Method for solving ironing problem of FOG bound polaroid

Abstract

The invention discloses a method for solving FOG bound polaroid ironing, which comprises the following steps: step 1, a glass substrate attached with a polaroid is fixed on a workbench, a to-be-protected area of the polaroid corresponds to a preset working area of a local cooling mechanism of the bound workbench, the local cooling mechanism is arranged on the workbench, and the local cooling mechanism is arranged on the workbench; the local cooling mechanism comprises a semiconductor chilling plate, and the cold end face of the semiconductor chilling plate faces the glass substrate; 2, a local cooling mechanism is started for pre-cooling; 3, the hot-pressing binding mechanism is controlled to move, a hot-pressing head is made to conduct hot-pressing binding on the binding area of the FPC and the glass substrate, the binding process and the cooling process of the local cooling mechanism are at least partially overlapped in time, and in the binding process, the cooling power of the semiconductor chilling plate is dynamically controlled through a temperature signal. The polaroid area is cooled through the local cooling mechanism, the problem that the polaroid is scalded during binding can be avoided, and the yield of products is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display modules, and in particular to a method for solving FOG binding of a polarizing plate. BACKGROUND

[0002] In a narrow-frame display module, the edges of the polarizing plate are relatively close to the display area, especially in a display module of a wearable device, the edge of the polarizing plate is very close to the position of the binding IC (about 0.45 mm), so when binding the COF IC or FPC, the binding pressure head will be very close to the polarizing plate pressure head. During the binding process, the temperature of the binding pressure head can reach about 175 degrees, even if a low-temperature binding scheme is used, the temperature of the binding pressure head can reach about 165 degrees. During binding, the heat of the binding pressure head will be transferred to the polarizing plate, and when the temperature of the polarizing plate reaches 85°C or above, the polarizing plate will have a risk of scalding, thereby causing the physical deformation and optical performance failure of the polarizing plate material due to the deterioration of the material properties, and further causing damage to the display module.

[0003] Therefore, the prior art has defects and needs to be improved. SUMMARY

[0004] The purpose of the present application is to overcome the shortcomings of the prior art and provide a method for solving FOG binding of a polarizing plate.

[0005] The technical solution of the present application is as follows: The present application provides a method for solving FOG binding of a polarizing plate, comprising: step 1: fixing a glass substrate with a polarizing plate attached to a workbench, and the area of the polarizing plate that needs to be protected corresponds to the working area of a local cooling mechanism preset on the binding workbench, the local cooling mechanism is arranged on the workbench, and the local cooling mechanism comprises a semiconductor refrigeration sheet, and the cold end face of the semiconductor refrigeration sheet faces the glass substrate; Step 2: Start the local cooling mechanism for pre-cooling; Step 3: Control the movement of the hot-press binding mechanism to make the hot-press head perform hot-press binding on the binding area of the FPC and the glass substrate, and the binding process at least partially overlaps in time with the cooling process of the local cooling mechanism. During the binding process, the temperature of the polarizing plate area or the corresponding area of the workbench is monitored in real time by a temperature sensor of the local cooling mechanism, and the refrigeration power of the semiconductor refrigeration sheet is dynamically controlled by a temperature signal; Step 5: After the binding is completed, the hot-press head is lifted, and the local cooling mechanism continues to work until the temperature of the polarizing plate area drops below a safe temperature and then stops.

[0006] Further, the local cooling mechanism further comprises a copper heat conduction block arranged on the binding workbench, an upper surface of the copper heat conduction block is flush with a working plane of the binding workbench, and a refrigeration surface of the semiconductor refrigeration sheet is connected with the copper heat conduction block to realize heat transfer. Further, the local cooling mechanism further comprises a heat dissipation unit for improving heat dissipation capacity of the semiconductor refrigeration sheet, and the heat dissipation unit is connected with a hot end surface of the semiconductor refrigeration sheet.

[0007] Further, the safety temperature is 85 degrees.

[0008] By using the above scheme, the beneficial effects of the present application are as follows: the local cooling mechanism can cool the polaroid area, so that the problem of scalding of the polaroid during binding can be avoided, and the yield of the product is improved. Through actual measurement, before the present scheme is used, the temperature of the polaroid area can reach 105°C, and the scalding defect rate is 15%. After the present scheme is used, the temperature of the polaroid area is stably controlled at 85°C±3°C, the polaroid is intact after binding is completed, the scalding defect rate is reduced to below 0.1%, and the binding resistance test qualified rate is maintained at above 99.8%. DETAILED DESCRIPTION

[0009] The present application will be described in detail below in combination with specific embodiments.

[0010] The present application provides a method for solving the problem of scalding of a polaroid during FOG binding, which comprises the following steps: Step 1: fixing a glass substrate with a polaroid attached thereon on a workbench, and the area of the polaroid that needs to be protected corresponds to a working area of a local cooling mechanism of a binding workbench, the local cooling mechanism is arranged on the workbench, the local cooling mechanism comprises a semiconductor refrigeration sheet, a copper heat conduction block and a heat dissipation unit, and a cold end surface of the semiconductor refrigeration sheet faces the glass substrate. Specifically, the copper heat conduction block is arranged on the binding workbench, an upper surface of the copper heat conduction block is flush with a working plane of the binding workbench, a refrigeration surface of the semiconductor refrigeration sheet is connected with the copper heat conduction block to realize heat transfer, when the glass substrate is placed on the workbench, the glass substrate is in contact with the copper heat conduction block, and the area of the polaroid that needs to be cooled corresponds to the copper heat conduction block, so that the polaroid can be cooled directly and quickly, and the problem of damage caused by heat accumulation can be avoided. The heat dissipation unit is connected with a hot end surface of the semiconductor refrigeration sheet, and comprises heat dissipation fins and a heat dissipation fan, so as to quickly dissipate the heat of the semiconductor refrigeration sheet.

[0011] Step 2: starting the local cooling mechanism to perform pre-cooling, so that the temperature rising speed of the polaroid during subsequent binding can be reduced, and better effect can be obtained.

[0012] Step 3: Control the movement of the hot-press bonding mechanism to perform hot-press bonding of the FPC and glass substrate bonding areas. The hot-press head is selected as a right-angled trapezoidal body, with its inclined surface located near the polarizer. Therefore, the closer the hot-press head is to the polarizer, the smaller its thickness, ensuring normal bonding while reducing heating of the polarizer. The bonding process and the cooling process of the local cooling mechanism overlap at least partially in time. For example, in this embodiment, the FOG bonding time is approximately 7 seconds, and the local cooling mechanism operates for 3 seconds during this period, because the temperature rise time in the first 1-2 seconds of bonding is within the safe threshold temperature (85 degrees Celsius). During the bonding process, the temperature of the corresponding area of ​​the worktable is monitored in real time by the temperature sensor of the local cooling mechanism, and the cooling power of the semiconductor refrigeration chip is dynamically controlled through temperature signals to perform closed-loop control, ensuring that the temperature of the polarizer area is always below the safe threshold.

[0013] Step 5: After the binding is completed, the hot press head is lifted, and the local cooling mechanism continues to work until the temperature of the polarizer area drops below the predetermined temperature, thus minimizing the risk of damaging the polarizer.

[0014] This solution employs a semiconductor cooling chip as the core cooling element, enabling active, rapid, and precise local temperature control with a cooling efficiency far exceeding that of passive insulation or air cooling. A closed-loop feedback system, formed by temperature sensors and a control unit, responds in real-time to temperature changes during the bonding process, dynamically adjusting the cooling power to ensure effective cooling while preventing over-cooling from negatively impacting bonding quality. The cooling mechanism is integrated inside or beneath the worktable, without affecting the normal movement and pressure application of the hot press head, ensuring the stability and reliability of the bonding process. Furthermore, this method is highly versatile and easy to integrate: the compact structure allows for convenient integration into existing FOG bonding equipment with low modification costs. It is suitable for various glass substrate sizes and bonding processes, fundamentally solving the problem of polarizer burn-in and significantly improving the production yield and product reliability of LCD modules.

[0015] In summary, this solution uses a localized cooling mechanism to lower the temperature of the polarizer area, preventing burns during bonding and improving product yield. Actual measurements show that before this solution, the polarizer area temperature reached 105°C, with a burn defect rate of 15%. After adopting this solution, the polarizer area temperature was stably controlled at 85°C ± 3°C. The polarizer remained intact after bonding, the burn defect rate dropped below 0.1%, and the bonding resistance test pass rate remained above 99.8%.

[0016] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for solving FOG binding polarizing sheet ironing sheet, characterized in that, The method comprises the following steps: step 1: fixing the glass substrate with attached polarizer on the workbench, and the area to be protected of the polarizer corresponds to the working area of the local cooling mechanism preset on the workbench, the local cooling mechanism is arranged on the workbench, and the cold end of the semiconductor refrigeration sheet faces the glass substrate; step 2: starting the local cooling mechanism for pre-cooling; step 3: controlling the movement of the hot-press bonding mechanism, so that the hot-press head performs hot-press bonding on the bonding area of the FPC and the glass substrate, and the bonding process at least partially overlaps with the cooling process of the local cooling mechanism in time, and during the bonding process, the temperature of the polarizer area or the corresponding area of the workbench is monitored in real time through the temperature sensor of the local cooling mechanism, and the refrigeration power of the semiconductor refrigeration sheet is dynamically controlled through the temperature signal; step 5: after the bonding is completed, the hot-press head is lifted, and the local cooling mechanism continues to work until the temperature of the polarizer area is reduced to below the safety temperature and then stops.

2. The method of claim 1, wherein the FOG-bound polarizing sheet is an ironed polarizing sheet. The local cooling mechanism further comprises a copper heat conduction block arranged on the bonding workbench, the upper surface of the copper heat conduction block is flush with the working plane of the bonding workbench, and the refrigeration surface of the semiconductor refrigeration sheet is connected with the copper heat conduction block to realize heat transfer.

3. The method of claim 1, wherein the FOG-bound polarizer is an optical film. The local cooling mechanism further comprises a heat dissipation unit for improving the heat dissipation capacity of the semiconductor refrigeration sheet, and the heat dissipation unit is connected with the hot end surface of the semiconductor refrigeration sheet. ​ 4. The method for solving FOG binding polarizer pressing according to any one of claims 1 to 3, characterized in that, The safety temperature is 85 degrees.