A new energy copper alloy power cable

Abstract

This invention relates to the field of power cable manufacturing and conductor surface modification, specifically to a new energy copper alloy power cable. It comprises: a copper alloy conductor composed of multiple stranded monofilaments with a chemically bonded interface modification layer on its surface; this layer is formed by curing pyromellitic dianhydride, 5-aminobenzotriazole, mercaptoacetic acid or β-mercaptopropyltrimethoxysilane, glycidyl methacrylate or allyl chloride, and a solvent; it constructs a molecular-level weld between the conductor and the cross-linked polyethylene insulation layer: one end anchors the conductor via Cu-S bonds, and the other end cross-links with the insulation layer via terminal alkenyl or epoxy groups, reacting and bonding during high-temperature vulcanization; this invention solves the problem of weak interfacial bonding in traditional physical contact methods, improving the overall mechanical stability of the cable structure.

Description

Technical Field

[0001] This invention relates to the field of power cable manufacturing and conductor surface modification, specifically to a new energy copper alloy power cable. Background Technology

[0002] Currently, the power transmission field mainly relies on copper alloy conductors combined with polymer insulation layers to construct power cables. The transmission and distribution of electrical energy are achieved through the hierarchical arrangement of conductors and insulation layers, and a relatively standardized structural system has been formed in conventional power transmission and distribution environments.

[0003] However, in related technologies, with the long-term exposure of cables to the harsh marine atmospheric environment of high salt spray and high humidity in specific new energy application scenarios such as offshore wind power, the interfacial corrosion and delamination problems of traditional cables have been aggravated. Copper alloy power cables based on traditional physical contact or simple physical coating treatment have exposed obvious adaptability defects. Specifically, due to the lack of a stable chemical bonding mechanism, traditional physical adsorption corrosion inhibitors are prone to migration or volatilization during high temperature and long-term aging, resulting in the failure of the corrosion-resistant layer on the surface of the copper conductor, short neutral salt spray tolerance time, and a significant increase in the surface contact resistance change rate under high temperature environment. In addition, a strong molecular-level welded structure cannot be formed between the conductor and the insulation layer, the interfacial bonding force is weak, and interfacial peeling or detachment is prone to occur during thermal expansion and contraction cycles, which seriously restricts the electrical stability and service life of the cable in harsh environments.

[0004] Therefore, there is an urgent need for a solution to address the problems of poor corrosion resistance and weak interfacial bonding in existing copper alloy conductors. Summary of the Invention

[0005] The purpose of this invention is to provide a new energy copper alloy power cable that effectively solves the problems of oxidation corrosion and increased contact resistance caused by the migration or volatilization of physically adsorbed corrosion inhibitors in copper alloy conductors under high temperature, high humidity, and salt spray environments. Furthermore, by constructing an organic-inorganic hybrid molecular-level welding structure, the interfacial bonding strength between the conductor and the insulation layer and the electrical stability during long-term operation are significantly improved. Specifically, the technical solution of this invention includes:

[0006] The copper alloy conductor, interface modification layer, insulation layer, and outer sheath layer are arranged sequentially from the inside out.

[0007] The copper alloy conductor is made up of multiple copper alloy monofilaments twisted together to form the conductive core of the cable, and the interface modification layer is attached to the surface of the copper alloy conductor by chemical bonding.

[0008] The interface modification layer is formed by curing an organic-inorganic hybrid ternary functional interface modifier, wherein the organic-inorganic hybrid ternary functional interface modifier comprises the following raw materials in parts by weight: 20-30 parts of pyromellitic dianhydride, 15-25 parts of 5-aminobenzotriazole, ... 10-18 parts of mercaptopropyltrimethoxysilane or mercaptoacetic acid, 12-20 parts of glycidyl methacrylate or allyl chloride, and 80-120 parts of organic solvent;

[0009] The interface modification layer forms a molecular-level welded structure between the copper alloy conductor and the insulating layer. One end of the organic-inorganic hybrid ternary functional interface modifier is anchored to the surface of the copper alloy conductor by forming Cu-S covalent bonds through thiol bonds or disulfide bonds, and the other end forms a cross-linked network with the molecular chain of the insulating layer through terminal alkenyl groups or epoxy groups.

[0010] The insulating layer is made of cross-linked polyethylene material, and the insulating layer undergoes a chemical reaction with the active double bonds of the interface modified layer during high-temperature vulcanization.

[0011] Preferably, the preparation method of the organic-inorganic hybrid ternary functional interface modifier includes the following steps:

[0012] Step S1, Framework Construction: Dissolve the pyromellitic dianhydride in an organic solvent, add the 5-aminobenzotriazole under a nitrogen atmosphere, start the stirrer to disperse, and heat to [temperature missing]. Maintain reflux condensation reaction After hours, an imidization reaction is carried out to obtain an intermediate solution containing an anti-corrosion core;

[0013] Step S2, anchoring group grafting: Lower the temperature of the reaction system to Slowly add dropwise to the intermediate solution -Mercaptopropyltrimethoxysilane or a mixture of said mercaptoacetic acid and dehydrating condensing agent added dropwise, if using -Mercaptopropyltrimethoxysilane is treated with an acid regulator to promote hydrolysis, and the reaction is carried out under constant temperature and stirring. At hour, a thiol functional group is grafted onto one end of the skeleton;

[0014] Step S3, End-group functionalization modification: Add a catalyst to the system obtained in step S2 and heat to... If glycidyl methacrylate is added, a quaternary ammonium salt catalyst is added to carry out a ring-opening addition reaction, and some active thiol groups are retained by controlling the molar ratio of the reactants; if allyl chloride is added, an acid-binding agent is added to carry out a nucleophilic substitution reaction; the reaction is continued at a constant temperature. After the reaction was completed, the solvent was removed by vacuum distillation to obtain the organic-inorganic hybrid ternary functional interface modifier.

[0015] Preferably, the coating process of the interface modification layer includes: during the cooling stage after the copper alloy conductor is drawn and annealed, using an ultrasonic atomizing device to apply a coating of a concentration of [missing information]. The nano-dispersion of the organic-inorganic hybrid ternary functional interface modifier was uniformly sprayed onto the surface of the copper alloy conductor.

[0016] In the preparation of the nano-dispersion, a combination of high-speed shearing and ultrasonic dispersion is used to disperse the modifier in anhydrous ethanol at a mass fraction of 2.0%, ensuring that the particle size of the modifier reaches the nanoscale distribution.

[0017] Preferably, the film formation process of the interface modified layer includes a thermally activated self-assembly step:

[0018] The copper alloy conductor coated with the nano-dispersion is passed through a drying tunnel at a temperature of 60-80℃ or kept warm using the residual heat of annealing.

[0019] During the heat preservation process, the thiol groups in the modifier undergo a dehydrogenation reaction with the copper surface, and after standing, the bubbles are removed and a dense self-assembled monolayer is formed.

[0020] Preferably, the molding method of the insulating layer is as follows: cross-linked polyethylene base material is added to an extruder and extruded onto the outside of the interface modified layer under a high-temperature vulcanization environment of 180-200℃.

[0021] During this process, the terminal alkenyl or epoxy groups of the interface modifier are thermally activated and participate in the cross-linking network reaction of the insulating material, thereby achieving in-situ cross-linking composite of the conductor and the insulating layer.

[0022] Preferably, after the copper alloy conductor is treated with the interface modification layer, its neutral salt spray corrosion resistance time is greater than 96 hours, and its surface contact resistance change rate is less than 5% after aging at 200°C for 168 hours.

[0023] Preferably, the peel strength between the insulation layer and the copper alloy conductor is increased by more than 50% compared to the unmodified cable, and the fracture surface exhibits cohesive failure characteristics, that is, the fracture occurs inside the insulation material body, rather than at the interface between the copper alloy conductor and the insulation layer.

[0024] Preferably, in step S1, the organic solvent is N,N-dimethylformamide or dimethyl sulfoxide; in step S3, the catalyst is a quaternary ammonium salt phase transfer catalyst.

[0025] Preferably, the extruder adopts multi-stage gradient temperature control. From the feed inlet to the die head, the temperatures of each temperature zone are set sequentially to 150-160℃, 165-175℃, 180-190℃, and 195-200℃ to ensure that the insulating layer material cross-links with the interface modification layer in the molten state and does not cause early scorching.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. This invention achieves molecular-level welding between copper alloy conductors and insulation layers by constructing an organic-inorganic hybrid ternary functional interface modification layer. The modifier utilizes thiol bonds or disulfide bonds to form stable Cu-S covalent bonds with the copper surface, effectively preventing interface delamination. Its other end is rich in terminal alkenyl or epoxy groups, which actively participate in the free radical reaction network of cross-linked polyethylene during the high-temperature vulcanization extrusion process of the insulation layer, achieving in-situ chemical bonding. Compared with unmodified cables, the peel strength between the insulation layer and the conductor is significantly improved by 52%-60%, and the fracture surface exhibits cohesive failure characteristics, completely solving the problem of weak bonding force at traditional physical contact interfaces and improving the mechanical stability of the overall cable structure.

[0028] 2. This invention significantly improves the corrosion resistance of new energy cables in complex environments. The modifier uses pyromellitic dianhydride and 5-aminobenzotriazole as raw materials, and constructs a rigid skeleton with strong corrosion resistance through an imidization reaction, which then self-assembles on the copper surface to form a dense monomolecular protective film. This dense film layer can effectively block the penetration of water molecules and oxygen, and the corrosion resistance time in the neutral salt spray test is significantly extended from the conventional 24 hours to 98-108 hours. Compared with physical coating using only benzotriazole, this chemically bonded film overcomes the defects of easy migration and volatilization of physical adsorbents, ensuring the long-term protective effect of the cable in high humidity and heat environments such as offshore wind power.

[0029] 3. This invention effectively inhibits the deterioration of the contact resistance of the cable under long-term operation at high temperatures. Thanks to the chemical passivation effect of the interface modification layer on the copper surface and the tight cross-linking with the insulation layer, the interface oxidation channel is blocked, and the electrochemical stability of the interface is maintained. Under the harsh conditions of aging at 200℃ for 168 hours, the surface contact resistance change rate of the cable of this invention is controlled between 3.3% and 4.2%, which is much lower than the 15% of the unmodified cable and the 12% of the BTA-treated cable. This excellent electrical stability ensures the current carrying capacity of the cable throughout its entire life cycle, reduces the risk of thermal failure caused by increased contact resistance, and meets the high load requirements of new energy transmission.

[0030] 4. The preparation process of this invention achieves efficient synergy between modifier synthesis and cable forming; through stepwise precise control of skeleton construction, anchoring group grafting, and end-group functionalization modification, a structurally well-defined ternary functional monomer is synthesized; during the coating process, the residual heat after conductor drawing and annealing is used to promote thiol dehydrogenation film formation, which not only saves energy but also improves film density; subsequently, during the multi-stage gradient heating process of insulation layer extrusion, the processing heat is used to thermally activate the active groups of the modifier, simultaneously completing the crosslinking and interfacial bonding of the insulation layer. The process flow is highly compatible with existing production lines and has extremely high industrial application value. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a comparison chart of the contact resistance stability after high-temperature aging of the present invention. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0034] Example 1:

[0035] This embodiment provides a new energy copper alloy power cable, including:

[0036] The cable consists of a copper alloy conductor, an interface modification layer, an insulation layer, and an outer sheath layer arranged sequentially from the inside out. The copper alloy conductor is composed of multiple copper alloy monofilaments twisted together to form the conductive core of the cable. The interface modification layer is attached to the surface of the copper alloy conductor by chemical bonding.

[0037] The interface modification layer is formed by curing an organic-inorganic hybrid ternary functional interface modifier. The interface modification layer forms a molecular-level welded structure between the copper alloy conductor and the insulating layer. One end of the organic-inorganic hybrid ternary functional interface modifier is anchored to the surface of the copper alloy conductor by forming Cu-S covalent bonds through thiol bonds, and the other end forms a cross-linked network with the molecular chains of the insulating layer through terminal alkenyl groups.

[0038] The insulation layer is made of cross-linked polyethylene material, and the insulation layer undergoes a chemical reaction with the active double bonds of the interface modification layer during the high-temperature vulcanization process;

[0039] After undergoing interface modification treatment, the new energy copper alloy power cable exhibits a neutral salt spray corrosion resistance time of 98 hours and a surface contact resistance change rate of 4.2% after aging at 200℃ for 168 hours. The peel strength between the insulation layer and the copper alloy conductor is 52% higher than that of the unmodified cable, and the fracture surface exhibits cohesive failure characteristics, meaning that the fracture occurs inside the insulation material itself, rather than at the interface between the copper alloy conductor and the insulation layer. This solves the oxidation and corrosion problem of copper alloy conductors in high-humidity and high-temperature environments such as offshore wind power and improves the interfacial bonding force between the conductor and the insulation layer.

[0040] The organic-inorganic hybrid ternary functional interface modifier comprises the following raw materials in parts by weight: 20 parts of pyromellitic dianhydride, 15 parts of 5-aminobenzotriazole, 10 parts of mercaptoacetic acid, 12 parts of glycidyl methacrylate, and 80 parts of organic solvent; the organic solvent is N,N-dimethylformamide.

[0041] The preparation method of organic-inorganic hybrid ternary functional interface modifier and the overall cable manufacturing process include the following steps:

[0042] Step S1, framework construction: Dissolve pyromellitic dianhydride in an organic solvent, add 5-aminobenzotriazole under a nitrogen atmosphere, start the stirrer to disperse, heat to 140°C, and keep under reflux and condensation for 3 hours to carry out imidization reaction to obtain an intermediate solution containing the anti-corrosion core.

[0043] Step S2, anchoring group grafting: Lower the temperature of the reaction system to Slowly add a mixture of mercaptoacetic acid and DCC in a mass ratio of 1:1.2 to the intermediate solution, adjust the pH to neutral or weakly alkaline, and stir the reaction at a constant temperature. At hour, a thiol functional group is grafted onto one end of the skeleton;

[0044] Step S3, End-group functionalization modification: A quaternary ammonium salt phase transfer catalyst and a small amount of triethylamine as an acid-binding agent are added to the system obtained in step S2, and the temperature is raised to... Add glycidyl methacrylate and continue the reaction at a constant temperature. After the reaction was completed, the product was poured into ice water to precipitate, filtered, washed and vacuum dried, and then dispersed in ethanol to obtain an organic-inorganic hybrid ternary functional interface modifier.

[0045] The coating process and film formation process of the interface modification layer include: in the cooling stage after the copper alloy conductor is drawn and annealed, the nano-dispersion of the organic-inorganic hybrid ternary functional interface modifier is uniformly sprayed onto the surface of the copper alloy conductor using an ultrasonic atomizing device; the copper alloy conductor coated with the nano-dispersion is subjected to heat preservation treatment through a drying tunnel at a temperature of 60°C; during the heat preservation process, the thiol groups in the modifier are induced to undergo a dehydrogenation reaction with the copper surface, and the surface is allowed to stand to degas and form a dense self-assembled monolayer film;

[0046] The molding method of the insulation layer is as follows: cross-linked polyethylene base material is added to an extruder. The extruder adopts multi-stage gradient temperature control. From the feed port to the die head, the temperature of each temperature zone is set to 150℃, 165℃, 180℃, and 195℃ respectively. Under the high-temperature vulcanization environment of 180-200℃, it is extruded and coated on the outside of the interface modified layer. During this process, the terminal alkenyl groups of the interface modifier are thermally activated and participate in the cross-linking network reaction of the insulating material, realizing the in-situ cross-linking composite of the conductor and the insulation layer.

[0047] Example 2:

[0048] This embodiment provides a new energy copper alloy power cable, including:

[0049] The cable consists of a copper alloy conductor, an interface modification layer, an insulation layer, and an outer sheath layer arranged sequentially from the inside out. The copper alloy conductor is composed of multiple copper alloy monofilaments twisted together to form the conductive core of the cable. The interface modification layer is attached to the surface of the copper alloy conductor by chemical bonding.

[0050] The interface modification layer is formed by curing an organic-inorganic hybrid ternary functional interface modifier. The interface modification layer forms a molecular-level welded structure between the copper alloy conductor and the insulating layer. One end of the organic-inorganic hybrid ternary functional interface modifier is anchored to the surface of the copper alloy conductor by forming Cu-S covalent bonds through thiol bonds, and the other end forms a cross-linked network with the molecular chains of the insulating layer through terminal alkenyl groups.

[0051] The insulation layer is made of cross-linked polyethylene material, and the insulation layer undergoes a chemical reaction with the active double bonds of the interface modification layer during the high-temperature vulcanization process;

[0052] After undergoing interface modification treatment, the new energy copper alloy power cable exhibited a neutral salt spray corrosion resistance time of 102 hours and a surface contact resistance change rate of 3.8% after aging at 200℃ for 168 hours. The peel strength between the insulation layer and the copper alloy conductor was increased by 55% compared to the unmodified cable, and the fracture surface showed cohesive failure characteristics, meaning that the fracture occurred within the insulation material itself, rather than at the interface between the copper alloy conductor and the insulation layer. This indicates that the interface modification layer has a positive effect on suppressing the increase in contact resistance.

[0053] The organic-inorganic hybrid ternary functional interface modifier comprises the following raw materials in parts by weight: 22 parts pyromellitic dianhydride, 18 parts 5-aminobenzotriazole, 12 parts mercaptoacetic acid, 14 parts glycidyl methacrylate, and 90 parts organic solvent; the organic solvent is dimethyl sulfoxide.

[0054] The preparation method of the organic-inorganic hybrid ternary functional interface modifier includes the following steps:

[0055] Step S1, framework construction: Pyromellitic dianhydride is dissolved in an organic solvent, and 5-aminobenzotriazole is added under a nitrogen protective atmosphere. The mixture is dispersed by stirring, heated to 145°C, and kept under reflux and condensation for 3.5 hours to carry out imidization reaction, thereby obtaining an intermediate solution containing an anti-corrosion core.

[0056] Step S2, anchoring group grafting: The temperature of the reaction system is reduced to 55°C, mercaptoacetic acid is slowly added dropwise to the intermediate solution, a trace amount of p-toluenesulfonic acid is added as a catalyst, and the reaction is stirred at a constant temperature for 2.5 hours to graft thiol functional groups at one end of the skeleton.

[0057] Step S3, end-group functionalization modification: Add a quaternary ammonium salt phase transfer catalyst to the system obtained in step S2, heat to 85℃, add glycidyl methacrylate, continue to keep the reaction at the temperature for 3.5 hours, remove the solvent by vacuum distillation after the reaction is completed, and obtain an organic-inorganic hybrid ternary functional interface modifier.

[0058] The coating process and film formation process of the interface modification layer include: in the cooling stage after the copper alloy conductor is drawn and annealed, the nano-dispersion of the organic-inorganic hybrid ternary functional interface modifier is uniformly sprayed onto the surface of the copper alloy conductor using an ultrasonic atomizing device; the copper alloy conductor coated with the nano-dispersion is heat-preserved through a drying tunnel at a temperature of 65°C; during the heat preservation process, the thiol groups in the modifier are induced to undergo a dehydrogenation reaction with the copper surface, and the surface is allowed to stand to degas and form a dense self-assembled monolayer film.

[0059] The molding method of the insulation layer is as follows: cross-linked polyethylene base material is added to an extruder. The extruder adopts multi-stage gradient temperature control. From the feed port to the die head, the temperature of each temperature zone is set to 152℃, 168℃, 182℃, and 196℃ respectively. Under the high-temperature vulcanization environment of 180-200℃, it is extruded and coated on the outside of the interface modified layer. During this process, the terminal alkenyl groups of the interface modifier are thermally activated and participate in the cross-linking network reaction of the insulation material, realizing the in-situ cross-linking composite of the conductor and the insulation layer.

[0060] Example 3:

[0061] This embodiment provides a new energy copper alloy power cable, including:

[0062] The cable consists of a copper alloy conductor, an interface modification layer, an insulation layer, and an outer sheath layer arranged sequentially from the inside out. The copper alloy conductor is made up of multiple copper alloy monofilaments twisted together to form the conductive core of the cable. The interface modification layer is attached to the surface of the copper alloy conductor by chemical bonding.

[0063] The interface modification layer is formed by curing an organic-inorganic hybrid ternary functional interface modifier. The interface modification layer forms a molecular-level welded structure between the copper alloy conductor and the insulating layer. One end of the organic-inorganic hybrid ternary functional interface modifier is anchored to the surface of the copper alloy conductor by forming Cu-S covalent bonds through thiol bonds or disulfide bonds, and the other end forms a cross-linked network with the molecular chains of the insulating layer through terminal alkenyl groups.

[0064] The insulation layer is made of cross-linked polyethylene. During high-temperature vulcanization, the insulation layer undergoes a chemical reaction with the active double bonds of the interface modification layer. After treatment with the interface modification layer, the new energy copper alloy power cable exhibits a neutral salt spray corrosion resistance time of 105 hours, and a surface contact resistance change rate of 3.5% after aging at 200℃ for 168 hours. The peel strength between the insulation layer and the copper alloy conductor is 58% higher than that of the unmodified cable, and the fracture surface exhibits cohesive failure characteristics, meaning the fracture occurs within the insulation material itself, rather than at the interface between the copper alloy conductor and the insulation layer. This technical solution utilizes... The synergistic effect of β-mercaptopropyltrimethoxysilane and terminal alkenyl groups maintains the stability of the interface in a long-term thermal expansion and contraction environment.

[0065] The organic-inorganic hybrid ternary functional interface modifier comprises the following raw materials in parts by weight: 25 parts pyromellitic dianhydride, 20 parts 5-aminobenzotriazole, 14 parts of mercaptopropyltrimethoxysilane, 16 parts of allyl chloride, and 100 parts of organic solvent; the organic solvent is N,N-dimethylformamide;

[0066] The preparation method of the organic-inorganic hybrid ternary functional interface modifier includes the following steps: Step S1, framework construction: Pyromellitic dianhydride is dissolved in an organic solvent, and 5-aminobenzotriazole is added under a nitrogen protective atmosphere. The mixture is dispersed by stirring, heated to 150°C, and kept under reflux and condensation for 4 hours to carry out an imidization reaction, thereby obtaining an intermediate solution containing an anti-corrosion core; Step S2, anchoring group grafting: The reaction system temperature is lowered to 60°C, and the intermediate solution is slowly added dropwise. -Mercaptopropyltrimethoxysilane, adjust the pH to weakly acidic, stir at constant temperature for 3 hours, and graft thiol functional groups at one end of the skeleton; Step S3, end group functionalization modification: add quaternary ammonium salt phase transfer catalyst to the system obtained in step S2, heat to 90℃, add allyl chloride, continue to keep the temperature for 4 hours, and remove the solvent by vacuum distillation after the reaction to obtain organic-inorganic hybrid ternary functional interface modifier.

[0067] The coating process and film formation process of the interface modification layer include: in the cooling stage after the copper alloy conductor is drawn and annealed, the nano-dispersion of the organic-inorganic hybrid ternary functional interface modifier is uniformly sprayed onto the surface of the copper alloy conductor using an ultrasonic atomization device; the copper alloy conductor coated with the nano-dispersion is kept warm using the residual annealing temperature; during the warming process, the thiol groups in the modifier are induced to undergo a dehydrogenation reaction with the copper surface, and the surface is allowed to stand to degas and form a dense self-assembled monolayer film;

[0068] The molding method of the insulation layer is as follows: cross-linked polyethylene base material is added to an extruder. The extruder adopts multi-stage gradient temperature control. From the feed port to the die head, the temperature of each temperature zone is set to 155℃, 170℃, 185℃ and 198℃ respectively. Under the high temperature vulcanization environment of 180-200℃, it is extruded and coated on the outside of the interface modified layer. During this process, the terminal alkenyl groups of the interface modifier are thermally activated and participate in the cross-linking network reaction of the insulation material, realizing the in-situ cross-linking composite of the conductor and the insulation layer.

[0069] Example 4:

[0070] This embodiment provides a new energy copper alloy power cable, including:

[0071] The cable consists of a copper alloy conductor, an interface modification layer, an insulation layer, and an outer sheath layer arranged sequentially from the inside out. The copper alloy conductor is made up of multiple copper alloy monofilaments twisted together to form the conductive core of the cable. The interface modification layer is attached to the surface of the copper alloy conductor by chemical bonding.

[0072] The interface modification layer is formed by curing an organic-inorganic hybrid ternary functional interface modifier. The interface modification layer forms a molecular-level welded structure between the copper alloy conductor and the insulating layer. One end of the organic-inorganic hybrid ternary functional interface modifier is anchored to the surface of the copper alloy conductor by forming Cu-S covalent bonds through thiol bonds, and the other end forms a cross-linked network with the molecular chains of the insulating layer through terminal alkenyl groups.

[0073] The insulation layer is made of cross-linked polyethylene. During high-temperature vulcanization, the insulation layer undergoes a chemical reaction with the active double bonds of the interface modification layer. After treatment with the interface modification layer, the new energy copper alloy power cable exhibits a neutral salt spray corrosion resistance time of 100 hours and a surface contact resistance change rate of 3.6% after aging at 200℃ for 168 hours. The peel strength between the insulation layer and the copper alloy conductor is 57% higher than that of the unmodified cable, and the fracture surface exhibits cohesive failure characteristics, meaning that the fracture occurs within the insulation material itself, rather than at the interface between the copper alloy conductor and the insulation layer. This example demonstrates the positive contribution of the modifier synthesized at a higher reaction temperature to the cable's aging resistance.

[0074] The organic-inorganic hybrid ternary functional interface modifier comprises the following raw materials in parts by weight: 28 parts pyromellitic dianhydride, 22 parts 5-aminobenzotriazole, 16 parts of mercaptopropyltrimethoxysilane, 18 parts of glycidyl methacrylate, and 110 parts of organic solvent; the organic solvent is dimethyl sulfoxide;

[0075] The preparation method of the organic-inorganic hybrid ternary functional interface modifier includes the following steps: Step S1, framework construction: Pyromellitic dianhydride is dissolved in an organic solvent, and 5-aminobenzotriazole is added under a nitrogen protective atmosphere. The mixture is dispersed by stirring, heated to 155℃, and kept under reflux and condensation for 4.5 hours to carry out an imidization reaction, thereby obtaining an intermediate solution containing an anti-corrosion core; Step S2, anchoring group grafting: The reaction system temperature is lowered to 65℃, and the intermediate solution is slowly added dropwise. -Mercaptopropyltrimethoxysilane, adjust the pH to weakly acidic, stir at a constant temperature for 3.5 hours, and graft thiol functional groups onto one end of the skeleton; Step S3, end-group functionalization modification: add a quaternary ammonium salt phase transfer catalyst to the system obtained in step S2, heat to 95℃, add glycidyl methacrylate, continue to keep the reaction at the temperature for 4.5 hours, and remove the solvent by vacuum distillation after the reaction is completed to obtain an organic-inorganic hybrid ternary functional interface modifier;

[0076] The coating process and film formation process of the interface modification layer include: in the cooling stage after the copper alloy conductor is drawn and annealed, the nano-dispersion of the organic-inorganic hybrid ternary functional interface modifier is uniformly sprayed onto the surface of the copper alloy conductor using an ultrasonic atomizing device; the copper alloy conductor coated with the nano-dispersion is subjected to heat preservation treatment through a drying tunnel at a temperature of 75°C; during the heat preservation process, the thiol groups in the modifier are induced to undergo a dehydrogenation reaction with the copper surface, and the surface is allowed to stand to degas and form a dense self-assembled monolayer film;

[0077] The molding method of the insulation layer is as follows: cross-linked polyethylene base material is added to an extruder. The extruder adopts multi-stage gradient temperature control. From the feed port to the die head, the temperature of each temperature zone is set to 158℃, 172℃, 188℃, and 199℃ respectively. Under the high-temperature vulcanization environment of 180-200℃, it is extruded and coated on the outside of the interface modified layer. During this process, the terminal alkenyl groups of the interface modifier are thermally activated and participate in the cross-linking network reaction of the insulation material, realizing the in-situ cross-linking composite of the conductor and the insulation layer.

[0078] Example 5:

[0079] This embodiment provides a new energy copper alloy power cable, including:

[0080] The cable consists of a copper alloy conductor, an interface modification layer, an insulation layer, and an outer sheath layer arranged sequentially from the inside out. The copper alloy conductor is composed of multiple copper alloy monofilaments twisted together to form the conductive core of the cable. The interface modification layer is attached to the surface of the copper alloy conductor by chemical bonding. The interface modification layer is formed by curing an organic-inorganic hybrid ternary functional interface modifier.

[0081] The interface modification layer forms a molecular-level welded structure between the copper alloy conductor and the insulating layer. One end of the organic-inorganic hybrid ternary functional interface modifier is anchored to the surface of the copper alloy conductor through a thiol bond, forming a Cu-S covalent bond. The other end forms a cross-linked network with the molecular chain of the insulating layer through a terminal alkenyl group.

[0082] The insulation layer is made of cross-linked polyethylene. During the high-temperature vulcanization process, the insulation layer reacts chemically with the active double bonds of the interface modification layer. After the interface modification layer treatment, the new energy copper alloy power cable has a neutral salt spray corrosion resistance time of 108 hours, and after aging at 200℃ for 168 hours, the surface contact resistance change rate is 3.3%. The peel strength between the insulation layer and the copper alloy conductor is 60% higher than that of the unmodified cable, and the fracture surface exhibits cohesive failure characteristics, that is, the fracture occurs inside the insulation material itself, rather than at the interface between the copper alloy conductor and the insulation layer. This verifies the role of high proportion of corrosion-resistant components and high cross-linking density in improving the overall weather resistance of the cable.

[0083] The organic-inorganic hybrid ternary functional interface modifier comprises the following raw materials in parts by weight: 30 parts of pyromellitic dianhydride, 25 parts of 5-aminobenzotriazole, 18 parts of mercaptoacetic acid, 20 parts of glycidyl methacrylate, and 120 parts of organic solvent; the organic solvent is N,N-dimethylformamide.

[0084] The preparation method of the organic-inorganic hybrid ternary functional interface modifier includes the following steps: Step S1, framework construction: Pyromellitic dianhydride is dissolved in an organic solvent, and 5-aminobenzotriazole is added under a nitrogen protective atmosphere. The mixture is dispersed by stirring, heated to 160°C, and kept under reflux and condensation for 5 hours to carry out an imidization reaction, thereby obtaining an intermediate solution containing an anti-corrosion core; Step S2, anchoring group grafting: The reaction system temperature is lowered to 70°C, and mercaptoacetic acid is slowly added dropwise to the intermediate solution to adjust the pH to weakly acidic. The mixture is stirred at a constant temperature for 4 hours to graft a thiol functional group onto one end of the framework; Step S3, end-group functionalization modification: A quaternary ammonium salt phase transfer catalyst is added to the system obtained in Step S2, the temperature is raised to 100°C, glycidyl methacrylate is added, and the reaction is continued at a constant temperature for 5 hours. After the reaction is completed, the solvent is removed by vacuum distillation to obtain the organic-inorganic hybrid ternary functional interface modifier;

[0085] The coating process and film formation process of the interface modification layer include: in the cooling stage after the copper alloy conductor is drawn and annealed, the nano-dispersion of the organic-inorganic hybrid ternary functional interface modifier is uniformly sprayed onto the surface of the copper alloy conductor using an ultrasonic atomizing device; the copper alloy conductor coated with the nano-dispersion is heat-preserved by passing it through a drying tunnel at a temperature of 80°C; during the heat preservation process, the thiol groups in the modifier are induced to undergo a dehydrogenation reaction with the copper surface, and the surface is allowed to stand to degas and form a dense self-assembled monolayer film.

[0086] The molding method of the insulation layer is as follows: cross-linked polyethylene base material is added to an extruder. The extruder adopts multi-stage gradient temperature control. From the feed port to the die head, the temperature of each temperature zone is set to 160℃, 175℃, 190℃, and 200℃ respectively. Under the high-temperature vulcanization environment of 180-200℃, it is extruded and coated on the outside of the interface modified layer. During this process, the terminal alkenyl groups of the interface modifier are thermally activated and participate in the cross-linking network reaction of the insulating material, realizing the in-situ cross-linking composite of the conductor and the insulation layer.

[0087] In Examples 1-5 and Comparative Examples 1-2, pyromellitic dianhydride was obtained from Shanghai Aladdin Biochemical Technology Co., Ltd., with a purity of 99% and CAS No.: 89-32-7; 5-aminobenzotriazole was obtained from Shanghai Maclean Biochemical Technology Co., Ltd., with a purity of 98% and CAS No.: 3528-63-0; mercaptoacetic acid was obtained from Sinopharm Chemical Reagent Co., Ltd., with analytical grade and CAS No.: 68-11-1; and glycidyl methacrylate was obtained from TCI (Shanghai) Chemical Industry Development Co., Ltd., with CAS No.: 106-91-2. -Mercaptopropyltrimethoxysilane (KH-580) was from Nanjing Jingwei Chemical Co., Ltd., CAS No.: 4420-74-0; allyl chloride was from Shandong Jinyueyuan New Material Co., Ltd., CAS No.: 107-05-1; N,N-dimethylformamide and dimethyl sulfoxide were both from Sinopharm Chemical Reagent Co., Ltd., analytical grade; crosslinked polyethylene base material was from Sinopec Maoming Branch, grade DMD-8920; quaternary ammonium salt phase transfer catalyst (tetrabutylammonium bromide) was from Shanghai Aladdin Biochemical Technology Co., Ltd., CAS No.: 1643-19-2; the others were all commercially available products.

[0088] Comparative Example 1:

[0089] This comparative example provides a new energy copper alloy power cable, including:

[0090] The cable consists of a copper alloy conductor, an insulation layer, and an outer sheath layer arranged sequentially from the inside out. The copper alloy conductor is made of multiple copper alloy monofilaments twisted together to form the conductive core of the cable. The insulation layer is made of cross-linked polyethylene material. The difference is that there is no interface modification layer between the copper alloy conductor and the insulation layer, and the surface of the copper alloy conductor is not chemically bonded.

[0091] After being manufactured using conventional processes, the copper alloy power cable for new energy exhibits a neutral salt spray corrosion resistance time of only 24 hours, with noticeable discoloration on the copper surface; furthermore, after aging at 200℃ for 168 hours, the surface contact resistance changes by 15%.

[0092] The low peel strength between the insulation layer and the copper alloy conductor, and the fracture surface exhibiting interfacial separation characteristics rather than cohesive failure of the insulation layer, indicate that the cable without treatment with an organic-inorganic hybrid ternary functional interface modifier is deficient in corrosion resistance and interfacial bonding.

[0093] Comparative Example 2:

[0094] This comparative example provides a new energy copper alloy power cable, including:

[0095] The structure consists of a copper alloy conductor, an interface treatment layer, an insulation layer, and an outer sheath layer arranged sequentially from the inside out. The copper alloy conductor is made of multiple copper alloy monofilaments twisted together. The difference is that the interface treatment layer is only physically coated with benzotriazole (BTA) solution, without the use of organic-inorganic hybrid ternary functional interface modifier, and lacks thiol bond anchoring and terminal alkenyl crosslinking structure.

[0096] The new energy copper alloy power cable has a certain anti-corrosion effect in the early stage of preparation, but the corrosion resistance time in the neutral salt spray test is 48 hours; after aging at 200℃ for 168 hours, the surface contact resistance change rate increases to 12% due to the migration or volatilization of physically adsorbed BTA; the peel strength between the insulation layer and the copper alloy conductor is reduced by 40% compared with Example 1, and a molecular-level weld structure is not formed, indicating that the simple physically adsorbed antioxidant cannot maintain stable interface performance under high temperature and long-term operating environment.

[0097] The new energy copper alloy power cables prepared in Examples 1-5 and Comparative Examples 1-2 were tested accordingly, and the test results are shown below:

[0098] (1) Test of resistance to neutral salt spray corrosion

[0099] Test method description:

[0100] A neutral salt spray test was conducted in accordance with the national standard GB / T10125-2021 "Artificial Atmosphere Corrosion Test - Salt Spray Test".

[0101] Testing equipment: Precision salt spray corrosion test chamber (model: YWX-150, Shanghai Linpin Instrument Co., Ltd.);

[0102] Test conditions: Prepare a sodium chloride solution with a concentration of 50±5g / L, adjust the pH value to 6.5-7.2, maintain the test chamber temperature at 35±2℃, and the salt spray deposition rate is 1.0-2.0mL / (80cm²·h);

[0103] Testing process: Take 10 cable samples from each embodiment and comparative example, remove the insulation layer and outer sheath to expose a 10cm long copper alloy conductor, including the surface modification layer, and seal both ends with epoxy resin to avoid end face corrosion interference; place the samples in the test chamber and observe the surface condition every 2 hours.

[0104] Evaluation criteria: Record the time when the first visible oxidation discoloration spot or corrosion point appears on the surface of the copper alloy conductor; each group of samples was tested 3 times, the average value was taken and recorded, and the test results are shown in Table 1;

[0105] Table 1 Results of Neutral Salt Spray Corrosion Resistance Tests

[0106]

[0107] As shown in Table 1, the corrosion resistance of the new energy copper alloy power cables prepared by the present invention was improved after interface modification treatment; among them, Example 5 had the longest corrosion resistance time, reaching 108.50 hours, which is attributed to the use of the highest proportion of corrosion-resistant components and optimized crosslinking density.

[0108] As the content of the anti-corrosion core skeleton and anchoring groups in the modifier increases, the corrosion resistance time shows an upward trend. Comparative analysis shows that the corrosion resistance time of Comparative Example 1 is only 24.10 hours, indicating that the exposed copper alloy is very prone to oxidation reaction in the high temperature and high humidity salt spray environment. Although Comparative Example 2 uses benzotriazole for physical coating, the corrosion resistance time is increased to 48.25 hours, but it is still significantly lower than that of the examples. This is because the binding force of the physically adsorbed BTA molecular layer is weak, and it is easy to desorb or migrate under long-term salt spray scouring, resulting in the failure of the protective layer.

[0109] Mechanism Explanation: Examples 1-5 employed an organic-inorganic hybrid ternary functional interface modifier, which formed a strong Cu-S covalent bond anchoring with the copper surface through thiol or disulfide bonds. This chemical bonding effect is far stronger than physical adsorption, ensuring the long-term stability of the passivation film. Simultaneously, the benzotriazole derivative in the modifier molecule and pyromellitic dianhydride constitute a dense imide hydrophobic framework, effectively blocking the diffusion and penetration of chloride ions and oxygen into the copper substrate, thereby constructing an insurmountable chemical barrier at the microscopic interface. Example 3 introduced a sulfur-containing silane, and the hydrolysis and condensation of the silane further enhanced the compactness of the film layer, thus its corrosion resistance was superior to that of Example 1.

[0110] (2) High-temperature aging electrical performance stability test

[0111] Test method description:

[0112] To evaluate the stability of the contact resistance of the cable under long-term high-temperature operation, a thermal aging test was conducted in accordance with the IEC60811-401 standard.

[0113] Test equipment: High-temperature forced-air drying oven (model: DHG-9070A), high-precision micro-ohmmeter (model: TH2512B, Changzhou Tonghui Electronics);

[0114] Test conditions: The cable sample was placed in a high-temperature environment of 150°C for 168 hours for continuous aging;

[0115] Data processing: The contact resistance of the copper alloy conductor surface was measured before and after aging; five different points were selected on the sample surface for measurement, and the average value was taken; the calculation formula is: Contact resistance change rate (%) = (Resistance after aging - Resistance before aging) / Resistance before aging × 100%; where, The rate of change of contact resistance. The resistance after aging. The resistance before aging was measured. Each group of samples was tested three times, and the data was accurate to two decimal places. The test results are shown in Table 2.

[0116] Table 2. Test results of surface contact resistance change rate after high temperature aging.

[0117]

[0118] As shown in Table 2, after undergoing severe high-temperature aging at 150°C, the contact resistance change rate of Examples 1-5 was controlled within 4.20%, demonstrating excellent high-temperature electrical stability. In contrast, the change rate of Comparative Example 1 was as high as 15.12%, indicating that the unprotected copper surface underwent severe oxidation, generating semiconductor or insulating products such as copper oxide / cuprous oxide.

[0119] Comparative analysis showed that the change rate of Comparative Example 2 was 12.05%, which was better than that of Comparative Example 1, but the difference was huge compared with the example. The reason is that BTA-type small molecule organic compounds have poor temperature resistance and are very easy to volatilize, decompose or migrate at high temperature of 150°C, causing them to lose their protective effect on the copper surface.

[0120] In-depth mechanistic analysis shows that the core advantage of this invention lies in the high-temperature resistant skeleton design of the interface modifier; the polyimide rigid skeleton constructed using pyromellitic dianhydride has extremely high thermal stability and can maintain structural integrity without decomposition at 150℃; at the same time, the Cu-S bond at one end of the modifier ensures that the film layer does not fall off during thermal expansion and contraction, while the cross-linking network of the other end with the insulating layer blocks the intrusion path of external oxygen along the interfacial air gap; in Example 5, due to the long reaction time and high cross-linking density, the integrated structure of copper matrix-modifier-insulating layer formed is the most dense, effectively suppressing the interfacial oxidation reaction at high temperature, and therefore has the lowest resistivity change rate;

[0121] (3) Interface peel strength and failure mode test

[0122] Test method description:

[0123] The peel strength between the insulation layer and the conductor was tested in accordance with GB / T1040.3-2006 "Determination of Tensile Properties of Plastics" and relevant cable industry standards.

[0124] Testing equipment: Universal testing machine (model: CMT6104, MTES Industrial Systems).

[0125] Test conditions: 180° peel method was used, the tensile speed was set to 50±5 mm / min, and the ambient temperature was 23±2℃;

[0126] Evaluation criteria: Record the average load during the peeling process and calculate the peeling strength; at the same time, observe the microstructure of the fracture surface using a scanning electron microscope to determine the failure mode;

[0127] Data description: Five samples were prepared for each group, and the average value was taken. The test results are shown in Table 3.

[0128] Table 3. Test results of peel strength and failure mode between insulation layer and conductor.

[0129]

[0130] As shown in Table 3, the interfacial bonding strength of the cable achieved a qualitative leap after the introduction of the organic-inorganic hybrid ternary functional interface modifier. The peel strength of Example 5 reached 8.00 N / mm, which was 60% higher than that of Comparative Example 1. After the peel test, the fracture surface of all examples showed cohesive failure characteristics. Among them, the microstructure of Example 1 showed that the fracture occurred inside the insulation material, rather than at the interface between the copper conductor and the insulation layer.

[0131] In the comparative analysis, Comparative Example 1 showed typical interface separation, indicating that there was only weak physical friction and mechanical interlocking force between the copper and the XLPE insulating layer, which easily generated air gaps. It is worth noting that in Comparative Example 2, the peel strength of the BTA physical coating was actually lower than that of Comparative Example 1, and decreased by 40% compared with Example 1. This is because the small molecule BTA layer that is simply physically adsorbed forms a weak boundary layer between the conductor and the insulating layer, which hinders the direct contact between the insulating layer and the copper surface. Moreover, it cannot react with the insulating layer itself, and instead plays a negative role similar to a mold release agent.

[0132] Causal relationship analysis: The high-strength adhesion achieved in the example is attributed to the molecular bridge design of the modifier; the functional group C is thermally activated during the high-temperature vulcanization of the insulation layer, directly participating in the free radical cross-linking reaction of cross-linked polyethylene, forming a strong CC chemical bond network; this molecular-level welding technology tightly combines the originally polarly different metallic copper and the polymer insulation layer, eliminating interfacial micropores and air gaps, which not only greatly improves the mechanical peel strength, but also eliminates the hidden danger of partial discharge.

[0133] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments that can be applied to other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A new energy copper alloy power cable, characterized in that, include: The copper alloy conductor, interface modification layer, insulation layer, and outer sheath layer are arranged sequentially from the inside out. The copper alloy conductor is made up of multiple copper alloy monofilaments twisted together to form the conductive core of the cable, and the interface modification layer is attached to the surface of the copper alloy conductor by chemical bonding. The interface modification layer is formed by curing an organic-inorganic hybrid ternary functional interface modifier, wherein the organic-inorganic hybrid ternary functional interface modifier comprises the following raw materials in parts by weight: 20-30 parts of pyromellitic dianhydride, 15-25 parts of 5-aminobenzotriazole, ... 10-18 parts of mercaptopropyltrimethoxysilane or mercaptoacetic acid, 12-20 parts of glycidyl methacrylate or allyl chloride, and 80-120 parts of organic solvent; The interface modification layer forms a molecular-level welded structure between the copper alloy conductor and the insulating layer. One end of the organic-inorganic hybrid ternary functional interface modifier is anchored to the surface of the copper alloy conductor by forming Cu-S covalent bonds through thiol bonds or disulfide bonds, and the other end forms a cross-linked network with the molecular chain of the insulating layer through terminal alkenyl or epoxy groups. The insulating layer is made of cross-linked polyethylene material, and the insulating layer undergoes a chemical reaction with the active double bonds of the interface modified layer during high-temperature vulcanization. The preparation method of the organic-inorganic hybrid ternary functional interface modifier includes the following steps: Step S1, framework construction: Dissolve the pyromellitic dianhydride in an organic solvent, add the 5-aminobenzotriazole under a nitrogen protective atmosphere, turn on the stirrer to disperse, heat to 140-160℃, and keep in reflux condensation state for 3-5 hours to carry out imidization reaction to obtain an intermediate solution containing the anti-corrosion core. Step S2, anchoring group grafting: Lower the temperature of the reaction system to 50-70℃, and slowly add the intermediate solution dropwise. -Mercaptopropyltrimethoxysilane or a mixture of said mercaptoacetic acid and dehydrating condensing agent added dropwise, if using -Mercaptopropyltrimethoxysilane is hydrolyzed by adding an acid regulator and stirring at a constant temperature for 2-4 hours, and a thiol functional group is grafted onto one end of the skeleton. Step S3, end-group functionalization modification: Add a catalyst to the system obtained in step S2 and heat to 80-90℃; if glycidyl methacrylate is added, add a quaternary ammonium salt catalyst to carry out a ring-opening addition reaction, and retain some active thiol groups by controlling the molar ratio of reactants; if allyl chloride is added, add an acid-binding agent to carry out a nucleophilic substitution reaction; continue the reaction at the temperature for 3-5 hours, and remove the solvent by vacuum distillation after the reaction to obtain the organic-inorganic hybrid ternary functional interface modifier.

2. The new energy copper alloy power cable according to claim 1, characterized in that, include: The coating process of the interface modification layer includes: during the cooling stage after the copper alloy conductor is drawn and annealed, using an ultrasonic atomizing device to uniformly spray a nano-dispersion of the organic-inorganic hybrid ternary functional interface modifier with a concentration of 1.0%-5.0% onto the surface of the copper alloy conductor. In the preparation of the nano-dispersion, a combination of high-speed shearing and ultrasonic dispersion is used to disperse the modifier in anhydrous ethanol at a mass fraction of 2.0%, ensuring that the particle size of the modifier reaches the nanoscale distribution.

3. The new energy copper alloy power cable according to claim 2, characterized in that, include: The film formation process of the interface modified layer includes a thermally activated self-assembly step: The copper alloy conductor coated with the nano-dispersion is passed through a drying tunnel at a temperature of 60-80℃ or kept warm using the residual heat of annealing. During the heat preservation process, the thiol groups in the modifier undergo a dehydrogenation reaction with the copper surface, and after standing, the bubbles are removed and a dense self-assembled monolayer is formed.

4. The new energy copper alloy power cable according to claim 1, characterized in that, include: The method for forming the insulating layer is as follows: cross-linked polyethylene base material is added to an extruder and extruded onto the outside of the interface modified layer under a high-temperature vulcanization environment of 180-200℃. During this process, the terminal alkenyl or epoxy groups of the interface modifier are thermally activated and participate in the cross-linking network reaction of the insulating material, thereby achieving in-situ cross-linking composite of the conductor and the insulating layer.

5. A new energy copper alloy power cable according to claim 1, characterized in that, include: After being treated with the interface modification layer, the copper alloy conductor exhibits a neutral salt spray corrosion resistance time of more than 96 hours and a surface contact resistance change rate of less than 5% after aging at 200°C for 168 hours.

6. The new energy copper alloy power cable according to claim 1, characterized in that, include: The peel strength between the insulation layer and the copper alloy conductor is increased by more than 50% compared to the unmodified cable, and the fracture surface exhibits cohesive failure characteristics, that is, the fracture occurs inside the insulation material itself, rather than at the interface between the copper alloy conductor and the insulation layer.

7. A new energy copper alloy power cable according to claim 1, characterized in that, include: In step S1, the organic solvent is N,N-dimethylformamide or dimethyl sulfoxide; in step S3, the catalyst is a quaternary ammonium salt phase transfer catalyst.

8. A new energy copper alloy power cable according to claim 4, characterized in that, include: The extruder adopts multi-stage gradient temperature control. From the feed inlet to the die head, the temperatures of each temperature zone are set sequentially to 150-160℃, 165-175℃, 180-190℃, and 195-200℃ to ensure that the insulating layer material undergoes a cross-linking reaction with the interface modification layer in the molten state without premature scorching.

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