Low-temperature plasma bonding support plate capacitor embedding integration device and process
By using a carrier plate embedded in a low-temperature plasma bonding device, the wiping component adsorbs chemical solutions, keeping the carrier plate surface clean. Combined with automatic positioning and a vacuum high-temperature and high-pressure environment, the problem of chemical residue in the carrier plate recesses is solved, achieving a high-quality lamination and drilling process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-29
- Publication Date
- 2026-03-24
AI Technical Summary
Chemical residue can easily remain in the recesses of the substrate during etching, affecting the lamination process.
The carrier plate embedded container integration device using low-temperature plasma bonding includes a wiping component, a reuse component, and an automatic positioning component. The wiping component adsorbs chemical solutions, the reuse component keeps the plate dry, and the automatic positioning component ensures the center positioning of the carrier plate. The lamination and drilling are carried out in a vacuum, high temperature and high pressure environment.
It effectively removes chemical solutions from the recesses of the carrier plate, ensuring the quality of the lamination process, preventing bubble formation, and achieving reliable vertical electrical interconnection.
Smart Images
Figure CN121729014A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of integrated circuit boards, in particular to a low-temperature plasma bonded carrier plate embedded capacitor integration device and process. BACKGROUND
[0002] The low-temperature plasma bonded carrier plate is a kind of three-dimensional packaging structure formed by permanently bonding multiple silicon interposers, glass substrates or other carrier plate materials together at a relatively low temperature (usually < 400°C) through low-temperature plasma activation and direct bonding technology. The embedded capacitor processing of the carrier plate refers to manufacturing a distributed capacitor layer inside the integrated circuit packaging substrate through specific materials and processes, so that the capacitor layer is installed inside the carrier plate, thereby improving the integration of the carrier plate. When the carrier plate is embedded and processed, the carrier plate needs to be soaked in chemical water first, and the surface of the carrier plate is formed with a specified circuit pattern through etching of the chemical water. The semi-cured sheet is pressed on the carrier plate through a laminating device to form an insulating layer. After the pressing process, a laser drilling device is used to drill holes at specified positions on the carrier plate to expose the underlying embedded capacitor electrode, thereby realizing vertical electrical connection. In the prior art, when the carrier plate needs to be laminated, the carrier plate needs to be soaked in chemical water for etching process, so that the surface of the carrier plate will be left with chemical water. Although the carrier plate is wiped, the recessed area formed by etching may still have residual chemical water. If the residual chemical water remains on the carrier plate during the laminating process, it will easily cause bubbles in the cross section of the combination, affecting the processing effect of the carrier plate. Therefore, the application provides a low-temperature plasma bonded carrier plate embedded capacitor integration device and process. SUMMARY
[0003] The purpose of the application is to solve the problem that the recessed area of the carrier plate is easy to have residual chemical water in the background art, and to provide a low-temperature plasma bonded carrier plate embedded capacitor integration device and process.
[0004] In a first aspect, the application provides a low-temperature plasma bonded carrier plate embedded capacitor integration device, which comprises a laminating machine shell, a first supporting plate is fixed on one side of the laminating machine shell, a first conveying belt is installed on the inner wall of the first supporting plate, a second supporting plate is fixed on the other side of the laminating machine shell, a drilling machine shell is fixed on the top end of the second supporting plate, a laser drilling machine is installed in the drilling machine shell, a second conveying belt is installed in the second supporting plate, a first hydraulic rod is fixed on the top end of the inner wall of the laminating machine shell, a pressing plate is fixed on the output end of the first hydraulic rod, a bottom plate is fixed on the bottom of the inner wall of the laminating machine shell, and the device further comprises a wiping assembly, a recycling assembly and an automatic positioning assembly. The wiping assembly is used for adsorbing chemical agents remaining in the recesses of the carrier plate surface, preventing the chemical agents from remaining in the recesses of the carrier plate; The recycling assembly is used for keeping the wiping assembly dry and continuously adsorbing the chemical agents. The automatic positioning assembly is used for automatically positioning the two sides of the carrier plate when the carrier plate enters the laminating machine shell, keeping the carrier plate at the center of the bottom plate, and facilitating the laminating processing of the carrier plate.
[0005] Optionally, the wiping assembly comprises a fixed plate fixedly connected to one side of the first supporting plate, a third conveying belt installed at the top end of the fixed plate, an adsorption layer fixedly connected to the outer wall of the third conveying belt, a plurality of long grooves formed in the outer wall of the adsorption layer, a first pulley fixedly connected to one side of the third conveying belt driving shaft, a transmission belt sleeved on the outer wall of the first pulley, a second pulley sleeved on the inner wall of the transmission belt on the other side, an adsorption roller fixedly connected to one side of the second pulley, a top frame fixedly connected to the top end of the fixed plate, and the adsorption roller rotatably connected to the inner wall of the top frame.
[0006] Optionally, the inner wall of the top frame is fixedly connected to a scraper, the bottom of the scraper is inclined to one side, the bottom of the scraper is arranged at the top end of the adsorption layer, and the scraper is arranged on one side of the adsorption roller.
[0007] Optionally, the recycling assembly comprises an air frame fixedly connected to the top end of the top frame, a filter plate fixedly connected to the top end of the air frame, a fan fixedly connected to the bottom of the filter plate, and a heating plate fixedly connected to the bottom of the air frame and arranged at the top end of the adsorption roller.
[0008] Optionally, one side of the laminating machine shell is slidably connected to a first sealing door, the other side of the laminating machine shell is installed with a second sealing door, and both sides of the drilling machine shell are installed with two groups of third sealing doors; one side of the first sealing door is fixedly connected to a second hydraulic rod, the output end of the second hydraulic rod is fixedly connected to a push plate, and the push plate is arranged on one side of the bottom plate.
[0009] Optionally, the automatic positioning assembly comprises an elongated rod fixedly connected to one side of the pressing plate, two side grooves formed in the inner wall of the laminating machine shell, the elongated rod slidably arranged in the inner wall of the side groove, a square plate slidably connected to the inner wall of the side groove, a baffle fixedly connected to the inner wall of the side groove and arranged at the top end of the square plate, a rope fixedly connected to the top end of the square plate, a circular groove formed in the inner wall of the laminating machine shell and penetrating the side groove, one end of the rope extending into the inner wall of the laminating machine shell through the circular groove, a clamping plate fixedly connected to one end of the rope, a gasket fixedly connected to one side of the clamping plate, the clamping plate arranged at the top end of the bottom plate, a spring fixedly connected to one end of the clamping plate and arranged on one side of the inner wall of the laminating machine shell, and a limiting rod fixedly connected to the top end of the bottom plate and penetrating the pressing plate.
[0010] Optionally, the inner wall of the circular groove is fixedly connected with a sleeve ring, the sleeve ring is made of rubber material, the inner wall of the sleeve ring is rotatably connected with a plurality of groups of rolling balls, and the rope is arranged on the inner wall of the sleeve ring.
[0011] Optionally, two groups of circular rollers are installed on the inner wall bottom of the laminating machine shell, the two groups of circular rollers are symmetrically distributed on the two sides of the bottom plate, and one side of the second sealing door is fixedly connected with a stopper.
[0012] Optionally, the inside of the drilling machine shell is fixedly connected with a mounting piece, the bottom of the mounting piece is rotatably connected with a positioning roller, the outer wall of the positioning roller is sleeved with a rubber sleeve, and the positioning roller is provided in a plurality of groups and symmetrically distributed on the two sides of the inner wall of the drilling machine shell.
[0013] In a second aspect, a carrier plate embedded integration process is applied to the low-temperature plasma bonding carrier plate embedded integration device in the first aspect, and the process comprises the following steps: S1, clean the surface of the etched carrier plate and place it on the first conveyor belt, wipe the chemical water in the recesses of the carrier plate surface clean through the wiping assembly, and place the prepared prepreg on the clean carrier plate; S2, the carrier plate and the prepreg are conveyed into the laminating machine shell through the first conveyor belt, the laminating machine shell is closed through the first sealing door and the second sealing door, and the pressing plate is pushed downward through the first hydraulic rod, so that the prepreg becomes a molten state in a vacuum, high temperature and high pressure environment, can fill all the line gaps on the carrier plate, and form a smooth surface to prevent the embedded layer from short-circuiting with the upper layer circuit and protect the fragile embedded layer structure; S3, the carrier plate after laminating is pushed into the drilling machine shell through the second hydraulic rod and the push plate, the position of the carrier plate is kept at the center through a plurality of positioning rollers, and a micro blind hole is accurately drilled on the just laminated insulating layer through the laser drilling machine to expose the embedded electrode pad to be connected in the lower layer; S4, a thin layer of chemical copper is deposited on the hole wall of the carrier plate through the copper deposition process, a dense, firm and low-resistance copper layer is formed in the hole, and reliable vertical electrical interconnection can be realized.
[0014] Compared with the prior art, the present application has at least one of the following beneficial technical effects: The present application transports the carrier plate to one side through the first conveyor belt, wipes the surface of the carrier plate through the wiping assembly, erases the chemical water remaining in the recesses of the carrier plate, keeps the surface of the carrier plate clean, and promotes the wiping assembly to remain dry through the reusing assembly, so as to further improve the efficiency of absorbing chemical water and solve the problem that chemical water is easily left in the recesses of the carrier plate. Furthermore, by setting up an automatic positioning component, the positioning of the carrier plate can be controlled according to the up and down movement of the pressure plate, so that the carrier plate is kept in the center of the base plate. Then, by activating the first hydraulic rod, the pressure plate is pushed downward. When the pressure plate moves downward, the automatic positioning component can be removed from the base plate according to the height of the pressure plate, thereby facilitating the pressing process of the carrier plate and the prepreg. Attached Figure Description
[0015] Figure 1 A schematic diagram of the overall structure of a carrier-embedded container integration device and process for low-temperature plasma bonding. Figure 2 A schematic cross-sectional view of the overall structure of a carrier-embedded integrated device and process for low-temperature plasma bonding. Figure 3 for Figure 2 An enlarged structural diagram at point A; Figure 4 for Figure 2 An enlarged structural diagram at point B; Figure 5 This is a schematic diagram of the top frame and wind frame structure; Figure 6 This is a schematic diagram of the wiping component structure; Figure 7 This is a schematic diagram of the cross-sectional structure of the laminator housing; Figure 8 for Figure 7 An enlarged structural diagram at point C; Figure 9 This is a schematic diagram of the structure surrounding the pressure plate and the base plate; Figure 10 This is a schematic diagram of the second hydraulic rod and push plate structure; Figure 11 This is a schematic diagram of the positioning roller structure.
[0016] Reference numerals: 1. Laminator housing; 2. First pallet; 3. First conveyor belt; 4. Second pallet; 5. Drilling machine housing; 6. Second conveyor belt; 7. First hydraulic rod; 8. Pressure plate; 9. Base plate; 10. Laser drilling machine; 11. First sealing door; 12. Second sealing door; 13. Third sealing door; 14. Fixing plate; 15. Third conveyor belt; 16. Adsorption layer; 17. Long trough; 18. Top frame; 19. Scraper; 20. Adsorption roller ; 21. First pulley; 22. Transmission belt; 23. Second pulley; 24. Wind frame; 25. Fan; 26. Heating plate; 27. Side groove; 28. Long rod; 29. Limiting rod; 30. Square plate; 31. Baffle; 32. Rope; 33. Spring; 34. Clamping plate; 35. Gasket; 36. Collar; 37. Second hydraulic rod; 38. Push plate; 39. Circular roller; 40. Stop block; 41. Mounting plate; 42. Positioning roller. Detailed Implementation
[0017] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0018] like Figure 1 and Figure 2 As shown, the present invention proposes a low-temperature plasma bonding carrier embedded container integration device, comprising a laminator housing 1. A first support plate 2 is fixedly connected to one side of the laminator housing 1, and a first conveyor belt 3 is installed on the inner wall of the first support plate 2. The first support plate 2 is used to install the first conveyor belt 3, and the carrier plate can be transported to the drilling housing 5 by the first conveyor belt 3. A second support plate 4 is fixedly connected to the other side of the laminator housing 1, and the drilling housing 5 is fixedly connected to the top of the second support plate 4. The second support plate 4 is used to support the drilling housing 5. The drilling machine housing 5 provides support, and a laser drilling machine 10 is installed inside the drilling machine housing 5. The laser drilling machine 10 is used to drill holes on the surface of the carrier plate. A second conveyor belt 6 is installed inside the second support plate 4. A first hydraulic rod 7 is fixed to the top of the inner wall of the laminator housing 1. A pressure plate 8 is fixed to the output end of the first hydraulic rod 7. The first hydraulic rod 7 is used to push the pressure plate 8 downward. A bottom plate 9 is fixed to the bottom of the inner wall of the laminator housing 1. The bottom plate 9 is used to cooperate with the pressure plate 8 to laminate the carrier plate and the prepreg.
[0019] It should be noted that, as Figure 3 , Figure 5 and Figure 6As shown, the wiping assembly of the carrier plate embedded container integrated device is used to adsorb residual chemical agents in the recesses of the carrier plate surface, preventing chemical agents from remaining in the recesses of the carrier plate. The wiping assembly includes a fixing plate 14, which is fixed to one side of the first support plate 2. A third conveyor belt 15 is installed at the top of the fixing plate 14, and an adsorption layer 16 is fixed to the outer wall of the third conveyor belt 15. When the carrier plate passes the bottom of the top frame 18, the third conveyor belt 15 can be activated, which drives the adsorption layer 16 to move together. Since the adsorption layer 16 is attached to the surface of the carrier plate, it can remove residual chemical agents from the top of the carrier plate. The adsorption layer 16 has multiple sets of elongated grooves 17 on its outer wall. Because of these grooves, the adsorption layer 16 deforms under pressure from the carrier plate when it contacts the carrier plate. The grooves also increase the deformation area of the adsorption layer 16, facilitating the adsorption of chemicals from the recesses of the carrier plate and maintaining the cleanliness of the carrier plate surface. A first pulley 21 is fixed to one side of the drive shaft of the third conveyor belt 15. A transmission belt 22 is fitted onto the outer wall of the first pulley 21, and a second belt 22 is fitted onto the other side of the inner wall of the transmission belt 22. The second pulley 23 has an adsorption roller 20 fixedly connected to one side. A top frame 18 is fixedly connected to the top of the fixed plate 14. The adsorption roller 20 is rotatably connected to the inner wall of the top frame 18. When the third conveyor belt 15 is running, its drive shaft can drive the first pulley 21 to rotate, which in turn drives the transmission belt 22 and the second pulley 23 to rotate together. The second pulley 23 can drive the adsorption roller 20 to rotate, thereby absorbing the chemical solution adhering to the adsorption layer 16 through contact between the adsorption roller 20 and the adsorption layer 16, maintaining the adsorption force of the adsorption layer 16. The inner wall of the top frame 18 is fixedly connected to the top. A scraper 19 is attached. When the adsorption layer 16 passes through the scraper 19, it will be squeezed by the bottom of the scraper 19. The scraper 19 can squeeze out the chemical liquid on the adsorption layer 16. The bottom of the scraper 19 is tilted to one side and is located at the top of the adsorption layer 16. The scraper 19 is located on one side of the adsorption roller 20. Because the bottom of the scraper 19 is tilted to one side, the scraped chemical liquid can adhere to the top of the tilt. At the same time, the adsorption roller 20 is located on one side of the tilt of the scraper 19 and can absorb the chemical liquid scraped out by the scraper 19, which can improve the cleaning of the adsorption layer 16.
[0020] Furthermore, such as Figure 3 and Figure 5As shown, the reuse component of the carrier plate embedded container integrated device is used to keep the wiping component dry and to continuously adsorb chemical agents. The reuse component includes an air frame 24, which is fixed to the top of the top frame 18. A filter plate is fixed to the top of the air frame 24, which can filter the airflow entering the air frame 24. A fan 25 is fixed to the bottom of the filter plate. When the third conveyor belt 15 is running, the fan 25 can be started to generate a downward airflow. A heating plate 26 is fixed to the bottom of the air frame 24. When the airflow flows downward, it will pass through the heating plate 26 and be heated into hot air by the heating plate 26. The heating plate 26 is set at the top of the adsorption roller 20. When the hot air flows downward to the adsorption roller 20, it can dry the adsorption roller 20 and keep the adsorption roller 20 dry.
[0021] Furthermore, such as Figure 2 , Figure 4 , Figure 7 and Figure 10 As shown, a stop block 40 is fixedly connected to one side of the second sealing door 12. By setting the stop block 40, the position of one side of the carrier plate can be limited when the carrier plate enters the laminator housing 1, preventing the carrier plate from moving out of the bottom plate 9. A first sealing door 11 is slidably connected to one side of the laminator housing 1, and a second sealing door 12 is installed on the other side of the laminator housing 1. By setting the first sealing door 11 and the second sealing door 12, the first sealing door 11 and the second sealing door 12 can seal both sides of the laminator housing 1 during the lamination process of the carrier plate, making it easy to maintain a vacuum inside the laminator housing 1 by using a vacuum pump. The vacuum environment is beneficial to the bonding of the carrier plate and the prepreg. Two sets of third sealing doors 13 are installed on both sides of the drilling housing 5. A second liquid... The pressure rod 37 has a push plate 38 fixedly connected to its output end. The push plate 38 is located on one side of the base plate 9. After the lamination process is completed, the second sealing door 12 and the third sealing door 13 can be opened first, and then the second hydraulic rod 37 can be activated. The second hydraulic rod 37 can push the pressed carrier plate into the drilling machine housing 5, and cooperate with the second conveyor belt 6 to transport the pressed carrier plate to the bottom of the laser drilling machine 10. Two sets of rollers 39 are installed on the bottom of the inner wall of the laminator housing 1. The two sets of rollers 39 are symmetrically distributed on both sides of the base plate 9. By setting two sets of rollers 39 on the bottom of the inner wall of the laminator housing 1, the bottom of the carrier plate can contact the rollers 39 when the carrier plate enters the laminator housing 1 and moves out of the laminator housing 1, so that the rotation of the rollers 39 can facilitate the transport of the carrier plate.
[0022] In this process, such as Figure 7 - Figure 9As shown, the automatic positioning component of the carrier plate embedded integrated device is used to automatically position both sides of the carrier plate when it enters the laminator housing 1, while keeping the carrier plate in the center of the base plate 9 for easy lamination processing. The automatic positioning component includes a long rod 28, which is fixed to one side of the pressure plate 8. The movement of the long rod 28 can be controlled by the movement of the pressure plate 8. Side grooves 27 are provided on both sides of the inner wall of the laminator housing 1. The long rod 28 is slidably disposed on the inner wall of the side groove 27, and the side groove 27 can limit the movement of the long rod 28. A square plate 30 is slidably connected to the inner wall of the side groove 27. The height of the square plate 30 can be controlled by the up and down movement of the pressure plate 8 and the long rod 28. A baffle 31 is fixed to the inner wall of the side groove 27. A baffle 31 is positioned at the top of the square plate 30 to prevent it from being pulled over by the rope 32 and to limit its height. The rope 32 is fixedly connected to the top of the square plate 30. A circular groove is formed on the inner wall of the laminator housing 1, penetrating the side groove 27. The groove allows the rope 32 to extend and connect to the clamping plate 34. One end of the rope 32 extends into the inner wall of the laminator housing 1 through the circular groove. A collar 36, made of rubber, is fixedly connected to the inner wall of the circular groove. The rubber collar 36 protects the rope 32 within the collar 36. Multiple sets of ball bearings are rotatably connected to the inner wall of the collar 36. The rope 32 is positioned on the inner wall of the collar 36, and the multiple sets of ball bearings within the collar 36 can... When the rope 32 slides, the friction between the rope 32 and the collar 36 is reduced by driving the ball bearings to slide. One end of the rope 32 is fixedly connected to a clamping plate 34, which can be used to fix the two sides of the carrier plate. A gasket 35 is fixedly connected to one side of the clamping plate 34, which can protect the two sides of the carrier plate when clamping it. The clamping plate 34 is set at the top of the base plate 9. A spring 33 is fixedly connected to one side of the inner wall of the laminator housing 1. One end of the spring 33 is fixedly connected to the clamping plate 34. The spring 33 is used to provide a push force to one side to the clamping plate 34, maintaining the tendency of the clamping plate 34 to move towards the base plate 9. By controlling the height of the pressure plate 8, the two sets of clamping plates 34 can be switched between before clamping, during clamping, and after clamping. The pressure plate 8 is located at the middle of the laminator housing 1. At this time, the two sets of clamping plates 34 are in the pre-clamping state. After the carrier plate moves to the bottom plate 9, the pressure plate 8 can be moved to the upper part of the inner wall of the laminator housing 1. At this time, the spring 33 can lose its compressive force and push the clamping plates 34 to clamp the carrier plate, keeping the carrier plate in the center of the bottom plate 9. When the pressure plate 8 moves down to the lower part of the inner wall of the laminator housing 1, the long rod 28 will push the square plate 30 and the rope 32 to move, driving the two sets of clamping plates 34 to move to both sides, so that the clamping plates 34 are removed from the bottom plate 9, preventing the clamping plates 34 from hindering the lamination process. The top of the bottom plate 9 is fixed with a limiting rod 29, which passes through the pressure plate 8. By setting the limiting rod 29, the movement trajectory of the top plate can be limited when the top plate moves up and down.
[0023] In this embodiment, as Figure 11 As shown, an mounting plate 41 is fixedly connected inside the drilling machine housing 5. A positioning roller 42 is rotatably connected to the bottom of the mounting plate 41. By setting the mounting plate 41, the positioning roller 42 can be easily installed inside the drilling machine housing 5. The outer wall of the positioning roller 42 is covered with a rubber sleeve. By setting the rubber sleeve on the outer wall of the positioning roller 42, damage can be prevented when the positioning roller 42 comes into contact with the carrier plate. Multiple sets of positioning rollers 42 are provided and are symmetrically distributed on both sides of the inner wall of the drilling machine housing 5. When the carrier plate moves into the drilling machine housing 5, the multiple sets of positioning rollers 42 on both sides can keep the carrier plate at the center of the drilling machine housing 5 and cooperate with the second conveyor belt 6 to control the position of the carrier plate.
[0024] A substrate-embedded capacitor integration process, applied to the aforementioned low-temperature plasma bonding substrate-embedded capacitor integration device, includes the following steps: S1. Clean the surface of the etched carrier board and place it on the first conveyor belt 3. Wipe the chemical solution in the recessed areas of the carrier board surface clean with the wiping component, and place the prepared semi-cured sheet on the clean carrier board. S2. The carrier plate and the prepreg are conveyed into the laminator housing 1 by the first conveyor belt 3. The laminator housing 1 is sealed by the first sealing door 11 and the second sealing door 12. The pressure plate 8 is pushed downward by the first hydraulic rod 7. Under vacuum, high temperature and high pressure environment, the prepreg becomes molten, which can fill all the line gaps on the carrier plate and form a flat surface, preventing the embedded capacitor layer from short-circuiting with the upper circuit and protecting the fragile embedded capacitor layer structure. S3. The laminated carrier plate is pushed into the drilling machine housing 5 by the second hydraulic rod 37 and the push plate 38. The carrier plate is kept in the center by multiple sets of positioning rollers 42. The laser drilling machine 10 precisely drills micro blind holes on the newly laminated insulating layer to expose the embedded capacitor electrode pads that need to be connected in the lower layer. S4. A thin layer of chemical copper is deposited on the wall of the hole in the carrier board through the copper plating process, forming a dense, strong, low-resistance copper layer in the hole, which can achieve reliable vertical electrical interconnection.
[0025] Working Principle: To address the issue of chemical residue easily remaining in the recesses of the carrier plate, when processing is required, the carrier plate can be placed at the top of the first conveyor belt 3 and transported to one side by the first conveyor belt 3. When the carrier plate passes the bottom of the top frame 18, the third conveyor belt 15 can be activated, which moves the adsorption layer 16 along with it. Since the adsorption layer 16 adheres to the surface of the carrier plate, it can adsorb the chemical residue remaining at the top of the carrier plate. Because the surface of the adsorption layer 16 is provided with multiple sets of elongated grooves 17, the adsorption layer 16 will deform under the pressure of the carrier plate when it comes into contact with it. At the same time, the elongated grooves 17 can increase the deformation area of the adsorption layer 16, making it easier to adsorb the chemical residue in the recesses of the carrier plate through the deformation of the adsorption layer 16, keeping the surface of the carrier plate clean. When the conveyor belt 15 is running, its drive shaft drives the first pulley 21 to rotate, which in turn drives the transmission belt 22 and the second pulley 23 to rotate together. The second pulley 23 drives the adsorption roller 20 to rotate, thereby absorbing the chemical solution adhering to the adsorption layer 16 through contact between the adsorption roller 20 and the adsorption layer 16, maintaining the adsorption force of the adsorption layer 16. When the adsorption layer 16 passes the scraper 19, it is subjected to the squeezing effect of the bottom of the scraper 19, which can squeeze out the chemical solution on the adsorption layer 16. Since the bottom of the scraper 19 is inclined to one side, the scraped chemical solution can adhere to the top of the inclined area. At the same time, the adsorption roller 20 is located on one side of the inclined area of the scraper 19, and can absorb the chemical solution scraped out by the scraper 19 through the adsorption roller 20, which can improve the cleaning of the adsorption layer 16. By reusing the components, when the third conveyor belt 15 is running, the fan 25 can be started to generate a downward airflow. The filter plate can filter the airflow entering the air frame 24. When the airflow flows downward, it will pass through the heating plate 26 and be heated into hot air. When the hot air flows downward to the adsorption roller 20, it can dry the adsorption roller 20, so as to keep the adsorption roller 20 dry, thereby further improving the efficiency of absorbing chemical solutions. After drying, a prepreg is placed on the carrier plate. Then, the first sealing door 11 is opened, and the carrier plate and prepreg are conveyed into the laminator housing 1 via the first conveyor belt 3. A set of rollers 39 are used to transport the carrier plate and prepreg onto the base plate 9. The pressure plate 8 is moved to the middle of the inner wall of the laminator housing 1 by retracting the first hydraulic rod 7. At this time, the long rod 28 will move upward a certain distance with the pressure plate 8, and the restoring force of the spring 33 will push the clamping plate 34 to move onto the base plate 9 until the carrier plate and prepreg are moved to the bottom. After plate 9 is in place, the first hydraulic rod 7 can be retracted to move the pressure plate 8 upward. When the pressure plate 8 moves upward, it will move the long rod 28 along with it. At this time, the square plate 30 in the side groove 27 will lose its thrust, and the spring 33 will push the clamping plate 34 to one side after losing its compressive force. When the clamping plate 34 moves, it will move the rope 32 along with it. By setting a rubber collar 36 in the circular groove, the rope 32 in the collar 36 can be protected. The multiple sets of balls set in the collar 36 can prevent the rope 32 from sliding. By reducing friction between the rope 32 and the collar 36 by sliding the ball bearings, the rope 32 moves upward, causing the square plate 30 to move until the two sets of clamping plates 34 contact the carrier plate. The equal thrust of the two sets of springs 33 keeps the carrier plate 9 centered, thus positioning it. Then, the first hydraulic rod 7 can be activated to move the pressure plate 8 downward. As the pressure plate 8 moves downward, it causes the two sets of long rods 28 to move downward. When the long rods 28 contact the square plate 30, they push the square plate 30 downward. When 0 moves downward, it pulls the rope 32, causing the rope 32 to pull the clamping plate 34 to move to one side and squeeze the spring 33, so that the square plate 30 gradually moves away from the bottom plate 9. This does not prevent the pressure plate 8 from pressing onto the carrier plate and the prepreg, making it easier to press the carrier plate and the prepreg together. When the carrier plate is laminated, the first sealing door 11 and the second sealing door 12 seal both sides of the laminator housing 1, making it easier to maintain a vacuum inside the laminator housing 1 through the vacuum equipment. The vacuum environment is conducive to the bonding of the carrier plate and the prepreg. After the lamination process is completed, the second sealing door 12 and the third sealing door 13 can be opened first. Then, the second hydraulic rod 37 can be activated to push the pressed carrier plate into the drilling machine housing 5. Another set of rollers 39 can be used to move the pressed carrier plate from the bottom plate 9 to one side. When the carrier plate moves into the drilling machine housing 5, multiple sets of positioning rollers 42 set on both sides can keep the carrier plate in the center of the drilling machine housing 5 and cooperate with the second conveyor belt 6 to control the position of the carrier plate. By setting a rubber sleeve on the outer wall of the positioning roller 42, damage can be prevented when the positioning roller 42 contacts the carrier plate. The pressed carrier plate can be transported to the bottom of the laser drilling machine 10 through the second conveyor belt 6, and the laser drilling machine 10 can be started to drill holes on the surface of the carrier plate.
[0026] The above specific embodiments are merely several optional embodiments of the present invention. Based on the technical solutions of the present invention and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.
Claims
1. A low-temperature plasma bonding carrier embedded container integration device, comprising a laminator housing (1), a first support plate (2) fixedly connected to one side of the laminator housing (1), a first conveyor belt (3) installed on the inner wall of the first support plate (2), a second support plate (4) fixedly connected to the other side of the laminator housing (1), a drilling housing (5) fixedly connected to the top of the second support plate (4), a laser drilling machine (10) installed inside the drilling housing (5), a second conveyor belt (6) installed inside the second support plate (4), a first hydraulic rod (7) fixedly connected to the top of the inner wall of the laminator housing (1), a pressure plate (8) fixedly connected to the output end of the first hydraulic rod (7), and a bottom plate (9) fixedly connected to the bottom of the inner wall of the laminator housing (1), characterized in that: It also includes wiping components, reuse components, and automatic positioning components; The wiping assembly is used to absorb residual chemical agents in the recesses of the carrier plate surface, preventing chemical agents from remaining in the recesses of the carrier plate. The reuse component is used to keep the wiping component dry and to continuously absorb chemical agents; The automatic positioning component is used to automatically position the two sides of the carrier plate when the carrier plate enters the laminator housing (1), and at the same time keep the carrier plate in the center of the base plate (9) to facilitate the lamination process of the carrier plate.
2. The low-temperature plasma bonding carrier-embedded integrated device according to claim 1, characterized in that, The wiping assembly includes a fixing plate (14), which is fixed to one side of the first tray (2). A third conveyor belt (15) is installed on the top of the fixing plate (14). An adsorption layer (16) is fixed to the outer wall of the third conveyor belt (15). Multiple sets of long grooves (17) are opened on the outer wall of the adsorption layer (16). A first pulley (21) is fixed to one side of the drive shaft of the third conveyor belt (15). A transmission belt (22) is sleeved on the outer wall of the first pulley (21). A second pulley (23) is sleeved on the other side of the inner wall of the transmission belt (22). An adsorption roller (20) is fixed to one side of the second pulley (23). A top frame (18) is fixed to the top of the fixing plate (14). The adsorption roller (20) is rotatably connected to the inner wall of the top frame (18).
3. The low-temperature plasma bonding carrier embedded container integration device according to claim 2, characterized in that, The inner wall of the top frame (18) is fixed with a scraper (19), the bottom of the scraper (19) is tilted to one side, the bottom of the scraper (19) is set at the top of the adsorption layer (16), and the scraper (19) is set on one side of the adsorption roller (20).
4. The low-temperature plasma bonding carrier-embedded integrated device according to claim 3, characterized in that, The reuse component includes a wind frame (24), which is fixed to the top of the top frame (18). A filter plate is fixed to the top of the wind frame (24), a fan (25) is fixed to the bottom of the filter plate, and a heating plate (26) is fixed to the bottom of the wind frame (24). The heating plate (26) is located at the top of the adsorption roller (20).
5. The low-temperature plasma bonding carrier-embedded integrated device according to claim 4, characterized in that, A first sealing door (11) is slidably connected to one side of the laminator housing (1), a second sealing door (12) is installed on the other side of the laminator housing (1), and two sets of third sealing doors (13) are installed on both sides of the drilling housing (5). A second hydraulic rod (37) is fixedly connected to one side of the first sealing door (11), and a push plate (38) is fixedly connected to the output end of the second hydraulic rod (37). The push plate (38) is located on one side of the base plate (9).
6. The low-temperature plasma bonding carrier embedded container integration device according to claim 5, characterized in that, The automatic positioning component includes a long rod (28) fixed to one side of the pressure plate (8). Side grooves (27) are provided on both sides of the inner wall of the laminator housing (1). The long rod (28) is slidably disposed on the inner wall of the side groove (27). A square plate (30) is slidably connected to the inner wall of the side groove (27). A baffle (31) is fixedly disposed on the inner wall of the side groove (27). The baffle (31) is disposed at the top of the square plate (30). A rope (32) is fixedly disposed at the top of the square plate (30). A circular groove is provided on the inner wall of the laminator housing (1). The circular groove penetrates the side groove (27), one end of the rope (32) extends into the inner wall of the laminator housing (1) through the circular groove, one end of the rope (32) is fixed to a clamping plate (34), one side of the clamping plate (34) is fixed to a gasket (35), the clamping plate (34) is set at the top of the bottom plate (9), one side of the inner wall of the laminator housing (1) is fixed to a spring (33), one end of the spring (33) is fixed to the clamping plate (34), the top of the bottom plate (9) is fixed to a limiting rod (29), and the limiting rod (29) penetrates the pressure plate (8).
7. The low-temperature plasma bonding carrier-embedded integrated device according to claim 6, characterized in that, A collar (36) is fixed to the inner wall of the circular groove. The collar (36) is made of rubber. Multiple sets of balls are rotatably connected to the inner wall of the collar (36). The rope (32) is set on the inner wall of the collar (36).
8. The low-temperature plasma bonding carrier-embedded integrated device according to claim 7, characterized in that, Two sets of rollers (39) are installed on the bottom of the inner wall of the laminator housing (1). The two sets of rollers (39) are symmetrically distributed on both sides of the bottom plate (9). A stop block (40) is fixed to one side of the second sealing door (12).
9. The low-temperature plasma bonding carrier-embedded integrated device according to claim 8, characterized in that, The drilling machine housing (5) is fixedly connected to an installation plate (41). The bottom of the installation plate (41) is rotatably connected to a positioning roller (42). The outer wall of the positioning roller (42) is covered with a rubber sleeve. Multiple sets of positioning rollers (42) are provided and are symmetrically distributed on both sides of the inner wall of the drilling machine housing (5).
10. A carrier-embedded capacitor integration process, applied to the low-temperature plasma bonding carrier-embedded capacitor integration device described in claim 9, characterized in that, The process includes the following steps: S1. Clean the surface of the etched substrate and place it on the first conveyor belt (3). Wipe the chemical solution in the recessed area of the substrate surface with the wiping assembly and place the prepared semi-cured sheet on the clean substrate. S2. The carrier plate and the prepreg are conveyed into the laminator housing (1) by the first conveyor belt (3). The laminator housing (1) is sealed by the first sealing door (11) and the second sealing door (12). The pressure plate (8) is pushed down by the first hydraulic rod (7). Under vacuum, high temperature and high pressure, the prepreg becomes molten, which can fill all the gaps in the circuit on the carrier plate and form a flat surface, preventing the buried capacitor layer from short-circuiting with the upper circuit and protecting the fragile buried capacitor layer structure. S3. The laminated carrier plate is pushed into the drilling machine housing (5) by the second hydraulic rod (37) and the push plate (38). The carrier plate is kept in the center by multiple sets of positioning rollers (42). The laser drilling machine (10) precisely drills micro blind holes on the newly laminated insulation layer to expose the embedded capacitor electrode pads that need to be connected in the lower layer. S4. A thin layer of chemical copper is deposited on the wall of the hole in the carrier board through the copper plating process, forming a dense, strong, low-resistance copper layer in the hole, which can achieve reliable vertical electrical interconnection.