Flexible light-emitting film and preparation method thereof

Abstract

The invention provides a flexible light-emitting film and a preparation method, and relates to the technical field of light-emitting films, the flexible light-emitting film comprises a first main body layer, a conduction structure, an LED chip and a second main body layer, the first main body layer is provided with a first interface layer; the conduction structure is pasted on the first interface layer and is composed of a plurality of warps, and the warps are metal wires; the positive electrode and the negative electrode of the LED chip are respectively conducted with the conduction structure; the second main body layer is provided with a second interface layer; the second main body layer is pasted on the first interface layer through the second interface layer so as to wrap the LED chip and the conduction structure. The first main body layer, the warps and the second main body layer have flexible characteristics, so that the flexible light-emitting film in a real sense can be realized; and the warps are directly adhered to the first main body layer, so that compared with the manner of preparing the warps on the transparent carrier through metallization, exposure, etching and development, the method has the advantages that the waste of metal consumption is effectively reduced, and the process operation flow is simpler, more convenient and quicker.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of light-emitting film, in particular to a flexible light-emitting film and a preparation method thereof. BACKGROUND

[0002] The transparent light-emitting film has a wide range of application scenarios, and is particularly suitable for automotive sunroofs, canopies, rear windows, side windows, corner windows, and home applications that require both transparency and light-emitting effects. Such a film can maintain a transparent state during the day and exhibit a light-emitting effect at night. Currently, there are no large-size flexible light-emitting films on the market, and the manufacturing process of some small-size flexible light-emitting film samples usually involves first coating metal on the entire surface of a transparent carrier to allow the metal to adhere to the surface of the transparent carrier; then obtaining a metal circuit through exposure, etching, and development; and finally connecting the positive and negative electrodes of the LED chip light-emitting body to the conductive circuit through conductive glue. The substrate of the transparent carrier is mainly PET. However, this manufacturing method requires a large amount of metal, resulting in a complex manufacturing process and relatively high cost. SUMMARY

[0003] The purpose of the present application is to improve and innovate in view of the shortcomings and problems in the background art, and to provide a flexible light-emitting film and a preparation method thereof.

[0004] According to a first aspect of the present application, a flexible light-emitting film is provided, comprising: a first main layer; the first main layer has a first interface layer; a conductive structure, the conductive structure is pasted on the first interface layer, and the conductive structure is composed of a plurality of warp threads, the warp threads being metal threads; an LED chip, the positive and negative electrodes of the LED chip are respectively in conduction with the conductive structure, and the conductive structures corresponding to the positive and negative electrodes of the LED chip are separated from each other; a second main layer; the second main layer has a second interface layer; the second main layer is pasted on the first interface layer through the second interface layer to wrap the LED chip and the conductive structure; wherein the first main layer and the second main layer are both made of transparent or translucent flexible glue, and the 180-degree peeling force between the flexible glue and glass is greater than 2N / 25mm, and the elastic modulus in a 25°C environment is greater than 0.02MPA.

[0005] In a further aspect, the positive and negative electrodes of the LED chip are respectively connected to the separated conductive structures through conductive glue.

[0006] In a further aspect, the LED chip is pasted on the first interface layer, and the positive and negative electrodes of the LED chip are tightly attached to the separated conductive structures.

[0007] A further embodiment is that the height of the first main body layer is between 25 micrometers and 500 micrometers, the height of the second main body layer is between 200 micrometers and 500 micrometers, and the height of the LED chip is less than 200 micrometers.

[0008] A further embodiment is that the width of the conductive structure is greater than the width of the two meridians, and the width of the conductive structure is less than or equal to the width of the LED chip.

[0009] According to a second aspect of the present invention, a rigid light-emitting film is provided, comprising a flexible light-emitting film as described in any of the above claims, wherein the side of the first main layer away from the first interface layer is bonded to glass, and the side of the second main layer away from the second interface layer is also bonded to glass, such that the flexible light-emitting film is adhered between the two glass layers.

[0010] According to a third aspect of the present invention, a method for preparing a flexible light-emitting film is provided, specifically comprising the following steps: The surface protective layer on the first main body layer is peeled off to expose the first interface layer; The conductive structure is attached to the first interface layer of the first main body layer, wherein the conductive structure is composed of several warp lines, and the warp lines are metal wires; The LED chip is fixed on the first main body layer with the warp threads pasted on it, ensuring that the positive and negative terminals of the LED chip are respectively connected to the mutually separated conductive structures; Remove the carrier protective layer on the second main layer to expose the second interface layer; The second interface layer of the second main body layer is pasted onto the first interface layer to wrap the LED chip and the conductive structure. The first and second main layers are both made of transparent or semi-transparent flexible colloids, and the 180-degree peel force between the flexible colloid and the glass is greater than 2N / 25mm, and the elastic modulus at 25°C is greater than 0.02MPA.

[0011] A further approach is that the preparation process of the flexible colloid is as follows: Dihydroxypolydimethylsiloxane was used as the base adhesive, and the mixture was cooled after vacuuming. A diluent was added and stirred until homogeneous to obtain the first mixture. Methyltriacetoxysilane was used as the base adhesive, and the mixture was cooled after vacuuming. Stabilizer, crosslinking agent and curing aid were added sequentially and stirred until homogeneous to obtain a second mixture. The first and second mixtures are stirred and mixed evenly to obtain the raw material liquid corresponding to the flexible colloid.

[0012] A further approach is that the preparation process of the flexible colloid is as follows: Methyl vinyl polysiloxane was used as the base adhesive, and methyl MQ resin, phenyl MQ resin and crosslinking agent were added sequentially and stirred until uniform; A catalyst is introduced and stirred until homogeneous to initiate the curing reaction; Introduce the inhibitor and diluent and continue stirring until thoroughly mixed; After filtration and degassing, the raw material liquid corresponding to the flexible colloid is obtained.

[0013] A further approach involves the following fabrication processes for the first and second main body layers: The carrier protective layer is released from the unwinding roll, passes through the tension roll and the support roll, and is then recycled back onto the take-up roll. The raw material liquid corresponding to the flexible colloid is dripped onto the carrier protective layer before passing through the tension roller and support roller. Adjust the gap between the thickness roller and the support roller to control the thickness of the flexible colloid; The carrier protective layer after passing through the tension roller and support roller is heated to cure the flexible colloid. A surface protective layer is attached to the surface of the cured flexible colloid; wherein the surface protective layer is attached to the surface of the cured flexible colloid via its corresponding adjusting roller and support roller.

[0014] A further option is to heat the flexible colloid on the carrier protective layer to 135-165℃.

[0015] Compared with existing technologies, the advantages of this invention are as follows: This invention provides a flexible light-emitting film. The first main layer, warp threads, and second main layer of the flexible light-emitting film all possess flexible properties, enabling a truly flexible light-emitting film. Moreover, the warp threads are directly adhered to the first main layer. Compared with existing technologies that prepare warp threads on a transparent PET carrier through metal plating, exposure, etching, and development, this invention effectively reduces metal waste and simplifies the process. Furthermore, this invention can connect the positive and negative electrodes of the LED chip to the conductive structure via conductive colloid, and also fix the LED chip through the adhesiveness of the first interface layer. When the LED chip is directly fixed to the first interface layer, the elimination of conductive colloid simplifies the manufacturing process and makes it easier to fix the LED chip to the first main layer. Finally, after removing the carrier protective layer of the first main layer and the surface protective layer of the second main layer, the flexible colloid allows for direct bonding with glass to form a rigid light-emitting film. Traditional rigid light-emitting films require the addition of PVB or EVA as an adhesive layer between the glass and the light-emitting film. Therefore, the thickness of the combined rigid light-emitting film can be reduced, achieving lightweighting and cost reduction. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the LED chip and conductive structure arrangement on a flexible light-emitting film provided in the first embodiment of the present invention. Figure 2 This is a schematic cross-sectional view of a flexible light-emitting film provided in the first embodiment of the present invention; Figure 3 This is a schematic flowchart of a method for preparing a flexible light-emitting film according to the second embodiment of the present invention; Figure 4 This is a schematic diagram of the preparation process of the first host layer and the second host layer provided in the second embodiment of the present invention.

[0018] Reference numerals: 1. Carrier protective layer; 2. First main body layer; 201. First interface layer; 3. Meridian; 4. Second main body layer; 401. Second interface layer; 5. LED chip; 6. Surface protective layer; 7. Conductive structure. Detailed Implementation

[0019] To make the objectives, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] Example 1 Please see Figures 1-2 The present invention provides a flexible light-emitting film, comprising a first main body layer 2, a conductive structure 7, an LED chip 5, and a second main body layer 4.

[0022] In this embodiment, the first main body layer 2 has a first interface layer 201; the first main body layer 2 is made of a transparent or semi-transparent flexible colloid, and the flexible colloid is adhesive. A surface protective layer 6 is provided on the side of the first main body layer 2 close to the first interface layer 201, and a carrier protective layer 1 is provided on the side of the first main body layer 2 away from the first interface layer 201; preferably, the surface protective layer 6 is a release film, and the carrier protective layer 1 can be made of materials such as PET or CPP; after peeling off the surface protective layer 6, the adhesive first interface layer 201 can be exposed.

[0023] Optionally, the flexible colloid corresponding to the first main body layer 2 has a transmittance of more than 80% under visible light, a haze of less than 0.5%, an elastic modulus of more than 0.02 MPa at 25°C, and a 180-degree peel force between the first interface layer 201 of the first main body layer 2 and the glass at 25°C that is greater than 2 N / 25 mm. In addition, the height H2 of the first main body layer 2 is between 25 micrometers and 500 micrometers.

[0024] In this embodiment, the conductive structure 7 is adhered to the first interface layer 201 under pressure. The conductive structure 7 is composed of individual warp threads 3, such as... Figure 1 As shown, the warp threads 3 can be arranged closely together or with a certain gap. The conductive structure 7 is used to conduct electricity with the positive and negative terminals of the LED chip 5, and the conductive structure 7 is disconnected at the LED chip 5 to ensure that the positive and negative terminals of the LED chip 5 are mutually insulated. Preferably, the width W1 of the conductive structure 7 needs to be at least greater than the width of two warp threads 3, that is, at least two warp threads 3 need to be arranged closely together or with a certain gap, and the width W1 of the conductive structure 7 is less than or equal to the width of the LED chip 5.

[0025] Optionally, the warp wire 3 can be a metal wire with width and thickness, or a metal wire with diameter; preferably, the metal wire is tungsten wire or copper wire. When the warp wire 3 is a metal wire with width and thickness, the width of the warp wire 3 is preferably less than 10 micrometers, and the thickness of the warp wire 3 is less than 15 micrometers; preferably, the thickness of the warp wire 3 is set to 7 micrometers, making the warp wire 3 invisible to the naked eye, thus not affecting the transparency of the flexible light-emitting film; this allows the flexible light-emitting film to maintain good transparency during the day, and to emit light at night when driving the LED chip 5. When the warp wire 3 is a metal wire with diameter, the diameter of the warp wire 3 is preferably set to less than 10 micrometers.

[0026] It should be noted that the dimensions of meridian 3 provided above are merely an example, and the specific dimensions of meridian 3 can be set according to requirements.

[0027] The positive and negative terminals of the LED chip 5 are respectively connected to the conductive structure 7, and the conductive structures 7 corresponding to the positive and negative terminals of the LED chip 5 are separated from each other, such as... Figure 1 As shown, the LED chips 5 can be arranged in an orderly or random manner, which can be determined by those skilled in the art according to the actual situation, and this application does not make specific limitations. The height H3 of the LED chip 5 is preferably less than 200 micrometers; when all the conductive structures 7 are gathered to the peripheral control board, the peripheral control board drives the LED chips 5, which can realize the light-emitting effect of the flexible light-emitting film.

[0028] In this application, the positive and negative electrodes of the LED chip 5 are connected to the conductive structure 7 via a conductive colloid, which can be conductive silver paste. After the warp thread 3 is adhered to the first interface layer 201 under pressure, the positive and negative electrodes of the LED chip 5 are then bonded to the conductive structure 7 using conductive silver paste, thereby fixing the LED chip 5 to the warp thread 3.

[0029] In some preferred embodiments, the LED chip 5 can also be directly pasted onto the first interface layer 201, and the LED chip 5 is fixed by the adhesiveness of the first interface layer 201; at this time, the positive and negative electrodes of the LED chip 5 are tightly attached to the conductive structure 7; since the conductive silver paste is omitted, the manufacturing process is simpler, and the LED chip 5 can be fixed onto the first main body layer 2 more conveniently.

[0030] When the LED chip 5 is directly pasted onto the first interface layer 201, the LED chip 5 is fixed in place by the adhesive of the first interface layer 201, while ensuring that the positive and negative electrodes of the LED chip 5 are tightly bonded to the conductive structure 7. At this time, by controlling the pressure during the pressing process, the warp 3 is at least partially embedded in the first main body layer 2, for example, more than two-thirds of the warp 3 is embedded in the first main body layer 2 in the height direction; then the LED chip 5 is directly pasted onto the first interface layer 201.

[0031] The second main body layer 4 has a second interface layer 401. The second main body layer 4 is also made of a transparent or semi-transparent flexible colloid, and a carrier protective layer 1 is provided on the side of the second main body layer 4 close to the second interface layer 401, and a surface protective layer 6 is provided on the side of the second main body layer 4 away from the second interface layer 401. Under pressure, the second interface layer 401 of the second main body layer 4 is adhered to the first interface layer 201, thus encapsulating the LED chip 5 and the conductive structure 7.

[0032] The second main body layer 4 also adopts a transparent flexible colloid. The corresponding flexible colloid has a visible light transmittance of more than 80%, a haze of less than 0.5%, an elastic modulus of more than 0.02 MPa at 25°C, and a 180-degree peel force between the second interface layer 401 of the second main body layer 4 and the glass at 25°C that is greater than 2 N / 25 mm. Preferably, the height H1 of the second main body layer 4 is between 200 micrometers and 500 micrometers.

[0033] Furthermore, after removing the carrier protective layer of the first main body layer 2 and the surface protective layer 6 of the second main body layer 4, the flexible colloid can be directly bonded to the glass, thus adhering the flexible light-emitting film between the two glass layers to form a rigid light-emitting film. This rigid light-emitting film can replace the traditional assembly, which requires adding PVB or EVA as an adhesive layer between the glass and the light-emitting film. Therefore, the thickness of the resulting rigid light-emitting film can be reduced, achieving lightweighting and cost reduction.

[0034] In summary, this invention provides a flexible light-emitting film. The first main body layer 2, warp threads 3, and second main body layer 4 of the flexible light-emitting film all possess flexible properties, enabling a truly flexible light-emitting film. Moreover, the warp threads 3 are directly adhered to the first main body layer 2. Compared to existing technologies that prepare the warp threads 3 on a transparent PET carrier through metal plating, exposure, etching, and development, this invention effectively reduces metal waste and simplifies and speeds up the process. Furthermore, this invention can connect the positive and negative electrodes of the LED chip 5 to the conductive structure 7 via conductive colloid, and can also fix the LED chip 5 using the adhesive properties of the first interface layer 201. When the LED chip 5 is directly fixed to the first interface layer 201, the elimination of conductive silver paste simplifies the manufacturing process and makes it easier to fix the LED chip 5 to the first main body layer 2. Finally, after removing the carrier protective layer 1 of the first main body layer 2 and the surface protective layer 6 of the second main body layer 4, the flexible colloid can be directly combined with the glass to form a rigid light-emitting film. Traditional rigid light-emitting films require an additional PVB or EVA layer between the glass and the film as an adhesive layer. Therefore, the thickness of the resulting rigid light-emitting film can be reduced, achieving lightweighting and cost reduction.

[0035] Example 2 Please see Figure 3 The present invention also provides a method for preparing a flexible light-emitting film, which is applied to the preparation of the flexible light-emitting film described in Example 1, and specifically includes the following steps: Step S101: Remove the surface protective layer 6 on the first main body layer 2 to expose the first interface layer 201; The first main body layer 2 is made of a transparent or semi-transparent flexible colloid, and the flexible colloid is viscous. The flexible colloid has a transmittance of more than 80% under visible light, a haze of less than 0.5%, an elastic modulus of more than 0.02 MPa at 25°C, and a 180-degree peel force between the first interface layer 201 on the first main body layer 2 and the glass at 25°C that is greater than 2 N / 25 mm.

[0036] Step S102: Attach the conductive structure 7 to the first interface layer 201 of the first main body layer 2; wherein, the conductive structure 7 is composed of several warp wires 3, and the warp wires 3 are metal wires; It is understandable that, since the first interface layer 201 on the first main body layer 2 is adhesive, the warp 3 can be directly pasted onto the first main body layer 2. Compared with the existing technology that prepares the warp 3 on the transparent carrier PET by means of metal plating, exposure, etching and development, the present invention not only effectively reduces the waste of metal usage, but also makes the process operation process simpler and faster.

[0037] Step S103: Fix the LED chip 5 onto the first main body layer 2 on which the warp threads 3 are pasted, ensuring that the positive and negative terminals of the LED chip 5 are respectively connected to the mutually separated conductive structure 7. Optionally, the positive and negative electrodes of the LED chip 5 are connected to the conductive structure 7 via conductive adhesive, thereby fixing the LED chip 5 in place. Preferably, the conductive adhesive can be conductive silver paste; after the warp thread 3 is adhered to the first interface layer 201 under pressure, the positive and negative electrodes of the LED chip 5 are then bonded to the conductive structure 7 via conductive silver paste, thereby fixing the LED chip 5 to the warp thread 3.

[0038] In some preferred embodiments, the LED chip 5 can also be directly pasted onto the first interface layer 201, and the LED chip 5 can be fixed by the adhesiveness of the first interface layer 201; at this time, the positive and negative electrodes of the LED chip 5 are tightly attached to the conductive structure 7; since the conductive silver paste is omitted, the manufacturing process is simpler, and the LED chip 5 can be fixed onto the first main body layer 2 more conveniently.

[0039] Step S104: Remove the carrier protective layer 1 on the second main body layer 4 to expose the second interface layer 401; The second main body layer 4 also uses a transparent or semi-transparent flexible colloid. The corresponding flexible colloid has a visible light transmittance of more than 80%, a haze of less than 0.5%, an elastic modulus of more than 0.02 MPa at 25°C, and a 180-degree peel force between the second interface layer 401 of the second main body layer 4 and the glass at 25°C that is greater than 2 N / 25 mm.

[0040] Step S105: Attach the second interface layer 401 of the second main body layer 4 to the first interface layer 201 to wrap the LED chip 5 and the conductive structure 7. It should be noted that after removing the carrier protective layer 1 of the first main body layer 2 and the surface protective layer 6 of the second main body layer 4, the flexible colloid can be directly bonded to the glass using its adhesive properties, thus adhering the flexible light-emitting film between the two glass layers to form a rigid light-emitting film. Traditional rigid light-emitting films require the addition of PVB or EVA as an adhesive layer between the glass and the light-emitting film. Therefore, the thickness of the resulting rigid light-emitting film can be reduced, achieving lightweighting and cost reduction.

[0041] Optionally, the preparation process of the flexible colloid specifically includes the following steps: Step S201: Using dihydroxy polydimethylsiloxane as the base adhesive, the mixture is cooled after vacuuming; a diluent is added and stirred until homogeneous to obtain the first mixture. Specifically, the weight of dihydroxypolydimethylsiloxane is 90-120. It is vacuumed for 1-2 hours at 100-150 degrees Celsius and a vacuum degree greater than 0.08 PA, and then cooled to below 20 degrees Celsius before being placed in the reaction vessel.

[0042] Specifically, the diluent can be low-viscosity dimethyl silicone oil, with a weight ratio of 1-3 parts. The base adhesive and the diluent should be mixed and stirred for 40-60 minutes.

[0043] Step S202: Using methyltriacetoxysilane as the base adhesive, the mixture is cooled after vacuuming; stabilizer, crosslinking agent and curing aid are added sequentially and stirred until homogeneous to obtain the second mixture; It should be noted that the weight of methyltriacetoxysilane is 90-120. It is evacuated at 100-150 degrees and a vacuum degree greater than 0.08 PA for 1-2 hours, and then cooled to below 20 degrees before being placed into the reaction vessel.

[0044] The stabilizer can be polyethylene glycol, with a weight of 2-5 parts. The base adhesive and stabilizer are mixed and stirred for 30-50 minutes, and then the crosslinking agent is added. The crosslinking agent can be tetraethyl orthosilicate, with a weight of 5-12 parts. The mixture is stirred for 10-30 minutes. Finally, the curing aid is added. The curing aid can be calcium carbonate. The mixture is stirred for 20-40 minutes.

[0045] Step S203: Stir and mix the first mixture and the second mixture evenly to obtain the raw material liquid corresponding to the flexible colloid.

[0046] When using, the first and second mixtures are introduced into the liquid tank at a 1:1 ratio and stirred evenly before use.

[0047] Optionally, the preparation process of the flexible colloid may further include the following steps: Step 301: Using methyl vinyl polysiloxane as the base adhesive, methyl MQ resin, phenyl MQ resin and crosslinking agent are added sequentially and stirred until uniformly mixed; Specifically, the methyl vinyl polysiloxane is 10-20 parts by weight, the methyl MQ resin is 20-40 parts by weight, the phenyl MQ resin is 4-8 parts by weight, and the crosslinking agent may include phenyl vinyl Q type silicone oil and hydrogen-containing silicone oil, wherein the phenyl vinyl Q type silicone oil is 2-6 parts by weight and the hydrogen-containing silicone oil is 0.2-0.8 parts by weight, and the mixture is stirred and mixed evenly at 25-35℃.

[0048] Step 302: Introduce the catalyst and stir to mix evenly to initiate the curing reaction; The catalyst can be a platinum catalyst to initiate the curing reaction, and its weight is 0.2-0.6%.

[0049] Step 303: Introduce the inhibitor and diluent and continue stirring to mix thoroughly; Specifically, the inhibitor can be ethynylcycloethanol, with a weight of 0.1-0.6; the diluent can be ethyl acetate, with a weight of 16-24.

[0050] Step 304: After filtration and degassing, the raw material liquid corresponding to the flexible colloid is obtained.

[0051] In practical applications, the raw material solution corresponding to the flexible colloid can be prepared by mixing the two components corresponding to steps 201-203; or, the raw material solution corresponding to the flexible colloid can be prepared by mixing the single components corresponding to steps 301-304. There is no specific limitation here, and it depends on the application environment.

[0052] Please see Figure 4 In some preferred embodiments, the preparation process of the first main body layer 2 and the second main body layer 4 is as follows: Step 401: Release the carrier protective layer 1 from the unwinding roller, pass through the tension roller and the support roller, and then retract it onto the take-up roller; Step 402: Drop the raw material liquid corresponding to the flexible colloid onto the carrier protective layer 1 before passing through the tension roller and support roller; Specifically, the raw material liquid corresponding to the flexible colloid is placed in a liquid tank and dripped onto the carrier protective layer 1 through a liquid delivery pipe and liquid outlet. Depending on the width of the carrier protective layer 1, multiple liquid outlets (left, center, and right) can be used to ensure that the flexible colloid raw material liquid is evenly spread on the carrier protective layer 1.

[0053] Step 403: Adjust the gap between the thickness roller and the support roller to control the thickness of the flexible colloid; Step 403: Heat the carrier protective layer after passing through the tension roller and support roller to solidify the flexible colloid; Specifically, heating elements are designed on both the upper and lower surfaces of the carrier protective layer 1. Heating is typically achieved using LED mercury lamps or UV lamps. Each lamp can be independently controlled to turn on and off, and different intensities of heat irradiation are applied based on the thickness of the flexible colloid. Simultaneously, the intensity of heat irradiation on the flexible colloid can be controlled by adjusting the unwinding and rewinding speeds. Preferably, the heating temperature of the flexible colloid on the carrier protective layer 1 is 135-165℃.

[0054] Step 404: Apply a surface protective layer 6 to the surface of the cured flexible colloid; wherein the surface protective layer 6 is applied to the surface of the cured flexible colloid via its corresponding adjusting roller and support roller.

[0055] In this process, after the flexible colloid is cured by heating, a release film needs to be attached to its surface. The release film is attached to the surface of the cured flexible colloid by a release film adjusting roller, thereby attaching a surface protective layer 6 to the surface of the cured flexible colloid. After attaching the surface protective layer 6, the colloid is then wound up.

[0056] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Parts not described in detail in this specification are prior art known to those skilled in the art.

Claims

1. A flexible light-emitting film, characterized in that, include: First main body layer (2); the first main body layer (2) has a first interface layer (201); Conductive structure (7), the conductive structure (7) is pasted on the first interface layer (201), the conductive structure (7) is composed of several warp lines (3), the warp lines (3) are metal wires; LED chip (5), the positive and negative terminals of the LED chip (5) are respectively connected to the conductive structure (7), and the conductive structures (7) corresponding to the positive and negative terminals of the LED chip (5) are separated from each other; The second main body layer (4) has a second interface layer (401); the second main body layer (4) is attached to the first interface layer (201) through the second interface layer (401) to enclose the LED chip (5) and the conductive structure (7); The first main body layer (2) and the second main body layer (4) are both made of transparent or semi-transparent flexible colloid, and the 180-degree peel force between the flexible colloid and the glass is greater than 2N / 25mm, and the elastic modulus at 25°C is greater than 0.02MPA.

2. The flexible light-emitting film according to claim 1, characterized in that: The positive and negative electrodes of the LED chip (5) are connected to the conductive structure (7) that is separated from each other through conductive colloid.

3. The flexible light-emitting film according to claim 1, characterized in that: The LED chip (5) is attached to the first interface layer (201), and the positive and negative electrodes of the LED chip (5) are respectively closely attached to the mutually spaced conductive structure (7).

4. The flexible light-emitting film according to claim 1, characterized in that: The height of the first main body layer (2) is between 25 micrometers and 500 micrometers, the height of the second main body layer (4) is between 200 micrometers and 500 micrometers, and the height of the LED chip (5) is less than 200 micrometers.

5. A flexible light-emitting film according to claim 1, characterized in that: The width of the conductive structure (7) is greater than the width of the two meridians (3), and the width of the conductive structure is less than or equal to the width of the LED chip (5).

6. A rigid light-emitting film, comprising a flexible light-emitting film as described in any one of claims 1 to 5, characterized in that: The side of the first main body layer (2) away from the first interface layer (201) is bonded to the glass, and the side of the second main body layer (4) away from the second interface layer (401) is also bonded to the glass, so that the flexible light-emitting film adheres to the two layers of glass.

7. A method for preparing a flexible light-emitting film, characterized in that, Specifically, the following steps are included: The surface protective layer on the first main body layer (2) is peeled off to expose the first interface layer (201). The conductive structure (7) is attached to the first interface layer (201) of the first main body layer (2), wherein the conductive structure (7) is composed of several warp lines (3), and the warp lines (3) are metal wires; Fix the LED chip (5) on the first main body layer (2) with the warp threads (3) pasted on it, and ensure that the positive and negative terminals of the LED chip (5) are connected to the mutually separated conductive structure (7); The carrier protective layer on the second main body layer (4) is torn off to expose the second interface layer (401). The second interface layer (401) of the second main body layer (4) is pasted onto the first interface layer (201) to wrap the LED chip (5) and the conductive structure (7). The first main body layer (2) and the second main body layer (4) are both made of transparent or semi-transparent flexible colloid, and the 180-degree peel force between the flexible colloid and the glass is greater than 2N / 25mm, and the elastic modulus at 25°C is greater than 0.02MPA.

8. The method for preparing a flexible light-emitting film according to claim 7, characterized in that, The specific preparation process of the flexible colloid is as follows: Dihydroxypolydimethylsiloxane was used as the base adhesive, and the mixture was cooled after vacuuming. A diluent was added and stirred until homogeneous to obtain the first mixture. Methyltriacetoxysilane was used as the base adhesive, and the mixture was cooled after vacuuming. Stabilizer, crosslinking agent and curing aid were added sequentially and stirred until homogeneous to obtain a second mixture. The first and second mixtures are stirred and mixed evenly to obtain the raw material liquid corresponding to the flexible colloid.

9. The method for preparing a flexible light-emitting film according to claim 7, characterized in that, The specific preparation process of the flexible colloid is as follows: Methyl vinyl polysiloxane was used as the base adhesive, and methyl MQ resin, phenyl MQ resin and crosslinking agent were added sequentially and stirred until uniform; A catalyst is introduced and stirred until homogeneous to initiate the curing reaction; Introduce the inhibitor and diluent and continue stirring until thoroughly mixed; After filtration and degassing, the raw material liquid corresponding to the flexible colloid is obtained.

10. A method for preparing a flexible light-emitting film according to claim 8 or 9, characterized in that, The preparation process of the first main body layer (2) and the second main body layer (4) is as follows: The carrier protective layer (1) is released from the unwinding roll, passes through the tension roll and the support roll, and is then recycled back onto the winding roll; The raw material liquid corresponding to the flexible colloid is dripped onto the carrier protective layer (1) before passing through the tension roller and the support roller; Adjust the gap between the thickness roller and the support roller to control the thickness of the flexible colloid; The carrier protective layer (1) after passing through the tension roller and the support roller is heated to solidify the flexible colloid. A surface protective layer (6) is attached to the surface of the cured flexible colloid; wherein the surface protective layer (6) is attached to the surface of the cured flexible colloid through its corresponding adjusting roller and support roller.

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