Photonic chip integrated micro-hemispherical resonator gyroscope

Abstract

This invention relates to a photonic chip-integrated micro-hemispherical resonator gyroscope, belonging to the field of microelectromechanical systems (MEMS) technology. It includes: a vacuum cavity, a substrate disposed within the vacuum cavity, and an uncoated micro-hemispherical resonator disposed on the substrate; interdigitated electrode driving units and a silicon-based photonic chip are also disposed on the substrate; the interdigitated electrode driving units are arranged below the edge of the uncoated micro-hemispherical resonator; the silicon-based photonic chip includes a laser, a first multimode interferometer beam splitter, an optical branch coherent functional component, and a photodetector connected sequentially in the optical path; the number of the optical branch coherent functional component and the photodetector corresponds to the number of output terminals of the first multimode interferometer beam splitter, and the grating coupler group in the optical branch coherent functional component is arranged below the edge of the uncoated micro-hemispherical resonator. This invention can retain the intrinsic high Q value of the resonator and achieve miniaturized and integrated micro-hemispherical resonator gyroscope.

Description

Technical Field

[0001] This invention relates to the field of microelectromechanical systems (MEMS) technology, and in particular to a photonic chip-integrated micro-hemispherical resonator gyroscope. Background Technology

[0002] The microspherical resonator gyroscope is a high-precision solid-state gyroscope based on the Coriolis vibration principle. Its core sensing element is a microspherical resonator made of fused silica. This resonator generates a four-antinode standing wave through excitation. When the carrier rotates, the Coriolis force causes the standing wave to precess relative to the shell. By detecting this precession, the angular velocity can be accurately measured. Due to its outstanding advantages such as being all-solid-state, wear-free, long-lasting, low-power consumption, instantaneous start-up, and strong shock resistance, the microspherical resonator gyroscope has become a key component in the inertial navigation systems of high-end equipment such as aerospace and precision guidance systems.

[0003] The performance of the micro-hemispherical resonator directly determines the final accuracy of the gyroscope. Its core performance parameters include: eigenfrequency: directly related to the resonator's geometry and material properties, it serves as the benchmark for determining the gyroscope's operating point; quality factor (Q value): a physical quantity characterizing the rate of energy dissipation from the resonator's mechanical vibration. A higher Q value indicates slower energy loss, lower gyroscope noise, better scaling factor stability, and ultimately higher accuracy; frequency splitting and rigid axis angle: caused by the asymmetry of the resonator's material or structure, these are the main sources of gyroscope zero bias and orthogonality errors, requiring correction through tuning processes. Therefore, the ability to accurately detect the resonator's vibration signal is a fundamental technical prerequisite for the micro-hemispherical resonator gyroscope to reach its theoretical performance limits.

[0004] Achieving high-performance signal detection in current micro-hemispherical resonator gyroscopes faces a core challenge. Traditional micro-hemispherical resonator gyroscopes rely on the principle of capacitance sensing, and their working architecture requires the pre-plating of conductive electrodes on the surface of the resonator to form a sensing capacitor. This architecture has a fundamental flaw: the metal thin film introduced to achieve capacitance sensing itself introduces significant stress and additional mechanical damping, directly and irreversibly causing a decrease in the intrinsic Q value of the resonator, thus limiting the accuracy and noise level of the gyroscope at its source. Summary of the Invention

[0005] Therefore, it is necessary to provide a photonic chip integrated micro-hemispherical resonator gyroscope that can retain the intrinsic high Q value of the resonator and achieve miniaturization and integrated design to address the above-mentioned technical problems.

[0006] A photonic chip integrated micro-hemispherical resonator gyroscope includes: a vacuum cavity, a substrate disposed within the vacuum cavity, and an uncoated micro-hemispherical resonator disposed on the substrate;

[0007] An interdigitated electrode driving unit and a silicon-based photonic chip are also disposed on the substrate; the interdigitated electrode driving unit is arranged below the edge of the uncoated micro-hemispherical resonator;

[0008] The silicon-based photonic chip includes a laser, a first multimode interferometer beam splitter, an optical branch coherent functional component, and a photodetector connected in sequence according to the optical path.

[0009] The number of the optical branch coherent functional components and the number of the photodetectors correspond to the number of branches at the output end of the first multimode interferometer beam splitter, and the grating coupler group in the optical branch coherent functional components is arranged below the edge of the uncoated micro-hemispherical resonator.

[0010] In one embodiment, the optical branch coherent functional component includes a phase modulator, a grating coupler group, a second multimode interferometer beam splitter, and a multimode interferometer beam combiner;

[0011] The optical branch includes a first branch and a second branch arranged in parallel. The phase modulator and the grating coupler group are respectively arranged on the first branch and the second branch. The grating coupler group is located below the edge of the uncoated micro-hemispherical resonator.

[0012] The input end of the second multimode interferometer beam splitter is branched and connected to the output end of the first multimode interferometer beam splitter. The two output ends are respectively connected to the input end of the phase modulator and the input end of the grating coupler group. The output end of the phase modulator and the output end of the grating coupler group are connected to the input end of the multimode interferometer beam combiner. The output end of the multimode interferometer beam combiner is connected to the photodetector.

[0013] In one embodiment, the grating coupler group includes an outgoing grating coupler and a receiving grating coupler arranged along the optical signal transmission direction;

[0014] The output grating coupler is connected to the output end of the second multimode interferometer beam splitter; the receiving grating coupler is connected to the input end of the multimode interferometer beam combiner.

[0015] In one embodiment, the interdigital electrode driving unit includes two or more interdigital electrode groups, which are arranged circumferentially below the edge of the uncoated micro-hemispherical resonator.

[0016] In one embodiment, the interdigital electrode group includes two interdigital electrodes, which are interlocking comb-shaped electrodes.

[0017] In one embodiment, the phase modulator is a phase modulator of a silicon-based or lithium niobate thermo-optical phase modulator or an electro-optical modulator.

[0018] In one embodiment, the uncoated micro-hemispherical resonator is a hemispherical cavity structure with its center recessed and extending inward to the substrate to form a hollow central pillar;

[0019] The edge of the uncoated micro-hemispherical harmonic oscillator bends outward to form a lip, and the lip is a ring structure formed by periodic bending.

[0020] In one embodiment, an edge coupler is provided at the emitting end of the laser, and the output end of the edge coupler is connected to the input end of the first multimode interferometer beam splitter.

[0021] In one embodiment, the edge coupler employs an adiabatic conical structure.

[0022] In one embodiment, the substrate is a silicon-on-insulator substrate.

[0023] Compared with existing technologies, the photonic chip-integrated micro-hemispherical resonator gyroscope provided by this invention has the following advantages:

[0024] 1. This invention directly uses an uncoated micro-hemispherical resonator as the core sensing element, eliminating the surface coating process of the resonator necessary to form the detection capacitor in existing capacitance detection schemes. This fundamentally avoids the additional mechanical damping and stress introduced by the metal thin film, fully preserves the inherent high quality factor (Q value) of the fused silica resonator, reduces vibration energy dissipation, lowers gyroscope noise, and improves scale factor stability, laying a core foundation for achieving ultra-high precision inertial measurement.

[0025] 2. A laser, a first multimode interferometer beam splitter, optical branch coherent functional components, and a photodetector are integrated into a single on-chip optical detection unit using a silicon-based photonic chip. Simultaneously, the interdigital electrode driving unit, the silicon-based photonic chip, and the uncoated micro-hemispherical resonator are all integrated on the same substrate and encapsulated inside a vacuum cavity, forming a compact integrated inertial measurement unit. This achieves miniaturized integration, improving the portability and engineering deployment applicability of the gyroscope.

[0026] 3. The grating coupler groups of the interdigital electrode driving unit and the optical branch coherent functional component are precisely arranged below the edge of the uncoated micro-hemispherical resonator, adapting to the vibration characteristics of the edge lip region of the resonator. Among them, the interdigital electrode driving unit can efficiently excite the resonator to generate a stable four-antinode standing wave through non-contact electrostatic drive, avoiding damage to the microstructure of the resonator caused by contact excitation. The laser, the optical branch coherent functional component, the multimode interferometer beam splitter, and the photodetector constitute a complete on-chip optical path detection link, which can accurately capture the precession information of the resonator vibration. Moreover, the optical detection method is not affected by electromagnetic interference, changes in electrode spacing, etc., improving detection sensitivity and stability, and ensuring the accuracy and long-term reliability of gyroscope measurement. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention, and those skilled in the art can obtain other related drawings based on these drawings without creative effort.

[0028] Figure 1 A perspective isometric view of a photonic chip-integrated micro-hemispherical resonator gyroscope in one embodiment;

[0029] Figure 2 An isometric view of a photonic chip-integrated micro-hemispherical resonator gyroscope in one embodiment;

[0030] Figure 3 This is a top view of a photonic chip-integrated micro-hemispherical resonator gyroscope in one embodiment;

[0031] Figure 4 This is a schematic diagram of beam emission and input coupling of a grating coupler group in one embodiment;

[0032] Figure 5 This is a schematic diagram of the micro-hemispherical resonator lip and interdigitated electrode structure in one embodiment.

[0033] Explanation of reference numerals in the attached figures:

[0034] Vacuum cavity 1, substrate 2, uncoated micro-hemispherical resonator 3, lip 31, laser 4, first multimode interferometer beam splitter 5, photodetector 6, phase modulator 7, grating coupler group 8, output grating coupler 81, receiving grating coupler 82, second multimode interferometer beam splitter 9, multimode interferometer beam combiner 10, interdigitated electrode 11, edge coupler 12.

[0035] The objectives, features, and advantages of this invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0038] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection, an electrical connection, a physical connection, or a wireless communication connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two elements or the interaction between two elements, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0040] It is understood that the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0041] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0042] like Figures 1 to 5As shown, a photonic chip-integrated micro-hemispherical resonator gyroscope is provided, comprising: a vacuum cavity 1, a substrate 2 disposed within the vacuum cavity 1, and an uncoated micro-hemispherical resonator 3 disposed on the substrate 2; an interdigitated electrode driving unit and a silicon-based photonic chip are also disposed on the substrate 2; the interdigitated electrode driving unit is arranged below the edge of the uncoated micro-hemispherical resonator 3; the silicon-based photonic chip includes a laser 4, a first multimode interferometer beam splitter 5, an optical branch coherent functional component, and a photodetector 6 connected sequentially in the optical path. The number of optical branch coherent functional components and photodetectors 6 corresponds to the number of branches at the output end of the first multimode interferometer beam splitter 5, and the grating coupler group 8 in the optical branch coherent functional component is arranged below the edge of the uncoated micro-hemispherical resonator 3. In this embodiment, the devices are connected by waveguides to ensure single-mode transmission in the communication band while maintaining low transmission loss. The waveguides can be silicon waveguides, silicon nitride waveguides, lithium niobate waveguides, etc.

[0043] Specifically, to ensure high-sensitivity detection and low-noise operation of the system, vacuum chamber 1 is hermetically sealed by bonding a ceramic substrate and a Kovar alloy cover plate with gold-tin eutectic solder, maintaining an internal vacuum level of 10 for an extended period. -3 Above Pa, the influence of gas damping on the motion of the uncoated micro-hemispherical resonator 3 can be significantly reduced, improving its quality factor (Q value). The electrical interface of the vacuum chamber 1 is realized through metallized through-holes on the ceramic substrate, which can reliably lead out the driving signal of the laser 4, the excitation signal of the interdigital electrode 11, and the detection output of the photodetector 6 to the outside of the package, facilitating the interface with the control system and data acquisition system.

[0044] Substrate 2 is a silicon-on-insulator (SOI) substrate, providing an ideal transmission environment for the waveguide while exhibiting low leakage current, low parasitic capacitance, and radiation resistance, making it suitable for the harsh operating environments of high-end equipment. The waveguide on substrate 2 is limited to single-mode waveguide dimensions, providing an ideal transmission environment for the waveguide.

[0045] The uncoated micro-hemispherical resonator 3 is manufactured using high-purity fused silica material through micro-blown glass precision molding technology, exhibiting excellent geometric symmetry and surface smoothness. It is firmly fixed to the substrate 2 via an anodic bonding process. The uncoated micro-hemispherical resonator 3 has a hemispherical cavity structure, with its center concave and extending inward to the substrate 2 to form a hollow central pillar. The edges of the hemisphere curve outward to form a lip 31, which is a periodically bent annular structure suitable for the surrounding arrangement of the interdigitated electrode drive unit and the alignment and detection of the grating coupler group 8, and also facilitates the adjustment of the resonator. Because this invention employs an optical detection architecture, the resonator can be tested for performance without coating, making it possible to perform rapid, online performance screening of the "bare" resonator at the front end of manufacturing (before the coating process). This allows for accurate acquisition of core parameters such as its intrinsic frequency, Q value, and frequency splitting, enabling the early rejection of unqualified products, avoiding ineffective cost investments in subsequent processes, providing data feedback for process improvement, and increasing manufacturing yield.

[0046] The interdigitated electrode driving unit includes two or more interdigitated electrode groups, which are arranged circumferentially below the edge of the uncoated microhemispherical resonator 3, preferably directly below the lip 31. Each interdigitated electrode group includes two interdigitated electrodes 11, which are interlocking comb-shaped electrodes. The interdigitated electrodes 11 are made of metal and can generate a uniformly distributed alternating electric field. By applying a DC bias voltage and an AC driving voltage matching the natural frequency of the resonator to the paired interdigitated electrodes 11, a periodic alternating electrostatic force can be generated between the interdigitated electrodes and the uncoated microhemispherical resonator. This non-contact, efficient excitation of the uncoated microhemispherical resonator 3 produces stable four-antinode standing wave vibrations, avoiding the risk of scratching or crushing the microstructure of the resonator caused by contact excitation.

[0047] The silicon-based photonic chip is integrated on the upper surface of substrate 2, and its optical path connection is as follows: laser 4 is fixed at the side of substrate 2 and outputs stable coherent laser. An edge coupler 12 is provided at the output end of laser 4. The edge coupler 12 adopts an adiabatic conical structure, which can effectively reduce coupling loss. Its output end is connected to the input end of the first multimode interferometer beam splitter 5.

[0048] The first multimode interferometer beam splitter 5 is based on the self-image effect principle. By precisely controlling the length and width of the multimode region, it achieves a 50:50 energy distribution with an error not exceeding ±1%. The first multimode interferometer beam splitter 5 has one or more output branches, the specific number determined according to requirements. Setting multiple output branches allows for vibration measurements at more points. Each output branch is connected to an optical branch coherent functional component; therefore, the number of optical branch coherent functional components corresponds to the number of output branches of the first multimode interferometer beam splitter 5. When the first multimode interferometer beam splitter 5 has two or more output branches, there are also two or more optical branch coherent functional components, arranged at circumferential intervals.

[0049] In this embodiment, taking the example that the output end of the first multimode interferometer beam splitter 5 has two branches, the number of optical branch coherent functional components and photodetectors 6 is two.

[0050] The optical branch coherent functional components include a phase modulator 7, a grating coupler group 8, a second multimode interferometer beamsplitter 9, and a multimode interferometer beam combiner 10. The second multimode interferometer beamsplitter 9 has two outputs, thus the optical branches are configured as a first branch and a second branch in parallel. The phase modulator 7 and the grating coupler group 8 are respectively arranged on the first and second branches, forming a reference optical path and a signal optical path. The grating coupler group 8 needs to be positioned below the edge of the uncoated micro-hemispherical resonator 3. Preferably, the grating coupler group 8 is positioned directly opposite the lower surface of the lip 31 of the uncoated micro-hemispherical resonator 3 to ensure efficient interaction between the optical signal and the vibration-sensitive area of ​​the uncoated micro-hemispherical resonator 3. The phase modulator 7 can be arranged at any position in the first branch as needed.

[0051] The grating coupler group 8 includes an output grating coupler 81 and a receiving grating coupler 82 arranged along the optical signal transmission direction to realize the transmission and reception of optical signals. The output grating coupler 81 and the receiving grating coupler 82 have the same structure and are symmetrically arranged. The output grating coupler 81 is connected to the output end of the second multimode interferometer beam splitter 9; the receiving grating coupler 82 is connected to the input end of the multimode interferometer beam combiner 10.

[0052] The input end of the second multimode interferometer beam splitter 9 is branched and connected to the output end of the first multimode interferometer beam splitter 5. The two output ends are respectively connected to the input end of the phase modulator 7 and the output grating coupler 81 in the grating coupler group 8. The output end of the phase modulator 7 and the receiving grating coupler 82 in the grating coupler group 8 are connected to the input end of the multimode interferometer beam combiner 10. The output end of the multimode interferometer beam combiner 10 is connected to the photodetector 6.

[0053] In the reference optical path, the phase modulator 7 can be a silicon-based or lithium niobate thermo-optical phase modulator or an electro-optical modulator. The heating electrode of the thermo-optical phase modulator is made of titanium nitride (TiN). It is driven by a precision current source and changes the temperature of the waveguide region by Joule heating. It utilizes the thermo-optical effect of silicon material to achieve precise control of the reference optical phase, which has the advantages of higher modulation rate and lower power consumption.

[0054] In the signal optical path, the output grating coupler 81 emits an upward optical signal at a certain angle. The optical signal illuminates the lower surface of the lip 31 of the uncoated micro-hemispherical resonator 3, causing the resonator structure to vibrate. During the illumination of the lower surface of the lip 31, the optical signal interacts with the resonator structure, and vibrational information is loaded into the optical signal. The optical signal carrying the vibrational information is reflected by the lower surface of the lip 31 and returns to the receiving grating coupler 82. The setting angle of the output grating coupler 81 and the receiving grating coupler 82 mainly depends on the wavelength, grating period, and equivalent refractive index of the material selected in the design. Appropriate parameters can be set by adjusting the arrangement height of the resonator structure; the typical setting angle is 8°-15°.

[0055] The photodetector 6 uses a germanium photodetector (GePD), which has a PIN structure and typically has a photocurrent conversion responsivity of 0.8~1.1A / W and a 3dB bandwidth of over 100MHz. It can accurately convert interference optical signals into electrical signal outputs.

[0056] The working process of the photonic chip integrated micro-hemispherical resonator gyroscope in this embodiment is as follows: By applying a DC bias voltage and an AC driving voltage matching the natural frequency of the resonator to the paired interdigital electrodes 11, a periodic alternating electrostatic force can be generated between the interdigital electrodes and the uncoated micro-hemispherical resonator 3, which efficiently excites the uncoated micro-hemispherical resonator 3 to generate a stable four-antinode standing wave vibration in a non-contact manner; the laser 4 outputs coherent laser light, which is coupled by the edge coupler 12 and then transmitted through the waveguide to the first multimode interferometer beam splitter 5 to split into two optical signals, which are transmitted along the first branch and the second branch, respectively. The optical signal of the first branch enters the phase modulator 7 for phase modulation to generate a demodulated carrier; the optical signal of the second branch is diffracted out of the silicon-based photonic chip through the output grating coupler 81 and irradiates the uncoated micro-hemispherical resonator 3. The lower surface of the lip 31 of the hemispherical resonator 3 interacts with the uncoated micro-hemispherical resonator 3, and the vibration information is loaded into the optical signal through the Doppler effect. The reflected optical signal carrying the vibration information of the uncoated micro-hemispherical resonator 3 is reflected by the lower surface of the lip 31 and coupled back to the second branch through the adjacent receiving grating coupler 82. Then, it is transmitted together with the phase-modulated reference light in the first branch to the multimode interferometer beam combiner 10. Coherent interference occurs in the multimode interference region and they are merged into one optical signal. The interference optical signal is transmitted to the photodetector 6, converted into an electrical signal output, and the carrier term is separated by a high-pass filter or demodulation algorithm (such as PGC). The phase difference between the two signals is solved, and the vibration displacement information of the uncoated micro-hemispherical resonator 3 is obtained. Finally, the accurate measurement of the carrier angular velocity is realized.

[0057] The photonic chip-integrated micro-hemispherical resonator gyroscope provided by this invention detects the vibration signal of the resonator non-contactly through optical methods by directly integrating optical elements on the chip. It eliminates the need for any additional metal film on the surface of the resonator, fundamentally eliminating the additional damping and stress caused by coating. This creates conditions for preserving the core performance potential of the resonator's high quality factor (high Q value), and is a key path to improving the final accuracy and noise level of the gyroscope.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. A photonic chip-integrated micro-hemispherical resonator gyroscope, characterized in that, include: A vacuum cavity (1), a substrate (2) disposed within the vacuum cavity (1), and an uncoated micro-hemispherical resonator (3) disposed on the substrate (2); An interdigitated electrode driving unit and a silicon-based photonic chip are also disposed on the substrate (2); the interdigitated electrode driving unit is arranged below the edge of the uncoated micro-hemispherical resonator (3); The silicon-based photonic chip includes a laser (4), a first multimode interferometer beam splitter (5), an optical branch coherent functional component, and a photodetector (6) connected in sequence according to the optical path. The number of optical branch coherent functional components and the number of photodetectors (6) correspond to the number of branches at the output end of the first multimode interferometer beam splitter (5), and the grating coupler group (8) in the optical branch coherent functional components is arranged below the edge of the uncoated micro hemispherical resonator (3). The optical branch coherent functional components include a phase modulator (7), a grating coupler group (8), a second multimode interferometer beam splitter (9), and a multimode interferometer beam combiner (10). The optical branch includes a first branch and a second branch arranged in parallel. The phase modulator (7) and the grating coupler group (8) are respectively arranged on the first branch and the second branch. The grating coupler group (8) is located below the edge of the uncoated micro-hemispherical resonator (3). The input end of the second multimode interferometer beam splitter (9) is branched and connected to the output end of the first multimode interferometer beam splitter (5). The two output ends are respectively connected to the input end of the phase modulator (7) and the input end of the grating coupler group (8). The output end of the phase modulator (7) and the output end of the grating coupler group (8) are connected to the input end of the multimode interferometer beam combiner (10). The output end of the multimode interferometer beam combiner (10) is connected to the photodetector (6). The grating coupler group (8) includes an outgoing grating coupler (81) and a receiving grating coupler (82) arranged along the optical signal transmission direction. The output grating coupler (81) is connected to the output end of the second multimode interferometer beam splitter (9); the receiving grating coupler (82) is connected to the input end of the multimode interferometer beam combiner (10); The interdigitated electrode driving unit includes two or more interdigitated electrode groups, which are arranged circumferentially below the edge of the uncoated micro-hemispherical resonator (3). The uncoated micro-hemispherical resonator (3) is a hemispherical cavity structure with its center recessed and extending inward to the substrate (2) to form a hollow central pillar; The edge of the uncoated micro-hemispherical harmonic oscillator (3) bends outward to form a lip (31), and the lip (31) is a ring structure formed by periodic bending.

2. The photonic chip-integrated micro-hemispherical resonator gyroscope according to claim 1, characterized in that, The interdigitated electrode group includes two interdigitated electrodes (11), which are interlocking comb-shaped electrodes.

3. The photonic chip-integrated micro-hemispherical resonator gyroscope according to claim 1 or 2, characterized in that, The phase modulator (7) is a phase modulator of a silicon-based or lithium niobate thermo-optical phase modulator or an electro-optical modulator.

4. The photonic chip-integrated micro-hemispherical resonator gyroscope according to claim 1 or 2, characterized in that, An edge coupler (12) is provided at the output end of the laser (4), and the output end of the edge coupler (12) is connected to the input end of the first multimode interferometer beam splitter (5).

5. The photonic chip-integrated micro-hemispherical resonator gyroscope according to claim 4, characterized in that, The edge coupler (12) adopts an adiabatic conical structure.

6. The photonic chip-integrated micro-hemispherical resonator gyroscope according to claim 1 or 2, characterized in that, The substrate (2) is a silicon-on-insulator substrate.

Images