SSD (Solid State Disk) temperature control method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention discloses an SSD solid state disk temperature control method and device, electronic equipment and a storage medium, and relates to the technical field of solid state disk management.The method comprises the steps that the NAND particle temperature is collected and updated in real time according to a preset period; and setting temperature thresholds of low-temperature disk locking, low-temperature unlocking, high-temperature current limiting, high-temperature unlocking, high-temperature disk locking and the like according to an application scene. And when the temperature exceeds the disk locking threshold value, the disk locking is triggered, temperature collection is accelerated, and the disk locking is unlocked until the temperature is recovered to the unlocking range. For a high-temperature current limiting scene, a PID control algorithm is adopted, initial parameters including proportion, integration and differential gain are set, temperature is collected regularly, deviation is calculated, and then the duty ratio is adjusted dynamically. The PID algorithm synthesizes the response of proportion, integration and differentiation links to calculate the optimal duty ratio so as to balance the response and stability of the system and ensure that the temperature of the NAND particles is stably lower than a high-temperature current limiting value. The problems that in the prior art, performance fluctuation is large, and misoperation is prone to occurring are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of solid-state drive (SSD) management technology, and more particularly to an SSD temperature control method, device, electronic device, and storage medium. Background Technology

[0002] With the deep integration of big data, cloud computing and artificial intelligence technologies, solid-state drives (SSDs) have become the core storage medium in scenarios such as data centers and high-performance computing.

[0003] However, SSDs face severe thermal management challenges during high-speed read and write operations: as the core unit of data storage, the temperature of NAND flash memory directly affects data reliability and device lifespan. Existing temperature control technologies rely on controller temperature or external sensors, which have significant limitations—the controller temperature deviates from the actual NAND flash memory temperature, causing temperature control strategies to lag, potentially leading to data write errors or accelerated flash memory aging; while external sensors can directly monitor flash memory temperature, they require additional hardware support, increasing cost and power consumption, and cannot dynamically adapt to complex load scenarios.

[0004] Traditional temperature control solutions achieve current limiting by adjusting SSD cache, CPU frequency, or NAND flash memory frequency, but they have three drawbacks: First, cache management is complex and does not directly control NAND flash memory operations, making it prone to errors that could reduce NAND reliability. Second, direct frequency adjustment leads to drastic performance fluctuations, especially in mixed load scenarios, where read and write latency may increase several times. Third, on / off temperature control that relies on fixed thresholds (such as forced frequency reduction when the temperature exceeds the threshold) cannot intervene in advance based on temperature change trends, resulting in a lag in temperature control.

[0005] Furthermore, current technologies lack the ability to sense and dynamically respond to particle temperature in real time. Under sustained high load or extreme temperature environments, SSDs may experience data loss or even hardware damage due to localized overheating.

[0006] Therefore, there is an urgent need for a method to control the temperature of SSDs by precisely adjusting the command flow to achieve smooth temperature control, thereby minimizing performance loss while ensuring data reliability. Summary of the Invention

[0007] This invention provides a method for controlling the temperature of an SSD (Solid State Drive) to address the problems of temperature deviation and hardware cost associated with existing technologies that rely on a main controller temperature sensor or external sensors. These technologies also lead to drastic performance fluctuations, a lack of real-time sensing and dynamic response capabilities, and are prone to data unreliability and hardware damage. The technical solution is as follows: According to one aspect of the present invention, a method for controlling the temperature of an SSD (Solid State Drive) includes: real-time acquisition of the temperature of NAND flash memory chips by a temperature acquisition module in the SSD at a preset time period, and real-time updating of the current temperature; setting temperature thresholds from low to high temperatures according to the application scenario of the SSD; the temperature thresholds include a low-temperature lock-in temperature, a low-temperature unlock temperature, a high-temperature current-limiting temperature, a high-temperature unlock temperature, and a high-temperature lock-in temperature; when the current temperature is higher than the high-temperature lock-in temperature or lower than the low-temperature lock-in temperature, marking the SSD as locked and accelerating the acquisition of the current temperature until the current temperature is higher than the low-temperature unlock temperature and lower than the high-temperature unlock temperature, and then releasing the lock-in marking; when the current temperature is higher than the high-temperature current-limiting temperature and lower than the high-temperature lock-in temperature, adjusting the duty cycle of the SSD using a PID control algorithm until the current temperature is lower than the high-temperature current-limiting temperature; the PID algorithm represents calculating the optimal duty cycle based on the deviation between the current temperature and the target temperature.

[0008] In one embodiment, the low-temperature locking temperature refers to triggering a locking operation when the current temperature is lower than the low-temperature locking temperature; the low-temperature unlocking temperature refers to releasing the locking operation when the current temperature is higher than the low-temperature unlocking temperature; the high-temperature current-limiting temperature refers to initiating flow control regulation when the current temperature is higher than the high-temperature current-limiting temperature; the high-temperature unlocking temperature refers to releasing the locking operation when the current temperature is lower than the high-temperature unlocking temperature; and the high-temperature locking temperature refers to triggering a locking operation when the current temperature is higher than the high-temperature locking temperature.

[0009] In one embodiment, the duty cycle adjustment of the SSD using a PID control algorithm until the current temperature is lower than the high-temperature current-limiting temperature is achieved through the following steps: setting initial parameters for the PID control algorithm; setting an initial value for the duty cycle based on the design requirements and empirical data of the SSD; using the initial value as the starting point for the PID control algorithm adjustment; the initial parameters include proportional gain, integral gain, and derivative gain; using the high-temperature current-limiting temperature as the target temperature; setting the temperature acquisition period; periodically acquiring and updating the current temperature of the NAND flash memory according to the period; and calculating the deviation between the current temperature and the target temperature.

[0010] In one embodiment, adjusting the duty cycle of the SSD using a PID control algorithm until the current temperature is lower than the high-temperature current-limiting temperature further includes the following steps: calculating the response value of the proportional element based on the deviation value using the proportional gain; calculating the response value of the integral element based on the accumulated deviation value using the integral gain; calculating the response value of the derivative element based on the changing trend of the deviation value and the derivative gain; calculating the optimal duty cycle by combining the response values ​​of the proportional, integral, and derivative elements using the PID control algorithm; and adjusting the allocation of the NAND's allowed and prohibited time periods based on the optimal duty cycle; allowing full load during the allowed time period and only allowing temperature acquisition during the prohibited time period.

[0011] In one embodiment, when the current temperature is higher than the high-temperature lock plate temperature or lower than the low-temperature lock plate temperature, the lock plate is marked and the current temperature is collected at an accelerated pace until the current temperature is higher than the low-temperature unlocking temperature and lower than the high-temperature unlocking temperature, and the lock plate marking is released. This is achieved through the following steps: when the current temperature is lower than the low-temperature lock plate temperature, the lock plate is marked and the current temperature is collected at an accelerated pace, and all instructions other than temperature collection are added to the waiting queue; until the current temperature is higher than the low-temperature unlocking temperature, the lock plate marking is released, and the instructions in the waiting queue are executed.

[0012] In one embodiment, when the current temperature is higher than the high-temperature lock disk temperature or lower than the low-temperature lock disk temperature, locking the disk and accelerating the acquisition of the current temperature until the current temperature is higher than the low-temperature unlock temperature and lower than the high-temperature unlock temperature, and then releasing the lock disk marking, further includes the following steps: when the current temperature is higher than the high-temperature lock disk temperature, locking the disk and accelerating the acquisition of the current temperature, adding all instructions other than temperature acquisition to the waiting queue; until the current temperature is lower than the low-temperature unlock temperature, and the lock disk marking is released, determining whether the current temperature is higher than the high-temperature current limiting temperature; if the current temperature is higher than the high-temperature current limiting temperature, then marking the flow control state, adjusting the duty cycle of the SSD using a PID control algorithm until the current temperature is lower than the high-temperature current limiting temperature, and then releasing the flow control state; otherwise, executing the instructions in the waiting queue.

[0013] In one embodiment, the duty cycle of the SSD is adjusted by a PID control algorithm until the current temperature is lower than the high-temperature current-limiting temperature. This is achieved through the following steps: using the high-temperature current-limiting temperature as the target value of the PID control, the parameters of the PID algorithm are adjusted by trial and error. The parameters are used to balance the system response speed and stability. The PID output is adaptively corrected each cycle according to the current temperature to ensure that the duty cycle dynamically matches the actual requirements.

[0014] According to one aspect of the present invention, an SSD solid-state drive temperature control device is provided, the device comprising: a temperature acquisition module, configured to acquire the temperature of NAND flash memory chips in real time according to a preset time period via a temperature acquisition module in the SSD, and update the current temperature in real time; a threshold setting module, configured to set temperature thresholds from low temperature to high temperature according to the application scenario of the SSD; the temperature thresholds include a low temperature lock-in temperature, a low temperature unlock temperature, a high temperature current-limiting temperature, a high temperature unlock temperature, and a high temperature lock-in temperature; a lock-in processing module, configured to mark the SSD as locked and accelerate the acquisition of the current temperature when the current temperature is higher than the high temperature lock-in temperature or lower than the low temperature lock-in temperature, until the current temperature is higher than the low temperature unlock temperature and lower than the high temperature unlock temperature, and then release the lock-in marking; and a flow control adjustment module, configured to adjust the duty cycle of the SSD using a PID control algorithm until the current temperature is lower than the high temperature current-limiting temperature when the current temperature is higher than the high temperature current-limiting temperature and lower than the high temperature lock-in temperature; the PID algorithm represents the calculation of the optimal duty cycle based on the deviation between the current temperature and the target temperature.

[0015] According to one aspect of the present invention, an electronic device includes at least one processor and at least one memory, wherein computer-readable instructions are stored on the memory; the computer-readable instructions are executed by one or more of the processors to cause the electronic device to implement the SSD solid-state drive temperature control method as described above.

[0016] According to one aspect of the present invention, a storage medium has computer-readable instructions stored thereon, which are executed by one or more processors to implement the SSD solid-state drive temperature control method as described above.

[0017] The beneficial effects of the technical solution provided by this invention are: In the above technical solution, this invention first uses a temperature acquisition module within the SSD to collect and update the NAND flash memory temperature in real time at a preset cycle. Temperature thresholds are set according to the application scenario, including low-temperature lockout, low-temperature unlock, high-temperature current limiting, high-temperature unlock, and high-temperature lockout. When the temperature exceeds the lockout threshold, lockout is triggered and temperature acquisition is accelerated until the temperature returns to the unlock range, at which point the lockout is released. For the high-temperature current limiting scenario, a PID control algorithm is used. Initial parameters, including proportional, integral, and derivative gains, are set, and temperature deviations are collected periodically to dynamically adjust the duty cycle. The PID algorithm integrates the responses of the proportional, integral, and derivative components to calculate the optimal duty cycle, balancing system response and stability, ensuring that the NAND flash memory temperature remains consistently below the high-temperature current limiting value. This method effectively improves the operational stability and data reliability of the SSD under different temperature environments, solving the problems of large performance fluctuations and susceptibility to misoperation in traditional temperature control solutions. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart illustrating an SSD solid-state drive temperature control method according to an exemplary embodiment; Figure 2 This is a flowchart illustrating a solid-state drive (SSD) temperature control method in an application scenario. Figure 3 yes Figure 2 Flow control flowchart in solid-state drive temperature control methods for corresponding application scenarios; Figure 4 This is a block diagram illustrating an SSD solid-state drive temperature control device according to an exemplary embodiment; Figure 5 This is a hardware structure diagram of an electronic device according to an exemplary embodiment; Figure 6 This is a block diagram illustrating an electronic device according to an exemplary embodiment. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] Those skilled in the art will understand that, unless specifically stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in this disclosure means the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should be understood that when we say an element is “connected” or “coupled” to another element, it may be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein may include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any units and all combinations of one or more associated listed items.

[0022] This invention provides a method for controlling the temperature of an SSD (Solid State Drive). By setting multi-level temperature thresholds and combining this method with PID (Pulse Controlled Drive) dynamic duty cycle adjustment, precise and proactive temperature control of the drive is achieved. This effectively solves the problems of large performance fluctuations and susceptibility to false protection triggers leading to reduced data reliability in traditional solutions under extreme temperature environments. This SSD temperature control method is applicable to SSD temperature control devices, which can be electronic devices. The SSD temperature control method described in this invention can be applied to various scenarios, such as SSD temperature control.

[0023] Please see Figure 1 This invention provides a method for controlling the temperature of an SSD (Solid State Drive), which is applicable to electronic devices.

[0024] In the following method embodiments, for ease of description, the execution subject of each step of the method is an electronic device, but this does not constitute a specific limitation.

[0025] like Figure 1 As shown, the method may include the following steps: Step 110: The temperature of the NAND flash memory is collected in real time by the temperature acquisition module in the SSD according to a preset time period, and the current temperature is updated in real time.

[0026] Specifically, a specially designed temperature acquisition module is integrated inside the SSD, featuring high precision and fast response capabilities. It accurately collects the temperature of the NAND flash memory at pre-set time intervals, such as every 100 milliseconds. The acquired temperature data is immediately transmitted to the processing unit, which updates the current temperature value in real time, ensuring the accuracy and timeliness of the temperature information.

[0027] In the above process, the embodiments of the present invention integrate a high-precision temperature acquisition module and acquire temperature according to a preset cycle, which enables real-time monitoring of the temperature changes of NAND particles, provides an accurate and reliable temperature data foundation, realizes real-time temperature monitoring, and provides a key basis for subsequent temperature control strategies.

[0028] Step 120: Set temperature thresholds from low temperature to high temperature according to the application scenario of the SSD.

[0029] The temperature thresholds include low temperature lock disk temperature, low temperature unlocking temperature, high temperature current limiting temperature, high temperature unlocking temperature, and high temperature lock disk temperature.

[0030] In one possible implementation, the low-temperature lock disk temperature refers to the time when the current temperature is lower than the low-temperature lock disk temperature to trigger the lock disk operation; the low-temperature unlock temperature refers to the time when the current temperature is higher than the low-temperature unlock temperature to release the lock disk operation; the high-temperature current limiting temperature refers to the time when the current temperature is higher than the high-temperature current limiting temperature to initiate flow control regulation; the high-temperature unlock temperature refers to the time when the current temperature is lower than the high-temperature unlock temperature to release the lock disk operation; and the high-temperature lock disk temperature refers to the time when the current temperature is higher than the high-temperature lock disk temperature to trigger the lock disk operation.

[0031] Specifically, taking into full account the operating characteristics of SSDs in different application scenarios, five key temperature thresholds are set sequentially from low temperature to high temperature: low temperature lock-up temperature, low temperature unlocking temperature, high temperature current limiting temperature, high temperature unlocking temperature, and high temperature lock-up temperature. For example, in a low-temperature environment, when the temperature is below the low temperature lock-up temperature (e.g., -20℃), data writing is unreliable, and a lock-up operation needs to be triggered; when the temperature rises back to the low temperature unlocking temperature (e.g., -10℃), the lock-up is released. In a high-temperature environment, the high temperature current limiting temperature (e.g., 65℃) is the critical point for initiating flow control adjustment; when the temperature exceeds this value, the read and write speeds of the hard drive need to be limited; the high temperature unlocking temperature (e.g., 70℃) is the temperature point for releasing the lock-up operation; and the high temperature lock-up temperature (e.g., 80℃) is the highest temperature threshold for triggering a lock-up to prevent unreliable data writing at high temperatures.

[0032] In the above process, the embodiments of the present invention set multi-level temperature thresholds according to the SSD application scenario, which enables precise control measures to be taken for different temperature conditions, providing a flexible temperature control strategy and realizing effective protection and performance optimization of SSD in different temperature environments.

[0033] Step 130: When the current temperature is higher than the high temperature lock disk temperature or lower than the low temperature lock disk temperature, mark the lock disk and accelerate the acquisition of the current temperature until the current temperature is higher than the low temperature unlocking temperature and lower than the high temperature unlocking temperature, and then remove the lock disk mark.

[0034] In one possible implementation, when the current temperature is lower than the low-temperature lock disk temperature, the disk is locked and the current temperature is collected at an accelerated pace. All instructions other than temperature collection are added to the processing queue. Once the current temperature is higher than the low-temperature unlock temperature, the disk lock mark is removed and the instructions in the processing queue are executed.

[0035] In one possible implementation, when the current temperature is higher than the high-temperature lock disk temperature, the disk is marked as locked and the current temperature is collected at an accelerated pace. All instructions other than temperature collection are added to the waiting queue. The process continues until the current temperature is lower than the low-temperature unlock temperature, at which point the disk lock mark is removed, and it is determined whether the current temperature is higher than the high-temperature current limiting temperature. If the current temperature is higher than the high-temperature current limiting temperature, the flow control state is marked, and the duty cycle of the SSD is adjusted using a PID control algorithm until the current temperature is lower than the high-temperature current limiting temperature, at which point the flow control state is removed. Otherwise, the instructions in the waiting queue are executed.

[0036] Specifically, when the temperature acquisition module detects that the current temperature is lower than the low-temperature disk lock temperature, the system immediately marks the disk as locked and accelerates the acquisition of the current temperature, for example, shortening the acquisition cycle to 50 milliseconds to more closely monitor temperature changes. Simultaneously, all commands other than temperature acquisition, such as read and write commands, are added to a processing queue, pausing their execution to prevent data errors caused by hard drive performance instability in low-temperature environments. Once the current temperature is higher than the low-temperature unlock temperature, the system removes the disk lock mark and executes the commands in the processing queue in the order they were added, resuming normal hard drive read and write operations.

[0037] Furthermore, if the current temperature is higher than the high-temperature lockout temperature, the lockout status is also marked and the current temperature is collected more quickly. Non-temperature acquisition commands are added to the processing queue. When the temperature drops below the low-temperature unlocking temperature and the lockout mark is removed, it is determined whether the current temperature is higher than the high-temperature current limit temperature. If it is higher than the high-temperature current limit temperature, the flow control status is marked, and the duty cycle of the SSD is adjusted using a subsequent PID control algorithm until the current temperature is lower than the high-temperature current limit temperature, at which point the flow control status is removed; if the current temperature is not higher than the high-temperature current limit temperature, the commands in the processing queue are executed directly.

[0038] In the above process, this embodiment of the invention triggers disk locking and unlocking operations according to different temperature conditions and reasonably processes pending instructions, thereby effectively protecting the SSD in extreme temperature environments, preventing data loss and hardware damage, providing a reliable security mechanism, and achieving stable operation of the SSD under different temperature conditions. Step 140: When the current temperature is higher than the high-temperature current limit temperature but lower than the high-temperature disk locking temperature, the duty cycle of the SSD is adjusted through a PID control algorithm until the current temperature is lower than the high-temperature current limit temperature.

[0039] The PID algorithm calculates the optimal duty cycle based on the deviation between the current temperature and the target temperature.

[0040] In one possible implementation, the initial parameters of the PID control algorithm are set. The initial value of the duty cycle is set according to the design requirements of the SSD and empirical data. The initial value is used as the starting point for the adjustment of the PID control algorithm. The high-temperature current-limiting temperature is used as the target temperature. The temperature acquisition period is set. The current temperature of the NAND chip is periodically acquired and updated according to the period. The deviation between the current temperature and the target temperature is calculated.

[0041] The initial parameters include proportional gain, integral gain, and derivative gain.

[0042] In one possible implementation, the response value of the proportional element is calculated based on the deviation value using the proportional gain, the response value of the integral element is calculated based on the accumulated deviation value using the integral gain, and the response value of the derivative element is calculated based on the trend of the deviation value and the derivative gain. The optimal duty cycle is obtained by combining the response values ​​of the proportional, integral, and derivative elements using a PID control algorithm, and the allocation of the allowable and prohibitive time periods of the NAND is adjusted based on the optimal duty cycle.

[0043] The permitted time period allows full load, while the prohibited time period only allows temperature data acquisition.

[0044] In one possible implementation, the high-temperature current-limiting temperature is used as the target value for PID control, and the parameters of the PID algorithm are adjusted by trial and error.

[0045] Among them, the parameters are used to balance the system response speed and stability. The PID output is adaptively corrected according to the current temperature in each cycle to ensure that the duty cycle dynamically matches the actual needs.

[0046] Specifically, when the current temperature is higher than the high-temperature current-limiting temperature but lower than the high-temperature disk-locking temperature, the initial parameters of the PID control algorithm are first set, including proportional gain, integral gain, and derivative gain. These parameters are set according to the SSD's design requirements and empirical data; for example, the proportional gain is set to 0.5, the integral gain to 0.1, and the derivative gain to 0.05. Simultaneously, the initial value of the duty cycle is set according to the SSD's design requirements and empirical data, such as an initial duty cycle of 80%, and this initial value is used as the starting point for the PID control algorithm adjustment.

[0047] Furthermore, the high-temperature current-limiting temperature is used as the target temperature, and the temperature acquisition period is set, for example, the current temperature of the NAND flash memory is acquired and updated periodically every 200 milliseconds. The deviation between the current temperature and the target temperature is calculated; for example, if the current temperature is 75℃ and the high-temperature current-limiting temperature is 70℃, then the deviation is 5℃.

[0048] Furthermore, the proportional gain is used to calculate the response value of the proportional element based on the deviation value; for example, the proportional element response value is 0.5 × 5 = 2.5. The integral gain is used to calculate the response value of the integral element based on the accumulated deviation value, taking into account the cumulative effect of the deviation over a period of time. The derivative gain is used to calculate the response value of the derivative element, which can predict the trend of deviation change. The optimal duty cycle is calculated by combining the response values ​​of the proportional, integral, and derivative elements using a PID control algorithm. For example, the optimal duty cycle obtained after comprehensive calculation is 60%.

[0049] Furthermore, the allocation of allowed and prohibited time periods for the NAND flash memory is adjusted based on the optimal duty cycle. During the allowed time period, the SSD is allowed to operate at full load for high-speed read and write operations; during the prohibited time period, only temperature sampling is allowed to reduce the power consumption and heat generation of the hard drive. The PID output is adaptively corrected each cycle based on the current temperature. For example, if the current temperature is still high, the duty cycle is further reduced to ensure that the duty cycle dynamically matches the actual demand.

[0050] In the above process, the embodiments of the present invention use a PID control algorithm to dynamically adjust the duty cycle according to the deviation between the current temperature and the target temperature, so as to accurately control the heat generation of the SSD, provide a fine temperature regulation method, realize the stable performance and effective heat dissipation of the SSD in high temperature current limiting scenarios, and improve the reliability and service life of the SSD.

[0051] Through the above process, the embodiments of the present invention, by real-time temperature acquisition and updating, temperature threshold setting, disk lock and unlock operation processing, and duty cycle adjustment in high-temperature current limiting scenarios, can take precise control measures according to different temperature conditions, protect the SSD in extreme temperature environments, prevent data loss and hardware damage, and achieve fine temperature regulation in high-temperature current limiting scenarios, ensuring the stable performance and effective heat dissipation of the SSD, improving the reliability and lifespan of the SSD, and providing strong support for the stable operation of the SSD in different application scenarios.

[0052] In one exemplary embodiment, the temperature control method for SSDs under high load in a data center is used as an application scenario, and the temperature is controlled using the SSD solid-state drive temperature control method proposed in this invention.

[0053] Step S1: Power on and initialize the SSD.

[0054] like Figure 2 As shown, after an enterprise-grade SSD is powered on in a data center server, it initiates an initialization process: loading the NAND flash memory driver, activating the temperature sensor interface, and initializing the temperature control module parameters, thus preparing the hardware for subsequent temperature monitoring and control.

[0055] Threshold pre-configuration: Temperature thresholds are set based on the enterprise-level high-load application scenario. Specifically, the low-temperature lock threshold (LowLockTemp) is set to 0℃, the low-temperature unlock threshold (LowUnlockTemp) to 5℃, the high-temperature unlock threshold (HighUnlockTemp) to 80℃, the high-temperature current limiting threshold (HighLimitTemp) to 70℃, and the high-temperature lock threshold (HighLockTemp) to 85℃ (dynamically enabled). These threshold settings are based on a comprehensive consideration of the performance and security of enterprise-level SSDs at different temperatures, ensuring effective protection and reasonable control of the SSD under various temperature conditions.

[0056] Period settings: Configure the temperature acquisition period T1 = 100ms, meaning temperature data is acquired every 100ms to ensure timely acquisition of NAND flash memory temperature changes; the PID control period T2 = 1s, used for the PID control algorithm to adjust the duty cycle. The temperature control module enters standby mode, awaiting the first temperature acquisition command.

[0057] In the above process, this embodiment of the invention provides a basic framework for dynamic temperature control through hardware initialization and multi-level threshold pre-configuration, ensuring system response speed and accuracy. Hardware initialization ensures the normal operation of temperature monitoring and control functions, while multi-level threshold pre-configuration sets reasonable temperature limits based on the characteristics of enterprise-grade SSDs, providing a basis for subsequent temperature status judgment and control strategies.

[0058] Step S2: Temperature acquisition and status determination.

[0059] Specifically, the temperature control module triggers a temperature acquisition every 100ms: Data acquisition: The NAND core temperature is read through the built-in sensor, for example, the temperature is 25℃ during the first acquisition.

[0060] Furthermore, threshold comparisons are performed based on the collected temperatures: If the temperature is <0℃ or >85℃, the drive will enter lock mode. When the temperature is below the low-temperature lock threshold of 0℃ or above the high-temperature lock threshold of 85℃, the performance and security of the SSD may be severely affected. In this case, the drive will enter lock mode to protect the data and hardware.

[0061] If the temperature is between 70°C and 85°C, it enters flow control mode. When the temperature is between the high-temperature current limiting threshold of 70°C and the high-temperature disk locking threshold of 85°C, although the SSD has not yet reached the level that requires disk locking, in order to prevent the temperature from rising further and causing performance degradation or hardware damage, it enters flow control mode and limits the read and write speed of the SSD.

[0062] If the temperature is between 5℃ and 70℃, it is considered normal. Within this temperature range, the SSD can perform normally without any special temperature control measures.

[0063] Furthermore, in continuous high-load write scenarios, the NAND temperature rises to 82°C, at which point the temperature is between 70°C and 85°C, triggering flow control.

[0064] In the above process, this embodiment of the invention accurately classifies the SSD's working state through real-time comparison of multi-level thresholds, avoiding data loss due to hard shutdown. Unlike traditional simple temperature control methods, this invention sets different working states according to different temperature ranges, ensuring SSD safety while minimizing the impact on normal business operations. Moreover, neither the left nor right state will pause all instructions; the temperature read command will be issued along with other commands. However, the higher the temperature, the shorter the temperature acquisition period will be. For example, when the temperature rises, the temperature acquisition period will be shortened from 100ms to 50ms to more closely monitor temperature changes.

[0065] Step S3, PID dynamic adjustment under flow control state.

[0066] like Figure 3 As shown, after the SSD enters performance mode, if a user initiates a continuous write operation, the controller receives the write command, checks that the NAND flash memory is unlocked, and allows execution. Before executing the user command, it first checks whether the SSD is in a locked state. If it is unlocked, the command is allowed to execute normally, ensuring business continuity.

[0067] Temperature acquisition command judgment: If temperature acquisition is required in the current cycle, the temperature acquisition command will be sent together with other commands without pausing user commands. While acquiring the temperature, the current temperature cTemp will be read; for example, if cTemp = 82℃ at this time.

[0068] Flow control activated: Because cTemp > 70℃ and < 85℃, the system has entered the flow control threshold range and begins flow control operations. Within this range, the SSD's read and write speeds need to be adjusted using a PID control algorithm to control the temperature rise.

[0069] PID duty cycle calculation: Calculation deviation: cTemp (82℃) - Target (70℃) = 12℃, that is, the current temperature is 12℃ higher than the target temperature, and speed limiting operation is required.

[0070] Combining historical integrals and rate of change, the PID output duty cycle is adjusted to 55%. The PID control algorithm calculates an optimal duty cycle based on the deviation between the current temperature and the target temperature, the accumulation of historical deviations, and the trend of deviation changes, in order to achieve precise control of SSD read and write speeds.

[0071] Instruction time slice allocation: Within a 1-second PID control cycle, full-load write is allowed for 550ms, while temperature sampling is disabled for the remaining 450ms. This method allocates SSD read / write time based on the calculated duty cycle, allowing full-load writes within the allowed time and temperature sampling only during the disabled instruction period, thus reducing SSD power consumption and heat generation.

[0072] Dynamic parameter updates: If the temperature rise rate is >1℃ / s, it indicates that the temperature is rising too fast. At this time, the high temperature lock threshold of 90℃ will be temporarily activated, and the duty cycle will be forcibly reduced to 0%, that is, all non-temperature acquisition commands will be suspended to prevent the temperature from rising further and causing hardware damage.

[0073] cTemp and LastTemp are updated each cycle to dynamically correct the PID output. Based on the current temperature collected in each cycle and the temperature of the previous cycle, the parameters of the PID control algorithm are continuously adjusted so that the duty cycle can more accurately match the actual needs, achieving more effective temperature control.

[0074] In the above process, this embodiment of the invention achieves a dynamic balance between temperature control response speed and performance stability through PID closed-loop control and multi-level threshold linkage. PID closed-loop control can dynamically adjust the duty cycle according to real-time temperature changes, while multi-level thresholds define the control strategy for different temperature ranges. The two work together to ensure that speed limiting measures can be taken in a timely manner when the temperature rises, while avoiding the impact of excessive speed limiting on SSD performance.

[0075] Step S4: Instruction queue management in disk lock state.

[0076] Specifically, if the NAND temperature exceeds 85℃ (high temperature lock-up threshold): Emergency disk lock trigger: Immediately suspend all non-temperature acquisition commands and mark the disk lock status. When the temperature reaches the high-temperature disk lock threshold, in order to protect data and hardware, all operations that may affect the temperature need to be stopped immediately, and only temperature acquisition commands are allowed to execute to continuously monitor temperature changes.

[0077] Instruction caching: Incomplete instructions are stored in the processing queue in sequence. Temperature instructions have no priority and will enter the processing queue along with other instructions, waiting to be processed after the disk lock is released.

[0078] Temperature recovery monitoring: Continuously collect temperature data. If the temperature drops below the high-temperature unlocking temperature threshold of 80℃ for 10 seconds, the lock mark is removed. While the drive is locked, continuously monitor temperature changes. When the temperature drops to a safe range and remains there for a period of time, the SSD is considered to have returned to normal and the lock status can be removed.

[0079] Command continuation: After unlocking the disk, flow control is performed. If the temperature remains within the flow control range, flow control operations continue; if the temperature is within the normal range, cached commands are executed sequentially. During command execution, the current temperature status is first assessed, and appropriate control strategies are implemented based on different statuses to ensure the SSD can safely resume operations.

[0080] In the above process, this embodiment of the invention uses instruction queue management to ensure data recovery under extreme temperatures and avoid service interruptions. While most instruction execution is paused in disk lock mode, the instructions are cached and can resume execution once the temperature returns to normal, ensuring data integrity and business continuity. Furthermore, flow control is performed after disk unlocking to reasonably control SSD performance based on actual conditions and prevent the temperature from rising again.

[0081] Step S5: Normal state restoration and performance mode restart.

[0082] Specifically, when the NAND temperature stabilizes at 65°C (within the range of 5°C to 70°C): Status flag clear: Removes the activation flags for the flow control and disk lock modules. At this point, the SSD temperature is within the normal range, and flow control and disk lock operations are no longer required. Clearing the relevant flags restores normal operating mode.

[0083] Full-bandwidth recovery: Allows instructions to execute continuously and clears the pending queue. It executes all cached instructions, enabling the SSD to operate at full bandwidth and fully utilize its performance.

[0084] Continuous monitoring: Return to performance mode and continue periodic temperature sampling and status assessment. Even after returning to normal operation, temperature monitoring continues, and the operating status is adjusted promptly based on temperature changes to ensure the SSD always operates within a safe temperature range.

[0085] In the above process, this embodiment of the invention uses a dynamic state switching mechanism to ensure that the SSD maximizes its performance output within a safe temperature range. Once the temperature returns to normal, the restrictions are promptly lifted, allowing the SSD to recover to its optimal performance state. Simultaneously, a continuous monitoring mechanism can promptly detect temperature anomalies, ensuring the long-term stable operation of the SSD.

[0086] Through the above process, this embodiment of the invention divides the disk lock, flow control, and normal states using multi-level thresholds (0℃ / 5℃ / 70℃ / 80℃ / 85℃), and combines this with a PID algorithm to adjust the instruction duty cycle in real time, thus solving the lag problem of traditional temperature control. In flow control mode, the duty cycle is dynamically adjusted according to temperature changes to achieve a dynamic balance between temperature control response speed and performance stability. In disk lock mode, instruction queue management ensures data recoverability and avoids data loss caused by hard shutdown. After temperature recovery, the system dynamically switches to performance mode to ensure service continuity. Compared to traditional solutions, this method significantly improves the stability and data persistence capabilities of SSDs under extreme temperatures, making it suitable for high-reliability scenarios such as data centers and edge computing.

[0087] The following are embodiments of the apparatus of the present invention, which can be used to execute the SSD solid-state drive temperature control method involved in the present invention. For details not disclosed in the apparatus embodiments of the present invention, please refer to the method embodiments of the SSD solid-state drive temperature control method involved in the present invention.

[0088] Please see Figure 4 This invention provides an SSD solid-state drive temperature control device 800.

[0089] The SSD solid-state drive temperature control device 800 includes, but is not limited to: a temperature acquisition module 810, a threshold setting module 830, a disk lock processing module 850, and a flow control adjustment module 870.

[0090] The temperature acquisition module 810 is used to collect the temperature of the NAND flash memory in real time according to a preset time period through the temperature acquisition module in the SSD solid-state drive, and update the current temperature in real time.

[0091] The threshold setting module 830 is used to set temperature thresholds from low temperature to high temperature according to the application scenario of the SSD; the temperature thresholds include low temperature lock-up temperature, low temperature unlock temperature, high temperature current limiting temperature, high temperature unlock temperature and high temperature lock-up temperature.

[0092] The lock disk processing module 850 is used to mark the lock disk and accelerate the acquisition of the current temperature when the current temperature is higher than the high temperature lock disk temperature or lower than the low temperature lock disk temperature, until the current temperature is higher than the low temperature unlocking temperature and lower than the high temperature unlocking temperature, and then remove the lock disk marking.

[0093] The flow control module 870 is used to adjust the duty cycle of the SSD through a PID control algorithm until the current temperature is lower than the high temperature current limit temperature when the current temperature is higher than the high temperature current limit temperature but lower than the high temperature disk lock temperature. The PID algorithm means that the optimal duty cycle is calculated based on the deviation between the current temperature and the target temperature.

[0094] It should be noted that the SSD solid-state drive temperature control provided in the above embodiments is only an example of the division of the above functional modules. In actual applications, the above functions can be assigned to different functional modules as needed. That is, the internal structure of the SSD solid-state drive temperature control device will be divided into different functional modules to complete all or part of the functions described above.

[0095] Furthermore, the SSD solid-state drive temperature control device and the SSD solid-state drive temperature control method provided in the above embodiments belong to the same concept. The specific way each module performs its operation has been described in detail in the method embodiments, and will not be repeated here.

[0096] Figure 5 A schematic diagram of the structure of an electronic device according to an exemplary embodiment is shown.

[0097] It should be noted that this electronic device is merely an example adapted to the present invention and should not be construed as providing any limitation on the scope of use of the present invention. Furthermore, this electronic device should not be interpreted as requiring or depending on having... Figure 5 One or more components of the exemplary electronic device 2000 shown.

[0098] The hardware structure of electronic devices 2000 can vary significantly due to differences in configuration or performance, such as... Figure 5 As shown, the electronic device 2000 includes: a power supply 210, an interface 230, at least one memory 250, and at least one central processing unit (CPU) 270.

[0099] Specifically, power supply 210 is used to provide operating voltage for various hardware devices on electronic device 2000.

[0100] Interface 230 includes at least one wired or wireless network interface 231 for interacting with external devices. Of course, in other examples adapted to this invention, interface 230 may further include at least one serial-to-parallel conversion interface 233, at least one input / output interface 235, and at least one USB interface 237, etc. Figure 5 As shown, this does not constitute a specific limitation.

[0101] The memory 250 serves as a carrier for resource storage and can be a read-only memory, random access memory, disk, or optical disk, etc. The resources stored on it include the operating system 251, application programs 253, and data 255, etc., and the storage method can be temporary storage or permanent storage.

[0102] The operating system 251 is used to manage and control the various hardware devices and application programs 253 on the electronic device 2000, so as to enable the central processing unit 270 to perform calculations and processing on the massive data 255 in the memory 250. It can be Windows Server™, Mac OS X™, Unix™, Linux™, FreeBSD™, etc.

[0103] Application 253 is a computer-readable instruction based on operating system 251 that performs at least one specific task, and may include at least one module ( Figure 5 (Not shown), each module may contain computer-readable instructions for electronic device 2000. For example, the SSD solid-state drive temperature control device can be considered as application program 253 deployed on electronic device 2000.

[0104] Data 255 may be signal information, etc., and is stored in memory 250.

[0105] The central processing unit 270 may include one or more processors and is configured to communicate with the memory 250 via at least one communication bus to read computer-readable instructions stored in the memory 250, thereby performing operations and processing on massive amounts of data 255 stored in the memory 250. For example, an SSD solid-state drive temperature control method can be implemented by the central processing unit 270 reading a series of computer-readable instructions stored in the memory 250.

[0106] Furthermore, the present invention can also be implemented through hardware circuits or a combination of hardware circuits and software. Therefore, the implementation of the present invention is not limited to any specific hardware circuit, software, or combination thereof.

[0107] Please see Figure 6 This invention provides an electronic device 4000, which may include: a desktop computer, a laptop computer, a server, etc., with sensor recognition capabilities.

[0108] exist Figure 6 In this context, the electronic device 4000 includes at least one processor 4001 and at least one memory 4003.

[0109] The data interaction between the processor 4001 and the memory 4003 can be achieved through at least one communication bus 4002. This communication bus 4002 may include a path for transmitting data between the processor 4001 and the memory 4003. The communication bus 4002 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The communication bus 4002 can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0110] Optionally, the electronic device 4000 may further include a transceiver 4004, which can be used for data interaction between the electronic device and other electronic devices, such as sending and / or receiving data. It should be noted that in practical applications, the transceiver 4004 is not limited to one type, and the structure of the electronic device 4000 does not constitute a limitation on the embodiments of the present invention.

[0111] Processor 4001 may be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this invention. Processor 4001 may also be a combination that implements computing functions, such as including one or more microprocessor combinations, a combination of a DSP and a microprocessor, etc.

[0112] The memory 4003 may be a ROM (Read Only Memory) or other type of static storage device capable of storing static information and instructions, RAM (Random Access Memory) or other type of dynamic storage device capable of storing information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), CD-ROM (Compact Disc Read Only Memory) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program instructions or code in the form of instructions or data structures and accessible by the electronic device 4000, but not limited thereto.

[0113] The memory 4003 stores computer-readable instructions, and the processor 4001 can read the computer-readable instructions stored in the memory 4003 through the communication bus 4002.

[0114] The computer-readable instructions are executed by one or more processors 4001 to implement the SSD solid-state drive temperature control method in the above embodiments.

[0115] Furthermore, this embodiment of the invention provides a storage medium storing computer-readable instructions, which are executed by one or more processors to implement the SSD solid-state drive temperature control method described above.

[0116] This invention provides a computer program product, which includes computer-readable instructions stored in a storage medium. One or more processors of an electronic device read the computer-readable instructions from the storage medium, load and execute the computer-readable instructions, thereby enabling the electronic device to implement the SSD solid-state drive temperature control method as described above.

[0117] Compared with related technologies, the beneficial effects of the present invention are: 1. This invention can precisely control the temperature of SSD solid-state drives to ensure their stable operation. By setting a temperature acquisition module in the SSD solid-state drive, the temperature of NAND flash memory is collected and updated in real time according to a preset time period. At the same time, temperature thresholds from low temperature to high temperature are set according to the application scenario, and corresponding temperature control measures are taken according to different temperature conditions to achieve precise temperature control and avoid the impact of abnormal temperature on hard drive performance and stability.

[0118] 2. This invention features an intelligent locking and unlocking mechanism that effectively protects data security. By setting low-temperature locking, low-temperature unlocking, high-temperature locking, and high-temperature unlocking temperatures, the device locks itself when the current temperature is higher than the high-temperature locking temperature or lower than the low-temperature locking temperature. The locking is lifted when the temperature is within a suitable range. In case of abnormal temperature, the device locks itself in time to prevent data from being damaged due to abnormal conditions. Once the temperature returns to normal, the device is unlocked and can be used again, ensuring data security.

[0119] 3. This invention can reasonably adjust flow control and optimize SSD performance. By setting a high-temperature current limit temperature, when the current temperature is higher than the high-temperature current limit temperature but lower than the high-temperature disk lock temperature, the PID control algorithm is used to adjust the duty cycle of the SSD until the current temperature is lower than the high-temperature current limit temperature, thus avoiding the hard drive from running under high load for a long time at high temperature, reasonably allocating resources and optimizing hard drive performance.

[0120] 4. This invention has a highly efficient PID control algorithm adjustment capability, which improves the temperature control effect. By setting the initial parameters of the PID control algorithm, taking the high temperature current limiting temperature as the target temperature, the current temperature is collected periodically and the deviation value is calculated. Then, the optimal duty cycle is calculated by combining the response values ​​of the proportional, integral and derivative links. Based on the optimal duty cycle, the allowable time period and the prohibition time period allocation of the NAND are adjusted to achieve efficient and accurate temperature control.

[0121] 5. This invention can reasonably handle commands during low-temperature disk locking, ensuring operational continuity. When the current temperature is lower than the low-temperature disk locking temperature mark and the current temperature is collected at an accelerated pace, all commands except for temperature collection are added to the processing queue. After the temperature is higher than the low-temperature unlocking temperature to remove the disk locking mark, the commands in the processing queue are executed, avoiding command loss or operation interruption due to disk locking, and ensuring operational continuity.

[0122] 6. This invention features a complete high-temperature disk locking process to ensure hard drive safety and performance recovery. When the current temperature exceeds the high-temperature disk locking temperature, the disk is locked and the current temperature is rapidly collected. The instruction is added to the processing queue. After the disk locking mark is removed, it is determined whether the current temperature is higher than the high-temperature current limiting temperature. If it is higher, the flow control state is marked and adjusted using a PID control algorithm until the temperature is lower than the high-temperature current limiting temperature, at which point the flow control state is released. Otherwise, the instructions in the processing queue are executed, comprehensively ensuring the safety of the hard drive and subsequent performance recovery under high-temperature conditions.

[0123] 7. This invention can adaptively adjust PID parameters to enhance temperature control adaptability; using the high-temperature current-limiting temperature as the target value of PID control, the PID algorithm parameters are adjusted by trial and error, and the PID output is adaptively corrected according to the current temperature in each cycle to ensure that the duty cycle dynamically matches the actual needs, so that the temperature control system can adapt to different working conditions and environmental changes, and enhance the adaptability and stability of temperature control.

[0124] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0125] The above description is only a partial embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for controlling the temperature of an SSD solid state drive, characterized in that, The method comprises: Real-time collection of the temperature of the NAND particles by a temperature collection module in the SSD according to a preset time period, and real-time updating of the current temperature; Setting temperature threshold values from low temperature to high temperature according to the application scenario of the SSD; the temperature threshold values comprise a low-temperature lock disc temperature, a low-temperature unlocking temperature, a high-temperature current limiting temperature, a high-temperature unlocking temperature and a high-temperature lock disc temperature; When the current temperature is higher than the high-temperature lock disc temperature or lower than the low-temperature lock disc temperature, marking the lock disc and accelerating the collection of the current temperature until the current temperature is higher than the low-temperature unlocking temperature and lower than the high-temperature unlocking temperature, and the lock disc marking is removed; When the current temperature is higher than the high-temperature current limiting temperature and lower than the high-temperature lock disc temperature, adjusting the duty cycle of the SSD by a PID control algorithm until the current temperature is lower than the high-temperature current limiting temperature; the PID algorithm means calculating the optimal duty cycle according to the deviation of the current temperature and the target temperature.

2. The method of claim 1, wherein the temperature of the SSD is controlled by the controller. The low-temperature lock disc temperature refers to triggering the lock disc operation when the current temperature is lower than the low-temperature lock disc temperature; the low-temperature unlocking temperature refers to removing the lock disc operation when the current temperature is higher than the low-temperature unlocking temperature; the high-temperature current limiting temperature refers to starting the flow control adjustment when the current temperature is higher than the high-temperature current limiting temperature; the high-temperature unlocking temperature refers to removing the lock disc operation when the current temperature is lower than the high-temperature unlocking temperature; and the high-temperature lock disc temperature refers to triggering the lock disc operation when the current temperature is higher than the high-temperature lock disc temperature.

3. The method of claim 1, wherein the temperature of the SSD is controlled by a temperature control device. The adjusting of the duty cycle of the SSD by the PID control algorithm until the current temperature is lower than the high-temperature current limiting temperature comprises: Setting the initial parameters of the PID control algorithm, setting the initial value of the duty cycle according to the design requirements and experience data of the SSD, and taking the initial value as the starting point of the adjustment of the PID control algorithm; the initial parameters comprise proportional gain, integral gain and differential gain; Taking the high-temperature current limiting temperature as the target temperature, setting the cycle time of temperature collection, periodically collecting the current temperature of the NAND particles and updating according to the cycle time, and calculating the deviation value between the current temperature and the target temperature.

4. The temperature control method of the SSD solid state disk according to claim 3, wherein, The adjusting of the duty cycle of the SSD by the PID control algorithm until the current temperature is lower than the high-temperature current limiting temperature further comprises: Calculating the response value of the proportional link according to the deviation value by the proportional gain, calculating the response value of the integral link according to the accumulated deviation value by the integral gain, and calculating the response value of the differential link according to the trend of the deviation value and the differential gain; Calculating the optimal duty cycle by the PID control algorithm according to the response values of the proportional link, the integral link and the differential link, and adjusting the allocation of the allowed time period and the prohibited time period of the NAND according to the optimal duty cycle; full load is allowed in the allowed time period, and only temperature collection is allowed in the prohibited time period.

5. The method of claim 1, wherein the temperature of the SSD is controlled by a temperature control system. When the current temperature is higher than the high-temperature lock disc temperature or lower than the low-temperature lock disc temperature, the lock disc is marked and the current temperature is accelerated to be collected until the current temperature is higher than the low-temperature unlock temperature and lower than the high-temperature unlock temperature, and the lock disc mark is released, comprising: When the current temperature is lower than the low-temperature lock disc temperature, the lock disc is marked and the current temperature is accelerated to be collected, and all instructions except temperature collection are added to a pending queue; Until the current temperature is higher than the low-temperature unlock temperature, the lock disc mark is released, and the instructions in the pending queue are executed.

6. The method of claim 1, wherein the temperature of the SSD is controlled by a temperature control system. When the current temperature is higher than the high-temperature lock disc temperature or lower than the low-temperature lock disc temperature, the lock disc is marked and the current temperature is accelerated to be collected until the current temperature is higher than the low-temperature unlock temperature and lower than the high-temperature unlock temperature, and the lock disc mark is released, further comprising: When the current temperature is higher than the high-temperature lock disc temperature, the lock disc is marked and the current temperature is accelerated to be collected, and all instructions except temperature collection are added to a pending queue; Until the current temperature is lower than the low-temperature unlock temperature, the lock disc mark is released, and it is determined whether the current temperature is higher than the high-temperature current limiting temperature; If the current temperature is higher than the high-temperature current limiting temperature, a flow control state is marked, a duty cycle of the SSD is adjusted by a PID control algorithm until the current temperature is lower than the high-temperature current limiting temperature, and the flow control state is released, otherwise the instructions in the pending queue are executed.

7. The method of claim 1, wherein the temperature of the SSD is controlled by a temperature control system. The duty cycle of the SSD is adjusted by the PID control algorithm until the current temperature is lower than the high-temperature current limiting temperature, further comprising: The high-temperature current limiting temperature is used as a target value of the PID control, and parameters of the PID algorithm are adjusted by a trial and error method; the parameters are used to balance system response speed and stability, the PID output is adaptively corrected according to the current temperature every period, and the duty cycle is dynamically matched to actual demand.

8. A temperature control device for an SSD solid state drive, characterized in that, The device comprises: A temperature collection module, configured to collect the temperature of the NAND particles in real time by a temperature collection module in the SSD at a preset time period, and update the current temperature in real time; A threshold setting module, configured to set temperature thresholds from low temperature to high temperature according to application scenarios of the SSD; the temperature thresholds comprise a low-temperature lock disc temperature, a low-temperature unlock temperature, a high-temperature current limiting temperature, a high-temperature unlock temperature, and a high-temperature lock disc temperature; A lock disc processing module, configured to mark the lock disc and accelerate the collection of the current temperature when the current temperature is higher than the high-temperature lock disc temperature or lower than the low-temperature lock disc temperature, until the current temperature is higher than the low-temperature unlock temperature and lower than the high-temperature unlock temperature, and the lock disc mark is released. A flow control adjusting module, configured to adjust the duty cycle of the SSD by a PID control algorithm when the current temperature is higher than the high-temperature current limiting temperature and lower than the high-temperature lock disc temperature until the current temperature is lower than the high-temperature current limiting temperature; the PID algorithm represents an optimal duty cycle calculated according to a deviation between the current temperature and a target temperature.

9. An electronic device, comprising: Comprising: At least one processor and at least one memory, wherein, The memory has computer readable instructions stored thereon; The computer readable instructions are executed by one or more of the processors, so that the electronic device implements the SSD solid state disk temperature control method according to any one of claims 1 to 7.

10. A storage medium having stored thereon computer readable instructions, characterized in that, The computer readable instructions are executed by one or more processors to implement the SSD solid state disk temperature control method according to any one of claims 1 to 7.

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