Collecting device for chip manufacturing process
By designing a collection device for chip manufacturing processes and utilizing a reasonable flow path and condensation collection plate structure, the problem of foreign companies monopolizing high-temperature gas mixture condensation collection devices has been solved, achieving efficient condensation and reduced production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-03
- Publication Date
- 2026-03-27
AI Technical Summary
In existing chip manufacturing processes, the condensation and collection devices for high-temperature gas mixtures are monopolized by foreign companies, resulting in high procurement costs.
A collection device for chip manufacturing processes has been designed, including a housing, a collector, a channel, and a flow guide plate structure. Through a reasonable flow path and a condensation collection plate, the high-temperature gas mixture can be effectively condensed and collected.
It achieves efficient condensation and collection of process products and byproducts in gas mixtures, reducing dependence on foreign equipment and lowering production costs.
Smart Images
Figure CN121731901A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip manufacturing technology, and in particular to a chip manufacturing process collection device. Background Technology
[0002] Physical vapor deposition (PVD) is commonly used in semiconductor chip manufacturing. It employs physical methods to vaporize the surface of a material source into gaseous atoms or molecules, depositing a thin film with specific functions onto the substrate surface using low-pressure gas. PVD offers advantages such as simple process, uniform and dense film formation, and strong adhesion to the substrate. However, when PVD is applied to semiconductor manufacturing, a high-temperature gas mixture is generated within the reaction system, requiring condensation and collection. Currently, most semiconductor equipment and components used in chip manufacturing are monopolized by foreign companies, with direct procurement costs reaching hundreds of thousands of US dollars. Therefore, this paper proposes a collection device specifically designed for chip manufacturing processes. Summary of the Invention
[0003] The purpose of this invention is to provide a collection device for chip manufacturing processes, which has the effect of collecting gas mixtures in chip manufacturing processes.
[0004] The above-mentioned technical objective of the present invention is achieved through the following technical solution: a collection device for chip manufacturing process, including a housing and a collector located inside the housing, a first channel is formed between the upper end of the collector and the upper end of the interior of the housing, a second channel is formed between the side of the collector and the periphery of the interior of the housing, a third channel is formed inside the collector, the second channel and the third channel are connected, the first channel is connected to an inlet, and the third channel is connected to an outlet.
[0005] By adopting the above technical solution, the inlet is used to connect to the chip manufacturing process equipment, and the outlet is used to connect to the suction-generating equipment (such as a vacuum pump). The high-temperature gas mixture generated by the chip manufacturing process equipment enters the first channel from the inlet, then flows downward along the second channel, and enters the third channel from the second channel, finally exiting from the outlet. During this process, some substances in the high-temperature gas mixture decrease in temperature, condense into solids, and adhere to the inner walls of the first, second, and third channels. The gas mixture flow path is rationally designed, which can effectively collect process products or by-products in the gas mixture.
[0006] A further provision of the present invention is that the collector sidewall and / or the lower end sidewall and / or the bottom of the collector are provided with a plurality of perforations, the perforations connecting the second channel and the third channel.
[0007] By adopting the above technical solution, the perforation connects the second channel and the third channel, allowing the gas mixture entering the second channel to flow downwards along the second channel before entering the third channel. This extends the flow path length of the gas mixture and the contact time with the inner wall of the second channel, resulting in good condensation and collection effects.
[0008] A further configuration of the present invention is as follows: the first channel is provided with an outer guide plate and an inner guide plate, the outer guide plate is installed on the inner wall of the outer shell, the inner guide plate is installed on the outer wall of the collector, the outer guide plate is arranged horizontally, inclined or vertically, and the inner guide plate is arranged horizontally, inclined or vertically.
[0009] By adopting the above technical solution, the outer guide plate and the inner guide plate are used to guide the flow of the gas mixture in the second channel, so that it flows along the designed path or generates turbulence, so that the residence time of the gas mixture is within the designed range, and the condensation and collection effect is guaranteed.
[0010] A further provision of the present invention is that a baffle is provided in the first channel, the baffle being installed on the inner wall of the outer casing and intersecting with the outer guide plate, or the baffle being installed on the outer wall of the collector and intersecting with the inner guide plate.
[0011] By adopting the above technical solution, the spoiler is used to generate turbulence.
[0012] A further configuration of the present invention is that the spoiler is arranged horizontally, inclined, or vertically, and the spoiler has several flow-disrupting holes.
[0013] By adopting the above technical solutions, the specific design forms of the spoiler are varied, and its function is to generate turbulence.
[0014] A further feature of the present invention is that it also includes an air outlet pipe, the lower end of which is the air outlet, the upper end of which is located within the third channel, and the upper end of which is higher than the point where the second channel and the third channel connect.
[0015] By adopting the above technical solution, the gas mixture enters the third channel from the connection point (perforation point) through the second channel, and then needs to flow upward into the upper end of the outlet pipe, and then flow downward along the outlet pipe to be discharged from the outlet. This prolongs the flow path of the gas mixture and the contact time with the collector, which is beneficial to maintaining or improving the condensation and collection effect.
[0016] A further feature of the present invention is that the collector includes a plurality of condensation collection plates, and the condensation collection plates are provided with a plurality of channels penetrating the condensation collection plates.
[0017] By adopting the above technical solution, the number of condensation collection plates is preferably multiple, providing sites for the adhesion of condensate. Channels allow gas to pass through.
[0018] A further configuration of the present invention is as follows: the collector includes a cover, the third channel is formed inside the cover, a gap is formed between the bottom of the cover and the bottom wall of the outer shell, and a plurality of perforations are provided at the bottom of the cover.
[0019] By adopting the above technical solution, the gas mixture in the second channel can enter the third channel from the bottom of the casing.
[0020] A further provision of the present invention is that a heater is provided in the first channel located below or around the inlet, the heater being used to heat the gas mixture.
[0021] By adopting the above technical solution, the heater is used to heat the gas mixture, thereby preventing the formation of a large amount of condensate at or near the inlet, which could cause blockage at or near the inlet or in the first channel, affecting the condensate collection in the second and third channels.
[0022] A further provision of the present invention is that the outer shell includes a housing, an upper cover plate, and a sealing ring for sealing the gap between the housing and the upper cover plate. The upper cover plate has a cooling channel, and the two ends of the cooling channel are respectively connected to an inlet pipe and an outlet pipe. The cooling channel is used to flow coolant to cool the sealing ring.
[0023] By adopting the above technical solution, the aging effect of high-temperature gas mixtures on the sealing ring can be effectively mitigated, and the service life of the sealing ring can be extended.
[0024] The beneficial effects of this invention are:
[0025] 1. The present invention, through the structural design of the first channel, second channel, third channel and gas outlet pipe inside the shell, allows the gas mixture to diffuse outwards into the second channel after entering the first channel, flow downwards along the second channel, enter the third channel from the lower side wall and bottom of the collector, flow upwards in the third channel and enter the upper end of the gas outlet pipe, and finally flow downwards along the gas outlet pipe to be discharged. The gas mixture has a reasonable flow path and a long contact time in the collection device, resulting in a good condensation and collection effect.
[0026] 2. The outer and inner guide vanes are used to guide the flow of the gas mixture, while the baffles are used to create turbulence in the gas mixture, allowing for a longer contact time and better condensation of the gas mixture in the second channel. Simultaneously, the inner sidewalls of the outer shell, the collector surface, the outer guide vane surface, the inner guide vane surface, and the baffle surface all provide attachment sites for the condensate.
[0027] 3. The condensation collection plate can provide condensation attachment sites and effectively increase the residence contact time of the gas mixture in the third channel, thereby improving the condensation collection effect.
[0028] 4. This invention greatly reduces our dependence on imported foreign equipment and parts, breaks the foreign technology monopoly, and significantly reduces the production cost of chips in my country. Attached Figure Description
[0029] Figure 1 This is a schematic diagram showing the positional relationship between the outer shell and the inlet in Example 1.
[0030] Figure 2 This is a schematic diagram showing the positional relationship between the outer shell and the collector in Example 1.
[0031] Figure 3 This is a schematic diagram showing the positional relationship between the outer shell and the outlet in Example 1.
[0032] Figure 4 A schematic diagram of the internal structure of the collector in Example 1.
[0033] Figure 5 This is a schematic diagram showing the positional relationship between the outer shell and the outer guide plate in Embodiment 2. Figure 1 .
[0034] Figure 6 This is a schematic diagram showing the positional relationship between the outer shell and the outer guide plate in Embodiment 2. Figure 1 .
[0035] In the diagram, 1 is the outer shell; 11 is the casing; 12 is the top cover; 13 is the cooling channel; 14 is the inlet; 2 is the collector; 21 is the cover; 211 is the perforation; 22 is the condensation collection plate; 221 is the channel; 3 is the first channel; 31 is the heater; 32 is the heating extension plate; 4 is the second channel; 5 is the third channel; 6 is the outer guide plate; 7 is the inner guide plate; 8 is the baffle plate; 81 is the baffle hole; 9 is the exhaust pipe; and 91 is the outlet. Detailed Implementation
[0036] Example 1: A collection device for a chip manufacturing process, such as Figures 1 to 4 As shown, the device includes an outer shell 1 and a collector 2 located inside the outer shell 1. The collector 2 includes a cover 21. A first channel 3 is formed between the upper end of the cover 21 and the upper end of the inner part of the outer shell 1. A second channel 4 is formed between the side walls of the cover 21 and the periphery of the inner part of the outer shell 1. A third channel 5 is formed inside the cover 21. A gap is formed between the bottom of the cover 21 and the lower end of the inner part of the outer shell 1. Perforations 211 are provided at the bottom of the cover 21 and the side walls of the lower end of the cover 21, and the perforations 211 connect the second channel 4 and the third channel 5.
[0037] The upper end of the outer casing 1 is provided with an inlet 14, which is connected to the first channel 3. A heater 31 is installed in the first channel 3, located below the inlet 14, to heat the gas mixture entering from the inlet 14 and prevent the formation of a large amount of condensate near the inlet 14, which could cause blockage. The heater 31 is connected to a heating extension plate 32 to increase the heating area.
[0038] The second channel 4 is equipped with multiple outer guide vanes 6, multiple inner guide vanes 7, and multiple spoilers 8. The outer guide vanes 6 are vertically installed and fixed to the inner wall of the outer shell 1. The inner guide vanes 7 are vertically installed and fixed to the side wall of the cover 21. The spoilers 8 are horizontally installed and fixed to the side wall of the cover 21, and are arranged intersecting with the inner guide vanes 7. Each spoiler 8 has multiple spoiler holes 81.
[0039] Collector 2 also includes multiple condensation collection plates 22, which are installed and fixed inside the housing 21 and located in the third channel 5. The condensation collection plates 22 have multiple channels 221 that penetrate the condensation collection plates 22 to allow the gas mixture to pass through.
[0040] The collecting device also includes an exhaust pipe 9, the upper end of which is located inside the third channel 5, and the upper end of the exhaust pipe 9 is higher than the perforation 211. The exhaust pipe 9 passes downward through the cover 21 and the bottom of the outer shell 1 and is located outside the outer shell 1. The lower end of the exhaust pipe 9 is an outlet 91, which is used to connect to a vacuum pump.
[0041] The outer casing 1 includes a housing 11, an upper cover plate 12, and a sealing ring for sealing the gap between the housing 11 and the upper cover plate 12. The upper cover plate 12 has a cooling channel 13, and the two ends of the cooling channel 13 are respectively connected to an inlet pipe and an outlet pipe. The cooling channel 13 is used to flow coolant to cool the sealing ring.
[0042] Working principle: Inlet 14 is used to connect to the chip manufacturing process equipment, and outlet 91 is used to connect to the suction-generating equipment (such as a vacuum pump). The high-temperature gas mixture generated by the chip manufacturing process equipment enters the first channel 3 through inlet 14, then flows downward along the second channel 4, and enters the third channel 5 from the second channel 4, finally exiting from outlet 91. During this process, some substances in the high-temperature gas mixture decrease in temperature, condense into solids, and adhere to the inner walls of the first channel 3, the second channel 4, the third channel 5, the surface of the outer guide plate 6, the inner guide plate 7, the surface of the baffle plate 8, and the surface of the condensation collection plate 22. The gas mixture flow path is reasonably designed, which can effectively collect the process products or by-products in the gas mixture.
[0043] Example 2: A collection device for a chip manufacturing process, which differs from Example 1 in that, as shown in Example 1... Figure 5 , Figure 6As shown, the outer guide plate 6 is set at an angle.
[0044] Example 3: A collection device for a chip manufacturing process, which differs from Example 1 in that the outer guide plate 6 is horizontally arranged, and the baffle plate 8 is inclined.
[0045] Example 4: A collection device for a chip manufacturing process, which differs from Example 1 in that the inner guide plate 7 is horizontally arranged.
Claims
1. A collection device for a chip manufacturing process, comprising a housing (1) and a collector (2) located inside the housing (1), wherein a first channel (3) is formed between the upper end of the collector (2) and the upper end of the interior of the housing (1), a second channel (4) is formed between the side of the collector (2) and the periphery of the interior of the housing (1), a third channel (5) is formed inside the collector (2), the second channel (4) and the third channel (5) are connected, the first channel (3) is connected to an inlet (14), and the third channel (5) is connected to an outlet (91).
2. The collection device for a chip manufacturing process according to claim 1, characterized in that: The collector (2) has several perforations (211) on its side wall and / or the lower side wall and / or the bottom of its bottom, which connect the second channel (4) to the third channel (5).
3. The collection device for a chip manufacturing process according to claim 1, characterized in that: The first channel (3) is provided with an outer guide plate (6) and an inner guide plate (7). The outer guide plate (6) is installed on the inner wall of the outer shell (1), and the inner guide plate (7) is installed on the outer wall of the collector (2). The outer guide plate (6) is set horizontally, inclined or vertically, and the inner guide plate (7) is set horizontally, inclined or vertically.
4. The collection device for a chip manufacturing process according to claim 3, characterized in that: The first channel (3) is also provided with a baffle (8). The baffle (8) is installed on the inner wall of the outer shell (1) and is arranged to cross the outer guide plate (6), or the baffle (8) is installed on the outer wall of the collector (2) and is arranged to cross the inner guide plate (7).
5. The collection device for a chip manufacturing process according to claim 4, characterized in that: The spoiler (8) is set horizontally, tilted or vertically, and the spoiler (8) has several interference holes (81).
6. A collection device for a chip manufacturing process according to any one of claims 1-5, characterized in that: It also includes an air outlet pipe (9), the lower end of which is the air outlet, the upper end of which is located in the third channel (5), and the upper end of which is higher than the connection between the second channel (4) and the third channel (5).
7. A collection device for a chip manufacturing process according to any one of claims 1-5, characterized in that: The collector (2) includes several condensation collection plates (22), and the condensation collection plates (22) have several channels (221) that penetrate the condensation collection plates (22).
8. A collection device for a chip manufacturing process according to any one of claims 1-5, characterized in that: The collector (2) includes a cover (21), the third channel (5) is formed inside the cover (21), a gap is formed between the bottom of the cover (21) and the bottom wall of the outer shell (1), and a plurality of perforations (211) are provided at the bottom of the cover (21).
9. A collection device for a chip manufacturing process according to any one of claims 1-5, characterized in that: The first channel (3) is provided with a heater (31) located below or around the inlet (14), the heater (31) being used to heat the gas mixture.
10. A collection device for a chip manufacturing process according to any one of claims 1-5, characterized in that: The outer casing (1) includes a shell (11), an upper cover plate (12), and a sealing ring for sealing the gap between the shell (11) and the upper cover plate (12). The upper cover plate (12) has a cooling channel (13). The two ends of the cooling channel (13) are respectively connected to an inlet pipe and an outlet pipe. The cooling channel (13) is used to flow coolant to cool the sealing ring.