air adsorption member 340 and the buffer member 350, and a second adhesive member 370 may be further included between the buffer member 350 and the speaker housing 330.

[0120] According to an embodiment, the air adsorption component 340 may be a mixture comprising particles and an adhesive having a molecular structure configured to perform air adsorption and desorption.

[0121] According to embodiments, the air adsorption component may include any one of a zeolite composite, an activated carbon polymer, or a porous surface material having a metal-organic framework (MOF) structure.

[0122] According to an embodiment, the air adsorption member 340 may include a first air adsorption member 441 or 451 disposed on the first outer housing 331 and a second air adsorption member 442 or 542 disposed on the second outer housing 332. The buffer member 350 may include a first buffer member 350 disposed between the first outer housing 331 and the first air adsorption member 441 or 451 and a second buffer member 350 disposed between the second outer housing 332 and the second air adsorption member 442 or 542.

[0123] According to an embodiment, the cushioning member 350 may include a plurality of bags in which empty spaces are formed.

[0124] According to an embodiment, the buffer member 350 may include a first (1-1) buffer member 350 disposed on the upper surface of the air adsorption member 340 and a first (1-2) buffer member 350 disposed on the lower surface of the air adsorption member 340.

[0125] According to an embodiment, the speaker housing 330 may be integrally formed with the housing 301.

[0126] An electronic device according to an embodiment of the present disclosure may include a housing 301 and an acoustic module 300 disposed inside the housing 301. The acoustic module 300 may include: a speaker unit 310 including a diaphragm 311; a speaker housing 330 housing the speaker unit 310; a resonant space 320 formed inside the speaker housing 330; a porous air-adsorption member 340 disposed inside the speaker housing 330 and configured to perform negative or positive air adsorption in the resonant space 320 by vibration of the diaphragm 311; and a breathable buffer member 350 disposed inside the speaker housing 330 between the air-adsorption member 340 and the speaker housing 330, and including a foaming agent.

[0127] According to an embodiment, the speaker housing 330 may include a first housing 331 and a second housing 332 connected to the first housing 331 and disposed above the first housing 331.

[0128] According to an embodiment, the cushioning member 350 may include at least one of melamine foam or high-density polyurethane foam (Poron).

[0129] According to an embodiment, the buffer member 350 may be formed of a membrane material.

[0130] According to an embodiment, a first adhesive member 360 may be further included between the air adsorption member 340 and the buffer member 350, and a second adhesive member 370 may be further included between the buffer member 350 and the speaker housing 330.

[0131] Typically, the acoustic module 300 includes an air-adsorption member 340 capable of performing negative and / or positive air adsorption to ensure unrestricted vibration of the diaphragm 311. However, the air-adsorption member 340 may be easily damaged when vibration occurs or when pressure (external force) is applied. Although additional structures can be provided to minimize vibration transmission to the air-adsorption member 340, adding such additional structures reduces the internal volume of the speaker, thereby degrading acoustic performance.

[0132] Embodiments of this disclosure may provide an acoustic module 300 and an electronic device including the acoustic module 300, wherein the vibration of the diaphragm 311 is unrestricted and the air resistance applied to the diaphragm 311 can be minimized, reduced, and / or limited by using an air-adsorption member 340 that promotes the compression and expansion of air.

[0133] However, the technical problem that this disclosure aims to solve is not limited to the above-described problem, and various modifications can be made without departing from the spirit and scope of this disclosure.

[0134] According to embodiments of this disclosure, in order to overcome the effects of limited space on the diaphragm 311 of the speaker unit 310 during movement within the acoustic module 300, an air-adsorption member 340 that facilitates air adsorption and desorption can be provided in the resonant space 320 within the acoustic module 300 to minimize the reproduction resistance caused by air during speaker playback (e.g., the movement resistance of the diaphragm 311). By minimizing the air resistance within the acoustic module 300, the movement of the diaphragm 311 can be smoother and acoustic performance can be ensured.

[0135] The effects achievable by this disclosure are not limited to those described above, and other effects not described above will be clearly understood by those skilled in the art based on the following description.

[0136] Specific embodiments have been described in the foregoing detailed description of this document. However, it will be apparent to those skilled in the art that various modifications can be made without departing from the scope of this disclosure.

Claims

1. An electronic device comprising: Housing (301); and The acoustic module (300) is disposed inside the housing. The acoustic module includes: The loudspeaker unit (310) includes a diaphragm (311). A speaker housing (330) accommodates the speaker unit; A porous air adsorption component (340) is disposed inside the speaker housing; and A breathable cushioning member (350) is disposed inside the speaker housing and stacked with the air-absorbing member.

2. The electronic device according to claim 1, wherein, The speaker housing includes a first housing (331) and a second housing (332), the second housing (332) being connected to the first housing (331) and disposed above the first housing.

3. The electronic device according to any one of claims 1 and 2, wherein, The acoustic module (300) further includes a resonant space (320) formed inside the speaker housing.

4. The electronic device according to claim 3, wherein, The air adsorption component is configured as follows: When the air in the resonant space is compressed by the vibration of the diaphragm, negative air adsorption is performed; as well as When the air in the resonant space expands due to the vibration of the diaphragm, positive air adsorption is performed.

5. The electronic device according to any one of claims 1 to 4, wherein, The buffer component is disposed between the air adsorption component and the speaker housing.

6. The electronic device according to any one of claims 1 to 5, wherein, The cushioning component includes a foaming agent.

7. The electronic device according to any one of claims 1 to 6, wherein, The cushioning component includes at least one of melamine foam or high-density polyurethane foam (Poron).

8. The electronic device according to any one of claims 1 to 7, wherein, The buffer component is formed of a membrane material.

9. The electronic device according to any one of claims 1 to 8, further comprising: A first adhesive member (360) is located between the air adsorption member and the buffer member; as well as A second adhesive member (370) is located between the buffer member and the speaker housing.

10. The electronic device according to any one of claims 1 to 9, wherein, The air adsorption component is a mixture comprising particles and a binder having a molecular structure configured to perform air adsorption and desorption.

11. The electronic device according to any one of claims 1 to 9, wherein, The air adsorption component comprises any one of a zeolite composite, an activated carbon polymer, or a porous surface material having a metal-organic framework (MOF) structure.

12. The electronic device according to claim 2, wherein, The air adsorption components include a first air adsorption component (441, 451) disposed on the first outer shell and a second air adsorption component (442, 542) disposed on the second outer shell, and The buffer component includes a first buffer component (451, 551) disposed between the first outer shell and the first air adsorption component, and a second buffer component (452, 552) disposed between the second outer shell and the second air adsorption component.

13. The electronic device according to any one of claims 1 to 12, wherein, The cushioning component includes a plurality of bags in which empty spaces are formed.

14. The electronic device according to any one of claims 1 to 13, wherein, The buffer member includes a first (1-1) buffer member (652) disposed on the upper surface of the air adsorption member and a first (1-2) buffer member (651) disposed on the lower surface of the air adsorption member.

15. The electronic device according to any one of claims 1 to 13, wherein, The speaker housing is integrally formed with the housing.

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