Treatment device for semiconductor waste gas combustion products

Abstract

The invention relates to the technical field of semiconductor manufacturing, and provides a semiconductor waste gas combustion product treatment device which comprises a reaction chamber, a collection box, a pipe section, a water tank and a filter plate. The collecting box is arranged below the reaction chamber and communicated with the reaction chamber, the collecting box is used for collecting powder generated during combustion of semiconductor waste gas, and a through hole is formed in the bottom of the collecting box; the pipe section is arranged below the collecting box and is connected with the through hole; the water tank is communicated with the pipe section and is also communicated with the water washing tower; the filter plate is provided with a plurality of filter holes and is arranged in the water tank. According to the semiconductor waste gas combustion product treatment device, gas carrying dust can be collected and washed with water, and the dust content in the gas is reduced; and residual impurity particles in the powder can be intercepted and are prevented from entering the water washing tower to influence the water washing tower, and the mode of front-end powder collection and rear-end filtering interception ensures normal operation of a machine table.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a device for treating semiconductor waste gas combustion products. Background Technology

[0002] In semiconductor manufacturing processes, various process gases are required. For example, silane (SiH4), phosphine (PH3), ammonia (NH3), and large amounts of nitrogen trifluoride (NF3) are commonly used when depositing silicon dioxide or silicon nitride layers in chemical vapor deposition. These waste gases must undergo high-temperature combustion and water washing before being passed through a central scrubbing tower for final treatment before being discharged.

[0003] Currently widely used semiconductor exhaust gas treatment devices easily produce powder and other byproducts after high-temperature combustion. During the treatment process, some solid particles are carried by the airflow into the acidic exhaust pipe, causing long-term accumulation and blockage. Other particles are deposited in the treatment equipment. During the operation of the circulating water pump, a large amount of impurities easily adhere to the level sensor, circulating water pipeline, and other parts, causing the level detection float to move slowly or the water pipe nozzles to become blocked. This leads to problems such as abnormal level detection, decreased water flow, and increased water tank temperature, ultimately causing the equipment to alarm. Summary of the Invention

[0004] This invention provides a device for treating semiconductor exhaust combustion products, which solves the defects in the prior art where semiconductor exhaust combustion products can cause pipe blockage and equipment failure.

[0005] This invention provides a device for treating semiconductor waste gas combustion products, comprising: a reaction chamber for semiconductor waste gas combustion; a collection box disposed below and connected to the reaction chamber, the collection box being used to collect powder generated during semiconductor waste gas combustion, the collection box having a through hole at its bottom; a pipe section disposed below the collection box and connected to the through hole; a water tank connected to the pipe section, the water tank also being connected to a water scrubbing tower; and a filter plate having multiple filter holes, the filter plate being disposed inside the water tank.

[0006] According to the present invention, a semiconductor exhaust gas combustion product treatment device further includes a purging assembly, a portion of which is disposed on the side wall of the collection box, the purging assembly being used to blow nitrogen into the collection box; a partition is provided at the bottom of the collection box, the partition and the purging assembly being located on opposite sides of the through hole, the partition being used to prevent dust from escaping.

[0007] According to the present invention, a semiconductor exhaust gas combustion product processing device is provided, wherein the purging assembly includes: a nozzle disposed on the side wall of the collection box and located on both sides of the through hole with the partition plate; a first pipeline connected to the nozzle; and a gas source connected to the first pipeline.

[0008] According to the present invention, a device for treating semiconductor exhaust combustion products is provided, wherein the nozzle comprises: a housing disposed on the side wall of the collection box, the first end of the housing being connected to the collection box and forming an exhaust end; an intake pipe disposed at the second end of the housing and connected to the housing, the first pipeline being connected to the intake pipe; and a pair of guide blocks disposed opposite to each other within the housing, the guide blocks having inclined surfaces, and a gradually expanding exhaust port being formed between the pair of inclined surfaces.

[0009] According to the present invention, a device for treating semiconductor exhaust gas combustion products is provided, wherein the angle of the gas outlet is 20°-30°.

[0010] According to the present invention, a semiconductor exhaust gas combustion product processing device is provided, wherein the nozzles are respectively provided on opposite sides of the collection box, and a pair of partitions are provided at the bottom of the collection box, the pair of partitions being located on both sides of the through hole.

[0011] According to the present invention, a semiconductor exhaust gas combustion product processing device further includes: a second pipeline, the two ends of which are respectively connected to a pair of nozzles; and a first solenoid valve disposed on the second pipeline, the first solenoid valve being connected to the first pipeline, the first solenoid valve being used to control the pair of nozzles to alternately purge.

[0012] According to the present invention, a semiconductor exhaust gas combustion product processing device further includes: a second pipeline, the two ends of which are respectively connected to a pair of nozzles; a first solenoid valve disposed on the second pipeline; and a second solenoid valve disposed on the second pipeline; wherein the connection between the first pipeline and the second pipeline is located between the first solenoid valve and the second solenoid valve.

[0013] According to the present invention, a semiconductor exhaust gas combustion product treatment device further includes a fixing frame disposed in the water tank, and multiple filter plates are arranged in parallel on the fixing frame. The fixing frame includes: a pair of frame bodies disposed opposite to each other; and a plurality of fixing plates disposed at equal intervals along the width direction of the frame bodies. The ends of the filter plates are disposed between two adjacent fixing plates or on one side of the fixing plates.

[0014] According to the semiconductor exhaust gas combustion product processing device provided by the present invention, the fixing frame further includes a plurality of reinforcing blocks, which are disposed on the fixing plate and abut against the side of the filter plate.

[0015] The semiconductor exhaust gas combustion product treatment device provided by the present invention can collect dust-laden gas and wash it with water by setting a collection box, thereby reducing the dust content in the gas; by setting a filter plate in the water tank, residual impurity particles in the powder can be intercepted, preventing them from entering the water washing tower and affecting the water washing tower. This method of front-end powder collection and back-end filtration and interception ensures the normal operation of the machine and extends the maintenance cycle of the machine. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the semiconductor waste gas combustion product treatment device provided by the present invention.

[0018] Figure 2 yes Figure 1 One of the structural diagrams of the collection box shown in the image.

[0019] Figure 3 yes Figure 1 The second schematic diagram of the collection box is shown in the image.

[0020] Figure 4 yes Figure 2 The diagram shows the structure of the nozzle.

[0021] Figure 5 This is an exploded view of the mounting bracket and filter plate.

[0022] Figure 6 yes Figure 5 The exploded view of the fixture is shown in the image.

[0023] Figure label: 10. Reaction chamber; 20. Collection box; 21. Partition; 22. Through hole; 23. Second pipeline; 24. First solenoid valve; 25. Second solenoid valve; 30. Pipe section; 40. Water tank; 50. Filter assembly; 51. Fixing frame; 52. Filter plate; 61. Nozzle; 62. First pipeline; 100. Water washing tower; 511. Frame; 512. Fixing plate; 513. Reinforcing block; 611. Shell; 612. Air inlet pipe; 613. Guide block. Detailed Implementation

[0024] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0025] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0027] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0029] The following is combined Figures 1-6 The present invention describes an apparatus for treating semiconductor exhaust combustion products.

[0030] like Figure 1 As shown, in an embodiment of the present invention, the device for treating semiconductor waste gas combustion products includes: a reaction chamber 10, a collection box 20, a pipe section 30, a water tank 40, and a filter plate 52. The reaction chamber 10 is used for semiconductor waste gas combustion, and the collection box 20 is located below and communicates with the reaction chamber 10. Solid powder generated from the oxidation-reduction reaction of the semiconductor waste gas in the reaction chamber 10 enters the collection box 20 under gravity. The bottom of the collection box 20 has a through hole 22, which is connected to one end of the pipe section 30, and the other end of the pipe section 30 is connected to the water tank 40, so that the powder enters the water tank 40 from the collection box 20 through the pipe section 30 under its own weight. The filter plate 52 is disposed in the water tank 40, which is connected to a water scrubbing tower 100. After the powder falls into the water tank 40 and is washed, it flows to the water washing tower 100. During the flow, it is filtered by the filter plate 52. The filter plate 52 is provided with multiple filter holes, which can intercept the residual impurity particles in the powder after washing, thereby preventing impurities from flowing into the water washing tower 100 and clogging the water passage.

[0031] In this embodiment, by setting a collection box 20 below the reaction chamber 10, the powder generated by combustion can be collected, while preventing the escape of dust-laden gas. When the dust-laden gas passes through the water tank 40, some of the dust in the gas can be washed away by water. The gas passes through the filter plate 52 and enters the water washing tower 100, and then is discharged from the water washing tower 100 to the acidic pipeline. This can effectively reduce the dust in the gas and prevent the acidic pipeline from being blocked. At the same time, the residual impurity particles in the powder can be blocked by the filter plate 52, preventing impurity particles from entering the water washing tower 100 and causing the water washing tower 100 to malfunction.

[0032] The semiconductor exhaust gas combustion product treatment device provided in this embodiment of the invention can collect dust-laden gas and wash it with water by setting a collection box, thereby reducing the dust content in the gas; by setting a filter plate in the water tank, residual impurity particles in the powder can be intercepted, preventing them from entering the water washing tower and affecting the water washing tower. This method of front-end powder collection and back-end filtration and interception ensures the normal operation of the machine and extends the maintenance cycle of the machine.

[0033] In an embodiment of the present invention, the semiconductor exhaust gas combustion product treatment device further includes a purging assembly, part of which is disposed on the side wall of the collection box 20. The purging assembly is used to blow nitrogen into the collection box 20. A partition 21 is provided at the bottom of the collection box 20. A pair of partitions 21 and the purging assembly are located on both sides of the through hole 22. The partitions 21 are used to prevent dust from escaping, so that the dust falls into the water tank 40 through the through hole 22.

[0034] Specifically, such as Figure 2 As shown, when the purging assembly blows air into the collection box 20, the dust flows under the action of the airflow and is blocked by the baffle 21 opposite to the purging assembly, thus falling into the water tank 40 through the through hole 22 for washing. By setting the baffle 21, the dust recovery efficiency is increased, dust escape is prevented, and the dust content in the gas discharged into the acidic pipeline is reduced.

[0035] In an embodiment of the present invention, the purging assembly includes a nozzle 61, a first conduit 62, and an air source. The nozzle 61 is disposed on the side wall of the collection box 20, and the two ends of the first conduit 62 are respectively connected to the nozzle and the air source.

[0036] like Figure 4 As shown, in an embodiment of the present invention, the nozzle 61 includes: a housing 611, an air inlet pipe 612, and a pair of guide blocks 613. The housing 611 is disposed on the side wall of the collection box 20, and the first end of the housing 611 is connected to the collection box 20, forming an air outlet. The air inlet pipe 612 is disposed at the second end of the housing 611 and is connected to the housing 611. A first pipe 62 is connected to the air inlet pipe 612, and gas from the gas source can enter the collection box 20 through the first pipe 62 and the housing 611. A pair of guide blocks 613 are disposed opposite to each other inside the housing 611. Each guide block 613 has an inclined surface, and a gradually expanding air outlet is formed between the pair of inclined surfaces to increase the pressure of the blown nitrogen gas, so that the dust can be blocked by the partition 21 during the dust drift and enter the water tank 40, thereby preventing the dust from escaping outside the partition 21.

[0037] Optionally, in an embodiment of the present invention, the angle of the air outlet is 20°-30°.

[0038] Furthermore, in an embodiment of the present invention, nozzles 61 are provided on both opposite sides of the collection box 20, and a pair of partitions 21 are provided at the bottom of the collection box 20, with the pair of partitions 21 located opposite each other on both sides of the through hole 22. In this embodiment, each nozzle 61 can be connected to a first pipe 62, and the two nozzles 61 alternately emit air, which can collect powder without causing dust to be blown away. Optionally, the two nozzles 61 can also achieve alternating air emission in other ways.

[0039] Optionally, such as Figure 2 As shown, in one embodiment of the present invention, the semiconductor exhaust gas combustion product treatment device further includes: a second pipeline 23 and a first solenoid valve 24. The two ends of the second pipeline 23 are respectively connected to a pair of nozzles 61. The first solenoid valve 24 is disposed on the second pipeline 23 and connected to the first pipeline 62. The first solenoid valve 24 is used to control the pair of nozzles 61 to alternately purge.

[0040] Specifically, in this embodiment, the first solenoid valve 24 has two switchable operating positions. When it is in the first operating position, the first pipeline 62 is connected to the left nozzle 61, which blows air into the collection box 20, while the right partition 21 prevents dust from escaping. When it is in the second operating position, the first pipeline 62 is connected to the right nozzle 61, which blows air into the collection box 20, while the left partition 21 prevents dust from escaping. By alternately blowing air through the left and right nozzles 61, powder can be collected without causing dust to be blown away, thus maximizing dust collection.

[0041] like Figure 3 As shown, in another embodiment of the present invention, the semiconductor exhaust gas combustion product treatment device further includes: a second pipeline 23, a first solenoid valve 24, and a second solenoid valve 25. The two ends of the second pipeline 23 are respectively connected to a pair of nozzles 61. The first solenoid valve 24 is disposed on the second pipeline 23, and the second solenoid valve 25 is disposed on the first pipeline 62. The connection between the first pipeline 62 and the second pipeline 23 is located between the first solenoid valve 24 and the second solenoid valve 25.

[0042] Specifically, in this embodiment, both the first solenoid valve 24 and the second solenoid valve 25 are on / off valves. When the first solenoid valve 24 is open and the second solenoid valve 25 is closed, the left nozzle 61 performs purging; when the first solenoid valve 24 is closed and the second solenoid valve 25 is open, the right nozzle 61 performs purging, thereby realizing alternating purging by the left nozzle 61 and the right nozzle 61.

[0043] like Figure 5 As shown, in an embodiment of the present invention, both ends of the filter plate 52 can be directly connected to the inner wall of the water tank 40; the filter plate 52 can also be mounted on a fixing frame 51, which is located inside the water tank 40, forming a filter assembly 50 with the filter plate 52. The advantage of mounting the filter plate 52 on the fixing frame 51 is that it facilitates removing the filter plate 52 from the water tank 40 for cleaning or replacement, thus preventing the filter holes on the filter plate 52 from becoming clogged after prolonged use. Furthermore, multiple filter plates 52 can be arranged in parallel on the fixing frame 51 to enhance the filtration effect.

[0044] Specifically, such as Figure 6 As shown, in an embodiment of the present invention, the fixing frame 51 includes: a pair of frame bodies 511 and a plurality of fixing plates 512. The pair of frame bodies 511 are arranged opposite to each other, and a plurality of fixing plates 512 are provided at equal intervals along the width direction of each frame body 511. The fixing plates 512 are used to fix the filter plate 52.

[0045] Optionally, in an embodiment of the present invention, the frame 511 can be a straight plate, with a slot formed between two adjacent fixing plates. The filter plate 52 can be directly inserted into the slot for easy cleaning and replacement. Simultaneously, filter plates 52 can be provided on both sides of multiple fixing plates, and these filter plates 52 can be directly connected to adjacent fixing plates 512. In this embodiment, the bottom of the filter plate 52 can directly abut against the bottom surface of the water tank 40.

[0046] Optionally, in another embodiment of the present invention, the frame 511 may also be an L-shaped plate, with a fixing plate 512 disposed on the vertical plate of the frame 511, and the horizontal plates of the two frames 511 abutting each other. By setting the frame 511 as an L-shaped plate, the horizontal plates of the L-shaped plate can intercept impurity particles that settle at the bottom of the water tank 40.

[0047] Furthermore, in an embodiment of the present invention, the fixing frame 51 further includes a plurality of reinforcing blocks 513, which are disposed on the fixing plate 512 and abut against the side of the filter plate 52. In particular, for the filter plate 52 inserted between the fixing plates 512, by providing reinforcing blocks 513 on its side, it is possible to prevent the filter plate 52 from being pushed out of the slot when the water flow impact is large.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for treating semiconductor waste gas combustion products, characterized in that, include: The reaction chamber is used for the combustion of semiconductor exhaust gases; A collection box is located below and communicates with the reaction chamber. The collection box is used to collect the powder generated during the combustion of semiconductor exhaust gas. The bottom of the collection box is provided with a through hole. A pipe section is located below the collection box and connected to the through hole; A water tank is connected to the pipe section, and the water tank is also used to connect to a water washing tower; The filter plate has multiple filter holes and is installed inside the water tank.

2. The semiconductor waste gas combustion product treatment apparatus according to claim 1, characterized in that, It also includes a purging assembly, a portion of which is disposed on the side wall of the collection box, and the purging assembly is used to blow nitrogen into the collection box; The bottom of the collection box is provided with a partition, which is located on both sides of the through hole along with the blowing assembly. The partition is used to prevent dust from escaping.

3. The semiconductor waste gas combustion product treatment apparatus according to claim 2, characterized in that, The purging assembly includes: The nozzle is disposed on the side wall of the collection box and is located on both sides of the through hole along with the partition plate; The first conduit is connected to the nozzle; The gas source is connected to the first pipeline.

4. The semiconductor waste gas combustion product treatment apparatus according to claim 3, characterized in that, The nozzle includes: A housing is provided on the side wall of the collection box, and the first end of the housing is connected to the collection box, forming an air outlet. An air intake pipe is disposed at the second end of the housing and communicates with the housing; the first pipeline is connected to the air intake pipe. A pair of guide blocks are disposed opposite each other inside the housing. The guide blocks are provided with inclined surfaces, and a gradually expanding air outlet is formed between the pair of inclined surfaces.

5. The semiconductor waste gas combustion product treatment apparatus according to claim 4, characterized in that, The angle of the air outlet is 20°-30°.

6. The semiconductor waste gas combustion product treatment apparatus according to claim 3, characterized in that, The nozzles are respectively provided on opposite sides of the collection box, and a pair of partitions are provided at the bottom of the collection box, with the pair of partitions located on both sides of the through hole.

7. The semiconductor waste gas combustion product treatment apparatus according to claim 6, characterized in that, Also includes: The second conduit, with its two ends respectively connected to a pair of nozzles; A first solenoid valve is disposed on the second pipeline and connected to the first pipeline. The first solenoid valve is used to control the pair of nozzles to alternately blow.

8. The semiconductor waste gas combustion product treatment apparatus according to claim 6, characterized in that, Also includes: The second conduit, with its two ends respectively connected to a pair of nozzles; The first solenoid valve is located on the second pipeline; The second solenoid valve is installed on the second pipeline; The connection between the first pipeline and the second pipeline is located between the first solenoid valve and the second solenoid valve.

9. The device for treating semiconductor waste gas combustion products according to claim 1, characterized in that, It also includes a fixing frame, which is disposed inside the water tank, and the multiple layers of filter plates are arranged parallel to the fixing frame. The fixing frame includes: A pair of frames, the pair of frames being arranged opposite to each other; Multiple fixing plates are evenly spaced along the width of the frame, and the end of the filter plate is located between two adjacent fixing plates or on one side of the fixing plate.

10. The semiconductor waste gas combustion product treatment apparatus according to claim 9, characterized in that, The mounting bracket also includes multiple reinforcing blocks, which are disposed on the mounting plate and abut against the side of the filter plate.

Images