Simulation test method and device of component, electronic equipment and storage medium

Abstract

The invention provides a simulation test method and device for a component, electronic equipment and a storage medium, and the method comprises the steps: carrying out the non-destructive detection of the component, obtaining the external data corresponding to the component, and carrying out the destructive detection of the component, and obtaining the internal data corresponding to the component; based on the external data and the internal data, performing three-dimensional modeling on the component to obtain a component model; according to the method and the device, the preset simulation test data is acquired, the multi-physical field simulation test is performed on the device model based on the preset simulation test data, and the test data corresponding to the component is obtained, so that the technical problem that the test data obtained by performing the multi-physical field test on the component in the prior art is inaccurate is solved; and the purpose of accurately carrying out multi-physical field testing on the component is achieved.

Description

Technical Field

[0001] This application relates to the field of quality testing technology, and in particular to a simulation testing method, apparatus, electronic device and storage medium for electronic components. Background Technology

[0002] Micro-Electro-Mechanical Systems (MEMS) components offer advantages such as small size, light weight, and reliable operation, significantly reducing the overall structural dimensions of device systems and providing ample space to accommodate the addition of new functions and devices. However, they still face challenges, such as measurement noise, temperature effects, and long-term stability. During operation, components are subjected to internal circuit currents and complex external environments, which may cause performance degradation, leading to thermoelectric stress concentration in the chip, affecting component functionality, and further jeopardizing the functionality and safety of the device system.

[0003] Therefore, multiphysics testing is required before microelectromechanical system (MEMS) components are put into use. However, the actual testing environment for multiphysics testing of MEMS components is often complex and variable, making it difficult to precisely control all variables. Furthermore, in multiphysics coupling tests, the interactions between different physical fields can be highly complex and difficult to predict and control accurately. This uncontrollability increases the uncertainty of the test results and reduces the accuracy of the tests. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a simulation test method, apparatus, electronic device and storage medium for components, so as to overcome all or part of the deficiencies in the prior art.

[0005] To achieve the above objectives, this application provides a simulation testing method for electronic components, comprising: performing non-destructive testing on the component to obtain external data corresponding to the component, and performing destructive testing on the component to obtain internal data corresponding to the component; performing three-dimensional modeling on the component based on the external data and the internal data to obtain a component model; acquiring predetermined simulation test data; and performing multiphysics simulation testing on the component model based on the predetermined simulation test data to obtain test data corresponding to the component.

[0006] Optionally, the non-destructive testing includes visual inspection and X-ray scanning; the non-destructive testing of the component to obtain the external data corresponding to the component includes: acquiring predetermined product information corresponding to the component; performing visual inspection on the component based on the predetermined product information and the component to obtain visual data corresponding to the component; performing X-ray scanning on the component to obtain internal component data corresponding to the component; and determining the visual data and the internal component data as the external data.

[0007] Optionally, the destructive testing includes internal morphology inspection, cutting process, and material feature analysis; the destructive testing of the component to obtain the internal data corresponding to the component includes: removing the encapsulation shell of the component; inspecting the internal morphology of the component after removing the encapsulation shell to obtain the internal morphology data corresponding to the component; cutting the component after removing the encapsulation shell to obtain the multi-layer composition structure corresponding to the component and the composition structure data corresponding to each layer; performing material feature analysis on each layer to obtain the microstructure data and morphology evolution data corresponding to the composition structure; and determining the internal morphology data, all composition structure data, all microstructure data, and all morphology evolution data as the internal data.

[0008] Optionally, the step of performing three-dimensional modeling of the component based on the external data and the internal data to obtain a component model includes: assembling the component based on the external data and the internal data to obtain an initial component model; and setting the material and meshing the initial component model to obtain the final component model.

[0009] Optionally, the predetermined simulation test data includes a predetermined set of operating temperatures and a first predetermined power; the step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain test data corresponding to the device includes: for each first predetermined operating temperature in the predetermined set of operating temperatures, in response to determining that the temperature applied to the device model has reached the first predetermined operating temperature, applying the first predetermined power to the device model, and after a predetermined time, performing structural analysis on the device model to obtain test data corresponding to the device model.

[0010] Optionally, the predetermined simulation test data further includes a second predetermined operating temperature and a second predetermined power; the step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain the test data corresponding to the device includes: applying the second predetermined operating temperature and the second predetermined power to the device model, performing structural analysis on the device model, and obtaining the test data corresponding to the device model.

[0011] Optionally, the predetermined simulation test data further includes predetermined magnetic field parameters and a third predetermined operating temperature; the step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain test data corresponding to the device includes: setting the magnetic field environment of the device model based on the predetermined magnetic field parameters, and calculating the eddy current field corresponding to the device model under the magnetic field environment; determining the initial temperature distribution corresponding to the device model based on the eddy current field; determining the final temperature distribution corresponding to the device model based on the initial temperature distribution and the third predetermined operating temperature; applying temperature to the device model according to the final temperature distribution, and performing structural analysis on the device model to obtain test data corresponding to the device model.

[0012] Based on the same inventive concept, this application also provides a simulation testing device for electronic components, comprising: a detection module configured to perform non-destructive testing on the component to obtain external data corresponding to the component, and to perform destructive testing on the component to obtain internal data corresponding to the component; a modeling module configured to perform three-dimensional modeling of the component based on the external data and the internal data to obtain a component model; and a simulation testing module configured to acquire predetermined simulation test data, and to perform multiphysics simulation testing on the component model based on the predetermined simulation test data to obtain test data corresponding to the component.

[0013] Based on the same inventive concept, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0014] Based on the same inventive concept, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform the method described above.

[0015] As can be seen from the above, the simulation testing method, apparatus, electronic device, and storage medium for components provided in this application include non-destructive testing of the components to obtain external data corresponding to the components, and destructive testing of the components to obtain internal data corresponding to the components, thereby achieving the goal of comprehensively and accurately obtaining the data required for component modeling. Based on the external and internal data, a three-dimensional model of the components is performed to obtain a device model, achieving the goal of accurately constructing the device model. Predetermined simulation test data is obtained, and based on the predetermined simulation test data, multiphysics simulation testing is performed on the device model to obtain the test data corresponding to the components, achieving the goal of accurately performing multiphysics simulation testing on the components and ensuring the accuracy of the obtained component test data. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart illustrating the simulation testing method for components according to an embodiment of this application. Figure 2 This is a topographic image of the MEMS accelerometer according to an embodiment of this application under X-rays. Figure 3 This is a schematic diagram showing the energy spectrum analysis results of some components of a MEMS accelerometer according to an embodiment of this application; Figure 4(a) is a front view of the MEMS accelerometer model according to an embodiment of this application; Figure 4(b) is a schematic diagram of the back of a MEMS accelerometer model according to an embodiment of this application; Figure 5 This is a schematic diagram of the overall mesh generation result of the MEMS accelerometer model according to an embodiment of this application; Figure 6(a) is a schematic diagram of the test data of the device model subjected to cyclic temperature and electrical multiphysics simulation tests according to an embodiment of this application; Figure 6(b) is a schematic diagram of the lead neck in the test results of the device model under cyclic temperature and electrical multiphysics simulation test according to an embodiment of this application; Figure 7 This is a schematic diagram of test data for multiphysics simulation testing of instantaneous temperature and electricity on a component model according to an embodiment of this application; Figure 8(a) is a schematic diagram of the zero magnetic field boundary in the magnetic field environment of the device model in the embodiment of this application; Figure 8(b) is a schematic diagram of the magnetic field in the Y-axis direction of the magnetic field environment of the device model in the embodiment of this application; Figure 8(c) is a vector diagram of the current density in the magnetic field environment of the device model in the embodiment of this application; Figure 9 This is a schematic diagram of the final temperature distribution in an embodiment of this application; Figure 10(a) is a schematic diagram of the overall deformation of the device model according to an embodiment of this application; Figure 10(b) is a schematic diagram of the adhesive on the chip corresponding to the location of maximum deformation in an embodiment of this application; Figure 10(c) is a schematic diagram of the lead wire corresponding to the maximum deformation point in an embodiment of this application; Figure 10(d) is a schematic diagram of the overall distribution of the maximum principal stress in an embodiment of this application; Figure 10(e) is a schematic diagram of the main strain results of an embodiment of this application; Figure 11 This is a schematic diagram of the structure of the simulation testing device for the components in an embodiment of this application; Figure 12 This is a schematic diagram of the hardware structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0019] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0020] As described in the background section, compared to other electronic components, MEMS components have advantages such as small size, light weight, and reliable operation. They can significantly reduce the overall structural size of the device system, providing ample space to meet the needs of adding new functions and devices. With continuous technological advancements, the accuracy and stability of MEMS components have been significantly improved, but they still face challenges such as measurement noise, temperature effects, and long-term stability. During use, MEMS components are affected by internal circuit currents and complex external environments, which may cause performance misalignment, resulting in thermoelectric stress concentration in the chip, affecting component functionality, and further jeopardizing the functionality and safety of the device system.

[0021] Domestic and international scholars mainly focus their research and innovation on the structural design, manufacturing process, signal processing, and performance optimization of MEMS devices, involving key technologies such as piezoresistive effect, capacitive sensing, and temperature compensation. However, the adaptability of MEMS devices to complex environments and their long-term reliability, especially their performance stability under extreme environments, multi-physics coupling effects, and the application of new materials and processes, still require in-depth exploration. Due to the special nature of MEMS devices, their operation is affected by internal circuit currents and complex external environments, which may cause performance mismatches and lead to thermoelectric stress concentration in the chip. Therefore, multi-physics testing is required before MEMS devices are put into use. In actual multi-physics testing of MEMS devices, the actual test environment is often complex and variable, making it difficult to accurately control all variables. In addition, in multi-physics coupling tests, the interactions between different physical fields can be very complex and difficult to predict and control accurately. This uncontrollability increases the uncertainty of test results and reduces the accuracy of the tests. In addition, traditional multi-physics testing of components mainly focuses on the electro-thermal coupling effect, and is insufficient in analyzing the influence of magnetic field environment on the device, such as eddy current field and induced current heat generation, resulting in inaccurate testing of MEMS components.

[0022] In view of this, embodiments of this application propose a simulation testing method for electronic components, referring to... Figure 1 This includes the following steps: Step 101: Perform non-destructive testing on the component to obtain the external data corresponding to the component, and perform destructive testing on the component to obtain the internal data corresponding to the component.

[0023] In this step, to avoid interference from the actual testing environment on component testing, this application performs multi-physics simulation testing on the components. Simulation testing, through computer modeling, can accurately simulate the behavior of components under multi-physics conditions. By adjusting the simulation test data, the coupling effect between different physical fields can be simulated, thereby more accurately predicting the performance of the components. For example, the components in this application are MEMS components, such as a MEMS accelerometer. First, accurate modeling of the components is required, which necessitates obtaining the data required for modeling. Comprehensive testing of the components is then performed. First, non-destructive testing is conducted to obtain the corresponding external data, where non-destructive testing refers to testing that does not cause physical damage to the components. Second, destructive testing is conducted to obtain the corresponding internal data, where destructive testing refers to testing that causes physical damage to the components. By performing multiple tests on the components, comprehensive external and internal data required for constructing the components are obtained, achieving the goal of accurately obtaining the modeling data required for the components. Through both destructive and non-destructive testing, the goal of comprehensively and accurately obtaining the data required for component modeling is achieved.

[0024] Step 102: Based on the external data and the internal data, perform three-dimensional modeling of the component to obtain the component model.

[0025] In this step, based on the corresponding external and internal data of the component, a 3D model is created to obtain a component model. This component model is stored in the computer and displayed on a screen. 3D modeling allows for accurate display of the component model, avoiding visual errors associated with 2D modeling. By using comprehensive and accurate external and internal data to construct the component model, the goal of accurately constructing the component model is achieved.

[0026] Step 103: Obtain predetermined simulation test data; based on the predetermined simulation test data, perform multiphysics simulation test on the device model to obtain the test data corresponding to the device.

[0027] In this step, predetermined simulation test data is acquired. This predetermined simulation test data includes multiphysics data, such as electrical and thermal data, or magnetic and thermal data. The predetermined simulation test data is determined according to actual experimental requirements. Based on the predetermined simulation test data, multiphysics simulation tests are performed on the device model to obtain the corresponding test data for the component. The predetermined simulation test data determines which physical fields to simulate on the device model. For example, if the predetermined simulation data is electrical and thermal data, the device model is simulated for electrical and thermal physical fields; if the predetermined simulation data is magnetic and thermal data, the device model is simulated for magnetic and thermal physical fields. By performing multiphysics simulation tests on a precisely constructed device model, the mutual interference between various factors in actual multiphysics testing is avoided, achieving the goal of accurate multiphysics simulation testing of the component and ensuring the accuracy of the obtained component test data.

[0028] This application, considering the unique characteristics of MEMS device structure, fabrication process, materials, and operation, proposes a 3D modeling and electro-thermal-magnetic multiphysics simulation method for MEMS devices. Addressing these unique characteristics, it analyzes failure modes and mechanisms under electro-thermal-magnetic conditions. By analyzing stress cloud maps of MEMS devices under different stresses through simulation, it effectively identifies sensitive stress distributions and weak points (such as stress concentration areas and thermal deformation sites) in the MEMS structure under multiphysics fields. This provides a basis for optimizing device testing conditions and improving failure analysis capabilities, effectively supporting quality control of MEMS devices. It is of great significance for optimizing MEMS device design and improving the reliability of such devices. Specifically, the research results can provide a basis for optimizing MEMS device testing conditions and improving failure analysis capabilities, effectively supporting quality control of MEMS devices, improving the reliability of such devices, and promoting the wider application of MEMS devices in aerospace, IoT, wearable devices, and other fields. It is also of great significance for standardizing application research quality improvement and evaluation, and ensuring application reliability.

[0029] The above scheme involves non-destructive testing of components to obtain their corresponding external data, and destructive testing to obtain their corresponding internal data, thus achieving the goal of obtaining comprehensive and accurate data required for component modeling. Based on the external and internal data, a 3D model of the component is created, resulting in a device model that accurately constructs the device model. Predetermined simulation test data is then acquired, and based on this data, multiphysics simulation tests are performed on the device model to obtain corresponding test data, achieving the goal of accurate multiphysics simulation testing of the component and ensuring the accuracy of the obtained test data.

[0030] In some embodiments, the non-destructive testing includes visual inspection and X-ray scanning; the non-destructive testing of the component to obtain the external data corresponding to the component includes: acquiring predetermined product information corresponding to the component; performing visual inspection on the component based on the predetermined product information and the component to obtain visual data corresponding to the component; performing X-ray scanning on the component to obtain internal component data corresponding to the component; and determining the visual data and the internal component data as the external data. In this embodiment, predetermined product information corresponding to the component is obtained. This predetermined product information includes descriptions of the component's product parameters, such as its external dimensions. Based on the predetermined product information and the component, an appearance inspection is performed on the component to obtain its appearance data. An optical microscope is used to inspect the component's appearance, obtaining its external shape data. A vernier caliper is used to measure the component, obtaining its product dimension data. Each data point in the appearance data is compared with its corresponding data in the predetermined product information to accurately determine the appearance data. For example, for each dimension data point, in response to determining that the error between the dimension data and the corresponding dimension in the predetermined product information is less than a predetermined error, the dimension data is determined as the target dimension data; in response to determining that the error between the dimension data and the corresponding dimension in the predetermined product information is greater than or equal to a predetermined error, the dimension in the corresponding dimension in the predetermined product information is determined as the target dimension data. By comparing the measured product dimension data with the dimensions in the predetermined product information, the component's dimensions are accurately determined. The product external shape data and all target dimension data together constitute the appearance data corresponding to the component.

[0031] X-ray scanning is performed on components to obtain data on their internal parts. For example, X-rays are used to scan the components. Without damaging the component's integrity, X-rays are used to visualize its internal structure, and the software's automatic measurement function is used to measure the dimensional parameters and positional information of the internal parts. These dimensional parameters and positional information together constitute the component's internal part data. The external data, including both appearance and internal part data, is then defined as external data. By performing visual inspection and X-ray scanning on the components, a comprehensive and accurate determination of the component's external data is achieved.

[0032] For example, when the component is a certain MEMS accelerometer, the morphology of the MEMS accelerometer under X-ray is as follows: Figure 2 As shown, two chips of different sizes are visible, connected by five leads. The larger chip is connected to external pins via several leads. X-ray imaging alone cannot reveal further information about the chip's horizontal structural parameters. Therefore, it is considered to open the component package and use a high-powered microscope to observe the internal morphology, chip and pin bonding, and chip integrity.

[0033] In some embodiments, the destructive testing includes internal morphology inspection, cutting process, and material feature analysis; the destructive testing of the component to obtain the internal data corresponding to the component includes: removing the encapsulation shell of the component; inspecting the internal morphology of the component after removing the encapsulation shell to obtain the internal morphology data corresponding to the component; cutting the component after removing the encapsulation shell to obtain the multi-layer composition structure corresponding to the component and the composition structure data corresponding to each layer of the composition structure; performing material feature analysis on each layer of the composition structure to obtain the microstructure data and morphology evolution data corresponding to the composition structure; and determining the internal morphology data, all composition structure data, all microstructure data, and all morphology evolution data as the internal data. In this embodiment, the component has a packaged shell. To obtain more accurate internal data, the packaged shell is removed. After removing the packaged shell, the overall internal structure of the component can be fully displayed. The internal morphology of the component after removing the packaged shell is inspected to obtain internal morphology data. Specifically, the internal structure and material properties of the component after removing the packaged shell are analyzed and tested to obtain internal morphology data. Removing the packaged shell clearly shows the internal morphology of the component, the integrity of each bonding wire, and the shape of the bonding points. A metallographic microscope is used to observe the exposed component to study its internal structure, including the chip, pins, and solder joints. At high magnification, the solder joint spacing and solder joint size can be accurately measured, allowing for the creation of a more accurate model.

[0034] Components have a certain volume. To accurately obtain the detailed internal structure of components, it is necessary to cut the components after removing the outer casing to obtain the multi-layered structure of the component and the structural data of each layer. The structural structure is a cross-section of the component. The cutting process includes cutting, grinding, polishing, and cleaning, making the obtained multi-layered structural structure and the structural data of each layer more accurate. The structural structure is then placed under an optical microscope, and computer measurement software is used to measure the precise thickness of the internal parts and the thickness of the adhesive layer, further providing accurate parameter information for building a device model.

[0035] Finally, further analysis of each layer's composition is required. For each layer, material characteristic analysis is performed to obtain the corresponding microstructure and morphological evolution data. This material characteristic analysis specifically includes scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). SEM is used to scan and image the composition, capturing information about the material's microstructure and morphological evolution. For example, in the case of a MEMS accelerometer, the EDS results for some components of that MEMS accelerometer are as follows: Figure 3As shown. Energy dispersive spectroscopy (EDS) analysis results show that, excluding the influence of the sample preparation resin, both chips are composed of pure silicon. The adhesive material for chip 1 is conductive silver paste, a polymer of resin matrix and conductive silver ions. The ceramic package is composed of aluminum oxide. The main component of the metal cover is gold, with a certain amount of tin doped in. The chip is connected to a very thin tungsten metal layer via conductive silver paste, and then to the ceramic substrate. Ultimately, the chip material is defined as silicon, the adhesives as conductive silver paste and polydimethylsiloxane organic adhesive, the package as aluminum oxide, the cover plate as Kovar alloy, the leads as gold, the metal layer between the chip and the package as tin, and the pads as aluminum. Internal morphology data, all compositional structure data, all microstructure data, and all morphological evolution data are defined as internal data. By performing internal morphology inspection, cutting processing, and material characteristic analysis on the components, the goal of comprehensively and accurately determining the internal data of the components is achieved.

[0036] In some embodiments, the step of performing three-dimensional modeling of the components based on the external data and the internal data to obtain a device model includes: assembling the components based on the external data and the internal data to obtain an initial device model; and setting materials and meshing the initial device model to obtain the device model. In this embodiment, both external and internal data comprehensively include the data required for modeling the components. Based on the external and internal data, component assembly is performed to obtain an initial component model. Component assembly specifically includes component part assembly and overall component assembly. For example, for ceramic-packaged component products, models of components such as the ceramic shell, bonding material, chip, substrate, lead frame, bonding wire, solder joints, and pins are established. Then, the models of each part are uniformly imported into the assembly and assembled together, using mating relationships such as overlap, parallelism, distance, and locking. For example, in the case of a MEMS accelerometer, the components of this MEMS accelerometer mainly include a ceramic shell, bonding material, two chips, substrate, lead frame, a bonding wire, b solder joints, and c pins. The chip body is made of silicon dioxide, the leads are gold wires, and the layer on top of the chip where it bonds to the gold wires is a thin aluminum sheet. The lead frame and pins are symmetrically distributed, so only a partial lead frame and pin model is built. The b solder joint models are replaced with two solder joint models, reducing the number of part models and subsequent calculation time. Figure 4(a) is a front view of the MEMS accelerometer model (with the metal cover hidden), and Figure 4(b) is a back view of the MEMS accelerometer model. The model contains a larger MEMS chip on the left (chip 1) and corresponding chip adhesive 1, and a thicker MEMS chip on the right (chip 2) and corresponding chip adhesive 2.

[0037] To make the initial device model more closely resemble the actual device, the materials of the initial model are set according to the materials of the device. The materials of the initial model can be obtained from the energy dispersive spectroscopy (EDS) analysis results of the corresponding device and pre-determined product data. For example, in the case of a MEMS accelerometer, based on the EDS analysis results of that MEMS accelerometer, chip adhesive 1 is nano-silver solder paste, and chip adhesive 2 is polydimethylsiloxane. The chip is made of high-purity silicon, and silicon material property data, such as thin-film silica density, Young's modulus, and Poisson's ratio, are added.

[0038] To ensure mesh convergence and appropriate computation time, the cell size of the mesh is set, and the initial device model is meshed. Different mesh sizes are used for different parts in the initial model to ensure the accuracy of subsequent simulation results for different parts. Meshing the initial device model before simulation transforms a continuous physical problem into a discrete numerical problem that can be processed by a computer. By constructing a numerical computation framework that conforms to physical laws, the simulation can accurately simulate the behavior of components under real-world conditions. Balancing computational accuracy and efficiency, tetrahedral meshing is used for key bonding areas such as leads and solder joints in the initial model, with a refined mesh BodySize function setting the mesh size to a first predetermined size, for example, 0.06 mm. Hexahedral meshing is used for ceramic packaging, metal covers, and chips, while other parts are automatically meshed with a second predetermined size, for example, 0.1 mm. Figure 5 The overall mesh generation results of the MEMS accelerometer model are shown. The mesh generation quality distribution is concentrated in the expected value, indicating that the quality of the MEMS accelerometer model is good.

[0039] In another embodiment provided in this application, before performing multiphysics simulation tests on the device model based on predetermined simulation test data, electrical, thermal, and mechanical properties of the packaging materials of each part of the device model are added to the simulation software based on the results of material property analysis of the components and the characteristics of the components themselves. Examples include density, specific heat capacity, thermal conductivity, and resistivity. Defining the electrical, thermal, and mechanical properties of the component packaging materials in the simulation software essentially provides an accurate numerical basis for multiphysics coupling simulation. By quantifying the material's response characteristics to electromagnetic, thermal, and mechanical forces, the simulation can accurately predict the component's electrical performance (such as signal integrity and loss), thermal behavior (such as temperature distribution and heat dissipation efficiency), and structural reliability (such as thermal stress and vibration fatigue) under actual operating conditions. By adding properties to the device model, the results of subsequent multiphysics simulation tests on the device model are ensured to be more accurate.

[0040] In some embodiments, the predetermined simulation test data includes a predetermined set of operating temperatures and a first predetermined power; the step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain test data corresponding to the device includes: for each first predetermined operating temperature in the predetermined set of operating temperatures, in response to determining that the temperature applied to the device model has reached the first predetermined operating temperature, applying the first predetermined power to the device model, and after a predetermined time, performing structural analysis on the device model to obtain test data corresponding to the device model. In this embodiment, the components face the effects of multiple physical fields in actual use scenarios. Due to the complexity and variability of these scenarios, the impact of these fields on the components needs to be considered. Therefore, multiphysics simulation testing is also required during multiphysics simulation testing. In actual use, components often face periodically or randomly changing thermal-electrical power. Cyclic simulation can accurately reproduce these dynamic processes, capture the impact of transient effects on component performance, and eliminate environmental interference in actual testing by strictly defining thermal and electrical conditions, avoiding the possibility of errors introduced by environmental factors (such as laboratory temperature fluctuations and the accuracy of testing equipment). A predetermined operating temperature set is obtained. For example, the predetermined operating temperature set is set according to the following steps: the initial temperature is set to 25℃, the temperature change range is -55℃ to 125℃, the temperature change rate is 20℃ / min, and the dwell time at high and low temperatures is 10min. Three sets of temperature cyclic loads are applied to the component model. Each set of temperature cyclic loads includes four stages, and each stage has 10 substeps. To obtain a first predetermined power, for example, the thermal convection coefficient is taken as 5 W / m²·℃ for natural airflow without a fan, and 0.15 W / mm² is applied to the device model. 3 Power. For each first predetermined operating temperature within the predetermined operating temperature set, if the temperature applied to the device model reaches the first predetermined operating temperature, a first predetermined power is applied to the device model, and cyclic temperature and electrical multiphysics simulation tests are performed on the device model. After the device model undergoes the simulation test at the first predetermined temperature and first predetermined power, the simulation test results need to be analyzed. Since it is a cyclic temperature test, the structural analysis of the device model is only performed after a certain period of time, i.e., after a predetermined time, to obtain the corresponding test data of the device model. For example, the test results of the cyclic temperature and electrical multiphysics simulation test of the device model are shown in Figure 6(a). The maximum stress occurs at both ends of the lead, and the maximum stress reaches 1.67 × 10⁹ Pa, as shown in the enlarged view of the lead neck in Figure 6(b). By performing cyclic temperature and electrical multiphysics simulation tests on the device model, high-stress areas (such as local hot spots caused by thermal-electric coupling and electric field concentration areas) can be quickly identified, avoiding the "trial and error" cost in physical prototype testing and ensuring the accuracy of the test data.

[0041] It should be noted that before conducting multiphysics simulation tests on the device model based on predetermined simulation test data, the device model also needs to be imported for testing to ensure the consistency between the device model and its corresponding components, which helps to improve the credibility of multiphysics coupling simulation.

[0042] In some embodiments, the predetermined simulation test data further includes a second predetermined operating temperature and a second predetermined power; the step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain test data corresponding to the device includes: applying the second predetermined operating temperature and the second predetermined power to the device model, performing structural analysis on the device model, and obtaining test data corresponding to the device model. In this embodiment, a second predetermined operating temperature and a second predetermined power are obtained, and instantaneous temperature and electrical multiphysics simulation tests are performed on the component model. For example, based on the operating temperature range of -65~85℃ specified in the MEMS accelerometer device manual, taking 85℃ as an example, the second predetermined operating temperature is set and applied to the device model casing. A heat source of 0.15 W / mm² is applied to the chip according to the device manual and related volumetric heat source calculation formulas. 3 Power. A second predetermined operating temperature and a second predetermined power are applied to the device model, and structural analysis is immediately performed on the device model to obtain the corresponding test data. For example, test data from multiphysics simulation tests of instantaneous temperature and electricity on a component model are as follows: Figure 7 As shown, the highest temperature occurs at the chip, reaching 85.998℃. The temperature of the leads bonded to the chip also increases accordingly, while the temperature of the lead frame remains basically consistent with the ambient temperature stress. By performing multiphysics simulation tests on the component model for instantaneous temperature and electricity, the impact of transient behavior on the component model is accurately revealed, eliminating interference factors from the actual test environment and ensuring the accuracy of the test data.

[0043] In some embodiments, the predetermined simulation test data further includes predetermined magnetic field parameters and a third predetermined operating temperature; the step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain test data corresponding to the device includes: setting the magnetic field environment of the device model based on the predetermined magnetic field parameters, and calculating the eddy current field corresponding to the device model under the magnetic field environment; determining the initial temperature distribution corresponding to the device model based on the eddy current field; determining the final temperature distribution corresponding to the device model based on the initial temperature distribution and the third predetermined operating temperature; applying temperature to the device model according to the final temperature distribution, and performing structural analysis on the device model to obtain test data corresponding to the device model. In this embodiment, traditional multiphysics testing of electronic components mainly focuses on the electro-thermal coupling effect, and has shortcomings in analyzing the influence of the magnetic field environment on the device, such as eddy current fields and induced current heating. To address these shortcomings, this embodiment performs multiphysics simulation testing on the device model using both magnetic and temperature parameters. Predetermined magnetic field parameters are obtained, and the magnetic field environment of the device model is set according to these parameters. Specifically, an air domain is drawn around the model, and an alternating magnetic field is applied. Boundary conditions are set on the upper surface of the air domain, specifying the magnitude and direction of the magnetic field strength. Simultaneously, zero magnetic field boundary conditions are added to the planes of the air domains on both sides. For example, a magnetic field in the Y-axis direction is applied to the device model, with a magnetic induction intensity of 0.1T and a frequency selected as 500Hz, typical of industrial mid-frequency interference. Meanwhile, zero magnetic field boundary conditions are added to the air domain planes on both sides to ensure that the magnetic field does not exceed this area. The zero magnetic field boundary in the magnetic field environment of the device model is shown in Figure 8(a). The magnetic field in the Y-axis direction in the magnetic field environment of the device model is shown in Figure 8(b). The current density result generated on the device model is shown in Figure 8(c). The current is mainly generated on the metal cover plate and metal layer perpendicular to the magnetic field direction, and a small amount of current also exists at the pins, etc.

[0044] The eddy current field corresponding to the device model under this magnetic field environment is calculated. For example, the device model is imported into the Maxwell 3D module for eddy current field calculation. According to Faraday's law of electromagnetic induction, when the device model is in an alternating magnetic field (or the conductor moves relative to the magnetic field), an eddy current field will be induced inside the conductor. When the eddy current flows in the conductor, Joule heating is generated due to the resistance, causing the temperature of the device model to change. Therefore, based on the eddy current field, the initial temperature distribution corresponding to the device model is determined. The final temperature distribution corresponding to the device model is determined by the initial temperature distribution and the third predetermined operating temperature. Transient thermal analysis and static stress-strain analysis are performed under the eddy current field conditions. The initial temperature distribution calculated by the eddy current field is imported into the transient thermal module, and combined with the third predetermined operating temperature to generate the overall temperature distribution, i.e., the final temperature distribution. Then, the final temperature distribution is imported into the static structure module, the bottom surface of the package is fixed, and the temperature is applied to the device model according to the final temperature distribution. Structural analysis is performed on the device model to obtain the corresponding test data. The overall deformation, maximum stress, and strain of the component are simulated and analyzed. The test data includes the overall deformation, maximum stress, and strain. Conducting simulation experiments based on magnetic field-eddy current-temperature-structure coupling can accurately analyze the failure mechanism of components under complex electromagnetic and thermodynamic multi-field interactions. By constructing a full-chain numerical model of "magnetic field excitation → eddy current generation → heat accumulation → structural response", it can provide key data support for the design optimization of high-reliability components.

[0045] For example, the third predetermined operating temperature of the environment and device model is set to 22°C, the calculation time is 5000s, and natural convection between the device model and the surrounding air is added at 5 W / m²·°C. The maximum temperature gradually increases to 47°C over time. The final temperature distribution after hiding the metal cover is as follows. Figure 9 As shown, the overall temperature of the device is basically uniform, with the highest temperature located on the upper surface of the ceramic package. Analysis of the simulation results shows that the overall deformation of the device model is as shown in Figure 10(a), with an average deformation of 2.8 × 10⁻⁶. -4 The deformation was greatest in the chip's adhesive and leads, both approaching 2.8 × 10 mm. -3 Figure 10(b) shows a schematic diagram of the adhesive on the chip corresponding to the point of maximum deformation, and Figure 10(c) shows a schematic diagram of the lead corresponding to the point of maximum deformation. The overall distribution of the maximum principal stress is shown in Figure 10(d), with the six largest stresses all located on the metal layer of the device, reaching a maximum of 435 MPa. The principal strain results are shown in Figure 10(e), with the main strain occurring around the adhesive on the chip, and an average elastic strain of approximately 0.043.

[0046] It should be noted that the method in this embodiment can be executed by a single device, such as a computer or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method described.

[0047] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0048] Based on the same inventive concept, corresponding to any of the above embodiments, this application also provides a simulation testing device for electronic components.

[0049] refer to Figure 11 The simulation testing device for the aforementioned components includes: The detection module 10 is configured to perform non-destructive testing on the component to obtain external data corresponding to the component, and to perform destructive testing on the component to obtain internal data corresponding to the component.

[0050] The modeling module 20 is configured to perform three-dimensional modeling of the component based on the external data and the internal data to obtain a component model.

[0051] The simulation test module 30 is configured to acquire predetermined simulation test data, and based on the predetermined simulation test data, perform multiphysics simulation tests on the device model to obtain test data corresponding to the device.

[0052] Using the aforementioned device, non-destructive testing of components is performed to obtain corresponding external data, and destructive testing of components is performed to obtain corresponding internal data, achieving the goal of comprehensively and accurately obtaining the data required for component modeling. Based on the external and internal data, a 3D model of the component is performed to obtain a device model, achieving the goal of accurately constructing the device model. Predetermined simulation test data is obtained, and based on the predetermined simulation test data, multiphysics simulation tests are performed on the device model to obtain corresponding test data for the component, achieving the goal of accurately performing multiphysics simulation tests on the component and ensuring the accuracy of the obtained component test data.

[0053] In some embodiments, the non-destructive testing includes visual inspection and X-ray scanning; the testing module 10 is further configured to acquire predetermined product information corresponding to the component, perform visual inspection on the component based on the predetermined product information and the component to obtain visual data corresponding to the component; perform X-ray scanning on the component to obtain internal component data corresponding to the component; and determine the visual data and the internal component data as the external data.

[0054] In some embodiments, the destructive testing includes internal morphology inspection, cutting process, and material feature analysis; the detection module 10 is further configured to remove the encapsulation shell of the component, perform internal morphology inspection on the component after removing the encapsulation shell to obtain internal morphology data corresponding to the component; perform cutting process on the component after removing the encapsulation shell to obtain the multi-layer composition structure corresponding to the component and the composition structure data corresponding to each layer of composition structure; perform material feature analysis on each layer of composition structure to obtain the microstructure data and morphology evolution data corresponding to the composition structure; and determine the internal morphology data, all composition structure data, all microstructure data, and all morphology evolution data as the internal data.

[0055] In some embodiments, the modeling module 20 is further configured to assemble components based on the external data and the internal data to obtain an initial device model; and to set materials and mesh the initial device model to obtain the device model.

[0056] In some embodiments, the predetermined simulation test data includes a predetermined set of operating temperatures and a first predetermined power; the simulation test module 30 is further configured to, for each first predetermined operating temperature in the predetermined set of operating temperatures, in response to determining that the temperature applied to the device model has reached the first predetermined operating temperature, apply the first predetermined power to the device model, and after a predetermined time, perform structural analysis on the device model to obtain test data corresponding to the device model.

[0057] In some embodiments, the predetermined simulation test data further includes a second predetermined operating temperature and a second predetermined power; the simulation test module 30 is further configured to apply the second predetermined operating temperature and the second predetermined power to the device model, and then perform structural analysis on the device model to obtain test data corresponding to the device model.

[0058] In some embodiments, the predetermined simulation test data further includes predetermined magnetic field parameters and a third predetermined operating temperature; the simulation test module 30 is further configured to set the magnetic field environment of the device model based on the predetermined magnetic field parameters, and calculate the eddy current field corresponding to the device model under the magnetic field environment; determine the initial temperature distribution corresponding to the device model based on the eddy current field; determine the final temperature distribution corresponding to the device model based on the initial temperature distribution and the third predetermined operating temperature; apply a temperature to the device model according to the final temperature distribution, perform structural analysis on the device model, and obtain the test data corresponding to the device model.

[0059] For ease of description, the above devices are described in terms of function, divided into various modules. Of course, in implementing this application, the functions of each module can be implemented in one or more software and / or hardware.

[0060] The apparatus of the above embodiments is used to implement the simulation test method of the corresponding component in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0061] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the simulation testing method of the components as described in any of the above embodiments.

[0062] Figure 12This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0063] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0064] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0065] The input / output interface 1030 is used to connect input / output modules to realize information input and output. The input / output modules can be configured as components in the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touch screens, microphones, various sensors, etc., and output devices may include displays, speakers, vibrators, indicator lights, etc.

[0066] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0067] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0068] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0069] The electronic devices described above are used to implement the simulation testing methods for the corresponding components in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0070] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing the computer to execute the simulation testing method of the components as described in any of the above embodiments.

[0071] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0072] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the simulation test method of the components as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0073] Based on the same concept, corresponding to the methods of any of the above embodiments, this application also provides a computer program product, including computer program instructions, which, when run on a computer, cause the computer to execute the simulation testing method of the components as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0074] It should be noted that the embodiments of this application can also be further described in the following ways: It is understood that before using the technical solutions of the various embodiments in this disclosure, users will be informed of the type, scope of use, and usage scenarios of the personal information involved in an appropriate manner, and user authorization will be obtained.

[0075] For example, upon receiving a user's active request, a prompt message is sent to the user to explicitly inform them that the requested operation will require the acquisition and use of the user's personal information. This allows the user to independently choose, based on the prompt message, whether to provide personal information to the software or hardware such as electronic devices, applications, servers, or storage media performing the operations of this disclosed technical solution.

[0076] As an optional but not limited implementation, in response to a user's active request, sending a prompt message to the user can be done via a pop-up window, where the prompt message can be presented in text format. Furthermore, the pop-up window can also include a selection control allowing the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0077] It is understood that the above notification and user authorization process are merely illustrative and do not constitute a limitation on the implementation of this disclosure. Other methods that comply with relevant laws and regulations may also be applied to the implementation of this disclosure.

[0078] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0079] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0080] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0081] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A simulation testing method for electronic components, characterized in that, include: Non-destructive testing is performed on the components to obtain external data corresponding to the components, and destructive testing is performed on the components to obtain internal data corresponding to the components; Based on the external data and the internal data, a three-dimensional model of the component is performed to obtain the component model; Obtain predetermined simulation test data, and perform multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain the test data corresponding to the device.

2. The method according to claim 1, characterized in that, The non-destructive testing includes visual inspection and X-ray scanning; The non-destructive testing of the components to obtain the corresponding external data includes: Obtain the predetermined product information corresponding to the component; based on the predetermined product information and the component, perform an appearance inspection on the component to obtain the appearance data corresponding to the component. The component is subjected to X-ray scanning to obtain the internal component data corresponding to the component. The appearance data and the internal component data are defined as the external data.

3. The method according to claim 1, characterized in that, The destructive testing includes internal morphology inspection, cutting process, and material characteristic analysis; The destructive testing of the component to obtain the corresponding internal data of the component includes: The component is subjected to a shell removal process, and the internal morphology of the component after shell removal is inspected to obtain the internal morphology data of the component. The components after removing the packaging shell are cut to obtain the multi-layer composition structure corresponding to the components and the composition structure data corresponding to each layer of the composition structure. For each layer of the constituent structure, material characteristic analysis is performed on the constituent structure to obtain the corresponding microstructure data and morphological evolution data; The internal morphological data, all compositional structural data, all microstructural data, and all morphological evolution data are defined as the internal data.

4. The method according to claim 1, characterized in that, The step of performing three-dimensional modeling of the component based on the external data and the internal data to obtain a component model includes: Based on the external data and the internal data, components are assembled to obtain an initial device model; The initial device model is then subjected to material settings and mesh generation to obtain the device model.

5. The method according to claim 1, characterized in that, The predetermined simulation test data includes a predetermined set of operating temperatures and a first predetermined power. The step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain the test data corresponding to the device includes: For each first predetermined operating temperature within the predetermined operating temperature set, in response to determining that the temperature applied to the device model has reached the first predetermined operating temperature, the first predetermined power is applied to the device model, and after a predetermined time, structural analysis is performed on the device model to obtain the test data corresponding to the device model.

6. The method according to claim 1, characterized in that, The predetermined simulation test data also includes a second predetermined operating temperature and a second predetermined power. The step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain the test data corresponding to the device includes: After applying the second predetermined operating temperature and the second predetermined power to the device model, structural analysis is performed on the device model to obtain the test data corresponding to the device model.

7. The method according to claim 1, characterized in that, The predetermined simulation test data also includes predetermined magnetic field parameters and a third predetermined operating temperature; The step of performing multiphysics simulation tests on the device model based on the predetermined simulation test data to obtain the test data corresponding to the device includes: Based on the predetermined magnetic field parameters, the magnetic field environment of the device model is set, and the eddy current field corresponding to the device model under the magnetic field environment is calculated. Based on the eddy current field, the initial temperature distribution corresponding to the device model is determined; Based on the initial temperature distribution and the third predetermined operating temperature, the final temperature distribution corresponding to the device model is determined; After applying temperature to the device model according to the final temperature distribution, structural analysis is performed on the device model to obtain the test data corresponding to the device model.

8. A simulation testing device for electronic components, characterized in that, include: The detection module is configured to perform non-destructive testing on the component to obtain external data corresponding to the component, and to perform destructive testing on the component to obtain internal data corresponding to the component. The modeling module is configured to perform three-dimensional modeling of the component based on the external data and the internal data to obtain a component model. The simulation test module is configured to acquire predetermined simulation test data, and based on the predetermined simulation test data, perform multiphysics simulation tests on the device model to obtain test data corresponding to the device.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the program, it implements the method as described in any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method described in any one of claims 1 to 7.

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