Method for acquiring back drilling parameters, back drilling method and device, electronic equipment and storage medium

Abstract

The invention provides a method for acquiring back drilling parameters, a back drilling method and device, electronic equipment and a storage medium. The method comprises the following steps: acquiring center coordinate information of a first round hole formed by a target through hole in a back drilling stop layer of a circuit board; acquiring a measurement thickness corresponding to a measurement position within a preset distance from the center coordinate information of the first circular hole on the circuit board; solving the average value of the measured thicknesses to obtain the actual thickness of the circuit board; based on the actual plate thickness, the theoretical plate thickness of the circuit board and the theoretical depth of the back drilling stop layer, the back drilling depth of back drilling of the target through hole is obtained, the actual thickness of the circuit board can be obtained through measurement based on the center coordinate of the drill hole of the back drilling stop layer, and therefore the back drilling depth can be accurately calculated; the problems that the backdrilling stop layer is damaged by over-drilling and the residual stub is too long due to under-drilling are effectively avoided, and the quality and stability of the backdrilling process are remarkably improved.

Description

Technical Field

[0001] This application belongs to the field of circuit board processing technology, and in particular relates to a method, apparatus, electronic device and storage medium for obtaining back-drilling parameters. Background Technology

[0002] As 3C products evolve towards lightweight, thin, and multifunctional designs, traditional fixed-depth back drilling struggles to meet the precision requirements of high Z-axis vertical interconnect drilling and the need for residual copper stub back drilling. Due to the inherent thickness tolerances of printed circuit boards (PCBs), fixed-depth back drilling is prone to over-drilling or under-drilling. Thickness-based back drilling is an optimized process for high-speed signal transmission. Using "board thickness" as the core variable, it dynamically adjusts the back drilling depth to precisely remove redundant copper pillars, improving high-frequency signal integrity. The key to thickness-based back drilling lies in accurately measuring the PCB thickness. This is achieved by measuring the board thickness using the coordinates of the surface holes on the PCB. However, the electroplating process in back drilling causes the PCB to expand and contract due to heat. Therefore, the thickness measurement process includes: drilling through-holes → through-hole electroplating → board thickness measurement → back drilling. Because it is difficult to keep the drill bit perpendicular when drilling through holes, the tilt is more severe in multilayer boards. The drill bit wobble increases the tilt of the drilling hole. In addition, the low accuracy of the inner layer copper alignment in multilayer PCBs and the difference in thermal expansion of high-frequency materials cause interlayer offset. As a result, the board thickness measured by the hole coordinates on the board surface cannot represent the board thickness corresponding to the actual through hole coordinates of the back drilling stop layer. This causes large fluctuations in the stub and large differences in the stub length during back drilling. Summary of the Invention

[0003] In view of this, embodiments of this application provide a method, apparatus, electronic device, and storage medium for obtaining back-drilling parameters, which can dynamically and accurately calculate the back-drilling depth based on the center coordinates of the drill hole in the back-drilling stop layer, thereby improving the stability of the stub during back-drilling and enhancing the quality of the back-drilling process.

[0004] In a first aspect, embodiments of this application provide a method for obtaining back-drilling parameters, for a circuit board having multiple through holes, including: Obtain the center coordinate information of the first circular hole formed by the target through hole in the back drill stop layer of the circuit board, wherein the target through hole is one or more of the through holes; Obtain the measured thickness corresponding to the measurement position on the circuit board within a preset distance from the center coordinate information of the first circular hole; calculate the average value of the measured thickness to obtain the actual thickness of the circuit board; The back-drilling depth for back-drilling the target through-hole is obtained based on the actual board thickness, the theoretical board thickness of the circuit board, and the theoretical depth of the back-drilling stop layer.

[0005] In some embodiments, obtaining the back-drilling depth for back-drilling the target through-hole based on the actual board thickness, the theoretical board thickness of the circuit board, and the theoretical depth of the back-drilling stop layer includes: Divide the actual plate thickness by the theoretical plate thickness to obtain the plate thickness ratio; Multiply the plate thickness ratio by the theoretical depth to obtain the initial back-drilling depth for back-drilling the target through hole; The initial back-drilling depth is added to the error compensation amount to obtain the back-drilling depth for back-drilling the target through hole.

[0006] In some embodiments, obtaining the center coordinate information of the first circular hole formed by the target through-hole in the back-drill stop layer of the circuit board includes: Obtain the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole in the circuit board, as well as obtain the actual thickness of the circuit board and the actual depth of the back drill stop layer of the circuit board; Based on the center coordinate information of the second circular hole, the center coordinate information of the third circular hole, the actual depth, and the actual thickness, the center coordinate information of the first circular hole on the back drilling stop layer of the target through hole is calculated, so as to determine the center coordinate information of the first circular hole as the back drilling position when back drilling the target through hole.

[0007] In some embodiments, calculating the center coordinate information of the first circular hole on the back-drill stop layer of the target through-hole on the circuit board based on the center coordinate information of the second circular hole, the center coordinate information of the third circular hole, the actual depth, and the actual thickness includes: The calculated ratio is obtained by dividing the actual depth by the actual thickness. The offset is obtained by subtracting the center coordinates of the second circular hole from the center coordinates of the third circular hole. Multiply the offset by the calculated ratio to obtain the corrected offset; The center coordinates of the first hole are obtained by adding the correction offset to the center coordinates of the second hole.

[0008] In some embodiments, obtaining the actual depth of the back-drilling stop layer includes: Obtain the theoretical depth of the back-drill stop layer, the theoretical thickness of the circuit board, and the actual thickness of the circuit board; Divide the actual thickness by the theoretical thickness to obtain the thickness ratio; Multiplying the theoretical depth by the thickness ratio yields the actual depth of the back-drilling stop layer.

[0009] In some embodiments, the target through-hole is formed as a circular hole on the first surface and the second surface of the circuit board, respectively; The process of obtaining the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through-hole in the circuit board includes: Acquire first image information of the first surface and first image information of the second surface of the circuit board; The center coordinates of the circular holes on the first surface and the center coordinates of the circular holes on the second surface are determined based on the first image information and the second image information. Based on the center coordinate information of the circular holes on the first surface and the center coordinate information of the circular holes on the second surface, the circular holes on the first surface and the circular holes on the second surface corresponding to each target through hole are obtained, so as to obtain the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole.

[0010] In some embodiments, determining the center coordinates of the circular holes on the first surface and the second surface based on the first image information and the second image information includes: The first image information is binarized to obtain a first binarized image. The edge information of the circular hole on the first surface is determined based on the first binarized image, and the center coordinate information of the circular hole on the first surface is determined based on the edge information of the circular hole on the first surface. The second image information is binarized to obtain a second binarized image. The edge information of the circular hole on the second surface is determined based on the second binarized image, and the center coordinate information of the circular hole on the second surface is determined based on the edge information of the circular hole on the second surface.

[0011] In some embodiments, the method further includes: The first number of circular holes on the first surface is identified based on the first image information; The second number of circular holes on the second surface is identified based on the second image information; Determine whether the first quantity and the second quantity are consistent.

[0012] Secondly, embodiments of this application provide a back-drilling method, including: Obtain the back drill parameters obtained by the method for obtaining back drill parameters as described in any one of the first aspects; The circuit board is back-drilled based on the back-drilling parameters.

[0013] Thirdly, embodiments of this application provide an apparatus for obtaining back-drilling parameters, used on a circuit board having multiple through holes, comprising: The acquisition module is used to acquire the center coordinate information of the first circular hole formed by the target through hole in the back drill stop layer of the circuit board, wherein the target through hole is one or more of the through holes; The first determining module is used to obtain the measured thickness corresponding to the measurement position within a preset distance from the center coordinate information of the first circular hole on the circuit board; calculate the average value of the measured thickness to obtain the actual thickness of the circuit board; The second determining module is used to determine the back-drilling depth for back-drilling the target through hole based on the actual plate thickness, the theoretical plate thickness, and the theoretical depth of the back-drilling stop layer.

[0014] Fourthly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method described in any of the above-mentioned embodiments.

[0015] Fifthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in any of the preceding claims.

[0016] Sixthly, embodiments of this application provide a computer program product that, when run on a terminal device, causes the electronic device to execute any of the methods described above.

[0017] The beneficial effects of the embodiments in this application compared with the prior art are: This application provides a method for obtaining back-drilling parameters. The method involves obtaining the center coordinates of a first circular hole formed by a target through-hole on a back-drilling stop layer of a circuit board; obtaining the measured thickness corresponding to a measurement position on the circuit board within a preset distance from the center coordinates of the first circular hole; calculating the average value of the measured thickness to obtain the actual thickness of the circuit board; and obtaining the back-drilling depth for back-drilling the target through-hole based on the actual board thickness, the theoretical board thickness, and the theoretical depth of the back-drilling stop layer. This method allows for the measurement of the actual thickness of the circuit board based on the center coordinates of the drill hole in the back-drilling stop layer, thereby enabling accurate calculation of the back-drilling depth. This effectively avoids damage to the back-drilling stop layer due to over-drilling and excessively long residual stubs due to under-drilling, significantly improving the quality and stability of the back-drilling process. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram illustrating the implementation process of a method for obtaining back-drilling parameters provided for the implementation of this application; Figure 2 This is a schematic diagram of the residual column after back-drilling at the back-drilling position determined by the method provided in the embodiments of this application; Figure 3 A schematic flowchart of a back drilling method provided in an embodiment of this application; Figure 4 A schematic diagram of a device for obtaining back-drilling parameters provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0020] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0021] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0022] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0023] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once detected," or "in response to detection."

[0024] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0026] The applicant carefully studied the existing back-drilling methods and found that the reason for the large stub fluctuations and large stub length differences during back-drilling is that they all measure the board thickness using the coordinates of the board surface. However, when the drill bit is tilted or there is interlayer offset, the board thickness measured by the hole coordinates on the board surface cannot represent the board thickness corresponding to the actual through-hole coordinates of the back-drilling stop layer. Therefore, the applicant attempted to measure the actual board thickness using the center coordinate information of the circular hole in the back-drilling stop layer, and then determine the back-drilling depth based on the actual board thickness. This can improve the stub stability during back-drilling and improve the quality of the back-drilling process.

[0027] Based on the problems in related technologies, this application provides a method for obtaining back-drilling parameters that can be applied to electronic devices. These electronic devices may include: mobile phones, tablets, wearable devices, augmented reality (AR) / virtual reality (VR) devices, laptops, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), etc. The electronic devices can serve as controllers for a machining system. This application does not impose any limitations on the specific type of electronic device. Figure 1 A schematic diagram illustrating the implementation process of a method for obtaining back-drilling parameters provided for the purposes of this application is provided. The back-drilling parameters may include: back-drilling depth and / or back-drilling position, such as... Figure 1 As shown, it includes: Step S101: Obtain the center coordinate information of the first circular hole formed by the target through hole in the back drill stop layer of the circuit board.

[0028] In this embodiment, the circuit board can be a PCB board, and the target through-hole is a metallized hole in the circuit board that needs to be back-drilled, used to connect different back-drill stop layers or provide electrical connections. The target through-hole can be one or more of the various through holes on the circuit board. The first circular hole is a circular opening formed by the target through-hole at the back-drill stop layer, and its center coordinates are the starting position of the back-drill.

[0029] In this embodiment, images of the first and second surfaces of the circuit board can be captured using a charge-coupled device (CCD). The images are then processed by grayscale conversion, noise reduction, and binarization to extract the edge contours of the circular holes. The center coordinates of the second circular hole on the first surface and the third circular hole on the second surface are then calculated. Based on the center coordinates of the second and third circular holes, the actual depth, and the actual thickness, the center coordinates of the first circular hole on the back-drill stop layer of the target via on the circuit board are calculated.

[0030] Step S102: Obtain the measured thickness corresponding to the measurement position within a preset distance from the center coordinate information of the first circular hole on the circuit board; calculate the average value of the measured thickness to obtain the actual thickness of the circuit board.

[0031] In this embodiment, the actual board thickness is the actual thickness of the circuit board during the manufacturing process due to material compression, lamination errors, etc., and may deviate from the theoretical design value.

[0032] In this embodiment, the preset distance is the radius of a circular area defined within the circuit board plane, centered on the center of the first circular hole, used to limit the distribution range of the board thickness measurement points. The measurement positions are multiple points selected within the preset distance range according to specific rules, used to collect board thickness data. These rules may include: equal-spaced distribution, gridded distribution, etc. The measured thickness is the circuit board thickness value obtained at each measurement position using a non-contact sensor. The preset distance can be dynamically adjusted according to the circuit board material and through-hole size. Within the preset distance range, N points are selected radially at equal intervals, with the center of the first circular hole as the origin. A measuring instrument is used to measure the thickness corresponding to the measurement position. N can be four points, located at 0°, 90°, 180°, and 270° respectively. The actual board thickness is obtained by taking the arithmetic mean of all measured thicknesses, used to correct the back-drilling depth parameters. In this embodiment, outlier values ​​can be removed from the measured thickness, for example, using the Grubbs criterion or the 3σ principle to remove measured values ​​that significantly deviate from the mean. Then, the average value is calculated to obtain the actual thickness of the circuit board.

[0033] In the embodiments provided in this application, by measuring at multiple points and calculating the average value, the accuracy of the actual thickness of the obtained circuit board can be improved.

[0034] Step S103: Based on the actual board thickness, the theoretical board thickness of the circuit board, and the theoretical depth of the back-drilling stop layer, the back-drilling depth for back-drilling the target through hole is obtained.

[0035] In this embodiment, the theoretical board thickness is the ideal thickness calculated based on material parameters during the circuit board design phase. The theoretical depth of the back drill stop layer is the theoretical depth of the back drill stop layer in the design. The back drill depth is the depth to which the surface is drilled downwards, and it needs to be precisely controlled to remove the stub without damaging the underlying back drill stop layer.

[0036] In this embodiment of the application, a formula can be used to calculate the back-drilling depth. The actual board thickness, the theoretical board thickness of the circuit board, and the theoretical depth of the back-drilling stop layer can be input into the formula to obtain the back-drilling depth.

[0037] This application provides a method for obtaining back-drilling parameters. The method involves obtaining the center coordinates of a first circular hole formed by a target through-hole on a back-drilling stop layer of a circuit board; obtaining the measured thickness corresponding to a measurement position on the circuit board within a preset distance from the center coordinates of the first circular hole; calculating the average value of the measured thickness to obtain the actual thickness of the circuit board; and obtaining the back-drilling depth for back-drilling the target through-hole based on the actual board thickness, the theoretical board thickness, and the theoretical depth of the back-drilling stop layer. This method allows for the measurement of the actual thickness of the circuit board based on the center coordinates of the drill hole in the back-drilling stop layer, thereby enabling accurate calculation of the back-drilling depth. This effectively avoids damage to the back-drilling stop layer due to over-drilling and excessively long residual stubs due to under-drilling, significantly improving the quality and stability of the back-drilling process.

[0038] In some embodiments, step S103 can be implemented by the following steps: Step S1031: Divide the actual plate thickness by the theoretical plate thickness to obtain the plate thickness ratio.

[0039] In this embodiment, the plate thickness ratio is the ratio of the actual plate thickness to the theoretical plate thickness.

[0040] Step S1032: Multiply the plate thickness ratio by the theoretical depth to obtain the initial back-drilling depth for back-drilling the target through hole.

[0041] In this embodiment of the application, the initial back drilling depth is the back drilling depth corrected by the plate thickness ratio.

[0042] Step S1033: Add the error compensation amount to the initial back-drilling depth to obtain the back-drilling depth for back-drilling the target through hole.

[0043] In this embodiment, the error compensation amount is a back-drilling depth correction value obtained based on historical data or real-time monitoring, including drill bit wear compensation, equipment mechanical error compensation, temperature drift compensation, etc. The back-drilling depth is the final depth of back-drilling the target through hole.

[0044] In this embodiment of the application, steps S1031 to S1033 can be represented by the following formula: L = (H1 ÷ H2) × H3 + H4; Where H1 is the actual plate thickness; H2 is the theoretical plate thickness; H3 is the theoretical depth; and H4 is the error compensation amount, usually taken as 0.05-0.1mm, used to compensate for errors such as drill bit wear and medium fluctuations.

[0045] The method provided in this application embodiment divides the actual board thickness by the theoretical board thickness to obtain a board thickness ratio; multiplies the board thickness ratio by the theoretical depth to obtain an initial back-drilling depth for back-drilling the target through-hole; and adds an error compensation amount to the initial back-drilling depth to obtain the back-drilling depth for back-drilling the target through-hole. This method can obtain a more accurate back-drilling depth, thereby improving the manufacturing quality of the PCB.

[0046] In some embodiments, step S101 can be implemented by the following steps: Step S1011: Obtain the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole in the circuit board, as well as obtain the actual thickness of the circuit board and the actual depth of the back drill stop layer of the circuit board.

[0047] In this embodiment, the circuit board can be a PCB board, which includes at least: a first surface layer and a second surface layer, and a back-drill stop layer located between the first surface layer and the second surface layer. A dielectric layer is provided between the first surface layer and the back-drill stop layer, and a dielectric layer is also provided between the second surface layer and the back-drill stop layer. The first surface layer and the second surface layer can be copper foil layers. The back-drill stop layer is a conductive layer in the PCB used for signal transmission and contains critical signal traces. When back-drilling, the back-drill stop layer must strictly avoid penetrating the signal layer, otherwise it will damage signal integrity or cause a short circuit. Here, the first surface can be the surface of the first surface layer away from the dielectric layer, and the second surface can be the surface of the second surface layer away from the dielectric layer. The first surface layer can be the top layer, and the second surface layer can be the bottom layer. In some embodiments, the first surface layer can be the bottom layer, and the second surface layer can be the top layer. When the first surface layer is the top layer, the first surface can be the top surface; when the first surface layer is the bottom layer, the first surface is the bottom surface. When the first surface layer is the top surface, the second surface is the bottom surface; when the first surface layer is the bottom surface, the second surface is the top surface. The second and third circular holes are circular openings formed on the first and second surfaces for the target through-holes, and their center coordinates reflect the surface hole positions. The second circular hole on the first surface can be a tool inlet hole, and the third circular hole on the second surface can be a tool outlet hole. Of course, the second circular hole on the first surface can be a tool outlet hole, and the third circular hole on the second surface can be a tool inlet hole.

[0048] In this embodiment, a high-precision charge-coupled device (CCD) vision system or a laser displacement sensor can be used to image the target through-holes on the first and second surfaces, respectively. The edges of the circular holes are extracted using an edge detection algorithm, and the center coordinates of the circular holes are fitted to obtain the center coordinate information (X2, Y2) of the second circular hole and the center coordinate information (X3, Y3) of the third circular hole.

[0049] In this embodiment, the actual depth of the back-drill stop layer is the vertical distance of the back-drill stop layer relative to the first surface. The actual depth of the back-drill stop layer can be calculated from its theoretical depth, and the actual thickness of the circuit board can be obtained by measurement.

[0050] Step S1012: Based on the center coordinate information of the second circular hole, the center coordinate information of the third circular hole, the actual depth, and the actual thickness, calculate the center coordinate information of the first circular hole on the back drilling stop layer of the target through hole in the circuit board, so as to determine the center coordinate information of the first circular hole as the back drilling position when back drilling the target through hole.

[0051] In this embodiment, the back-drill stop layer is an intermediate layer in the PCB that carries high-speed signals. Back-drilling is necessary to eliminate stubs and ensure signal integrity. The first circular hole is the actual hole position projection of the target via on the back-drill stop layer, and its center coordinates are the precise positioning target for the back-drill. The drill bit is inserted from one end but not to the other, only removing a portion of the copper, leaving a hollow channel. The purpose is to cut off the remaining copper stub and avoid signal interference.

[0052] In this embodiment, the actual depth of the back-drill stop layer and the actual thickness of the circuit board can be obtained. Based on the center coordinate information of the second circular hole, the center coordinate information of the third circular hole, the actual depth, and the actual thickness, the center coordinate information of the first circular hole is calculated. The center coordinate information of the first circular hole can be represented as (X1, Y1). After obtaining the center coordinate information of the third circular hole, the calculated center coordinates (X1, Y1) of the first circular hole are input to the CNC drilling machine control system to drive the drill bit to accurately position to the back-drill stop layer hole position and perform back-drilling processing.

[0053] The method provided in this application embodiment obtains the center coordinate information of the first circular hole on the first surface and the center coordinate information of the second circular hole on the second surface of the target through hole in the circuit board, as well as the actual thickness of the circuit board and the actual depth of the back drill stop layer of the circuit board; based on the center coordinate information of the first circular hole, the center coordinate information of the second circular hole, the actual depth and the actual thickness, the center coordinate information of the third circular hole on the back drill stop layer of the target through hole is calculated, so as to determine the center coordinate information of the third circular hole as the back drill position when back drilling the target through hole. Since the center coordinate information of the third circular hole on the back drill stop layer is used as the back drill position, the back drill position is concentric with the third circular hole, thereby improving the symmetry of the stub and solving the problem of the stub being longer on one side and shorter on the other side due to the drill bit tilt in the PCB back drilling process of the prior art.

[0054] Figure 2 This is a schematic diagram illustrating the process of fabricating a circuit board using the back-drilling position determined by the method provided in the embodiments of this application. Figure 2 As shown, a through hole 100 is first drilled on the circuit board. The through hole penetrates the back drill stop layer 200. It can be seen that the drilled through hole is tilted. When the drill bit 300 is used for vertical back drilling with the center coordinate information of the third circular hole, the drill bit 300 will not penetrate the back drill stop layer 200. The position of the back drill is not offset from the center coordinate of the third circular hole. After the back drill, the lengths of the left residual pile 400 and the right residual pile 500 are basically the same, that is, the symmetry of the stub is good. Even if the drilled through hole is tilted, the back drill hole can still be concentric with the drilled hole in the back drill stop layer, thus ensuring the symmetry of the stub.

[0055] In some embodiments, step S1012 can be implemented by the following steps: Step S121: Divide the actual depth by the actual thickness to obtain the calculated ratio.

[0056] In this embodiment of the application, the calculated ratio can be obtained by dividing the actual depth by the actual thickness.

[0057] Step S122: Subtract the center coordinate information of the second circular hole from the center coordinate information of the third circular hole to obtain the offset.

[0058] In this embodiment of the application, the offset can be obtained by subtracting the center coordinates of the second circular hole (X2, Y2) from the center coordinates of the third circular hole (X3, Y3). X, Y).

[0059] Step S123: Multiply the offset by the calculated ratio to obtain the corrected offset.

[0060] In this embodiment of the application, the corrected offset = offset ( X, Y)×(actual depth÷actual thickness).

[0061] Step S124: Add the correction offset to the center coordinate information of the first circular hole to obtain the center coordinate information of the third circular hole.

[0062] In this embodiment, the center coordinates (X1, Y1) of the first circular hole = the center coordinates (X2, Y2) of the second circular hole + the offset ( X, Y)×(actual depth÷actual thickness).

[0063] The method provided in this application embodiment dynamically adjusts the coordinates based on the deviation between the actual circuit board thickness and the theoretical value in actual production, ensuring that the back drill position is accurately aligned with the actual position of the back drill stop layer, thereby eliminating stub deviation. By correcting the actual thickness and proportion, it avoids depth calculation errors caused by changes in board thickness.

[0064] In some embodiments, step S1011 can be implemented by the following steps: Step S111: Obtain the theoretical depth of the back drill stop layer, the theoretical thickness of the circuit board, and the actual thickness of the circuit board.

[0065] In this embodiment, the theoretical depth of the back-drill stop layer is the vertical distance from the back-drill stop layer to the first surface of the circuit board, preset during the design phase. This is typically calculated based on PCB stack-up design parameters, which may include, for example, copper foil thickness and dielectric layer thickness. The theoretical depth of the back-drill stop layer is obtained by adding the copper foil thickness and dielectric layer thickness. The theoretical thickness of the circuit board is the total thickness preset during the design phase, derived by summing the thicknesses of each layer. The actual thickness of the circuit board is the actual total thickness obtained through physical measurement. It may deviate from the theoretical value due to lamination process tolerances, material deformation, or environmental factors. The actual thickness of the circuit board can be measured using a laser thickness gauge or a micrometer.

[0066] In this embodiment, the theoretical depth of the back-drill stop layer and the theoretical thickness of the circuit board can be read from the PCB design file. A high-precision laser thickness gauge or micrometer is used to measure at multiple points along the edge of the circuit board or around the holes, and the average value is taken as the actual thickness of the circuit board.

[0067] Step S112: Divide the actual thickness by the theoretical thickness to obtain the thickness ratio.

[0068] In this embodiment, the thickness ratio is the ratio of the actual thickness to the theoretical thickness, used to quantify the thickness change caused by the pressing process.

[0069] Step S113: Multiply the theoretical depth by the thickness ratio to obtain the actual depth of the back-drilling stop layer.

[0070] In this embodiment, the actual depth of the back drill stop layer is the true vertical distance from the back drill stop layer to the first surface after considering the pressing tolerance, which is calculated by multiplying the theoretical depth by the thickness ratio.

[0071] The method provided in this application embodiment can obtain the accurate actual depth of the back-drilling stop layer.

[0072] In some embodiments, prior to step S1011, the method further includes: Step S1: Obtain first image information of the first surface and first image information of the second surface of the circuit board.

[0073] In this embodiment, the first image information and the second image information can be two-dimensional images of the circuit board surface captured by a high-resolution industrial camera, and the two-dimensional images include the edge contours of through holes. The through holes are formed by drilling, and the number of through holes is typically set according to the actual product requirements.

[0074] In this embodiment, the circuit board can be placed on a stage and fixed by vacuum adsorption. A dual industrial camera system is used to align with the first surface and the second surface respectively, thereby acquiring first image information and second image information. The dual industrial camera system may include: a first camera and a second camera. The first camera acquires the image of the first surface, and the second camera simultaneously acquires the image of the second surface.

[0075] In some embodiments, a single industrial camera system can also be used to acquire the first image information and the second image information. When using a single industrial camera system, the camera can first acquire the first image information of the first surface, then flip the circuit board, and then acquire the second image information of the second surface.

[0076] Step S2: Determine the center coordinates of the circular holes on the first surface and the second surface based on the first image information and the second image information.

[0077] In this embodiment of the application, the center of the circle can be extracted from the first image information and the second image information by an image processing algorithm, thereby obtaining the center coordinate information of the circular hole on the first surface and the center coordinate information of the circular hole on the second surface.

[0078] In this embodiment, the first image information is binarized to obtain a first binarized image. Based on the first binarized image, the edge information of the circular hole on the first surface is determined, and the center coordinate information of the circular hole on the first surface is determined based on the edge information of the circular hole on the first surface. Similarly, the second image information is binarized to obtain a second binarized image. Based on the second binarized image, the edge information of the circular hole on the second surface is determined, and the center coordinate information of the circular hole on the second surface is determined based on the edge information of the circular hole on the second surface.

[0079] Step S3: Based on the center coordinate information of the circular holes on the first surface and the center coordinate information of the circular holes on the second surface, coordinate the circular holes on the first surface and the circular holes on the second surface corresponding to each through hole, so as to obtain the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole.

[0080] In this embodiment of the application, the algorithm for coordination can be a point set coordination algorithm, a deep learning algorithm, etc.

[0081] The following explanation uses a point set alignment algorithm as an example. A point set alignment algorithm is a mathematical method that transforms the center coordinates of the circular holes on the first surface and the center coordinates of the circular holes on the second surface through rotation, translation, scaling, etc., to achieve optimal matching between the two sets of points. Point set alignment algorithms can include the ICP (Iterative Closest Point) algorithm, which achieves registration by iteratively minimizing the distance between point pairs.

[0082] In this embodiment, the center coordinate information set of the circular holes on the first surface can be denoted as P = {p1, p2, ..., pn}, and the center coordinate information set of the circular holes on the second surface can be denoted as Q = {q1, q2, ..., qn}; ensuring that the number of points in both sets is the same. For each point pi in P, find the nearest point qj in Q; calculate the optimal transformation matrix; apply the transformation matrix to update the position of P; repeat the steps until convergence, thereby outputting the matching result: {(p1', q1), (p2', q2), ..., (pn', qn)}, where pi' is a center coordinate information in P. The center coordinate information of the second circular hole corresponds to the center coordinate information of a third circular hole, and there is a one-to-one correspondence.

[0083] The method provided in this application embodiment can obtain the center coordinate information of the circular holes on the first surface and the center coordinate information of the circular holes on the second surface corresponding to each through hole through registration. Since the center coordinate information of the circular holes on the first surface and the center coordinate information of the circular holes on the second surface corresponding to each through hole are obtained, the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole can be obtained.

[0084] In some embodiments, after step S1, the method further includes: Step S4: Identify the first number of circular holes on the first surface based on the first image information.

[0085] In this embodiment of the application, the first quantity refers to the number of circular holes (through holes) detected by image recognition on the first surface of the circuit board.

[0086] Step S5: Identify the second number of circular holes on the second surface based on the second image information.

[0087] In this embodiment of the application, the second quantity refers to the number of circular holes (through holes) detected by image recognition on the second surface of the circuit board.

[0088] Step S6: Determine whether the first quantity and the second quantity are consistent.

[0089] In this embodiment, the first quantity and the second quantity can be used to determine whether they are consistent. By determining whether they are consistent, the problem of missing holes or holes that are not drilled through can be detected, thereby ensuring that the number of through holes on both sides of the circuit board is consistent.

[0090] In this embodiment of the application, if there is a discrepancy, the production interface can display "The number of circular holes on the first surface and the second surface are inconsistent" and mark the number of differences.

[0091] In this embodiment of the application, when the quantities are consistent, step S3 is performed.

[0092] The method provided in this application, by judging a first quantity and a second quantity, can ensure that the number of circular holes on both sides of the circuit board is consistent, avoiding problems such as missed holes or holes not being drilled through. By automatically detecting whether the quantity is consistent, the detection efficiency and accuracy can be improved. Consistent quantity is a prerequisite for point set alignment. If the quantity is inconsistent, forced alignment will lead to incorrect matching, ultimately causing back-drilling position errors.

[0093] Based on the foregoing embodiments, this application further provides a method for obtaining back-drilling parameters, including: A CCD camera is installed facing each other vertically, and a standard board is used to correct the installation eccentricity. After drilling and electroplating the circuit board, the hole positions on the top and bottom surfaces of the circuit board are scanned to calculate whether the number of holes on the top and bottom surfaces of the circuit board after drilling is consistent. Check for any missed holes or holes that are not drilled through, and ensure that the number of drilled holes on the top and bottom surfaces of the circuit board is consistent.

[0094] After scanning the holes for pixels, the edges of the holes are determined through binarization, and the center coordinates of the first and second circular holes are determined.

[0095] Since there is a one-to-one correspondence between the holes on the upper and lower surfaces, and a one-to-one correspondence between the second and third circular holes, the ICP algorithm can be used to find the one-to-one correspondence between the second and third circular holes, thereby obtaining the center coordinate information of the second and third circular holes.

[0096] After finding the center coordinates of the second and third circular holes, the center coordinates of the first circular hole at the back-drilling stop layer can be calculated based on the center coordinates of the second and third circular holes of the first borehole. The center coordinates of the first circular hole can then be used to confirm the coordinate position of the back-drilling hole.

[0097] The calculation formula is as follows: Center coordinates of the first circular hole (X1, Y1) = Center coordinates of the second circular hole (X2, Y2) + Offset ( X, Y) × (actual depth ÷ actual thickness), where the offset ( X, Y) = Center coordinates of the third hole (X3, Y3) - Center coordinates of the second hole (X2, Y2).

[0098] In this embodiment of the application, the actual depth = theoretical depth of the back-drilling stop layer * actual plate thickness ÷ theoretical plate thickness.

[0099] After obtaining the center coordinates of the first circular hole in each back-drilling stop layer of the PCB board, and then obtaining the actual board thickness after obtaining the center coordinates of the first circular hole, the calculation formula for the back-drilling depth (L) needs to be combined with the theoretical depth H3. The calculation formula is as follows: L = (H1 ÷ H2) × H3 + H 4； Wherein, H1: actual plate thickness; H2: theoretical plate thickness; H3: theoretical depth; H4: error compensation amount, usually taken as 0.05-0.1mm, is used to offset errors such as drill bit wear and medium fluctuation.

[0100] Finally, after outputting the back-drilling depth of the inner back-drilling stop layer hole coordinates, the back-drilling depth and position can be given to the back-drilling mechanical drilling machine for back-drilling processing of the circuit board.

[0101] Based on the foregoing embodiments, this application provides a back-drilling method, the method comprising: Obtain the back-drilling parameters obtained by any of the methods described above; perform back-drilling processing on the circuit board based on the back-drilling parameters.

[0102] In this embodiment, back drilling is a special depth-controlled drilling technique used to remove unwanted portions within through holes in multilayer PCBs to improve signal integrity.

[0103] In this embodiment, the back-drilling depth and the center coordinates of the first circular hole on the back-drilling stop layer of the circuit board can be obtained as the back-drilling position. The obtained back-drilling position and the center coordinates of the first circular hole are input into the back-drilling equipment to control the back-drilling equipment to perform drilling at the specified position.

[0104] The method provided in this application improves the symmetry of the stub by using the center coordinates of the first circular hole on the back-drilling stop layer as the back-drilling position. By performing back-drilling according to the back-drilling depth, it effectively avoids the problems of "over-drilling" damaging the back-drilling stop layer and "under-drilling" causing excessively long residual stubs, thus significantly improving the quality and stability of the back-drilling process.

[0105] Figure 3 This is a flowchart illustrating a back-drilling method provided in an embodiment of this application, as shown below. Figure 3 As shown, it includes: The data of the scanned circuit board is obtained by scanning the hole coordinates on the C and S sides of the CCD scanned board. The algorithm obtains the center coordinates of the through hole in the back drilling stop layer (i.e., the center coordinate information of the first circular hole in the above embodiment). The thickness of the board is measured for the center coordinates of the hole in the inner back drilling stop layer. The back drilling depth value is corrected to obtain the back drilling depth. The center coordinates of the through hole in the back drilling stop layer and the back drilling depth are output. The center coordinates of the through hole in the back drilling stop layer and the back drilling depth can be uploaded to the server or new drill tape drilling depth QR code data can be generated. The mechanical back drilling machine downloads the depth control drill tape or scans the QR code to perform back drilling.

[0106] The method provided in this application, by obtaining the center coordinates of the through hole in the back-drilling stop layer and the back-drilling depth, can make the stub symmetrical after back-drilling, while effectively avoiding the problems of "over-drilling" damaging the inner back-drilling stop layer and "under-drilling" causing excessively long residual stubs, thus significantly improving the quality and stability of the back-drilling process.

[0107] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0108] According to the foregoing embodiments, this application provides a device for obtaining back-drilling parameters. The various modules and units included in the device can be implemented by a processor in a computer device; of course, they can also be implemented by specific logic circuits. In the implementation process, the processor can be a central processing unit (CPU), a microprocessor (MPU), a digital signal processor (DSP), or a field programmable gate array (FPGA), etc.

[0109] This application provides an apparatus for obtaining back-drilling parameters. Figure 4 This is a schematic diagram of a device for obtaining back-drilling parameters provided in an embodiment of this application, as shown below. Figure 4 As shown, the device 410 for obtaining back drill parameters includes: The acquisition module 401 is used to acquire the center coordinate information of the first circular hole formed by the target through hole in the back drill stop layer of the circuit board, wherein the target through hole is one or more of the through holes; The first determining module 402 is used to obtain the measured thickness corresponding to the measurement position within a preset distance from the center coordinate information of the first circular hole on the circuit board; calculate the average value of the measured thickness to obtain the actual thickness of the circuit board; The second determining module 403 is used to determine the back-drilling depth for back-drilling the target through hole based on the actual plate thickness, the theoretical plate thickness, and the theoretical depth of the back-drilling stop layer.

[0110] In some embodiments, the second determining module includes: The second calculation unit is used to divide the actual plate thickness by the theoretical plate thickness to obtain the plate thickness ratio. The third calculation unit is used to multiply the plate thickness ratio by the theoretical depth to obtain the initial back-drilling depth for back-drilling the target through hole; The fourth calculation unit is used to add the error compensation amount to the initial back-drilling depth to obtain the back-drilling depth for back-drilling the target through hole.

[0111] In some embodiments, the acquisition module includes: The second acquisition unit is used to acquire the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole in the circuit board, as well as to acquire the actual thickness of the circuit board and the actual depth of the back drill stop layer of the circuit board. The determining unit is used to calculate the center coordinate information of the first circular hole on the back-drilling stop layer of the target through hole on the circuit board based on the center coordinate information of the second circular hole, the center coordinate information of the third circular hole, the actual depth and the actual thickness, so as to determine the center coordinate information of the first circular hole as the back-drilling position when back-drilling the target through hole.

[0112] In some embodiments, the determining unit includes: The first calculation subunit is used to divide the actual depth by the actual thickness to obtain a calculated ratio. The second calculation subunit is used to subtract the center coordinate information of the second circular hole from the center coordinate information of the third circular hole to obtain the offset; The third calculation subunit is used to multiply the offset by the calculated ratio to obtain the corrected offset; The fourth calculation subunit is used to add the correction offset to the center coordinate information of the second circular hole to obtain the center coordinate information of the first circular hole.

[0113] In some embodiments, the second acquisition unit includes: A sub-unit is used to obtain the theoretical depth of the back-drill stop layer, the theoretical thickness of the circuit board, and the actual thickness of the circuit board; divide the actual thickness by the theoretical thickness to obtain a thickness ratio; and multiply the theoretical depth by the thickness ratio to obtain the actual depth of the back-drill stop layer.

[0114] In some embodiments, the second acquisition unit includes: An image acquisition subunit is used to acquire first image information of the first surface and first image information of the second surface of the circuit board. The first determining subunit is used to determine the center coordinate information of the circular hole on the first surface and the center coordinate information of the circular hole on the second surface based on the first image information and the second image information. The matching subunit is used to coordinate the circular holes on the first surface and the second surface based on the center coordinate information of the circular holes on the first surface and the center coordinate information of the circular holes on the second surface to obtain the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole.

[0115] In some embodiments, the first determining subunit includes: performing binarization processing on the first image information to obtain a first binarized image; determining edge information of a circular hole on a first surface based on the first binarized image; and determining center coordinate information of the circular hole on the first surface based on the edge information of the circular hole on the first surface; performing binarization processing on the second image information to obtain a second binarized image; determining edge information of a circular hole on a second surface based on the second binarized image; and determining center coordinate information of the circular hole on the second surface based on the edge information of the circular hole on the second surface.

[0116] In some embodiments, the second acquisition unit further includes: The first identification subunit is used to identify a first number of circular holes on the first surface based on the first image information; The second identification subunit is used to identify the second number of circular holes on the second surface based on the second image information; The judgment subunit is used to determine whether the first quantity and the second quantity are consistent.

[0117] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0118] In addition, the device for obtaining back drill parameters described above can be a software unit, a hardware unit, or a combination of software and hardware. It can also be integrated into an electronic device as an independent component, or exist as an independent terminal device.

[0119] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0120] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 5As shown, the electronic device 3 in this embodiment may include: at least one processor 30 ( Figure 5 Only one processor 30, memory 31, and computer program 32 stored in memory 31 and executable on at least one processor 30 are shown. When the processor 30 executes the computer program 32, it implements the steps in any of the above method embodiments, or the processor 30 executes the computer program 32 to implement the functions of each module / unit in the above device or system embodiments.

[0121] For example, computer program 32 may be divided into one or more modules / units, one or more of which are stored in memory 31 and executed by processor 30 to complete this application. One or more modules / units may be a series of computer program 32 instruction segments capable of performing a specific function, which describe the execution process of computer program 32 in electronic device 3.

[0122] This application also provides a computer-readable storage medium storing a computer program 32, which, when executed by a processor 30, implements the steps described in the above-described method embodiments.

[0123] This application provides a computer program product that, when run on an electronic device, enables the electronic device to perform the steps described in the various method embodiments above.

[0124] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program 32 instructing related hardware. The computer program 32 can be stored in a computer-readable storage medium, and when executed by the processor 30, it can implement the steps of the various method embodiments described above. The computer program 32 includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. A computer-readable medium can include at least: any entity or device capable of carrying computer program code to a terminal, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0125] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0126] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0127] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0128] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0129] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for obtaining back-drilling parameters, used on a circuit board with multiple through holes, characterized in that, include: Obtain the center coordinate information of the first circular hole formed by the target through hole in the back drill stop layer of the circuit board, wherein the target through hole is one or more of the through holes; Obtain the measured thickness corresponding to the measurement position on the circuit board within a preset distance from the center coordinate information of the first circular hole; calculate the average value of the measured thickness to obtain the actual thickness of the circuit board; The back-drilling depth for back-drilling the target through-hole is obtained based on the actual board thickness, the theoretical board thickness of the circuit board, and the theoretical depth of the back-drilling stop layer.

2. The method according to claim 1, characterized in that, The back-drilling depth for back-drilling the target through-hole is obtained based on the actual board thickness, the theoretical board thickness of the circuit board, and the theoretical depth of the back-drilling stop layer, including: Divide the actual plate thickness by the theoretical plate thickness to obtain the plate thickness ratio; Multiply the plate thickness ratio by the theoretical depth to obtain the initial back-drilling depth for back-drilling the target through hole; The initial back-drilling depth is added to the error compensation amount to obtain the back-drilling depth for back-drilling the target through hole.

3. The method according to claim 1, characterized in that, The process of obtaining the center coordinate information of the first circular hole formed by the target through-hole in the back-drill stop layer of the circuit board includes: Obtain the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole in the circuit board, as well as obtain the actual thickness of the circuit board and the actual depth of the back drill stop layer of the circuit board; Based on the center coordinate information of the second circular hole, the center coordinate information of the third circular hole, the actual depth, and the actual thickness, the center coordinate information of the first circular hole on the back drilling stop layer of the target through hole is calculated, so as to determine the center coordinate information of the first circular hole as the back drilling position when back drilling the target through hole.

4. The method according to claim 3, characterized in that, Based on the center coordinate information of the second circular hole, the center coordinate information of the third circular hole, the actual depth, and the actual thickness, the center coordinate information of the first circular hole on the back-drilling stop layer of the target through-hole in the circuit board is calculated, including: The calculated ratio is obtained by dividing the actual depth by the actual thickness. The offset is obtained by subtracting the center coordinates of the second circular hole from the center coordinates of the third circular hole. Multiply the offset by the calculated ratio to obtain the corrected offset; The center coordinates of the first hole are obtained by adding the correction offset to the center coordinates of the second hole.

5. The method according to claim 4, characterized in that, Obtaining the actual depth of the back-drilling stop layer includes: Obtain the theoretical depth of the back-drill stop layer, the theoretical thickness of the circuit board, and the actual thickness of the circuit board; Divide the actual thickness by the theoretical thickness to obtain the thickness ratio; Multiplying the theoretical depth by the thickness ratio yields the actual depth of the back-drilling stop layer.

6. The method according to claim 3, characterized in that, The target through-holes are formed as circular holes on the first surface and the second surface of the circuit board, respectively; The process of obtaining the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through-hole in the circuit board includes: Acquire first image information of the first surface and first image information of the second surface of the circuit board; The center coordinates of the circular holes on the first surface and the center coordinates of the circular holes on the second surface are determined based on the first image information and the second image information. Based on the center coordinate information of the circular holes on the first surface and the center coordinate information of the circular holes on the second surface, the circular holes on the first surface and the circular holes on the second surface corresponding to each target through hole are obtained, so as to obtain the center coordinate information of the second circular hole on the first surface and the center coordinate information of the third circular hole on the second surface of the target through hole.

7. The method according to claim 6, characterized in that, Determining the center coordinates of the circular holes on the first surface and the second surface based on the first image information and the second image information includes: The first image information is binarized to obtain a first binarized image. The edge information of the circular hole on the first surface is determined based on the first binarized image, and the center coordinate information of the circular hole on the first surface is determined based on the edge information of the circular hole on the first surface. The second image information is binarized to obtain a second binarized image. The edge information of the circular hole on the second surface is determined based on the second binarized image, and the center coordinate information of the circular hole on the second surface is determined based on the edge information of the circular hole on the second surface.

8. The method according to claim 6, characterized in that, The method further includes: The first number of circular holes on the first surface is identified based on the first image information; The second number of circular holes on the second surface is identified based on the second image information; Determine whether the first quantity and the second quantity are consistent.

9. A back-drilling method, characterized in that, include: Obtain the back drill parameters obtained by the method for obtaining back drill parameters as described in any one of claims 1 to 8; The circuit board is back-drilled based on the back-drilling parameters.

10. A device for obtaining back drill parameters, characterized in that, include: The acquisition module is used to acquire the center coordinate information of the first circular hole formed by the target through hole in the back drill stop layer of the circuit board, wherein the target through hole is one or more of the through holes; The first determining module is used to obtain the measured thickness corresponding to the measurement position within a preset distance from the center coordinate information of the first circular hole on the circuit board; calculate the average value of the measured thickness to obtain the actual thickness of the circuit board; The second determining module is used to determine the back-drilling depth for back-drilling the target through hole based on the actual board thickness, the theoretical board thickness of the circuit board, and the theoretical depth of the back-drilling stop layer.

11. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 8 and / or the method as described in claim 9.

12. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1 to 8 and / or the method as described in claim 9.

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