Surface inspection equipment and inspection system

Abstract

This invention discloses a surface inspection device and system, comprising: a clamping device including a clamping mechanism and a Z-axis module for driving the clamping mechanism to move up and down; the clamping mechanism includes multiple clamping units evenly spaced along the circumference of the wafer; a first inspection device located below the clamping device, including a vision mechanism and a first X-axis module capable of driving the vision mechanism to move along the X-axis direction past the clamping device; each clamping unit includes at least one clamping component, the clamping component including a clamping member, an elastic member, and a driving cylinder; the clamping member can move towards or away from the periphery of the wafer radially; when the piston rod of the driving cylinder extends, it can drive the clamping member away from the wafer and stretch the elastic member; when the driving cylinder removes its driving action on the clamping member, the elastic member rebounds, thereby driving the clamping member to clamp the wafer; the clamping member is configured to form line contact with the periphery of the wafer. This invention, employing the above structure, can effectively reduce secondary damage during wafer inspection.

Description

Technical Field

[0001] This invention relates to the field of appearance inspection technology, and in particular to a surface inspection device and inspection system. Background Technology

[0002] Currently, defect detection on the back side of wafers typically employs a clamping mechanism to grip the wafer and move it above a vision unit to obtain back-side topography information. However, existing clamping mechanisms have significant drawbacks, easily causing secondary damage to the wafer during the inspection process. Specifically, the clamping mechanism uses rigid grippers; the lack of cushioning during wafer gripping and release results in significant mechanical impact on the brittle wafer due to the rigid contact. Furthermore, friction and vibration occur during wafer transport, and during high-speed movement, sudden stops, or trajectory changes, minute relative displacements or vibrations may occur between the wafer and the clamping mechanism, leading to scratches or contamination on the wafer surface.

[0003] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0004] The purpose of this invention is to provide a surface inspection device and inspection system that can effectively reduce secondary damage during wafer inspection.

[0005] The objective of this invention is achieved through the following technical solution: a surface inspection device, comprising:

[0006] The clamping device includes a clamping mechanism for clamping a wafer and a Z-axis module for driving the clamping mechanism to move up and down along the Z-axis direction. The clamping mechanism includes a plurality of clamping units that are equally spaced along the circumference of the wafer.

[0007] The first detection device is located below the clamping device, and includes a vision mechanism and a first X-axis module capable of driving the vision mechanism to move through the clamping device along the X-axis direction;

[0008] The clamping unit includes at least one clamping assembly, which includes a clamping member, an elastic member, and a driving cylinder. The clamping member is capable of approaching or moving away from the periphery of the wafer along the radial direction of the wafer. When the piston rod of the driving cylinder extends, it can drive the clamping member away from the wafer and stretch the elastic member. When the driving cylinder removes its driving action on the clamping member, the elastic member rebounds, thereby driving the clamping member to clamp the wafer. The clamping member is configured to form a line contact with the periphery of the wafer.

[0009] Furthermore, the clamping member includes at least one clamping surface inclined to the Z-axis, the clamping surface being configured to form line contact with the corresponding edge of the wafer periphery.

[0010] Furthermore, the edge is formed by the intersection of the end face of the wafer and the periphery of the wafer.

[0011] Furthermore, the wafer periphery is chamfered, and at least one of the clamping surfaces is in contact with the edge line formed by the chamfer.

[0012] Furthermore, the clamping member includes an upper clamping surface and a lower clamping surface arranged at an angle, both of which are inclined to the Z-axis, and the upper clamping surface and the lower clamping surface respectively form line contact with the edge line corresponding to the periphery of the wafer.

[0013] Furthermore, the horizontal plane containing the intersection line of the upper clamping surface and the lower clamping surface has an angle α with the upper clamping surface, where 60°≤α≤90°;

[0014] The horizontal plane containing the intersection line of the upper clamping surface and the lower clamping surface has an included angle β with the lower clamping surface, where 15°≤β≤30°.

[0015] Furthermore, the clamping mechanism includes a base for mounting each of the clamping units, and the clamping member includes:

[0016] The seat body is slidably connected to the base;

[0017] The clamping block is fixedly connected to the base body and is located below the base;

[0018] The clamping assembly includes mounting blocks disposed on the base and corresponding one-to-one with the clamping members, and the elastic member is connected between the base and the mounting blocks.

[0019] Furthermore, a limiting structure is provided between the mounting block and the base, the limiting structure being adapted to limit the extreme clamping position of the clamping member;

[0020] An adjustment structure is provided between the seat and the elastic element and / or between the mounting block and the elastic element to adjust the degree of stretching of the elastic element.

[0021] Furthermore, the number of clamping units is three, and they are arranged in a circumferential array on the base. Each clamping unit includes two clamping components, which are arranged at an acute angle. In the direction from the center to the edge of the wafer, the two clamping components of the same clamping unit gradually move away from each other.

[0022] Furthermore, the present invention also provides a detection system, comprising:

[0023] The aforementioned surface inspection equipment;

[0024] The support device includes a rotary table mechanism for supporting and rotating the wafer and a second X-axis module for driving the rotary table mechanism to move along the X-axis direction to a first inspection station or a second inspection station. When the rotary table mechanism is at the first inspection station, the clamping device is located directly above the rotary table mechanism.

[0025] The second testing device is located at the second testing station;

[0026] The rotary table mechanism, the vision mechanism, and the clamping mechanism are arranged sequentially from bottom to top along the Z-axis, and the rotary table mechanism and the vision mechanism are adapted to move along the X-axis direction so that the projections of the rotary table mechanism, the vision mechanism, and the clamping mechanism in the Z-axis direction do not overlap.

[0027] Compared with the prior art, the present invention has the following beneficial effects: The present invention adopts the above-described structure. The clamping device, through the synergistic action of the driving cylinder and the elastic element, provides effective buffering during wafer clamping and release by the extension and contraction of the elastic element, preventing wafer edge chipping or micro-cracks caused by rigid collisions. The continuous and flexible clamping force provided by the elastic element ensures a stable relative position between the wafer and the clamping element during transfer, emergency stop, or trajectory change, eliminating frictional damage caused by minor slippage or vibration. The clamping element forms line contact with the wafer periphery, which greatly reduces the contact area compared to traditional surface contact clamping, significantly reducing the risk of scratches or contamination particles on the wafer surface during clamping. Furthermore, multiple clamping units are evenly spaced along the wafer circumference. Combined with the line contact method, this allows the clamping force to be evenly distributed at the wafer edge, avoiding localized stress concentration and preventing bending or deformation of the wafer during clamping, which is particularly important for large-size thin wafers. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the surface inspection device of the present invention.

[0029] Figure 2 This is a schematic diagram of the clamping mechanism in this invention.

[0030] Figure 3 This is a top view schematic diagram of the clamping mechanism in this invention.

[0031] Figure 4 This is an exploded structural diagram of the clamping mechanism and the wafer in this invention.

[0032] Figure 5 This is a schematic diagram of the clamping component in this invention.

[0033] Figure 6 This is a schematic diagram of the state when the clamping block holds the wafer in this invention.

[0034] Figure 7This is a schematic diagram of the clamping block in this invention.

[0035] Figure 8 This is a schematic diagram of the structure of the first detection device in this invention.

[0036] Figure 9 This is a schematic diagram of the vision mechanism in this invention.

[0037] Figure 10 This is a partial schematic diagram of the vision mechanism in this invention.

[0038] Figure 11 This is a cross-sectional schematic diagram of the vision mechanism in this invention.

[0039] Figure 12 This is a schematic diagram of the detection system of the present invention.

[0040] Figure 13 This is a schematic diagram of the installation of the bearing device and the second detection device in this invention.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100. Clamping device; 110. Clamping mechanism; 120. Z-axis module; 130. Clamping unit; 140. Clamping assembly; 150. Clamping component; 151. Base; 1511. Mounting part; 1512. Adjustment groove; 1513. First adjustment hole; 152. Clamping block; 1521. Upper clamping surface; 1522. Lower clamping surface; 153. Adjustment block; 1531. Second connecting hole; 1532. Second adjustment hole; 154. Adjustment bolt; 160. Elastic element; 170. Drive cylinder; 180. Base; 181. Slide rail assembly; 182. Mounting block; 183. Leveling plate; 191. First adjusting screw; 192. Limiting post; 193. Second adjusting screw; 200. First detection device; 210. Vision mechanism; 220. First X-axis module; 230. Mounting bracket; 231. Mounting shaft; 240. Camera module; 241. First transmission component; 250. Light source module; 251. Second transmission component; 260. Adjustment assembly; 261. Drive shaft; 262. First transmission shaft; 263. Second transmission shaft; 264. Drive motor; 265. First transmission gear; 266. Second transmission gear; 267. Third transmission gear; 300. Bearing device; 310. Rotary table mechanism; 320. Second X-axis module; 400. Second detection device; 500. Wafer; 510. Chamfer. Detailed Implementation

[0043] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0044] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0045] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0046] Please see Figure 1 and Figure 2 As shown, a surface inspection device corresponding to a preferred embodiment of the present invention includes: a clamping device 100, comprising a clamping mechanism 110 for clamping a wafer 500 and a Z-axis module 120 for driving the clamping mechanism 110 to move up and down along the Z-axis direction, the clamping mechanism 110 including a plurality of clamping units 130 equally spaced along the circumference of the wafer 500; a first inspection device 200, located below the clamping device 100, comprising a vision mechanism 210 and a first X-axis module 220 capable of driving the vision mechanism 210 to move through the clamping device 100 along the X-axis direction; wherein, the clamping unit 130 includes The device includes at least one clamping assembly 140, which includes a clamping member 150, an elastic member 160, and a drive cylinder 170. The clamping member 150 is capable of approaching or moving away from the periphery of the wafer 500 along the radial direction of the wafer 500. When the piston rod of the drive cylinder 170 extends, it can drive the clamping member 150 away from the wafer 500 and stretch the elastic member 160. When the drive cylinder 170 removes its driving action on the clamping member 150, the elastic member 160 rebounds, thereby driving the clamping member 150 to clamp the wafer 500. The clamping member 150 is configured to form a line contact with the periphery of the wafer 500.

[0047] The present invention employs the above-described structure. The clamping device 100, through the synergistic action of the drive cylinder 170 and the elastic element 160, provides effective buffering during the clamping and releasing of the wafer 500 by the extension and retraction of the elastic element 160, preventing edge chipping or micro-cracks in the wafer 500 caused by rigid collisions. The continuous and flexible clamping force provided by the elastic element 160 ensures a stable relative position between the wafer 500 and the clamping element 150 during transfer, emergency stops, or trajectory changes, eliminating friction caused by minute slippage or vibration. Damage; the clamping element 150 forms line contact with the periphery of the wafer 500, which greatly reduces the contact area compared with the traditional surface contact clamping, significantly reducing the risk of scratches or contaminant particles on the surface of the wafer 500 during clamping. In addition, multiple clamping units 130 are evenly distributed along the circumference of the wafer 500. Combined with the line contact method, the clamping force can be evenly distributed on the edge of the wafer 500, avoiding local stress concentration and preventing the wafer 500 from bending or deforming during clamping. This is especially important for large-size thin wafers 500.

[0048] Furthermore, referring to Figures 5 to 7 As shown, the clamping member 150 includes at least one clamping surface inclined to the Z-axis, which is configured to form line contact with a corresponding edge of the periphery of the wafer 500. The edge of the wafer 500 may be formed by the intersection of the end face of the wafer 500 and the periphery of the wafer 500. When there is one clamping surface, it may contact the upper edge or the lower edge of the wafer 500; when there are two clamping surfaces, each clamping surface contacts the upper edge and the lower edge of the wafer 500, respectively.

[0049] Admittedly, in other embodiments, the periphery of the wafer 500 is provided with a chamfer 510, such that the beveled surface where the chamfer 510 is located forms an edge line with both the end face of the wafer 500 and the periphery of the wafer 500. At least one clamping surface is in contact with the edge line formed by the chamfer 510. Preferably, in this embodiment, chamfers 510 are provided on both the upper and lower sides of the wafer 500, that is, four edge lines are formed on the periphery of the wafer 500, and each clamping surface can selectively contact one edge line.

[0050] By adopting the above structure, the bevel of chamfer 510 provides a natural guide surface for the clamping process, enabling the clamping component 150 to be positioned more smoothly and accurately to the contact edge, improving the alignment tolerance and operational stability of the clamping. The contact position is transferred from the sharp and fragile original edge to the bevel edge of the chamfer 510 after grinding, effectively eliminating the "knife-edge effect" and significantly reducing the risk of chipping at the edge of the wafer 500 through better stress distribution. The chamfer 510 area is usually the non-active area of ​​the wafer 500. Contacting here can maximize the distance from the core area of ​​the chip, and the chamfer surface itself is smoother, thereby significantly reducing the amount of contaminant particles generated and adhering to the active area during the clamping process.

[0051] Furthermore, the clamping member 150 includes an upper clamping surface 1521 and a lower clamping surface 1522 arranged at an angle. Both the upper clamping surface 1521 and the lower clamping surface 1522 are inclined to the Z-axis, and the upper clamping surface 1521 and the lower clamping surface 1522 respectively form line contact with different edges corresponding to the periphery of the wafer 500.

[0052] The upper clamping surface 1521 and lower clamping surface 1522, arranged at an angle, simultaneously form line contact with the two corresponding upper and lower edges of the wafer 500's periphery, creating a stable spatial constraint. This effectively limits the displacement and sway of the wafer 500 along the Z-axis during clamping, significantly improving the rigidity and stability of the clamping, making it particularly suitable for high-speed transport and emergency stop conditions. The wedge-shaped or V-shaped structure formed by the dual clamping surfaces provides radial clamping force while generating a slight axial component force, which helps the wafer 500 to automatically center radially and adhere tightly to the fixed position. The dual-line contact system provides a reference point, ensuring repeatability of the detection pose. Compared to single-line contact, dual-line contact distributes the clamping force more evenly across the upper and lower edges of the wafer 500, greatly reducing local stress concentration. Combined with the small contact area of ​​the line contact itself, this further reduces the risk of indentation, chipping, or micro-cracks on the wafer 500 edge. In addition, this structure has a certain degree of adaptability to the tolerances of wafer 500 thickness and edge morphology, enhancing the equipment's compatibility and clamping reliability for different batches of wafer 500.

[0053] Furthermore, the horizontal plane containing the intersection line of the upper clamping surface 1521 and the lower clamping surface 1522 has an angle α with respect to the upper clamping surface 1521, where 60° ≤ α < 90°. The horizontal plane containing the intersection line of the upper clamping surface 1521 and the lower clamping surface 1522 has an angle β with respect to the lower clamping surface 1522, where 15° ≤ β ≤ 30°. By limiting these angles, the optimal allocation of the three functions of constraint, clamping, and lifting on the upper clamping surface 1521 and the lower clamping surface 1522 can be achieved.

[0054] Furthermore, referring to Figures 2 to 5 As shown, the clamping mechanism 110 includes a base 180 that is driveably connected to the Z-axis module 120, and each clamping unit 130 is mounted on the top of the base 180. The clamping member 150 includes a seat 151 and a clamping block 152. A slide rail assembly 181 is provided on the base 180, and the seat 151 is disposed on the slide rail assembly 181 so as to be slidably connected to the base 180. The clamping block 152 is fixedly connected to the seat 151 and is located below the base 180. A mounting block 182 is provided on the top of the base 180, and the mounting block 182 corresponds one-to-one with the clamping member 150. An elastic member 160 is connected between the seat 151 and the mounting block 182.

[0055] In this embodiment, the seat 151 extends beyond the base 180 to form a mounting portion 1511. The mounting portion 1511 has an adjustment groove 1512 recessed inward on the outer side of the slide rail assembly 181 in the sliding direction. The adjustment groove 1512 penetrates the mounting portion 1511 downward along the Z-axis direction.

[0056] The clamping member 150 also includes an adjusting block 153, which is embedded in the adjusting groove 1512 and extends downward along the Z-axis beyond the adjusting groove 1512. The adjusting groove 1512 is adapted to guide the adjusting block 153 to move and adjust along the Z-axis. The mounting part 1511 has a first connecting hole at the bottom of the adjusting groove 1512, and the adjusting block 153 has a second connecting hole 1531 corresponding to the first connecting hole. The second connecting hole 1531 is a strip-shaped hole with its length direction parallel to the Z-axis. A threaded component connects the first connecting hole and the second connecting hole 1531 to fix the adjusting block 153 and the mounting part 1511. The clamping block 152 is fixedly connected to the portion of the adjusting block 153 that extends out of the adjusting groove 1512. The clamping block 152 can move synchronously with the adjusting block 153 along the Z-axis to accommodate wafers 500 of different thicknesses.

[0057] Preferably, the adjusting groove 1512 has a first adjusting hole 1513 extending through it along the Z-axis on the non-open side. The adjusting block 153 has a second adjusting hole 1532 recessed inwards on the side facing the first adjusting hole 1513. An adjusting bolt 154 is threaded between the first adjusting hole 1513 and the second adjusting hole 1532. The adjusting bolt 154 is inserted sequentially into the first adjusting hole 1513 and the second adjusting hole 1532 via the upper end of the first adjusting hole 1513. When the adjusting block 153 and the mounting part 1511 are loosened, rotating the adjusting bolt 154 drives the adjusting block 153 to make fine adjustments along the Z-axis, thereby improving the adjustment accuracy.

[0058] Furthermore, a limiting structure is provided between the mounting block 182 and the base 151, which is adapted to limit the ultimate clamping position of the clamping member 150. The limiting structure includes a first adjusting screw 191 threadedly connected to the base 151 and a limiting post 192 fixedly connected to the mounting block 182. The first adjusting screw 191 and the limiting post 192 are arranged opposite each other along the radial direction of the wafer 500, and their axial directions are both parallel to the sliding direction of the base 151. By rotating the first adjusting screw 191, the distance between the first adjusting screw 191 and the limiting post 192 can be adjusted to adjust the ultimate clamping position of the clamping member 150.

[0059] Furthermore, an adjustment structure for adjusting the stretching degree of the elastic element 160 is provided between the base 151 and the elastic element 160 and / or between the mounting block 182 and the elastic element 160. In this embodiment, the adjustment structure is a second adjusting screw 193 with its axis parallel to the sliding direction of the base 151. By providing the adjustment structure, the clamping force of the clamping member 150 can be adjusted to the optimal level, ensuring that the wafer 500 can be reliably clamped while preventing damage to the wafer 500 due to clamping.

[0060] Furthermore, the drive cylinder 170 is disposed on the base 180. It is a linear cylinder arranged along the sliding direction of the seat 151. Its piston rod can be fixedly connected to the seat 151 to push the seat 151, so that the clamping assembly 140 is in the released position. When the air supply to the drive cylinder 170 is stopped, the seat 151 moves to the clamping position under the rebound action of the elastic member 160, while pushing the piston rod to retract. Admittedly, in other embodiments, the piston rod may not be connected to the seat 151. When it extends, it can push the seat 151, so that the clamping assembly 140 is in the released position. When it is necessary to clamp the wafer 500, the piston rod of the drive cylinder 170 retracts to contact the push against the seat 151, so that the seat 151 moves to the clamping position under the rebound action of the elastic member 160.

[0061] Furthermore, there are three clamping units 130 arranged in a circular array on the base 180, with adjacent clamping units 130 spaced 120° apart. Each clamping unit 130 includes two clamping components 140 arranged at an acute angle, and the two clamping components 140 of the same clamping unit 130 gradually move away from each other in the direction from the center to the edge of the wafer 500. By adopting the above structure, the structure of the clamping device 100 can be greatly simplified while the clamping effect of the clamping device 100 is optimized.

[0062] Furthermore, a leveling disk 183 is fixed at the bottom of the base 180. The leveling disk 183 is a disc-shaped structure with the same axis as the wafer 500. The leveling disk 183 can fit against the upper surface of the wafer 500 to prevent the wafer 500 from warping during the clamping process.

[0063] Furthermore, the Z-axis module 120 is a conventional linear module, used to drive the clamping mechanism 110 to descend to the position of clamping the wafer 500 or to rise to the position of avoiding the inflow and outflow of the wafer 500.

[0064] Furthermore, referring to Figures 8 to 11As shown, the vision mechanism 210 includes a mounting frame 230, a camera module 240 mounted on the mounting frame 230, and a light source module 250. The mounting frame 230 is mounted on a first X-axis module 220. The camera module 240 is a line scan camera, with its length direction parallel to the Y-axis direction. The light source module 250 is a strip light source adapted to the camera module 240. The first X-axis module 220 is a linear module arranged along the X-axis direction. When the clamping device 100 grips the wafer 500, the first X-axis module 220 can drive the vision mechanism 210 to move along the X-axis direction from one side of the wafer 500 to the other side, thereby achieving visual inspection of the entire end face of the wafer 500. The optical axes of the light source module 250 and the camera module 240 are both inclined upwards and point towards the surface of the wafer 500 to be measured, and intersect at this surface.

[0065] Preferably, both the light source module 250 and the camera module 240 are rotatably mounted on the mounting bracket 230 around the Y-axis. The mounting bracket 230 is provided with an adjustment component 260, which is adapted to drive the light source module 250 and the camera module 240 to rotate in opposite directions around the same axis to adjust the included angle between the two optical axes and meet different shooting requirements.

[0066] By adopting the above structure, the angle between the light source module 250 and the camera module 240 can be continuously and precisely adjusted, enabling the same vision mechanism 210 to quickly adapt to various types of defect detection and optimize imaging conditions for wafers 500 with different materials, film thicknesses and surface characteristics. The best contrast image can be obtained without changing the hardware, which greatly expands the application range and detection accuracy of the equipment.

[0067] Furthermore, the mounting bracket 230 is a long strip structure with its length direction parallel to the Y-axis direction, and both ends of it are fixedly connected to mounting shafts 231. The mounting shafts 231 at both ends are coaxial, and their axial direction is parallel to the Y-axis direction. Both ends of the camera module 240 are fixed with first transmission components 241, and both ends of the light source module 250 are fixed with second transmission components 251. Each first transmission component 241 is rotatably sleeved on a different mounting shaft 231, and each second transmission component 251 is rotatably sleeved on a different mounting shaft 231.

[0068] The adjustment assembly 260 includes a drive shaft 261, a first drive shaft 262, a second drive shaft 263, and a drive motor 264. The drive shaft 261 is rotatably mounted on the mounting bracket 230, and its axis is parallel to the Y-axis direction. Both ends of the drive shaft 261 extend to different ends of the mounting bracket 230. The first drive shaft 262 and the second drive shaft 263 are rotatably mounted on the mounting bracket 230, and their axes are parallel to the X-axis direction.

[0069] There are two of each of the first drive shaft 262 and the second drive shaft 263. One of the first drive shaft 262 and the second drive shaft 263 is located at one end of the mounting bracket 230 and above the drive shaft 261, while the other first drive shaft 262 and the second drive shaft 263 are located at the other end of the mounting bracket 230 and above the drive shaft 261.

[0070] Both ends of the drive shaft 261 are fixedly fitted with first transmission gears 265. Each first transmission shaft 262 is fixedly fitted with a second transmission gear 266, which corresponds to and meshes with the first transmission gears 265. Each second transmission shaft 263 is fixedly fitted with a third transmission gear 267, which corresponds to and meshes with the second transmission gears 266. A drive motor 264 is connected to one end of the drive shaft 261. A first transmission member 241 corresponds to each first transmission shaft 262 and is located above it; the first transmission member 241 meshes with the first transmission shaft 262. A second transmission member 251 corresponds to each second transmission shaft 263 and is located above it; the second transmission member 251 meshes with the first transmission shaft 262. In this embodiment, the first transmission shaft 262 and the second transmission shaft 263 are worm gear structures. The outer contours of the first transmission member 241 and the second transmission member 251 are arc-shaped structures coaxial with the mounting shaft 231, and the outer edges are provided with teeth that cooperate with the worm gear structure.

[0071] By driving the drive shaft 261 to rotate via the drive motor 264, the first transmission shaft 262 and the second transmission shaft 263 can rotate in opposite directions around the X-axis, thereby driving the first transmission component 241 and the second transmission component 251 to rotate in opposite directions around the Y-axis.

[0072] Furthermore, the camera module 240 and the light source module 250 are located below the mounting axis 231, and the intersection point of the optical axes of the camera module 240 and the light source module 250 is located on the axis of the mounting axis 231. Since the intersection point of the optical axes of the camera module 240 and the light source module 250 is designed to completely coincide with their common mechanical rotation axis, the rotation center itself is located on the surface of the wafer 500 being inspected. When the adjustment component 260 drives the two to rotate in opposite directions around this axis to change the angle between the optical axes, no matter how the angle changes, the two optical axes will inevitably intersect on this fixed axis. This avoids lateral drift of the scanning field of view that may be caused by angle adjustment. This feature allows the angle parameter to be seamlessly and dynamically adjusted during scanning or batch switching without interrupting the inspection or performing any complex visual repositioning and motion compensation, thereby ensuring the absolute continuity of the inspection process and the high repeatability of the results.

[0073] Furthermore, referring to Figure 12 and Figure 13As shown, the present invention also provides an inspection system, including a surface inspection device, a carrier device 300, and a second inspection device 400. The carrier device 300 includes a rotary table mechanism 310 for carrying and rotating a wafer 500, and a second X-axis module 320 for driving the rotary table mechanism 310 to move along the X-axis direction to a first inspection station or a second inspection station. When the rotary table mechanism 310 is in the first inspection station, the clamping device 100 is located directly above the rotary table mechanism 310, so that the clamping device 100 can clamp the wafer 500 and perform visual inspection of the lower end face under the action of the first inspection device 400.

[0074] The second inspection device 400 is located at the second inspection station and includes multiple inspection mechanisms to perform inspections on different items. When the rotary table mechanism 310 is at the second inspection station, the multiple inspection mechanisms are arranged at circumferential intervals around the rotary table mechanism 310. As the rotary table mechanism 310 drives the wafer 500 to rotate, each inspection mechanism can perform comprehensive inspections on the wafer 500.

[0075] Furthermore, the rotary stage mechanism 310, the vision mechanism 210, and the clamping mechanism 110 are arranged sequentially from bottom to top along the Z-axis so that the wafer 500 is not obstructed during its movement along the X-axis. The rotary stage mechanism 310 and the vision mechanism 210 are adapted to move along the X-axis so that the projections of the rotary stage mechanism 310, the vision mechanism 210, and the clamping mechanism 110 in the Z-axis direction do not overlap, ensuring that the vision mechanism 210 can successfully capture images of the lower surface of the wafer 500.

[0076] The working process of the detection system of the present invention is as follows: The rotary table mechanism 310 first moves to the second detection station under the drive of the second X-axis module 320 to receive the wafer 500 to be detected, and then drives the wafer 500 to rotate so that the second detection device 400 can detect the wafer 500; after the detection is completed, the rotary table mechanism 310 moves to the first detection station under the drive of the second X-axis module 320, and the clamping mechanism 110 moves downward under the drive of the Z-axis module 120 to clamp the wafer 500 and then rises to reset; then the rotary table mechanism 310 moves away from the first detection station under the drive of the second X-axis module 320. In the first inspection station, the vision mechanism 210 moves along the X-axis under the drive of the first X-axis module 220 to capture the entire lower surface of the wafer 500. During this process, the adjustment component 260 can adjust the angles of the light source module 250 and the camera module 240 to meet different inspection requirements. After the inspection is completed, the rotary table mechanism 310 moves back to the first inspection station, and the clamping mechanism 110 descends under the drive of the Z-axis module 120 to put the wafer 500 back into the rotary table mechanism 310. Then the rotary table mechanism 310 moves back to the second inspection station, and after the wafer 500 is removed, it receives a new wafer 500 to be inspected.

[0077] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A surface inspection device, characterized in that, include: The clamping device (100) includes a clamping mechanism (110) for clamping a wafer (500) and a Z-axis module (120) for driving the clamping mechanism (110) to move up and down along the Z-axis direction. The clamping mechanism (110) includes a plurality of clamping units (130) that are equally spaced along the circumference of the wafer (500). The first detection device (200) is located below the clamping device (100) and includes a vision mechanism (210) and a first X-axis module (220) capable of driving the vision mechanism (210) to move through the clamping device (100) along the X-axis direction. The clamping unit (130) includes at least one clamping assembly (140), which includes a clamping member (150), an elastic member (160), and a driving cylinder (170). The clamping member (150) is capable of approaching or moving away from the periphery of the wafer (500) radially. When the piston rod of the driving cylinder (170) extends, it can drive the clamping member (150) away from the wafer (500) and stretch the elastic member (160). When the driving cylinder (170) removes its driving action on the clamping member (150), the elastic member (160) rebounds, thereby driving the clamping member (150) to clamp the wafer (500), the clamping member (150) being configured to form a line contact with the periphery of the wafer (500).

2. The surface inspection device as described in claim 1, characterized in that, The clamping member (150) includes at least one clamping surface inclined to the Z-axis, the clamping surface being configured to form line contact with the edge corresponding to the periphery of the wafer (500).

3. The surface inspection device as described in claim 2, characterized in that, The edge is formed by the intersection of the end face of the wafer (500) and the periphery of the wafer (500).

4. The surface inspection device as described in claim 2, characterized in that, The wafer (500) has a chamfer (510) around its periphery, and at least one of the clamping surfaces is in contact with the edge line formed by the chamfer (510).

5. The surface inspection device as described in claim 2, characterized in that, The clamping member (150) includes an upper clamping surface (1521) and a lower clamping surface (1522) arranged at an angle. Both the upper clamping surface (1521) and the lower clamping surface (1522) are inclined to the Z-axis. The upper clamping surface (1521) and the lower clamping surface (1522) respectively form line contact with different edges corresponding to the periphery of the wafer (500).

6. The surface inspection device as described in claim 5, characterized in that, The horizontal plane containing the intersection line of the upper clamping surface (1521) and the lower clamping surface (1522) has an angle α with the upper clamping surface (1521), where 60°≤α<90°; The horizontal plane containing the intersection line of the upper clamping surface (1521) and the lower clamping surface (1522) has an included angle β with the lower clamping surface (1522), where 15°≤β≤30°.

7. The surface inspection device as described in claim 1, characterized in that, The clamping mechanism (110) includes a base (180) for mounting each of the clamping units (130), and the clamping member (150) includes: The seat (151) is slidably connected to the base (180); The clamping block (152) is fixedly connected to the seat (151) and is located below the base (180); The clamping assembly (140) includes a mounting block (182) disposed on the base (180) and corresponding to the clamping member (150), and the elastic member (160) is connected between the base (151) and the mounting block (182).

8. The surface inspection device as described in claim 7, characterized in that, A limiting structure is provided between the mounting block (182) and the base (151), and the limiting structure is adapted to limit the extreme clamping position of the clamping member (150); An adjustment structure for adjusting the stretching degree of the elastic element (160) is provided between the seat (151) and the elastic element (160) and / or between the mounting block (182) and the elastic element (160).

9. The surface inspection device as described in claim 7, characterized in that, The number of clamping units (130) is three, and they are arranged in a circular array on the base (180). Each clamping unit (130) includes two clamping components (140). The two clamping components (140) are arranged at an acute angle, and in the direction from the center to the edge of the wafer (500), the two clamping components (140) of the same clamping unit (130) gradually move away from each other.

10. A detection system, characterized in that, include: The surface inspection device as described in any one of claims 1 to 9; The support device (300) includes a rotary table mechanism (310) for supporting and rotating the wafer (500) and a second X-axis module (320) for driving the rotary table mechanism (310) to move along the X-axis direction to a first inspection station or a second inspection station. When the rotary table mechanism (310) is at the first inspection station, the clamping device (100) is located directly above the rotary table mechanism (310). The second detection device (400) is located at the second detection station; The rotary table mechanism (310), the vision mechanism (210), and the clamping mechanism (110) are arranged sequentially from bottom to top along the Z-axis, and the rotary table mechanism (310) and the vision mechanism (210) are adapted to move along the X-axis direction so that the projections of the rotary table mechanism (310), the vision mechanism (210), and the clamping mechanism (110) in the Z-axis direction do not overlap.

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