Optimization method and device of honeycomb plate embedded pipeline structure for spacecraft

Abstract

The invention provides an optimization method and device of a cellular board embedded pipeline structure for a spacecraft, and the optimization method comprises the steps: building a heat dissipation model based on the initial parameters of the cellular board embedded pipeline structure; carrying out at least one analogue simulation on the heat dissipation model to obtain an equivalent temperature of a temperature field where the embedded pipe is located; based on the equivalent temperature, the simulation rib efficiency of the embedded pipe is determined; if the simulation rib efficiency of the embedded pipe is not greater than a preset threshold value, adjusting the initial adjacent spacing of the embedded pipe in the heat dissipation model, and returning to execute the step of performing at least one analogue simulation on the heat dissipation model until the simulation rib efficiency of the embedded pipe is greater than the preset threshold value or the adjustment frequency reaches a preset frequency threshold value, obtaining a target adjacent spacing which enables the rib efficiency of the embedded pipe to be greater than a preset threshold value; and based on the target adjacent spacing, optimizing the honeycomb plate embedded pipeline structure. The distance between the adjacent embedded pipes is adjusted by taking the rib efficiency as an optimization index, so that the overall weight is reduced while the heat exchange efficiency is ensured, and the emission cost is reduced.

Description

Technical Field

[0001] This disclosure relates to the field of spacecraft technology, specifically to an optimization method and apparatus for pre-embedded pipeline structures in honeycomb panels for spacecraft. Background Technology

[0002] The relentless pursuit of weight reduction and compact layout in spacecraft necessitates that the load-bearing structure itself also possess heat transfer capabilities. To balance weight reduction and heat dissipation, cooling pipes are typically embedded directly into lightweight honeycomb panels, allowing the load-bearing structure to simultaneously function as a thermal control channel.

[0003] However, existing pre-buried pipeline structures are often designed based on human experience, making it difficult to further reduce weight and lower launch costs while ensuring heat exchange efficiency. Summary of the Invention

[0004] This disclosure addresses the problems existing in the prior art by providing an optimization method and apparatus for the pre-embedded pipeline structure of a spacecraft honeycomb panel, which can partially or completely solve the problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted in this disclosure is as follows: The first aspect of this disclosure provides an optimization method for a pre-embedded pipe structure in a spacecraft cellular panel, comprising: constructing a heat dissipation model of the pre-embedded pipe structure based on initial parameters of the pre-embedded pipe structure; the pre-embedded pipe structure includes several pre-embedded pipes; the initial parameters include the initial adjacent spacing of the pre-embedded pipes; performing at least one simulation on the heat dissipation model to obtain the equivalent temperature of the temperature field where the pre-embedded pipes are located; determining the simulation rib efficiency of the pre-embedded pipes based on the equivalent temperature of the temperature field where the pre-embedded pipes are located; if the simulation rib efficiency of the pre-embedded pipes is not greater than a preset threshold, adjusting the initial adjacent spacing of the pre-embedded pipes in the heat dissipation model, and returning to the step of performing at least one simulation on the heat dissipation model until the simulation rib efficiency of the pre-embedded pipes is greater than the preset threshold or the number of adjustments reaches a preset number threshold, thereby obtaining a target adjacent spacing that makes the rib efficiency of the pre-embedded pipes greater than the preset threshold; and optimizing the pre-embedded pipe structure of the cellular panel based on the target adjacent spacing.

[0006] In some embodiments of this disclosure, the simulation rib efficiency of the embedded pipe is determined based on the equivalent temperature of the temperature field where the embedded pipe is located, including: determining the simulation heat transfer of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located; determining the simulation rib efficiency of the embedded pipe based on the simulation heat transfer and the theoretical heat transfer of the embedded pipe; the simulation rib efficiency is the ratio of the simulation heat transfer to the theoretical heat transfer.

[0007] In some embodiments of this disclosure, the simulated heat transfer of the embedded pipe is determined based on the equivalent temperature of the temperature field where the embedded pipe is located, including: determining the simulated heat transfer of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located, the ambient radiation temperature of the embedded pipe, and the emissivity of the embedded pipe.

[0008] In some embodiments of this disclosure, the simulated heat transfer of the embedded pipe is determined by the following formula: In the formula, To simulate heat exchange, For emission rate, The Stefan-Boltzmann constant is... Equivalent temperature This refers to ambient radiation temperature.

[0009] In some embodiments of this disclosure, the heat dissipation model is simulated at least once to obtain the equivalent temperature of the temperature field where the embedded pipe is located. This includes: simulating the heat dissipation model at least once, solving the unsteady heat conduction differential equation of the temperature field where the embedded pipe is located using finite element method to obtain the full temperature distribution data of the temperature field where the embedded pipe is located; and calculating the equivalent temperature of the temperature field where the embedded pipe is located using the heat flow weighted average method based on the full temperature distribution data of the temperature field where the embedded pipe is located.

[0010] In some embodiments of this disclosure, the heat dissipation model is simulated at least once to obtain the equivalent temperature of the temperature field where the embedded pipe is located. This includes: simulating the heat dissipation model once when the fluid temperature of the heat dissipation model is at the upper limit of a set temperature range to obtain a first equivalent temperature of the temperature field where the embedded pipe is located; and simulating the heat dissipation model once when the fluid temperature of the heat dissipation model is at the lower limit of a set temperature range to obtain a second equivalent temperature of the temperature field where the embedded pipe is located. The first equivalent temperature represents the maximum heat transfer temperature of the embedded pipe, and the second equivalent temperature represents the minimum heat transfer temperature of the embedded pipe.

[0011] In some embodiments of this disclosure, the simulation rib efficiency of the embedded pipe is determined based on the equivalent temperature of the temperature field where the embedded pipe is located, including: determining the first simulation rib efficiency of the embedded pipe based on the first equivalent temperature of the temperature field of the embedded pipe; and determining the second simulation rib efficiency of the embedded pipe based on the second equivalent temperature of the temperature field of the embedded pipe.

[0012] In some embodiments of this disclosure, adjusting the initial adjacent spacing of the embedded pipes in the heat dissipation model includes: if either the efficiency of the first simulation rib or the efficiency of the second simulation rib is not greater than a preset threshold, then adjusting the initial adjacent spacing of the embedded pipes in the heat dissipation model, and returning to the step of performing at least one simulation on the heat dissipation model until both the efficiency of the first simulation rib and the efficiency of the second simulation rib are greater than the preset threshold, thereby obtaining a target adjacent spacing that makes both the efficiency of the first simulation rib and the efficiency of the second simulation rib greater than the preset threshold.

[0013] In some embodiments of this disclosure, the initial parameters include the inner diameter of the embedded pipe, the outer radius of the embedded pipe, the adjacent spacing of the embedded pipe, the thickness of the web perpendicular to the embedded pipe, and the length and thickness of the fins disposed on the upper and lower sides of the web.

[0014] A second aspect of this disclosure provides an optimization device for a pre-embedded pipe structure in a spacecraft honeycomb panel, comprising: a heat dissipation model construction unit for constructing a heat dissipation model of the pre-embedded pipe structure of the honeycomb panel based on initial parameters of the pre-embedded pipe structure; the pre-embedded pipe structure of the honeycomb panel includes a plurality of pre-embedded pipes; the initial parameters include the initial adjacent spacing of the pre-embedded pipes; a simulation unit for performing at least one simulation on the heat dissipation model to obtain the equivalent temperature of the temperature field where the pre-embedded pipes are located; a simulation rib efficiency determination unit for determining the simulation rib efficiency of the pre-embedded pipes based on the equivalent temperature of the temperature field where the pre-embedded pipes are located; a pre-embedded pipe spacing adjustment unit for adjusting the initial adjacent spacing of the pre-embedded pipes in the heat dissipation model if the simulation rib efficiency of the pre-embedded pipes is not greater than a preset threshold, and returning to the step of performing at least one simulation on the heat dissipation model until the simulation rib efficiency of the pre-embedded pipes is greater than the preset threshold or the number of adjustments reaches a preset number threshold, thereby obtaining a target adjacent spacing that makes the rib efficiency of the pre-embedded pipes greater than the preset threshold; and a structure optimization unit for optimizing the pre-embedded pipe structure of the honeycomb panel based on the target adjacent spacing.

[0015] This disclosure also provides an electronic device, comprising: a memory for storing at least one instruction; and a processor for invoking the instruction stored in the memory to execute the optimization method for the pre-embedded pipe structure of the spacecraft honeycomb panel in any of the embodiments of the first aspect.

[0016] This disclosure also provides a computer-readable storage medium storing at least one executable instruction, which is loaded and executed by a processor to implement the optimization method for the pre-embedded pipe structure of a spacecraft honeycomb panel in the first aspect and any embodiment of the first aspect described above.

[0017] This disclosure also provides a computer program product comprising: computer program code that, when executed by a computer, causes the computer to perform the methods described above.

[0018] This disclosure also provides a computer program product, which includes: computer program code, which, when executed by a computer, causes the computer to perform the optimization method for the pre-embedded pipeline structure of the spacecraft honeycomb panel described in the first aspect and any embodiment of the first aspect.

[0019] Compared with the prior art, this disclosure has the following beneficial effects: The optimization method provided in this disclosure constructs a heat dissipation model of the pre-embedded pipes in the honeycomb panel with an initial adjacent spacing and obtains the equivalent temperature through simulation. Then, the simulated rib efficiency is calculated from the equivalent temperature, and the spacing is iteratively adjusted until the rib efficiency exceeds a preset threshold. This results in a target adjacent spacing that balances high heat flow dissipation and lightweight design. It can reduce the pipe length and panel thickness while ensuring heat exchange efficiency, thereby improving the structural stiffness and reducing launch costs. Attached Figure Description

[0020] Figure 1 This is a schematic flowchart of an optimization method for a pre-embedded pipeline structure in a spacecraft honeycomb panel, provided in an embodiment of this disclosure. Figure 2 This is a partial structural schematic diagram of a honeycomb panel pre-embedded pipeline structure provided in an embodiment of this disclosure; Figure 3 This is a schematic diagram of a heat dissipation model provided in an embodiment of this disclosure; Figure 4 This is a schematic diagram of a heat dissipation model provided in an embodiment of this disclosure; Figure 5 This is a schematic diagram of the simulation results of a heat dissipation model provided in an embodiment of this disclosure; Figure 6 This is a schematic diagram of an optimized honeycomb panel pre-embedded pipeline structure provided in an embodiment of this disclosure; Figure 7 This is a structural block diagram of an optimization device for a pre-embedded pipeline structure of a honeycomb panel for spacecraft, provided in an embodiment of this disclosure. Detailed Implementation

[0021] The present disclosure will now be further described with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present disclosure and should not be construed as limiting the scope of protection of the present disclosure. It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of this application.

[0022] The acquisition, transmission, storage, use, and processing of data in this disclosed technical solution comply with relevant national laws and regulations. In the embodiments of this disclosure, certain existing industry solutions such as software, components, and models may be mentioned. These should be considered exemplary, intended only to illustrate the feasibility of implementing the technical solution of this disclosure, and do not imply that the applicant has already used or necessarily used such solutions.

[0023] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0024] This disclosure provides an optimization method for the pre-embedded pipeline structure of a honeycomb panel for spacecraft, such as... Figure 1 As shown, the process includes steps S11 to S15.

[0025] Step S11: Based on the initial parameters of the honeycomb panel embedded pipe structure, construct a heat dissipation model of the honeycomb panel embedded pipe structure.

[0026] In this embodiment, the honeycomb panel embedded pipe structure includes several embedded pipes. In some embodiments, the honeycomb panel embedded pipe structure may specifically include a honeycomb panel body and an embedded pipe structure disposed within its cavity; the honeycomb panel body adopts a composite structure, consisting of an upper skin, a lower skin, and an aluminum honeycomb core sandwiched between the two skins, formed by an adhesive bonding process, wherein the skin material can be aluminum or carbon fiber composite material; the embedded pipe structure includes embedded pipes, a web, and fins, wherein the web and the embedded pipes are vertically connected, and the fins are disposed on the upper and lower sides of the web, and the upper and lower end faces of the fins are tightly fitted with the inner surfaces of the upper and lower skins, respectively, forming a surface-to-surface contact form, thereby constructing an efficient heat conduction path. In a specific embodiment, an aluminum alloy pipe with an inner diameter of 10 mm and a wall thickness of 1 mm can be selected as the embedded pipe.

[0027] In one possible implementation, the initial parameters include the initial adjacent spacing of the embedded pipes. In another possible implementation, the initial parameters include the inner diameter of the embedded pipe, the outer radius of the embedded pipe, the adjacent spacing of the embedded pipe, the thickness of the web perpendicular to the embedded pipe, and the length and thickness of the fins located on the upper and lower sides of the web.

[0028] In one specific implementation, such as Figure 2 As shown, the honeycomb panel embedded pipeline structure includes a honeycomb panel cavity 1, upper and lower skins 2, and embedded pipeline structure including embedded pipes 3, webs 4, and fins 5. The upper and lower end faces of the fins 5 are tightly fitted with the inner surfaces of the upper and lower skins 2, respectively, forming surface-to-surface contact to achieve thermal conductivity. In this structure, the inner diameter of the embedded pipe 3 is 10mm, the outer radius is 6mm, the thickness of the web 4 is 3mm, and the length of the fins 5 is 30mm and the thickness is 1mm.

[0029] In one specific embodiment, based on certain initial parameters: the inner radius of the embedded pipe is 5mm, the outer radius is 6mm, the thickness of the web 4 is 3mm, the length of the fin 5 is 30mm and the thickness is 1mm, and the length of the skin 2 is 150mm and the thickness is 0.3mm, the heat dissipation model of the honeycomb panel embedded pipe structure is constructed as follows. Figure 3 As shown.

[0030] Step S12: Perform at least one simulation on the heat dissipation model to obtain the equivalent temperature of the temperature field where the embedded pipe is located.

[0031] Before performing at least one simulation on the heat dissipation model, the model needs to be discretized and a computational mesh drawn with a cell size of 0.05 mm. A schematic diagram of the mesh is shown below. Figure 4 As shown.

[0032] The skin is set to radiate from a 4K outer space environment, and the temperature of the working fluid flowing inside the pipe is 50 degrees Celsius. The simulation results are as follows: Figure 5 As shown. In another possible implementation, the skin can also be configured to radiate the ground vacuum tank at 170K (liquid nitrogen temperature), but this disclosure does not specifically limit this embodiment.

[0033] Based on the simulation results, the equivalent temperature of the temperature field where the embedded pipe is located can be obtained.

[0034] Step S13: Determine the simulation rib efficiency of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located.

[0035] It should be noted that rib efficiency describes the thermal effect of the layout spacing. The closer the value is to 1, the better the heat dissipation effect. However, the pipe length and weight will increase. Therefore, it is necessary to design and select an appropriate rib efficiency to ensure heat exchange / heat dissipation efficiency while reducing weight and lowering launch costs.

[0036] It is understood that the embodiments of this disclosure mainly use the method of adjusting the spacing to adjust the rib efficiency, but in some scenarios, the rib efficiency can also be adjusted by adjusting parameters such as the radius of the embedded pipe and the length of the fin. This disclosure does not make specific limitations here.

[0037] In one specific implementation, the equivalent temperature is 44.012℃, and the simulation rib efficiency is 0.93 when the pipe spacing is 120mm.

[0038] Step S14: If the simulation rib efficiency of the embedded pipe is not greater than the preset threshold, adjust the initial adjacent spacing of the embedded pipe in the heat dissipation model, and return to the step of performing at least one simulation on the heat dissipation model until the simulation rib efficiency of the embedded pipe is greater than the preset threshold or the number of adjustments reaches the preset number threshold, so as to obtain the target adjacent spacing that makes the rib efficiency of the embedded pipe greater than the preset threshold.

[0039] In one possible implementation, the preset threshold is 0.9 to 0.95.

[0040] In one specific implementation, assuming a preset threshold of 0.9, when the pipe spacing is 140mm, the simulated rib efficiency is 0.8. Since 0.8 is lower than 0.9, the model layout needs to be optimized and recalculated. After multiple iterations, combined with simulation results, when the pipe spacing is 130mm, the rib efficiency is 0.92, which meets the engineering requirements. The final pipe layout dimensions are as follows. Figure 6 As shown.

[0041] Step S15: Optimize the pre-embedded pipe structure of the honeycomb panel based on the target adjacent spacing.

[0042] In some embodiments of this disclosure, the simulation rib efficiency of the embedded pipe is determined based on the equivalent temperature of the temperature field where the embedded pipe is located, which may specifically include the following steps S131 to S132.

[0043] Step S131: Determine the simulated heat transfer of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located.

[0044] In some embodiments of this disclosure, the simulated heat transfer of the embedded pipe is determined based on the equivalent temperature of the temperature field where the embedded pipe is located. Specifically, this may include: determining the simulated heat transfer of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located, the ambient radiation temperature of the embedded pipe, and the emissivity of the embedded pipe.

[0045] In some embodiments of this disclosure, the simulated heat transfer of the embedded pipe can be determined using the following formula: , In the formula, To simulate heat exchange, For emission rate, The Stefan-Boltzmann constant is... Equivalent temperature This refers to ambient radiation temperature.

[0046] It should be noted that the temperature values ​​used in this embodiment are absolute temperature values. The conversion is based on the formula: Celsius temperature °C = absolute temperature K + 273.15.

[0047] For example, in one specific implementation, with an equivalent temperature of 44.012℃ and a pipe spacing of 120mm, the calculated simulated heat transfer is 516.35W / m². 2 .

[0048] Step S132: Based on the simulated heat exchange of the pre-embedded pipe and the theoretical heat exchange of the pre-embedded pipe, determine the simulated rib efficiency of the pre-embedded pipe.

[0049] In this embodiment of the disclosure, the simulated rib efficiency is the ratio of simulated heat exchange to theoretical heat exchange.

[0050] For example, in one specific implementation, with an equivalent temperature of 44.012℃ and a pipe spacing of 120mm, the calculated simulated heat transfer is 516.35W / m². 2 The theoretical heat exchange rate is 556.47 W / m³. 2 Further calculations showed that the simulated rib efficiency was 0.93.

[0051] In some embodiments of this disclosure, performing at least one simulation of the heat dissipation model to obtain the equivalent temperature of the temperature field where the embedded pipe is located may include: performing at least one simulation of the heat dissipation model, solving the unsteady-state heat conduction differential equation of the temperature field where the embedded pipe is located by finite element method to obtain the full temperature distribution data of the temperature field where the embedded pipe is located; and calculating the equivalent temperature of the temperature field where the embedded pipe is located by using the heat flow weighted average method based on the full temperature distribution data of the temperature field where the embedded pipe is located.

[0052] In one possible implementation, to obtain the target temperature field information, a heat conduction differential equation can be established based on the law of conservation of energy and Fourier's law. The general form of the three-dimensional unsteady heat conduction differential equation in Cartesian coordinates is: In the formula, Let be the rate of change of the internal energy of the infinitesimal element with time. , , These represent the net heat transferred through the infinitesimal element in the x, y, and z directions, respectively. (It is the thermal conductivity) The heat generated is the internal heat source within the infinitesimal element. This problem is considered to be a matter of constant physical properties (i.e.,...). (Does not change with temperature / location), steady-state calculation (i.e., temperature does not change with time, =0), the equation simplifies to: .

[0053] The specific steps further include: 1. Drawing a discretized mesh of the model based on the actual situation. The mesh accuracy is selected according to the actual situation of the model and needs to meet the independence requirement. 2. Specifying boundary conditions: the inner wall of the pipe is a constant temperature boundary condition with a temperature of T1; the connection between the pipe and the radiant plate is thermally conductive with a thermal conductivity of λ; the radiant surface is a radiative boundary condition with an emissivity of λ. The temperature of the radiation space is T2; the remaining boundaries are adiabatic boundary conditions. 3. Based on the existing conditions, construct a discrete system of equations. 4. Iteratively solve the algebraic equations to obtain the temperature field information. 5. Take the temperature data of all radiation surfaces, average them by nodes, and obtain the equivalent temperature value T3. It should be noted that the above steps can all be solved using existing software, such as the ANSYMechanical APDL solver. This embodiment of the disclosure does not impose specific limitations on this.

[0054] In some embodiments of this disclosure, the heat dissipation model is simulated at least once to obtain the equivalent temperature of the temperature field where the embedded pipe is located. Specifically, this may include the following steps S121 to S122.

[0055] Step S121: Under the condition that the fluid temperature of the heat dissipation model is the upper limit of the set temperature range, perform a simulation on the heat dissipation model to obtain the first equivalent temperature of the temperature field where the embedded pipe is located.

[0056] For example, in one specific embodiment, with a fluid temperature of 50°C, the first equivalent temperature is 41.013°C.

[0057] Step S122: Under the condition that the fluid temperature of the heat dissipation model is the lower limit of the set temperature range, perform a simulation on the heat dissipation model to obtain the second equivalent temperature of the temperature field where the embedded pipe is located.

[0058] For example, in one specific embodiment, the second equivalent temperature is -23.625°C when the fluid temperature is -20°C.

[0059] The first equivalent temperature represents the maximum heat transfer temperature of the embedded pipe, and the second equivalent temperature represents the minimum heat transfer temperature of the embedded pipe.

[0060] In some embodiments of this disclosure, the simulation rib efficiency of the embedded pipe is determined based on the equivalent temperature of the temperature field where the embedded pipe is located, which may specifically include steps S134 and S135.

[0061] Step S134: Determine the first simulation rib efficiency of the embedded pipe based on the first equivalent temperature of the embedded pipe temperature field.

[0062] For example, in a specific implementation, under the condition that the fluid temperature is 50°C, the equivalent temperature is 41.013°C. When the pipe spacing is 150mm, the calculated simulated heat transfer is 497.10W / m2, the theoretical heat transfer is 556.47W / m2, and the efficiency of the first simulated rib is further calculated to be 0.89.

[0063] Step S135: Determine the efficiency of the second simulation rib of the embedded pipe based on the second equivalent temperature of the embedded pipe temperature field.

[0064] For example, in one specific implementation, with a fluid temperature of -20°C (equivalent to -23.625°C), and a pipe spacing of 150mm, the calculated simulated heat transfer is 197.82 W / m². 2 The theoretical heat exchange rate is 209.57 W / m³. 2 Further calculations showed that the efficiency of the second simulated rib was 0.94.

[0065] In some embodiments of this disclosure, adjusting the initial adjacent spacing of the embedded pipes in the heat dissipation model may specifically include: if either the efficiency of the first simulation rib or the efficiency of the second simulation rib is not greater than a preset threshold, then adjusting the initial adjacent spacing of the embedded pipes in the heat dissipation model, and returning to the step of performing at least one simulation on the heat dissipation model until both the efficiency of the first simulation rib and the efficiency of the second simulation rib are greater than the preset threshold, thereby obtaining a target adjacent spacing that makes both the efficiency of the first simulation rib and the efficiency of the second simulation rib greater than the preset threshold.

[0066] For example, in one specific implementation, the preset threshold is 0.9, the efficiency of the first simulation rib is 0.89 < 0.9, and the efficiency of the second simulation rib is 0.94 > 0.9. Since the efficiency of the first simulation rib is lower than the preset threshold, it needs to be adjusted.

[0067] This disclosure also provides an optimization device for the pre-embedded pipeline structure of honeycomb panels for spacecraft, such as... Figure 7 As shown, the optimization device 100 includes a heat dissipation model construction unit 110, a simulation unit 120, a simulation rib efficiency determination unit 130, a pre-embedded pipe spacing adjustment unit 140, and a structure optimization unit 150.

[0068] The heat dissipation model construction unit 110 is used to construct a heat dissipation model of the honeycomb panel embedded pipe structure based on the initial parameters of the honeycomb panel embedded pipe structure; the honeycomb panel embedded pipe structure includes several embedded pipes; the initial parameters include the initial adjacent spacing of the embedded pipes.

[0069] The simulation unit 120 is used to perform at least one simulation of the heat dissipation model to obtain the equivalent temperature of the temperature field where the embedded pipe is located.

[0070] The simulation rib efficiency determination unit 130 is used to determine the simulation rib efficiency of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located.

[0071] The pre-embedded pipe spacing adjustment unit 140 is used to adjust the initial adjacent spacing of the pre-embedded pipes in the heat dissipation model if the simulation rib efficiency of the pre-embedded pipes is not greater than a preset threshold, and return to perform at least one simulation of the heat dissipation model until the simulation rib efficiency of the pre-embedded pipes is greater than the preset threshold or the number of adjustments reaches the preset number threshold, so as to obtain the target adjacent spacing that makes the rib efficiency of the pre-embedded pipes greater than the preset threshold.

[0072] The structural optimization unit 150 is used to optimize the structure of the pre-embedded pipes in the honeycomb panel based on the target adjacent spacing.

[0073] For details and benefits of the optimization device for the pre-embedded pipeline structure of the honeycomb panel for spacecraft provided in the embodiments of this disclosure, please refer to the above description of the optimization method for the pre-embedded pipeline structure of the honeycomb panel for spacecraft, which will not be repeated here.

[0074] This disclosure also provides an electronic device, comprising: a memory for storing at least one instruction; and a processor for calling the instruction stored in the memory to execute the optimization method for the pre-embedded pipe structure of the spacecraft cellular panel in any of the above embodiments.

[0075] This disclosure also provides a computer-readable storage medium storing at least one executable instruction, which is loaded and executed by a processor to implement the optimization method for the pre-embedded pipe structure of the spacecraft honeycomb panel in any of the above embodiments.

[0076] This disclosure also provides a computer program product, which includes computer program code. When the computer program code is run by a computer, it causes the computer to execute the optimization method for the pre-embedded pipeline structure of the spacecraft honeycomb panel in any of the above embodiments.

[0077] Those skilled in the art will understand that embodiments of this disclosure can be provided as methods, systems, or computer program products. Therefore, this disclosure can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this disclosure can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0078] This disclosure is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create a machine for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0079] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0080] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0081] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0082] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0083] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient computer-readable media, such as modulated data signals and carrier waves.

[0084] It should also be noted that the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Terms such as "including" or "contains" mean that the element preceding the word covers the element listed after the word, and do not exclude the possibility of covering other elements as well.

[0085] Although operations are described in a specific order in the accompanying drawings in this disclosure, it should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0086] Finally, it should be noted that the above content is only used to illustrate the technical solution of this disclosure, and is not intended to limit the scope of protection of this disclosure. Simple modifications or equivalent substitutions made by those skilled in the art to the technical solution of this disclosure do not depart from the substance and scope of the technical solution of this disclosure.

Claims

1. An optimization method for the pre-embedded pipe structure of a honeycomb panel for spacecraft, characterized in that, include: Based on the initial parameters of the honeycomb panel embedded pipe structure, a heat dissipation model of the honeycomb panel embedded pipe structure is constructed; the honeycomb panel embedded pipe structure includes several embedded pipes; the initial parameters include the initial adjacent spacing of the embedded pipes. Perform at least one simulation on the heat dissipation model to obtain the equivalent temperature of the temperature field where the embedded pipe is located; Based on the equivalent temperature of the temperature field where the pre-embedded pipe is located, the simulation rib efficiency of the pre-embedded pipe is determined. If the simulation rib efficiency of the embedded tube is not greater than the preset threshold, the initial adjacent spacing of the embedded tube in the heat dissipation model is adjusted, and the step of performing at least one simulation on the heat dissipation model is returned until the simulation rib efficiency of the embedded tube is greater than the preset threshold or the number of adjustments reaches the preset number threshold, so as to obtain the target adjacent spacing that makes the rib efficiency of the embedded tube greater than the preset threshold. Based on the target adjacent spacing, the structure of the pre-embedded pipes in the honeycomb panel is optimized.

2. The optimization method as described in claim 1, characterized in that, The determination of the simulation rib efficiency of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located includes: Based on the equivalent temperature of the temperature field where the pre-embedded pipe is located, the simulated heat transfer of the pre-embedded pipe is determined. Based on the simulated heat exchange of the pre-embedded pipe and the theoretical heat exchange of the pre-embedded pipe, the simulated rib efficiency of the pre-embedded pipe is determined; the simulated rib efficiency is the ratio of the simulated heat exchange to the theoretical heat exchange.

3. The optimization method as described in claim 2, characterized in that, The determination of the simulated heat transfer of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located includes: Based on the equivalent temperature of the temperature field where the pre-embedded pipe is located, the ambient radiation temperature of the pre-embedded pipe, and the emissivity of the pre-embedded pipe, the simulated heat transfer of the pre-embedded pipe is determined.

4. The optimization method as described in claim 3, characterized in that, The simulated heat transfer of the pre-embedded pipe is determined using the following formula: ， In the formula, To simulate heat exchange, For emission rate, The Stefan-Boltzmann constant is... Equivalent temperature This refers to ambient radiation temperature.

5. The optimization method as described in claim 1, characterized in that, The process of performing at least one simulation on the heat dissipation model to obtain the equivalent temperature of the temperature field where the embedded pipe is located includes: The heat dissipation model is simulated at least once, and the unsteady thermal conduction differential equation of the temperature field of the embedded pipe is solved by finite element method to obtain the full temperature distribution data of the temperature field of the embedded pipe. Based on the full temperature distribution data of the temperature field where the pre-embedded pipe is located, the equivalent temperature of the temperature field where the pre-embedded pipe is located is calculated using the heat flow weighted average method.

6. The optimization method as described in claim 1, characterized in that, The process of performing at least one simulation on the heat dissipation model to obtain the equivalent temperature of the temperature field where the embedded pipe is located includes: Under the condition that the fluid temperature of the heat dissipation model is the upper limit of the set temperature range, the heat dissipation model is simulated once to obtain the first equivalent temperature of the temperature field where the embedded pipe is located. Under the condition that the fluid temperature of the heat dissipation model is the lower limit of the set temperature range, the heat dissipation model is simulated once to obtain the second equivalent temperature of the temperature field where the embedded pipe is located. Wherein, the first equivalent temperature represents the maximum heat exchange temperature of the pre-embedded pipe, and the second equivalent temperature represents the minimum heat exchange temperature of the pre-embedded pipe.

7. The optimization method as described in claim 6, characterized in that, The determination of the simulation rib efficiency of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located includes: Based on the first equivalent temperature of the temperature field of the pre-embedded pipe, the first simulated rib efficiency of the pre-embedded pipe is determined. The second simulated rib efficiency of the pre-embedded pipe is determined based on the second equivalent temperature of the temperature field of the pre-embedded pipe.

8. The optimization method as described in claim 7, characterized in that, Adjusting the initial adjacent spacing of the embedded pipes in the heat dissipation model includes: If either the first simulation rib efficiency or the second simulation rib efficiency is not greater than the preset threshold, then the initial adjacent spacing of the embedded pipe in the heat dissipation model is adjusted, and the process of performing at least one simulation on the heat dissipation model is returned until both the first simulation rib efficiency and the second simulation rib efficiency are greater than the preset threshold, thereby obtaining the target adjacent spacing that makes both the first simulation rib efficiency and the second simulation rib efficiency greater than the preset threshold.

9. The optimization method as described in any one of claims 1-8, characterized in that, The initial parameters include the inner diameter of the embedded pipe, the outer radius of the embedded pipe, the adjacent spacing of the embedded pipe, the thickness of the web perpendicular to the embedded pipe, and the length and thickness of the fins located on the upper and lower sides of the web.

10. An optimization device for the pre-embedded pipeline structure of a spacecraft honeycomb panel, characterized in that, include: A heat dissipation model construction unit is used to construct a heat dissipation model of the honeycomb panel embedded pipe structure based on the initial parameters of the honeycomb panel embedded pipe structure; the honeycomb panel embedded pipe structure includes a plurality of embedded pipes; the initial parameters include the initial adjacent spacing of the embedded pipes; The simulation unit is used to perform at least one simulation on the heat dissipation model to obtain the equivalent temperature of the temperature field where the embedded pipe is located. The simulation rib efficiency determination unit is used to determine the simulation rib efficiency of the embedded pipe based on the equivalent temperature of the temperature field where the embedded pipe is located. The pre-embedded pipe spacing adjustment unit is used to adjust the initial adjacent spacing of the pre-embedded pipe in the heat dissipation model if the simulation rib efficiency of the pre-embedded pipe is not greater than a preset threshold, and return to the step of performing at least one simulation on the heat dissipation model until the simulation rib efficiency of the pre-embedded pipe is greater than the preset threshold or the number of adjustments reaches a preset number threshold, so as to obtain the target adjacent spacing that makes the rib efficiency of the pre-embedded pipe greater than the preset threshold. The structural optimization unit is used to optimize the pre-embedded pipeline structure of the honeycomb panel based on the target adjacent spacing.

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