Integrated evaporative cooling system and method

Abstract

The invention discloses an integrated evaporative cooling system and method. The system comprises a heating body, a heat dissipation device, an air outlet pipe, a liquid return pipe, a condenser, a one-way exhaust component, a one-way recovery component, an exhaust recovery cavity, a semiconductor chilling plate array and heat dissipation fins. The heat dissipation device, the air outlet pipe, the condenser and the liquid return pipe are sequentially connected to form a closed circulation loop. The one-way exhaust component and the one-way recovery component are arranged between the condenser and the exhaust recovery cavity and used for controlling communication and isolation of the condenser and the exhaust recovery cavity. And the cold end of the semiconductor chilling plate array is connected with the exhaust recovery cavity. When the system pressure is higher than a set value P1, the one-way exhaust component is automatically opened, and a gaseous working medium is condensed into a liquid state through semiconductor refrigeration; and when the liquid level in the cavity reaches L and the pressure is lower than P2, the one-way recovery component is automatically opened, and the liquid working medium flows back to the condenser under the action of gravity. The gas exhausting, recycling and liquid supplementing functions are integrated, the space is saved, the automation degree is improved, and it is ensured that the working quality is dynamic and stable.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of heat exchange, and particularly relates to an integrated evaporative cooling system and method. BACKGROUND

[0002] Common cooling technologies applied to power equipment and electronic devices include air cooling, water cooling and evaporative cooling. Among them, air cooling and water cooling both remove heat based on the heat absorption process of the specific heat of the refrigerant. The former uses air as the refrigerant, and the system structure is simple, but when it is applied to areas with thin air, the cooling efficiency is limited; the latter uses water as the refrigerant, and compared with air cooling, the cooling efficiency is improved, but the water cooling system needs to be additionally configured with a water treatment device, and the system is relatively complex, and the water cooling system adopts forced circulation, the operating pressure is relatively high, and there is a certain risk of leakage.

[0003] Compared with the above conventional cooling methods, evaporative cooling uses a working medium with good insulation performance as a medium, and uses the latent heat of phase change from liquid to gas to achieve cooling, and the cooling efficiency is relatively high, and there is no leakage risk. Moreover, the evaporative cooling system applied to a hydro-generator can realize self-circulation, and the self-circulation system has a relatively low operating pressure, which further increases the safety and reliability of the system.

[0004] The evaporative cooling system generally includes primary heat exchange and secondary heat exchange. In the primary heat exchange part, the liquid evaporative cooling working medium directly or indirectly contacts the cooled object, and through the phase change heat absorption process of the liquid phase to the gas phase, the heat is transferred from the cooled object to the evaporative cooling working medium; and in the secondary heat exchange part, the gaseous or gas-liquid two-phase evaporative cooling working medium that has absorbed heat will exchange heat with the secondary refrigerant (usually water, air, etc.) again, and transfer the heat to the secondary refrigerant and reconvert to liquid working medium. When the liquid working medium returns to the system under the driving action of gravity, or centrifugal force, or a pump, it can participate in the next cycle, and thus the cycle is repeated to achieve efficient cooling. The secondary heat exchange part is usually called a condenser.

[0005] The flow heat exchange characteristics of the working medium on the primary heat exchange side and the secondary side refrigerant, the heat exchange area, etc. are all related to the heat exchange efficiency of the condenser. However, in actual operation, when the heat load suddenly changes, the secondary refrigerant flow is reduced due to external influences, or there is non-condensable gas in the system, the pressure in the condenser will rise. Therefore, in practice, an exhaust valve is often configured on the condenser, which can be selected as an electromagnetic valve or a mechanical valve. When the pressure of the condenser reaches the upper limit of the set pressure, the exhaust valve is opened to exhaust; when the pressure of the condenser reaches the lower limit of the set pressure, the exhaust valve is closed to stop exhaust. In this way, the pressure in the condenser is maintained within a safe range, and the safety and reliability of the system operation are ensured.

[0006] But in this process, the exhaust gaseous cooling medium will inevitably cause the loss of evaporative cooling medium in the cooling system. If the exhaust is frequent, it may even cause the system to have too little work quality and affect the cooling effect.

[0007] Therefore, in the current practical application, in order to avoid the above problems, a set of exhaust recovery device is usually configured separately, and in order to ensure the efficiency of the recovered medium, the exhaust recovery device needs to be equipped with a compressor to form a low-temperature environment, so as to further increase the heat exchange temperature difference and improve the efficiency of the gaseous cooling medium after heat exchange. But there are two problems at present:

[0008] 1. Due to the existence of complex components such as compressors in the device, it is difficult to realize small integration of the exhaust recovery device; when the application object is in a limited space, it is difficult to install this device.

[0009] 2. In addition to the exhaust port being connected to the system, the current exhaust recovery device is set independently of the system. Therefore, the recovered liquid medium cannot flow back to the system in real time, and the dynamic stability of the system cannot be guaranteed, and only liquid level monitoring can be used to ensure reliable operation of the system. SUMMARY

[0010] To solve the above technical problems, the present application provides an integrated evaporative cooling system and method.

[0011] To achieve the above purpose, the technical scheme adopted by the present application is as follows:

[0012] An integrated evaporative cooling system, comprising a heat generating body, a heat dissipation device, an exhaust pipe, a liquid return pipe, a condenser, a one-way exhaust component, a one-way recovery component, an exhaust gas recovery cavity, a semiconductor refrigeration sheet array and a heat dissipation fin; the heat dissipation device, the exhaust pipe, the condenser and the liquid return pipe are connected in sequence to form a closed circulation loop; the one-way exhaust component is arranged between the condenser and the exhaust gas recovery cavity, and is used to control the communication and isolation between the condenser and the exhaust gas recovery cavity; the one-way recovery component is arranged between the exhaust gas recovery cavity and the condenser, and is used to control the communication and isolation between the exhaust gas recovery cavity and the condenser; the cold end of the semiconductor refrigeration sheet array is connected with the exhaust gas recovery cavity; and the heat dissipation fin is connected with the hot end of the semiconductor refrigeration sheet array.

[0013] Further, the one-way exhaust component comprises a pressure switch and a flow guide structure; the pressure switch is used to open when the primary side circulation system pressure is higher than the set high value P1, so that the condenser and the exhaust gas recovery cavity are communicated, and to close when the primary side circulation system pressure is lower than the set low value P2, so that the condenser and the exhaust gas recovery cavity are isolated; and the flow guide structure is used to realize gas-liquid separation.

[0014] Further, the one-way recovery component comprises an electromagnetic valve and a filtering and purifying structure; the electromagnetic valve is used to open when the liquid level of the working medium in the exhaust gas recovery cavity reaches a set liquid level value L and the pressure in the exhaust gas recovery cavity is lower than a set low value P2, so that the exhaust gas recovery cavity is communicated with the condenser, otherwise the electromagnetic valve is closed, so that the exhaust gas recovery cavity is isolated from the condenser; the filtering and purifying structure is used for impurity filtering and moisture treatment.

[0015] Further, the cold end of the semiconductor refrigeration sheet array provides a low-temperature environment for the exhaust gas recovery cavity, so that the gaseous or gas-liquid two-phase working medium entering the exhaust gas recovery cavity is condensed into liquid working medium; the heat dissipation fins exchange heat with the hot end of the semiconductor refrigeration sheet array through the third side heat medium.

[0016] Further, the closed circulation loop is filled with liquid phase change working medium; the heat dissipation device and the heat generating body exchange heat in a direct contact mode or an indirect contact mode; in the direct contact mode, the heat dissipation device forms a hollow cavity, the heat generating body is located in the hollow cavity, and the phase change working medium directly immerses the heat generating body or is sprayed onto the surface of the heat generating body; in the indirect contact mode, the heat dissipation device and the heat generating body are closely arranged, and the heat dissipation device is a hollow wire or a hollow liquid box.

[0017] The application also provides an integrated evaporative cooling method, which is realized based on the integrated evaporative cooling system.

[0018] The closed circulation loop is filled with liquid phase change working medium;

[0019] The heat generated by the heat generating body is transferred to the liquid working medium in the heat dissipation device, and the liquid working medium is phase changed into gaseous or gas-liquid two-phase state after absorbing heat;

[0020] The gaseous or gas-liquid two-phase working medium rises along the gas outlet pipe and enters the condenser;

[0021] In the condenser, the working medium exchanges heat with the second side heat medium and is condensed into liquid state;

[0022] The liquid working medium flows back to the heat dissipation device along the liquid return pipe under the action of gravity, and the next cycle begins.

[0023] Further, the method further comprises an exhaust process, which comprises: monitoring the pressure of the primary side circulation system; when the pressure of the primary side circulation system is higher than a set high value P1, the pressure switch of the one-way exhaust component is automatically opened, the condenser is communicated with the exhaust gas recovery cavity through the one-way exhaust component, and the gaseous or gas-liquid two-phase working medium enters the exhaust gas recovery cavity from the condenser; when the pressure of the primary side circulation system is lower than a set low value P2, the pressure switch is automatically closed, and the condenser is isolated from the exhaust gas recovery cavity; the working medium entering the exhaust gas recovery cavity exchanges heat with the cold end of the semiconductor refrigeration sheet array and is condensed into liquid working medium.

[0024] Further, the recovery liquid supplementing process comprises: monitoring the liquid level and pressure of the working medium in the exhaust gas recovery cavity; when the liquid level of the working medium in the exhaust gas recovery cavity reaches a set liquid level value L and the pressure is lower than a set low value P2, the electromagnetic valve of the one-way recovery component is automatically opened, the exhaust gas recovery cavity is communicated with the condenser through the one-way recovery component; the liquid working medium flows back to the condenser through the one-way recovery component under the action of gravity and participates in the primary side cycle; otherwise, the electromagnetic valve remains in the closed state.

[0025] Further, the pressure switch of the one-way exhaust component receives the primary side cycle system pressure signal; the primary side cycle system pressure is compared with the set high value P1 and the set low value P2; if the primary side cycle system pressure is higher than the set high value P1, the pressure switch is switched to the open state; if the primary side cycle system pressure is lower than the set low value P2, the pressure switch is switched to the closed state; the flow guide structure separates the working medium passing through the one-way exhaust component into gas and liquid.

[0026] Further, the electromagnetic valve of the one-way recovery component receives the working medium liquid level signal and the pressure signal in the exhaust gas recovery cavity; the working medium liquid level is compared with the set liquid level value L and the pressure is compared with the set low value P2; if the working medium liquid level reaches the set liquid level value L and the pressure is lower than the set low value P2, the electromagnetic valve is switched to the open state; otherwise, the electromagnetic valve is switched to the closed state; the filter purification structure filters and treats impurities of the working medium passing through the one-way recovery component.

[0027] Beneficial effects:

[0028] 1. In the current system applying evaporation cooling technology, the exhaust gas recovery device is an independent set of equipment, which needs to occupy additional space and is not easy to arrange. Moreover, the recovery working medium cannot be treated online and cannot be supplemented in time. In the actual operation process, with the increase of the number of exhaust gas, the amount of working medium in the closed system will continuously decrease, which will affect the cooling effect when the amount of working medium is too low, and even heat transfer deterioration will occur. The present application provides an integrated evaporation cooling system for the heat generating body, an exhaust gas recovery cavity is arranged above the condenser, and the two are communicated through a one-way exhaust component and a one-way recovery component, thereby realizing isolation and communication, respectively, so as to integrate the functions of exhaust gas, recovery, liquid supplementing and the like, thereby saving space and greatly enhancing the integration of the system and the degree of automation of operation and maintenance.

[0029] 2. The exhaust gas recovery cavity, the one-way exhaust component and the one-way recovery component in the present application are all arranged at the end of the self-circulation evaporation cooling cycle. Therefore, the flow resistance components such as the flow guide structure and the adsorption structure involved therein do not need to worry about the adverse effects on the flow and heat exchange performance of the primary side heat exchange link.

[0030] 3. The one-way exhaust component and the one-way recovery component are adopted, the occurrence conditions, flow and heat exchange path of the exhaust process and the working medium recovery and liquid supplement are constrained, the effective integration of functions is realized, and the automatic processing is realized online.

[0031] 4. Based on the performance characteristics of the semiconductor refrigeration sheet, a low temperature much lower than the temperature of the third side heat exchange medium can be realized, so as to provide the required low temperature environment for the exhaust gas recovery cavity, further increase the heat exchange temperature difference, enhance the heat exchange effect, realize rapid liquefaction, and facilitate timely recovery and liquid supplement. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 It is a schematic diagram of an integrated evaporation cooling system of the application.

[0033] Figure 2 It is a schematic diagram of a one-way exhaust component.

[0034] Figure 3 It is a schematic diagram of a one-way recovery component.

[0035] Among them, the reference signs are: heat generating body 1, heat dissipation device 2, gas outlet pipe 3, liquid return pipe 4, condenser 5, one-way exhaust component 6, one-way recovery component 7, exhaust gas recovery cavity 8, semiconductor refrigeration sheet array 9, heat dissipation fin 10, pressure switch 6-1, flow guide structure 6-2, electromagnetic valve 7-1, filtration and purification structure 7-2. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical scheme and advantages of the application more clear and obvious, the application will be further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described here are only used to explain the application and not to limit the application. In addition, the technical features involved in each embodiment of the application described below can be combined with each other as long as they do not conflict with each other.

[0037] As shown in Figure 1 The application provides an integrated evaporation cooling system for the heat generating body 1, which integrates the functions of exhaust, recovery and liquid supplement; it includes primary side, secondary side and tertiary side heat exchange. The components of the primary side heat exchange mainly include heat dissipation device 2, gas outlet pipe 3, liquid return pipe 4 and condenser 5, which form a closed circulation loop through the connecting pipeline. The circulation loop is filled with liquid phase change working medium, which serves as the primary side heat exchange medium.

[0038] The condenser 5 is arranged above the heat dissipating device 2, the air outlet pipe 3 is connected between the condenser 5 and the heat dissipating device 2, and the air outlet pipe 3 provides an ascending channel for the primary side heat exchange medium, so that the primary side heat exchange medium enters the condenser 5 from the heat dissipating device 2; the liquid return pipe 4 is connected between the condenser 5 and the heat dissipating device 2, and the liquid return pipe 4 provides a flow return channel for the primary side heat exchange medium, so that the primary side heat exchange medium flows back to the heat dissipating device 2 from the condenser 5. Thus, a closed circulation loop can be formed.

[0039] The primary side heat exchange occurs between the heat generating body 1 and the phase change medium. The secondary side heat exchange is carried out in the condenser 5, and the heat exchange occurs between the phase change medium and the secondary side heat exchange medium. The one-way air exhaust component 6 and the one-way recovery component 7 are arranged above the condenser 5, and the one-way air exhaust component 6 and the one-way recovery component 7 are connected with the air exhaust and recovery cavity 8. The cold end side of the semiconductor refrigeration sheet array 9 is connected above the air exhaust and recovery cavity 8. The heat dissipating fins 10 are arranged at the hot end side of the semiconductor refrigeration sheet array 9. According to actual conditions, air or water and other cooling media flow through the heat dissipating fins 10, the tertiary side heat exchange is carried out through the heat dissipating fins 10, the heat exchange occurs between the tertiary side heat exchange medium and the phase change medium, and the heat of the hot end side of the semiconductor refrigeration sheet array 9 is taken away. Thus, the integrated evaporation cooling system for the heat generating body 1 is formed.

[0040] Preferably, the heat generating body 1 and the heat dissipating device 2 can adopt direct contact or indirect contact mode for heat exchange.

[0041] When the direct contact is adopted, the heat dissipating device 2 forms a hollow cavity, and the heat generating body 1 is located in the cavity. The heat of the heat generating body 1 is directly transmitted to the primary side heat exchange medium, i.e. the phase change medium. Generally, the immersion type and the spraying type structures can be adopted. When the immersion type is adopted, a certain amount of phase change medium is filled in the cavity. The heat generating body 1 is directly immersed in the phase change medium; and when the spraying type is adopted, the phase change medium is sprayed to the surface of the heat generating body 1 in the form of mist, droplets and the like through a nozzle.

[0042] When the indirect contact is adopted, the heat dissipating device 2 is closely arranged with the heat generating body 1. The heat dissipating device 2 can be a hollow wire or a hollow liquid box. The heat of the heat generating body 1 is indirectly transmitted to the primary side heat exchange medium, i.e. the phase change medium, through the heat dissipating device 2.

[0043] The working process of the application is as follows:

[0044] Before starting operation, a certain amount of liquid phase change medium is filled in the closed circulation loop in advance. When the heat generating body 1 starts to generate heat, the liquid phase change medium in the heat dissipating device 2 absorbs heat and gradually increases in temperature until the phase change occurs to become gaseous or gas-liquid two-phase state. The gaseous or two-phase state medium ascends along the air outlet pipe 3, enters the condenser 5, exchanges heat with the secondary side heat exchange medium, is re-condensed into liquid state, flows back along the liquid return pipe 4 under the action of gravity, enters the heat dissipating device 2, and starts a new cycle. Thus, the cycle is repeated to realize the cooling of the heat generating body 1.

[0045] The exhaust process is as follows: during operation, when the pressure of the primary side circulation system is higher than the set high value P1, the one-way exhaust component 6 will automatically open, so that the condenser 5 is in communication with the exhaust recovery cavity 8, and exhaust is achieved until the pressure of the primary side circulation system is lower than the set low value P2, the one-way exhaust component 6 will automatically close, and the condenser 5 is no longer in communication with the exhaust recovery cavity 8.

[0046] When the one-way exhaust component 6 is opened, the gaseous or gas-liquid two-phase working medium exhausted from the condenser 5 enters the exhaust recovery cavity 8 through the one-way exhaust component 6, exchanges heat with the cold end of the semiconductor refrigeration fin array 9, and is quickly condensed into liquid working medium. The hot end of the semiconductor refrigeration fin array 9 exchanges heat with the three-side heat exchange medium through the heat dissipation fin 10, and cools the hot end of the semiconductor refrigeration fin array 9.

[0047] The exhaust recovery liquid supplementing process is as follows: the gaseous or gas-liquid two-phase working medium entering the exhaust recovery cavity 8 during exhaust exchanges heat with the cold end of the semiconductor refrigeration fin array 9 and is quickly condensed into liquid working medium. When the liquid working medium accumulates to a certain value in the exhaust recovery cavity 8, and the working medium liquid level in the exhaust recovery cavity 8 reaches the set liquid level value L and the pressure in the exhaust recovery cavity 8 is lower than the set low value P2, the one-way recovery component is automatically opened. The exhaust recovery cavity 8 is in communication with the condenser 5 through the one-way recovery component 7. The liquid working medium will flow back to the condenser 5 through the one-way recovery component 7 and participate in the primary side circulation, thereby realizing working medium recovery.

[0048] As shown in Figure 2 The one-way exhaust component 6 mainly includes a pressure switch 6-1 and a flow guide structure 6-2. The function of the pressure switch is to control the on-off according to the pressure change: when the pressure of the primary side circulation system is higher than the set high value P1, the pressure switch 6-1 will automatically open, and the exhaust recovery cavity 8 is in communication with the condenser 5 through the one-way exhaust component 6; when the pressure of the primary side circulation system is lower than the set low value P2, the pressure switch will automatically close, and the exhaust recovery cavity 8 is no longer in communication with the condenser 5 through the one-way exhaust component 6. The function of the flow guide structure 6-2 is to realize gas-liquid separation, which can be a cyclone type flow guide structure, a baffling type flow guide structure, a gravity type flow guide structure, and various composite flow guide structures, which realize and strengthen the gas-liquid phase separation based on the strengthening effect of inertia, centrifugal force, and gravity.

[0049] As shown in Figure 3As shown, the one-way recovery component 7 mainly comprises an electromagnetic valve 7-1 and a filtering and purifying structure 7-2. The electromagnetic valve 7-1 is used to control the on-off according to a given signal. When the liquid level of the working medium in the exhaust gas recovery cavity 8 reaches the set liquid level value L and the pressure in the exhaust gas recovery cavity 8 is lower than the set low value P2 at the same time, an electric signal is sent to control the electromagnetic valve to open, so that the exhaust gas recovery cavity 8 is communicated with the condenser 5 through the one-way recovery component 7. Otherwise, the electromagnetic valve is closed, and the exhaust gas recovery cavity 8 is no longer communicated with the condenser 5 through the one-way recovery component 7. The filtering and purifying structure 7-2 is used for impurity filtering and water treatment. The impurity filtering can be achieved by using a mesh filter, a folding filter and the like; and the water treatment can be achieved by using an adsorption type, a membrane type dehydration structure and a composite treatment structure and the like.

[0050] Preferably, the third-side heat exchange medium which exchanges heat with the hot end of the semiconductor refrigeration sheet array 9 through the heat dissipation fin 10 can be water, air or the like, which can be determined according to the actual application scene. The third-side heat exchange medium can be consistent with the second-side heat exchange medium, and can be connected in series or in parallel in the flow path. Alternatively, the third-side heat exchange medium can be different from the second-side heat exchange medium, and can be selected from other types which are easy to obtain.

[0051] In summary, the exhaust gas recovery cavity is arranged above the condenser, and the two are communicated through the one-way exhaust component and the one-way recovery component. The one-way exhaust component mainly comprises a pressure switch and a flow guide structure. The pressure switch is used to control the on-off in the set pressure range. The flow guide structure is based on the strengthening effect of inertia, centrifugal force and gravity to realize and strengthen the gas-liquid separation of the working medium. The one-way recovery component mainly comprises an electromagnetic valve and a filtering and purifying structure. The on-off of the electromagnetic valve is determined according to the liquid level and the pressure of the liquid working medium in the exhaust gas recovery cavity. The filtering and purifying structure is used to realize the functions of impurity filtering and water adsorption filtering. The exhaust gas recovery cavity is rapidly cooled by the semiconductor refrigeration sheet array, and the heat of the hot end of the semiconductor refrigeration sheet array is taken away by the heat dissipation fin. The third-side heat exchange medium can be introduced, or can be connected in series or in parallel with the second-side heat exchange medium in the condenser. The low temperature of the third-side heat exchange medium can be realized by the performance characteristics of the semiconductor refrigeration sheet array, the heat exchange temperature difference in the exhaust gas recovery cavity can be increased, the heat exchange effect can be enhanced, and the rapid liquefaction can be realized in the cavity.

[0052] Those skilled in the art will easily understand that the above description is only a preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An integrated evaporative cooling system, characterized in that, The device includes a heating element, a heat dissipation device, an exhaust pipe, a return pipe, a condenser, a one-way exhaust component, a one-way recovery component, an exhaust recovery chamber, a semiconductor refrigeration chip array, and heat dissipation fins. The heat dissipation device, exhaust pipe, condenser, and return pipe are sequentially connected to form a closed loop. The one-way exhaust component is located between the condenser and the exhaust recovery chamber to control the connection and isolation between them. The one-way recovery component is located between the exhaust recovery chamber and the condenser to control the connection and isolation between them. The cold end of the semiconductor refrigeration chip array is connected to the exhaust recovery chamber. The heat dissipation fins are connected to the hot end of the semiconductor refrigeration chip array.

2. The integrated evaporative cooling system according to claim 1, characterized in that, The one-way exhaust component includes a pressure switch and a flow guiding structure; the pressure switch is used to open when the pressure of the primary circulation system is higher than the set high value P1, so that the condenser is connected to the exhaust recovery chamber, and to close when the pressure of the primary circulation system is lower than the set low value P2, so that the condenser is isolated from the exhaust recovery chamber; the flow guiding structure is used to achieve gas-liquid separation.

3. The integrated evaporative cooling system according to claim 1, characterized in that, The one-way recovery component includes a solenoid valve and a filtration and purification structure; the solenoid valve is used to open when the working fluid level in the exhaust recovery chamber reaches the set level value L and the pressure in the exhaust recovery chamber is lower than the set low value P2, so that the exhaust recovery chamber is connected to the condenser, otherwise it is closed to isolate the exhaust recovery chamber from the condenser; the filtration and purification structure is used for impurity filtration and moisture treatment.

4. The integrated evaporative cooling system according to claim 1, characterized in that, The cold end of the semiconductor cooling chip array provides a low-temperature environment for the exhaust recovery chamber, causing the gaseous or gas-liquid two-phase working fluid entering the exhaust recovery chamber to condense into a liquid working fluid; the heat dissipation fins exchange heat with the hot end of the semiconductor cooling chip array through a tertiary heat exchange medium.

5. The integrated evaporative cooling system according to claim 1, characterized in that, The closed-loop circulation circuit is filled with liquid phase change working fluid; the heat dissipation device and the heating element exchange heat through direct or indirect contact; in the direct contact method, the heat dissipation device forms a hollow cavity, the heating element is located in the hollow cavity, and the phase change working fluid is directly immersed in the heating element or sprayed onto the surface of the heating element; in the indirect contact method, the heat dissipation device and the heating element are arranged in close contact, and the heat dissipation device is a hollow wire or a hollow liquid box.

6. An integrated evaporative cooling method, characterized in that, The integrated evaporative cooling system according to any one of claims 1-5 includes the following steps: Liquid phase change working fluid is injected into a closed-loop circulation system; The heat generated by the heating element is transferred to the liquid working fluid in the heat dissipation device. After absorbing heat, the liquid working fluid changes phase to gaseous or gas-liquid two-phase state. The gaseous or gas-liquid two-phase working fluid rises along the outlet pipe and enters the condenser; In the condenser, the working fluid exchanges heat with the secondary heat exchange medium and condenses into a liquid state; The liquid working fluid flows back to the heat dissipation device along the return pipe under the action of gravity, and the next cycle begins.

7. The integrated evaporative cooling method according to claim 6, characterized in that, It also includes the exhaust process, including: monitoring the pressure of the primary circulation system; when the pressure of the primary circulation system is higher than the set high value P1, the pressure switch of the one-way exhaust component is automatically opened, and the condenser is connected to the exhaust recovery chamber through the one-way exhaust component, and the gaseous or gas-liquid two-phase working fluid enters the exhaust recovery chamber from the condenser; when the pressure of the primary circulation system is lower than the set low value P2, the pressure switch is automatically closed, and the condenser is isolated from the exhaust recovery chamber; the working fluid entering the exhaust recovery chamber undergoes heat exchange with the cold end of the semiconductor refrigeration array and condenses into a liquid working fluid.

8. The integrated evaporative cooling method according to claim 6, characterized in that, It also includes a recovery and replenishment process, including: monitoring the working fluid level and pressure in the exhaust recovery chamber; when the working fluid level in the exhaust recovery chamber reaches the set level value L and the pressure is lower than the set low value P2, the solenoid valve of the one-way recovery component automatically opens, and the exhaust recovery chamber is connected to the condenser through the one-way recovery component; the liquid working fluid flows back to the condenser through the one-way recovery component under the action of gravity and participates in the primary side circulation; otherwise, the solenoid valve remains closed.

9. The integrated evaporative cooling method according to claim 6, characterized in that, The pressure switch of the one-way exhaust component receives the pressure signal of the primary circulation system; compares the pressure of the primary circulation system with the set high value P1 and the set low value P2; if the pressure of the primary circulation system is higher than the set high value P1, the pressure switch switches to the open state; if the pressure of the primary circulation system is lower than the set low value P2, the pressure switch switches to the closed state; the flow guiding structure performs gas-liquid separation on the working fluid passing through the one-way exhaust component.

10. An integrated evaporative cooling method according to claim 6, characterized in that, The solenoid valve of the one-way recovery component receives the working fluid level signal and pressure signal in the exhaust recovery chamber; it compares the working fluid level with the set level value L and the pressure with the set low value P2; if the working fluid level reaches the set level value L and the pressure is lower than the set low value P2, the solenoid valve switches to the open state; otherwise, the solenoid valve switches to the closed state; the filtration and purification structure filters impurities and removes moisture from the working fluid passing through the one-way recovery component.

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