Motion error compensation method and equipment for mass transfer

Abstract

The invention relates to the technical field of Micro LED chip mass transfer, in particular to a mass transfer motion error compensation method and equipment. Before transfer, displacement errors caused by blasting and inertia are predicted and corrected in advance according to transfer energy and chip quality, and pre-compensation before transfer is achieved. And determining the total displacement error of the previous region transfer stage and the current region transfer stage according to the deviation between the theoretical speed and the actual speed of the substrate, thereby realizing integration of the errors before chip transfer, in the chip transfer stage and in the region transfer stage, performing error compensation on the position of the action point, and improving the precision during chip transfer. And during area changing, any one or more of the position of the first action point, the area changing displacement amount of the transfer substrate or the position of the bearing substrate is adjusted according to the total displacement error amount, so that the error of the previous area changing stage and the previous transfer stage is compensated. Therefore, the influence of the error of the previous area changing stage and the previous transfer stage on the subsequent chip transfer is reduced.

Description

Technical Field

[0001] This invention relates to the field of mass transfer technology for Micro LED chips, and particularly to a method and device for motion error compensation in mass transfer. Background Technology

[0002] In some existing non-contact mass transfer methods, chips are arranged and attached to a transfer substrate with a spacing of 100μm or smaller, ranging from hundreds to thousands. For example, in laser-assisted transfer, a laser emitter emits a laser beam to peel off the chips from the transfer substrate, and the chips are then transferred to a receiving substrate.

[0003] To improve transfer speed and efficiency, the transfer substrate and receiving substrate will remain in motion during chip transfer, reducing frequent start-stop cycles. Furthermore, a multi-region simultaneous transfer strategy is employed, where the transfer substrate is divided into multiple regions, and two or more adjacent regions are transferred simultaneously. However, this multi-region simultaneous transfer strategy involves a region-switching phase. During this phase, the transfer substrate needs to undergo acceleration and deceleration to ensure the laser application point can quickly cross adjacent transfer regions to reach the next transfer region.

[0004] During the transfer process and / or area switching stage, the speed difference between the transfer substrate and the carrier substrate, as well as the deviation between the actual speed and the theoretical speed, can cause significant errors in the subsequent chip transfer, resulting in a large deviation of the chip landing on the carrier substrate and affecting the accuracy of chip transfer. Summary of the Invention

[0005] The main objective of this invention is to provide a method and device for compensating motion errors in mass transfer, aiming to solve the technical problem in the prior art where displacement errors at different stages affect the accuracy of chip transfer.

[0006] To achieve the above objectives, the present invention proposes a motion error compensation method for mass transfer, comprising the following steps: Step S1: Determine the chip flight inertial displacement error based on the transfer energy, chip mass, and the theoretical velocity difference between the transfer substrate and the receiving substrate during chip flight; Step S2: Adjust the initial set point based on the chip's flight inertial displacement error as the first offset to obtain the coordinates of the first point of action; Step S3: Determine the total displacement error between the previous area transfer stage and the current area transfer stage based on the error between the theoretical speed and the actual speed of the transfer substrate and the receiving substrate. Step S4: Before transferring the first chip in the current region, adjust the coordinates of the first action point using the total displacement error as the second offset to obtain the coordinates of the second action point for transferring the chip; Step S5: At the start of the next area-changing stage, adjust one or more of the following for compensation: the position of the first action point, the area-changing displacement of the transfer substrate, or the position of the receiving substrate, based on the total displacement error; and return to step S3 after the area-changing stage ends.

[0007] The above-mentioned motion error compensation method for mass transfer also includes the following steps: when transferring the chip in the current region, the deviation between the chip landing point position and the target position is detected in real time based on the configured vision module to obtain the real-time displacement deviation; the coordinates of the second action point are dynamically corrected according to the real-time displacement deviation.

[0008] In the above-mentioned method for compensating motion errors during mass transfer, determining the chip's flight inertial displacement error includes: Based on the transfer energy and chip mass in the transfer parameters, the initial vertical velocity of the chip is calculated; The chip's flight time is calculated based on its initial vertical velocity and the vertical distance it travels. The chip's flight time and the difference between the theoretical velocities of the transfer substrate and the receiving substrate are used to calculate the chip's flight inertial displacement error.

[0009] In the above-mentioned method for compensating motion errors during massive transfers, determining the total displacement error between the previous area transfer stage and the current area transfer stage includes the following steps: The differential displacement error is determined based on the flight time of a single chip and the error between the actual and theoretical speeds of the transfer substrate and the receiving substrate in the current region. Based on the switching time of the previous switching process and the error between the theoretical and actual speed change of the transfer substrate in the previous switching process, the switching speed change displacement error is determined. By integrating the differential uniform displacement error and the variable displacement error during zone switching, the total displacement error is obtained.

[0010] In the above-mentioned motion error compensation method for mass transfer, when transferring the chip in the current region, both the transfer substrate and the receiving substrate move at a constant speed. The determination of the differential displacement error includes the following steps: The first error value is obtained based on the error between the actual uniform speed and the theoretical uniform speed of the transfer substrate; The second error value is obtained based on the error between the actual uniform speed and the theoretical uniform speed of the substrate. The difference between the first error value and the second error value is used to obtain the relative speed error; The differential uniform displacement error is determined based on the flight time and relative velocity error of a single chip.

[0011] In the above-mentioned motion error compensation method for mass transfer, during the previous area change process, the transfer substrate undergoes a variable speed motion of first accelerating and then decelerating. The determination of the variable speed displacement error during area change includes the following steps: The speed change error at each moment is obtained by comparing the theoretical speed and the actual speed of the transfer substrate at each moment. Integrating the speed change error during the zone change time yields the zone change speed change displacement error.

[0012] A second aspect of this invention discloses a motion error compensation device for mass transfer, comprising a transfer energy transmitter, a transfer substrate, a carrier substrate, and a control system; the control system includes a data processing module and a control module. The data module is configured as follows: The chip flight inertial displacement error is determined based on the transferred energy, chip mass, and the theoretical velocity difference between the transfer substrate and the receiving substrate during chip flight. The initial set point is adjusted based on the chip's flight inertial displacement error as the first bias, and the coordinates of the first point of action are obtained. Based on the error between the theoretical and actual speeds of the transfer substrate and the receiving substrate, the total displacement error between the previous area transfer stage and the current area transfer stage is determined. The control module is configured as follows: Before transferring the first chip in the current region, the coordinates of the first point of action are adjusted using the total displacement error as the second offset to obtain the coordinates of the second point of action for transferring the chip. At the start of the next area transfer stage, compensation is made by adjusting one or more of the following: the position of the first action point, the area transfer displacement of the transfer substrate, or the position of the receiving substrate, based on the total displacement error. After the area transfer stage ends, the data module is triggered to determine the total displacement error between the previous area transfer stage and the current area transfer stage.

[0013] The aforementioned motion error compensation device for mass transfer also includes a vision module, which is used to detect the deviation between the chip landing point position and the target position in real time when transferring the chip in the current region, and obtain the real-time displacement deviation; the control module is also configured to dynamically correct the coordinates of the second point of action based on the real-time displacement deviation.

[0014] In the aforementioned mass transfer motion error compensation device, the data module includes a first calculation unit, which is configured as follows: Based on the transfer energy and chip mass in the transfer parameters, the initial vertical velocity of the chip is calculated; The chip's flight time is calculated based on its initial vertical velocity and the vertical distance it travels. The chip's flight time and the difference between the theoretical velocities of the transfer substrate and the receiving substrate are used to calculate the chip's flight inertial displacement error.

[0015] In the aforementioned motion error compensation device for massive transfer, the data module further includes a second calculation unit, a third unit, and a summation unit; The second calculation unit is used to determine the differential displacement error based on the flight time of a single chip and the error between the actual and theoretical speeds of the transfer substrate and the receiving substrate in the current region. The third calculation unit is used to determine the speed change displacement error of the area switching process based on the area switching time of the previous area switching process and the error between the theoretical speed and the actual speed of the transfer substrate in the previous area switching process. The summation unit is used to integrate the differential uniform displacement error and the zone-changing variable displacement error to obtain the total displacement error.

[0016] The technical solution provided by this invention may include the following beneficial effects: Before the transfer, displacement errors caused by explosion and inertia are predicted and corrected in advance based on the transfer energy and chip quality, achieving pre-compensation before transfer. Furthermore, the total displacement error between the previous area transfer stage and the current area transfer stage is determined based on the deviation between the theoretical and actual speeds of the substrate. This integrates the errors before chip transfer, during chip transfer, and during area transfer to compensate for errors in the coordinates of the application point, improving the accuracy of chip transfer. This achieves both high-efficiency chip transfer and high-precision chip transfer.

[0017] During the area switching process, the position of the first action point, the area switching displacement of the transfer substrate, or the position of the receiving substrate are adjusted according to the total displacement error to compensate for the errors of the previous area switching stage and the previous transfer stage, thereby reducing the impact of the errors of the previous area switching stage and the previous transfer stage on the subsequent chip transfer. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a flowchart of a motion error compensation method according to an embodiment of the present invention; Figure 2 This is a comparison diagram before and after a massive transfer in one embodiment of the present invention; Figure 3 This is a speed curve diagram of the transfer substrate and the receiving substrate during a mass transfer in one embodiment of the present invention; Figure 4 This is a schematic diagram of chip flight according to an embodiment of the present invention; Figure 5 This is a speed curve diagram of the transfer substrate and the receiving substrate during the transfer stage in one embodiment of the present invention; Figure 6 This is a speed curve of the transfer substrate during the area switching stage in one embodiment of the present invention; Figure 7 This is a flowchart of a motion error compensation method according to another embodiment of the present invention. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; taking "A and / or B" as an example, it includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0024] The following is combined Figure 1This invention describes a motion error compensation method for mass transfer, applicable to non-contact mass transfer of Micro LED chips, such as laser-assisted transfer, electric field-assisted transfer, and piezoelectric-driven jet transfer. The following description uses laser-assisted transfer as an example to illustrate this technical solution.

[0025] The motion error compensation method for mass transfer in this embodiment includes the following steps: Step S0: Initialize the vision module for visual inspection and the sensor for acquiring real-time speed, and acquire motion information of the transfer substrate and the receiving substrate, as well as chip transfer parameters. The vision module is used to detect the initial position of the chip on the transfer substrate and the target position of the receiving substrate; the vision module can be an industrial camera. The sensor can be a speed sensor, laser sensor, inertial measurement unit, or grating ruler, etc., to acquire the real-time speed of the transfer substrate and the receiving substrate. In the laser-assisted transfer embodiment, the chip transfer parameters include the coordinates of the initial set point, the transfer energy, and the theoretical speed of the transfer substrate and the receiving substrate. The initial set point refers to the point of initial laser application, and the transfer energy refers to the laser pulse energy emitted by the laser emitter.

[0026] Step S1: Determine the chip flight inertial displacement error based on the transfer energy, chip mass, and the theoretical velocity difference between the transfer substrate and the receiving substrate during chip flight. Chip flight inertial error refers to the inertial displacement error caused by the theoretical velocity difference between the transfer substrate and the receiving substrate during chip descent. Specifically, the initial vertical velocity of the chip is determined by the transfer energy and chip mass; the chip flight time is determined based on the initial vertical velocity; and finally, the chip flight inertial displacement error is determined by the chip flight time and the theoretical velocity difference between the transfer substrate and the receiving substrate.

[0027] Step S2: Adjust the initial setpoint based on the chip flight inertial displacement error as the first bias to obtain the coordinates of the first action point. In actual production, the transfer energy, chip mass, and theoretical speed of the transfer substrate and the receiving substrate are constant; therefore, the chip flight inertial displacement error is a constant. Adjusting the initial setpoint using the chip flight inertial displacement error as the first bias eliminates the chip flight inertial displacement error in advance. For example, define the coordinates of the initial setpoint as (X0, Y0). During chip transfer, both the transfer substrate and the receiving substrate move along the X-axis, remaining stationary along the Y-axis. Therefore, the chip flight inertial displacement exists only in the X-direction. Define the first bias as... Then the coordinates of the first point of action are (X0+ (Y0). More specifically, in the embodiment of laser-assisted transfer, the initial set point bias can be achieved by optical path fine-tuning without moving the laser emitter.

[0028] Step S3: Based on the error between the theoretical and actual speeds of the transfer substrate and the receiving substrate, determine the total displacement error between the previous area-changing stage and the current area transfer stage; it is worth noting that the area-changing stage refers to a jump in the X-direction. Specifically, as shown... Figure 2 In the illustrated embodiment, regions A, B, C, and D are sequentially connected along the X direction. Exemplarily, the laser emitter can emit two spaced-apart light spots in the X direction, enabling a multi-region simultaneous transfer strategy. Initially, one light spot is at the first chip to be transferred in region A, and the other light spot is at the first chip to be transferred in region B. The two light spots are emitted simultaneously to remove the corresponding chips, thus achieving simultaneous chip transfer in both regions. When all chips in region A have been transferred, the chips in region B are also transferred synchronously. At this point, a region-switching phase occurs; the light spot originally emitted in region A needs to cross region B to reach the first chip to be transferred in region C. Similarly, the light spot originally emitted in region B crosses region C to reach the first chip to be transferred in region D. This stage is the region-switching phase. During this process, the transfer substrate needs to undergo high-speed acceleration and deceleration to achieve the region-switching; the specific speed changes can be seen in [the diagram / document / etc.]. Figure 3 The speed curves of the transfer substrate and the receiving substrate over time are shown.

[0029] Step S4: Before transferring the first chip in the current region, adjust the coordinates of the first action point using the total displacement error as the second offset to obtain the coordinates of the second action point used for chip transfer. This offset compensates for the total displacement error caused by the previous region-switching stage and the current region transfer stage, ensuring precise alignment between the chip's final landing point and the target position of the receiving substrate. For example, during the transfer and region-switching stages, both the transferring substrate and the receiving substrate move along the X-axis while remaining stationary along the Y-axis. Therefore, the total displacement error exists only in the X-direction. Let the total displacement error be defined as ΔS, then the coordinates of the second action point are (X0 + ... +△S, Y0).

[0030] Step S5: At the start of the next area-changing stage, adjust one or more of the following for compensation: the position of the first action point, the area-changing displacement of the transfer substrate, or the position of the receiving substrate, based on the total displacement error; and return to step S3 after the area-changing stage ends. This eliminates the total displacement error from the previous area-changing stage and the transfer stage, thus preventing error accumulation.

[0031] For example, when adjusting the position of the first point of action based solely on the total displacement error, the total displacement error is eliminated by adjusting the laser output device. The adjustment method could be: the laser output device remains stationary, and the laser offset is maintained as the sum of the first offset and the second offset; that is, the coordinates of the second point of action are updated to the coordinates of the first point of action when the next region is transferred. Alternatively, the laser output device could compensate for the total displacement error, with the laser offset remaining at the first offset.

[0032] For example, when the error is large or higher stability is required, the total displacement error can be eliminated without adjusting the laser output device. Instead, the displacement of the transfer substrate during the area-changing stage can be compensated based on the total displacement error, i.e., the total displacement of the transfer substrate during the area-changing stage is the original displacement plus the total displacement error; or the total displacement error can be eliminated simply by changing the position of the receiving substrate, i.e., the receiving substrate moves relative to the laser emitter by the total displacement error.

[0033] Of course, it is also possible to primarily adjust the position of the first point of action, and secondarily adjust the displacement of the transfer substrate and / or the position of the receiving substrate to form an optical-mechanical collaborative compensation mechanism.

[0034] In some specific embodiments, there may be a step between step S4 and step S5 where it is determined whether the current transfer area is the last area of ​​the current row. If it is, the process ends and step S5 is not executed; if not, step S5 is executed.

[0035] Preferably, such as Figure 7 As shown, it also includes the following steps: When transferring chips in the current region, the configured vision module detects the deviation between the chip's landing point and the target position in real time, obtaining the real-time displacement deviation. This real-time displacement deviation is then dynamically used as a real-time offset to correct the coordinates of the second action point. Specifically, optical path fine-tuning is used to offset the previous second action point coordinates from the real-time displacement deviation, resulting in new second action point coordinates. These new coordinates are then used to transfer the next chip. This achieves dynamic correction of the second action point coordinates based on the real-time displacement deviation during transfer, forming a closed-loop self-correcting optimization.

[0036] Then, the total offset between the coordinates of the second action point of the last chip in the region and the coordinates of the first action point corresponding to the region is used as the latest total displacement error.

[0037] As an optional embodiment, such as Figure 4 As shown, the chip falls from the transfer substrate under the influence of transferred energy, exhibiting parabolic motion. The determination of the chip's flight inertial displacement error includes: Based on the transfer energy and chip mass in the transfer parameters, the initial vertical velocity of the chip is calculated; specifically, the calculation formula is: ; in, Let be the initial velocity of the chip in the vertical direction; This is an empirical coefficient; To transfer energy; For chip quality; The chip's flight time is calculated based on its initial vertical velocity and the vertical distance traveled during the transfer; specifically, the calculation formula is as follows: ; in, For chip flight time, To transfer vertical distance, It is the acceleration due to weight; The chip's flight time and the difference between the theoretical velocities of the transfer substrate and the receiving substrate are used to calculate the chip's flight inertial displacement error. Specifically, the calculation formula is as follows: ; in, This indicates the chip's flight inertial displacement error. This represents the difference in theoretical speed between the transfer substrate and the receiving substrate.

[0038] Thus, by considering the characteristics of laser blasting, the chip's flight time and initial vertical velocity can be predicted, so as to correct the chip's inertial displacement error in advance.

[0039] As an optional embodiment, determining the total displacement error between the previous area transfer stage and the current area transfer stage includes the following steps: The differential displacement error is determined based on the flight time of a single chip and the error between the actual and theoretical speeds of the transfer substrate and the receiving substrate in the current region. Preferably, when transferring the chip in the current region, the transfer substrate and the receiving substrate adopt a differential uniform speed motion mode, that is, both the transfer substrate and the receiving substrate move at a uniform speed, but the speed ratio between the transfer substrate and the receiving substrate is not equal to 1. In a specific embodiment, such as... Figure 3 The speed curves of the carrier substrate and the transfer substrate shown indicate that during the chip transfer phase, the speed of the carrier substrate along the X direction is n times greater than the speed of the transfer substrate along the X direction. Of course, in other embodiments, the transfer substrate and the receiving substrate may also employ synchronous uniform speed or segmented acceleration / deceleration motion modes.

[0040] Based on the transfer time of the previous area-changing process and the error between the theoretical and actual speed changes of the transfer substrate during the previous area-changing process, the area-changing speed-changing displacement error is determined. During the area-changing stage, the transfer substrate needs to undergo high-speed acceleration and deceleration to achieve area transition. The receiving substrate, however, maintains a constant set speed with minimal speed variation, therefore its contribution to the area-changing speed-changing error is negligible. In other words, the displacement error during the area-changing stage mainly originates from the speed deviation of the transfer substrate during the acceleration and deceleration phases.

[0041] By integrating the differential uniform displacement error and the variable displacement error during zone switching, the total displacement error is obtained.

[0042] In this way, the total displacement error between the previous area transfer stage and the current area transfer stage can be determined based on the error between the theoretical speed and the actual speed of the transfer substrate and the receiving substrate.

[0043] like Figure 5 As shown, when transferring the chip in the current region, both the transfer substrate and the receiving substrate move at a constant speed. The determination of the difference displacement error includes the following steps: The first error value is obtained based on the error between the actual uniform speed and the theoretical uniform speed of the transfer substrate; specifically, the calculation formula is as follows: = - ; in, This is the first error value. To achieve a theoretically uniform transfer speed for the substrate, This represents the actual uniform speed at which the substrate is transferred.

[0044] The second error value is obtained based on the error between the actual uniform speed and the theoretical uniform speed of the substrate; specifically, the calculation formula is as follows: = ; in, This is the first error value. To maintain the theoretical constant speed of the substrate, To ensure the actual uniform speed of the substrate.

[0045] The difference between the first error value and the second error value is used to obtain the relative speed error; The differential uniform displacement error is determined based on the flight time and relative velocity error of a single chip. Specifically, the calculation formula is as follows: ; in, This is for the difference in uniform displacement error.

[0046] like Figure 6As shown, during the area switching process, the transfer substrate undergoes a variable speed motion that first accelerates and then decelerates. Determining the variable speed displacement error during area switching includes the following steps: Based on the theoretical speed and actual speed of the transfer substrate at each moment, the speed change error at each moment is obtained; specifically, the speed change error at each moment is as follows: ; in, For speed change error, The theoretical speed for the transfer substrate speed change. This refers to the actual speed of the transfer substrate.

[0047] Integrating the speed change error over the time interval between speed changes yields the speed change displacement error during the speed change. Specifically, the calculation formula is as follows: ; in, This is for the displacement error during zone change and speed change. This is the time for zone switching. Therefore, the total displacement error is ΔS = .

[0048] A second aspect of the present invention also discloses a motion error compensation device for mass transfer, comprising a transfer energy emitter, a transfer substrate, a carrier substrate, and a control system; the control system includes a data processing module and a control module. The data module is configured as follows: The chip flight inertial displacement error is determined based on the transferred energy, chip mass, and the theoretical velocity difference between the transfer substrate and the receiving substrate during chip flight. The initial set point is adjusted based on the chip's flight inertial displacement error as the first bias, and the coordinates of the first point of action are obtained. Based on the error between the theoretical and actual speeds of the transfer substrate and the receiving substrate, the total displacement error between the previous area transfer stage and the current area transfer stage is determined. The control module is configured as follows: Before transferring the first chip in the current region, the coordinates of the first point of action are adjusted using the total displacement error as the second offset to obtain the coordinates of the second point of action for transferring the chip. At the start of the next area transfer stage, compensation is made by adjusting one or more of the following: the position of the first action point, the area transfer displacement of the transfer substrate, or the position of the receiving substrate, based on the total displacement error. After the area transfer stage ends, the data module is triggered to determine the total displacement error between the previous area transfer stage and the current area transfer stage.

[0049] In this way, the total displacement error of the previous zone-changing stage and the transfer stage can be eliminated to avoid error accumulation.

[0050] For example, when adjusting the position of the point of application based solely on the total displacement error, the total displacement error is eliminated by adjusting the laser output device. The adjustment method could be: using the coordinates of the second point of application as the new coordinates of the first point of application. Specifically, the laser output device could remain stationary, and the laser offset of the output laser could be maintained as the sum of the first offset and the second offset, thus iteratively updating the coordinates of the first point of application to the coordinates of the second point of application. Alternatively, the laser output device could be moved by the amount of the total displacement error, with the laser offset of the output device being the first offset, thereby updating the coordinates of the first point of application to the coordinates of the second point of application.

[0051] For example, when the error is large or higher stability is required, the total displacement error can be eliminated without adjusting the laser output. Instead, it can be eliminated simply by changing the displacement of the transfer substrate during the area-changing stage according to the total displacement error. That is, the total displacement of the transfer substrate during the area-changing stage is the original displacement plus the total displacement error. Alternatively, the total displacement error can be eliminated simply by changing the position of the receiving substrate. That is, the receiving substrate moves relative to the laser emitter by the total displacement error.

[0052] Of course, it is also possible to primarily adjust the position of the point of action, and secondarily adjust the displacement of the transfer substrate and / or the position of the receiving substrate, to form an optical-mechanical collaborative compensation mechanism.

[0053] Preferably, the system further includes a vision module, which is used to detect the deviation between the chip landing point position and the target position in real time when transferring the chip in the current region, and obtain the real-time displacement deviation; the control module is also configured to dynamically correct the coordinates of the second point of action based on the real-time displacement deviation.

[0054] In this way, the coordinates of the second point of action can be dynamically corrected based on the real-time displacement deviation during the transfer, forming a closed-loop self-correction optimization.

[0055] Specifically, the data module includes a first calculation unit, which is configured to calculate the initial vertical velocity of the chip based on the transfer energy and chip mass in the transfer parameters; specifically, the calculation formula is: ; in, Let be the initial velocity of the chip in the vertical direction; This is an empirical coefficient; To transfer energy; For chip quality; The chip's flight time is calculated based on its initial vertical velocity and the vertical distance traveled during the transfer; specifically, the calculation formula is as follows: ; in, For chip flight time, To transfer vertical distance, It is the acceleration due to weight; The chip's flight time and the difference between the theoretical velocities of the transfer substrate and the receiving substrate are used to calculate the chip's flight inertial displacement error. Specifically, the calculation formula is as follows: ; in, This indicates the chip's flight inertial displacement error. This represents the difference in theoretical speed between the transfer substrate and the receiving substrate.

[0056] Thus, by considering the characteristics of laser blasting, the chip's flight time and initial vertical velocity can be predicted, so as to correct the chip's inertial displacement error in advance.

[0057] Specifically, the data module further includes a second calculation unit, a third unit, and a summation unit; the second calculation unit is used to determine the differential displacement error based on the flight time of a single chip and the error between the actual and theoretical speeds of the transfer substrate and the receiving substrate in the current region; preferably, when transferring chips in the current region, the transfer substrate and the receiving substrate adopt a differential uniform speed motion mode, that is, both the transfer substrate and the receiving substrate move at a uniform speed, but the speed ratio between the transfer substrate and the receiving substrate is not equal to 1. In a specific embodiment, such as... Figure 3 The speed curves of the carrier substrate and the transfer substrate shown indicate that during the chip transfer phase, the speed of the carrier substrate along the X direction is n times greater than the speed of the transfer substrate along the X direction. Of course, in other embodiments, the transfer substrate and the receiving substrate may also employ synchronous uniform speed or segmented acceleration / deceleration motion modes.

[0058] The third calculation unit is used to determine the speed-variable displacement error during the area switching process based on the switching time of the previous area switching process and the error between the theoretical and actual speeds of the transfer substrate during the previous area switching process. During the area switching stage, the transfer substrate needs to undergo high-speed acceleration and deceleration to achieve the area jump. The receiving substrate, however, maintains a constant set speed, with minimal speed variation, and therefore its contribution to the speed-variable error during area switching can be ignored. That is, the displacement error during the area switching stage mainly originates from the speed deviation of the transfer substrate during the acceleration and deceleration phases.

[0059] The summation unit integrates the differential uniform displacement error and the variable speed displacement error during zone switching to obtain the total displacement error. Thus, the total displacement error between the previous zone switching stage and the current zone transfer stage is determined based on the error between the theoretical and actual speeds of the transfer substrate and the receiving substrate.

[0060] Specifically, when transferring the chip in the current region, both the transfer substrate and the receiving substrate move at a constant speed, and the second computing unit is configured as follows: The first error value is obtained based on the error between the actual uniform speed and the theoretical uniform speed of the transfer substrate; specifically, the calculation formula is as follows: = - ; in, This is the first error value. To achieve a theoretically uniform transfer speed for the substrate, This represents the actual uniform speed at which the substrate is transferred.

[0061] The second error value is obtained based on the error between the actual uniform speed and the theoretical uniform speed of the substrate; specifically, the calculation formula is as follows: = ; in, This is the first error value. To maintain the theoretical constant speed of the substrate, To ensure the actual uniform speed of the substrate.

[0062] The difference between the first error value and the second error value is used to obtain the relative speed error; The differential uniform displacement error is determined based on the flight time and relative velocity error of a single chip. Specifically, the calculation formula is as follows: ; in, This is for the difference in uniform displacement error.

[0063] Specifically, during the previous area switching process, the transfer substrate undergoes variable speed movement, and the third computing unit is configured as follows: Based on the theoretical speed and actual speed of the transfer substrate at each moment, the speed change error at each moment is obtained; specifically, the speed change error at each moment is as follows: ; in, For speed change error, The theoretical speed for the transfer substrate speed change. This refers to the actual speed of the transfer substrate.

[0064] Integrating the speed change error over the time interval between speed changes yields the speed change displacement error during the speed change. Specifically, the calculation formula is as follows: ; in, This is for the displacement error during zone change and speed change. This is the time for zone switching. Therefore, the total displacement error is ΔS = .

[0065] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made under the concept of the present invention using the contents of the present invention specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method of motion error compensation for mass transfer, characterized by: The method comprises the following steps: Step S1: determining a chip flight inertia displacement error according to a transfer energy, a chip mass, and a theoretical speed difference between the transfer substrate and the receiving substrate when the chip is flying; Step S2: adjusting an initial set point according to the chip flight inertia displacement error as a first bias to obtain a first action point coordinate; Step S3: determining a total displacement error of a previous zone switching stage and a current region transfer stage according to a difference between a theoretical speed and an actual speed of the transfer substrate and the receiving substrate; Step S4: before transferring a first chip in the current region, adjusting the first action point coordinate by taking the total displacement error as a second bias to obtain a second action point coordinate for transferring the chip; Step S5: when a next zone switching stage starts, adjusting one or more of the first action point position, a zone switching displacement of the transfer substrate, or a position of the receiving substrate according to the total displacement error to compensate; and after the zone switching stage ends, returning to step S3.

2. The mass transfer method of claim 1, wherein, The method further comprises the following steps: When transferring a chip in the current region, detecting a deviation between a chip landing point position and a target position in real time based on a configured visual module to obtain a real-time displacement deviation; Dynamically correcting the second action point coordinate according to the real-time displacement deviation.

3. The mass transfer method of claim 1, wherein, The determination of the chip flight inertia displacement error comprises: calculating a chip vertical initial speed based on a transfer energy and a chip mass in transfer parameters; calculating a chip flight time based on the chip vertical initial speed and a transfer vertical distance; calculating the chip flight inertia displacement error based on the chip flight time and a difference between theoretical speeds of the transfer substrate and the receiving substrate.

4. The mass transfer method of claim 1, wherein, The determination of the total displacement error of the previous zone switching stage and the current region transfer stage comprises the following steps: determining a difference displacement error based on a single chip flight time and a difference between actual speeds and theoretical speeds of the transfer substrate and the receiving substrate in the current region; determining a zone switching speed displacement error based on a zone switching time of a previous zone switching process and a difference between a theoretical speed variation speed and an actual speed variation speed of the transfer substrate in the previous zone switching process; integrating the difference uniform speed displacement error and the zone switching speed displacement error to obtain the total displacement error.

5. The mass-transferred motion error compensation method of claim 4, wherein, When transferring a chip in the current region, the transfer substrate and the receiving substrate are both in uniform speed motion, and the determination of the difference displacement error comprises the following steps: obtaining a first error value according to a difference between an actual uniform speed of the transfer substrate and a theoretical uniform speed; obtaining a second error value according to a difference between an actual uniform speed of the receiving substrate and a theoretical uniform speed; obtaining a relative speed error by subtracting the first error value from the second error value; determining the difference uniform speed displacement error according to a single chip flight time and the relative speed error.

6. The mass transfer method of claim 4, wherein, In the previous zone switching process, the transfer substrate is in a speed variation motion of accelerating first and then decelerating, and the determination of the zone switching speed displacement error comprises the following steps: obtaining a speed variation error at each moment according to a theoretical speed variation and an actual speed variation of the transfer substrate at each moment; integrating the speed variation errors in the zone switching time to obtain the zone switching speed displacement error.

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The initial set point is adjusted based on the chip's flight inertial displacement error as the first bias, and the coordinates of the first point of action are obtained. Based on the error between the theoretical and actual speeds of the transfer substrate and the receiving substrate, the total displacement error between the previous area transfer stage and the current area transfer stage is determined. The control module is configured as follows: Before transferring the first chip in the current region, the coordinates of the first point of action are adjusted using the total displacement error as the second offset to obtain the coordinates of the second point of action for transferring the chip. At the start of the next area transfer stage, compensation is made by adjusting one or more of the following: the position of the first action point, the area transfer displacement of the transfer substrate, or the position of the receiving substrate, based on the total displacement error. After the area transfer stage ends, the data module is triggered to determine the total displacement error between the previous area transfer stage and the current area transfer stage.

8. The mass-transferred motion error compensation apparatus of claim 6, wherein, It also includes a vision module, which is used to detect the deviation between the chip landing point position and the target position in real time when transferring the chip in the current area, and obtain the real-time displacement deviation; the control module is also configured to dynamically correct the coordinates of the second point of action based on the real-time displacement deviation.

9. The mass-transferred motion error compensation apparatus of claim 6, wherein, The data module includes a first computing unit, which is configured to: Based on the transfer energy and chip mass in the transfer parameters, the initial vertical velocity of the chip is calculated; The chip's flight time is calculated based on its initial vertical velocity and the vertical distance it travels. The chip's flight time and the difference between the theoretical velocities of the transfer substrate and the receiving substrate are used to calculate the chip's flight inertial displacement error.

10. The mass-transferred motion error compensation apparatus of claim 6, wherein, The data module further includes a second calculation unit, a third unit, and a summation unit; The second calculation unit is used to determine the differential displacement error based on the flight time of a single chip and the error between the actual and theoretical speeds of the transfer substrate and the receiving substrate in the current region. The third calculation unit is used to determine the speed change displacement error of the area switching process based on the area switching time of the previous area switching process and the error between the theoretical speed and the actual speed of the transfer substrate in the previous area switching process. The summation unit is used to integrate the differential uniform displacement error and the zone-changing variable displacement error to obtain the total displacement error.

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