An integrated liquid-cooled high-power LED optical module and a control method thereof

Abstract

The application discloses an integrated liquid cooling high-power LED optical module and a control method thereof. The LED packaging unit, the wiring unit and the temperature sensing unit are arranged. The heat dissipation assembly comprises a second substrate, a liquid cooling circulation unit and a plurality of heat dissipation fins. The temperature sensing unit detects the temperature signal of the LED packaging unit. The cooling liquid driving assembly drives the cooling liquid in the liquid cooling micro-flow pipe to exchange heat with the heat dissipation fins and the first substrate. The LED packaging unit, the fly-eye collimating lens and the heat dissipation assembly are structurally fused. The heat generated by the first substrate is effectively dissipated. The liquid cooling micro-flow pipe is arranged between the two groups of heat dissipation fins. The cooling liquid driving assembly is arranged at the bottom of the plurality of heat dissipation fins. The heat dissipation path of the heat dissipation fins and the liquid cooling circulation are fully utilized. The fly-eye collimating lens collimates, deflects or integrates the light emitted by the LED packaging unit. The problems of heat dissipation and optical efficiency of high-power density LEDs are solved. The product integration and working stability are improved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor lighting technology, and particularly relates to an integrated liquid-cooled high-power LED optical module and its control method. Background Technology

[0002] As LED technology advances towards higher power density, the heat generated increases dramatically. Poor heat dissipation has become a major bottleneck restricting the development of high-power LEDs, directly leading to decreased luminous efficacy, wavelength drift, shortened lifespan, and even chip burnout. Traditional heat dissipation methods, such as adding fins to aluminum substrates or air cooling, are no longer sufficient to meet the heat dissipation requirements of these increasingly powerful LEDs. To maximize the lighting efficiency of high-power-density LEDs, a highly efficient optical system (such as a collimating lens) is needed to collect and utilize the emitted light to achieve different beam angle requirements.

[0003] However, in the existing technology, the LED chip packaging, heat dissipation module and optical lens are usually three independently designed and manufactured components. This discrete structure has the following inherent defects: (1) Long heat dissipation path and low efficiency: heat is carried away from the LED chip through multiple interfaces such as the packaging substrate, thermal grease and heat sink, resulting in high thermal resistance and high chip junction temperature; (2) Complex structure and large size: stacking three independent systems together makes the entire lamp structure bulky, which is not conducive to the miniaturization and lightweight design of the lamp, and also increases the complexity of the back-end application. Although liquid cooling technology has been maturely applied in fields such as AI chips, and compound eye lenses are known in fields such as projection, there is no precedent in the lighting field for deeply integrating these with the packaging and optics of high-power LEDs. Therefore, there is an urgent need to provide an integrated liquid-cooled high-power LED optical module to solve the above-mentioned technical problems. Summary of the Invention

[0004] In view of this, the present invention provides an integrated liquid-cooled high-power LED optical module and its control method, which integrates liquid cooling heat dissipation, LED packaging unit and compound eye collimating optics into a highly integrated design, which can solve the heat dissipation and optical efficiency problems of high power density LEDs, and achieve the beneficial effects of shorter heat dissipation path, high light output efficiency, high integration and stable performance. The specific technical solution is as follows.

[0005] In a first aspect, the present invention provides an integrated liquid-cooled high-power LED optical module, comprising:

[0006] Mounting plate;

[0007] A first substrate is disposed on the upper surface of the mounting plate. The first substrate includes an LED packaging unit, a temperature sensing unit, and a wiring unit. The wiring unit is disposed on one side of the first substrate. The temperature sensing unit is located between the LED packaging unit and the wiring unit. The LED packaging unit is disposed at the center of the upper surface of the first substrate. Both the LED packaging unit and the temperature sensing unit are connected to the wiring unit.

[0008] A compound eye collimating lens is sleeved above the LED packaging unit and connected to the first substrate. The compound eye collimating lens is used to receive the light emitted by the LED packaging unit and to collimate, deflect, or integrate the light.

[0009] The heat dissipation assembly includes a second substrate disposed on the lower surface of the mounting plate, a liquid cooling circulation unit, and multiple sets of heat dissipation fins. The tops of the multiple sets of heat dissipation fins abut against the lower surface of the second substrate. The liquid cooling circulation unit includes a liquid cooling microfluidic tube located between the two sets of heat dissipation fins and a coolant driving assembly disposed at the bottom of the multiple sets of heat dissipation fins. The liquid cooling microfluidic tube extends from the lower surface of the second substrate to the bottom of the mounting plate.

[0010] The wiring unit is used to connect to the control unit, which is used to receive the temperature signal of the LED packaging unit detected by the temperature sensing unit, and control the coolant driving component to drive the coolant in the liquid-cooled microfluidic tube to exchange heat with the heat dissipation fins and the first substrate according to the temperature signal.

[0011] As a preferred embodiment of the above technical solution, the heat dissipation assembly further includes a sealing frame and a fan. The sealing frame is disposed on both sides of the second substrate, and the fan is disposed on the surface of a plurality of heat dissipation fins between the two sealing frames. The sealing frame is attached to the side of the coolant driving assembly along the length direction of the liquid-cooled microfluidic tube.

[0012] As a preferred embodiment of the above technical solution, the coolant driving assembly includes a microfluidic channel plate and a liquid box. The top of the microfluidic channel plate abuts against the bottom of the liquid-cooled microfluidic tube. The liquid box includes a sealing plate, a support base, and a circulation pump. The sealing plate is disposed between the microfluidic channel plate and the support base. The liquid boxes on both sides of the support base are used to contain coolant. The upper surface of the sealing plate is in contact with the bottom of the microfluidic channel plate, and the lower surface of the sealing plate is used to seal the liquid box.

[0013] As a preferred embodiment of the above technical solution, a limiting plate is provided at one end of the sealing frame away from the second substrate, and the limiting plate extends along the side of the microfluidic channel plate to fit against the side of the liquid box; first recovery grooves are provided on both sides of the sealing plate, and each first recovery groove is inserted into the liquid-cooled microfluidic tube.

[0014] As a preferred embodiment of the above technical solution, the microfluidic channel plate includes multiple flow guide holes, and the flow guide holes are matched one-to-one with the liquid-cooled microfluidic tubes.

[0015] As a preferred embodiment of the above technical solution, the sealing plate is provided with an opening corresponding to the support base, and the support base is provided with a sealing cover and a circulation pump, with the sealing cover fitted over the circulation pump.

[0016] As a preferred embodiment of the above technical solution, the mounting plate is provided with a liquid outlet groove, a boss, and a second recovery groove. The liquid outlet groove is disposed on the boss and parallel to the arrangement direction of the liquid-cooled microfluidic tubes. The boss abuts against the lower surface of the first substrate. The second recovery groove is located on both sides of the boss and is disposed at both ends of the liquid-cooled microfluidic tubes corresponding to the first recovery groove.

[0017] As a preferred embodiment of the above technical solution, the mounting plate further includes heat dissipation holes arranged at intervals along the four edges of the mounting plate.

[0018] As a preferred embodiment of the above technical solution, the compound eye collimating lens includes an aspherical main collimating lens and a plurality of microlens arrays. The aspherical main collimating lens is directly opposite the light-emitting center of the LED packaging unit and is used to receive and collimate the light emitted by the LED packaging unit. The plurality of microlens arrays are arranged around the aspherical main collimating lens.

[0019] Secondly, the present invention also provides a control method for an integrated liquid-cooled high-power LED optical module, applied to the aforementioned integrated liquid-cooled high-power LED optical module, the control method comprising the following steps:

[0020] The temperature signal of the LED packaging unit is obtained by the temperature sensing unit, and when the temperature value corresponding to the temperature signal exceeds a first preset temperature, the fan is controlled to start.

[0021] When the temperature value corresponding to the temperature signal exceeds the second preset temperature, the circulation pump is controlled to start and the coolant in the liquid box is brought into contact with the bottom of the first substrate through the first liquid-cooled microfluidic tube above the circulation pump to obtain heated coolant, wherein the second preset temperature is greater than the first preset temperature.

[0022] When the heated coolant flows from the outlet tank into the second recovery tank, the fan speed is controlled to cool the heated coolant in the second liquid-cooled microfluidic tube corresponding to the second recovery tank.

[0023] This invention provides an integrated liquid-cooled high-power LED optical module and its control method. An LED packaging unit, a wiring unit, and a temperature sensing unit are mounted on a first substrate. The heat dissipation assembly includes a second substrate, a liquid-cooling circulation unit, and multiple sets of heat dissipation fins. The temperature sensing unit detects the temperature signal of the LED packaging unit and controls a coolant driving assembly to drive the coolant in the liquid-cooled microfluidic tube to exchange heat with the heat dissipation fins and the first substrate. The LED packaging unit, compound eye collimating lens, and heat dissipation assembly are structurally integrated. The compound eye collimating lens collimates, deflects, or integrates the light emitted from the LED packaging unit. The heat dissipation fins, liquid-cooled microfluidic tube, and coolant driving assembly work together to effectively dissipate heat from the first substrate. The liquid-cooled microfluidic tube is positioned between two sets of heat dissipation fins, and the coolant driving assembly is positioned at the bottom of the multiple sets of heat dissipation fins. By fully utilizing the heat dissipation path of the heat dissipation fins and the liquid-cooling circulation, the heat dissipation and optical efficiency problems of high-power-density LEDs can be solved. The entire product is small in size, improving product integration and operational stability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of the integrated liquid-cooled high-power LED optical module provided by the present invention;

[0026] Figure 2 An exploded view of the integrated liquid-cooled high-power LED optical module provided by the present invention;

[0027] Figure 3 A schematic diagram of the structure of the liquid cooling circulation unit provided by the present invention;

[0028] Figure 4 A bottom view of the liquid container provided by the present invention;

[0029] Figure 5 This is a schematic diagram of the structure of the mounting plate provided by the present invention;

[0030] Figure 6 A flowchart of the control method provided by the present invention.

[0031] The symbols for the main components are explained below:

[0032] 10-Mounting plate; 11-First substrate; 12-LED packaging unit; 13-Temperature sensing unit; 14-Wiring unit; 15-Compound eye collimating lens; 16-Second substrate; 17-Liquid cooling circulation unit; 18-Heat dissipation fins; 19-Liquid cooling microfluidic tube; 20-Coolant driving assembly; 21-Sealing frame; 22-Fan; 23-Microfluidic channel plate; 24-Liquid box; 25-Sealing plate; 26-Support base; 28-Limiting plate; 29-First recovery tank; 30-Guide hole; 31-Opening; 32-Sealing cover; 33-Circulation pump; 34-Liquid outlet tank; 35-Boss; 36-Second recovery tank; 37-Heat dissipation hole; 38-Injection port. Detailed Implementation

[0033] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0034] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly on" another element, there is no intervening element. The terms "parallel," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] See Figure 1 , Figure 2 and Figure 3 This invention provides an integrated liquid-cooled high-power LED optical module, comprising:

[0037] Mounting plate 10;

[0038] A first substrate 11 is disposed on the upper surface of the mounting plate 10. The first substrate 11 includes an LED packaging unit 12, a temperature sensing unit 13, and a wiring unit 14. The wiring unit 14 is disposed on one side of the first substrate 11, and the temperature sensing unit 13 is located between the LED packaging unit 12 and the wiring unit 14. The LED packaging unit 12 is disposed at the center of the upper surface of the first substrate 11, and both the LED packaging unit 12 and the temperature sensing unit 13 are connected to the wiring unit 14.

[0039] The compound eye collimating lens 15 is sleeved above the LED packaging unit 12 and connected to the first substrate 11. The compound eye collimating lens 15 is used to receive the light emitted by the LED packaging unit 12 and collimate, deflect or integrate the light.

[0040] The heat dissipation assembly includes a second substrate 16 disposed on the lower surface of the mounting plate 10, a liquid cooling circulation unit 17, and multiple sets of heat dissipation fins 18. The tops of the multiple sets of heat dissipation fins 18 abut against the lower surface of the second substrate 16. The liquid cooling circulation unit 17 includes a liquid cooling microfluidic tube 19 located between the two sets of heat dissipation fins 18 and a coolant driving assembly 20 disposed at the bottom of the multiple sets of heat dissipation fins 18. The liquid cooling microfluidic tube 19 extends from the lower surface of the second substrate 16 to the bottom of the mounting plate 10.

[0041] The wiring unit 14 is used to connect to the control unit, which is used to receive the temperature signal detected by the temperature sensing unit 13 of the LED packaging unit 12, and control the coolant driving assembly 20 to drive the coolant in the liquid-cooled microfluidic tube 19 to exchange heat with the heat dissipation fins 18 and the first substrate 11 according to the temperature signal.

[0042] In this embodiment, the heat dissipation assembly further includes a sealing frame 21 and a fan 22. The sealing frame 21 is disposed on both sides of the second substrate 16, and the fan 22 is disposed on the surface of multiple sets of heat dissipation fins 18 between the two sealing frames 21. The sealing frame 21 is attached to the side of the coolant driving assembly 20 along the length direction of the liquid-cooled microfluidic tube 19. The coolant driving assembly 20 includes a microfluidic channel plate 23 and a liquid box 24. The top of the microfluidic channel plate 23 abuts against the bottom of the liquid-cooled microfluidic tube 19. The liquid box 24 includes a sealing plate 25, a support base 26, and a circulation pump 33. The sealing plate 25 is disposed between the microfluidic channel plate 23 and the support base 26. The liquid boxes 24 on both sides of the support base 26 are used to contain coolant. The upper surface of the sealing plate 25 is attached to the bottom of the microfluidic channel plate 23, and the lower surface of the sealing plate 25 is used to seal the liquid box 24. A limiting plate 28 is provided at one end of the sealing frame 21 away from the second substrate 16. The limiting plate 28 extends along the side of the microfluidic channel plate 23 to fit against the side of the liquid box 24. First recycling grooves 29 are provided on both sides of the sealing plate 25. Each first recycling groove 29 is inserted into the liquid-cooled microfluidic tube 19.

[0043] It should be noted that the microfluidic channel plate 23 includes multiple guide holes 30, each of which corresponds to and is adapted to the liquid-cooled microfluidic tube 19. The sealing plate 25 is provided with an opening 31 corresponding to the support base 26. The support base 26 is provided with a sealing cover 32 and a circulation pump 33, with the sealing cover 32 sleeved above the circulation pump 33. The mounting plate 10 is provided with a liquid outlet groove 34, a boss 35, and a second recovery groove 36. The liquid outlet groove 34 is located on the boss 35 and parallel to the arrangement direction of the liquid-cooled microfluidic tube 19. The boss 35 abuts against the lower surface of the first substrate 11. The second recovery groove 36 is located on both sides of the boss 35, and the second recovery groove 36 and the first recovery groove 29 are correspondingly provided at both ends of the liquid-cooled microfluidic tube 19. The mounting plate 10 also includes heat dissipation holes 37 spaced along the four edges of the mounting plate 10. The compound eye collimating lens 15 includes an aspherical main collimating lens and a plurality of microlens arrays. The aspherical main collimating lens is directly opposite the light-emitting center of the LED packaging unit 12 and is used to receive and collimate the light emitted by the LED packaging unit 12. The plurality of microlens arrays are arranged around the aspherical main collimating lens.

[0044] The first substrate 11 can be a PCB board or a PCBA board. The mounting plate 10 is made of a high thermal conductivity material (such as copper or aluminum alloy) and has microchannels etched or machined inside (compatible with liquid-cooled microfluidic tubes). The microchannels can be used for the circulation of coolant. The bottom of the first substrate 11 can be etched with microchannels for coolant flow. The second substrate 16 is made of the same material as the first substrate 11. The liquid-cooled microfluidic tube 19 passes through the second substrate 16. Multiple sets of heat dissipation fins 18 are installed between the sealing frames 21 on both sides of the second substrate 16. The sealing frames 21 and the second substrate 16 can be connected by snap-fit ​​or fastening.

[0045] Specifically, the LED packaging unit 12 includes multiple high-power-density LED chips, which are formed on the upper surface of the first substrate through eutectic bonding, high thermal conductivity adhesive, or hot pressing. The multiple LED chips can be arranged in an array, hexagonal, rhomboid, or other shapes at the center of the first substrate 11. The wiring unit 14 includes two terminals located on both sides of the LED packaging unit 12. The temperature sensing unit 13 is an NTC resistor or other temperature sensor. The compound eye collimating lens 15 is injection molded or molded from an optical-grade transparent material (such as PMMA, PC, or glass). Its bottom has a mounting structure that matches the contours of the first substrate 11 and the LED packaging unit 12, achieving seamless docking and precise positioning. The optical working surface of the compound eye collimating lens 15 has a compound eye structure, consisting of a central aspherical main collimating lens and multiple microlens arrays (compound eyes) surrounding it. The aspherical main collimating lens faces the light-emitting center of the LED packaging unit, receiving and collimating most of the direct light. The microlens array captures large-angle lateral light emitted by the LED chip and deflects and integrates it into the main optical path, achieving high light collection and collimation rates, thereby improving the illumination effect of the LED packaging unit 12. The compound eye collimating lens 15 and the first substrate 11 can be detachably connected or fixed via positioning posts and holes, snap-fit ​​structures, etc., using sealant for bonding, or with a sealing gasket in between to ensure the airtightness of the optical cavity.

[0046] Specifically, such as Figure 5As shown, the mounting plate 10 has multiple spaced heat dissipation holes 37 around its perimeter. Mounting holes are provided on the protruding parts of both sides of the mounting plate 10, with up to three mounting holes on each side. These mounting holes are used to mount the fan 22, allowing the fan 22 to be mounted on the surface of multiple sets of heat dissipation fins 18. A screw hole for fixing the first substrate 11 is provided between every two heat dissipation holes, and at least one screw hole is provided between adjacent heat dissipation holes. The mounting plate 10 has a liquid outlet groove 34, a boss 35, and a second recovery groove 36. The length direction of the liquid outlet groove 34 is consistent with the arrangement direction of the multiple sets of heat dissipation fins 18. The height of the boss 35 is less than the mounting surface of the screw hole. The liquid outlet groove 34 is perpendicular to the two second recovery grooves 36. The boss 35 is hexagonal, and the liquid outlet groove 34 is located at the center of the boss 35, ensuring full contact between the liquid outlet groove 34 and the bottom of the first substrate 11. This increases the contact area between the coolant and the bottom of the first substrate 11, improving the heat exchange rate.

[0047] Specifically, the fan 22 is located on both sides of the multiple heat dissipation fins 18, and the mounting surface of the fan 22 is flush with the sealing frame 21. The two fans 22 are respectively connected to the wiring terminals on each side, reducing wiring. The two wiring terminals can be connected to a control unit at the same time, or to a control unit separately. The control unit can be located at the coolant drive assembly 20. Part of the interface of one wiring terminal can be used to control the lighting brightness, and part of the interface of the other wiring terminal can be used to control the speed of the fan 22 or the circulation pump 33. The specific settings can be configured according to the actual situation and are not limited here.

[0048] Specifically, taking sixteen liquid-cooled microfluidic tubes 19 as an example, and seventeen sets of heat dissipation fins 18, the eight liquid-cooled microfluidic tubes in the middle are designated as the first liquid-cooled microfluidic tubes, and the two liquid-cooled microfluidic tubes located on both sides of the first liquid-cooled microfluidic tubes (the first and sixteenth in the horizontal direction of the microfluidic channel plate) are designated as the second liquid-cooled microfluidic tubes. The tops of the first liquid-cooled microfluidic tubes (near the mounting plate) and the tops of the second liquid-cooled microfluidic tubes are fitted with slots or holes on the second substrate. The bottom of the first liquid-cooled microfluidic tube passes through the sealing plate and faces the opening, that is, the installation position of the circulation pump 33 corresponds to the bottom of the first liquid-cooled microfluidic tube. This ensures that when the liquid cooling mode is activated, the temperature of the coolant flowing from the liquid box 24 into the first liquid-cooled microfluidic tube remains basically unchanged (i.e., the first liquid-cooled microfluidic tube is the first liquid-cooled microfluidic tube). (One liquid-cooled microfluidic tube is considered as the liquid inlet channel). The second liquid-cooled microfluidic tube is adapted to the second recovery tank 36 on the mounting plate. The coolant flowing out of the liquid outlet tank 34 will become heated coolant when it comes into contact with the bottom of the first substrate 11. The heated coolant flows from the liquid outlet tank 34 to the gap around the boss 35 and flows into the second recovery tank 36 by gravity. Then the heated coolant passes through the second substrate 16 and the second liquid-cooled microfluidic tube in sequence. Multiple heat dissipation holes around the second substrate 16 allow the heated coolant to dissipate some heat. The heat dissipation fins 18 on both sides of each liquid-cooled microfluidic tube 19 in the second liquid-cooled microfluidic tube can dissipate heat from the heated coolant. At the same time, the fan 22 can accelerate the heat dissipation rate of the heat dissipation fins, which can ensure that the temperature of the coolant flowing back into the liquid box 24 is basically close to the initial temperature.

[0049] The number of first liquid-cooled microfluidic tubes can be adjusted according to the rotation speed of the circulating pump 33. Initially, four liquid-cooled microfluidic tubes can be started, meaning coolant flows into the corresponding four liquid-cooled microfluidic tubes from the opening 31. As the rotation speed increases, coolant flows from the four liquid-cooled microfluidic tubes to one or two adjacent tubes, up to a total of ten liquid-cooled microfluidic tubes. The flow rate of each liquid-cooled microfluidic tube is different, while the flow rate of the liquid-cooled microfluidic tube directly opposite the opening is the same. As the distance from the opening increases, the flow rate of the liquid-cooled microfluidic tubes will decrease. The specific settings can be selected according to actual conditions, which will not be elaborated here.

[0050] Specifically, a limiting plate 28 is provided at the end of the sealing frame 21. The limiting plate 28 is inverted T-shaped. First recovery grooves 29 are provided on both sides of the sealing plate 25. The limiting plate 28 extends to the side of the liquid box 24 and fits tightly against the notches on both sides of the microfluidic channel plate 23. In actual installation, the limiting plate 28 directly fits against the side of the liquid box 24 and abuts (or is welded) to the "convex" shaped upper surface of the limiting plate 28, thereby improving the sealing performance of the liquid box 24. The support base 26 is located in the middle of the liquid box 24 and can extend from the bottom of the liquid box 24 to the sealing plate 25. The height of the sealing cover 32 is flush with the sealing plate 25. The hole of the sealing cover 32 corresponds to the opening 31 on the sealing plate 25. Preferably, the diameter of the hole of the sealing cover 32 is larger than the diameter of the opening 31 to facilitate the rapid flow of coolant into the liquid-cooled microfluidic tube 19. A circulation pump 33 is installed on the support base 26 (to evacuate the liquid-cooled microfluidic tube corresponding to the opening to generate negative pressure). The sealing cover 32 covers the body of the circulation pump 33. The bottom of the support base 26 is detachably connected to the sealing cover 32. Figure 4 As shown, the bottom of the liquid box 24 is provided with an inlet 38 for coolant injection.

[0051] It should be understood that by setting an LED packaging unit 12, a wiring unit 14, and a temperature sensing unit 13 on the first substrate 11, the heat dissipation assembly includes a second substrate 16, a liquid cooling circulation unit 17, and multiple sets of heat dissipation fins 18. The temperature sensing unit 13 detects the temperature signal of the LED packaging unit 12 and controls the coolant driving assembly 20 to drive the coolant in the liquid cooling microfluidic tube 19 to exchange heat with the heat dissipation fins 18 and the first substrate 11, thus structurally integrating the LED packaging unit 12, the compound eye collimating lens 15, and the heat dissipation assembly. The straight lens 15 collimates, deflects, or integrates the light emitted from the LED packaging unit 12. The heat sink fins, liquid-cooled microfluidic tubes 19, and coolant driving components 20 work together to effectively dissipate heat from the first substrate 11. The liquid-cooled microfluidic tubes 19 are positioned between two sets of heat sink fins 18, and the coolant driving components 20 are positioned at the bottom of multiple sets of heat sink fins 18. By fully utilizing the heat dissipation path of the heat sink fins 18 and the liquid cooling circulation, the heat dissipation and optical efficiency problems of high power density LEDs can be solved. The entire product is small in size, improving product integration and operational stability.

[0052] See Figure 6 The present invention also provides a control method for an integrated liquid-cooled high-power LED optical module, applied to the aforementioned integrated liquid-cooled high-power LED optical module, the control method comprising the following steps:

[0053] S1: Obtain the temperature signal of the LED packaging unit detected by the temperature sensing unit, and when the temperature value corresponding to the temperature signal exceeds the first preset temperature, control the fan to start;

[0054] S2: When the temperature value corresponding to the temperature signal exceeds the second preset temperature, the circulation pump is controlled to start and the coolant in the liquid box is brought into contact with the bottom of the first substrate through the first liquid-cooled microfluidic tube above the circulation pump to obtain heated coolant, wherein the second preset temperature is greater than the first preset temperature.

[0055] S3: When the heated coolant flows from the outlet tank into the second recovery tank, control the fan speed to cool the heated coolant in the second liquid-cooled microfluidic tube corresponding to the second recovery tank.

[0056] In this embodiment, upon power-up, the LED packaging unit, temperature sensing unit, and wiring unit perform self-tests. The control unit can be an MCU, which is connected to the wiring unit. After detecting that the components on the first substrate are normal (i.e., voltage, current, and temperature are normal), the MCU collects and records the initial temperature signal from the temperature sensing unit, turns on at least one LED chip in the LED packaging unit, and collects the heat generated by the LED chip emitting light, the temperature of the compound eye collimating lens, and the temperature on the first substrate. The NTC (thermistor) feeds back different temperatures to the MCU in real time. At the same time, the MCU is also connected to an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). The first preset temperature can be 20 degrees Celsius, and the second preset temperature can be 40 degrees Celsius.

[0057] It should be noted that when the collected temperature does not reach the first preset temperature, the fan is not activated. The mounting plate and the second substrate will also transfer some heat from the first substrate to the heat sink fins; this heat dissipation process is recorded as the normal cooling mode. As the number of LED chips increases and the light-emitting time continues, the temperature value corresponding to the temperature signal collected by the NTC will also increase. When the collected temperature is greater than or equal to the first preset temperature, the MCU controls the fan to start. After a certain period, when the collected temperature is lower than the first preset temperature and tends to stabilize, there is no need to activate the coolant drive component, because the mounting plate and the second substrate will also transfer some heat from the first substrate to the heat sink fins; this heat dissipation process is set to air cooling mode.

[0058] When the fan starts and the collected temperature is greater than or equal to the second preset temperature, the MCU controls the circulation pump to start, so that the coolant in the liquid box enters the liquid outlet on the mounting plate from the first liquid cooling microfluidic tube to cool the first substrate. If the collected temperature changes significantly within a certain period of time and does not reach the second preset temperature, the fan can be turned off, and the speed of the circulation pump can be controlled to increase and finally rotate at a constant speed until the collected temperature does not exceed the first preset temperature. This heat dissipation process is set to liquid cooling mode.

[0059] When the fan starts and the collected temperature is greater than or equal to the second preset temperature, the MCU controls the circulation pump to start, causing the coolant in the liquid tank to flow from the first liquid-cooled microfluidic tube into the outlet tank on the mounting plate to cool the first substrate. If the collected temperature change is small within a certain period and does not reach the second preset temperature, the fan speed is reduced, and the circulation pump speed is increased until it rotates at a constant speed until the collected temperature does not exceed the first preset temperature. This heat dissipation process is set to air-liquid cooling mode. When the fan starts and the collected temperature is greater than or equal to the second preset temperature, the MCU controls the circulation pump to start, causing the coolant in the liquid tank to flow from the first liquid-cooled microfluidic tube into the outlet tank on the mounting plate to cool the first substrate. If the collected temperature continues to exceed the second preset temperature within a certain period, the fan speed and the circulation pump speed are increased. Based on this, the drive speed and on / off state of the fan and circulation pump can be reasonably adjusted according to the real-time temperature detection, thereby ensuring that the LED packaging unit operates within a safe temperature range, improving the reliability and lifespan of the LED packaging unit.

[0060] In addition, the NTC thermistor provides different resistance values ​​based on different temperatures for the MCU to calculate. When the temperature exceeds the LED's safe temperature, it issues a command to stop or reduce the LED drive current to lower the temperature. When the temperature drops to the set temperature (less than or equal to the first preset temperature), it issues a command to restore full power output, ensuring the safe and stable output of the LED packaging unit. If any unit, such as the fan or circulation pump, malfunctions, the MCU issues a command to stop the LED packaging unit from outputting power, ensuring the module's safety and stability. An engineer data interface is provided, which allows for the reading of module operating status data, such as operating time, temperature changes, and operating status. Fault codes for each unit can be set, allowing engineers to quickly determine the module's fault location based on the codes. The system also includes temperature monitoring for the control module and the entire machine, high and low temperature alarms and protection, and temperature comparison calculations between the air inlet and outlet to ensure the safe and stable operation of the entire machine.

[0061] It should be understood that the present invention has the following significant technical effects:

[0062] (1) Heat dissipation performance: The LED chip is directly die-bonded on the microchannel mounting, eliminating the multi-layer thermal interface material in the traditional structure, reducing the thermal path from the chip PN junction to the heat dissipation liquid to the shortest, and all materials with high thermal conductivity and similar coefficient are used, resulting in low thermal resistance. There are no major bottlenecks in the entire heat dissipation path, which can quickly remove the heat generated by the chip, ensuring that the LED works stably at low temperature, continuously maintaining low temperature and high light efficiency output, and greatly extending the lifespan.

[0063] (2) Optical efficiency: The compound eye collimating lens with integrated design achieves "seamless connection" with the LED chip, minimizing light loss and Fresnel reflection at the transmission interface. The compound eye structure can efficiently collect almost all light emitted by the LED, including large-angle side light, and collimate it for output. The light extraction efficiency (optical extraction efficiency) is significantly improved compared with traditional discrete lenses, and the light focusing effect is uniform and free of stray light;

[0064] (3) Integration and modularization: The three cross-domain technologies (encapsulation, heat dissipation, and optics) are integrated into a standard module. Backend lighting manufacturers no longer need to deal with complex heat dissipation and optics issues separately. They can simply connect the power supply to use it, which greatly reduces the application threshold and technical difficulty.

[0065] (4) Compact structure and high power density: The module is small in size and light in weight, but can carry a very high power density, making it particularly suitable for lighting applications with strict requirements on space and weight, such as searchlights, stage lights, car headlights, special work lights, etc.

[0066] (5) Production efficiency and cost optimization: The integrated modular design simplifies the supply chain and assembly process, facilitates large-scale standardized production, and reduces overall manufacturing costs and assembly time.

[0067] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limitations; therefore, other examples of exemplary embodiments may have different values.

[0068] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0069] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. An integrated liquid-cooled high-power LED optical module, characterized in that, include: Mounting plate; A first substrate is disposed on the upper surface of the mounting plate. The first substrate includes an LED packaging unit, a temperature sensing unit, and a wiring unit. The wiring unit is disposed on one side of the first substrate. The temperature sensing unit is located between the LED packaging unit and the wiring unit. The LED packaging unit is disposed at the center of the upper surface of the first substrate. Both the LED packaging unit and the temperature sensing unit are connected to the wiring unit. A compound eye collimating lens is sleeved above the LED packaging unit and connected to the first substrate. The compound eye collimating lens is used to receive the light emitted by the LED packaging unit and to collimate, deflect, or integrate the light. The heat dissipation assembly includes a second substrate disposed on the lower surface of the mounting plate, a liquid cooling circulation unit, and multiple sets of heat dissipation fins. The tops of the multiple sets of heat dissipation fins abut against the lower surface of the second substrate. The liquid cooling circulation unit includes a liquid cooling microfluidic tube located between the two sets of heat dissipation fins and a coolant driving assembly disposed at the bottom of the multiple sets of heat dissipation fins. The liquid cooling microfluidic tube extends from the lower surface of the second substrate to the bottom of the mounting plate. The wiring unit is used to connect to the control unit, which is used to receive the temperature signal of the LED packaging unit detected by the temperature sensing unit, and control the coolant driving component to drive the coolant in the liquid-cooled microfluidic tube to exchange heat with the heat dissipation fins and the first substrate according to the temperature signal.

2. The integrated liquid-cooled high-power LED optical module according to claim 1, characterized in that, The heat dissipation assembly also includes a sealing frame and a fan. The sealing frame is disposed on both sides of the second substrate, and the fan is disposed on the surface of multiple sets of heat dissipation fins between the two sealing frames. The sealing frame is attached to the side of the coolant drive assembly along the length of the liquid-cooled microfluidic tube.

3. The integrated liquid-cooled high-power LED optical module according to claim 2, characterized in that, The coolant drive assembly includes a microfluidic channel plate and a liquid box. The top of the microfluidic channel plate abuts against the bottom of the liquid-cooled microfluidic tube. The liquid box includes a sealing plate, a support base, and a circulation pump. The sealing plate is disposed between the microfluidic channel plate and the support base. The liquid boxes on both sides of the support base are used to contain coolant. The upper surface of the sealing plate is in contact with the bottom of the microfluidic channel plate, and the lower surface of the sealing plate is used to seal the liquid box.

4. The integrated liquid-cooled high-power LED optical module according to claim 3, characterized in that, A limiting plate is provided at one end of the sealing frame away from the second substrate. The limiting plate extends along the side of the microfluidic channel plate to fit against the side of the liquid box. First recovery grooves are provided on both sides of the sealing plate, and each first recovery groove is inserted into the liquid-cooled microfluidic tube.

5. The integrated liquid-cooled high-power LED optical module according to claim 4, characterized in that, The microfluidic channel plate includes multiple flow guide holes, which are matched one-to-one with the liquid-cooled microfluidic tubes.

6. The integrated liquid-cooled high-power LED optical module according to claim 4, characterized in that, The sealing plate is provided with an opening corresponding to the support base. The support base is provided with a sealing cover and a circulation pump, and the sealing cover is fitted over the circulation pump.

7. The integrated liquid-cooled high-power LED optical module according to claim 6, characterized in that, The mounting plate is provided with a liquid outlet groove, a boss, and a second recovery groove. The liquid outlet groove is disposed on the boss and parallel to the arrangement direction of the liquid-cooled microfluidic tubes. The boss abuts against the lower surface of the first substrate. The second recovery groove is located on both sides of the boss and is disposed at both ends of the liquid-cooled microfluidic tubes, corresponding to the first recovery groove.

8. The integrated liquid-cooled high-power LED optical module according to claim 7, characterized in that, The mounting plate also includes heat dissipation holes spaced apart along its four edges.

9. The integrated liquid-cooled high-power LED optical module according to claim 1, characterized in that, The compound eye collimating lens includes an aspherical main collimating lens and multiple microlens arrays. The aspherical main collimating lens is directly opposite the light-emitting center of the LED packaging unit and is used to receive and collimate the light emitted by the LED packaging unit. The multiple microlens arrays are arranged around the aspherical main collimating lens.

10. A control method for an integrated liquid-cooled high-power LED optical module, characterized in that, The control method, applied to the integrated liquid-cooled high-power LED optical module as described in any one of claims 1-9, comprises the following steps: The temperature signal of the LED packaging unit is obtained by the temperature sensing unit, and when the temperature value corresponding to the temperature signal exceeds a first preset temperature, the fan is controlled to start. When the temperature value corresponding to the temperature signal exceeds the second preset temperature, the circulation pump is controlled to start and the coolant in the liquid box is brought into contact with the bottom of the first substrate through the first liquid-cooled microfluidic tube above the circulation pump to obtain heated coolant, wherein the second preset temperature is greater than the first preset temperature. When the heated coolant flows from the outlet tank into the second recovery tank, the fan speed is controlled to cool the heated coolant in the second liquid-cooled microfluidic tube corresponding to the second recovery tank.

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