Four-axis three-station wafer carrying manipulator structure

Abstract

The invention relates to the technical field of wafer processing equipment, in particular to a four-axis three-station wafer carrying manipulator structure which comprises an angle rotating mechanism, a Z-axis moving assembly and an X-axis wafer taking module. The X-axis wafer taking module comprises an X-axis base plate, linear guide rails fixed to the two sides of the top end of the X-axis base plate, photoelectric switches fixed to the two ends of one side of the X-axis base plate, a rotating base fixed to the bottom of the X-axis base plate, a fifth servo motor, a third servo motor and a fourth servo motor, the left side and the right side of the top end of the X-axis base plate are each fixedly provided with a set of synchronous belt wheel assembly, synchronous belts are arranged in the synchronous belt wheel assemblies in a sleeved mode, multi-station efficient carrying is achieved, flexible dispatching can be achieved among a Load Port, a pre-aligner and a process cavity, the wafer waiting time is shortened, and the equipment utilization rate is increased; the system adapts to complex layout and is high in automation degree, an integrated sensor system can achieve automatic calibration, anti-collision detection and wafer existence detection, and manual intervention is reduced.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, specifically to a four-axis, three-station wafer handling robot structure. Background Technology

[0002] In semiconductor manufacturing, wafer handling is a critical step in the chip production process, directly affecting production efficiency, wafer yield, and equipment operational stability. Traditional wafer handling equipment mostly adopts a single-axis or dual-axis drive structure, which has problems such as limited degrees of freedom of movement, insufficient positioning accuracy, and weak load capacity, making it difficult to meet the high-precision, high-cleanliness, and high-throughput requirements of modern semiconductor manufacturing.

[0003] In existing technical solutions, adding an angle deflection axis increases mechanical complexity, may cause drift with long-term use, requires regular calibration, and has high maintenance costs. High-speed rotation may also cause end-effector jitter, affecting wafer placement accuracy. Four-axis operation requires coordinated motion planning, making timing control difficult. During high-cycle production, even a slight delay can lead to wafer transfer failure, significantly increasing manufacturing costs. In terms of application scenarios, not all processes require an angle deflection axis. Some inspection equipment only requires three axes (X / Y / Z), and using four axes would only increase unnecessary costs. Summary of the Invention

[0004] Technical problems to be solved

[0005] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a four-axis three-station wafer handling robot structure, which can effectively solve the problems of the need for coordinated motion planning of four axes, the difficulty of timing control, and the increase of unnecessary costs in the existing technology.

[0006] Technical solution

[0007] This invention provides a four-axis, three-station wafer handling robot structure, including an angle rotation mechanism, a Z-axis motion assembly, and an X-axis wafer picking module. The X-axis wafer picking module includes an X-axis base plate, linear guides fixed to both sides of the top of the X-axis base plate, photoelectric switches fixed to both ends of one side of the X-axis base plate, and a rotating base fixed to the bottom of the X-axis base plate. The bottom of the X-axis base plate is connected to a fifth servo motor, a third servo motor, and a fourth servo motor. A set of synchronous pulley assemblies is fixed to both the left and right sides of the top of the X-axis base plate, with a synchronous belt fitted inside each assembly. The bottom of the rotating base is fixedly connected to a disk in the angle rotation mechanism, and one side of the disk is fixedly connected to the Z-axis motion assembly. The Z-axis motion assembly includes a Z-axis linear motor and a Z-axis adapter plate sleeved on the outside of the Z-axis linear motor. The Z-axis adapter plate is fixedly connected to the angle rotation mechanism. The outside of the Z-axis linear motor is fixedly connected to the Y-axis motion assembly. The Y-axis motion assembly includes a Y-axis adapter plate fixed to the Z-axis linear motor, a Y-axis linear motor sleeved on the Y-axis adapter plate, and a first servo motor that is driven by the linear motor. Two sets of synchronous belts are fixedly connected to synchronous belt pulley clamping blocks. A second ARM bracket and a second laser sensor are fixed on each set of synchronous belt pulley clamping blocks. Each set of second ARM brackets is fixedly connected to a first ARM bracket. The first ARM bracket is in contact with and fixed to the wafer.

[0008] Furthermore, the angle rotation mechanism includes two sets of Z-axis side connecting plates, a cooling fan fixed at the bottom between the two, a second servo motor fixed between the two, and a rotation limiting block topped on the top of one set of Z-axis side connecting plates. The top output end of the second servo motor is fixedly connected to the hollow rotation platform. The top of the hollow rotation platform is fixedly connected to a disk with a first sensing plate. The disk has a protruding structure. The rotation limiting block and the protruding structure are at the same height. The first sensing plate and the first photoelectric switch are horizontally placed and at the same height.

[0009] Furthermore, a first photoelectric switch is provided on one side of the hollow rotating platform, the Z-axis side connecting plate is fixedly connected to the Z-axis adapter plate by bolts through a reinforcing connecting block, and the Y-axis adapter plate and the Z-axis linear motor are also fixedly connected by bolts.

[0010] Furthermore, an L-shaped laser sensor bracket is fixed on one side of the X-axis base plate, and a first laser sensor is fixed thereon. The bottom of the second ARM brackets on both sides is fixed to the linear guide rail by sliders, and one end of each slider is fixedly connected to the second sensing plate. The other end of the second sensing plate is located in the middle of the detection end of the second photoelectric switch.

[0011] Furthermore, one end of each of the synchronous belts on both sides is connected to the output transmission of the third and fourth servo motors via synchronous pulleys, and a fifth servo motor is fixed to the bottom of the X-axis base plate.

[0012] Furthermore, a third laser sensor is fixed to the top of the laser sensor bracket, and a drag chain is fixed to the top of the X-axis base plate, with one end of the drag chain fixedly connected to one end of the slider.

[0013] Furthermore, the ends of the two sets of second ARM brackets are kept in contact with the wafers through wafer guide blocks, and the wafer guide blocks are fixedly connected to the second ARM brackets by bolts.

[0014] Furthermore, the inner side of the Z-axis adapter plate is fixedly connected to two sets of Z-axis side connecting plates by bolts.

[0015] Beneficial effects

[0016] In this invention, the wafer is positioned above the carrier slot via X / Y / Z axes from the loading port, then extends outward along the Y-axis (Fork), descends along the Z-axis to adsorb the wafer, and finally retracts along the Y-axis. The dual-Fork design reduces waiting time, carries two wafers simultaneously, reduces the number of transfers, and increases throughput. High-precision alignment is achieved through the angle deflection axis directly adjusting the wafer angle to meet the stringent orientation requirements of processes such as lithography and inspection. Adaptable to complex layouts, the rotational capability allows the robot to optimize its movement path in confined spaces, and the angle deflection axis's rotational capability enables the robot to adjust the wafer posture in narrow spaces to avoid collisions. The four-axis, three-station handling robot has high-precision alignment capabilities, directly adjusting the wafer angle to ensure precise alignment of the notch or flat edge, meeting the stringent orientation requirements of processes such as lithography and inspection. Multi-station efficient handling allows for flexible scheduling between the Load Port, pre-aligner, and process chambers, reducing wafer waiting time and improving equipment utilization. Adaptable to complex layouts and highly automated, the integrated sensor system enables automatic calibration, collision detection, and wafer presence detection, reducing manual intervention.

[0017] In this device, the second servo motor drives the disc-rotating base to rotate via the hollow rotating platform. During rotation, the angle rotation is detected by the first sensing plate and the first photoelectric switch on one side, and excessive deflection is prevented by the protrusions and rotation limit blocks. The Z-axis adapter plate on the outside can adjust the height of the Z-axis side connecting plate via the Z-axis linear motor. The Z-axis linear motor is connected to the Y-axis adapter plate, and the Y-axis adapter plate can be adjusted in the Y-axis direction via the first servo motor and the Y-axis linear motor on the outside, achieving adjustment in three directions. On the X-axis base plate, the fifth and third servo motors at the bottom drive the synchronous belt via the synchronous pulley, thereby moving the second ARM bracket-second sensing plate-slider structure, which is fixed to the synchronous belt and the synchronous pulley clamping block structure, on the linear guide rail, realizing the four-way driving function and improving the accuracy of processing. During the movement, the multiple sets of second sensing plate structures can automatically align with the photoelectric switch and multiple sets of laser sensors. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of the Y-axis adapter plate-first servo motor of the present invention;

[0021] Figure 3 This is a schematic diagram of the Z-axis linear motor and the Z-axis side adapter plate in this invention;

[0022] Figure 4 This is a schematic diagram of the angle rotation mechanism in this invention;

[0023] Figure 5 This is one of the structural schematic diagrams of the X-axis wafer feeding module in this invention;

[0024] Figure 6 This is the second schematic diagram of the X-axis wafer feeding module in this invention;

[0025] Figure 7 This is a schematic diagram of the X-axis base plate in this invention.

[0026] The labels in the diagram represent: 1. Y-axis motion component; 2. Z-axis motion component; 3. Angle rotation mechanism; 4. X-axis wafer picking module; 5. Wafer; 6. Y-axis linear motor; 7. First servo motor; 8. Y-axis adapter plate; 9. Z-axis linear motor; 10. Z-axis adapter plate; 11. Rotation limit block; 12. Hollow rotation platform; 13. First photoelectric switch; 14. Z-axis side connecting plate; 15. Second servo motor; 16. Reinforcing connecting block; 17. Cooling fan; 18. X-axis base plate; 19. Cable chain; 20. Photoelectric switch; 21. Linear guide rail; 22. First sensor plate; 23. Rotating base; 24. First ARM bracket; 25. Synchronous belt pulley assembly; 26. Second ARM bracket; 27. Wafer guide block; 28. Second sensor plate; 29. ​​Laser sensor bracket; 30. First laser sensor; 31. Second photoelectric switch; 32. Synchronous belt; 33. Second laser sensor; 34. Third laser sensor; 35. Synchronous belt pulley clamping block; 36. Third servo motor; 37. Fourth servo motor; 38. Fifth servo motor; 39. Synchronous belt pulley. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] The present invention will be further described below with reference to embodiments.

[0029] Example: A four-axis, three-station wafer handling robot structure, see attached diagram. Figure 1 -Appendix Figure 7 It includes an angle rotation mechanism 3, a Z-axis motion component 2, and an X-axis wafer picking module 4.

[0030] The X-axis wafer picking module 4 includes an X-axis base plate 18, linear guide rails 21 fixed to both sides of the top of the X-axis base plate 18, photoelectric switches 20 fixed to both ends of one side of the X-axis base plate 18, and a rotating base 23 fixed to the bottom of the X-axis base plate 18. The bottom of the X-axis base plate 18 is connected to a fifth servo motor 38, a third servo motor 36, and a fourth servo motor 37. A set of synchronous pulley assemblies 25 are fixed to both sides of the top of the X-axis base plate 18, and a synchronous belt 32 is sleeved inside the synchronous pulley assembly 25. The bottom of the rotating base 23 is fixedly connected to the disk in the angle rotation mechanism 3, and one side of the disk and the angle rotation mechanism 3 is fixedly connected to the Z-axis motion assembly 2.

[0031] The Z-axis motion assembly 2 includes a Z-axis linear motor 9 and a Z-axis adapter plate 10 sleeved on the outside of the Z-axis linear motor 9. The Z-axis adapter plate 10 is fixedly connected to the angle rotation mechanism 3, and the outside of the Z-axis linear motor 9 is fixedly connected to the Y-axis motion assembly 1.

[0032] Furthermore, the Y-axis motion assembly 1 includes a Y-axis adapter plate 8 fixed to the Z-axis linear motor 9, a Y-axis linear motor 6 sleeved on the Y-axis adapter plate 8, and a first servo motor 7 connected to the linear motor. Two sets of synchronous belts 32 are fixedly connected to synchronous belt pulley clamping blocks 35. Each set of synchronous belt pulley clamping blocks 35 is fixed with a second ARM bracket 26 and a second laser sensor 33. Each set of second ARM brackets 26 is fixedly connected to a first ARM bracket 24. The first ARM bracket 24 is in contact with and fixed to the wafer 5. By using two sets of ARM brackets in conjunction with the synchronous belts 32 for independent driving, wafer 5 pick-up and drop operations at different workstations can be completed simultaneously or separately. This adapts to the continuous production process of multi-cavity equipment, effectively shortens the process changeover time, and increases the wafer 5 handling throughput per unit time.

[0033] The angle rotation mechanism 3 includes two sets of Z-axis side connecting plates 14, a cooling fan 17 fixed at the bottom between them, a second servo motor 15 fixed between them, and a rotation limit block 11 topped on the top of one set of Z-axis side connecting plates 14. The top output end of the second servo motor 15 is fixedly connected to the hollow rotating platform 12. The top of the hollow rotating platform 12 is fixedly connected to a disk with a first sensing plate 22. The disk has a raised structure. The hollow rotating platform 12 and synchronous belt 32 drive are designed to eliminate dust pollution, reduce particles generated by mechanical wear, and meet the cleanliness standards of semiconductor workshops. Compared with traditional screw drives, the synchronous belt 32 drive avoids pollution caused by grease evaporation and reduces transmission noise. The sealed structure of the hollow rotating platform 12 effectively prevents the diffusion of debris generated by internal component wear. In terms of load capacity, by strengthening the rigid connection of thickened metal structural components such as the connecting block 16 and Z-axis side connecting plates, the overall structure's resistance to deformation is improved, enabling stable handling of wafers 5 of different sizes and ensuring structural stability during high-speed movement.

[0034] The rotating limiting block 11 maintains the same height as the protruding structure. The first sensing sheet 22 and the first photoelectric switch 13 are horizontally positioned and at the same height. The robot picks up wafers from the loading port, positioning them on the X / Y / Z axes above the carrier slot. It then extends the fork along the Y axis, descends along the Z axis to adsorb the wafer 5, and finally retracts along the Y axis. This dual-fork design reduces waiting time and allows for the simultaneous transport of two wafers 5, reducing the number of transfers and increasing throughput. High-precision alignment is achieved by directly adjusting the wafer 5 angle using the angle deflection axis, meeting the stringent orientation requirements of processes such as lithography and inspection. Adaptable to complex layouts, the rotational capability allows the robot to optimize its movement path in confined spaces. The angle deflection axis's rotational capability enables the robot to adjust the wafer 5's orientation in narrow spaces, avoiding collisions. This four-axis, three-station handling robot offers high-precision alignment, directly adjusting the wafer 5 angle to ensure precise alignment of the notch or flat edge, meeting the stringent orientation requirements of processes such as lithography and inspection. It also provides efficient multi-station handling, enabling efficient transport within the loading port. Flexible scheduling between ports, pre-aligners, and process chambers reduces wafer 5 waiting time and improves equipment utilization; adaptable to complex layouts, highly automated, and integrated sensor systems enable automatic calibration, collision avoidance detection, and wafer 5 presence detection, reducing manual intervention.

[0035] A first photoelectric switch 13 is provided on one side of the hollow rotating platform 12. The Z-axis side connecting plate 14 is fixedly connected to the Z-axis adapter plate 10 by bolts through the reinforcing connecting block 16. The Y-axis adapter plate 8 and the Z-axis linear motor 9 are also fixedly connected by bolts. The inner side of the Z-axis adapter plate 10 is fixedly connected to the two sets of Z-axis side connecting plates 14 by bolts.

[0036] An L-shaped laser sensor bracket 29 is fixed on one side of the X-axis base plate 18, and a first laser sensor 30 is also fixed thereon. The bottom of the second ARM brackets 26 on both sides is fixed to the linear guide rail 21 by sliders, and one end of each slider is fixedly connected to the second sensing plate 28. The other end of the second sensing plate 28 is located in the middle of the detection end of the second photoelectric switch 31. The system integrates linear motion of the Y-axis and Z-axis and angular rotational motion, and with the bidirectional material handling design of the X-axis, it realizes four-axis linkage control, which greatly improves the spatial motion freedom of the robot.

[0037] During the transmission process, the Y-axis motion is driven by the first servo motor 7, which drives the Y-axis linear motor to move the Z-axis motion components and subsequent structures smoothly in the forward and backward directions. The Z-axis direction is directly driven by the Z-axis linear motor, which is rigidly connected to the angle rotation mechanism 3 via the reinforcing connecting block 16, ensuring the straightness and response speed of the vertical movement. The angle rotation motion is driven by the second servo motor 15, which outputs torque through the hollow rotating platform 12 to drive the top disk and the X-axis wafer picking module for precise angle adjustment. During rotation, the first sensing plate 22 and the first photoelectric switch 13 ensure the angle positioning accuracy through real-time detection. The X-axis picking action is driven by the third and fourth servo motors 37, which drive the synchronous pulley assemblies 25 on both sides. Through the transmission of the synchronous belt 32 and the synchronous pulley clamping block 35, the ARM bracket slides along the linear guide rail 21, achieving the lateral displacement of wafer 5 for picking and placing. The closed-loop control of each axis transmission and the rigid cooperation of the mechanical structure ensure that the wafer 5 picking and placing positioning accuracy reaches the micrometer level, meeting the requirements of high-precision manufacturing.

[0038] One end of each of the two synchronous belts 32 is connected to the output transmission of the third servo motor 36 and the fourth servo motor 37 via synchronous pulleys 39. The bottom of the X-axis base plate 18 is fixed with a fifth servo motor 38. Each motion component (Y-axis, Z-axis, rotary mechanism, X-axis module) is detachably connected by bolts, resulting in a compact structure and reasonable layout. For example, the Z-axis adapter plate is fixed to the Z-axis side connecting plate of the angle rotation mechanism 3 by bolts, and the connection between the X-axis base plate and the rotating base 23 is also secured by bolts, facilitating the individual disassembly of a component for maintenance or replacement. Simultaneously, the modular design allows the equipment to expand the number of workstations or adjust motion parameters according to production needs, enhancing the equipment's versatility and adaptability.

[0039] A third laser sensor 34 is fixed to the top of the laser sensor bracket 29, and a drag chain 19 is fixed to the top of the X-axis base plate 18, with one end of the drag chain 19 fixedly connected to one end of the slider. The configuration of the first, second, and third laser sensors 34 and photoelectric switch 20 achieves multiple protections for wafer 5 position detection, motion travel limit, and rotation angle calibration. Specifically, the second sensing element 28, in conjunction with the second photoelectric switch 31, can monitor the motion limit position of the ARM bracket in the X-axis direction in real time. The mechanical limit of the rotation limit block 11 and the disk protrusion structure, combined with the electrical detection of the first sensing element 22 and the first photoelectric switch 13, provides double protection for the safe range of angle rotation. The laser sensor confirms whether the wafer 5 is placed stably through non-contact detection, avoiding collision damage to the wafer 5 due to positioning deviation and reducing production losses.

[0040] The ends of the two sets of second ARM brackets 26 are in contact with the wafer through wafer guide blocks 27, and the wafer guide blocks 27 are fixedly connected to the second ARM brackets 26 by bolts.

[0041] Therefore, in this device, the second servo motor 15 can drive the disk-rotating base 23 to rotate via the hollow rotating platform 12. During rotation, the angle rotation can be detected by the first sensing plate 22 and the first photoelectric switch 13 on one side, and excessive deflection can be prevented by the protrusion and the rotation limit block 11. The outer Z-axis adapter plate 10 can adjust the height of the Z-axis side connecting plate 14 via the Z-axis linear motor 9. The Z-axis linear motor 9 is connected to the Y-axis adapter plate 8, and the Y-axis adapter plate 8 can be adjusted by the outer first servo motor 7 and the Y-axis linear motor 6. The adjustment can be made in three directions. On the X-axis base plate 18, the fifth servo motor 38 and the third servo motor 36 at the bottom can drive the synchronous belt 32 through the synchronous pulley 39. The second ARM bracket 26-second sensor plate 28-slider structure, which is fixed to the synchronous pulley 39 pressure block 35 structure fixed to the synchronous belt 32, moves on the linear guide rail 21 to realize the function of four-way drive, improve the accuracy of processing, and during the movement, the multiple sets of second sensor plates 28 can be automatically aligned with the photoelectric switch 20 and multiple sets of laser sensors.

[0042] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A four-axis, three-station wafer handling robot structure, characterized in that, It includes an angle rotation mechanism (3), a Z-axis motion component (2), and an X-axis wafer picking module (4). The X-axis wafer picking module (4) includes an X-axis base plate (18), linear guide rails (21) fixed to both sides of the top of the X-axis base plate (18), photoelectric switches (20) fixed to both ends of one side of the X-axis base plate (18), and a rotating base (23) fixed to the bottom of the X-axis base plate (18). The bottom of the X-axis base plate (18) is connected to a fifth servo motor (38), a third servo motor (36), and a fourth servo motor (37). A set of synchronous pulley assemblies (25) is fixed to both the left and right sides of the top of the X-axis base plate (18). A synchronous belt (32) is fitted inside the synchronous pulley assembly (25). The bottom of the rotating base (23) is fixedly connected to a disk in the angle rotation mechanism (3), and the disk and one side of the angle rotation mechanism (3) are fixedly connected to the Z-axis motion assembly (2). The Z-axis motion assembly (2) includes a Z-axis linear motor (9) and a Z-axis adapter plate (10) sleeved on the outside of the Z-axis linear motor (9). The Z-axis adapter plate (10) is fixedly connected to the angle rotation mechanism (3), and the outside of the Z-axis linear motor (9) is fixedly connected to the Y-axis motion assembly (1). The Y-axis motion assembly (1) includes a Y-axis adapter plate (8) fixed to the Z-axis linear motor (9), a Y-axis linear motor (6) sleeved on the Y-axis adapter plate (8), and a first servo motor (7) connected to the linear motor. The two sets of synchronous belts (32) are fixedly connected to the synchronous belt pulley clamping blocks (35). The two sets of synchronous belt pulley clamping blocks (35) are each fixed with a second ARM bracket (26) and a second laser sensor (33). The second ARM bracket (26) is fixedly connected to the first ARM bracket (24). The first ARM bracket (24) is in contact with and fixed to the wafer (5).

2. The four-axis, three-station wafer handling robot structure according to claim 1, characterized in that, The angle rotation mechanism (3) includes two sets of Z-axis side connecting plates (14), a cooling fan (17) fixed at the bottom between the two, a second servo motor (15) fixed between the two, and a rotation limiting block (11) covering the top of a set of Z-axis side connecting plates (14). The top output end of the second servo motor (15) is fixedly connected to the hollow rotating platform (12). The top of the hollow rotating platform (12) is fixedly connected to a disk with a first sensing plate (22). The disk has a protruding structure. The rotation limiting block (11) is at the same height as the protruding structure. The first sensing plate (22) and the first photoelectric switch (13) are horizontal structures and at the same height.

3. The four-axis, three-station wafer handling robot structure according to claim 2, characterized in that, A first photoelectric switch (13) is provided on one side of the hollow rotating platform (12). The Z-axis side connecting plate (14) is fixedly connected to the Z-axis adapter plate (10) by bolts through a reinforcing connecting block (16). The Y-axis adapter plate (8) and the Z-axis linear motor (9) are also fixedly connected by bolts.

4. The structure of a four-axis, three-station wafer handling robot according to claim 1, characterized in that, An L-shaped laser sensor bracket (29) is fixed on one side of the X-axis base plate (18), and a first laser sensor (30) is fixed thereon. The bottom of the second ARM bracket (26) on both sides is fixed to the linear guide rail (21) by a slider, and one end of the slider is fixedly connected to the second sensing plate (28). The other end of the second sensing plate (28) is located in the middle of the detection end of the second photoelectric switch (31).

5. The structure of a four-axis, three-station wafer handling robot according to claim 4, characterized in that, One end of each of the synchronous belts (32) on both sides is connected to the output transmission of the third servo motor (36) and the fourth servo motor (37) via a synchronous pulley (39), and the bottom of the X-axis base plate (18) is fixed with a fifth servo motor (38).

6. The structure of a four-axis, three-station wafer handling robot according to claim 4, characterized in that, The top of the laser sensor bracket (29) is fixed with a third laser sensor (34), and the top of the X-axis base plate (18) is fixed with a drag chain (19), one end of the drag chain (19) being fixedly connected to one end of the slider.

7. The structure of a four-axis, three-station wafer handling robot according to claim 1, characterized in that, The ends of the two sets of second ARM brackets (26) are in contact with the wafer through wafer guide blocks (27), and the wafer guide blocks (27) are fixedly connected to the second ARM brackets (26) by bolts.

8. The structure of a four-axis, three-station wafer handling robot according to claim 1, characterized in that, The inner side of the Z-axis adapter plate (10) is fixedly connected to two sets of Z-axis side connecting plates (14) by bolts.

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