Sensor chip packaging structure adopting array cross-linked heat dissipation mode

Abstract

The invention discloses a sensor chip packaging structure adopting an array cross-linked heat dissipation mode, relates to the technical field of chip packaging, and aims to solve the problem of how to ensure that corresponding pressing force is just formed to achieve effective packaging in a chip packaging process. Comprising a packaging table, a rotating table is rotationally mounted in the packaging table, and a packaging base is horizontally mounted on the upper side of the rotating table; on one hand, uniform distribution of pressing force is realized by utilizing accurate limiting control and pressure feedback, and the coplanarity between a chip and a substrate is prevented from being damaged by displacement or warping, so that effective packaging is ensured; on the other hand, uniform heat dissipation after packaging of the chip and the substrate is completed in a cross-linking heat conduction mode, so that pre-cooling in the subsequent heating and curing stage is facilitated, and invalid packaging is avoided; and under the combination of the two, the pressing force can be controlled in the chip packaging process, and effective packaging can be completed.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically to a sensor chip packaging structure employing an array cross-linking heat dissipation method. Background Technology

[0002] With the rapid advancement of sensor technology, high-precision and high-reliability sensor chips have become indispensable core components in modern industry, automotive electronics, and consumer electronics. The packaging process not only needs to provide robust physical protection for the fragile chip but also ensures accurate and stable interaction between its sensing unit and the external environment. Among these complex process steps, how to stably fix the chip in a predetermined position and maintain a tight fit at specific stages, such as during transfer or before heat curing, is a crucial and long-standing technical challenge.

[0003] In the prior art, referring to the invention patent with patent publication number CN117727700B, the chip heat is conducted to the outside of the chip packaging structure, and a pressing fit is achieved by directly contacting the chip with an elastomer structure and a heat-collecting plate. However, during the pressing process, the elastomer structure combined with the heat-collecting plate often lacks precise limit control and pressure feedback, which can easily lead to uneven pressing force. Insufficient pressure may cause the chip to undergo micron-level displacement or warping during pipeline conveying or heating, destroying the coplanarity between the chip and the substrate, thereby causing packaging failure or performance parameter drift; excessive pressure may damage expensive chips or their internal sensitive structures. Therefore, this application proposes a solution. Summary of the Invention

[0004] The purpose of this invention is to provide a sensor chip packaging structure using an array cross-linking heat dissipation method, which solves the problem of how to ensure that the corresponding clamping force is formed during the chip packaging process to achieve effective packaging.

[0005] The objective of this invention can be achieved through the following technical solution: a sensor chip packaging structure using an array cross-linked heat dissipation method, comprising a packaging platform, a rotating stage rotatably mounted in the packaging platform, a packaging base horizontally mounted on the upper side of the rotating stage, cross-linked heat-conducting strips arranged in the packaging base, a bonding plate commonly mounted on the upper side of several of the cross-linked heat-conducting strips, a docking frame rotatably disposed on the upper side of the packaging base corresponding to the bonding plate, and toothed airbags connected to a pneumatic air supply source mounted on both sides of the docking frame; A roller pressing assembly for continuous pressing and fitting of the packaged chip is provided directly above the packaging base. The roller pressing assembly includes a sliding frame that slides radially along the packaging platform. A pressing frame is provided perpendicularly to the bottom of the sliding frame. A pressure roller is rotatably mounted on the pressing frame that is vertically corresponding to the packaging base and has an adjustable longitudinal spacing.

[0006] The configuration is further defined as follows: a dynamically adjustable structure is provided on the outer side of the clamping frame, the dynamically adjustable structure includes a hinge column disposed on the inner side of the clamping frame, a swing plate is rotatably connected to the outer side of the upper end of the hinge column, and the inner side of the swing plate is connected to the pressure roller through a rotating rod.

[0007] The configuration is further defined as follows: a spring connected to a clamping frame is installed on the outer side of the swing plate, and a miniature cylinder with its output end rotatably connected to the lower side of the swing plate is installed on the clamping frame.

[0008] The configuration is further defined as follows: a direct drive shift rod is installed at the upper end of the clamping frame, the lower end of the sliding frame is slidably installed on the direct drive shift rod, and a slide rail rod for radial movement is provided at the lower end of the sliding frame.

[0009] The further configuration is as follows: the middle part of the docking frame corresponding to the toothed airbag has a broken structure, and the drive structure is embedded inside the hinge of the encapsulation base corresponding to the docking frame.

[0010] A further configuration is provided: a flexible sealing ring is fitted in the middle of the outer ring side of the pressure roller, and the outer periphery of the flexible sealing ring initially corresponds to the break point on the docking frame.

[0011] Further configuration: an annular guide hole is provided on the outer side of the packaging stage, and a slider is installed at the lower end of the rotary table corresponding to the annular guide hole. The rotary table realizes the change of the loading position before chip packaging by rotating circumferentially in the annular guide hole through the slider, and realizes the change of the unloading position after chip packaging by rotating circumferentially on the packaging base through the docking frame.

[0012] A sensor chip packaging method employing an array cross-linking heat dissipation approach includes the following steps: The sensor chip is first placed in the docking frame by a mechanical gripping device, and the toothed airbag is filled in segments by a pneumatic air supply source. The segmented inflation is adapted to the size of the sensor chip to complete the fixation. Then the docking frame is rotated to the rotating table and overlapped. At this time, a preliminary docking is formed with the substrate pre-placed on the packaging base. Then the rotating table drives the overlapped body to rotate and stop under the pressure roller. The clamping frame moves back and forth via a direct-drive shift rod, driving the pressure roller to perform a rolling action on the surface of the packaged chip structure, achieving stable pressing between the chip and the substrate. The pressure roller is equipped with a contact sensor. When the contact pressure is sensed in real time, the extension and retraction length of the micro cylinder is adjusted according to the current packaging limit conditions of the chip and the substrate. This causes the swing plate to drive the pressure roller to move vertically, thereby adjusting the interval between the packaged chip and the substrate, and thus achieving the purpose of real-time adjustment according to the packaging size.

[0013] The present invention has the following beneficial effects: 1. This invention addresses the problem of ensuring the correct clamping force is applied during chip packaging to achieve effective packaging. On one hand, it utilizes precise limit control and pressure feedback to achieve uniform distribution of clamping force, preventing displacement or warping that could disrupt the coplanarity between the chip and the substrate, thus ensuring effective packaging. On the other hand, it achieves uniform heat dissipation after chip and substrate packaging through cross-linking thermal conductivity, facilitating pre-cooling during the subsequent heating and curing stage and preventing ineffective packaging. The combination of these two methods effectively controls the clamping force during chip packaging and achieves effective packaging. 2. During the dynamic pressing process in the packaging process, when the contact sensor in the pressure roller senses the contact pressure in real time, the extension and retraction length of the micro cylinder is adjusted according to the current packaging limit conditions of the chip and the substrate. This causes the swing plate to drive the pressure roller to move vertically, thereby adjusting the interval between the packaged chip and the substrate. This results in a pressing force between the pressure roller and the sensor chip that is limited by the distance, thus achieving the purpose of adjusting and accurately pressing in real time according to the packaging size. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the initial state during material loading according to the present invention; Figure 3 This is a structurally exploded view of the packaging base of the present invention; Figure 4 This is a side sectional view of the present invention; Figure 5 This is a schematic diagram of the structure of the roller pressing assembly of the present invention; Figure 6 This is a side view of the roll forming assembly of the present invention; Figure 7 This is a schematic diagram of lateral translational bonding during the rolling process of the present invention; Figure 8 This is a top view of the unfolded state of the present invention.

[0016] In the diagram: 1. Encapsulation stage; 2. Ring guide hole; 3. Rotary stage; 4. Encapsulation base; 5. Docking frame; 6. Clamping frame; 7. Slide rail; 8. Sliding frame; 9. Pressure roller; 10. Flexible sealing ring; 11. Toothed airbag; 12. Cross-linked heat-conducting strip; 13. Slider; 14. Bonding plate; 15. Rotating rod; 16. Direct drive moving rod; 17. Hinge column; 18. Miniature cylinder; 19. Swing plate; 20. Spring. Detailed Implementation

[0017] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1 To address the challenge of ensuring the correct clamping force is applied during chip packaging for effective encapsulation, the following technical solution is proposed: Reference Figure 1 - Figure 8 As shown, the sensor chip packaging structure using an array cross-linked heat dissipation method in this embodiment includes a packaging stage 1, a rotating stage 3 rotatably mounted in the packaging stage 1, a packaging base 4 horizontally mounted on the upper side of the rotating stage 3, cross-linked heat-conducting strips 12 arranged in the packaging base 4, and a bonding plate 14 jointly mounted on the upper side of several cross-linked heat-conducting strips 12. In this invention, the cross-linked heat-conducting strips 12 are made of a high thermal conductivity material that is closely attached to the bonding plate 14. They are actually used for real-time heat conduction in the sensor chip packaging process, effectively dissipating heat during the chip packaging process and avoiding the normal operation of subsequent processes. The packaging base 4 is rotatably provided with a docking frame 5 on the upper side of the bonding plate 14. Toothed airbags 11 connected to a pneumatic air supply are installed on both sides of the docking frame 5. The toothed airbags 11 are positioned on the chip and substrate packaging side. The protruding parts of each toothed airbag 11 are distributed at intervals. The inflation of the filling area on the toothed airbag 11 is adjusted according to the actual chip specifications. The missing parts of the chip are filled by the toothed airbags 11 to achieve effective double-sided limiting and fixing. Furthermore, the rotation characteristics of the docking frame 5 are used to form an overlap with the packaging base 4 to facilitate subsequent packaging before heat curing. Reference Figure 2 , Figure 4 - Figure 8As shown, a roller pressing assembly for continuous pressing and fitting of the packaged chip is provided directly above the packaging base 4. The roller pressing assembly includes a sliding frame 8 that slides radially along the packaging platform 1. A pressing frame 6 is perpendicularly arranged at the bottom of the sliding frame 8. A pressure roller 9, which is vertically corresponding to the packaging base 4 and whose longitudinal spacing is adjustable, is rotatably arranged on the pressing frame 6. A flexible sealing ring 10 is sleeved in the middle of the outer ring side of the pressure roller 9. The outer periphery of the flexible sealing ring 10 initially corresponds to the break point on the docking frame 5. The pressure roller 9 is a roller pressing structure with a built-in drive motor A (not shown in the figure). It can rotate under the drive of the drive motor A, thereby forming a "rolling" action to complete the extrusion contact packaging. A contact sensor is embedded in the flexible sealing ring 10 on the outside of the pressure roller 9 to complete the real-time contact pressure sensing during the "rolling" action of the pressure roller 9. During the chip packaging process, the chip and the substrate are connected by a pressing action, and the contact extrusion packaging is completed by the continuous rotation of the pressure roller 9, and the contact pressure is sensed in real time.

[0019] Reference Figure 5 As shown, a dynamically adjustable structure is provided on the outer side of the clamping frame 6. The dynamically adjustable structure includes a hinge column 17 located on the inner side of the clamping frame 6. A swing plate 19 is rotatably connected to the outer side of the upper end of the hinge column 17. The inner side of the swing plate 19 is connected to the pressure roller 9 through a rotating rod 15. A spring 20 connected to the clamping frame 6 is installed on the outer side of the swing plate 19. A miniature cylinder 18 with its output end rotatably connected to the lower side of the swing plate 19 is installed on the clamping frame 6. Based on the above, when the contact pressure is sensed in real time, the extension and retraction length of the miniature cylinder 18 is adjusted according to the current packaging limit conditions of the chip and the substrate, so that the swing plate 19 drives the pressure roller 9 to move vertically to adjust the gap between the packaged chip and the substrate, thereby achieving the purpose of real-time adjustment according to the packaging size.

[0020] The upper end of the clamping frame 6 is equipped with a direct drive moving rod 16, and the lower end of the sliding frame 8 is slidably mounted on the direct drive moving rod 16. The lower end of the sliding frame 8 is provided with a slide rail 7 for its radial movement. The movement of the clamping frame 6 perpendicular to the radial position on the rotary table 3 is achieved by the horizontal movement of the clamping frame 6 on the direct drive moving rod 16. During this process, the part of the clamping frame 6 corresponding to the direct drive moving rod 16 is provided with a horizontal sliding structure. The clamping frame 6 drives the pressure roller 9 to perform a rolling action on the surface of the packaged chip structure through the reciprocating movement of the direct drive moving rod 16, thereby achieving stable pressing between the chip and the substrate.

[0021] Basic principle: This invention is based on the packaging process before chip heating and curing. On the one hand, it uses precise limit control and pressure feedback to achieve uniform distribution of clamping force, avoiding displacement or warping that could damage the coplanarity between the chip and the substrate, thus ensuring effective packaging. On the other hand, it uses cross-linking heat conduction to achieve uniform heat dissipation after chip and substrate packaging, so that the subsequent heating and curing stage can be pre-cooled to avoid invalid packaging.

[0022] Example 2 This embodiment further optimizes the structure in the sensor chip packaging structure, referring to... Figure 1 - Figure 8 As shown, the assembly includes: the docking frame 5 has a broken structure in the middle of the toothed airbag 11, and the encapsulation base 4 has a drive structure (not shown in the figure) embedded in the hinge of the docking frame 5. The drive structure includes a drive motor B, which can drive the docking frame 5 to complete the rotation action. The docking frame 5 has a broken structure on both sides, which can achieve unobstructed movement when the docking frame 5 rotates to the bottom of the pressure roller 9 and the pressure roller 9 completes the reciprocating rotation and squeezing action, thus completing the rotation and pressing of the sensor chip in the docking frame 5. Among them, the docking frame 5 rotates from one side to the bottom of the pressure roller 9, and the micro cylinder 18 starts to drive the swing plate 19 to swing so that the pressure roller 9 moves downward in the vertical direction until it contacts the surface of the sensor chip in the docking frame 5. At this time, the sensor chip between the toothed airbags 11 is directly pressed by the pressure roller 9 to complete the encapsulation with the substrate. During the encapsulation process, the clamping frame 6 completes the relative horizontal sliding between the horizontal sliding structure and the direct drive shift rod 16, and finally completes the reciprocating adaptation and pressing during the sensor chip encapsulation process, realizing the stable pressing between the chip and the substrate. A flexible sealing ring 10 is fitted in the middle of the outer ring side of the pressure roller 9. The outer periphery of the flexible sealing ring 10 initially corresponds to the break on the docking frame 5. Based on the above, the rotation and linear translation of the pressure roller 9 are directly in contact with the sensor chip through the flexible sealing ring 10. The flexible sealing ring 10 can not only provide flexible contact with the sensor chip, but also provide clamping buffer to reduce the damage that hard impacts may cause to the chip.

[0023] Reference Figure 8 As shown, an annular guide hole 2 is provided on the outer side of the packaging stage 1. A slider 13 is installed on the lower end of the rotary stage 3 corresponding to the annular guide hole 2. The rotary stage 3 achieves the change of the loading position before chip packaging by rotating circumferentially in the annular guide hole 2 through the slider 13. The docking frame 5 achieves the change of the unloading position after chip packaging by rotating circumferentially on the packaging base 4. The annular guide hole 2 on the packaging stage 1 provides rotational guidance for the rotary stage 3 and the packaging base 4. The rotary stage 3 and the packaging base 4 complete the position change through the slider 13, realizing the staggered rotation between the position of the docking frame 5 and the pressure roller 9, further completing the rapid loading and unloading of sensor chips before, during, and after packaging.

[0024] Example 3 Reference Figure 1 - Figure 8 As shown, this embodiment combines the technical content of Embodiment 1 and Embodiment 2 to construct a sensor chip packaging method using an array cross-linking heat dissipation method, including the following steps: The sensor chip is first placed in the docking frame 5 by a mechanical gripping device, and the toothed airbag 11 is filled in segments by a pneumatic air supply source, and the segmented inflation is adapted to the size of the sensor chip to complete the fixation. Subsequently, the docking frame 5 rotates onto the rotating table 3 and overlaps with it. At this time, a preliminary docking is formed between it and the substrate pre-placed on the packaging base 4. Then, the rotating table 3 drives the overlapping body to rotate to a stop below the pressure roller 9. The clamping frame 6 drives the pressure roller 9 to perform a rolling action on the surface of the packaged chip structure by reciprocating the direct drive shift rod 16, thereby achieving stable pressing between the chip and the substrate. The pressure roller 9 is equipped with a contact sensor. When the contact pressure is sensed in real time, the extension and retraction length of the micro cylinder 18 is adjusted according to the current packaging limit conditions of the chip and the substrate. This causes the swing plate 19 to drive the pressure roller 9 to move vertically, thereby adjusting the interval between the packaged chip and the substrate and achieving the purpose of real-time adjustment according to the packaging size.

[0025] In summary, this invention, combining embodiments one, two, and three, achieves uniform distribution of clamping force through precise limit control and pressure feedback, preventing displacement or warping that could disrupt the coplanarity between the chip and the substrate, thus ensuring effective packaging. Furthermore, it utilizes cross-linking thermal conductivity to achieve uniform heat dissipation after chip and substrate packaging, facilitating pre-cooling during the subsequent heating and curing stage and preventing ineffective packaging. This combination effectively controls the clamping force during chip packaging and ensures effective packaging.

[0026] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

[0027] In the description of this specification, references to terms such as "an embodiment," "example," and "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not describe all details exhaustively, nor do they limit the invention to any specific implementation method.

Claims

1. A sensor chip packaging structure employing an array cross-linking heat dissipation method, comprising a packaging stage (1), characterized in that, A rotating platform (3) is rotatably installed in the encapsulation platform (1). An encapsulation base (4) is horizontally installed on the upper side of the rotating platform (3). Cross-linked heat-conducting strips (12) are arranged in the encapsulation base (4). A bonding plate (14) is installed on the upper side of several cross-linked heat-conducting strips (12). A docking frame (5) is rotatably set on the upper side of the encapsulation base (4) corresponding to the bonding plate (14). Toothed airbags (11) connected to a pneumatic air supply source are installed on both sides of the docking frame (5). A roller pressing assembly for continuous pressing of the packaged chip is provided directly above the packaging base (4). The roller pressing assembly includes a sliding frame (8) that slides radially along the packaging platform (1). A pressing frame (6) is provided perpendicularly to the bottom of the sliding frame (8). A pressure roller (9) is provided longitudinally on the pressing frame (6) that is vertically corresponding to the packaging base (4) and whose longitudinal spacing is adjustable.

2. The sensor chip packaging structure employing an array cross-linking heat dissipation method according to claim 1, characterized in that, The outer side of the clamping frame (6) is provided with a dynamically adjustable structure, which includes a hinge column (17) disposed on the inner side of the clamping frame (6). The outer side of the upper end of the hinge column (17) is rotatably connected to a swing plate (19). The inner side of the swing plate (19) is connected to the pressure roller (9) through a rotating rod (15).

3. The sensor chip packaging structure employing an array cross-linking heat dissipation method according to claim 2, characterized in that, A spring (20) connected to a clamping frame (6) is installed on the outside of the swing plate (19), and a miniature cylinder (18) whose output end is rotatably connected to the lower side of the swing plate (19) is installed on the clamping frame (6).

4. The sensor chip packaging structure using an array cross-linking heat dissipation method according to claim 2, characterized in that, The upper end of the clamping frame (6) is equipped with a direct drive shift rod (16), the lower end of the sliding frame (8) is slidably mounted on the direct drive shift rod (16), and the lower end of the sliding frame (8) is provided with a slide rail rod (7) for its radial movement.

5. The sensor chip packaging structure employing an array cross-linking heat dissipation method according to claim 1, characterized in that, The docking frame (5) has a broken structure in the middle of the toothed airbag (11), and the encapsulation base (4) has a drive structure embedded in the hinge of the docking frame (5).

6. The sensor chip packaging structure employing an array cross-linking heat dissipation method according to claim 5, characterized in that, A flexible sealing ring (10) is fitted in the middle of the outer ring side of the pressure roller (9), and the outer periphery of the flexible sealing ring (10) initially corresponds to the break point on the docking frame (5).

7. The sensor chip packaging structure employing an array cross-linking heat dissipation method according to claim 1, characterized in that, The outer side of the packaging stage (1) is provided with an annular guide hole (2). The rotating stage (3) is equipped with a slider (13) at the lower end of the annular guide hole (2). The rotating stage (3) achieves the change of the loading position before chip packaging by rotating the slider (13) in the annular guide hole (2). The docking frame (5) achieves the change of the unloading position after chip packaging by rotating the circumferentially on the packaging base (4).

8. The sensor chip packaging structure employing an array cross-linking heat dissipation method according to any one of claims 1-7, characterized in that, The sensor chip packaging method using array cross-linking heat dissipation includes the following steps: The sensor chip is first placed in the docking frame (5) by a mechanical gripping device, and the toothed airbag (11) is filled in segments by a pneumatic air supply source, and the segmented inflation is carried out to fit the size of the sensor chip to complete the fixation; then the docking frame (5) is rotated to the rotating table (3) and overlapped, at which point a preliminary docking is formed with the substrate pre-placed on the packaging base (4), and then the rotating table (3) drives the overlapped body to rotate to stop below the pressure roller (9); The clamping frame (6) moves back and forth via the direct drive rod (6) to drive the pressure roller (9) to perform a rolling action on the surface of the packaged chip structure, thereby achieving stable pressing between the chip and the substrate. The pressure roller (9) is equipped with a contact sensor. When the contact pressure is sensed in real time, the extension and retraction length of the micro cylinder (18) is adjusted according to the current packaging limit conditions of the chip and the substrate, so that the swing plate (19) drives the pressure roller (9) to move vertically to achieve the adjustment of the gap between the packaged chip and the substrate, thereby achieving the purpose of real-time adjustment according to the packaging size.

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