Packaging structure and preparation method thereof, preparation method of battery and battery

Abstract

The invention provides a packaging structure and a preparation method thereof, a preparation method of a battery and the battery. The packaging structure comprises at least one film layer stacking structure, the film layer stacking structure comprises a substrate layer, a first packaging film layer, a bonding layer and a second packaging film layer which are stacked in sequence, the first packaging film layer comprises at least one first inorganic film layer and at least one second inorganic film layer, and the first inorganic film layer and the second inorganic film layer are made of different materials. The first inorganic film layer and the second inorganic film layer are stacked in the thickness direction of the packaging structure. According to the packaging structure, the sealing effect and the water and oxygen blocking capacity of the packaging structure are effectively improved, the packaging effect on the battery module is further improved, and the durability of the battery is enhanced.

Description

Technical Field

[0001] This application relates to the field of battery technology, specifically to a packaging structure and its preparation method, a battery preparation method, and a battery. Background Technology

[0002] Perovskite photovoltaics is a novel solar cell technology with a wide range of applications, capable of meeting the demands of various fields for efficient, lightweight, and flexible solar power. By fabricating ultralight and ultrathin flexible perovskite devices on micron-scale polymer substrates, the requirements for high efficiency and ultrathinness can be met, while also possessing outstanding high-quality power-to-weight ratio. However, current perovskite solar cells suffer from poor moisture barrier properties after encapsulation, leaving them susceptible to moisture and oxygen intrusion that can affect cell durability. Summary of the Invention

[0003] In view of this, embodiments of this application provide a packaging structure and its preparation method, a battery preparation method, and a battery, which solve the problems in the prior art.

[0004] The first aspect of this application provides an encapsulation structure, which includes at least one film layer stacked structure. The film layer stacked structure includes a substrate layer, a first encapsulation film layer, an adhesive layer, and a second encapsulation film layer stacked sequentially. The first encapsulation film layer includes a plurality of first inorganic film layers and a plurality of second inorganic film layers. The materials of the first inorganic film layers and the second inorganic film layers are different. The first inorganic film layers and the second inorganic film layers are stacked along the thickness direction of the encapsulation structure.

[0005] In one embodiment, at least one first inorganic film layer includes multiple first inorganic film layers, and / or at least one second inorganic film layer includes multiple second inorganic film layers. In the same first encapsulation film layer, the first inorganic film layer and the second inorganic film layer are alternately stacked along the thickness direction of the encapsulation structure. Optionally, ten of each of the first and second inorganic membrane layers are provided; Optionally, the material of the first inorganic film layer includes aluminum oxide; Optionally, the thickness of the first inorganic film layer is greater than 1 nanometer and less than or equal to 2 nanometers; Optionally, the material of the second inorganic film layer includes silicon oxide; Optionally, the thickness of the second inorganic film layer is greater than 0.5 nanometers and less than or equal to 1 nanometer; Optionally, the thickness of the first encapsulation film layer is greater than or equal to 25 nanometers and less than or equal to 30 nanometers.

[0006] In one embodiment, the adhesive layer material comprises an organic material doped with at least one sheet-like barrier portion; Optionally, the extension direction of the barrier portion intersects the thickness direction of the adhesive layer; Optionally, at least one barrier portion includes at least one first barrier portion and at least one second barrier portion, wherein the first barrier portion and the second barrier portion are stacked alternately along the thickness direction of the adhesive layer. Optionally, adjacent first and second blocking portions may partially overlap; Optionally, at least one barrier portion includes at least three barrier portions arranged along the thickness direction of the encapsulation structure; Optionally, multiple barrier portions in the same layer may extend along a first direction and be arranged along a second direction, with the first and second directions intersecting. Optionally, the length of the barrier portion is greater than or equal to 0.1 micrometers and less than or equal to 10 micrometers, and / or the width of the barrier portion is greater than or equal to 0.1 micrometers and less than or equal to 10 micrometers, and / or the thickness of the barrier portion is greater than or equal to 0.3 nanometers and less than or equal to 100 nanometers, and / or the ratio of the length to the thickness of the barrier portion is greater than or equal to 100; and / or the ratio of the width to the thickness of the barrier portion is greater than or equal to 100. Optionally, the organic material of the adhesive layer includes epoxy resin; Optionally, the material of the barrier includes at least one of Maxene and hexagonal boron nitride; Optionally, the doping concentration of Maxene is lower than that of hexagonal boron nitride; Optionally, the doping concentration of Maxene is greater than or equal to 0.5% by weight and less than or equal to 1% by weight. Optionally, the doping concentration of hexagonal boron nitride is greater than 1 weight percentage and less than or equal to 2 weight percentage; Optionally, the thickness of the adhesive layer is greater than 45 micrometers and less than or equal to 50 micrometers.

[0007] In one embodiment, the material of the second encapsulation film layer includes an inorganic material; Optionally, the material of the second encapsulation film layer is the same as that of one of the first inorganic film layer and the second inorganic film layer; Optionally, the material of the second encapsulation layer includes aluminum oxide; Optionally, the thickness of the second encapsulation film layer is greater than 25 nanometers and less than or equal to 30 nanometers; Optionally, the base layer may be made of organic material; Optionally, the base layer can be a flexible structure; Optionally, the base layer material includes at least one of polyethylene terephthalate and polyimide; Optionally, the thickness of the substrate layer is greater than 45 micrometers and less than or equal to 50 micrometers; Optionally, at least one film-layer stacked structure includes a first film-layer stacked structure as a substrate and a second film-layer stacked structure as a cover plate, wherein at least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure that encapsulates the battery module, and the battery module is located between the substrate and the cover plate. Optionally, along the direction away from the battery module, the film stacking structure includes a second encapsulation film layer, an adhesive layer, a first encapsulation film layer, and a substrate layer stacked in sequence.

[0008] In one embodiment, at least one film-layer stacked structure includes a first film-layer stacked structure as a substrate and a second film-layer stacked structure as a cover plate. The encapsulation structure also includes an encapsulating adhesive layer located between the substrate and the cover plate. The substrate, the cover plate, and the encapsulating adhesive layer work together to form an encapsulation structure that encapsulates the battery module. The encapsulating adhesive layer surrounds the periphery of the battery module, and the battery module is located between the substrate and the cover plate. Optionally, along the direction away from the battery module, the film stacking structure includes a second encapsulation film layer, an adhesive layer, a first encapsulation film layer, and a substrate layer stacked sequentially. Optionally, the orthographic projection of the first encapsulation film layer on the substrate completely covers the orthographic projection of the second encapsulation film layer on the substrate and the orthographic projection of the adhesive layer on the substrate, and the edge of the orthographic projection of the first encapsulation film layer on the substrate does not coincide with the edge of the orthographic projection of the adhesive layer on the substrate, and the edge of the orthographic projection of the first encapsulation film layer on the substrate and the edge of the orthographic projection of the second encapsulation film layer on the substrate do not coincide. The encapsulating adhesive layer is located between the first encapsulation film layer on the substrate and the first encapsulation film layer on the cover plate, and the side of the encapsulating adhesive layer closer to the battery module contacts the adhesive layer and the second encapsulation film layer. Optionally, the material for the encapsulating adhesive layer includes butyl rubber.

[0009] A second aspect of this application provides a method for fabricating a packaging structure, comprising: Provide a base layer; A first encapsulation film layer is prepared on one side surface of the substrate layer. The first encapsulation film layer includes at least one first inorganic film layer and at least one second inorganic film layer. The materials of the first inorganic film layer and the second inorganic film layer are different. The first inorganic film layer and the second inorganic film layer are stacked along the thickness direction of the encapsulation structure. An adhesive layer is prepared on the surface of the first encapsulation film layer away from the substrate layer; A second encapsulation film layer is prepared on the side of the adhesive layer away from the first encapsulation film layer.

[0010] In one embodiment, at least one first inorganic film layer comprises a plurality of first inorganic film layers, and / or at least one second inorganic film layer comprises a plurality of second inorganic film layers, wherein preparing the first encapsulation film layer on one side surface of the substrate layer comprises: Along the thickness direction of the encapsulation structure, a first inorganic film layer and a second inorganic film layer are alternately deposited on one side surface of the substrate layer; Optionally, preparing an adhesive layer on the surface of the first encapsulation film layer away from the substrate layer includes: At least one sheet-like barrier portion is incorporated into an epoxy resin to form an adhesive material. An adhesive material is applied to the surface of the first encapsulation film layer away from the substrate layer, and the adhesive material is cured to form an adhesive layer; Optionally, preparing a second encapsulation film layer on the surface of the adhesive layer away from the first encapsulation film layer includes: Atomic layer deposition technology is used to deposit a second encapsulation film layer on the surface of the adhesive layer away from the first encapsulation film layer. The material of the second encapsulation film layer includes alumina. The alumina and the epoxy resin in the adhesive layer react to form an interface bonding layer.

[0011] The third aspect of this application provides a method for manufacturing a battery, the battery including a battery module and the encapsulation structure of the first aspect of this application, at least one film layer stacking structure including a first film layer stacking structure and / or a second film layer stacking structure; The methods for preparing batteries include: The battery module is fabricated on one side of the substrate; A cover plate is provided on the side of the battery module away from the substrate and on the side of the substrate close to the battery module. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure that encapsulates the battery module. The substrate is a first film layer stacked structure, or the cover plate is a second film layer stacked structure. or, The methods for preparing batteries include: The battery module is fabricated on one side of the substrate; An encapsulating adhesive layer is prepared around the battery module on the side of the substrate closest to the battery module. A cover plate is provided on the side of the battery module away from the substrate and on the side of the encapsulating adhesive layer away from the substrate. The substrate, the cover plate, and the encapsulating adhesive layer cooperate to form an encapsulation structure that encapsulates the battery module. The substrate is a first film layer stacked structure, or the cover plate is a second film layer stacked structure. or, The methods for preparing batteries include: A first film layer stack structure is prepared as a substrate; A battery module is fabricated on one side of the first film layer stacked structure; A second film-layer stacked structure is prepared as a cover plate on the side of the battery module away from the first film-layer stacked structure and on the side of the first film-layer stacked structure close to the battery module. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure that encapsulates the battery module. or, The methods for preparing batteries include: A first film layer stack structure is prepared as a substrate; A battery module is fabricated on one side of the first film layer stacked structure; An encapsulating adhesive layer is prepared around the battery module on the side of the first film layer stack structure closest to the battery module. A second film layer stack structure is prepared as a cover plate on the side of the battery module away from the first film layer stack structure and on the side of the encapsulating adhesive layer away from the first film layer stack structure. The substrate, the cover plate and the encapsulating adhesive layer work together to form an encapsulation structure that wraps the battery module.

[0012] The fourth aspect of this application provides a battery, including a battery module and a packaging structure provided in the first aspect of this application, wherein the packaging structure encapsulates and seals the battery module.

[0013] In one embodiment, the battery module includes perovskite battery cells; Optionally, the perovskite solar cell includes a first electrode, a hole transport layer, a perovskite layer, an electron transport layer, a hole blocking layer, and a second electrode, which are stacked sequentially along the thickness direction. Optionally, the material of the first electrode includes at least one of indium tin oxide and indium zinc oxide; Optionally, the thickness of the first electrode is greater than or equal to 150 nanometers and less than or equal to 200 nanometers; Optionally, the hole transport layer material includes at least one of 2,2',7,7'-tetratetra(N,N-di-p-methoxyaniline)-9,9'-helical bisfluorene, copper sulfide cyanide, nickel oxide, cuprous aluminate, and poly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid. Optionally, the thickness of the hole transport layer is greater than or equal to 10 nanometers and less than or equal to 50 nanometers; Optionally, the material of the perovskite layer includes ABX3, where A is a monovalent cation, B is a divalent cation, and X is a monovalent anion; Optionally, the thickness of the perovskite layer is greater than or equal to 500 nanometers and less than or equal to 600 nanometers; Optionally, the material of the electron transport layer includes at least one of titanium dioxide, zinc oxide, tungsten trioxide, tin dioxide, zinc tin oxide, fullerene and its derivatives; Optionally, the thickness of the electron transport layer is greater than or equal to 10 nanometers and less than or equal to 30 nanometers; Optionally, the hole-blocking layer may be made of at least one of 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline and tin oxide. Optionally, the thickness of the hole blocking layer is greater than or equal to 1 nanometer and less than or equal to 20 nanometers; Optionally, the material of the second electrode includes at least one of gold, silver, and copper; Optionally, the thickness of the second electrode is greater than or equal to 50 nanometers and less than or equal to 150 nanometers.

[0014] The encapsulation structure provided in the embodiments of this application includes at least one film-layer stacked structure. This film-layer stacked structure comprises a substrate layer, a first encapsulation film layer, an adhesive layer, and a second encapsulation film layer stacked sequentially. The film-layer stacked structure is configured as a multi-film-layer structure, effectively improving the sealing effect and water and oxygen barrier capability of the encapsulation structure. The first encapsulation film layer comprises at least one first inorganic film layer and at least one second inorganic film layer, which are stacked along the thickness direction of the encapsulation structure. The stacking of the first and second inorganic film layers extends the diffusion path of water and oxygen, significantly reducing the water and oxygen permeability, thereby improving the encapsulation effect of the battery module and enhancing the battery's durability. Attached Figure Description

[0015] Figure 1 This is a top-view perspective structural diagram of the encapsulation structure of a battery module according to one embodiment of this application.

[0016] Figure 2 This is a cross-sectional schematic diagram of a film layer stacking structure according to one embodiment of this application.

[0017] Figure 3 This is a cross-sectional structural diagram of the first encapsulation film layer according to one embodiment of this application.

[0018] Figure 4 This is a cross-sectional structural diagram of the adhesive layer according to one embodiment of this application.

[0019] Figure 5 This is a cross-sectional view of the encapsulation structure of a battery module according to another embodiment of this application.

[0020] Figure 6 This is a schematic diagram of the encapsulation structure of a battery module according to another embodiment of this application.

[0021] Figure 7 This is a flowchart illustrating the main steps of a method for preparing a multi-layer structure according to one embodiment of this application.

[0022] Figure 8 This is a flowchart of some steps in a method for preparing a multi-layer structure according to one embodiment of this application.

[0023] Figure 9 This is a schematic diagram of the structure of a battery module according to one embodiment of this application.

[0024] Explanation of reference numerals in the attached figures 10. Encapsulation structure; 11. Film layer stacking structure; 11a. First film layer stacking structure; 11b. Second film layer stacking structure; 111. Substrate layer; 112. First encapsulation film layer; 1121. First inorganic film layer; 1122. Second inorganic film layer; 113. Adhesive layer; 1131. Organic material; 1132. First barrier portion; 1133. Second barrier portion; 114. Second encapsulation film layer; 12. Encapsulating adhesive layer; 20. Battery module; 21. First electrode; 22. Hole transport layer; 23. Perovskite layer; 24. Electron transport layer; 25. Hole blocking layer; 26. Second electrode. Detailed Implementation

[0025] In related technologies, a glass substrate and an encapsulation layer are used to encapsulate perovskite solar cells. The encapsulation layer includes a main body covering the adhesive layer and an end region connected to the main body. The average density of the end region is several times that of the main body. This structural design, especially the control of the density of the end region of the encapsulation layer, prevents moisture and oxygen from penetrating into the cell. However, the water and oxygen barrier capabilities of existing encapsulation layers need improvement, and the problem of water and oxygen intrusion into the cell still exists during long-term use.

[0026] Based on this, embodiments of this application provide a packaging structure for packaging a battery module. The packaging structure includes at least one film-layer stacked structure, which comprises a substrate layer, a first encapsulation film layer, an adhesive layer, and a second encapsulation film layer stacked sequentially. The first encapsulation film layer includes multiple first inorganic film layers and multiple second inorganic film layers. The materials of the first inorganic film layers and the second inorganic film layers are different. The first and second inorganic film layers are stacked along the thickness direction of the packaging structure. This application effectively improves the sealing effect and water and oxygen barrier capability of the packaging structure, thereby improving the packaging effect of the battery module and enhancing the battery's durability.

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0029] When a structure is referred to as "connected" to another structure, the structure may be directly connected to the other structure or indirectly connected to it by means of one or more intermediate structures placed between them. The terms "first," "second," "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance. At least one may include one or more. At least one may include one or more. At least part may include part or all. The first and second directions intersect, for example, they may be perpendicular. Connections may include direct connections and / or indirect connections.

[0030] Figure 1 This is a top-view perspective structural diagram of the encapsulation structure of a battery module according to one embodiment of this application. Figure 2 This is a cross-sectional schematic diagram of a film layer stacking structure according to one embodiment of this application. Figure 3 This is a cross-sectional structural diagram of the first encapsulation film layer according to one embodiment of this application. Figure 1 , Figure 2 and Figure 3 As shown, in one aspect, the embodiments of this application provide an encapsulation structure. The encapsulation structure 10 includes at least one film layer stacked structure 11. The film layer stacked structure 11 includes a base layer 111 (or base layer or substrate layer), a first encapsulation film layer 112, an adhesive layer 113, and a second encapsulation film layer 114 stacked sequentially. The first encapsulation film layer 112 includes at least one first inorganic film layer 1121 and at least one second inorganic film layer 1122. The materials of the first inorganic film layer 1121 and the second inorganic film layer 1122 are different. The first inorganic film layer 1121 and the second inorganic film layer 1122 are stacked along the thickness direction of the encapsulation structure 10.

[0031] The encapsulation structure 10 of this application includes at least one film-layer stacked structure 11, which comprises a base layer, a first encapsulation film layer 112, an adhesive layer 113, and a second encapsulation film layer 114 stacked sequentially. This film-layer stacked structure 11 effectively improves the sealing effect and water and oxygen barrier capability of the encapsulation structure 10. The first encapsulation film layer 112 comprises at least one first inorganic film layer 1121 and at least one second inorganic film layer 1122, which are stacked along the thickness direction of the encapsulation structure 10. The stacking of the first inorganic film layer 1121 and the second inorganic film layer 1122 can, for example, form an ultra-thin and dense inorganic barrier. The alternating interface between the two forces water and oxygen molecules to bypass the barrier, thereby extending the diffusion path of water and oxygen, significantly reducing the water and oxygen permeability, and thus improving the encapsulation effect of the battery module 20 and enhancing the battery's durability.

[0032] In some embodiments, at least one first inorganic film layer 1121 includes multiple first inorganic film layers 1121, and / or at least one second inorganic film layer 1121 includes multiple second inorganic film layers 1122. Within the same first encapsulation film layer 112, the first inorganic film layers 1121 and second inorganic film layers 1122 are alternately stacked along the thickness direction of the encapsulation structure 10. The alternating stacking of multiple first inorganic film layers 1121 and multiple second inorganic film layers 1122 forms a complex and ordered multilayer structure. This arrangement not only further enhances the density of the inorganic barrier but also forces water and oxygen molecules to bypass more interfaces when passing through the first encapsulation film layer 112, thereby significantly extending the diffusion path of water and oxygen. This significantly reduces the water and oxygen permeability of the encapsulation structure 10, providing more reliable encapsulation protection for the battery module 20 and effectively improving the overall performance and durability of the battery.

[0033] For example, ten first inorganic film layers 1121 and ten second inorganic film layers 1122 are provided to balance the performance and overall thickness of the first encapsulation film layer 112. However, this is not a limitation; in other embodiments, the number of first inorganic film layers 1121 and ten and second inorganic film layers 1122 can be designed as needed.

[0034] In some embodiments, the material of the first inorganic film layer 1121 includes aluminum oxide, and the material of the second inorganic film layer 1122 includes silicon oxide.

[0035] Alumina (e.g., Al2O3) has good UV resistance, while silicon oxide (e.g., SiO2) has good moisture resistance. The two are alternately set to complement each other, which enhances the overall UV resistance and moisture resistance of the first encapsulation film layer 112.

[0036] During the preparation process, the first inorganic film layer 1121 and the second inorganic film layer 1122 can be deposited layer by layer by atomic layer deposition (ALD) technology to ensure the uniformity and density of each layer, thereby constructing an efficient inorganic barrier, effectively preventing water and oxygen intrusion and protecting the internal structure of the battery module 20 from damage.

[0037] For example, the material of the first inorganic film layer 1121 may consist only of alumina, or it may consist of alumina and other materials. For example, the material of the second inorganic film layer 1122 may consist only of silicon oxide, or it may consist of silicon oxide and other materials.

[0038] In terms of specific thickness dimensions, in some embodiments, the thickness of the first inorganic film layer 1121 is greater than 1 nanometer and less than or equal to 2 nanometers. The thickness of the second inorganic film layer 1122 is greater than 0.5 nanometers and less than or equal to 1 nanometer.

[0039] By controlling the thickness of the first inorganic film layer 1121 and the thickness of the second inorganic film layer 1122 within a reasonable range, that is, the thickness of the first inorganic film layer 1121 is greater than 1 nanometer and less than or equal to 2 nanometers, and the thickness of the second inorganic film layer 1122 is greater than 0.5 nanometers and less than or equal to 1 nanometer, the thickness of both the first inorganic film layer 1121 and the second inorganic film layer 1122 reaches the nanometer level. This ensures that both layers exhibit good UV resistance and moisture resistance, while avoiding an excessively large thickness of the entire encapsulation structure 10, which would waste raw materials and result in an excessively large battery size after encapsulation.

[0040] For example, the thickness of the first inorganic film layer 1121 can be 1.2 nanometers, 1.4 nanometers, 1.6 nanometers, 1.8 nanometers, or 2 nanometers, etc. The thickness of the second inorganic film layer 1122 can be 0.6 nanometers, 0.7 nanometers, 0.8 nanometers, 0.9 nanometers, or 1 nanometer, etc.

[0041] like Figure 3 As shown, in terms of overall dimensions, the thickness h1 of the first encapsulation film layer 112 is greater than or equal to 25 nanometers and less than or equal to 30 nanometers, ensuring that the thickness h1 of the first encapsulation film layer 112 is at the nanometer level. For example, the specific value of the thickness h1 of the first encapsulation film layer 112 can be 25 nanometers, 26 nanometers, 27 nanometers, 28 nanometers, 29 nanometers, or 30 nanometers, etc.

[0042] Figure 4 This is a cross-sectional structural diagram of the adhesive layer according to one embodiment of this application. Figure 4 As shown, in some embodiments, the material of the adhesive layer 113 includes an organic material 1131 doped with at least one sheet-like barrier portion.

[0043] At least one sheet-like barrier portion can significantly improve the water and oxygen barrier performance of the adhesive layer 113. The barrier portion can block water and oxygen in the organic material 1131, causing water and oxygen molecules to bypass, thereby extending the path of water and oxygen through the adhesive layer 113, reducing the water and oxygen permeability, and further effectively improving the battery durability.

[0044] like Figure 4 As shown, the organic material 1131 of the adhesive layer 113 includes epoxy resin. Epoxy resin, as the base material of the adhesive layer 113, possesses good adhesive properties and chemical stability. By doping the epoxy resin with at least one sheet-like barrier portion, the water and oxygen barrier properties of the adhesive layer 113 are improved.

[0045] In some embodiments, the extension direction of the barrier portion intersects the thickness direction of the adhesive layer 113 (e.g., it may be parallel to direction X) to improve the water and oxygen barrier properties of the barrier portion. For example, the extension direction of the barrier portion may be perpendicular to the thickness direction of the adhesive layer 113, but it is not limited to this.

[0046] like Figure 4 As shown, further, at least one barrier portion includes at least one first barrier portion 1132 and at least one second barrier portion 1133, with the first barrier portion 1132 and the second barrier portion 1133 staggered and stacked along the thickness direction of the adhesive layer 113. For example, adjacent first barrier portions 1132 and second barrier portions 1133 partially overlap. For example, adjacent first barrier portions 1132 and second barrier portions 1133 are staggered. This design causes water and oxygen molecules to bypass the multiple overlapping first barrier portions 1132 and second barrier portions 1133 when passing through the adhesive layer 113, similar to following an S-shaped or serpentine path. Figure 4 (In the direction indicated by the middle arrow) it detours, thus extending the water-oxygen permeation path.

[0047] At least one barrier portion includes at least three layers of barrier portions arranged along the thickness direction of the encapsulation structure 10. For example, a plurality of first barrier portions 1132 and a plurality of second barrier portions 1133 are staggered and stacked to form at least three layers of barrier portions. For example, a plurality of barrier portions in the same layer may extend along a first direction and be arranged along a second direction, for example, at equal or unequal intervals along the second direction. The first direction and the second direction intersect, for example, perpendicular to each other. For example, the first direction is perpendicular to direction X. For example, the second direction is perpendicular to direction X.

[0048] In terms of size design, for example, the length of the barrier (the length direction can be perpendicular to direction X, for example, the length along the first direction) can be greater than or equal to 0.1 micrometers and less than or equal to 10 micrometers. That is, the length of the barrier is designed to be relatively large, which can extend the water-oxygen bypass path as much as possible. For example, the length of the barrier can be specifically 0.1 micrometers, 1 micrometer, 2 micrometers, 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, etc., as needed. The barrier or its orthographic projection on the substrate layer 111 can be polygonal, circular, or elliptical, etc. The barrier or its orthographic projection on the substrate layer 111 can be rectangular, etc.

[0049] For example, the width of the barrier (which can be perpendicular to direction X, for example, the dimension along a second direction) can be greater than or equal to 0.1 micrometers and less than or equal to 10 micrometers. That is, the width of the barrier can be designed to be relatively large, maximizing the water-oxygen bypass path. For example, the width of the barrier can be specifically 0.1 micrometers, 1 micrometer, 2 micrometers, 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, etc., depending on the specific needs.

[0050] For example, the thickness of the barrier (the thickness direction can be parallel to the X direction) is greater than or equal to 0.3 nanometers and less than or equal to 100 nanometers. That is, the thickness of the barrier is designed to reach the nanometer level, so as to extend the water and oxygen bypass path as much as possible while reducing the thickness of the adhesive layer 113.

[0051] For example, if the length-to-thickness ratio of the barrier is greater than or equal to 100, this design allows the sheet-like barrier to be arranged in the organic material 1131 as perpendicular as possible to the thickness direction of the adhesive layer 113 (the thickness direction can be parallel to direction X), which is conducive to forming a "maze path" or "brick wall structure". This effectively prevents the direct penetration of water and oxygen molecules, and can reduce the water and oxygen permeability coefficient of the adhesive layer by 1 to 2 orders of magnitude, down to below 30%.

[0052] For example, if the ratio of the width to the thickness of the barrier is greater than or equal to 100, this design allows the sheet-like barrier to be arranged as perpendicular as possible to the thickness direction of the adhesive layer 113 within the organic material 1131. This facilitates the formation of a "maze path" or "brick wall structure," effectively preventing the direct penetration of water and oxygen molecules. This can reduce the water and oxygen permeability coefficient of the adhesive layer 113 by one to two orders of magnitude, down to below 30%.

[0053] For example, multiple barrier portions in the same layer may extend along a first direction and be arranged along the first direction.

[0054] For example, multiple barrier sections in the same layer may extend along the second direction and be arranged along the second direction.

[0055] For example, multiple barrier elements in the same layer can be arranged in a multi-row, multi-column array. The row direction can be the first direction, and the column direction can be the second direction.

[0056] For example, multiple barrier portions in the same layer may extend along a first direction and be arranged along a second direction. The length of the barrier portion along the first direction is equal to or approximately equal to the dimension of the adhesive layer 113 along the first direction.

[0057] like Figure 4 As shown, in some embodiments, the barrier material includes at least one of maxrine and hexagonal boron nitride. Maxrine is a two-dimensional material composed of transition metal carbides or nitrides, which can form a complementary effect with the epoxy resin matrix and hexagonal boron nitride, improving adhesion strength, thermal conductivity, or corrosion resistance. Hexagonal boron nitride, on the other hand, is a two-dimensional material composed of boron and nitrogen atoms, possessing excellent insulation, thermal conductivity, and mechanical properties. Of course, there are many types of nanosheets, and in other embodiments, the choice of nanosheets is not limited to maxrine and hexagonal boron nitride.

[0058] For example, the material of the barrier may include only one of Maxene and hexagonal boron nitride, or it may include both Maxene and hexagonal boron nitride, depending on the specific needs.

[0059] In some specific implementations, the doping concentration of Maxene is lower than that of hexagonal boron nitride.

[0060] Specifically, the doping concentration of Maxene is lower than that of hexagonal boron nitride. This means that a relatively larger proportion of dopants are introduced during the preparation process using hexagonal boron nitride, resulting in the adhesive layer 113 exhibiting more significant adhesion, thermal conductivity, and corrosion resistance properties.

[0061] In some specific implementations, the doping concentration of the Maxene is strictly controlled within a certain range, namely, a doping concentration greater than or equal to 0.5 wt%, but less than or equal to 1 wt%. This concentration range ensures that the Maxene possesses the required physical or chemical properties while avoiding the negative impacts that may result from excessively high doping concentrations.

[0062] For example, the doping concentration of Maxene can be 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1.0 wt%, etc., and can be selected as needed. This application does not limit the specific concentration.

[0063] Similarly, in some other implementations, the doping concentration of hexagonal boron nitride also has specific range requirements. Specifically, the doping concentration is greater than 1 wt% but not more than 2 wt%. This concentration setting aims to further enhance the performance of hexagonal boron nitride by appropriately doping it while maintaining its inherent properties. By precisely controlling the doping concentration, the material properties can be optimized and controlled in different application scenarios.

[0064] For example, the doping concentration of hexagonal boron nitride can be 1.2 weight percentage, 1.4 weight percentage, 1.6 weight percentage, 1.8 weight percentage, 2.0 weight percentage, etc., and can be selected as needed. This application does not limit the specific concentration.

[0065] Figure 5 This is a cross-sectional view of the encapsulation structure of a battery module according to another embodiment of this application. Figure 6 This is a schematic diagram of the encapsulation structure for a battery module, representing another embodiment of this application. Figure 2 , Figure 5 or Figure 6 As shown, in some embodiments, the thickness h2 of the adhesive layer 113 is greater than 45 micrometers and less than or equal to 50 micrometers.

[0066] By setting the thickness h2 of the adhesive layer 113 within a specific range, that is, greater than 45 micrometers and less than or equal to 50 micrometers, it is possible to ensure that the adhesive layer 113 performs well, while avoiding the problem that the thickness h2 of the adhesive layer 113 is too large, which would waste raw materials and cause the packaging structure 10 to be too large.

[0067] For example, the thickness h2 of the adhesive layer 113 can be greater than 46 micrometers, 47 micrometers, 48 ​​micrometers, 49 micrometers, 50 micrometers, etc., and can be selected according to the specific needs. This application does not limit the specific value.

[0068] In some embodiments, the material of the second encapsulation film 114 includes an inorganic material. The material of the second encapsulation film 114 is the same as the material of one of the first inorganic film 1121 and the second inorganic film 1122. For example, the material of the second encapsulation film 114 is the same as the material of the first inorganic film 1121, or the material of the second encapsulation film 114 is the same as the material of the second inorganic film 1122.

[0069] In some embodiments, the material of the second encapsulation film layer 114 includes aluminum oxide.

[0070] The oxides (e.g., aluminum oxide) in the second encapsulation film layer 114 can react with the hydroxyl groups in the organic material 1311 (e.g., epoxy resin) to form Si-O-Al bonds, thereby enhancing the interfacial bonding between the second encapsulation film layer 114 and the adhesive layer 113 and enhancing the mechanical stability of the encapsulation structure 10.

[0071] In some implementations, the base layer is a flexible structure.

[0072] The substrate layer is designed as a flexible structure, meaning it is made of a deformable material that can deform under external force. This makes the film layer stack structure 11 an integrally bendable flexible structure, which can meet the encapsulation requirements of the flexible battery module 20.

[0073] The base layer is an organic material. For example, the base layer material includes at least one of polyethylene terephthalate and polyimide, but is not limited to this. In other embodiments, the base layer material may be other flexible and deformable materials.

[0074] In some embodiments, the thickness of the substrate 111 is greater than 45 micrometers and less than or equal to 50 micrometers.

[0075] By setting the thickness of the substrate 111 within a specific range, that is, greater than 45 micrometers and less than or equal to 50 micrometers, it is possible to ensure that the substrate 111 performs well, while avoiding excessive thickness of the substrate 111, which would waste raw materials and cause the packaging structure 10 to be too large.

[0076] For example, the thickness of the substrate 111 can be 46 nanometers, 47 nanometers, 48 ​​nanometers, 49 nanometers, 50 nanometers, etc., and can be selected according to the specific needs. This application does not limit the implementation.

[0077] like Figure 1 , Figure 5 As shown, in some embodiments, at least one film-layer stacked structure 11 includes a first film-layer stacked structure 11a and a second film-layer stacked structure 11b, for example, a first film-layer stacked structure 11a as a substrate and a second film-layer stacked structure 11b as a cover plate. The encapsulation structure 10 also includes an encapsulating adhesive layer 12 located between the substrate and the cover plate. The substrate, the cover plate, and the encapsulating adhesive layer 12 cooperate to form an encapsulation structure 10 that encapsulates the component to be encapsulated (e.g., a battery module 20). The encapsulating adhesive layer 12 surrounds the periphery of the battery module 20, which is located between the substrate and the cover plate. The encapsulation can be a covering or an encapsulation.

[0078] With this configuration, both the top cover and the bottom substrate of the battery module 20 adopt a film-layer stacked structure 11, and are sealed around the perimeter with an encapsulating adhesive layer 12, thereby improving the overall encapsulation performance of the battery module 20 and enhancing its water and oxygen barrier capabilities. Compared to related technologies that use glass substrates or polyethylene terephthalate (PET) or polyimide (PI) materials as substrates, this application solves the problem of easy water and oxygen permeation in existing rigid and flexible substrates.

[0079] For example, along a direction away from the component to be packaged (e.g., battery module 20) (e.g., parallel to direction X), the film stack structure 11 includes a second encapsulation film layer 114, an adhesive layer 113, a first encapsulation film layer 112, and a base layer 111 stacked sequentially.

[0080] Furthermore, in some embodiments, the orthographic projection of the first encapsulation film layer 112 on the substrate completely covers the orthographic projection of the second encapsulation film layer 114 on the substrate and the orthographic projection of the adhesive layer 113 on the substrate, and the edge of the orthographic projection of the first encapsulation film layer 112 on the substrate does not coincide with the edge of the orthographic projection of the adhesive layer 113 on the substrate, the edge of the orthographic projection of the first encapsulation film layer 112 on the substrate 111 and the edge of the orthographic projection of the second encapsulation film layer 114 on the substrate, the encapsulating adhesive layer 12 is located between the first encapsulation film layer 112 on the substrate and the first encapsulation film layer 112 on the cover plate, and the side of the encapsulating adhesive layer 12 closest to the battery module 20 contacts the adhesive layer 113 and the second encapsulation film layer 114.

[0081] The orthographic projection of the first encapsulation film layer 112 onto the substrate layer 111 not only covers the projection portion of the second encapsulation film layer 114 but also extends to the projection portion of the adhesive layer 113, ensuring the integrity and sealing of the entire structure. The encapsulating adhesive layer 12 is disposed between the first encapsulation film layer 112 on the substrate and the first encapsulation film layer 112 on the cover plate, playing a crucial role in adhesion and sealing. Furthermore, the side of the encapsulating adhesive layer 12 closest to the battery module 20 is in close contact with the adhesive layer 113 and the second encapsulation film layer 114. This contact method not only enhances the stability of the overall structure but also ensures the sealing, safety, and reliability of the battery module 20, preventing potential impacts from the external environment on the battery module 20. Through this meticulously designed encapsulation structure 10, the long-term performance and durability of the battery module 20 can be effectively improved.

[0082] For example, in some embodiments, the material of the encapsulating adhesive layer 12 includes butyl rubber.

[0083] Butyl rubber has low water vapor permeability, high adhesion, and electrical insulation properties, effectively preventing water and oxygen from entering the battery module 20. However, it is not limited to this; in other embodiments, the material of the encapsulating adhesive layer 12 can be other materials with adhesive properties.

[0084] In this embodiment, the encapsulating adhesive layer 12 is made of butyl rubber. After the first encapsulating film layer 112 and the second encapsulating film layer 114 are prepared, the butyl rubber is placed between the first encapsulating film layer 112 of the substrate and the first encapsulating film layer 112 of the cover plate and surrounds the battery module 20. The butyl rubber is melted by vacuum hot pressing, so that it is bonded together with the first encapsulating film layer 112 of the substrate, the first encapsulating film layer 112 of the cover plate, the adhesive layer 113 and the second encapsulating film layer 114 to form a sealed encapsulation structure 10.

[0085] Under this scheme, as Figure 2 and Figure 5 As shown, the thickness h3 of the second encapsulation film layer 114 is greater than 25 nanometers and less than or equal to 30 nanometers.

[0086] By setting the thickness h3 of the second encapsulation film layer 114 within a specific range, that is, greater than 25 nanometers and less than or equal to 30 nanometers, it is possible to ensure that the second encapsulation film layer 114 performs well, while avoiding the waste of raw materials caused by the excessive thickness h3 of the second encapsulation film layer 114, which would also result in an excessively large size of the encapsulation structure 10.

[0087] For example, the thickness h3 of the second encapsulation film layer 114 can be 26 nanometers, 27 nanometers, 28 nanometers, 29 nanometers, 30 nanometers, etc., and can be selected according to the specific needs. This application does not limit the implementation.

[0088] In addition, such as Figure 6 As shown, in some other embodiments, at least one film-layer stacked structure 11 includes a first film-layer stacked structure as a substrate and a second film-layer stacked structure as a cover plate. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure 10 that encapsulates the component to be packaged (e.g., battery module 20), with the battery module 20 located between the substrate and the cover plate. In this scheme, the entire battery module 20 is encapsulated using the film-layer stacked structure 11, improving overall encapsulation performance and water and oxygen barrier capabilities. In this case, along the thickness direction of the substrate, the thickness h3 of the second encapsulation film layer 114 is greater than the height h of the battery module 20, to achieve encapsulation of the battery module 20. For example, the thickness h3 of the second encapsulation film layer 114 is greater than 1.5 micrometers, such as 1.6 micrometers, 1.7 micrometers, 1.8 micrometers, 1.9 micrometers, 2.0 micrometers, etc. Since the thickness h3 of the second encapsulation film layer 114 under this scheme is relatively thick, magnetron sputtering is preferred to prepare the second encapsulation film layer 114.

[0089] Battery module 20 can be replaced with the component to be packaged.

[0090] Specifically, a substrate is first prepared, then the battery module 20 is placed on the second encapsulation film layer 114 of the substrate, and then a cover plate is prepared on the side of the battery module 20 away from the substrate, thereby encapsulating the battery module 20 between the cover plate and the substrate. Specifically, a first inorganic film layer 1121 and a second inorganic film layer 1122 are alternately deposited on one side of the substrate layer 111 using atomic layer deposition technology, then an adhesive material is coated on the side of the second inorganic film layer 1122 away from the substrate layer 111 to form an adhesive layer 113, and then a second encapsulation film layer 114 is deposited on the side of the adhesive layer 113 away from the second inorganic film layer 1122 using magnetron sputtering. Next, the battery module 20 is placed on the side of the second encapsulation film layer 114 away from the substrate layer 111 on the substrate. Then, the second encapsulation film layer 114 of the cover plate is prepared by magnetron sputtering on the surface of the second encapsulation film layer 114 away from the substrate layer 111 and on the side of the battery module 20 away from the substrate, until the second encapsulation film layer 114 completely covers and encapsulates the battery module 20. Next, an adhesive material is coated on the side of the second encapsulation film layer 114 away from the battery module 20 to form the adhesive layer 113 of the cover plate. On the side of the adhesive layer 113 away from the battery module 20, the first inorganic film layer 1121 and the second inorganic film layer 1122 are alternately deposited by atomic layer deposition technology to form the first encapsulation film layer 112 of the cover plate. Finally, the substrate layer 111 of the cover plate is prepared on the side of the first encapsulation film layer 112 away from the battery module 20, and the encapsulation is completed.

[0091] Compared to related technologies that require pressurizing the outer periphery of the encapsulation layer to form the end region and achieve a seal around the encapsulation layer, this application can achieve a seal without pressurizing the cover plate and substrate. This avoids the local hardening or brittleness of the material caused by pressurization, which affects the flexibility and bendability of the entire encapsulation structure 10. It also avoids irreversible deformation or stress concentration of the material caused by pressurization, which could lead to cracks or other defects in the encapsulation structure 10.

[0092] It should be noted that the battery module 20 can be a perovskite battery. Encapsulating the perovskite battery using the encapsulation structure 10 of this application greatly enhances its water and oxygen barrier capabilities, improving its durability. However, it is not limited to this; for example, the battery module 20 can also be a lithium battery, lithium iron phosphate battery, etc.

[0093] Figure 7 This is a flowchart illustrating the main steps of a method for fabricating a packaging structure according to one embodiment of this application. Figure 2 , Figure 3 , Figure 5 and Figure 7 As shown, on the other hand, embodiments of this application also provide a method for preparing a packaging structure, including: Step S100: Provide a base layer.

[0094] Step S200: Prepare a first encapsulation film layer 112 on one side surface of the substrate layer. The first encapsulation film layer 112 includes at least one first inorganic film layer 1121 and at least one second inorganic film layer 1122. The materials of the first inorganic film layer 1121 and the second inorganic film layer 1122 are different. The first inorganic film layer 1121 and the second inorganic film layer 1122 are stacked along the thickness direction of the encapsulation structure 10.

[0095] Step S300: Prepare an adhesive layer 113 on the side of the first encapsulation film layer 112 away from the substrate layer.

[0096] Step S400: Prepare a second encapsulation film layer 114 on the side of the adhesive layer 113 away from the first encapsulation film layer 112.

[0097] The method for preparing the encapsulation structure 11 provided in this application includes a substrate layer, a first encapsulation film layer 112, an adhesive layer 113, and a second encapsulation film layer 114 stacked sequentially. The first encapsulation film layer 112 includes at least one first inorganic film layer 1121 and at least one second inorganic film layer 1122, which are stacked along the thickness direction of the encapsulation structure to form an ultra-thin and dense inorganic barrier. The alternating interface between the two forces water and oxygen molecules to bypass, thereby extending the diffusion path of water and oxygen, significantly reducing the water and oxygen permeability, and thus improving the water and oxygen barrier capability of the encapsulation structure 11.

[0098] Furthermore, in some embodiments, at least one first inorganic film layer 1121 includes a plurality of first inorganic film layers 1121, and / or, the at least one second inorganic film layer 1122 includes a plurality of second inorganic film layers 1122, and the preparation of the first encapsulation film layer 112 on one side surface of the substrate layer includes: Along the thickness direction of the substrate layer, a first inorganic film layer 1121 and a second inorganic film layer 1122 are alternately deposited on one side surface of the substrate layer.

[0099] In practice, the substrate layer is first placed in the reaction chamber of the atomic layer deposition equipment. The reaction chamber is then evacuated and heated to a suitable reaction temperature. Next, by controlling the timing and sequence of the precursor pulses, the first inorganic film layer 1121 and the second inorganic film layer 1122 are alternately deposited on the substrate surface until the desired number and thickness of films are achieved. Throughout the deposition process, reaction parameters such as temperature, pressure, and precursor pulse time are strictly controlled to ensure that the formed dense inorganic layer exhibits good performance and uniformity.

[0100] Figure 8 This is a partial flowchart illustrating a method for preparing a film-layer stacked structure according to one embodiment of this application. Figure 3 , Figure 5 and Figure 8 As shown, in some embodiments, step S300 specifically includes: Step S301: Doping at least one sheet-like barrier portion into the organic material 1131 to form an adhesive material.

[0101] Step S302: Apply adhesive material to the surface of the first encapsulation film layer 112 away from the substrate layer, and cure the adhesive material to form an adhesive layer 113.

[0102] In specific operation, the organic material 1131 is first placed in a suitable container, and at least one sheet-like barrier component is added in a precise ratio. The mixture is then thoroughly stirred using a stirring device to ensure the barrier component is evenly dispersed within the organic material 1131. During stirring, the stirring speed and time must be strictly controlled to ensure complete integration of the barrier component with the organic material 1131. Next, a suitable coating process, such as spin coating, spray coating, or blade coating, is used to evenly coat the prepared adhesive material onto the surface of the first encapsulation film layer 112 away from the substrate layer. After coating, the adhesive material is cured to form the adhesive layer 113.

[0103] The materials and related dimensions of the barrier have been introduced in the packaging structure 10 above, and will not be repeated here.

[0104] In some embodiments, forming a second encapsulation film 114 on the surface of the adhesive layer 113 away from the first encapsulation film layer 112 includes: Using atomic layer deposition technology, a second encapsulation film layer 114 is deposited on the surface of the adhesive layer 113 away from the first encapsulation film layer 112. The material of the second encapsulation film layer 114 includes alumina. The alumina reacts with the epoxy resin in the adhesive layer 113 to form an interface bonding layer.

[0105] During the deposition process, precise control of various parameters of atomic layer deposition technology is required, such as deposition temperature, precursor pulse time, and purge time, to ensure the thickness uniformity and quality stability of the second encapsulation layer 114. The interfacial bonding layer formed by the reaction of alumina and epoxy resin in the adhesive layer 113 effectively enhances the bonding strength between the second encapsulation layer 114 and the adhesive layer 113, thereby improving the stability and reliability of the entire encapsulation structure.

[0106] On another front, this application provides a method for manufacturing a battery, the battery including a battery module 20 and the encapsulation structure 10 of this application, at least one film layer stacking structure 11 including a first film layer stacking structure 11a and / or a second film layer stacking structure 11b; The methods for preparing batteries include: Battery module 20 is fabricated on one side of the substrate; A cover plate is provided on the side of the battery module 20 away from the substrate and on the side of the substrate close to the battery module 20. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure 10 that encapsulates the battery module 20. The substrate is a first film layer stacked structure 11a, or the cover plate is a second film layer stacked structure 11b. or, The methods for preparing batteries include: Battery module 20 is fabricated on one side of the substrate; An encapsulation adhesive layer 12 is prepared around the battery module 20 on the side of the substrate close to the battery module 20. A cover plate is provided on the side of the battery module 20 away from the substrate and on the side of the encapsulating adhesive layer 12 away from the substrate. The substrate, the cover plate and the encapsulating adhesive layer 12 cooperate to form an encapsulation structure 10 that encapsulates the battery module 20. The substrate is a first film layer stacked structure 11a, or the cover plate is a second film layer stacked structure 11b. or, The methods for preparing batteries include: Battery module 20 is fabricated on one side of the substrate; A second film layer stack structure 11b is prepared as a cover plate on the side of the battery module 20 away from the substrate and on the side of the substrate close to the battery module 20. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure 10 that encapsulates the battery module 20.

[0107] or, The methods for preparing batteries include: A first film layer stacked structure 11a is prepared as a substrate; A battery module 20 is fabricated on one side of the first film layer stacked structure 11a; A cover plate is prepared on the side of the battery module 20 away from the first film layer stacked structure 11a and on the side of the first film layer stacked structure 11a close to the battery module 20. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure 10 that encapsulates the battery module 20.

[0108] or, The methods for preparing batteries include: A first film layer stacked structure 11a is prepared as a substrate; A battery module 20 is fabricated on one side of the first film layer stacked structure 11a; A second film-layer stacked structure 11b is prepared as a cover plate on the side of the battery module 20 away from the first film-layer stacked structure 11a and on the side of the first film-layer stacked structure 11a close to the battery module 20. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure 10 that encapsulates the battery module 20.

[0109] or, The methods for preparing batteries include: Battery module 20 is fabricated on one side of the substrate; An encapsulation adhesive layer 12 is prepared around the battery module 20 on the side of the substrate close to the battery module 20. A second film layer stack structure 11b is prepared as a cover plate on the side of the battery module 20 away from the substrate and on the side of the encapsulating adhesive layer 12 away from the substrate. The substrate, the cover plate and the encapsulating adhesive layer 12 cooperate to form an encapsulation structure 10 that encapsulates the battery module 20.

[0110] or, The methods for preparing batteries include: A first film layer stacked structure 11a is prepared as a substrate; A battery module 20 is fabricated on one side of the first film layer stacked structure 11a; On the side of the first film layer stacked structure 11a near the battery module 20, an encapsulating adhesive layer 12 is prepared around the battery module 20; A cover plate is prepared on the side of the battery module 20 away from the first film layer stacked structure 11a and on the side of the encapsulating adhesive layer 12 away from the first film layer stacked structure 11a. The substrate, the cover plate and the encapsulating adhesive layer 12 cooperate to form an encapsulation structure 10 that encapsulates the battery module 20.

[0111] or, The methods for preparing batteries include: A first film layer stacked structure 11a is prepared as a substrate; A battery module 20 is fabricated on one side of the first film layer stacked structure 11a; On the side of the first film layer stacked structure 11a near the battery module 20, an encapsulating adhesive layer 12 is prepared around the battery module 20; A second film layer stacked structure 11b is prepared as a cover plate on the side of the battery module 20 away from the first film layer stacked structure 11a and on the side of the encapsulating adhesive layer 12 away from the first film layer stacked structure 11a. The substrate, the cover plate and the encapsulating adhesive layer 12 cooperate to form an encapsulation structure 10 that encapsulates the battery module 20.

[0112] The battery fabrication method of this application embodiment uses a film-layer stacked structure 11 for both the cover plate and the substrate in the encapsulation structure 10, which improves the overall water and oxygen barrier performance of the encapsulation structure 10, thereby improving the sealing performance of the battery module 20 and extending the service life of the battery module 20. This embodiment can be combined with some or all of the features in the above embodiments, which will not be repeated here.

[0113] It should be noted that in this embodiment, the thickness direction of the encapsulation structure 10 is consistent with the direction indicated by the X arrow in the figure.

[0114] For example, preparing the first film layer stacked structure 11a includes: sequentially preparing a base layer 111, a first encapsulation film layer 112, an adhesive layer 113, and a second encapsulation film layer 114. For example, preparing the second film layer stacked structure 11b includes: sequentially preparing a second encapsulation film layer 114, an adhesive layer 113, a first encapsulation film layer 112, and a base layer 111.

[0115] Figure 9 This is a schematic diagram of the structure of a battery module according to one embodiment of this application. Figure 1 and Figure 9 As shown, in another aspect, this application also provides a battery, including a battery module 20 and a packaging structure 10 provided in this application, the packaging structure 10 encapsulating and sealing the battery module 20.

[0116] Since the battery in this embodiment includes the packaging structure 10 of this embodiment, the battery in this embodiment has the same technical effects as the packaging structure 10 of this embodiment. For details, please refer to the relevant description above, which will not be repeated here. This embodiment can be combined with some or all of the features in the above embodiments, which will not be repeated here.

[0117] In some embodiments, the battery module 20 includes perovskite battery cells. Perovskite batteries can achieve high-efficiency photoelectric conversion, and the ultra-light and ultra-thin flexible devices fabricated on micron-scale polymer substrates can meet the requirements of "high efficiency and ultra-thinness", while also possessing outstanding high-quality power-to-weight ratio (power output per unit mass).

[0118] In terms of specific structure, such as Figure 9As shown, in some embodiments, the perovskite solar cell includes a first electrode 21, a hole transport layer 22, a perovskite layer 23, a hole blocking layer 24, an electron transport layer 25, and a second electrode 26, which are sequentially stacked along the thickness direction (e.g., parallel to direction X).

[0119] The material of the first electrode 21 includes at least one of indium tin oxide and indium zinc oxide. The thickness of the first electrode 21 is greater than or equal to 150 nanometers and less than or equal to 200 nanometers. For example, the thickness of the first electrode 21 can be 150 nanometers, 160 nanometers, 170 nanometers, 180 nanometers, 190 nanometers, 200 nanometers, etc., and can be set according to needs. This application does not limit the specific thickness.

[0120] In some embodiments, the hole transport layer 22 is made of at least one of 2,2',7,7'-tetratetra(N,N-di-p-methoxyaniline)-9,9'-spirobisfluorene, copper sulfide cyanide, nickel oxide, cuprous aluminate, and poly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid.

[0121] In terms of specific dimensions, the thickness of the hole transport layer 22 is greater than or equal to 10 nanometers and less than or equal to 50 nanometers. For example, the thickness of the hole transport layer 22 can be 10 nanometers, 20 nanometers, 30 nanometers, 40 nanometers, 50 nanometers, etc., and can be set according to needs. This application does not limit the specific thickness.

[0122] In some embodiments, the material of the perovskite layer 23 includes ABX3, where A is a monovalent cation, B is a divalent cation, and X is a monovalent anion. The thickness of the perovskite layer 23 is greater than or equal to 500 nanometers and less than or equal to 600 nanometers. For example, the thickness of the perovskite layer 23 can specifically be 500 nanometers, 510 nanometers, 520 nanometers, 530 nanometers, 540 nanometers, 550 nanometers, 560 nanometers, 570 nanometers, 580 nanometers, 590 nanometers, 600 nanometers, etc., and can be set as needed; this application does not limit the specific thickness.

[0123] For example, A includes Cs + 、Rb + CH3NH3 + CH2(NH2)2 + At least one of them. B includes Pb2. + X includes I - ,Br - Cl - F - SCN - At least one of them.

[0124] In some embodiments, the material of the electron transport layer 24 includes at least one selected from titanium dioxide, zinc oxide, tungsten trioxide, tin dioxide, zinc tin oxide, fullerene, and their derivatives. The thickness of the electron transport layer 24 is greater than or equal to 10 nanometers and less than or equal to 30 nanometers. Exemplarily, the thickness of the electron transport layer 24 can specifically be 10 nanometers, 15 nanometers, 20 nanometers, 25 nanometers, 30 nanometers, etc., and is set according to specific needs; this application does not limit the specific thickness.

[0125] In some embodiments, the hole blocking layer 25 is made of at least one of 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline and tin oxide. The thickness of the hole blocking layer 25 is greater than or equal to 1 nanometer and less than or equal to 20 nanometers. For example, the thickness of the hole blocking layer 25 can be 1 nanometer, 5 nanometers, 10 nanometers, 15 nanometers, 20 nanometers, etc., and can be set as needed. This application does not limit the specific thickness.

[0126] In some embodiments, the material of the second electrode 26 includes at least one of gold, silver, and copper. The thickness of the second electrode 26 is greater than or equal to 50 nanometers and less than or equal to 150 nanometers. For example, the thickness of the second electrode 26 can specifically be 50 nanometers, 60 nanometers, 70 nanometers, 80 nanometers, 90 nanometers, 100 nanometers, 110 nanometers, 120 nanometers, 130 nanometers, 140 nanometers, 150 nanometers, etc., and can be set according to needs. This application does not limit the specific thickness.

[0127] In some embodiments, the perovskite solar cell includes a first electrode 21, a hole transport layer 22, a perovskite layer 23, an electron transport layer 25, a hole blocking layer 24, and a second electrode 26, which are sequentially stacked along the thickness direction (e.g., parallel to direction X).

[0128] In some embodiments, the first electrode 21 may be a transparent electrode. The second electrode 26 may be a metal electrode.

[0129] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0130] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0131] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A packaging structure, characterized in that, The encapsulation structure includes at least one film layer stacked structure, which includes a base layer, a first encapsulation film layer, an adhesive layer, and a second encapsulation film layer stacked sequentially. The first encapsulation film layer includes at least one first inorganic film layer and at least one second inorganic film layer. The materials of the first inorganic film layer and the second inorganic film layer are different. The first inorganic film layer and the second inorganic film layer are stacked along the thickness direction of the encapsulation structure.

2. The packaging structure according to claim 1, characterized in that, The at least one first inorganic film layer includes a plurality of first inorganic film layers, and / or the at least one second inorganic film layer includes a plurality of second inorganic film layers. In the same first encapsulation film layer, the first inorganic film layer and the second inorganic film layer are alternately stacked along the thickness direction of the encapsulation structure. Preferably, ten of the first inorganic film layer and ten of the second inorganic film layer are provided; Preferably, the material of the first inorganic film layer includes aluminum oxide; Preferably, the thickness of the first inorganic film layer is greater than 1 nanometer and less than or equal to 2 nanometers; Preferably, the material of the second inorganic film layer includes silicon oxide; Preferably, the thickness of the second inorganic film layer is greater than 0.5 nanometers and less than or equal to 1 nanometer; Preferably, the thickness of the first encapsulation film layer is greater than or equal to 25 nanometers and less than or equal to 30 nanometers.

3. The packaging structure according to claim 1, characterized in that, The adhesive layer is made of an organic material doped with at least one sheet-like barrier portion. Preferably, the extending direction of the barrier portion intersects the thickness direction of the adhesive layer; Preferably, at least one barrier portion includes at least one first barrier portion and at least one second barrier portion, and the first barrier portion and the second barrier portion are stacked alternately along the thickness direction of the adhesive layer; Preferably, the adjacent first and second blocking portions partially overlap; Preferably, at least one barrier portion includes at least three layers of the barrier portion arranged along the thickness direction of the encapsulation structure; Preferably, the plurality of the barrier portions in the same layer may extend along a first direction and be arranged along a second direction, wherein the first direction and the second direction intersect. Preferably, the length of the barrier portion is greater than or equal to 0.1 micrometers and less than or equal to 10 micrometers, and / or the width of the barrier portion is greater than or equal to 0.1 micrometers and less than or equal to 10 micrometers, and / or the thickness of the barrier portion is greater than or equal to 0.3 nanometers and less than or equal to 100 nanometers, and / or the ratio of the length to the thickness of the barrier portion is greater than or equal to 100; and / or the ratio of the width to the thickness of the barrier portion is greater than or equal to 100. Preferably, the organic material of the adhesive layer includes epoxy resin; Preferably, the material of the barrier portion includes at least one of Maxene and hexagonal boron nitride; Preferably, the doping concentration of the Maxene is lower than the doping concentration of the hexagonal boron nitride; Preferably, the doping concentration of the Maxene is greater than or equal to 0.5% by weight and less than or equal to 1% by weight. Preferably, the doping concentration of the hexagonal boron nitride is greater than 1 weight percentage and less than or equal to 2 weight percentage; Preferably, the thickness of the adhesive layer is greater than 45 micrometers and less than or equal to 50 micrometers.

4. The packaging structure according to claim 1, characterized in that, The material of the second encapsulation film layer includes inorganic materials; Preferably, the material of the second encapsulation film layer is the same as the material of one of the first inorganic film layer and the second inorganic film layer; Preferably, the material of the second encapsulation film layer includes aluminum oxide; Preferably, the thickness of the second encapsulation film layer is greater than 25 nanometers and less than or equal to 30 nanometers; Preferably, the substrate layer is an organic material; Preferably, the base layer is a flexible structure; Preferably, the material of the base layer includes at least one of polyethylene terephthalate and polyimide; Preferably, the thickness of the substrate layer is greater than 45 micrometers and less than or equal to 50 micrometers; Preferably, the at least one film layer stacked structure includes a first film layer stacked structure as a substrate and a second film layer stacked structure as a cover plate, wherein at least a portion of the substrate and at least a portion of the cover plate cooperate to form the encapsulation structure that encapsulates the battery module, and the battery module is located between the substrate and the cover plate; Preferably, along the direction away from the battery module, the film stacking structure includes a second encapsulation film layer, an adhesive layer, a first encapsulation film layer, and a substrate layer stacked sequentially.

5. The packaging structure according to claim 1, characterized in that, The at least one film layer stacked structure includes a first film layer stacked structure as a substrate and a second film layer stacked structure as a cover plate. The encapsulation structure further includes an encapsulating adhesive layer located between the substrate and the cover plate. The substrate, the cover plate, and the encapsulating adhesive layer cooperate to form the encapsulation structure that encapsulates the battery module. The encapsulating adhesive layer surrounds the periphery of the battery module, and the battery module is located between the substrate and the cover plate. Preferably, along the direction away from the battery module, the film stacking structure includes a second encapsulation film layer, an adhesive layer, a first encapsulation film layer, and a substrate layer stacked sequentially. Preferably, the orthographic projection of the first encapsulation film layer on the substrate completely covers the orthographic projection of the second encapsulation film layer on the substrate and the orthographic projection of the adhesive layer on the substrate, and the edge of the orthographic projection of the first encapsulation film layer on the substrate does not coincide with the edge of the orthographic projection of the adhesive layer on the substrate, nor do the edges of the orthographic projections of the first and second encapsulation film layers on the substrate. The encapsulating adhesive layer is located between the first encapsulation film layer on the substrate and the first encapsulation film layer on the cover plate, and the side of the encapsulating adhesive layer closest to the battery module contacts the adhesive layer and the second encapsulation film layer. Preferably, the material of the encapsulating adhesive layer includes butyl rubber.

6. A method for preparing a packaging structure, characterized in that, include: Provide a base layer; A first encapsulation film layer is prepared on one side surface of the substrate layer. The first encapsulation film layer includes at least one first inorganic film layer and at least one second inorganic film layer. The materials of the first inorganic film layer and the second inorganic film layer are different. The first inorganic film layer and the second inorganic film layer are stacked along the thickness direction of the encapsulation structure. An adhesive layer is prepared on the surface of the first encapsulation film layer away from the substrate layer; A second encapsulation film layer is prepared on the surface of the adhesive layer away from the first encapsulation film layer.

7. The preparation method according to claim 6, characterized in that, The at least one first inorganic film layer includes a plurality of first inorganic film layers, and / or, the at least one second inorganic film layer includes a plurality of second inorganic film layers, wherein the preparation of the first encapsulation film layer on one side surface of the substrate layer includes: Along the thickness direction of the encapsulation structure, a first inorganic film layer and a second inorganic film layer are alternately deposited on one side surface of the substrate layer; Preferably, the step of preparing an adhesive layer on the surface of the first encapsulation film layer away from the substrate layer includes: At least one sheet-like barrier portion is incorporated into an epoxy resin to form an adhesive material. The adhesive material is applied to the surface of the first encapsulation film layer away from the substrate layer, and the adhesive material is cured to form the adhesive layer; Preferably, the step of preparing a second encapsulation film layer on the surface of the adhesive layer away from the first encapsulation film layer includes: Atomic layer deposition technology is used to deposit a second encapsulation film layer on the surface of the adhesive layer away from the first encapsulation film layer. The material of the second encapsulation film layer includes alumina. The alumina reacts with the epoxy resin in the adhesive layer to form an interface bonding layer.

8. A method for preparing a battery, characterized in that, The battery includes a battery module and an encapsulation structure according to any one of claims 1 to 5, wherein at least one film layer stacking structure of the encapsulation structure includes a first film layer stacking structure and / or a second film layer stacking structure; The method for preparing the battery includes: The battery module is fabricated on one side of the substrate; A cover plate is provided on the side of the battery module away from the substrate and on the side of the substrate close to the battery module, and at least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure that encapsulates the battery module; the substrate is a first film layer stacked structure, or the cover plate is a second film layer stacked structure; or, The method for preparing the battery includes: The battery module is fabricated on one side of the substrate; An encapsulation adhesive layer is prepared around the battery module on the side of the substrate closest to the battery module; A cover plate is provided on the side of the battery module away from the substrate and on the side of the encapsulating adhesive layer away from the substrate. The substrate, the cover plate, and the encapsulating adhesive layer cooperate to form an encapsulation structure that encapsulates the battery module. The substrate is a first film layer stacked structure, or the cover plate is a second film layer stacked structure. or, The method for preparing the battery includes: The first film layer stack structure is prepared as a substrate; A battery module is fabricated on one side of the first film layer stacked structure; A second film-layer stacked structure is prepared as a cover plate on the side of the battery module away from the first film-layer stacked structure and on the side of the first film-layer stacked structure close to the battery module. At least a portion of the substrate and at least a portion of the cover plate cooperate to form an encapsulation structure that encapsulates the battery module. or, The method for preparing the battery includes: The first film layer stack structure is prepared as a substrate; A battery module is fabricated on one side of the first film layer stacked structure; An encapsulation adhesive layer is prepared around the battery module on the side of the first film layer stack structure near the battery module; A second film layer stack structure is prepared as a cover plate on the side of the battery module away from the first film layer stack structure and on the side of the encapsulating adhesive layer away from the first film layer stack structure. The substrate, the cover plate and the encapsulating adhesive layer cooperate to form an encapsulation structure that wraps the battery module.

9. A battery, characterized in that, include: Battery module; as well as The encapsulation structure according to any one of claims 1 to 5, wherein the encapsulation structure encapsulates and seals the battery module.

10. The battery according to claim 9, characterized in that, The battery module includes perovskite battery cells; Preferably, the perovskite solar cell includes a first electrode, a hole transport layer, a perovskite layer, an electron transport layer, a hole blocking layer, and a second electrode, which are sequentially stacked along the thickness direction parallel to the encapsulation structure. Preferably, the material of the first electrode includes at least one of indium tin oxide and indium zinc oxide; Preferably, the thickness of the first electrode is greater than or equal to 150 nanometers and less than or equal to 200 nanometers; Preferably, the material of the hole transport layer includes at least one of 2,2',7,7'-tetratetra(N,N-di-p-methoxyaniline)-9,9'-spirobisfluorene, copper sulfide cyanide, nickel oxide, cuprous aluminate, and poly(3,4-ethylenedioxythiophene)-polystyrene sulfonic acid; Preferably, the thickness of the hole transport layer is greater than or equal to 10 nanometers and less than or equal to 50 nanometers; Preferably, the material of the perovskite layer includes ABX3, wherein A is a monovalent cation, B is a divalent cation, and X is a monovalent anion; Preferably, the thickness of the perovskite layer is greater than or equal to 500 nanometers and less than or equal to 600 nanometers; Preferably, the material of the electron transport layer includes at least one of titanium dioxide, zinc oxide, tungsten trioxide, tin dioxide, zinc tin oxide, fullerene and its derivatives; Preferably, the thickness of the electron transport layer is greater than or equal to 10 nanometers and less than or equal to 30 nanometers; Preferably, the hole-blocking layer is made of at least one of 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline and tin oxide; Preferably, the thickness of the hole blocking layer is greater than or equal to 1 nanometer and less than or equal to 20 nanometers; Preferably, the material of the second electrode includes at least one of gold, silver, and copper; Preferably, the thickness of the second electrode is greater than or equal to 50 nanometers and less than or equal to 150 nanometers.

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