Large-current direct insertion type power device packaging structure

Abstract

The invention relates to the technical field of power device packaging structures, and discloses a large-current direct insertion type power device packaging structure which comprises a lower packaging box and an upper packaging box, a heat conductor is installed on the inner wall of the top of the upper packaging box, heat dissipation fins are fixedly connected to the top of the heat conductor, a jacking mechanism is arranged on the inner wall of the lower packaging box, and the heat dissipation fins are fixedly connected to the top of the heat conductor. A mounting mechanism is arranged on the inner wall of the lower packaging box, a protection mechanism is arranged on the inner wall of the lower packaging box, and a replacement mechanism is arranged on the inner wall of the top of the upper packaging box. Therefore, the heat dissipation silicone grease coated on the top of the chip and the top of other elements is in contact with the bottom of the heat conductor and is uniformly dispersed through uniform pressure, the heat dissipation effect can be further improved, substrates and chips with different thicknesses can be further installed in the mode, and the application range of the device is widened.

Description

Technical Field

[0001] This invention relates to the field of power device packaging structure technology, specifically a high-current through-hole power device packaging structure. Background Technology

[0002] The packaging structure of power devices is a structure that protects and supports semiconductor power devices and provides electrical connections. Power devices are generally used in high-voltage and high-current applications, so the packaging structure must have good thermal management and electrical insulation performance.

[0003] Patent CN120184112B relates to the field of chip packaging technology and discloses a power device packaging structure, including: an upper pressure plate assembly, a chip layer, and a heat sink assembly. The chip layer is disposed between the upper pressure plate assembly and the heat sink assembly. The upper pressure plate assembly includes a first connecting portion, and the heat sink assembly includes a second connecting portion. The first connecting portion includes multiple first insulated micron wires, and the second connecting portion includes multiple second insulated micron wires. The first insulated micron wires and the second insulated micron wires are connected by static friction. The static friction connection between the first insulated micron wires and the second insulated micron wires is not affected by temperature, which helps to improve the reliability of the power device packaging structure. However, when the above device is used to install chips or substrates of different thicknesses, uneven contact between the chip and the heat sink assembly is likely to occur, which will affect the subsequent heat dissipation effect. At the same time, the subsequent installation is carried out by screws, which is relatively cumbersome. After long-term use, the entire device needs to be removed and the packaging structure opened before the thermal grease is replaced. The operation is cumbersome and complicated. Therefore, a high-current through-hole power device packaging structure is proposed to solve the above-mentioned problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a high-current through-hole power device packaging structure to address the shortcomings of the prior art.

[0005] To solve the above technical problems, the technical solution adopted by the present invention is: a high-current through-hole power device packaging structure, including a lower packaging box and an upper packaging box, wherein a heat conductor is installed on the inner wall of the top of the upper packaging box, and a heat dissipation fin is fixedly connected to the top of the heat conductor; a lifting mechanism is provided on the inner wall of the lower packaging box; an installation mechanism is provided on the inner wall of the lower packaging box; a protective mechanism is provided on the inner wall of the lower packaging box; and a replacement mechanism is provided on the inner wall of the top of the upper packaging box. The lifting mechanism includes an elastic telescopic column, which is fixedly connected to the inner wall of the lower packaging box. A support plate is fixedly connected to the telescopic end of the elastic telescopic column. A connecting plate is fixedly connected to the surface of the support plate. A threaded rod is fixedly connected to the bottom of the connecting plate. A limit post is threadedly connected to the circumferential surface of the threaded rod. The limit post is elastic. A guide rod is fixedly connected to the inner wall of the lower packaging box. A fixing plate is fixedly connected to the surface of the support plate. A pin is fixedly connected to the inner wall of the fixing plate. The substrate is placed on top of the support plate through the guide rod, and the support plate and connecting plate are pressed down by the substrate. The connecting plate drives the limiting post to move down. The limiting post deforms and retracts through its own notch, so that the limiting post can pass through the through hole at the bottom of the lower packaging box. After the limiting post passes through the through hole, it resets by its own elasticity and the limiting block on its surface is stuck at the bottom of the lower packaging box, so that the connecting plate and support plate will not reset under the action of the elastic telescopic post. Then the upper packaging box and the lower packaging box are packaged.

[0006] Preferably, the fixing plate is fixedly connected to the connecting plate, the pins pass through the bottom of the lower packaging box, and the top of the limiting post contacts the bottom of the connecting plate; After encapsulation, press the two sides of the limiting post inward to disable the limiting mechanism. At this time, the elastic telescopic post will drive the support plate to move upward and reset. The support plate will drive the substrate to move upward, so that the substrate can move upward smoothly and allow the chips and other components on the substrate surface to make uniform contact with the bottom of the heat conductor. Since four elastic telescopic posts drive the substrate upward at the same time, the force on the substrate is balanced around the edges. Therefore, the thermal grease applied to the top of the chips and other components contacts the bottom of the heat conductor and is evenly dispersed by uniform pressure, thereby improving the heat dissipation effect. Furthermore, substrates and chips of different thicknesses can be installed in this way, expanding the applicability of the device.

[0007] Preferably, the mounting mechanism includes a fixing block, an mounting rod slidably connected to the inner wall of the fixing block, a clamping plate fixedly connected to the end of the mounting rod away from the fixing block, a top plate slidably connected to the inner wall of the bottom of the lower packaging box, and a transmission rod fixedly connected to the circumferential surface of the mounting rod. After the device is packaged, it is installed on the circuit board. During installation, the top plate will first contact the circuit board, and then the device will continue to be pressed down. At this time, the top plate will move into the lower package box in the opposite direction. When the top plate moves up, it pushes the transmission rod to move through the inclined plane. The transmission rod drives the mounting rod to move towards the fixed block. The mounting rod drives the clamping plate to move. The clamping plate will move to contact the lower package box and allow the clamping plate to be inserted into the mounting hole on the circuit board.

[0008] Preferably, a retaining strip is fixedly connected to the surface of the top plate to prevent the top plate from detaching from the lower packaging box, and a chuck is fixedly connected to the end of the mounting rod away from the clamping plate.

[0009] Preferably, the inner wall of the fixing block is provided with a spring, and the spring is used for the reset of the chuck; the circumferential surface of the transmission rod contacts the top of the top plate; and the circumferential surface of the mounting rod is slidably connected to the inner wall of the lower packaging box. As the top plate continues to move upward, the transmission rod will move to the notch on the side of the top plate. Then, the compressed spring will drive the chuck to move, the chuck will drive the mounting rod to reset, and the mounting rod will drive the clamping plate to reset, so that the clamping plate moves in the mounting hole of the circuit board. The triangular block under the clamping plate will contact the bottom of the circuit board and achieve installation, thus enabling quick installation of the device without the need for screws, which is very convenient and fast.

[0010] Preferably, the protective mechanism includes a push plate, which is slidably connected to the inner wall of the lower packaging box. A guide plate is fixedly connected to the front of the push plate, and a guide groove is formed on the surface of the guide plate. A pressure rod is fixedly connected to the bottom of the connecting plate through a connecting rod. A push rod is fixedly connected to the rear of the push plate, and a transmission plate is fixedly connected to the rear of the push rod. Rollers are rotatably connected to the inner walls on both sides of the transmission plate.

[0011] Preferably, the guide groove is located on the movement trajectory of the pressure rod, and the bottom of the guide plate is in contact with the inner wall of the lower packaging box.

[0012] Preferably, an installation block is fixedly connected to the inner wall of the lower packaging box, an elastic telescopic rod is fixedly connected to the side of the installation block near the pin, a clamping ring is fixedly connected to the telescopic end of the elastic telescopic rod, a guide block is fixedly connected to the circumferential surface of the clamping ring, and a protective sleeve is sleeved on the surface of the pin. After the device is installed, the pins will pass through the circuit board and be soldered. The protective sleeves on the pin surfaces can protect them from being bumped, deformed, or damaged during placement or transportation.

[0013] Preferably, the circumferential surface of the roller contacts the guide block, the inner wall of the clamping ring contacts the circumferential surface of the protective sleeve, and the bottom of the clamping ring contacts the inner wall of the lower packaging box. When the substrate is installed, the connecting plate moves downward, which in turn moves the pressure rod downward. The pressure rod enters the guide groove on the guide plate and pushes the guide plate to move through the inclined guide groove. The guide plate moves the push plate, which in turn moves the push rod, which in turn moves the transmission plate, which in turn moves the roller. The roller moves the two guide blocks through the inclined guide blocks, which in turn move the two clamping rings apart. This allows the clamping rings to no longer limit the protective sleeve, so that the protective sleeve can be removed when installing the base. This facilitates the subsequent installation of the package onto the circuit board. The clamping rings also prevent the protective sleeve from falling off. A limit ring is provided at the top of the protective sleeve to prevent it from sliding out of the clamping rings after it has slid down. When the clamping rings are opened, the protective sleeve can be removed together with the limit ring.

[0014] Preferably, the replacement mechanism includes a pressure plate and mounting screws. A pressure column is fixedly connected to the bottom of the pressure plate. The heat conductor is mounted on the inner wall of the top of the upper packaging box by mounting screws. The circumferential surface of the pressure column contacts the inner wall of the top of the upper packaging box, and the bottom of the pressure column contacts the top of the support plate. When the heat dissipation effect of the packaged component decreases after prolonged use, the user can remove the pressure plate and insert the pressure post at the bottom of the pressure plate into the hole at the top of the package. Then, press the pressure plate, and the pressure plate will move the support plate down through the pressure post. This will smoothly and evenly separate the chip or component from the heat conductor, preventing them from sticking together due to dried thermal grease. Manually removing the heat conductor directly can easily result in uneven force, which can lead to the chip or component being pulled off and damaged due to adhesion. Afterward, the heat conductor and heat sink fins can be removed by rotating the mounting screws, and new thermal grease can be applied. Then, the process can be reversed to complete the installation, making it convenient to replace the thermal grease in the future.

[0015] The present invention, by adopting the above technical solution, can bring the following beneficial effects: 1. In this high-current through-hole power device packaging structure, the support plate drives the substrate to move upward, allowing the substrate to move smoothly and the chips and other components on the substrate surface to make uniform contact with the bottom of the heat conductor. Since four elastic telescopic pillars drive the substrate to move upward simultaneously, the force on the substrate is balanced around the edges. Therefore, the thermal grease applied to the top of the chips and other components contacts the bottom of the heat conductor and is evenly dispersed by uniform pressure, thereby improving the heat dissipation effect. Furthermore, substrates and chips of different thicknesses can be installed in this way, expanding the applicability of the device.

[0016] 2. This high-current through-hole power device packaging structure allows the device to be mounted on a circuit board after packaging. During installation, the clamp can move within the mounting holes on the circuit board, and the triangular block below the clamp will contact the bottom of the circuit board for installation. This allows for quick installation of the device without the need for screws, making it very convenient and fast.

[0017] 3. In this high-current through-hole power device package structure, after the device is installed, the pins will pass through the circuit board and be soldered. The protective sleeve on the surface of the pins can protect them from being bumped, deformed or damaged during placement or transportation. When the substrate is installed, the clamp will no longer limit the protective sleeve, so that the protective sleeve can be removed when installing the base, which is convenient for the subsequent installation of the package on the circuit board. The clamp can also prevent the protective sleeve from falling off.

[0018] 4. With this high-current through-hole power device package structure, when the heat dissipation effect of the package decreases after long-term use, the user can remove the heat conductor and heat sink fins by using the pressure plate, pressure post, and mounting screws. Then, the reverse operation can be performed to install it, which facilitates the subsequent replacement of thermal grease. At the same time, it can smoothly and evenly separate the chip or component from the heat conductor, preventing them from sticking together due to dry thermal grease. Directly removing the heat conductor by hand can easily cause uneven force, which can lead to adhesion and tearing off the chip or component, resulting in damage. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the replacement mechanism of the present invention; Figure 3 This is a half-sectional view of the packaging box structure of the present invention; Figure 4 This is a schematic diagram of the connecting plate structure of the present invention; Figure 5 This is a schematic diagram of the fixing block structure of the present invention; Figure 6 This is a half-sectional view of the fixing block structure of the present invention; Figure 7 For the present invention Figure 6 Enlarged view of the structure at point A in the middle; Figure 8 This is a schematic diagram of the pusher plate structure of the present invention; Figure 9 For the present invention Figure 8 Enlarged view of the structure at point B in the middle; Figure 10 This is a schematic diagram of the pressure plate structure of the present invention.

[0020] In the diagram: 1. Lower encapsulation box; 2. Upper encapsulation box; 3. Heat conductor; 4. Heat sink fins; 5. Lifting mechanism; 51. Elastic telescopic column; 52. Support plate; 53. Connecting plate; 54. Limiting column; 55. Threaded rod; 56. Guide rod; 57. Fixing plate; 58. Pin; 6. Mounting mechanism; 61. Fixing block; 62. Mounting rod; 63. Clamping plate; 64. Top plate; 641. Clamping strip; 65. Transmission rod; 66. Chuck; 7. Protective mechanism; 71. Push plate; 72. Guide plate; 73. Pressure rod; 74. Push rod; 75. Transmission plate; 76. Roller; 77. Guide block; 78. Mounting block; 79. Elastic telescopic rod; 710. Clamping ring; 711. Protective sleeve; 8. Replacement mechanism; 81. Pressure plate; 82. Pressure column; 83. Mounting screw. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-10 One embodiment of the present invention is: a high-current through-hole power device packaging structure, including a lower packaging box 1 and an upper packaging box 2. A heat conductor 3 is installed on the inner wall of the top of the upper packaging box 2, and a heat dissipation fin 4 is fixedly connected to the top of the heat conductor 3. A lifting mechanism 5 is provided on the inner wall of the lower packaging box 1, an installation mechanism 6 is provided on the inner wall of the lower packaging box 1, a protective mechanism 7 is provided on the inner wall of the lower packaging box 1, and a replacement mechanism 8 is provided on the inner wall of the top of the upper packaging box 2. The lifting mechanism 5 includes an elastic telescopic column 51, which is fixedly connected to the inner wall of the lower packaging box 1. The telescopic end of the elastic telescopic column 51 is fixedly connected to a support plate 52. The surface of the support plate 52 is fixedly connected to a connecting plate 53. The bottom of the connecting plate 53 is fixedly connected to a threaded rod 55. The circumferential surface of the threaded rod 55 is threadedly connected to a limit post 54. The limit post 54 is elastic. The inner wall of the lower packaging box 1 is fixedly connected to a guide rod 56. The surface of the support plate 52 is fixedly connected to a fixing plate 57. The inner wall of the fixing plate 57 is fixedly connected to a pin 58. The support plate 52 moves the substrate upward, allowing it to move smoothly and ensuring that the chips and other components on the substrate surface are evenly in contact with the bottom of the heat conductor 3. Since the four elastic telescopic columns 51 move the substrate upward simultaneously, the force on the substrate is balanced around the edges. Therefore, the thermal grease applied to the top of the chips and other components contacts the bottom of the heat conductor 3 and is evenly dispersed by uniform pressure, thereby improving the heat dissipation effect. Furthermore, substrates and chips of different thicknesses can be installed in this way, expanding the applicability of the device. The substrate in this device can also be a carrier of chips or components in a thick copper lead frame or package.

[0023] The fixing plate 57 is fixedly connected to the connecting plate 53. The pin 58 passes through the bottom of the lower package box 1. The top of the limiting post 54 contacts the bottom of the connecting plate 53. The top of the pin 58 will contact the corresponding contact point on the bottom of the installed substrate and achieve electrical connection for subsequent installation of the packaged components.

[0024] The mounting mechanism 6 includes a fixing block 61, an mounting rod 62 slidably connected to the inner wall of the fixing block 61, a clamping plate 63 fixedly connected to the end of the mounting rod 62 away from the fixing block 61, a top plate 64 slidably connected to the inner wall of the bottom of the lower encapsulation box 1, and a transmission rod 65 fixedly connected to the circumferential surface of the mounting rod 62. After the device is packaged, it is installed on the circuit board. During installation, the clamp 63 can move in the mounting holes of the circuit board, and the triangular block under the clamp 63 will contact the bottom of the circuit board to achieve installation. This allows for quick installation of the device without the need for screws, which is very convenient and fast.

[0025] A retaining strip 641 is fixedly connected to the surface of the top plate 64. The retaining strip 641 is used to prevent the top plate 64 from detaching from the lower encapsulation box 1. A chuck 66 is fixedly connected to the end of the mounting rod 62 away from the clamping plate 63.

[0026] The inner wall of the fixing block 61 is provided with a spring, and the spring is used to reset the chuck 66. The circumferential surface of the transmission rod 65 contacts the top of the top plate 64, and the circumferential surface of the mounting rod 62 is slidably connected to the inner wall of the lower encapsulation box 1.

[0027] Working principle: The substrate passes through the guide rod 56 and is placed on top of the support plate 52. The substrate presses down the support plate 52 and the connecting plate 53. The connecting plate 53 drives the limiting post 54 to move downward. The limiting post 54 deforms and retracts through its own notch, allowing it to pass through the through hole at the bottom of the lower packaging box 1. After the limiting post 54 passes through the through hole, it resets due to its own elasticity, and the limiting block on its surface is stuck at the bottom of the lower packaging box 1. This prevents the connecting plate 53 and the support plate 52 from resetting under the action of the elastic telescopic post 51. Then, the upper packaging box 2 and the lower packaging box 1 are packaged. After packaging, the two sides of the limiting post 54 are pressed inward, causing the limiting to fail. At this time, the elastic telescopic post 51 will drive the support plate 52 to move upward and reset. The support plate 52 drives the substrate to move upward, allowing the limiting post 54 to move downward. The substrate can be moved upward smoothly, allowing the chips and other components on the substrate surface to contact the bottom of the heat conductor 3 evenly. Since the substrate is moved upward simultaneously by four elastic telescopic pillars 51, the force on the substrate is balanced around the edges. Therefore, the thermal grease applied to the top of the chips and other components contacts the bottom of the heat conductor 3 and is evenly dispersed by uniform pressure, thereby improving the heat dissipation effect. In addition, substrates and chips of different thicknesses can be installed in this way, expanding the applicability of the device. After completion, due to the thickness of the substrate and chips, the limiting pillar 54 will not be fully retracted into the lower package box 1. At this time, the limiting pillar 54 is rotated by a tool, so that the limiting pillar 54 is separated from the threaded rod 55, thereby removing the limiting pillar 54 and preventing the limiting pillar 54 from affecting the subsequent installation of the package. After the device is packaged, it is installed on the circuit board. During installation, the top plate 64 first contacts the circuit board, and then the device is pressed down. At this time, the top plate 64 will move backward into the lower packaging box 1. When the top plate 64 moves upward, it pushes the transmission rod 65 through the inclined plane. The transmission rod 65 drives the mounting rod 62 to move towards the fixing block 61. The mounting rod 62 drives the clamping plate 63 to move. The clamping plate 63 will move to contact the lower packaging box 1 and insert into the mounting hole on the circuit board. When the top plate 64 continues to move upward, the transmission rod 65 will move to the notch on the side of the top plate 64. Then the compressed spring will drive the chuck 66 to move. The chuck 66 drives the mounting rod 62 to reset. The mounting rod 62 drives the clamping plate 63 to reset, so that the clamping plate 63 moves in the mounting hole of the circuit board. The triangular block under the clamping plate 63 will contact the bottom of the circuit board and achieve installation. Thus, the device can be installed quickly without the need for screws, which is very convenient and fast.

[0028] Please see Figures 1-10 Based on the above embodiments, in another embodiment of the present invention, the protective mechanism 7 includes a push plate 71, which is slidably connected to the inner wall of the lower packaging box 1. A guide plate 72 is fixedly connected to the front of the push plate 71, and a guide groove is provided on the surface of the guide plate 72. A pressure rod 73 is fixedly connected to the bottom of the connecting plate 53 through a connecting rod. A push rod 74 is fixedly connected to the rear of the push plate 71, and a transmission plate 75 is fixedly connected to the rear of the push rod 74. Rollers 76 are rotatably connected to the inner walls on both sides of the transmission plate 75.

[0029] The guide groove is located on the movement trajectory of the pressure rod 73, and the bottom of the guide plate 72 is in contact with the inner wall of the lower packaging box 1.

[0030] A mounting block 78 is fixedly connected to the inner wall of the lower packaging box 1. An elastic telescopic rod 79 is fixedly connected to the side of the mounting block 78 near the pin 58. A clamping ring 710 is fixedly connected to the telescopic end of the elastic telescopic rod 79. A guide block 77 is fixedly connected to the circumferential surface of the clamping ring 710. A protective sleeve 711 is sleeved on the surface of the pin 58. After the device is installed, pin 58 will pass through the circuit board and be soldered. The protective sleeve 711 on the surface of pin 58 can protect it from being bumped, deformed or damaged during placement or transportation. When the substrate is installed, the clamp 710 will no longer limit the protective sleeve 711, so that the protective sleeve 711 can be removed when installing the base, which is convenient for the subsequent installation of the package on the circuit board. The clamp 710 can also prevent the protective sleeve 711 from falling off.

[0031] The circumferential surface of the roller 76 contacts the guide block 77, the inner wall of the clamping ring 710 contacts the circumferential surface of the protective sleeve 711, and the bottom of the clamping ring 710 contacts the inner wall of the lower encapsulation box 1.

[0032] The replacement mechanism 8 includes a pressure plate 81 and mounting screws 83. A pressure column 82 is fixedly connected to the bottom of the pressure plate 81. The heat conductor 3 is installed on the inner wall of the top of the upper packaging box 2 by the mounting screws 83. The circumferential surface of the pressure column 82 contacts the inner wall of the top of the upper packaging box 2, and the bottom of the pressure column 82 contacts the top of the support plate 52. When the heat dissipation effect of the packaged component decreases after prolonged use, the user can remove the heat conductor 3 and heat sink fins 4 by using the pressure plate 81, pressure post 82, and mounting screw 83. Then, the reverse operation can be performed to install them, which facilitates the subsequent replacement of thermal grease. At the same time, it can smoothly and evenly separate the chip or component from the heat conductor 3, preventing them from sticking together due to dried thermal grease. Manually removing the heat conductor 3 directly can easily result in uneven force, which can easily cause the chip or component to be torn off and damaged due to sticking.

[0033] Working principle: After the device is installed, pin 58 passes through the circuit board and is soldered. The protective sleeve 711 on the surface of pin 58 protects it from impacts during placement or transportation, preventing deformation or damage. When the substrate is installed, it moves the connecting plate 53 downward, which in turn moves the pressure rod 73 downward. The pressure rod 73 enters the guide groove on the guide plate 72 and pushes the guide plate 72 to move through the inclined guide groove. The guide plate 72 moves the push plate 71, which in turn moves the push rod 74. The push rod 74 moves the transmission plate 75, which in turn moves the roller 76. The column 76 drives the two guide blocks 77 to separate from each other through the inclined guide block 77. The two guide blocks 77 drive the two clamping rings 710 to separate, so that the clamping rings 710 no longer limit the protective sleeve 711. This allows the protective sleeve 711 to be removed when installing the base, which facilitates the subsequent installation of the package on the circuit board. The clamping rings 710 can also prevent the protective sleeve 711 from falling off. A limit ring is provided at the top of the protective sleeve 711. The limit ring can be used to prevent the protective sleeve 711 from sliding down and slipping out of the clamping rings 710. When the clamping rings 710 are opened, the protective sleeve 711 can be removed together with the limit ring. When the heat dissipation effect of the packaged component decreases after prolonged use, the user can remove the pressure plate 81 and insert the pressure post 82 at the bottom of the pressure plate 81 into the hole at the top of the upper package box 2. Then press the pressure plate 81, and the pressure plate 81 will drive the support plate 52 to move down through the pressure post 82. This will smoothly and evenly separate the chip or component from the heat conductor 3, preventing them from sticking together due to dry thermal grease. Manually removing the heat conductor 3 directly can easily result in uneven force, which can lead to the chip or component being pulled off and damaged due to sticking. Afterwards, the heat conductor 3 and heat sink fins 4 can be removed by rotating the mounting screw 83, and new thermal grease can be applied. Then, the reverse operation can be performed to install them, which facilitates the replacement of thermal grease in the future.

[0034] This invention provides a high-current through-hole power device packaging structure. Many methods and approaches exist for implementing this technical solution; the above description is merely a preferred embodiment of the invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this invention, and these improvements and modifications should also be considered within the scope of protection of this invention. All components not explicitly stated in this embodiment can be implemented using existing technologies.

Claims

1. A high-current through-hole power device package structure, comprising a lower package (1) and an upper package (2), characterized in that: A heat conductor (3) is installed on the inner wall of the top of the upper packaging box (2), and a heat dissipation fin (4) is fixedly connected to the top of the heat conductor (3). A lifting mechanism (5) is provided on the inner wall of the lower packaging box (1), an installation mechanism (6) is provided on the inner wall of the lower packaging box (1), a protective mechanism (7) is provided on the inner wall of the lower packaging box (1), and a replacement mechanism (8) is provided on the inner wall of the top of the upper packaging box (2). The lifting mechanism (5) includes an elastic telescopic column (51), which is fixedly connected to the inner wall of the lower packaging box (1). The telescopic end of the elastic telescopic column (51) is fixedly connected to a support plate (52). A connecting plate (53) is fixedly connected to the surface of the support plate (52). A threaded rod (55) is fixedly connected to the bottom of the connecting plate (53). A limit post (54) is threadedly connected to the circumferential surface of the threaded rod (55). The limit post (54) is elastic. A guide rod (56) is fixedly connected to the inner wall of the lower packaging box (1). A fixing plate (57) is fixedly connected to the surface of the support plate (52). A pin (58) is fixedly connected to the inner wall of the fixing plate (57).

2. The high-current through-hole power device packaging structure according to claim 1, characterized in that: The fixing plate (57) is fixedly connected to the connecting plate (53), the pin (58) passes through the bottom of the lower encapsulation box (1), and the top of the limiting post (54) contacts the bottom of the connecting plate (53).

3. The high-current through-hole power device packaging structure according to claim 2, characterized in that: The mounting mechanism (6) includes a fixing block (61), an mounting rod (62) is slidably connected to the inner wall of the fixing block (61), a clamping plate (63) is fixedly connected to one end of the mounting rod (62) away from the fixing block (61), a top plate (64) is slidably connected to the inner wall of the bottom of the lower packaging box (1), and a transmission rod (65) is fixedly connected to the circumferential surface of the mounting rod (62).

4. The high-current through-hole power device packaging structure according to claim 3, characterized in that: A retaining strip (641) is fixedly connected to the surface of the top plate (64), the retaining strip (641) is used to prevent the top plate (64) from detaching from the lower encapsulation box (1), and a chuck (66) is fixedly connected to the end of the mounting rod (62) away from the clamping plate (63).

5. The high-current through-hole power device packaging structure according to claim 4, characterized in that: The inner wall of the fixing block (61) is provided with a spring, and the spring is used to reset the chuck (66). The circumferential surface of the transmission rod (65) is in contact with the top of the top plate (64), and the circumferential surface of the mounting rod (62) is slidably connected to the inner wall of the lower packaging box (1).

6. The high-current through-hole power device packaging structure according to claim 5, characterized in that: The protective mechanism (7) includes a push plate (71), which is slidably connected to the inner wall of the lower packaging box (1). A guide plate (72) is fixedly connected to the front of the push plate (71). A guide groove is provided on the surface of the guide plate (72). A pressure rod (73) is fixedly connected to the bottom of the connecting plate (53) through a connecting rod. A push rod (74) is fixedly connected to the rear of the push plate (71). A transmission plate (75) is fixedly connected to the rear of the push rod (74). Rollers (76) are rotatably connected to the inner walls on both sides of the transmission plate (75).

7. The high-current through-hole power device packaging structure according to claim 6, characterized in that: The guide groove is located on the movement trajectory of the pressure rod (73), and the bottom of the guide plate (72) is in contact with the inner wall of the lower packaging box (1).

8. The high-current through-hole power device packaging structure according to claim 7, characterized in that: The inner wall of the lower packaging box (1) is fixedly connected to a mounting block (78), and the mounting block (78) is fixedly connected to an elastic telescopic rod (79) on the side near the pin (58). The telescopic end of the elastic telescopic rod (79) is fixedly connected to a clamping ring (710), and the circumferential surface of the clamping ring (710) is fixedly connected to a guide block (77). The surface of the pin (58) is fitted with a protective sleeve (711).

9. The high-current through-hole power device packaging structure according to claim 8, characterized in that: The circumferential surface of the roller (76) contacts the guide block (77), the inner wall of the clamping ring (710) contacts the circumferential surface of the protective sleeve (711), and the bottom of the clamping ring (710) contacts the inner wall of the lower packaging box (1).

10. The high-current through-hole power device packaging structure according to claim 9, characterized in that: The replacement mechanism (8) includes a pressure plate (81) and mounting screws (83). A pressure column (82) is fixedly connected to the bottom of the pressure plate (81). The heat conductor (3) is installed on the inner wall of the top of the upper packaging box (2) by mounting screws (83). The circumferential surface of the pressure column (82) contacts the inner wall of the top of the upper packaging box (2), and the bottom of the pressure column (82) contacts the top of the support plate (52).

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