Semiconductor device and manufacturing method thereof

Abstract

The invention discloses a bonding device and a bonding method, the bonding device comprises a bonding head, the pickup surface of the bonding head is provided with an adsorption device, and the adsorption device is used for picking up a first element; and the movable assembly is arranged on the pickup surface, the movable assembly is provided with a sensing device, the sensing device obtains the shape information of the first element to determine a bonding contact point on the first element, and the movable assembly acts on the bonding contact point to bond the first element to the second element. That is, in the application, the morphology information is determined by determining the acting force of the adsorption device on the first element, then the bonding contact point is determined, and then the first element and the second element are bonded by using the bonding contact point through the movable assembly, so that the formation of bubbles in the bonding process can be effectively avoided, and the yield of the semiconductor device is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a bonding apparatus and bonding method. Background Technology

[0002] In the manufacturing process of semiconductor devices, especially in the chip manufacturing process, bonding equipment is usually required to bond wafers to wafers, chips to chips, or chips to wafers.

[0003] In practice, the bonding process usually adopts planar bonding, which generally involves multiple contact points to begin bonding. This can easily lead to "air trapping," causing some gas to be unable to be blown out or cleaned out in time, thus forming bubbles and affecting the yield of semiconductor devices. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a bonding apparatus and bonding method that can effectively eliminate the problem of bubble formation during the bonding process and improve the yield of semiconductor devices.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a bonding device, comprising: a bonding head, wherein the picking surface of the bonding head is provided with an adsorption device for picking up a first element; and a movable component disposed on the picking surface, wherein the movable component is provided with a sensing device, the sensing device acquiring morphological information of the first element to determine a bonding contact point on the first element, and the movable component acting on the bonding contact point to bond the first element to a second element.

[0006] In some embodiments, the morphology information includes a bending stress diagram of the first element.

[0007] In some embodiments, the active component determines the force exerted by the active component on the bonding contact point based on the bending stress diagram.

[0008] In some embodiments, there are at least two adsorption devices, which form a first array; there are at least two movable components, which form a second array; the first array and the second array are staggered; each adsorption device is surrounded by a movable component; and each movable component is surrounded by an adsorption device.

[0009] In some embodiments, each of the active components is provided with the sensing device.

[0010] In some embodiments, the adsorption device is a vacuum adsorption device.

[0011] In some embodiments, the adsorption device gradually releases the first element when the active component acts on the bonding contact point.

[0012] To solve the above-mentioned technical problems, another technical solution adopted in this application is: providing a bonding method, comprising: picking up a first element using an adsorption device, the adsorption device being disposed on the picking surface of a bonding head; bonding the first element to a second element using a movable component disposed on the picking surface, wherein the movable component is provided with a sensing device, the sensing device acquiring morphological information of the first element to determine bonding contact points on the first element, and the movable component acting on the bonding contact points to bond the first element to the second element.

[0013] In some embodiments, the morphology information includes a bending stress diagram of the first element.

[0014] In some embodiments, the active component determines the force exerted by the active component on the bonding contact point based on the bending stress diagram.

[0015] Unlike current technologies, the bonding apparatus provided in this application includes: a bonding head, the pickup surface of which is provided with an adsorption device for picking up a first component; and a movable component disposed on the pickup surface, wherein the movable component is provided with a sensing device, the sensing device acquiring morphological information of the first component to determine bonding contact points on the first component, and the movable component acting on the bonding contact points to bond the first component to a second component. That is, in this application, the morphological information of the first component is determined by the sensing device, thereby determining the bonding contact points, and then the first and second components are bonded using the bonding contact points by the movable component. This effectively avoids the formation of bubbles during the bonding process, thereby improving the yield of semiconductor devices. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the structure of the first embodiment of the bonding device in this application; Figure 2 This is a schematic diagram of the structure of the second embodiment of the bonding device in this application; Figure 3 This is a schematic diagram of an embodiment of the adsorption device and movable components provided on the pickup surface in this application; Figure 4 This is a flowchart illustrating an embodiment of the bonding method in this application.

[0017] In the attached figures, there are bonding device 10, bonding head 100, adsorption device 110, moving component 200, sensing device 210, first element 20, second element 30, bonding contact point A, first bonding contact point A1, and second bonding contact point A2. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0019] The reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] The terms "first," "second," etc., used in this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0021] Furthermore, although the terms "first," "second," etc., are used repeatedly in this application to describe various data (or various components, or various applications, or various instructions, or various operations), these data (or components, applications, instructions, or operations) should not be limited by these terms. These terms are only used to distinguish one piece of data (or component, application, instruction, or operation) from another piece of data (or component, application, instruction, or operation). For example, first position information can be called second position information, and second position information can be called first position information; the only difference is the scope they encompass, but it does not depart from the scope of this application. First position information and second position information are both collections of various position and attitude information, but they are not the same collection of position and attitude information.

[0022] Current bonding equipment typically uses planar bonding during the bonding process, which usually involves multiple contact points to begin bonding. This can easily lead to "air trapping" at the bonding interface, preventing some gas from being blown out or cleaned in time. Consequently, bubbles form at the bonding interface, affecting the yield of semiconductor devices.

[0023] Therefore, a bonding device is provided that can effectively eliminate the problem of bubble formation during the bonding process and improve the yield of semiconductor devices.

[0024] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the first embodiment of the bonding device in this application.

[0025] like Figure 1 As shown, the bonding device 10 includes a bonding head 100 and a movable component 200; the picking surface of the bonding head 100 is provided with an adsorption device 110, which is used to pick up the first element 20; the movable component 200 is disposed on the picking surface, wherein the movable component 200 is provided with a sensing device 210, which acquires the morphological information of the first element 20 to determine the bonding contact point A on the first element 20, and the movable component 200 acts on the bonding contact point A to bond the first element 20 to the second element 30.

[0026] The bonding head 100 is a module used to pick up and bond the first element 20 to be bonded; the pickup surface is the side of the bonding head 100 close to the picked-up first element 20, for example, the contact surface between the bonding head 100 and the picked-up first element 20 is the pickup surface. It can be understood that the dashed box is also part of the bonding head 100; the adsorption device 110 is a module used to pick up the first element 20 to be bonded, for example, the adsorption device 110 is a vacuum adsorption device; the movable component 200 is a module used to bond the first element 20 and the second element 30; the first element 20 is the object picked up for bonding, such as a wafer or a chip; the second element 30 is the object used for bonding, such as a wafer or a chip; the sensing device 210 is a module used to acquire the morphology information of the first element 20; the bonding contact point A is the contact point on the first element 20 that contacts the movable component 200, and there can be at least one bonding contact point A; the morphology information includes the surface morphology and other related information of the first element 20.

[0027] Specifically, the picking surface of the bonding head 100 is provided with an adsorption device 110, and the movable component 200 is disposed on the picking surface of the bonding head 100. When the adsorption device 110 of the bonding head 100 is configured to pick up the first element 20 to be bonded, the movable component 200 contacts the picked-up first element 20 to be bonded. The movable component 200 is provided with a sensing device 210. When the adsorption device 110 of the bonding head 100 picks up the first element 20 to be bonded, the sensing device 210 senses the morphological information of the first element 20 according to the force exerted by the adsorption device 110 on the first element 20, and then determines the bonding contact point A on the first element 20. Thus, the movable component 200 can use the bonding contact point A to bond the first element 20 and the second element 30 together.

[0028] In some embodiments, the morphological information includes a bending stress diagram of the first element 20, wherein the bending stress diagram is a stress distribution diagram on the first element 20 when the adsorption device 110 acts on the first element 20, and the active component 200 determines the force exerted by the active component 200 on the bonding contact point A based on the bending stress diagram.

[0029] In this embodiment, the sensing device in the active component acquires the topographic information of the first element and then determines the bonding contact point. The active component then bonds the first element to the second element based on the bonding contact point, thereby improving the yield of the semiconductor device.

[0030] This application provides a second embodiment of the bonding device.

[0031] Please see Figure 2 , Figure 2 This is a schematic diagram of the structure of the second embodiment of the bonding device in this application.

[0032] like Figure 2 As shown, the bonding device 10 includes a bonding head 100 and a movable component 200. The picking surface of the bonding head 100 is provided with an adsorption device 110. There are at least two adsorption devices 110, and the at least two adsorption devices 110 form a first array. The movable component 200 is disposed on the picking surface. There are at least two movable components 200, and the at least two movable components 200 form a second array. Each movable component 200 is provided with a sensing device 210. When the multiple adsorption devices 110 of the bonding head 100 adsorb the first element 20, the sensing devices 210 in the multiple movable components 200 sense the morphological information of the first element 20 to determine the bonding contact point corresponding to each movable component 200 on the surface of the first element 20.

[0033] In one embodiment, the first element 20 includes a first region and a second region. The sensing device 210 determines a first bonding contact point A1 in the first region and a second bonding contact point A2 in the second region based on the morphology information of the first element 20. The morphology information includes bending stress diagrams of different regions of the first element 20 under the adsorption force of the adsorption device 110. The active component 200 applies a first force to the first bonding contact point A1 to bond the first element 20 located in the first region to the second element 30. Because the first element 20 located in the first region is bonded to the second element 30, the morphology information of the first element 20 located in the second region changes (e.g., changes in the bending stress diagram). The sensing device 210 determines the second bonding contact point A2 in the second region based on the morphology information change of the first element 20 located in the second region. The active component 200 applies a second force to the second bonding contact point A2 to bond the first element 20 located in the second region to the second element 30. After the active component 200 applies a first force to the first bonding contact point A1, or simultaneously the active component 200 applies a second force to the second bonding contact point A2, so that the first element 20 located in the first region and the second region are bonded to the second element 30 sequentially or simultaneously.

[0034] like Figure 3 As shown, Figure 3 This is a schematic diagram of an embodiment of the pickup surface provided with an adsorption device and a movable component in this application.

[0035] The first array includes at least two adsorption devices 110, arranged in an array according to a first rule on the pickup surface of the bonding head 100. The second array includes at least two movable components 200, arranged in an array according to a second rule on the pickup surface of the bonding head 100. The first array and the second array are staggered. Each adsorption device 110 is surrounded by a movable component 200, and each movable component 200 is surrounded by an adsorption device 110.

[0036] In this embodiment, multiple active components are distributed on the pickup surface of the bonding head. When the bonding head's adsorption device adsorbs the first element, the morphological information of the first element can be accurately determined by the force between all the active components and the first element, thereby obtaining the bonding contact points corresponding to different active components.

[0037] This application also provides a bonding method.

[0038] Please see Figure 4 , Figure 4 This is a flowchart illustrating an embodiment of the bonding method in this application.

[0039] like Figure 4 As shown, the bonding method includes the following operations: S10. The first element is picked up using an adsorption device, which is set on the picking surface of the bonding head.

[0040] Specifically, the adsorption device 110, which is disposed on the pick-up surface of the bonding head 100, picks up the first element.

[0041] S20. A first element is bonded to a second element using a movable component disposed on a pickup surface; wherein the movable component is provided with a sensing device, the sensing device acquires the morphological information of the first element to determine the bonding contact point on the first element, and the movable component acts on the bonding contact point to bond the first element to the second element.

[0042] Specifically, when bonding is required, the adsorption device 110 of the bonding head 100 picks up the first element 20 to be bonded, and the movable component 200 on the pickup surface of the bonding head 100 contacts the adsorbed first element 20. After the movable component 200 contacts the first element 20, the sensing device 210 provided in the movable component 200 senses the force corresponding to the force exerted by the adsorption device 110 on the first element, and then determines the morphological information of the first element 20 based on the force, and further determines the optimal bonding contact point A of the first element 20 based on the morphological information. After the adsorption device 110 of the bonding head 100 adsorbs the first element 20 to be bonded and obtains the bonding contact point A on the first element 20, the movable component 200 bonds the first element 20 to the second element 30 based on the bonding contact point A.

[0043] In this embodiment, when the adsorption device adsorbs the first element to be bonded, the sensing device in the active component senses the morphological information of the first element and determines the optimal bonding contact point. The active component then bonds the first element to the second element based on the bonding contact point, avoiding the generation of bubbles and thus improving the yield of semiconductor devices.

[0044] In the several embodiments provided in this application, it should be understood that the disclosed systems and devices can be implemented in other ways. For example, the system implementations described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0045] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A bonding apparatus characterized by comprising: The bonding device comprises: a bonding head, a pickup surface of the bonding head is provided with an adsorption device for picking up a first component; a movable assembly provided on the pickup surface, wherein the movable assembly is provided with a sensing device that acquires topographic information of the first component to determine a bonding contact point on the first component, and the movable assembly acts on the bonding contact point to bond the first component to a second component.

2. The bonding device according to claim 1, wherein the topographic information comprises a bending stress map of the first component.

3. The bonding device according to claim 2, wherein the movable assembly determines an acting force of the movable assembly on the bonding contact point according to the bending stress map.

4. The bonding device according to claim 1, wherein the adsorption device is at least two, the at least two adsorption devices form a first array, the movable assembly is at least two, the at least two movable assemblies form a second array, the first array and the second array are arranged in a staggered manner, each adsorption device is surrounded by the movable assembly, and each movable assembly is surrounded by the adsorption device.

5. The bonding apparatus according to claim 4, wherein each movable assembly is provided with the sensing device.

6. The bonding device according to claim 1, wherein the adsorption device is a vacuum adsorption device.

7. The bonding device according to claim 1, wherein the adsorption device gradually releases the first component when the movable assembly acts on the bonding contact point.

8. A bonding method characterized by, The bonding device comprises: picking up a first component by using an adsorption device, the adsorption device being provided on a pickup surface of a bonding head; bonding the first component to a second component by using a movable assembly provided on the pickup surface, wherein the movable assembly is provided with a sensing device that acquires topographic information of the first component to determine a bonding contact point on the first component, and the movable assembly acts on the bonding contact point to bond the first component to the second component.

9. The bonding method according to claim 8, wherein the topographic information comprises a bending stress map of the first component.

10. The bonding method according to claim 9, wherein the movable assembly determines an acting force of the movable assembly on the bonding contact point according to the bending stress map.

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