Anti-glare surface with wear resistance properties

Abstract

Described herein is a textured article comprising a substrate comprising a textured region defined on a major surface of the substrate wherein the textured region comprises: (a) a Vmp / Sq of at least 0.084; (b) a Vmp / Sq of at least 0.084 and a Smrk2 of at least 90%; and / or (c) a Vmp of at least 10 nm and an Sdq of from 0 to 0.1. The textured articles generally have good wear resistance and optical properties, including anti-glare, haze, flash point, and image clarity. Also described herein is a method for manufacturing a textured article, the method comprising: removing a first portion of a major surface of a substrate by penetrating a stop layer to a hole of the major surface to form a seed recess and an unremoved portion; the stop layer is removed; and then removing a second portion of the major surface, the second portion including the seed recess and the unremoved portion.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 530,581, filed August 3, 2023, the contents of which are incorporated herein by reference in their entirety for all purposes. Technical Field

[0003] This disclosure generally relates to textured articles, and more specifically to textured articles having desired structural and optical properties, including abrasion resistance, anti-glare, image sharpness, flash point and / or haze. Background Technology

[0004] The consumer electronics and automotive markets require products with anti-glare properties. To achieve this effect, the surface of the product (such as a cover glass) is typically roughened to scatter reflected light from bright scenes away from the mirror direction. A widely used glass roughening process is sandblast-and-HF-etch (SBE), which produces a low-image-resolution surface with a reasonable flash point (PPD). However, such anti-glare surfaces are easily damaged by scratches, especially in high-touch applications such as laptops, tablets, and smartphones, due to the presence of fingerprint debris that leads to scratches and the lack of suitable surface structures to mitigate them.

[0005] Therefore, there is a need in the art for articles having desired properties, as well as methods of manufacturing and using them. This disclosure is intended to achieve the above and other objectives. Summary of the Invention

[0006] In various respects, this disclosure relates to a textured article comprising a substrate including a textured region defined on a main surface of the substrate, wherein the textured region includes a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012.

[0007] In various respects, this disclosure relates to a textured article comprising a substrate including a textured region defined on a main surface of the substrate, wherein the textured region includes a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012 and a Smrk2 of at least 90% as measured according to ISO 25178-2:2021.

[0008] In various respects, this disclosure relates to a textured article comprising a substrate including a textured region defined on a main surface of the substrate, wherein the textured region includes a Vmp of at least 10 nm as measured according to ISO 25178-2:2012 and an Sdq of 0-0.1 as measured according to ISO 25178-2:201.

[0009] In various aspects, this disclosure relates to a method for manufacturing a textured article, the method comprising: providing a substrate having a stop layer disposed on a main surface of the substrate, the stop layer having randomly distributed holes penetrating into the main surface; a first removal step comprising removing a first portion of the main surface through the holes of the stop layer to form seed depressions in the main surface and an unremoved portion of the main surface beneath the stop layer; a second removal step comprising removing the stop layer to expose the unremoved portion of the main surface beneath the stop layer; and a third removal step comprising removing a second portion of the main surface substrate to provide a textured region on the main surface, the second portion including the seed depressions and the unremoved portion of the main surface.

[0010] In various aspects, this disclosure relates to a textured article comprising a substrate including a textured region defined on a main surface of the substrate, wherein the textured region comprises: (a) at least 0.084 Vmp / Sq; (b) at least 0.084 Vmp / Sq and at least 90% Smrk2; and / or (c) at least 10 nm Vmp and 0-0.1 Sdq. In some aspects, the textured article generally exhibits good abrasion resistance and optical properties, including anti-glare, haze, flash point, and image sharpness. In various aspects, this disclosure also relates to a method for manufacturing a textured article, the method comprising: removing a first portion of the main surface by means of a hole penetrating a stop layer to the main surface of the substrate to form a seed depression and an unremoved portion; removing the stop layer; and then removing a second portion of the main surface, the second portion comprising the seed depression and the unremoved portion.

[0011] Further features and advantages of this disclosure will be set forth in the detailed description below, and will be apparent in part from the description or learned by practice of the methods described herein (including the detailed description below, the claims, and the drawings).

[0012] It should be understood that the foregoing general description and the following detailed description are merely exemplary and intended to provide an overview or framework for understanding the nature and characteristics of the claims. Drawings are included to provide a further understanding of this disclosure and are incorporated in and form a part of this specification. The drawings illustrate various aspects of this disclosure and, together with the description, serve to explain the principles and operation of those aspects. Attached Figure Description

[0013] The following detailed description can be further understood when read in conjunction with the accompanying drawings. Where possible, the same reference numerals will be used throughout the drawings to refer to the same or similar parts. It should be understood that the drawings are not drawn to scale, and the size of each depicted part or the relative size of one part to another is not intended to be limiting.

[0014] Figure 1A The scatter plot of Sdq versus Vmp is measured on the textured areas of a substrate of a textured article consistent with the disclosure herein (“Example”) and a comparative substrate (“Comparative Process”).

[0015] Figure 1B It shows Figure 1A The scatter plot of Sdq against Vmp in the first magnified region.

[0016] Figure 1C It shows Figure 1A The scatter plot of Sdq against Vmp in the second magnified region.

[0017] Figure 1D It only shows Figure 1A The example is a scatter plot of Sdq against Vmp, where the comparison process data points have been removed.

[0018] Figure 1E It only shows Figure 1A The scatter plot of Sdq versus Vmp for the comparative process samples is shown, with example data points removed.

[0019] Figure 1F It shows Figure 1E The scatter plot of Sdq against Vmp in the magnified region.

[0020] Figure 2 It only shows Figure 1A Scatter plot of Sdq versus Vmp for comparison process #1 sample, the sample being subdivided by substrate type.

[0021] Figure 3 It only shows Figure 1A Scatter plot of Sdq versus Vmp for comparison process #2 sample, the sample being subdivided by substrate type.

[0022] Figure 4A It only shows Figure 1A Scatter plot of Sdq versus Vmp for comparison process #3 sample, the sample being subdivided by substrate type.

[0023] Figure 4B It shows Figure 4A The scatter plot of Sdq against Vmp in the magnified region.

[0024] Figure 5 It only shows Figure 1A Scatter plot of Sdq versus Vmp for comparison process #4 sample, the sample being subdivided by substrate type.

[0025] Figure 6 It only shows Figure 1A Scatter plot of Sdq versus Vmp for comparison process #5 sample, the samples being subdivided by substrate type.

[0026] Figure 7A The scatter plot of Smrk2 versus Vmp / Sq is measured on the textured areas of a substrate of a textured article consistent with the disclosure herein (“Example”) and a comparative substrate (“Comparative Process”).

[0027] Figure 7B It shows Figure 7A The first magnified region is a scatter plot of Smrk2 against Vmp / Sq.

[0028] Figure 7C It shows Figure 7A The scatter plot of Smrk2 against Vmp / Sq in the second magnified region.

[0029] Figure 7D It only shows Figure 7A The example is a scatter plot of Smrk2 against Vmp / Sq, where the comparison process data points have been removed.

[0030] Figure 7E It shows Figure 7D Scatter plot of Smrk2 versus Vmp / Sq in the magnified region.

[0031] Figure 7F It only shows Figure 7A Scatter plots of Smrk2 versus Vmp / Sq for comparative process samples, with example data points removed.

[0032] Figure 7G It shows Figure 7F Scatter plot of Smrk2 versus Vmp / Sq in the magnified region.

[0033] Figure 8 It only shows Figure 7AScatter plot of Smrk2 versus Vmp / Sq for comparison process #1 sample, the samples being subdivided by substrate type.

[0034] Figure 9 It only shows Figure 7A Scatter plot of Smrk2 versus Vmp / Sq for comparison process #2 sample, the sample being subdivided by substrate type.

[0035] Figure 10A It only shows Figure 7A Scatter plot of Smrk2 versus Vmp / Sq for comparison process #3 sample, the samples being subdivided by substrate type.

[0036] Figure 10B It shows Figure 10A Scatter plot of Smrk2 versus Vmp / Sq in the magnified region.

[0037] Figure 11 It only shows Figure 7A Scatter plot of Smrk2 versus Vmp / Sq for comparison process #4 sample, the samples being subdivided by substrate type.

[0038] Figure 12 It only shows Figure 7A Scatter plot of Smrk2 versus Vmp / Sq for comparison process #5 sample, the samples being subdivided by substrate type.

[0039] Figure 13 This is a scatter plot of Sdq versus Vmp of an anti-glare textured article (example) produced based on the disclosure in this article.

[0040] Figures 14A-14B Scatter plots of PPD140 versus uncoupled DOI and haze versus uncoupled DOI for an anti-glare textured article (example) produced according to the disclosure herein are shown. "x" indicates... Figure 14A -B contains the same sample, and "o" is in Figure 14A -B is the same sample, which demonstrates the versatility of the process disclosed herein in producing textured articles with desired optical and abrasion-resistant properties.

[0041] Figure 15 It is a process flow diagram that describes, in some respects, the method steps for producing textured articles based on the disclosure herein.

[0042] Figure 16 It is a schematic diagram illustrating, in some respects, the method steps for producing textured articles based on the disclosure herein.

[0043] Figure 17AThese are scanning electron microscopy (SEM) images taken after wear testing on a comparative substrate prepared using comparative process #3 (i.e., sandblasting-etching). SEM parameters are as follows: CS Gemini 450; WED = 20.0 mm; EHT = 5.00 kV; Magnification = 2.50 KX; Signal A = SE2; Vacuum mode = High vacuum; Scale bar = 4 µm.

[0044] Figure 17B Is with Figure 17A Scanning electron microscopy (SEM) images of the same comparative substrate. SEM parameters are as follows: CSGemini 450; WD = 19.5 mm; EHT = 5.00 kV; magnification = 1.50 KX; signal A = SE2; vacuum mode = high vacuum; scale bar = 10 µm.

[0045] Figure 17C Is with Figures 17A-17B Microscopic images of the same comparative substrate. Scale bar: 25 μm.

[0046] Figure 17D These are microscopic images of textured artifacts prepared according to the disclosure herein. Scale bar: 25 μm. Detailed Implementation

[0047] In the following description, whenever a group is described as comprising at least one of a group of elements and combinations thereof, it should be understood that the group may comprise, substantially comprise, or consist of any number of those stated elements, individually or in combination with each other. Similarly, whenever a group is described as comprising at least one of a group of elements or combinations thereof, it should be understood that the group may consist of any number of those stated elements, individually or in combination with each other.

[0048] Where numerical ranges including upper and lower limits are described herein, unless otherwise stated in specific circumstances, the ranges are intended to include their endpoints, as well as all integers and fractions within the range. Furthermore, when a quantity, concentration, or other value or parameter is given in the form of a range, one or more ranges, or a list of upper and lower limits, this should be understood as specifically disclosing all ranges formed by any pair of any upper limit or value and any lower limit or value, regardless of whether such pairs are disclosed individually.

[0049] When the term “about” is used to describe a range of values ​​or endpoints, this disclosure should be understood to include the specific values ​​or endpoints mentioned. As used herein, the term “about” means that a quantity, size, formulation, parameter, and other quantity and characteristic is not and does not need to be precise, but may be approximate and / or larger or smaller as required, reflecting tolerances, conversion factors, rounding, measurement errors, and other factors known to those skilled in the art. It should be noted that the term “substantially” can be used herein to indicate the degree of inherent uncertainty attributable to any quantitative comparison, value, measurement result, or other representation.

[0050] “Transmitted haze” and “haze” are used interchangeably to refer to the percentage of transmitted light scattered outside a pyramid at approximately ±2.5° according to the following reference: ASTM (American Society for Testing and Materials) D1003-21, entitled “Standard Test Method for Haze and Luminous Transmittance of Transparent Plastics,” the contents of which are incorporated herein by reference in their entirety. For optically smooth surfaces, transmitted haze is generally close to zero. High haze levels are typically associated with reduced display resolution or contrast due to high levels of scattering in reflections. However, some applications may require different levels of haze, including high or low haze, and the methods disclosed herein can produce textured articles with different haze levels as described herein. Depending on some aspects, the haze of the textured articles disclosed herein may be less than 70%, less than 10%, or any other haze value disclosed elsewhere herein.

[0051] “Transmittance” is defined as the percentage of incident light power transmitted through a material (e.g., an article, substrate, or optical film or portion thereof) within a given wavelength range. The terms “transmittance” and “transmission” are used interchangeably herein and have no difference in meaning unless the context clearly indicates otherwise. Unless otherwise specified, all transmittance values ​​herein were measured using BYK Haze Gard with CIE Standard Light Source A as the light source.

[0052] The terms "flash" and "dazzle" are used interchangeably to refer to optical effects at least in part caused by surface roughening. Display "flash" is typically (but not always) an undesirable negative effect that can occur when introducing anti-glare or light-scattering surfaces in pixelated display systems (e.g., LCD, OLED, touchscreens, etc.) and differs in type and cause from the types of "flash" or "spots" observed and characterized in projection or laser systems. Flash is associated with the very fine granular appearance of the display and may appear to shift within the pattern of particles as the viewing angle changes. Display flash can manifest as bright and dark spots or colored spots at a scale of approximately pixel size. This effect arises from pixel focusing and defocusing caused by surface depressions, micro-bumps, or protrusions that act as microlenses. It is typically measured using pixel power deviation (PPD). 140 Quantification can be performed using "flash point". In this regard, "flash point" can be compared with "pixel power deviation" and "PPD". 140 "Use interchangeably. PPD" 140 The power is calculated by performing image analysis on the display pixels according to the following procedure: A grid frame is drawn around each LCD pixel. The total power within each grid frame is then calculated based on charge-coupled device (CCD) camera data, and this total power is assigned to the total power of each pixel. Therefore, the total power of each LCD pixel becomes an array, and the average and standard deviation of this array can be calculated. (PPD) 140 The value is defined as the total power of each pixel divided by the standard deviation of the average power of each pixel (multiplied by 100). The total power collected from each LCD pixel via an eye simulator camera is measured, and the standard deviation (PPD) of the total pixel power is calculated across the measurement area. 140 The measurement area typically comprises approximately 30x30 LCD pixels. This is used to obtain PPD. 140 Details of the measurement system and image processing calculations for the values ​​are described in U.S. Patent No. 9,411,180, entitled "Apparatus and Method for Determining Sparkle," the essential portions of which relating to PPD measurement are incorporated herein by reference in their entirety. Furthermore, unless otherwise stated, the SMS-1000 system (Display-Messtechnik & Systeme GmbH & Co. KG) is used to generate and evaluate the PPD values ​​of this disclosure. 140 Measurement results. PPD 140The measurement system includes: a pixelated source comprising a plurality of pixels (e.g., a Lenovo Z50 140 ppi laptop), each of which has reference indices i and j; and an imaging system optically disposed along an optical path originating from the pixelated source. The imaging system includes: an imaging device disposed along the optical path and having a pixelated sensitive region comprising a second plurality of pixels, each of which is referenced by indices m and n; and an aperture disposed in the optical path between the pixelated source and the imaging device, wherein the aperture has an adjustable collection angle for an image originating from the pixelated source. Image processing computation includes: acquiring a pixelated image of a transparent sample, the pixelated image comprising a plurality of pixels; determining the boundaries between adjacent pixels in the pixelated image; integrating within the boundaries to obtain the integrated energy of each source pixel in the pixelated image; and calculating the standard deviation of the integrated energy of each source pixel, where the standard deviation is the power dispersion of each pixel. As used herein, all “PPD”... 140 The "flash point" value, attributes, and limits are all calculated and evaluated using a testing apparatus that employs a display device with a pixel density of 140 pixels per inch (PPI) (also referred to herein as "PPD"). 140 ", such as when measured at an incident angle of 0 degrees.

[0053] "Image sharpness" or "DOI" is measured according to ASTM D5767-18, entitled "Standard Test Method for Instrumental Measurement of Image Sharpness (DOI) Gloss of Coated Surfaces Using the Rhopoint IQ Gloss, Haze and DOI Meter (Rhopoint Instruments Ltd. Standard Test Method for Instrumental Measurement of Image Sharpness (DOI) Gloss of Coated Surfaces"), and is a measure of the degree of blurring of the reflected image of a rough surface. DOI can be derived by calculating the ratio of the intensity of light reflected from a rough surface at a deviation of ±0.3° from the specular direction to the specular reflectivity. DOI values ​​can be measured in either "coupled" or "uncoupled" mode. For example, in "coupled" mode, DOI changes significantly when the sample is coupled to an absorbing material block to prevent back reflection using a refractive index-matched fluid such as baby oil. There is a correlation between coupled and uncoupled values, such that if one value is provided, the other can be calculated. Unless otherwise stated, DOI is measured and reported herein as an "uncoupled" value.

[0054] “Vmp”, “Sq”, “Smrk2”, and “Sdq” are surface structural properties. Vmp, Sq, and Sdq are measured according to ISO (International Organization for Standardization) 25178-2:2012, and Smrk2 is measured according to ISO 25178-2:2021. Unless otherwise stated, all such values ​​reported herein are obtained using Zygo NewView. TM A surface profilometer is used to analyze and measure surfaces, and it is used with MountainsMap. TM The values ​​are calculated by software, but any commercially available surface profilometer and software can measure and calculate Vmp, Sq, Smrk2, and Sdq. Vmp / Sq can be calculated by division.

[0055] "Vmp" stands for "peak material volume" and is considered an indicator of wear resistance when one does not wish to be bound by theory, as it represents the volume of material exceeding 10% surface coverage. According to polishing theory, the applied frictional energy (normal force * COF * sliding distance) corresponds to the volume of surface material removed. Assuming that the higher the surface micro-protrusions are the contacting surfaces, a higher Vmp indicates that a greater amount of frictional energy is required to wear the surface down to 10% of the material ratio.

[0056] “Sq” stands for “Root Mean Square Height of Surface”, and is a commonly used parameter to describe the height or amplitude of a surface. It helps to represent a holistic measure of texture on a surface and is equivalent to the standard deviation of the surface’s height distribution.

[0057] “Vmp / Sq” is calculated by dividing Vmp by Sq.

[0058] “Smrk2”, also known as “Smr2”, is the “surface bearing area ratio”, and is typically a percentage of the measured area of ​​the deeper valley structures of a textured surface, and is associated with another surface parameter, Svk (see ISO 25178-2:2021). More technically, it is typically the material ratio (Smr) along the material ratio curve at the height represented by Svk.

[0059] "Sdq" stands for "root mean square gradient of the surface" and is considered an indicator of wear without being bound by theory, as it is related to the slope or gradient of the textured surface, with higher slopes experiencing greater wear severity due to higher contact pressure. This higher pressure caused by lateral forces can generally result in a higher nominal coefficient of friction (COF) for surfaces with a higher Sdq.

[0060] The "average maximum lateral dimension" of a depression means the average maximum dimension of the depression in a direction parallel to the main surface of the substrate that includes the textured region. The average value is typically automatically calculated using commercial software associated with a surface analysis instrument. The instrument / software sums the maximum lateral dimensions of a representative number of depressions and then divides the sum by the total number of depressions in the representative sample.

[0061] The "average maximum depth" of a depression means the average maximum depth of the depression in a direction perpendicular to the main surface of the substrate that includes the textured region. The average value is typically automatically calculated using commercial software associated with a surface analysis instrument. The instrument / software sums the maximum depths of a representative number of depressions and then divides the sum by the total number of depressions in the representative sample.

[0062] The terms "random", "randomly", or similar terms regarding the arrangement of depressions on a textured surface or pinholes in a photomask can include a truly random arrangement or a pseudo-random arrangement. For example, a truly random arrangement can be based on a randomization process that relies on the randomness inherent in noise from a noise generator or atmospheric pressure fluctuations. A pseudo-random arrangement can be based on, for example, a mathematical sequence and / or depend on user selection aimed at arranging random depressions. For example, "random" should be distinguished from an ordered arrangement of depressions, such as in the form of a grid and / or lines.

[0063] Consumer electronics and automotive markets require articles with anti-glare properties. To produce an anti-glare effect, the surface of an article (such as a cover glass) is typically roughened so that reflected light from a bright scene is scattered away from the specular direction. A widely used glass roughening process is sandblast-HF etching (SBE), which can produce a low image clarity surface with a reasonable peak power density (PPD). However, such anti-glare surfaces are easily damaged by scratches, especially when used in high-touch applications such as laptops, tablets, and smartphones, due to the presence of fingerprint debris that causes scratches and the lack of a suitable surface structure to mitigate scratches.

[0064] The textured articles disclosed herein include a unique surface structure characterized by Vmp, Sq, Vmp / Sq, Smrk2, Sq, or any combination thereof. In some aspects, the textured articles have abrasion resistance while having desired optical properties such as anti-glare, image clarity, peak power density, transmittance, and / or haze. For example, the figures herein (including Figures 1-12) illustrate the unique structural properties of the textured articles disclosed herein compared to several known anti-glare surfaces.

[0065] In some aspects, the textured articles disclosed herein are fabricated using photolithography and surface removal (e.g., etching) processes and are resistant to scratches caused by small particle abrasion. In some aspects, the size, roughness, and density of the surface features are also designed to provide good anti-glare properties to meet industry requirements. In some aspects, the textured articles disclosed herein include randomly arranged depressions (or pits) having smooth edges / walls and valleys of equal or substantially similar depth.

[0066] Without being bound by theory, it is assumed that the textured articles disclosed herein possess good abrasion resistance, at least in part, due to the structural features and / or manufacturing methods described herein, particularly compared to textured articles prepared using known processes such as SBE. For example, in SBE, abrasive grains are bombarded against a substrate surface, creating pits and / or cracks of varying depths, including relatively deep pits / cracks resulting from further bombardment of the initially formed pits / cracks by additional abrasive grains. When such pits, particularly relatively deep ones / cracks, are subsequently etched, the resulting depressions may have steep walls (i.e., high slope). When such surfaces with steeply walled depressions are used in high-touch applications (such as touchscreen displays on mobile phones or tablets), debris (e.g., small abrasive particles such as dust, dirt, sand, etc.) present on the surface or on the user's fingertips or stylus can move across the surface. When such debris comes into contact with the high-slope walls of the depression, the angle of contact between the debris and the wall results in a larger force component pointing more perpendicularly to the wall surface compared to cases where the wall has a lower slope, thus causing abrasive damage. In contrast, the textured articles disclosed herein typically have walls with a lower slope, at least in part because the surface structure is produced by the manufacturing method described herein. As described elsewhere herein, pinholes through a stop layer on the substrate surface are used to create seed depressions via a removal step (e.g., chemical etching). The stop layer is then removed, and the substrate surface undergoes further removal steps (e.g., chemical etching). Compared to processes such as SBE, this process typically produces a surface structure with a relatively uniform depth, and the depth can be controlled to give the surface desired structural features (e.g., walls with a lower slope and other structural features represented by Vmp, Sdq, Sq, Vmp / Sq, Smrk2, etc.). When debris is moved across such a surface, for example, with a fingertip, these structural features cause the debris to contact the structure with a smaller force component perpendicular to the wall surface, compared to other types of anti-glare surfaces (e.g., prepared by SBE), thus imparting abrasion resistance. Furthermore, such abrasion-resistant textured articles still possess desired optical properties such as anti-glare, DOI, haze, transmittance, and PPD. 140 The optical properties can be adjusted as needed, as illustrated in the examples herein.

[0067] In some aspects, a textured article is disclosed, comprising a substrate including a textured region defined on a main surface of the substrate. The textured region of such a textured article may have any of the structural and / or optical properties disclosed herein.

[0068] In some respects, the textured artifacts herein include textured regions having any one or more of Vmp, Sq, Vmp / Sq, Smrk2, and Sdq. For example, any combination thereof can be formed, including Vmp / Sq and Smrk2, and Vmp and Sdq. Other combinations are also considered, such as Vmp and Smrk2; Sq and Smrk2; Sq and Smrk2; Sq and Sdq; Vmp, Sq and Smrk2; Vmp / Sq, Sdq and Smrk2; etc.

[0069] In some aspects, a textured article is disclosed, the textured article comprising a substrate, the substrate including a textured region defined on a main surface of the substrate, wherein the textured region includes the following as measured according to ISO 25178-2:2012 (Vmp, Sq, Sdq) or ISO 25178-2:2021 (Smrk2):

[0070] (a) At least 0.084 Vmp / Sq;

[0071] (b) At least 0.09 Vmp / Sq;

[0072] (c) Sdq of 0-0.1 and Vmp of at least 10 nm;

[0073] (d) Sdq of 0-0.1 and Vmp of at least 14 nm;

[0074] (e) Sdq of at least 0.0045 and 0.1 or less, and Vmp of at least 10 nm;

[0075] (f) Sdq of at least 0.0045 and 0.1 or less, and Vmp of at least 14 nm;

[0076] (g) At least 90% of Smrk2, and at least 0.084 Vmp / Sq;

[0077] (h) At least 92% of Smrk2, and at least 0.084 Vmp / Sq;

[0078] (i) Density of 0.005-0.015 indentations / µm 2 The depression;

[0079] (j) Depressions with an average maximum lateral dimension between 5 and 50 micrometers;

[0080] (k) Depressions with an average maximum depth of 15-2500 nm;

[0081] (l) Indentations having an average maximum depth, wherein at least 90% of the indentations have a maximum depth within 10% of the average maximum depth; or

[0082] (m) Any combination thereof.

[0083] In some respects, any such textured article having a textured region characterized by any one or more of (a)-(m) above or any other Vmp, Sq, Vmp / Sq, Sdq and / or Smrk2 disclosed elsewhere herein has any one or more of the following optical properties:

[0084] (1) 3.7% or less PPD at an incident angle of 0 degrees 140 ;

[0085] (2) 3.5% or less PPD at an incident angle of 0 degrees 140 ;

[0086] (3) 3% or less PPD at an incident angle of 0 degrees 140 ;

[0087] (4) 80% or less of the uncoupled DOI as measured according to ASTM D 5767-18;

[0088] (5) Uncoupled DOI of 60% or less as measured according to ASTM D 5767-18;

[0089] (6) Haze of 70% or less as measured according to ASTM D 1003-21;

[0090] (7) Haze of 45% or less as measured according to ASTM D 1003-21;

[0091] (8) Haze of 10% or less as measured according to ASTM D 1003-21;

[0092] (9) PPD of 3.7% or less (or 3.5% or less) at an incident angle of 0 degrees. 140 Uncoupled DOI of 80% or less as measured according to ASTM D 5767-18, and haze of 10% or less as measured according to ASTM D 1003-21;

[0093] (10) PPD of 3.5% or less (or 3% or less) at an incident angle of 0 degrees. 140Uncoupled DOI of 60% or less as measured according to ASTM D 5767-18, and haze of 70% or less (or 45% or less) as measured according to ASTM D 1003-21;

[0094] (11) At least 90% transmittance; or

[0095] (12) Any combination thereof.

[0096] In some respects, the textured region of a textured article can have any suitable Vmp / Sq. In some respects, Vmp / Sq can be at least: 0.084, 0.085, 0.09, 0.095, 0.1, 0.105, 0.11, 0.115, 0.12, 0.125, 0.13, 0.135, 0.14, 0.145, or 0.15; alternatively or additionally, Vmp / Sq can be: 0.15, 0.145, 0.14, 0.135, 0.13, 0.125, 0.12, 0.115, 0.11, 0.105, 0.1, 0.095, 0.09, 0.085, or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, Vmp / Sq is 0.084-0.15, 0.084-0.145, 0.084-0.14, 0.084-0.135, 0.084-0.13, 0.084-0.125, 0.084-0.12, 0.084-0.115, 0.084-0.11, 0.084-0.105, 0.084-0.1, 0.084-0.095, 0.084-0.09, 0.084-0.085, 0.085-0 0.15, 0.085-0.145, 0.085-0.14, 0.085-0.135, 0.085-0.13, 0.085-0.125, 0.085-0.12, 0.085-0.115, 0.085-0.11, 0.085-0.105, 0.085-0.1, 0.085-0.095, 0.085-0.09, 0.09-0.15, 0.09-0.145, 0.09-0.14, 0.09-0.135, 0 0.09-0.13, 0.09-0.125, 0.09-0.12, 0.09-0.115, 0.09-0.11, 0.09-0.105, 0.09-0.1, 0.09-0.095, 0.095-0.15, 0.095-0.145, 0.095-0.14, 0.095-0.135, 0.095-0.13, 0.095-0.125, 0.095-0.12, 0.095-0.115, 0.095-0.1 1, 0.095-0.105, 0.095-0.1, 0.1-0.15, 0.1-0.145, 0.1-0.14, 0.1-0.135, 0.1-0.13, 0.1-0.125, 0.1-0.12, 0.1-0.115, 0.1-0.11, 0.1-0.105, 0.105-0.15, 0.105-0.145, 0.105-0.14, 0.105-0.135, 0.105-0.13, 0.105-0.125, 0.105-0.12, 0.105-0.115, 0.105-0.11, 0.11-0.15, 0.11-0.145, 0.11-0.14, 0.11-0.135, 0.11-0.13, 0.11-0.125, 0.11-0.12, 0.11-0.115, 0.115-0.15, 0.115-0.145, 0.115-0.14, 0.115-0.135, 0.115-0.13, 0.115-0.125, 0.115-0.12, 0.12-0.15, 0.1 2-0.145, 0.12-0.14, 0.12-0.135, 0.12-0.13, 0.12-0.125, 0.125-0.15, 0.125-0.145, 0.125-0.14, 0.125-0.135, 0.125-0.13, 0.13-0.15, 0.13-0.145, 0.13-0.135, 0.135-0.15, 0.135-0.145, 0.135-0.14, 0.14-0.15, 0.14-0.145 or 0.145-0.15. Upon specific consideration, Vmp / Sq can be combined with Smrk2 or any other feature or combination disclosed herein (e.g., Sq, Sdq, PPD). 140 The combination of uncoupled DOI, haze, transmittance, pit density, average maximum pit depth, average maximum lateral dimension of pit, X% of pits within Y% of average maximum depth, or any combination thereof.

[0097] In some respects, the textured area of ​​a textured article can have any suitable Smrk2. In some respects, Smrk2 can be at least: 68%, 70%, 75%, 80%, 85%, 90%, 92%, 94%, 96%, 98%, or 99%; alternatively or additionally, Smrk2 can be: 100%, 99%, 98%, 96%, 94%, 92%, 90%, 85%, 80%, 75%, or 70% or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, Smrk2 (%) can be 68-100, 68-99, 68-98, 68-96, 68-94, 68-92, 68-90, 68-85, 68-80, 68-75, 68-70, 70-100, 70-99, 70-98, 70-96, 70-94, 70-92, 70-90, 70-85, 70-80, 70-75, 75-100, 75-99, 75-98, 75-96, 75-94, 75-92, 75-90, 75-85, 75-80, 80-100, 80-9 9, 80-98, 80-96, 80-94, 80-92, 80-90, 80-85, 85-100, 85-999, 85-98, 85-96, 85-94, 85-92, 85-90, 90-100, 90-99, 90-98, 90-96, 90-94, 90-92, 92-100, 92-99, 92-98, 92-96, 92-94, 94-100, 94-99, 94-98, 94-96, 96-100, 96-99, 96-98, 98-100, 98-99 or 99-100. Upon careful consideration, Smrk2 can be used with Vmp / Sq or any other feature or combination thereof disclosed herein (e.g., Sq, Vmp, Sdq, PPD). 140 The combination of uncoupled DOI, haze, transmittance, pit density, average maximum pit depth, average maximum lateral dimension of pit, X% of pits within Y% of average maximum depth, or any combination thereof.

[0098] In some respects, the textured region of a textured article can have any suitable Vmp. In some respects, Vmp (nm) can be at least: 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, or 44; alternatively or additionally, Vmp (nm) can be: 46, 44, 42, 40, 38, 36, 34, 32, 30, 28, 26, 24, 22, 20, 18, 16, 14, 12, or 10 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, Vmp (nm) can be 8-46, 8-44, 8-42, 8-40, 8-38, 8-36, 8-34, 8-32, 8-30, 8-28, 8-26, 8-24, 8-22, 8-20, 8-18, 8-16, 8-14, 8-12, 8-10, 10-46, 10-44, 10-42, 10-40, 10-38, 10-36, 10-34, 10-32, 10-30, 10-28, 10-26, 10-24, 10-22, 10- 20, 10-18, 10-16, 10-14, 10-12, 12-46, 12-44, 12-42, 12-40, 12-38, 12-36, 12-34, 12-32, 12-30, 12-28, 12-26, 12-24, 12-22, 12-20, 12-18, 12-16, 12-14, 14-46, 14-44, 14-42, 14-40, 14-38, 14-36, 14-34, 14-32, 14-30, 14-28, 14-26 14-24, 14-22, 14-20, 14-18, 14-16, 16-46, 16-44, 16-42, 16-40, 16-38, 16-36, 16-34, 16-32, 16-30, 16-28, 16-26, 16-24, 16-22, 16-20, 16-18, 18-46, 18-44, 18-42, 18-40, 18-38, 18-36, 18-34, 18-32, 18-30, 18-28, 18-26, 18-24, 18- 22, 18-20, 20-46, 20-44, 20-42, 20-40, 20-38, 20-36, 20-34, 20-32, 20-30, 20-28, 20-26, 20-24, 20-22, 22-46, 22-44, 22-42, 22-40, 22-38, 22-36, 22-34, 22-32, 22-30, 22-28, 22-26, 22-24, 24-46, 24-44, 24-42, 24-40, 24-38, 24-36,24-34, 24-32, 24-30, 24-28, 24-26, 26-46, 26-44, 26-42, 26-40, 26-38, 26-36, 26-34, 26-32, 26-30, 26-28, 28-46, 28-44, 28-42, 28-40, 28-38, 28-36, 28-34, 28-32, 28-30, 30-46, 30-44, 30-42, 30-40, 30-38, 30-36 30-34, 30-32, 32-46, 32-44, 32-42, 32-40, 32-38, 32-36, 32-34, 34-46, 34-44, 34-42, 34-40, 34-38, 34-36, 36-46, 36-44, 36-42, 36-40, 36-38, 38-46, 38-44, 38-42, 38-40, 40-46, 40-44, 40-42, 42-46, 42-44, or 44-46. With specific consideration, Vmp can be combined with Sdq or any other feature or combination disclosed herein (e.g., Sq, Vmp / Sq, Smrk2, PPD, ...). 140 The combination of uncoupled DOI, haze, transmittance, pit density, average maximum pit depth, average maximum lateral dimension of pit, X% of pits within Y% of average maximum depth, or any combination thereof.

[0099] In some respects, the textured regions of a textured artifact can have any suitable Sdq. In some respects, Sdq can be at least: 0, 0.0045, 0.005, 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.06, 0.08, 0.09, 0.1, 0.11, 0.12, 0.13, 0.14, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, or 1; Alternatively or additionally, Sdq can be: 1, 0.9, 0.8, 0.7, 0.6, 0.5, 0.4, 0.35, 0.3, 0.25, 0.2, 0.15, 0.14, 0.13, 0.12, 0.11, 0.1, 0.09, 0.08, 0.07, 0.06, 0.05, 0.04, 0.03, 0.02, 0.01, 0.005, or 0.0045 or less. For clarity, any two of the above open ranges can be combined to form a closed range. For example, in some aspects, Sdq can be 0-1, 0-0.8, 0-0.6, 0-0.4, 0-0.35, 0-0.3, 0-0.25, 0-0.2, 0-0.15, 0-0.14, 0-0.13, 0-0.12, 0-0.11, 0-0.1, 0-0.09, 0-0.08, 0-0.07, 0-0.06, 0-0.05, 0-0.04, 0-0.03, 0-0.02 0-0.01, 0-0.005, 0-0.0045, 0.0045-1, 0.0045-0.8, 0.0045-0.6, 0.0045-0.4, 0.0045-0.35, 0.0045-0.3, 0.0045-0.25, 0.0045-0.2, 0.0045-0.15, 0.0045-0.14, 0.0045-0.13, 0.0045-0.12 0.0045-0.11, 0.0045-0.1, 0.0045-0.09, 0.0045-0.08, 0.0045-0.07, 0.0045-0.06, 0.0045-0.05, 0.0045-0.04, 0.0045-0.03, 0.0045-0.02, 0.0045-0.01, 0.0045-0.005, 0.005-1, 0.005-0 0.8, 0.005-0.6, 0.005-0.4, 0.005-0.35, 0.005-0.3, 0.005-0.25, 0.005-0.2, 0.005-0.15, 0.005-0.14, 0.005-0.13, 0.005-0.12, 0.005-0.11, 0.005-0.1, 0.005-0.09, 0.005-0.08, 0.005-0.07、0.005-0.06、0.005-0.05、0.005-0.04、0.005-0.03、0.005-0.02、0.005-0.01、0.01-1、0.01-0.8、0.01-0.6、0.01-0.4、0.01-0.35、0.01-0.3、0.01-0.35、0.01-0.3、0.01-0.25、0.01-0.2、0.01-0.15、0.01-0.14、0.01-0.13、0.01-0.12、0.01-0.11、0.01-0.1、0.01-0.09、0.01-0.08、0.01-0.07、0.01-0.06、0.01-0.05、0.01-0.04、0.01-0.03、0.01-0.02、0.02-1、0.02-0.8、0.02-0.6、0.02-0.4、0.02-0.35、0.02-0.3、0.02-0.25、0.02-0.2、0.02-0.15、0.02-0.1、0.02-0.09、0.02-0.08、0.02-.07、0.02-0.06、0.02-0.05、0.02-0.04、0.02-0.03、0.03-1、0.03-0.8、0.03-0.6、0.03-0.4、0.03-0.35、0.03-0.3、0.03-0.25、0.03-0.2、0.03-0.15、0.03-0.14、0.03-0.13、0.03-0.12、0.03-0.11、0.03-0.1、0.03-0.09、0.03-0.08、0.03-0.07、0.03-0.06、0.03-0.05、0.03-0.04、0.04-1、0.04-0.8、0.04-0.6、0.04-0.4、0.04-0.35、0.04-0.3、0.04-0.25、0.04-0.2、0.04-0.15、0.04-0.14、0.04-0.13、0.04-0.12、0.04-0.11、0.04-0.1、0.04-0.09、0.04-0.08、0.04-0.07、0.04-0.06、0.04-0.05、0.05-1、0.05-0.8、0.05-0.6、0.05-0.4、0.05-0.35、0.05-0.3、0.05-0.25、0.05-0.2、0.05-0.15、0.05-0.1、0.05-0.09、0.05-0.08、0.05-0.07、0.05-0.06、0.06-1、0.06-0.8、0.06-0.6、0.06-0.4、0.0.06-0.35, 0.06-0.3, 0.06-0.25, 0.06-0.2, 0.06-0.15, 0.06-0.1, 0.06-0.09, 0.06-0.08, 0.06-0.07, 0.07-1, 0.07-0.8, 0.07-0.6, 0.07-0.4, 0.07-0.35, 0.07-0.3, 0.07-0.25, 0.07-0.2, 0.07-0.15, 0.07-0.1, 0.07-0.09, 0.07-0.08, 0.0 8-1, 0.08-0.8, 0.08-0.6, 0.08-0.4, 0.08-0.35, 0.08-0.3, 0.08-0.25, 0.08-0.2, 0.08-0.15, 0.08-0.1, 0.08-0.09, 0.09-1, 0.09-0.8, 0.09-0.6, 0.09-0.4, 0.09-0.35, 0.09-0.3, 0.09-0.25, 0.09-0.2, 0.09-0.15, 0.09-0.14, 0.09-0.13 0.09-0.12, 0.09-0.11, 0.09-0.1, 0.1-1, 0.1-0.8, 0.1-0.6, 0.1-0.4, 0.1-0.35, 0.1-0.3, 0.1-0.25, 0.1-0.2, 0.1-0.15, 0.15-1, 0.15-0.8, 0.15-0.6, 0.15-0.4, 0.15-0.35, 0.15-0.3, 0.15-0.25, 0.15-0.2, 0.2-1, 0.2-0.8, 0.2-0.6, 0. 2-0.4, 0.2-0.35, 0.2-0.3, 0.2-0.25, 0.25-1, 0.25-0.8, 0.25-0.6, 0.25-0.4, 0.25-0.35, 0.25-0.3, 0.3-1, 0.3-0.8, 0.3-0.6, 0.3-0.4, 0.3-0.35, 0.35-1, 0.35-0.8, 0.35-0.6, 0.35-0.4, 0.4-1, 0.4-0.8, 0.4-0.6, 0.6-1, 0.6-0.8, or 0.8-1. With specific consideration, Sdq can be combined with Vmp or any other feature or combination disclosed herein (e.g., Sq, Vmp / Sq, Smrk2, PPD). 140 The combination of uncoupled DOI, haze, transmittance, pit density, average maximum pit depth, average maximum lateral dimension of pit, X% of pits within Y% of average maximum depth, or any combination thereof.

[0100] In some respects, the textured areas of a textured artifact can have any suitable PPD. 140For example, measurements taken at an incident angle of 0 degrees. In some respects, PPD... 140 (%) can be at least: 0.1, 0.5, 1, 1.5, 2, 2.5, 3, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, 4, 4.5, 5, 5.5, 6, 6.5, or 7; alternatively or additionally, PPD 140 (%) can be: 7, 6.5, 6, 5.5, 5, 4.5, 4, 3.9, 3.8, 3.7, 3.6, 3.5, 3.4, 3.3, 3.2, 3.1, 3, 2.5, 2, 1.5, 1, 0.5, or 0.1 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, PPD 140(%) can be 0.1-7, 0.1-6, 0.1-5, 0.1-4.5, 0.1-4, 0.1-3.9, 0.1-3.8, 0.1-3.7, 0.1-3.6, 0.1-3.5, 0.1-3.4, 0.1-3.3, 0.1-3.2, 0.1-3.1, 0.1-3, 0.1-2.8, 0.1-2.6, 0.1-2.5, 0.1-2.4, 0.1-2.2, 0.1-2, 0.1-1.5, 0.1-1, 0.1-0.5, 0.5-7, 0.5-6, 0.5-5, 0.5-4.5, 0.5-4, 0.5-3.9, 0.5-3.8, 0.5-3.7, 0.5-3.6, 0 0.5-3.5, 0.5-3.4, 0.5-3.3, 0.5-3.2, 0.5-3.1, 0.5-3, 0.5-2.8, 0.5-2.6, 0.5-2.5, 0.5-2.4, 0.5-2.2, 0.5-2, 0.5-1.5, 0.5-1, 1-7, 1-6, 1-5, 1-4.5, 1- 4, 1-3.9, 1-3.8, 1-3.7, 1-3.6, 1-3.5, 1-3.4, 1-3.3, 1-3.2, 1-3.1, 1-3, 1-2.8, 1-2.6, 1-2.5, 1-2.4, 1-2.2, 1-2, 1-1.5, 1.5-7, 1.5-6, 1.5-5, 1.5-4.5 1.5-4, 1.5-3.9, 1.5-3.8, 1.5-3.7, 1.5-3.6, 1.5-3.5, 1.5-3.4, 1.5-3.3, 1.5-3.2, 1.5-3.1, 1.5-3, 1.5-2.8, 1.5-2.6, 1.5-2.5, 1.5-2.4, 1.5-2.2 1.5-2, 2-7, 2-6, 2-5, 2-4.5, 2-4, 2-3.9, 2-3.8, 2-3.7, 2-3.6, 2-3.5, 2-3.4, 2-3.3, 2-3.2, 2-3.1, 2-3, 2-2.8, 2-2.6, 2-2.5, 2-2.4, 2-2.2, 2.2-7, 2. 2-6, 2.2-5, 2.2-4.5, 2.2-4, 2.2-3.9, 2.2-3.8, 2.2-3.7, 2.2-3.6, 2.2-3.5, 2.2-3.4, 2.2-3.3, 2.2-3.2, 2.2-3.1, 2.2-3, 2.2-2.8, 2.2-2.6, 2.2-2.5 2.2-2.4, 2.4-7, 2.4-6, 2.4-5, 2.4-4.5, 2.4-4, 2.4-3.9, 2.4-3.8, 2.4-3.7, 2.4-3.6, 2.4-3.5, 2.4-3.4, 2.4-3.3, 2.4-3.2, 2.4-3.1, 2.4-3, 2.4-2.8、2.4-2.6、2.4-2.5、2.5-7、2.5-6、2.5-5、2.5-4.5、2.5-4、2.5-3.9、2.5-3.8、2.5-3.7、2.5-3.6、2.5-3.5、2.5-3.4、2.5-3.3、2.5-3.2、2.5-3.1、2.5-3、2.5-2.8、2.5-2.6、2.6-7、2.6-6、2.6-5、2.6-4.5、2.6-4、2.6-3.9、2.6-3.8、2.6-3.7、2.6-3.6、2.6-3.5、2.6-3.4、2.6-3.3、2.6-3.2、2.6-3.1、2.6-3、2.6-2.8、2.8-7、2.8-6、2.8-5、2.8-4.5、2.8-4、2.8-3.9、2.8-3.8、2.8-3.7、2.8-3.6、2.8-3.5、2.8-3.4、2.8-3.3、2.8-3.2、2.8-3.1、2.8-3、3-7、3-6、3-5、3-4.5、3-4、3-3.9、3-3.8、3-3.7、3-3.6、3-3.5、3-3.4、3-3.3、3-3.2、3-3.1、3.1-7、3.1-6、3.1-5、3.1-4.5、3.1-4、3.1-3.9、3.1-3.8、3.1-3.7、3.1-3.6、3.1-3.5、3.1-3.4、3.1-3.3、3.1-3.2、3.2-7、3.2-6、3.2-5、3.2-4.5、3.2-4、3.2-3.9、3.2-3.8、3.2-3.7、3.2-3.6、3.2-3.5、3.2-3.4、3.2-3.3、3.3-7、3.3-6、3.3-5、3.3-4.5、3.3-4、3.3-3.9、3.3-3.8、3.3-3.7、3.3-3.6、3.3-3.5、3.3-3.4、3.4-7、3.4-6、3.4-5、3.4-4.5、3.4-4、3.4-3.9、3.4-3.8、3.4-3.7、3.4-3.6、3.4-3.5、3.5-7、3.5-6、3.5-5、3.5-4.5、3.5-4、3.5-3.9、3.5-3.8、3.5-3.7、3.5-3.6、3.6-7、3.6-6、3.6-5、3.6-4.5、3.6-4、3.6-3.9、3.6-3.8、3.6-3.7、3.7-7、3.7-6、3.7-5、3.7-4.5、3.7-4、3.7-3.9、3.7-3.8、3.8-7、3.8-6、3.8-5、3.8-4.5、3.8-4、3.8-3.9、3.9-7、3.9-6, 3.9-5, 3.9-4.5, 3.9-4, 4-7, 4-6, 4-5, 4-4.5, 4.5-5, 5-7, 5-6.5, 5-6, 6-7, 6-6.5 or 6.5-7. After careful consideration, PPD is chosen. 140 It can be combined with uncoupled DOI, transmittance and / or haze or any other feature or combination thereof disclosed herein (e.g., Sdq, Vmp, Smrk2, Vmp / Sq, Sq, pit density, average maximum depth of pit, average maximum lateral dimension of pit, X% of pits within Y% of average maximum depth or any combination thereof).

[0101] In some respects, the textured regions of a textured article can have any suitable uncoupled DOI. In some respects, the uncoupled DOI (%) can be at least: 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, or 95; alternatively or additionally, the uncoupled DOI (%) can be: 100, 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, or 25 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range.For example, in some aspects, the uncoupled DOI (%) can be 20-100, 20-95, 20-90, 20-85, 20-80, 20-75, 20-70, 20-65, 20-60, 20-55, 20-50, 20-45, 20-40, 20-35, 20-30, 20-25, 25-100, 25-95, 25-90, 25-85, 25-80, 25-75, 25-70, 25-65, 25-60, 25-55, 25-50, 25-45, 25-40, 25-35, 25-30, 30 -100, 30-95, 30-90, 30-85, 30-80, 30-75, 30-70, 30-65, 30-60, 30-55, 30-50, 30-45, 30-40, 30-35, 35-100, 35-95, 35-90, 35-85, 35-80, 35-75, 35-70, 35-65, 35-60, 35-55, 35-50, 35-45, 35-40, 40-100, 40-95, 40-90, 40-85, 40-80, 40-75, 40-70, 40-65, 4 0-60, 40-55, 40-50, 40-45, 45-100, 45-95, 45-90, 45-85, 45-80, 45-75, 45-70, 45-65, 45-60, 45-55, 45-50, 50-100, 50-95, 50-90, 50-85, 50-80, 50-75, 50-70, 50-65, 50-60, 50-55, 55-100, 55-95, 55-90, 55-85, 55-80, 55-75, 55-70, 55-65, 55-60, 60-10 0, 60-95, 60-90, 60-85, 60-80, 60-75, 60-70, 60-65, 65-100, 65-95, 65-90, 65-85, 65-80, 65-75, 65-70, 70-100, 70-95, 70-90, 70-85, 70-80, 70-75, 75-100, 75-95, 75-90, 75-85, 75-80, 80-100, 80-95, 80-90, 80-85, 85-100, 85-95, 85-90, 90-95 or 95-100. After careful consideration, uncoupled DOIs can be used with PPDs. 140 Transmittance and / or haze or any other characteristic or combination thereof disclosed herein (e.g., Sdq, Vmp, Smrk2, Vmp / Sq, Sq, pit density, average maximum depth of pit, average maximum lateral dimension of pit, X% of pits within Y% of average maximum depth or any combination thereof).

[0102] In some respects, the textured areas of a textured article can have any suitable haze. In some respects, the haze (%) can be at least: 2, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, or 80; alternatively or additionally, the haze (%) can be: 80, 75, 70, 65, 60, 55, 50, 45, 40, 35, 30, 25, 20, 15, 10, 5, or 2 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, haze (%) can be 2-80, 2-75, 2-70, 2-65, 2-60, 2-55, 2-50, 2-45, 2-40, 2-35, 2-30, 2-25, 20, 2-15, 2-10, 2-5, 5-80, 5-75, 5-70, 5-65, 5-60, 5-55, 5-50, 5-45, 5-40, 5-35, 5-30, 5-25, 5-20, 5-15, 5-10, 10-80, 10-75, 10-70, 10-65, 10-60. 10-55, 10-50, 10-45, 10-40, 10-35, 10-30, 10-25, 10-20, 10-15, 15-80, 15-75, 15-70, 15-65, 15-60, 15-55, 15-50, 15-45, 15-40, 15-35, 15-30, 15-25, 15-20, 20-80, 20-75, 20-70, 20-65, 20-60, 20-55, 20-50, 20-45, 20-40, 20-35, 20-30, 20 -25, 25-80, 25-75, 25-70, 25-65, 25-60, 25-55, 25-50, 25-45, 25-40, 25-35, 25-30, 30-80, 30-75, 30-70, 30-65, 30-60, 30-55, 30-50, 30-45, 30-40, 30-35, 35-80, 35-75, 35-70, 35-65, 35-60, 35-55, 35-50, 35-45, 35-40, 40-80, 40-75, 40-7 0, 40-65, 40-60, 40-55, 40-50, 40-45, 45-80, 45-75, 45-70, 45-65, 45-60, 45-55, 45-50, 50-80, 50-75, 50-70, 50-65, 50-60, 50-55, 55-80, 55-75, 55-70, 55-65, 55-60, 60-80, 60-75, 60-70, 60-65, 65-80, 65-75, 65-70, 70-80, 70-75 or 75-80.After careful consideration, haze can be compared with PPD. 140 Transmittance and / or uncoupled DOI or any other feature or combination thereof disclosed herein (e.g., Sdq, Vmp, Smrk2, Vmp / Sq, Sq, pit density, average maximum depth of pit, average maximum lateral dimension of pit, X% of pits within Y% of average maximum depth or any combination thereof).

[0103] In some respects, the textured regions of a textured article can have any suitable transmittance. In some respects, the transmittance (%) can be at least: 80, 85, 90, 92, 94, 96, 98, 99, or 100; alternatively or additionally, the transmittance (%) can be: 100, 99, 98, 96, 94, 92, 90, 85, or 80 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, transmittance (%) can be 80-100, 80-99, 80-98, 80-96, 80-94, 80-92, 80-90, 80-85, 85-100, 85-99, 85-98, 85-96, 85-94, 85-92, 85-90, 90-100, 90-99, 90-98, 90-96, 90-94, 90-92, 92-100, 92-99, 92-98, 92-96, 92-94, 94-100, 94-99, 94-98, 94-96, 96-100, 96-99, 96-98, 98-100, 98-99, or 99-100. After careful consideration, transmittance can be correlated with haze and PPD. 140 And / or uncoupled DOI or any other feature or combination thereof disclosed herein (e.g., Sdq, Vmp, Smrk2, Vmp / Sq, Sq, indentation density, average maximum depth of indentation, average maximum lateral dimension of indentation, X% of indentations within Y% of average maximum depth, or any combination thereof).

[0104] In some respects, the textured areas of a textured article can have any depression density. In some respects, depression density (depressions / µm) 2 The value can be at least: 0.001, 0.002, 0.004, 0.005, 0.006, 0.008, 0.01, 0.012, 0.014, 0.015, 0.016, 0.018, or 0.02; alternatively or additionally, the depression density (depressions / µm) 2The values ​​can be: 0.02, 0.018, 0.016, 0.015, 0.014, 0.012, 0.01, 0.008, 0.006, 0.005, 0.004, 0.002, or 0.001 or smaller. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, the depression density (depression / µm) 2 The range can be 0.001-0.02, 0.001-0.018, 0.001-0.016, 0.001-0.015, 0.001-0.014, 0.001-0.012, 0.001-0.01, 0.001-0.008, 0.001-0.006, 0.001-0.005, 0.001-0.004, 0.001-0.002, 0.002-0.02, 0.002-0.018, 0.002-0.016, 0.002-0.015, 0.002- 0.014, 0.002-0.012, 0.002-0.01, 0.002-0.008, 0.002-0.006, 0.002-0.005, 0.002-0.004, 0.004-0.02, 0.004-0.018, 0.004-0.016, 0.004-0.015, 0.004-0.014, 0.004-0.012, 0.004-0.01, 0.004-0.008, 0.004-0.006, 0.006-0.02, 0.006- 0.018, 0.006-0.016, 0.006-0.015, 0.006-0.014, 0.006-0.012, 0.006-0.01, 0.006-0.008, 0.008-0.02, 0.008-0.018, 0.008-0.016, 0.008-0.015, 0.008-0.014, 0.008-0.012, 0.008-0.01, 0.01-0.02, 0.01-0.018, 0.01-0.016, 0.01-0.0 15, 0.01-0.014, 0.01-0.012, 0.012-0.02, 0.012-0.018, 0.012-0.016, 0.012-0.015, 0.012-0.014, 0.014-0.02, 0.014-0.018, 0.014-0.016, 0.014-0.015, 0.015-0.02, 0.015-0.018, 0.015-0.016, 0.016-0.02, 0.016-0.018, or 0.018-0.02. With specific consideration, the depression density can be combined with any other characteristics or combinations disclosed herein (including haze, transmittance, PPD). 140Uncoupled DOI, Sdq, Vmp, Smrk2, Vmp / Sq, Sq, average maximum lateral dimension of the depression, average maximum depth, X% of the depression is within Y% of the average maximum depth or any combination thereof.

[0105] In some aspects, the textured areas of a textured article may have recesses having any suitable average maximum lateral dimension. In some aspects, the average maximum lateral dimension (µm) may be at least: 5, 10, 15, 20, 25, 30, 35, 40, 45, or 50; alternatively or additionally, the average maximum lateral dimension (µm) may be: 50, 45, 40, 35, 30, 25, 20, 15, 10, or 5 or less. For clarity, any two ranges in the above open ranges may be combined to form a closed range. For example, in some aspects, the average maximum lateral dimension (µm) can be 5-50, 5-45, 5-40, 5-35, 5-30, 5-25, 5-20, 5-15, 5-10, 10-50, 10-45, 10-40, 10-35, 10-30, 10-25, 10-20, 10-15, 15-50, 15-45, 15-40, 15-35, 1 5-30, 15-25, 15-20, 20-50, 20-45, 20-40, 20-35, 20-30, 20-25, 25-50, 25-45, 25-40, 25-35, 25-30, 30-50, 30-45, 30-40, 30-35, 35-50, 35-45, 35-40, 40-50, 40-45, or 45-50. With specific consideration, the average maximum lateral dimension of the depression can be combined with any other feature or combination disclosed herein (including haze, transmittance, PPD). 140 Uncoupled DOI, Sdq, Vmp, Smrk2, Vmp / Sq, Sq, depression density, average maximum depth of depression, X% of depressions within Y% of average maximum depth, or any combination thereof.

[0106] In some aspects, the textured regions of a textured article may have depressions having any suitable average maximum depth. In some aspects, the average maximum depth (nm) may be at least: 100, 150, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1200, 1400, 1600, 1800, 2000, 2200, 2400, or 2500; alternatively or additionally, the average maximum depth (nm) may be: 2500, 2400, 2200, 2000, 1800, 1600, 1400, 1200, 1000, 900, 800, 700, 600, 500, 400, 300, 200, 150, or 100 or less. For clarity, any two ranges in the above open ranges may be combined to form a closed range. For example, in some aspects, the average maximum depth (nm) can be 100-2500, 100-2400, 100-2200, 100-2000, 100-1800, 100-1600, 100-1400, 100-1200, 100-1000, 100-900, 100-800, 100-700, 100-600, 100-500, 100-400, 100-300, 100-200, 100-150, 1 50-2500, 150-2400, 150-2200, 150-2000, 150-1800, 150-1600, 150-1400, 150-1200, 150-1000, 150-900, 150-800, 150-700, 150-600, 150-500, 150-400, 150-300, 150-200, 200-2500, 200-2400, 200-2200, 200-20 00, 200-1800, 200-1600, 200-1400, 200-1200, 200-1000, 200-900, 200-800, 200-700, 200-600, 200-500, 200-400, 200-300, 300-2500, 300-2400, 300-2200, 300-2000, 300-1800, 300-1600, 300-1400, 300-1200, 3 00-1000, 300-900, 300-800, 300-700, 300-600, 300-500, 300-400, 400-2500, 400-2400, 400-2200, 400-2000, 400-1800, 400-1600, 400-1400, 400-1200, 400-1000, 400-900, 400-800, 400-700, 400-600, 400-500500-2500, 500-2400, 500-2200, 500-2000, 500-1800, 500-1600, 500-1400, 500-1200, 500-1000, 500-900, 500-800, 500-700, 500-600, 600-2500, 600-2400, 600-2200, 600-2000, 600-1800, 600-1600, 600-1400, 600-1200, 600-1000, 600-900, 600-800, 6 00-700, 700-2500, 700-2400, 700-2200, 700-2000, 700-1800, 700-1600, 700-1400, 700-1200, 700-1000, 700-900, 700-800, 800-2500, 800-2400, 800-2200, 800-2000, 800-1800, 800-1600, 800-1400, 800-1200, 800-1000, 800-900, 900-2500, 900-2400 900-2200, 900-2000, 900-1800, 900-1600, 900-1400, 900-1200, 900-1000, 1000-2500, 1000-2400, 1000-2200, 1000-2000, 1000-1800, 1000-1600, 1000-1400, 1000-1200, 1200-2500, 1200-2400, 1200-2200, 1200-2000, 1200-1800, 1200-1600, 1200-140 0, 1400-2500, 1400-2400, 1400-2200, 1400-2000, 1400-1800, 1400-1600, 1600-2500, 1600-2400, 1600-2200, 1600-2000, 1600-1800, 1800-2500, 1800-2400, 1800-2200, 1800-2000, 2000-2500, 2000-2400, 2000-2200, 2200-2500, 2200-2400, or 2400-2500. With specific consideration, the average maximum depth of the depression can be combined with any other feature or combination disclosed herein (including haze, transmittance, PPD, etc.). 140 Uncoupled DOI, Sdq, Vmp, Smrk2, Vmp / Sq, Sq, depression density, average maximum lateral dimension of depression, X% of depressions within Y% of average maximum depth, or any combination thereof.

[0107] In some aspects, the textured areas of a textured article may have recesses having an average maximum depth, wherein X% of such recesses are within Y% of the average maximum depth. When X% is relatively high and Y% is relatively low, this means that a substantial majority of the recesses have substantially the same depth. In some aspects, having substantially the same depth is advantageous for providing textured articles with higher abrasion resistance and desired optical properties. In some aspects, X (%) can be at least: 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 99, or 100; alternatively or additionally, X (%) can be: 100, 99, 95, 90, 80, 70, 60, or 50 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, X (%) can be 50-100, 50-99, 50-95, 50-90, 50-85, 50-80, 50-75, 50-70, 50-65, 50-60, 50-55, 55-100, 55-99, 55-95, 55-90, 55-85, 55-80, 55-75, 55-70, 55-65, 55-60, 60-100, 60-99, 60-95, 60-90, 60-85, 60-80, 60-75, 60-70, 60-65, 65-100, 65-99 65-95, 65-90, 65-85, 65-80, 65-75, 65-70, 70-100, 70-99, 70-95, 70-90, 70-85, 70-80, 70-75, 75-100, 75-99, 75-95, 75-90, 75-85, 75-80, 80-100, 80-99, 80-95, 80-85, 85-100, 85-99, 85-95, 85-90, 90-100, 90-99, 90-95, 95-100, 95-99 or 99-100. In some respects, Y (%) can be at least 1, 2, 4, 6, 8, 10, 12, 14, 16, 18, or 20; alternatively or additionally, Y (%) can be 20, 18, 16, 14, 12, 10, 8, 6, 4, 2, or 1 or less. For clarity, any two of the above open ranges can be combined to form a closed range.For example, in some aspects, Y (%) can be 1-20, 1-18, 1-16, 1-14, 1-12, 1-10, 1-8, 1-6, 1-4, 1-2, 2-20, 2-18, 2-16, 2-14, 2-12, 2-10, 2-8, 2-6, 2-4, 4-20, 4-18, 4-16, 4-14, 4-12, 4-10, 4-8, 4-6, 6-20, 6 -18, 6-16, 6-14, 6-12, 6-10, 6-8, 8-20, 8-18, 8-16, 8-14, 8-12, 8-10, 10-20, 10-18, 10-16, 10-14, 10-12, 12-20, 12-18, 12-16, 12-14, 14-20, 14-18, 14-16, 16-20, 16-18, or 18-20. Upon specific consideration, the feature described in this paragraph (X% of the depression is within Y% of the average maximum depth) can be combined with any other feature or combination disclosed herein (including haze, transmittance, PPD). 140 (A combination of uncoupled DOI, Sdq, Vmp, Smrk2, Vmp / Sq, Sq, depression density, average maximum depth of depression, average maximum lateral dimension of depression, or any combination thereof.)

[0108] In some respects, the textured area of ​​a textured article includes recesses randomly distributed across at least a portion of the textured area. However, in other respects, the recesses may be arranged in an ordered manner, such as in the form of grids, lines, squares, circular patterns, etc.

[0109] In some applications, the main surface of the substrate and / or the substrate itself comprises glass, glass-ceramic, ceramic, or any combination thereof. In some applications, high transparency to visible light is desired, and in such cases, glass is typically used as the substrate; however, in applications requiring high transparency to visible light, glass-ceramic can also be used, provided that the transparency of the glass-ceramic meets the desired level. Such applications requiring high transparency to visible light include, for example, cover glass for consumer electronics or automotive solutions (including displays, tablets, smartphones, etc.). However, in some applications, high transparency to visible light may not be required, and lower transparency in the visible spectrum may be acceptable or even desirable. In such cases, glass-ceramic or ceramic substrates can be used. For example, when using textured articles on a mobile phone back cover, low transparency is not required. In such cases, using such textured articles with low transparency to visible light as a mobile phone back cover will provide an anti-glare / matte finish to an opaque mobile phone back cover.

[0110] In some aspects, the substrate and / or its main surface can be made of any suitable material, such as alkali aluminosilicates, aluminoborosilicates, soda lime, alkali-containing borosilicates, and alkali aluminoborosilicates, wherein the alkali in any of the foregoing is, for example, Li, Na, Ka, or any combination thereof. In some aspects, the substrate may be lithium oxide-free. In some aspects, the substrate and / or the main surface may contain crystalline features (which may be reinforced or unreinforced) or may contain a single-crystal structure, such as sapphire. In some aspects, the substrate and / or the main surface comprises an amorphous substrate (e.g., glass) and a crystalline cladding (e.g., a sapphire layer, a polycrystalline alumina layer, and / or spinel (MgAl)). x O y (Layer). In some aspects, the substrate and / or main surface may comprise a glass-ceramic material comprising one or more crystalline phases (such as lithium disilicate, lepidolite, β-quartz, or β-spodumene), which may be combined with residual glass in the structure. These glass-ceramic substrates may optionally be optically transparent and chemically strengthened, such as those described in U.S. Patent Nos. 10,611,675, 2020 / 0231491, 2020 / 0223744, and 2020 / 0148591, each hereby incorporated herein by reference in its entirety. Alternatively, as described elsewhere herein, some applications may not desire or require optical transparency. In any case, any substrate and / or main surface disclosed herein may be strengthened by any method known in the art (such as by chemical strengthening (e.g., ion exchange) and / or vapor strengthening) before, after, or during the intermediate texturing steps herein, or may be unstrengthened.

[0111] In some respects, the textured regions are formed by removing at least a portion of the main surface of the substrate. In other respects, this removal is performed by etching, as described elsewhere in this document.

[0112] In some aspects, a method for manufacturing the textured article described herein is disclosed. The textured article produced by said method can be described by any of the characteristics, properties, etc., described elsewhere herein for textured articles. For example, the textured article produced by said method can have any structural and optical properties disclosed elsewhere herein for textured articles, such as Vmp, Sq, Vmp / Sq, Sdq, Smrk2, uncoupled DOI, haze, PPD. 140The texturized article may include, but is not limited to, the following characteristics or properties: indentation density, average maximum lateral dimension, average maximum depth, X% of the indentations being within Y% of the average maximum indentation depth, or any other feature or property disclosed herein, or any combination thereof. The texturized article produced by the method may also be prepared from the substrates described elsewhere herein for texturized articles.

[0113] In some aspects, the method includes providing a substrate having a stop layer disposed on a main surface of the substrate, the stop layer having randomly distributed holes penetrating to the main surface. In some aspects, the method further includes a first removal step, the first removal step including removing a first portion of the main surface through the holes in the stop layer to form seed depressions in the main surface and an unremoved portion of the main surface beneath the stop layer. In some aspects, the method further includes a second removal step, the second removal step including removing the stop layer to expose the unremoved portion of the main surface beneath the stop layer. In some aspects, the method further includes a third removal step, the third removal step including removing a second portion of the main surface substrate to provide a textured region on the main surface, the second portion including the seed depressions and the unremoved portion of the main surface.

[0114] In some aspects, the randomly distributed apertures in the stop layer are formed by a method comprising: positioning a photomask over the stop layer, the photomask comprising a pattern of randomly distributed apertures; and irradiating the stop layer with light through the photomask to transfer the pattern to the stop layer. In some aspects, the apertures in the photomask have at least one of the following: a maximum dimension of 1-10 micrometers; and 0.005-0.015 apertures / µm. 2 Density. For example, the longest dimension can be 1-10, 1-9, 1-8, 1-7, 1-6, 1-5, 1-4, 1-3, 1-2, 2-10, 2-9, 2-8, 2-7, 2-6, 2-5, 2-4, 2-3, 3-10, 3-9, 3-8, 3-7, 3-6, 3-5, 3-4, 4-10, 4-9, 4-8, 4-7, 4-6, 4-5, 5-10, 5-9, 5-8, 5-7, 5-6, 6-10, 6-9, 6-8, 6-7, 7-10, 7-9, 7-8, 8-9, or 9-10; and / or pore density (pores / µm). 2The range can be 0.005-0.015, 0.005-0.014, 0.005-0.012, 0.005-0.01, 0.005-0.008, 0.005-0.006, 0.006-0.015, 0.006-0.014, 0.006-0.012, 0.006-0.01, or 0.0 06-0.008, 0.008-0.015, 0.008-0.014, 0.008-0.012, 0.008-0.01, 0.01-0.015, 0.01-0.014, 0.01-0.012, 0.012-0.015, 0.012-0.014 or 0.014-0.015.

[0115] In some aspects, the stop layer comprises any material known in the art that is resistant to methods of removing the substrate (or its main surface) through the holes of the stop layer. In other words, the stop layer should be sufficient to persist under conditions that allow the main surface of the substrate to be removed through the holes of the stop layer, so that the stop layer can perform its function as a stop layer. For example, in some aspects, the stop layer comprises molybdenum, silicon carbide, silicon nitride, titanium, titanium nitride, aluminum, aluminum nitride, chromium, chromium oxynitride, zirconium, niobium, tungsten, copper, nickel, chromium plus titanium, or any combination thereof.

[0116] In some aspects, one or more removal steps in the removal process include chemical etching. For example, in some aspects, at least one of the first, second, and third removal steps includes chemical etching. In some aspects, chemical etching includes a chemical mixture that can remove and / or dissolve the main surface of the substrate, thereby forming textured regions of the textured article. In some aspects, chemical etching includes hydrofluoric acid (HF), metal hydroxides, or any combination thereof. In some aspects, the metal hydroxide is an alkali metal hydroxide, an alkaline earth metal hydroxide, or any combination thereof. Alkali metal hydroxides include lithium hydroxide, sodium hydroxide, potassium hydroxide, rubidium hydroxide, cesium hydroxide, or any combination thereof. Alkaline earth metal hydroxides include magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, or any combination thereof.

[0117] In some aspects, a first removal step creates seed depressions, a second step removes a stop layer, and a third removal step further removes material from the seed depressions and from the portion located below the now-removed stop layer to form depressions that tend to merge in some aspects and may but not necessarily merge. In some aspects, such a process produces an undulating surface with depressions of relatively uniform depth. In some aspects, at least one of the first and third removal steps includes hydrofluoric acid (HF) with or without a fluorinated surfactant. In some aspects, at least one of the first and third removal steps includes a metal hydroxide with or without a surfactant. In some aspects, at least one of the first and third removal steps employs HF with or without a fluorinated surfactant, and the other step in the first or third removal step employs a metal hydroxide.

[0118] In some aspects, when HF is used, at least one of the first and third removal steps includes any suitable composition conditions. For example, in some aspects, at least one of the first and third removal steps uses a composition comprising HF, wherein the amount (wt.%) of HF is at least: 0.1, 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 6, 8, 10, 12, 14, 16, 18, or 20 based on the total weight of the composition; alternatively or additionally, at least one of the first and third removal steps uses a composition comprising HF, wherein the amount (wt.%) of HF is 20, 18, 16, 14, 12, 10, 8, 6, 5, 4.5, 4, 3.5, 3, 2.5, 2, 1.5, 1, 0.5, or 0.1 or less based on the total weight of the composition. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, the amount of HF (wt.%) based on the total weight of the composition can be 0.1-20, 0.1-18, 0.1-16, 0.1-14, 0.1-12, 0.1-10, 0.1-8, 0.1-6, 0.1-5, 0.1-4.5, 0.1-4, 0.1-3.5, 0.1-3, 0.1-2.5, 0.1-2, 0.1-1.5, 0.1-1, 0.1-0.5, 0.5-20, 0. 5-18, 0.5-16, 0.5-14, 0.5-12, 0.5-10, 0.5-8, 0.5-6, 0.5-5, 0.5-4.5, 0.5-4, 0.5-3.5, 0.5-3, 0.5-2.5, 0.5-2, 0.5-1.5, 0.5-1, 1-20, 1-18, 1-16, 1-14, 1-12, 1-10, 1-8, 1-6, 1-5, 1-4, 1-4.5, 1-4, 1-3.5 1-3, 1-2.5, 1-2, 1-1.5, 1.5-20, 1.5-18, 1.5-16, 1.5-14, 1.5-12, 1.5-10, 1.5-8, 1.5-6, 1.5-5, 1.5-4.5, 1.5-4, 1.5-3.5, 1.5-3, 1.5-2.5, 1.5-2, 2-20, 2-18, 2-16, 2-14, 2-12, 2-10, 2-8, 2-6, 2-5, 2- 4.5, 2-4, 2-3.5, 2-3, 2-2.5, 2.5-20, 2.5-18, 2.5-16, 2.5-14, 2.5-12, 2.5-10, 2.5-8, 2.5-6, 2.5-5, 2.5-4.5, 2.5-4, 2.5-3.5, 2.5-3, 3-20, 3-18, 3-16, 3-14, 3-12, 3-10, 3-8, 3-6, 3-5, 3-4.5, 3-4, 3-3.5, 3.5-20, 3.5-18, 3.5-16, 3.5-14, 3.5-12, 3.5-10, 3.5-8, 3.5-6, 3.5-5, 3.5-4.5, 3.5-4, 4-20, 4-18, 4-16, 4-14, 4-12, 4-10, 4-8, 4-6, 4-5, 4-4.5, 4.5-20, 4.5-18, 4.5-16, 4.5-14, 4.5-12, 4.5-10, 4.5-8, 4.5-6, 4.5-5, 5 -20, 5-18, 5-16, 5-14, 5-12, 5-10, 5-8, 5-6, 6-20, 6-18, 6-16, 6-14, 6-12, 6-10, 6-8, 8-20, 8-18, 8-16, 8-14, 8-12, 8-10, 10-20, 10-18, 10-16, 10-14, 10-12, 12-20, 12-18, 12-16, 12-14, 14-20, 14-16, 16-20, 16-18, or 18-20. In some respects, the HF concentration used in the first removal step is lower than the HF concentration used in the third removal step. In some aspects, the first removal step comprises 0.1-20 wt.% or 0.5-2 wt.% of HF, or any other amount disclosed herein, and the third removal step comprises 1-20 wt.% or 8-12 wt.% of HF, or any other amount disclosed herein.

[0119] In some aspects, when HF is used, at least one of the first and third removal steps includes any suitable conditions. For example, in some aspects, at least one of the first and third removal steps employs a composition comprising a fluorinated surfactant (e.g., other than HF), wherein the amount (wt.%) of the fluorinated surfactant is at least: 0, 0.1, 0.5, 1, 1.5, 2, 2.5, 3, 3.5, 4, 4.5, 5, 6, 7, 8, 9, or 10 based on the total weight of the composition; alternatively or additionally, at least one of the first and third removal steps employs a composition comprising a fluorinated surfactant (e.g., other than HF), wherein the amount (wt.%) of the fluorinated surfactant is 10, 9, 8, 7, 6, 5, 4.5, 4, 3.5, 3, 2.5, 2, 1.5, 1, 0.5, or 0.1 or less based on the total weight of the composition. For clarity, any two ranges in the above open ranges may be combined to form a closed range.For example, in some aspects, the amount (wt.%) of the fluorinated surfactant, based on the total weight of the composition, can be 0-10, 0-9, 0-8, 0-7, 0-6, 0-5, 0-4.5, 0-4, 0-3.5, 0-3, 0-2.5, 0-2, 0-1.5, 0-1, 0-0.5, 0-0.1, 0.1-10, 0.1-9, 0.1-8, 0.1-7, 0.1-6, 0.1-5, 0.1-4.5, 0.1-4, 0.1-3.5, 0.1-3, 0.1-2.5, 0.1-2, 0. 1-1.5, 0.1-1, 0.1-0.5, 0.5-10, 0.5-9, 0.5-8, 0.5-7, 0.5-6, 0.5-5, 0.5-4.5, 0.5-4, 0.5-3.5, 0.5-3, 0.5-2.5, 0.5-2, 0.5-1.5, 0.5-1, 1-10, 1-9, 1-8, 1-7, 1-6, 1-5, 1-4.5, 1-4, 1-3.5, 1-3, 1-2.5, 1-2, 1-1.5, 1.5-10, 1.5-9, 1.5-8, 1.5-7 1.5-6, 1.5-5, 1.5-4.5, 1.5-4, 1.5-3.5, 1.5-3, 1.5-2.5, 1.5-2, 2-10, 2-9, 2-8, 2-7, 2-6, 2-5, 2-4.5, 2-4, 2-3.5, 2-3, 2-2.5, 2.5-10, 2.5-9, 2.5-8, 2.5-7, 2.5-6, 2.5-5, 2.5-4.5, 2.5-4, 2.5-3.5, 2.5-3, 3-10, 3-9, 3-8, 3-7, 3-6, 3-5, 3- 4.5, 3-4, 3-3.5, 3.5-10, 3.5-9, 3.5-8, 3.5-7, 3.5-6, 3.5-5, 3.5-4.5, 3.5-4, 4-10, 4-9, 4-8, 4-7, 4-6, 4-5, 4-4.5, 4.5-10, 4.5-9, 4.5-8, 4.5-7, 4.5-6, 4.5-5, 5-10, 5-9, 5-8, 5-7, 5-6, 6-10, 6-9, 6-8, 6-7, 7-10, 7-9, 7-8, 8-10, 8-9, or 9-10. In some aspects, the first removal step includes a fluorinated surfactant, and the third removal step does not use a fluorinated surfactant. In some aspects, the third removal step includes a fluorinated surfactant, and the first removal step does not use a fluorinated surfactant. In some respects, both the first and third removal steps involve fluorinated surfactants. In other respects, neither the first nor the third removal steps use fluorinated surfactants.

[0120] Any suitable fluorinated surfactant known in the art can be used as a fluorinated surfactant in any step of the method steps described herein (such as the first removal step and / or the third removal step), including anionic fluorinated surfactants, nonionic fluorinated surfactants, ethoxylated nonionic fluorinated surfactants, amphoteric fluorinated surfactants, perfluorinated fluorinated surfactants, partially fluorinated fluorinated surfactants, or any combination thereof, wherein any of the fluorinated surfactants is soluble in water and / or in a solvent. For example, CAPSTONE, available from The Chemours Company, can be used. TM Any of the following fluorinated surfactants: FS-10 (anionic fluorinated surfactant), FS-22 (solvent-based additive), FS-30 (general-purpose water-soluble ethoxylated nonionic fluorinated surfactant), FS-3000 (nonionic fluorinated surfactant), FS-31 (nonionic fluorinated surfactant), FS-3100 (nonionic fluorinated surfactant), FS-34 (general-purpose water-soluble ethoxylated nonionic fluorinated surfactant), FS-35 (nonionic fluorinated surfactant), FS-50 (amphoteric fluorinated surfactant), FS-51 (amphoteric amine-based fluorinated surfactant), FS-60 (water-soluble anionic fluorinated surfactant). Fluorinated surfactants), FS-61 (water-based anionic fluorinated surfactant), FS-63 (water-soluble anionic fluorinated surfactant), FS-64 (water-soluble proprietary anionic fluorinated surfactant, free of intentionally added VOCs), FS-65 (water-soluble fluorinated surfactant, free of intentionally added VOCs), FS-66 (solvent-free anionic fluorinated surfactant), FS-81 (water-based partially fluorinated coating additive), FS-83 (solvent-based additive), FS-87 (water-soluble non-flammable and partially fluorinated copolymer, free of intentionally added VOCs), FS-93 (water-soluble anionic fluorinated surfactant), or any combination thereof.

[0121] In some aspects, when using HF, at least one of the first and third removal steps includes any suitable temperature conditions. For example, in some aspects, when using HF, at least one of the first and third removal steps is carried out at at least the following temperatures (°C): 15, 20, RT, 25, 30, 35, 40, 45, 50, 55, or 60; alternatively or additionally, when using HF, at least one of the first and third removal steps is carried out at the following temperatures: 60, 55, 50, 45, 40, 35, 30, 25, RT, 20, or 15 or lower. For clarity, any two of the above open ranges may be combined to form a closed range. For example, in some aspects, when HF is used, at least one of the first removal step and the third removal step is carried out at the following temperatures (°C): 15-60, 15-55, 15-50, 15-45, 15-40, 15-35, 15-30, 15-25, 15-RT, 15-20, 20-60, 20-55, 20-50, 20-45, 20-40, 20-35, 20-30, 20-25, 20-RT, RT-60, RT-55, RT-50, RT-45, RT-4 0, RT-35, RT-30, RT-25, RT-20, 25-60, 25-55, 25-50, 25-45, 25-40, 25-35, 25-30, 30-60, 30-55, 30-50, 30-45, 30-40, 30-35, 35-60, 35-55, 35-50, 35-45, 35-40, 40-60, 40-55, 40-50, 40-45, 45-60, 45-55, 45-50, 50-60, 50-55, or 55-60. As used herein, “RT” means room temperature and generally refers to the ambient temperature of the environment (e.g., room or facility) in which the removal steps are performed. Generally, the RT is about 15-25°C, such as about 18°C, about 20°C, about 22°C, about 18-22°C, about 18-20°C, or about 20-22°C, depending on the room or facility. In some respects, the first removal step using HF is carried out at a temperature of RT to 50°C, 20-35°C, or any other temperature disclosed herein, and the third removal step is carried out at a temperature of RT to 50°C, 25-40°C, or any other amount disclosed herein.

[0122] In some aspects, when using HF, at least one of the first and third removal steps includes any suitable timing conditions. For example, in some aspects, when using HF, the time period (minutes) during which at least one of the first and third removal steps is performed is at least: 1, 5, 10, 20, 40, 60, 80, 100, or 120; alternatively or additionally, when using HF, the time period (minutes) during which at least one of the first and third removal steps is performed is 120, 100, 80, 60, 40, 20, 10, 5, or 1 or less. For clarity, any two of the above open ranges can be combined to form a closed range. For example, in some aspects, when HF is used, the time period (minutes) for at least one of the first removal step and the third removal step is 1-120, 1-100, 1-80, 1-60, 1-40, 1-20, 1-10, 1-5, 5-120, 5-100, 5-80, 5-60, 5-40, 5-20, 5-10, 10-120, 10-100, 10-80, 10-60, 10-40, 10-20, 20-120, 20-100, 20-80, 20-60, 20-40, 40-120, 40-100, 40-80, 40-60, 60-120, 60-100, 60-80, 80-120, 80-100 or 100-120. In some respects, the first removal step using HF is performed for a period of 1-60 minutes or 5-40 minutes or any other period disclosed herein, and the third removal step using HF is performed for a period of 1-120 minutes or 40-80 minutes or any other period disclosed herein.

[0123] In some aspects, when a metal hydroxide is used, at least one of the first and third removal steps includes any suitable composition conditions. For example, in some aspects, at least one of the first and third removal steps employs a composition comprising a metal hydroxide (e.g., NaOH and / or KOH) at a weight (wt.%) of at least 1, 2, 5, 10, 20, 30, 40, 50, 60, or 70 based on the total weight of the composition; alternatively or additionally, at least one of the first and third removal steps employs a composition comprising a metal hydroxide (e.g., NaOH and / or KOH) at a weight (wt.%) of 70, 60, 50, 40, 30, 20, 10, 5, 2, or 1 or less based on the total weight of the composition. For clarity, any two of the above open-ended ranges may be combined to form a closed-ended range. For example, in some aspects, based on the total weight of the composition, the amount (wt.%) of the metal hydroxide (e.g., NaOH and / or KOH) can be 1-70, 1-60, 1-50, 1-40, 1-30, 1-20, 1-10, 1-50, 1-2, 2-70, 2-60, 2-50, 2-40, 2-30, 2-20, 2-10, 2-5, 5-70, 5-60, 5- 50, 5-40, 5-30, 5-20, 5-10, 10-70, 10-60, 10-50, 10-40, 10-30, 10-20, 20-70, 20-60, 20-50, 20-40, 20-30, 30-70, 30-60, 30-50, 30-40, 40-70, 40-60, 40-50, 50-70, 50-60, or 60-70. Each of the above quantities may be used herein to refer to a single metal hydroxide or the total amount of metal hydroxide. In some respects, the concentration of metal hydroxide used in the first removal step is lower than the concentration of metal hydroxide used in the third removal step. In some aspects, the first removal step includes 1-50 wt.% or 2-10 wt.% of metal hydroxide or any other amount disclosed herein, and the third removal step includes 10-70 wt.% or 20-50 wt.% of metal hydroxide or any other amount disclosed herein.

[0124] In some respects, any surfactant can be used in combination with compositions comprising metal hydroxides. Suitable surfactants include any of the fluorinated surfactants disclosed elsewhere herein, for example. Additionally, suitable surfactants include, for example, sodium dodecyl sulfate (SDS), cetrimonium bromide (CTAB), cetrimonium chloride (CTAC), or any combination thereof.

[0125] In some aspects, when metal hydroxides (e.g., NaOH and / or KOH) are used, at least one of the first and third removal steps includes any suitable temperature conditions. For example, in some aspects, when metal hydroxides are used, at least one of the first and third removal steps is carried out at at least the following temperatures (°C): RT, 20, 30, 40, 50, 70, 90, 110, 130, 150, or 165; alternatively or additionally, when metal hydroxides are used, at least one of the first and third removal steps is carried out at the following temperatures: 165, 150, 130, 110, 90, 70, 50, 40, 30, 20, or RT or lower. For clarity, any two of the above open ranges may be combined to form a closed range. For example, in some aspects, when metal hydroxides are used, at least one of the first removal step and the third removal step is carried out at the following temperatures (°C): RT-165, RT-150, RT-130, RT-110, RT-90, RT-70, RT-50, RT-40, RT-30, RT-20, 20-165, 20-150, 20-130, 20-110, 20-90, 20-70, 20-50, 20-40, 20-30, 30-165, 30-150, 30-130, 30-110, 30-90, 30-70, 30-50, 30- 40, 40-165, 40-150, 40-130, 40-110, 40-90, 40-70, 40-50, 50-165, 50-150, 50-130, 50-110, 50-90, 50-70, 70-165, 70-150, 70-130, 70-110, 70-90, 90-165, 90-150, 90-130, 90-110, 90-165, 90-150, 90-130, 90-110, 110-165, 110-150, 110-130, 130-165, 130-150 or 150-165. As used herein, “RT” means room temperature and generally refers to the ambient temperature of the environment in which the removal steps are performed (e.g., a room or facility). Generally, RT is about 15-25°C, such as about 18°C, about 20°C, about 22°C, about 18-22°C, about 18-20°C, or about 20-22°C, depending on the room or facility. In some aspects, the first removal step using metal hydroxide is carried out at a temperature of RT to 150°C, 50-130°C, or any other temperature disclosed herein, and the third removal step is carried out at a temperature of 70-165°C or 90-150°C, or any other amount disclosed herein.

[0126] In some aspects, when metal hydroxides (NaOH and / or KOH) are used, at least one of the first and third removal steps includes any suitable time conditions. For example, in some aspects, when metal hydroxides are used, the time period (minutes) for at least one of the first and third removal steps is at least: 1, 5, 10, 20, 40, 60, 80, 100, 120, 140, 160, 180, 200, 220, or 240; alternatively or additionally, when metal hydroxides are used, the time period (minutes) for at least one of the first and third removal steps is 240, 220, 200, 180, 160, 140, 120, 100, 80, 60, 40, 20, 10, 5, or 1 or less. For clarity, any two of the above open-ended ranges can be combined to form a closed-ended range.For example, in some aspects, when metal hydroxides are used, the time period (minutes) for at least one of the first removal step and the third removal step is 1-240, 1-220, 1-200, 1-180, 1-160, 1-140, 1-120, 1-100, 1-80, 1-60, 1-40, 1-20, 1-10, 1-5, 5-240, 5-220, 5-200, 5-180, 5-160, 5-140, 5-120, 5-100, 5-80, 5-60, 5-40 5-20, 5-10, 10-240, 10-220, 10-200, 10-180, 10-160, 10-140, 10-120, 10-100, 10-80, 10-60, 10-40, 10-20, 20-240, 20-220, 20-200, 20-180, 20-160, 20-140, 20-120, 20-100, 20-80, 20-60, 20-40, 40-240, 40-220, 40-200, 40-180 40-160, 40-140, 40-120, 40-100, 40-80, 40-60, 60-240, 60-220, 60-200, 60-180, 60-160, 60-140, 60-120, 60-100, 60-80, 80-240, 80-220, 80-200, 80-180, 80-160, 80-140, 80-120, 80-100, 100-240, 100-220, 100-200, 100-180 100-160, 100-140, 100-120, 120-240, 120-220, 120-200, 120-180, 120-160, 120-140, 140-240, 140-220, 140-200, 140-180, 140-160, 160-240, 160-220, 160-200, 160-180, 180-240, 180-220, 180-200, 200-240, 200-220 or 220-240. In some respects, the first removal step using metal hydroxide is carried out for a period of 1-120 minutes or 40-140 minutes or any other period disclosed herein, and the third removal step using metal hydroxide is carried out for a period of 10-240 minutes or 100-180 minutes or any other period disclosed herein.

[0127] In some respects, the third removal step is performed using conditions suitable for removing the stop layer from the main surface of the substrate, and depends on the material used for the stop layer. In some respects, such conditions are relatively inert to the material of the main surface of the substrate compared to the stop layer. For example, when the stop layer comprises molybdenum, example conditions involve wet etching using a mixture of 60 ml phosphoric acid / 36 ml nitric acid / 20 ml acetic acid / 130 ml water heated to 40°C. When the stop layer comprises silicon carbide, example conditions involve plasma etching (e.g., in UNAXIS). TM Dry etching is performed in the machine, with settings as follows: ~30 seconds SiC LP36SF6 6O2 12mT 200W, using reflectance spectroscopy from field to endpoint.

[0128] In some aspects, the first removal step removes a first portion of the main surface of the substrate through the pores of the stop layer to form a seed depression. In some aspects, the thickness (µm) of the first portion is at least: 1, 2, 4, 6, 8, 10, 15, 20, 25, or 30; alternatively or additionally, the thickness (µm) of the first portion is 30, 25, 20, 15, 10, 8, 6, 4, 2, or 1 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, the thickness (µm) of the first part is 1-30, 1-25, 1-20, 1-15, 1-10, 1-8, 1-6, 1-4, 1-2, 2-30, 2-25, 2-20, 2-15, 2-10, 2-8, 2-6, 2-4, 4-30, 4-25, 4-20, 4-15, 4-10, 4-8, 4-6, 6-30, 6-25, 6-20, 6-15, 6-10, 6-8, 8-30, 8-25, 8-20, 8-15, 8-10, 10-30, 10-25, 10-20, 10-15, 15-30, 15-25, 15-20, 20-30, 20-25, or 25-30.

[0129] In some aspects, the third removal step removes a second portion of the main surface of the substrate to provide a textured region on the main surface, the second portion comprising seed depressions and unremoved portions of the main surface. In some aspects, the thickness (µm) of the second portion is at least: 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, or 120; alternatively or additionally, the thickness (µm) of the first portion is 120, 110, 100, 90, 80, 70, 60, 50, 40, 30, 20, or 10 or less. For clarity, any two ranges in the above open ranges can be combined to form a closed range. For example, in some aspects, the thickness (µm) of the second part is 10-120, 10-110, 10-100, 10-90, 10-80, 10-70, 10-60, 10-50, 10-40, 10-30, 10-20, 20-120, 20-110, 20-100, 20-90, 20-80, 20-70, 20-60, 20-50, 20-40, 20-30, 30-120, 30-110, 30-100, 30-90, 30-80, 30-70, 30-60, 30-50, 30-40, 40-120, 40-110, 4 0-100, 40-90, 40-80, 40-70, 40-60, 40-50, 50-120, 50-110, 50-100, 50-90, 50-80, 50-70, 50-60, 60-120, 60-110, 60-100, 60-90, 60-80, 60-70, 70-120, 70-110, 70-100, 70-90, 70-80, 80-120, 80-110, 80-100, 80-90, 90-120, 90-110, 90-100, 100-120, 100-110 or 110-120.

[0130] Now refer to Figures 15-16 Various aspects of this disclosure are discussed, and the figures illustrate various aspects of the texturing article and manufacturing method disclosed herein. The following general description is intended to provide an overview of this disclosure, its structures, and methods, and various aspects will be discussed more specifically throughout this disclosure with reference to the depicted non-limiting aspects, all of which are interchangeable within the context of this disclosure.

[0131] Figure 15This document describes in some aspects a process flow diagram of a method for producing textured articles according to the disclosure herein. In step 1501, a photomask is fabricated, the photomask comprising randomly arranged pinholes, typically about 1-5 µm in diameter. In step 1502, a stop layer is placed on the main surface of a substrate. Steps 1501 and 1502 can be performed in any order. In step 1503, a photomask pattern of the randomly arranged pinholes is transferred to the stop layer by a suitable method such as photolithography, whereby the pinholes penetrate the stop layer to the main surface of the underlying substrate. For example, in step 1503, the randomly distributed holes in the stop layer can be formed by a method comprising: positioning a photomask over the stop layer, the photomask comprising a pattern of randomly distributed holes; and then irradiating the stop layer with light through the photomask to transfer the pattern to the stop layer. Step 1504 is a first removal step, the first removal step comprising removing a first portion of the main surface through the holes in the stop layer to form seed depressions in the main surface and an unremoved portion of the main surface below the stop layer. Step 1505 is a second removal step, which includes removing the stop layer to expose the unremoved portion of the main surface located beneath the stop layer. Step 1506 is a third removal step, which includes removing a second portion of the main surface substrate to provide a textured region on the main surface, the second portion including seed recesses and the unremoved portion of the main surface. Any one or more of steps 1501, 1502, 1503, 1504, 1505, and 1506 can be optional, as in some respects, a third party can perform any one or more of such steps. For example, steps 1501, 1502, and 1503 can be performed by a third party, such that the method can begin with a substrate already having a stop layer with randomly distributed holes penetrating to the main surface of the underlying substrate. Alternatively, the method can begin with step 1503, since the substrate including the stop layer can be provided by a third party, and the method can begin with transferring the photomask pinhole pattern to the stop layer in step 1503. Other alternatives have been considered, wherein the method may begin at any one of steps 1501, 1502, 1503, 1504, 1505, or 1506, and any step may be optional.

[0132] Figure 16This is a schematic diagram illustrating, in some respects, a method for producing textured articles according to the disclosure herein. A substrate 1601 is provided, the substrate having a stop layer 1602 disposed on a main surface 1603 of the substrate 1601. Optionally, the method may include a step (not shown) of depositing the stop layer 1602 on the substrate 1601. In step 1607, a photomask 1604 with a pattern of randomly distributed holes 1605 is used to transfer a pattern to the stop layer 1602, thereby forming randomly distributed holes 1606 penetrating to the main surface 1603. In some respects, in step 1607, the pattern transfer is accomplished by positioning the photomask 1604 over the stop layer 1602 and irradiating the stop layer 1602 through the randomly distributed holes 1605 of the photomask 1604. Step 1608 is a first removal step, which includes removing a first portion of the main surface 1603 through randomly distributed holes 1606 in the stop layer 1602 to form seed depressions 1609 in the main surface 1603 and an unremoved portion 1610 of the main surface beneath the stop layer 1602. Step 1611 is a second removal step, which includes removing the stop layer 1602 to expose the unremoved portion 1610 of the main surface beneath the stop layer 1602. Step 1612 is a third removal step, which includes removing a second portion of the main surface substrate to provide a textured region 1613 on the main surface, the second portion including the seed depressions and the unremoved portion of the main surface. In the third removal step 1612, the seed depressions 1609 and the unremoved portion 1610 are further removed to form depressions 1614 and residual portions 1615 of the unremoved portion. In some aspects, the depressions 1615 are merged to form an undulating surface. Any one or more of steps 1607, 1608, 1611, and 1612 may be optional, because in some respects, it is considered that a third party may perform any one or more of such steps, as directed at... Figure 15 Similar discussions.

[0133] This article considers various aspects, some of which are elaborated in the following paragraphs. With explicit consideration, any aspect or part thereof can be combined to form a combination.

[0134] Aspect 1. A textured article comprising:

[0135] A substrate, the substrate including a textured region defined on the main surface of the substrate;

[0136] The textured region includes:

[0137] For example, a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012.

[0138] Aspect 2. The textured article according to aspect 1, wherein the Vmp / Sq is at least 0.09 as measured according to ISO 25178-2:2012.

[0139] Aspect 3. A textured article comprising:

[0140] A substrate, the substrate including a textured region defined on the main surface of the substrate;

[0141] The textured region includes:

[0142] For example, a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012; and

[0143] For example, at least 90% of Smrk2 as measured according to ISO 25178-2:2021.

[0144] Aspect 4. The textured article according to aspect 3 or any of the preceding aspects, wherein the Smrk2 is at least 92% as measured according to ISO 25178-2:2021.

[0145] Aspect 5. A textured article comprising:

[0146] A substrate, the substrate including a textured region defined on the main surface of the substrate;

[0147] The textured region includes:

[0148] Such as a Vmp of at least 10 nm as measured according to ISO 25178-2:2012; and

[0149] Sdq, for example, 0-0.1 as measured according to ISO 25178-2:2012.

[0150] Aspect 6. The textured article according to aspect 5 or any of the preceding aspects, wherein:

[0151] As measured according to ISO 25178-2:2012, the Vmp is at least 14 nm; and

[0152] As measured according to ISO 25178-2:2012, Sdq is 0.0045-0.1.

[0153] Aspect 7. The textured article according to any one of the preceding aspects, which exhibits at least one of the following:

[0154] 3.7% or less PPD at an incident angle of 0 degrees 140 ;

[0155] Such as 80% or less of uncoupled DOI as measured according to ASTM D 5767-18; and

[0156] Such as 70% or less of haze as measured according to ASTM D 1003-21.

[0157] Aspect 8. The textured article according to any one of the preceding aspects exhibits:

[0158] 3.7% or less PPD at an incident angle of 0 degrees 140 ;

[0159] Such as 80% or less of uncoupled DOI as measured according to ASTM D 5767-18; and

[0160] Such as 10% or less of haze as measured according to ASTM D 1003-21.

[0161] Aspect 9. The textured article according to any one of Aspects 1 to 7, exhibiting:

[0162] 3.5% or less PPD at an incident angle of 0 degrees 140 ;

[0163] Such as 60% or less of uncoupled DOI as measured according to ASTM D 5767-18; and

[0164] Such as 70% or less of haze as measured according to ASTM D 1003-21.

[0165] Aspect 10. The textured article according to any one of the preceding aspects, wherein the textured region includes depressions, the density of which is 0.005-0.015 depressions / µm. 2 .

[0166] Aspect 11. The textured article according to any one of the preceding aspects, wherein:

[0167] The textured region includes a depression, the depression having at least one of the following:

[0168] The average maximum lateral dimension is between 5 and 50 micrometers; and

[0169] Average maximum depth: 150-2500 nm.

[0170] Aspect 12. The textured article according to any one of the preceding aspects, wherein:

[0171] The textured region includes depressions;

[0172] The depression has an average maximum depth; and

[0173] At least 90% of the maximum depth of the depression is within 10% of the average maximum depth.

[0174] Aspect 13. The textured article according to any one of the preceding aspects, wherein the textured region includes depressions randomly distributed across at least a portion of the textured region.

[0175] Aspect 14. The textured article according to any one of the preceding aspects, wherein the main surface of the substrate comprises glass, glass ceramic, ceramic or any combination thereof.

[0176] Aspect 15. The textured article according to any one of the preceding aspects, wherein the textured region is formed by removing at least a portion of the main surface of the substrate.

[0177] Aspect 16. A method for manufacturing textured articles, the method comprising:

[0178] A substrate is provided having a stop layer disposed on a main surface of the substrate, the stop layer having randomly distributed holes penetrating to the main surface;

[0179] A first removal step includes removing a first portion of the main surface through the holes in the stop layer to form a seed depression in the main surface and an unremoved portion of the main surface below the stop layer;

[0180] A second removal step, comprising removing the stop layer to expose the unremoved portion of the main surface located beneath the stop layer; and

[0181] The third removal step includes removing a second portion of the main surface substrate to provide a textured region on the main surface, the second portion including the seed depression and the unremoved portion of the main surface.

[0182] Aspect 17. The method according to aspect 16 or any of the preceding aspects, wherein the randomly distributed holes in the stop layer are formed by a method comprising:

[0183] A photomask is positioned above the stop layer, the photomask comprising a pattern of randomly distributed holes; and

[0184] Light is passed through the photomask to illuminate the stop layer in order to transfer the pattern to the stop layer.

[0185] Aspect 18. The method according to aspect 17 or any of the preceding aspects, wherein the apertures in the photomask have at least one of the following: a maximum dimension of 1-10 micrometers; and 0.005-0.015 apertures / µm. 2 The density.

[0186] Aspect 19. The method according to any one of Aspects 16 to 18 or any of the preceding aspects, wherein the stop layer comprises molybdenum, silicon carbide, silicon nitride, titanium, titanium nitride, aluminum, aluminum nitride, chromium, chromium oxynitride, zirconium, niobium, tungsten, copper, nickel, chromium plus titanium, or any combination thereof.

[0187] Aspect 20. The method according to any one of aspects 16 to 19 or any of the preceding aspects, wherein at least one of the first removal step, the second removal step and the third removal step comprises chemical etching.

[0188] Aspect 21. The method according to aspect 20, wherein the chemical etching comprises hydrofluoric acid or metal hydroxide.

[0189] Aspect 22. The method according to any one of aspects 16 to 21 or any of the preceding aspects, wherein the thickness of the first portion removed through the hole in the stop layer is 1-10 micrometers.

[0190] Aspect 23. The method according to any one of aspects 16 to 22 or any of the preceding aspects, wherein the thickness of the second portion removed from the unremoved portion of the seed depression and the main surface is 10-100 micrometers.

[0191] Aspect 24. The method according to any one of Aspects 16 to 23 or any of the preceding aspects, wherein the main surface of the substrate comprises glass, glass-ceramic, ceramic or any combination thereof.

[0192] Aspect 25. The method according to any one of Aspects 16 to 24 or any of the preceding aspects, wherein the textured region includes at least one of the following:

[0193] (1) Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012;

[0194] (2) If measured according to ISO 25178-2:2012, Vmp / Sq shall be at least 0.09;

[0195] (3) Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012, and Smrk2 of at least 90% as measured according to ISO 25178-2:2021;

[0196] (4) Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012, and Smrk2 of at least 92% as measured according to ISO 25178-2:2021;

[0197] (5) Vmp of at least 10 nm as measured according to ISO 25178-2:2012, and Sdq of 0–0.1 as measured according to ISO 25178-2:2012; and

[0198] (6) Vmp of at least 14 nm as measured according to ISO 25178-2:2012, and Sdq of 0.0045-0.1 as measured according to ISO 25178-2:2012.

[0199] Aspect 26. The method according to any one of aspects 16 to 25 or any of the preceding aspects, wherein the textured region exhibits:

[0200] (1) At least one of the following: 3.7% or less PPD at an incident angle of 0 degrees 140 ; such as 80% or less of uncoupled DOI as measured according to ASTM D5767-18; and 70% or less of haze as measured according to ASTM D 1003-21;

[0201] (2) 3.7% or less PPD at an incident angle of 0 degrees 140 ; such as 80% or less of uncoupled DOI as measured according to ASTM D 5767-18; and 10% or less of haze as measured according to ASTM D 1003-21; or

[0202] (3) 3.5% or less PPD at an incident angle of 0 degrees 140 Uncoupled DOI of 60% or less as measured according to ASTM D 5767-18; and haze of 70% or less as measured according to ASTM D 1003-21.

[0203] Aspect 27. A combination of two or more of the foregoing aspects or any part thereof.

[0204] Example

[0205] The following examples illustrate non-limiting aspects of this disclosure and are not intended to limit the scope of this disclosure or the claims.

[0206] In this example, substrates A and B are two different aluminum borosilicate glasses, substrates C and D are two different lithium aluminum silicate glasses, and substrate E is a glass ceramic.

[0207] Vmp, Sq, Smrk2, and Sdq are structural properties of the surface (as discussed elsewhere in this document) and are defined according to ISO 25178-2:2012 (Vmp, Sq, Sdq) or ISO 25178-2:2021 (Smrk2) using Zygo NewView. TM A surface profilometer is used to analyze and measure surfaces, and it is used with MountainsMap. TM It is calculated by software.

[0208] In this example, as discussed elsewhere in this article, haze, DOI, and flash point (PPD) are used. 140 () refers to the optical properties of the substrate.

[0209] In this example, abrasion tests (“Abrasion Tests”) were performed on certain textured articles to determine their durability. In the Abrasion Tests, abrasive abrasion was used to assess the surface durability of the disclosed surface design against small particles. The Abrasion Tests are designed to simulate field events such as a contaminated fingertip sliding across a touchscreen on a mobile electronic device, or the interaction of keyboard keys with a cover glass in a laptop application. In the Abrasion Tests, A1 ultrafine dust particles (Powder Technology Inc, Arden Hills, MN) were prepared as a mixture in olive oil and then dropped onto the prepared anti-glare textured surface. A vertical force was applied to the particle injection area via a pad. The pad was moved laterally in a reciprocating motion to induce contact events between the abrasive particles and the textured surface. Three sets of runs were performed at discrete locations with 200, 400, and 1000 cycles, respectively, to examine surfaces with different levels of abrasion. The abraded samples were first wiped with methanol to remove any remaining particles and then examined in a lightbox with D65 illumination. Track visibility is used to indicate resistance to damage. Highly visible tracks after testing generally indicate the introduction of more severe damage, while tracks with lower visibility indicate less severe damage.

[0210] This example demonstrates the structural and optical properties of a texturized article (“Example”) consistent with the disclosure herein, compared to a comparative texturized article produced by a comparative process (“Comparative Process”).

[0211] The example described herein is prepared according to the disclosure herein. Specifically, a photomask with randomly arranged pinholes, the pinholes having a diameter of approximately 2-5 micrometers, is fabricated. A molybdenum thin film etch stop layer is then deposited on a glass substrate (substrate D), and the pinhole pattern is transferred into the molybdenum layer using photolithography, the pinholes penetrating to the underlying glass substrate. The masked substrate is then subjected to a first etching step by immersion in an etching solution for a relatively short period of time to remove a layer of glass substrate approximately 2-10 micrometers thick through the pinholes and from the back side of the glass substrate, thereby forming small etch pits beneath each pinhole. If desired, only the masked side of the substrate may be subjected to the etching solution. The molybdenum mask is then removed, and a second etching step is performed on the unmasked surface for a relatively long period of time (compared to the first etching step) to remove a layer of glass substrate approximately 10-100 micrometers thick, approximately until the etch features produced by the first etching step merge, resulting in a smooth surface with undulating features. If desired, alternatives to molybdenum may be used as the stop layer, such as any of those alternatives known in the art, including silicon carbide, silicon nitride, titanium, titanium nitride, aluminum, aluminum nitride, chromium, chromium oxynitride, zirconium, niobium, tungsten, copper, nickel, chromium plus titanium, or any combination thereof.

[0212] The first (shorter) etching step is carried out using an aqueous etching solution containing 0.1-20 wt.% HF (e.g., 0.57 wt.%) and 0-10 wt.% fluorinated surfactant (e.g., 3.4 wt.%) at a temperature of room temperature to 50°C for a duration of 1-60 minutes. The second (longer) etching step is carried out using an aqueous etching solution containing 1-20 wt.% HF (e.g., 10 wt.%) at a temperature of room temperature to 50°C for a duration of 1 minute to 2 hours. Generally, changing the etching conditions within these limits will produce the variations shown in Figures 1-14. Alternative conditions for the first etching step include 1-50 wt.% NaOH and / or KOH, room temperature to 150°C, and 1 minute to 2 hours. Alternative conditions for the second etching step include 10-70 wt.% NaOH and / or KOH, 70-165°C, and 10 minutes to 4 hours.

[0213] Comparative process #1 is a cream etching process used to prepare textured articles from substrates A and B. This process is very similar to Comparative process #4. The main difference is that Comparative process #1 uses an etchant containing suspended solids (e.g., a cream). This process is generally considered to be able to etch glass surfaces more uniformly. This process is described in U.S. Patent 10,690,818.

[0214] Comparative process #2 is a photolithographic-based anti-glare texture produced using substrate C, based on the disclosure of commonly transferred WO 2022 / 011067 A1, the contents of which are incorporated herein by reference in their entirety. Photolithography enables the fabrication of engineered / predefined textured glass articles. In contrast, processes such as sandblasting and conventional chemical etching produce random textured glass articles.

[0215] Comparative process #3 is the sandblasting-etching (SBE) process, used to prepare textured articles from substrates A, D, and E. This type of surface is produced using a two-step process, where the surface is first bombarded with fine abrasive particles to create microcracks on the sample surface, followed by an HF etching step. The HF etching step opens up the crack sites, which become large and sharp features after removing approximately 10-50 micrometers of surface material.

[0216] The surface of Comparative Process #4 is produced using a two-step nucleation and etching process for preparing a textured article from substrate A. During the nucleation step, chemicals such as ammonium bifluoride remove some glass modifiers (e.g., Ca) present in the glass, thereby forming nucleation sites. These nucleation sites provide an etching mask for the underlying substrate, resulting in a structure opposite to the nucleation topology. The nucleation material is also water-soluble and can be easily removed after the etching step.

[0217] Comparative process #5 is the anti-glare surface included in the M3 touchscreen learning machine (tablet computer) commercially available from BBK Electronics. The M3 device was disassembled and the anti-glare surface was tested. It is believed that the anti-glare surface is typically produced using a photolithography process according to CN113816612A to create sharp features with slowly varying depths. The data reported in Table 2 for comparative process #5 were collected by analyzing several different areas of the same sample (i.e., not testing multiple samples).

[0218] The results of the examples are illustrated in Table 1 and plotted on [the graph / chart]. Figure 1A , 1B 1D, 7A-7E, 13, 14A and 14B.

[0219] The results of comparing textured artifacts are presented in Table 2 and plotted on [the graph / plot]. Figures 1A-1C 1E, 1F, 2, 3, 4A, 4B, 5, 6, 7A-7C, 7F, 7G, 8, 9, 10A, 10B, 11 and 12.

[0220] When the values ​​of Sdq and Vmp are known, a wear sensitivity map can be plotted, such as in... Figure 13 The wear sensitivity diagram in the image. (Example) Figure 13As shown, surfaces with a combination of high Vmp and low Sdq generally exhibit better wear performance. Therefore, other surfaces with a combination of high Vmp and low Sdq (such as...) are expected to have better wear performance. Figure 1A and 1D Example data points (i.e., Figure 13 Those not yet plotted also exhibit better wear resistance. Without being bound by theory, Sdq and Vmp are considered good indicators of wear resistance, for reasons explained elsewhere in this paper.

[0221] Wear tests were performed on certain textured articles (examples) prepared according to the disclosure herein. Figure 13 The results for examples 30, 26, 1, 2, 3, 4, 5, 61, 62, 63, 19, 64, and 65 are plotted. Figure 17D As shown, representative samples underwent wear testing via microscopic analysis. Samples from comparative process #3 (i.e., sandblasting-etching) were also subjected to wear testing and analyzed using SEM (such as...). Figure 17A and 17B (as shown) and microscopy (such as) Figure 17C (As shown) Analyze representative products.

[0222] exist Figure 13 In the diagram, solid circles indicate good wear test results (no visible traces detected or a small number of visible traces detected), while hollow circles correspond to poor wear results (at least some visible traces detected).

[0223] Figures 14A-14B Optical data from a textured article according to the disclosure herein are shown. Based on the surface data in Figures 1-13, the textured article is expected to have good abrasion resistance. More specifically, Figure 14A and 14B Two potential desired options are shown: "x" data points with low haze and "o" data points with high haze. Notably, both high-haze and low-haze textured articles exhibit good anti-glare performance, demonstrating the versatility of the process and textured articles presented in this paper. Furthermore, the "x" data points have a PPD of less than 3.7% (or less than 3.5%) at an incident angle of 0 degrees. 140 Less than 80% of uncoupled DOIs; and less than 10% haze; while “o” data points have a PPD of less than 3.5% (or less than 3%) at an incident angle of 0 degrees. 140 ; less than 60% of uncoupled DOI; and less than 70% (or less than 45%) of haze.

[0224] exist Figures 17A-17B In the study, failure modes were revealed using SEM on the sandblasted-etched texture after wear testing by small particles. Surface peaks ( Figure 17A) or high platform area ( Figure 17B It can soften in high-pressure areas. Figures 17C-17D In this context, microscopy provides the ability to examine failure modes from another perspective, encompassing a larger area. Figure 17C The high scratch visibility of the blast-etched texture is due to more uniform damage across the tested surface, with two main failure modes observed: sharp-corner abrasion to form flat areas; and scratches spanning multiple etched pits. This corresponds to the surface of the textured article prepared according to the disclosure herein. Figure 17D It is evident that the texture of this invention successfully mitigates some failure modes that may result from wear testing. The reduction in the number of wear points in sharp corners helps to reduce track visibility in mirror viewing mode. Scratches are also confined to smaller areas to further help reduce the visibility of such scratches.

[0225] Table 1. Optical and structural properties of the examples

[0226]

[0227]

[0228]

[0229] Table 1 (continued). Optical and structural properties of examples.

[0230]

[0231]

[0232]

[0233] Table 2. Optical and structural properties of the comparative samples (“Comparative Process”)

[0234]

[0235]

[0236]

[0237]

[0238]

[0239] Table 2 (continued). Optical and structural properties of the comparative samples (“comparative process”).

[0240]

[0241]

[0242]

[0243]

[0244] As shown by the data in Tables 1 and 2 and Figures 1-14 and 17, the examples exhibit unique structural features (compared to samples produced by the comparative process) in certain respects, which are associated with good abrasion resistance. The data also demonstrate the versatility of the process disclosed herein in producing textured articles that retain abrasion resistance while also possessing the desired optical properties. Generally, textured articles having the following characteristics can be distinguished from known textured surfaces and exhibit good abrasion resistance after wear testing (e.g., judged by slight or no visible marks): (a) Vmp / Sq greater than 0.084 (or greater than 0.09); (b) Vmp / Sq greater than 0.084 (or greater than 0.09) and Smrk2 greater than 90% (or greater than 92%); (c) Vmp greater than 10 nm (or greater than 14 nm) and Sdq from 0 to 0.1 (or greater than 0.0045 and less than 0.1), or (d) any combination thereof. In some respects, such textured articles also possess desirable optical properties, such as at least one of the following: a PPD of less than 3.7% (or less than 3.5%) at an incident angle of 0 degrees. 140 ; less than 80% (or less than 60%) of uncoupled DOI; and less than 70% (or less than 10%) of haze. Such textured artifacts according to the disclosure herein have unique structural properties, as indicated by Vmp, Vmp / Sq, Smrk2, and Sdq, compared to comparative textured artifacts.

[0245] It should be understood that the disclosed aspects or embodiments may relate to specific features, elements, or steps described in connection with a particular aspect or embodiment. It should also be understood that although a particular aspect or embodiment has been described, specific features, elements, or steps may be interchanged or combined with alternative aspects or embodiments in various combinations or arrangements not shown.

[0246] As used herein, when the term “and / or” is used in a list of two or more items, it means that any one of the listed items may be used alone, or any combination of two or more of the listed items may be used. For example, if a composition is described as containing components A, B and / or C, the composition may contain A alone; B alone; C alone; a combination of A and B; a combination of A and C; a combination of B and C; or a combination of A, B and C.

[0247] While the transitional phrase "comprising" may be used to disclose various features, elements, or steps of a particular aspect or embodiment, it should be understood that implicit alternative aspects or embodiments include aspects or embodiments that may be described using the transitional phrases "consisting of" or "substantially consisting of". Thus, for example, an implicit alternative aspect or embodiment of a device comprising A+B+C includes aspects or embodiments of the device consisting of A+B+C and aspects or embodiments of the device substantially consisting of A+B+C.

[0248] References to the position of elements herein (e.g., “top,” “bottom,” “above,” “below,” “first,” “second,” etc.) are used only to describe the orientation of the various elements in the accompanying drawings. It should be noted that the orientation of the various elements may differ according to other exemplary embodiments, and such variations are intended to be covered by this disclosure. Furthermore, these relational terms are used only to distinguish one entity or action from another, and do not necessarily require or imply any actual such relationship or order between such entities or actions.

[0249] As used herein, the terms “about,” “approximately,” “substantially,” and similar terms are intended to have a broad meaning consistent with common and accepted usage by one of ordinary skill in the art to which the subject matter of this disclosure pertains. Those skilled in the art who have examined this disclosure will understand that these terms are intended to allow for description of certain features described and claimed, without limiting the scope of those features to the precise numerical ranges provided. Therefore, these terms should be interpreted as indicating that non-substantial or insignificant modifications or alterations to the described and claimed subject matter are considered to fall within the scope of the invention as set forth in the appended claims.

[0250] As used herein, terms such as “optional,” “optionally,” etc., are intended to mean that an event or condition subsequently described may or may not occur, and that the description includes examples of events or conditions occurring as well as examples of events or conditions not occurring. As used herein, unless otherwise specified, the indefinite articles “a,” “an,” and the corresponding definite article “described” mean “at least one / a” or “one or more / a.” It should also be understood that the various features disclosed in the specification and figures can be used in any and all combinations.

[0251] Regarding the use of any plural and / or singular terms in this document, those skilled in the art can convert from plural to singular and / or from singular to plural as appropriate to the context and / or application. For clarity, different single / multiple substitutions may be explicitly described herein.

[0252] Unless otherwise specified, all compositions are expressed as batch weight percentages (wt.%). As will be understood by those skilled in the art, various melt components (e.g., silicon, alkali or alkaline earth metal-based, boron, etc.) can undergo varying levels of volatilization during component melting (e.g., varying with vapor pressure, melting time, and / or melting temperature). Therefore, the batch weight percentage values ​​used in connection with such components are intended to cover values ​​of these components within ±0.5 wt.% of the final melted article of manufacture. In light of the foregoing, substantial compositional equivalence between the final article of manufacture and the batch composition is expected.

[0253] It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure without departing from its spirit and scope. Since modifications, combinations, sub-combinations, and variations of the disclosed embodiments incorporated into the spirit and substance of this disclosure will be readily apparent to those skilled in the art, this disclosure should be construed as encompassing all contents within the scope of the appended claims and their equivalents.

[0254] All references cited in this paper are included in full for all purposes.

Claims

1. A textured article comprising: a substrate comprising a textured region defined on a major surface of the substrate; wherein the textured region comprises: a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012.

2. The textured article of claim 1, wherein the Vmp / Sq is at least 0.09 as measured according to ISO 25178-2:2012.

3. A textured article comprising: a substrate comprising a textured region defined on a major surface of the substrate; wherein the textured region comprises: a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012; and a Smrk2 of at least 90% as measured according to ISO 25178-2:2021.

4. The textured article of claim 3, wherein the Smrk2 is at least 92% as measured according to ISO 25178-2:2021.

5. A textured article comprising: a substrate comprising a textured region defined on a major surface of the substrate; wherein the textured region comprises: a Vmp of at least 10 nm as measured according to ISO 25178-2:2012; and an Sdq of 0-0.1 as measured according to ISO 25178-2:2012.

6. The textured article of claim 5, wherein: the Vmp is at least 14 nm as measured according to ISO 25178-2:2012; and the Sdq is 0.0045-0.1 as measured according to ISO 25178-2:2012.

7. The textured article of any of the preceding claims, exhibiting at least one of: PPD of 3.7% or less at an angle of incidence of 0 degrees 140 ; an uncoupled DOI of 80% or less as measured according to ASTM D 5767-18; and a haze of 70% or less as measured according to ASTM D 1003-21.

8. The textured article of any of the preceding claims, exhibiting: PPD of 3.7% or less at an angle of incidence of 0 degrees 140 ; an uncoupled DOI of 80% or less as measured according to ASTM D 5767-18; and a haze of 10% or less as measured according to ASTM D 1003-21.

9. The textured article of any of claims 1-7, exhibiting: PPD of 3.5% or less at an angle of incidence of 0 degrees 140 ; an uncoupled DOI of 60% or less as measured according to ASTM D 5767-18; and a haze of 70% or less as measured according to ASTM D 1003-21.

10. The textured article according to any of the preceding claims, wherein the textured region comprises depressions, the density of the depressions being 0.005-0.015 depressions per pm 2 .

11. The textured article of any of the preceding claims, wherein: the textured region comprises depressions having at least one of: an average maximum lateral dimension of between 5-50 microns; and an average maximum depth of 150-2500 nm.

12. The textured article of any of the preceding claims, wherein: the textured region comprises depressions; the depressions have an average maximum depth; and the average maximum depth is at least 50 nm. At least 90% of the maximum depth of the recesses is within 10% of the average maximum depth.

13. The textured article of any of the preceding claims, wherein the textured region comprises randomly distributed recesses across at least a portion of the textured region.

14. The textured article of any of the preceding claims, wherein the major surface of the substrate comprises glass, glass-ceramic, ceramic, or any combination thereof.

15. The textured article of any of the preceding claims, wherein the textured region is formed by removing at least a portion of the major surface of the substrate.

16. A method for making a textured article, the method comprising: providing a substrate having a stop layer disposed on a major surface of the substrate, the stop layer having randomly distributed holes that penetrate to the major surface; a first removal step comprising removing a first portion of the major surface through the holes of the stop layer to form a seed recess in the major surface and an unremoved portion of the major surface underneath the stop layer; a second removal step comprising removing the stop layer, thereby exposing the unremoved portion of the major surface underneath the stop layer; and a third removal step comprising removing a second portion of the major surface substrate to provide a textured region on the major surface, the second portion comprising the seed recess and the unremoved portion of the major surface.

17. The method of claim 16, wherein the randomly distributed holes in the stop layer are formed by a method comprising: positioning a photomask over the stop layer, the photomask comprising a pattern of randomly distributed holes; and irradiating the stop layer with light through the photomask to transfer the pattern to the stop layer.

18. The method of claim 17, wherein the holes in the photomask have at least one of: a longest dimension of 1-10 microns; and a density of 0.005-0.015 holes per pm. 2 of 1-10 microns; and a density of 0.005-0.015 holes per pm.

19. The method of any of claims 16 to 18, wherein the stop layer comprises molybdenum, silicon carbide, silicon nitride, titanium, titanium nitride, aluminum, aluminum nitride, chromium, chromium oxynitride, zirconium, niobium, tungsten, copper, nickel, chromium plus titanium, or any combination thereof.

20. The method of any of claims 16 to 19, wherein at least one of the first removal step, the second removal step, and the third removal step comprises chemical etching.

21. The method of claim 20, wherein the chemical etching comprises hydrofluoric acid or a metal hydroxide.

22. The method of any of claims 16 to 21, wherein the first portion removed through the holes of the stop layer is 1-10 microns in thickness.

23. The method of any of claims 16 to 22, wherein the second portion removed from the seed recess and the unremoved portion of the major surface is 10-100 microns in thickness.

24. The method of any of claims 16 to 23, wherein the major surface of the substrate comprises glass, glass-ceramic, ceramic, or any combination thereof.

25. The method of any one of claims 16-24, wherein the textured region comprises at least one of: (1) a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012; (2) a Vmp / Sq of at least 0.09 as measured according to ISO 25178-2:2012; (3) a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012, and a Smrk2 of at least 90% as measured according to ISO 25178-2:2021; (4) a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012, and a Smrk2 of at least 92% as measured according to ISO 25178-2:2021; (5) a Vmp of at least 10 nm as measured according to ISO 25178-2:2012, and an Sdq of 0-0.1 as measured according to ISO 25178-2:2012; and (6) a Vmp of at least 14 nm as measured according to ISO 25178-2:2012, and an Sdq of 0.0045-0.1 as measured according to ISO 25178-2:2012.

26. The method of any one of claims 16-25, wherein the textured region exhibits: (1) a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012; (2) a Vmp / Sq of at least 0.09 as measured according to ISO 25178-2:2012; (3) a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012, and a Smrk2 of at least 90% as measured according to ISO 25178-2:2021; (4) a Vmp / Sq of at least 0.084 as measured according to ISO 25178-2:2012, and a Smrk2 of at least 92% as measured according to ISO 25178-2:2021; (5) a Vmp of at least 10 nm as measured according to ISO 25178-2:2012, and an Sdq of 0-0.1 as measured according to ISO 25178-2:2012; and (6) a Vmp of at least 14 nm as measured according to ISO 25178-2:2012, and an Sdq of 0.0045-0.1 as measured according to ISO 25178-2:2012. (1) at least one of: a PPD of 3.7% or less at an incident angle of 0 degrees 140 ; an uncoupled DOI of 80% or less as measured according to ASTM D5767-18; and a haze of 70% or less as measured according to ASTM D 1003-21; (2) a PPD of 3.7% or less at an incident angle of 0 degrees 140 ; an uncoupled DOI of 80% or less as measured according to ASTM D 5767-18; and a haze of 10% or less as measured according to ASTM D 1003-21; or (3) a PPD of 3.5% or less at an incident angle of 0 degrees 140 ; a non-coupled DOI of 60% or less as measured according to ASTM D 5767-18; and a haze of 70% or less as measured according to ASTM D 1003-21.

Images