Full-automatic blade coating device for wafer glass slurry
The fully automatic wafer glass paste coating device, with its dual-station switching and dynamic adhesion adjustment, solves the problems of processing and loading/unloading interruptions and coating deviations in existing equipment, achieving efficient and stable wafer glass paste coating and improving production efficiency and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-10
- Publication Date
- 2026-03-27
AI Technical Summary
Existing wafer glass paste coating equipment suffers from single-station design, which leads to interruptions in processing and loading/unloading processes, making it unable to meet the needs of continuous operation in large-scale mass production. Furthermore, the coating components and the carrier components are prone to misalignment, and the coating speed is unstable, making it difficult to meet the chip consistency and precision requirements.
The system employs a dual-station switching structure and dynamic fit adjustment. Driven by a rotating component, a placing component, and a first driving component, it achieves synchronous operation of wafer loading and glass paste coating. Furthermore, the fit fine-tuning structure, composed of an extrusion component, a guide component, and a resetting component, ensures the stability of coating accuracy and speed.
It enables continuous fully automated scraping of wafer glass paste, improving processing efficiency and coating thickness consistency, meeting the coating accuracy requirements for improved chip consistency, and solving the problems of low efficiency and insufficient accuracy in existing equipment.
Smart Images

Figure CN121732380A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor packaging, and in particular to a fully automated wafer glass paste coating device. Background Technology
[0002] In semiconductor chip manufacturing processes, the uniform coating of glass paste on the wafer surface is a core step in ensuring the electrical performance and structural reliability of devices. Its processing efficiency and coating accuracy directly affect the mass production quality and adaptability of chips to large-scale production. Currently, the mainstream equipment for wafer glass paste coating in the industry is mainly screen printing equipment or semi-automatic scraping equipment. Both types of equipment operate around the core logic of the collaborative operation of coating and scraping components. However, as chip consistency continues to improve and mass production scale expands, the structural design of existing equipment has gradually revealed its compatibility shortcomings.
[0003] Existing wafer glass paste coating equipment suffers from significant structural defects and application limitations. Firstly, most equipment employs a single-station design, sharing the same station for coating and wafer loading / unloading. After coating a batch of wafers, the machine must be stopped to remove the processed wafers and place the unprocessed ones. During loading / unloading, the equipment is completely idle, preventing the coating and loading / unloading processes from being synchronized and disrupting the overall processing flow. This makes it difficult to meet the continuous operation efficiency requirements of large-scale mass production. Secondly, the coating and wafer-carrying components in existing equipment are mostly fixedly installed, lacking dynamic fit adjustment mechanisms. Initial mechanical assembly errors or wear after long-term use can easily lead to fit deviations between the coating and wafer-carrying components. Furthermore, the movement of the scraping components relies heavily on manual control or simple semi-automatic drive mechanisms, making it impossible to precisely control the stability of the scraping speed. This results in significant fluctuations in the glass paste coating thickness across different wafers, failing to meet the stringent requirements for coating accuracy after improving chip consistency. Therefore, a fully automated wafer glass paste scraping device is proposed. Summary of the Invention
[0004] This invention provides the following technical solution: a fully automatic wafer glass paste coating device, comprising: The support member and the rotating member rotatably connected to the center of the upper surface of the support member, and the rotating member has a placement member installed at the front and rear ends of the upper surface of the rotating member, and a placement area is opened on both sides of the upper surface of the placement member, and a first driving member is installed at the center of the lower surface of the support member, and the driving end of the first driving member is coaxially connected to the bottom end of the rotating member. The first fixing member is located above the rear end of the upper surface of the rotating member, and the second fixing member is installed in the center of the inner cavity of the first fixing member. The first coating member is provided on both sides of the upper surface of the second fixing member, and the position of the first coating member corresponds to that of the placement area. The first transmission component is rotatably connected above the first fixed component, and the end of the first transmission component is coaxially connected to the second driving component. A first sliding component is sleeved on the center of the surface of the first transmission component, and spraying components are installed on both sides of the first sliding component. A guide component is connected to the feed end of the spraying component, and a scraping component is installed on the lower surface of the first sliding component. The lower surface of the scraping component slides against the upper surface of the second fixed component. The extrusion component is rotatably connected to the upper rear end of the support component, and the rotating end of the extrusion component is coaxially connected to the third driving component, which is in contact with the lower surface of the extrusion component and the lower center of the back of the first fixing component. The guide is disposed on both sides of the rear end of the upper surface of the support, and the back sides of the first fixing member are sleeved on the upper part of the guide, and a reset member is sleeved on the lower part of the guide.
[0005] After the wafer to be processed is placed in the placement area of the placement component, the first driving component drives the rotating component to rotate, and the rotating component drives the placement component to rotate synchronously, so that the wafer to be processed in the placement area moves to the working position corresponding to the first coating component. The third driving component drives the extruder to rotate, the extruder squeezes the first fixing component, the first fixing component moves downward along the guide component, and the first fixing component drives the second fixing component to move synchronously, so that the first coating component is in contact with the surface of the wafer to be processed in the placement area. The glass slurry is guided to the spraying component by the guide under the delivery of the external equipment. At the same time, the second drive component drives the first transmission component to rotate, the first transmission component drives the first sliding component to move, the first sliding component drives the spraying component to move synchronously, the spraying component sprays the glass slurry onto the first coating component, the first sliding component drives the scraper to move synchronously, the scraper slides along the upper surface of the second fixed component, and scrapes the glass slurry on the first coating component evenly. The third driving component continues to drive the extruder to rotate, the extruder separates from the first fixing component, the reset component at the bottom of the guide component drives the first fixing component to move upward along the guide component to reset, the first fixing component drives the second fixing component and the first coating component to move synchronously, so that the first coating component separates from the wafer surface after coating. The first driving component drives the rotating component to rotate again, and the rotating component drives the placement component to rotate synchronously, removing the wafer that has been coated from the working position corresponding to the first coating component. At the same time, the wafer to be processed in another placement area on the placement component is moved to the working position corresponding to the first coating component. The above steps are repeated to realize the continuous fully automatic coating operation of wafer glass paste.
[0006] Preferably, a conveying component is added to the outside of the support component, and the upper surface of the conveying component is designed with an incline, and buffer components are installed on the front and back of the inner wall of the conveying component.
[0007] The inclined design of the conveyor reduces resistance during the transport process, facilitates smooth movement of objects, and improves transport efficiency; the buffer prevents objects from directly colliding with the inner wall of the conveyor, effectively protecting the integrity of the objects and reducing the probability of wear and tear during transport.
[0008] Preferably, a guide is installed on the upper surface of the conveyor at the feed end, and the guide is located on the upper outer side of the top of the rotating part, and the lower surface of the guide is at the same height as the placement area.
[0009] The positioning of the guide component and its height design, which are consistent with the placement area, can accurately connect the placement area of the rotating component and the conveyor, preventing objects from falling or shifting when transferred from the placement area to the conveyor, and ensuring the smoothness and continuity of object transfer.
[0010] Preferably, a heating element is provided at the discharge end of the conveying component, and the inlet end of the heating element corresponds to the discharge end of the conveying component, and a heating assembly is provided at the corresponding position in the inner cavity of the heating element.
[0011] The heating element and the feeding end of the conveyor correspond to each other, achieving seamless connection between object conveying and heating. No additional manual or equipment is needed to transfer objects, shortening the operation process and improving the overall processing efficiency. The heating component can heat objects in a targeted manner to meet the specific heating process requirements of the objects and ensure the stability of the heating effect.
[0012] Preferably, a feeding component is added to the front end of the upper surface of the support member, and the center of the back side of the feeding component slides and fits against the center of the front side of the rotating member.
[0013] The sliding contact design of the feeding component and the rotating component ensures the fit and stability of the two components during relative movement, avoids the failure of object transfer due to misalignment during the feeding process, and ensures that the object can be accurately and stably transferred to the placement area of the rotating component, thereby improving the reliability of feeding.
[0014] Preferably, a lifting component is provided directly below the feeding component, and the bottom end of the lifting component is connected to the support component. A forked component is installed at the lifting end of the lifting component, and the top end of the forked component is connected to both sides of the lower surface of the feeding component.
[0015] The combination of the lifting component and the fork component allows for flexible adjustment of the height of the feeding component, enabling it to adapt to different feeding height requirements or achieve precise alignment with the placement area of the rotating component, thus improving the versatility of the equipment. The fork component connects to the feeding component on both sides, ensuring balanced force during the lifting and lowering of the feeding component, preventing tilting, and ensuring the smoothness of the lifting and lowering movement of the feeding component.
[0016] Preferably, the upper surface of the feeding component is provided with positioning components on both sides, and the discharge end of the positioning component corresponds to the position of the placement area, and a pusher is slidably connected to the inner cavity of the positioning component.
[0017] Positioning components can constrain the positioning of objects, preventing them from moving arbitrarily on the feeding components and ensuring the accuracy of their position before feeding. The sliding pusher can replace manual feeding, enabling precise pushing of objects to the placement area and improving feeding efficiency and accuracy.
[0018] Preferably, a second transmission component is rotatably connected to the center of the inner cavity of the feeding component, and a fourth driving component is coaxially connected to the end of the second transmission component. The first driving component, the second driving component, the third driving component, and the fourth driving component are respectively connected to the corresponding support component, the first fixing component, and the feeding component.
[0019] The fourth driving component provides stable power for the rotation of the second transmission component, ensuring that the second transmission component can operate continuously and stably, and providing a power basis for the movement of subsequent related components; the connecting component can firmly fix each driving component to the corresponding structure, preventing the driving component from shaking or displacing due to vibration during operation, ensuring the operating accuracy of each driving component, and thus improving the working stability and reliability of the overall equipment.
[0020] Preferably, a second sliding member is sleeved at the center of the surface of the second transmission member, and the outer surface of the second sliding member is slidably fitted with the inner wall of the feeding member.
[0021] The cooperation between the second transmission component and the second sliding component enables the transmission and conversion of power, transforming the rotational motion of the second transmission component into the sliding motion of the second sliding component. The sliding contact design between the second sliding component and the inner wall of the feeding component guides the sliding direction of the second sliding component, preventing deviation or jamming during sliding and ensuring the smoothness and accuracy of the sliding motion of the second sliding component.
[0022] Preferably, a limiting element is provided at the center of the corresponding inner wall of the positioning element, and the two sides of the second sliding element extend outward along the limiting element and connect with the corresponding pushing element.
[0023] The limiting component can guide and limit the extended movement on both sides of the second sliding component, preventing directional deviation when the second sliding component drives the pusher component to move, and ensuring that the pusher component can slide stably along the preset trajectory of the positioning component's inner cavity; the second sliding component is directly connected to the pusher component, reducing power transmission links, reducing power loss, improving transmission efficiency and the pusher component's pushing response speed, and further ensuring the accuracy of object pushing.
[0024] In summary, compared with the prior art, the present invention provides a fully automatic wafer glass paste coating device, which has the following beneficial effects: This invention uses a rotating component, a placement component, and a first driving component to drive rotation, forming a dual-station switching structure. The placement areas of the two placement components can be used for wafer loading and glass slurry coating operations respectively, without stopping the machine to wait for loading and unloading. This solves the problem of interruption in the processing and loading / unloading process of existing single-station equipment, and significantly improves the overall processing efficiency. The fitting fine-tuning structure is formed by the extrusion component, guide component, and reset component. When the third drive component drives the cam to rotate, it can push the first fixing component to move up and down along the guide rod, dynamically compensating for mechanical errors and ensuring that the lower surface of the second fixing component fits with the upper surface of the placement component. The second drive component drives the first transmission component to move the first sliding component at a uniform speed, so that the coating component can coat at a uniform speed, avoiding the problems of uneven coating speed and unstable fitting in manual or semi-automatic equipment, ensuring the consistency of coating thickness of batch wafers, and meeting the requirements of coating accuracy for improving chip consistency. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the structure of the present invention.
[0026] Figure 2 This is a schematic diagram of the right rear side view of the support member of the present invention.
[0027] Figure 3 This is a cross-sectional structural diagram of the support component of the present invention.
[0028] Figure 4 This is a cross-sectional view of the loading component of the present invention.
[0029] Figure 5 This is a schematic diagram of the right rear view of the first fixing member of the present invention.
[0030] Figure 6 This is a schematic diagram of the conveying component and its connection structure of the present invention.
[0031] Explanation of reference numerals in the attached figures: 1. Support component, i.e., support base; 2. Rotating component; 3. Placement component; 4. Placement area; 5. First driving component; 6. First fixing component; 7. Second fixing component; 8. First coating component; 9. First transmission component, i.e., first lead screw; 10. Second driving component; 11. First sliding component; 12. Spraying component; 13. Guide component; 14. Scraping component; 15. Extrusion component; 16. Third driving component; 17. Guide component; 18. Reset component; 19. Conveying component; 20. Buffer component, i.e., elastic buffer plate; 21. Flow guide component; 22. Heating component, i.e., heating box; 23. Feeding component; 24. Positioning component; 25. Pushing component; 26. Second transmission component; 27. Second sliding component; 28. Fourth driving component; 29. Lifting component. Detailed Implementation
[0032] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 This invention provides a technical solution: a fully automatic wafer glass paste coating device, comprising: Support 1, and rotating component 2 rotatably connected to the center of the upper surface of support 1, with a placement component 3 installed at the front and rear ends of the upper surface of rotating component 2, and placement areas 4 opened on both sides of the upper surface of placement component 3, and a first driving component 5 installed at the center of the lower surface of support 1, with the driving end of the first driving component 5 coaxially connected to the bottom end of rotating component 2. The first fixing member 6 is located above the rear end of the upper surface of the rotating member 2, and the second fixing member 7 is installed in the center of the inner cavity of the first fixing member 6. The first coating member 8 is provided on both sides of the upper surface of the second fixing member 7, and the position of the first coating member 8 corresponds to that of the placement area 4. The first transmission component 9 is rotatably connected above the first fixing component 6, and the end of the first transmission component 9 is coaxially connected to the second driving component 10. A first sliding component 11 is sleeved on the center of the surface of the first transmission component 9, and spraying components 12 are installed on both sides of the first sliding component 11. A guide component 13 is connected to the feed end of the spraying component 12, and a scraping component 14 is installed on the lower surface of the first sliding component 11. The lower surface of the scraping component 14 slides and fits against the upper surface of the second fixing component 7. The extrusion member 15 is rotatably connected to the upper rear end of the support member 1, and the rotating end of the extrusion member 15 is coaxially connected to the third drive member 16, which is in contact with the lower surface of the extrusion member 15 and the lower center of the back of the first fixing member 6. The guide member 17 is disposed on both sides of the rear end of the upper surface of the support member 1, and the back sides of the first fixing member 6 are sleeved on the upper part of the guide member 17, and the reset member 18 is sleeved on the lower part of the guide member 17.
[0033] After the wafer to be processed is placed in the placement area 4 of the placement component 3, the first driving component 5 drives the rotating component 2 to rotate, and the rotating component 2 drives the placement component 3 to rotate synchronously, so that the wafer to be processed in the placement area 4 moves to the working position corresponding to the first coating component 8. The third driving component 16 drives the extruder 15 to rotate, the extruder 15 extrudes the first fixing component 6, the first fixing component 6 moves downward along the guide component 17, the first fixing component 6 drives the second fixing component 7 to move synchronously, so that the first coating component 8 is in contact with the surface of the wafer to be processed in the placement area 4. The glass slurry is guided by the guide 13 to the spraying component 12 under the delivery of the external equipment. At the same time, the second driving component 10 drives the first transmission component 9 to rotate. The first transmission component 9 drives the first sliding component 11 to move. The first sliding component 11 drives the spraying component 12 to move synchronously. The spraying component 12 sprays the glass slurry onto the first coating component 8. The first sliding component 11 drives the scraper 14 to move synchronously. The scraper 14 slides along the upper surface of the second fixing component 7 to uniformly scrape the glass slurry on the first coating component 8. The third driving member 16 continues to drive the extruder 15 to rotate, the extruder 15 separates from the first fixing member 6, the reset member 18 at the lower part of the guide member 17 drives the first fixing member 6 to move upward along the guide member 17 to reset, the first fixing member 6 drives the second fixing member 7 and the first coating member 8 to move synchronously, so that the first coating member 8 separates from the wafer surface after coating. The first driving component 5 drives the rotating component 2 to rotate again, and the rotating component 2 drives the placement component 3 to rotate synchronously, so that the wafer that has been coated is removed from the working position corresponding to the first coating component 8. At the same time, the wafer to be processed in another placement area 4 on the placement component 3 is moved to the working position corresponding to the first coating component 8. The above steps are repeated to realize the continuous fully automatic coating operation of wafer glass paste. Through the coordinated drive of the first drive component 5, the second drive component 10 and the third drive component 16, combined with the cyclic rotation of the rotating component 2 and the linear transmission of the first transmission component 9, the manual intervention of traditional manual scraping and semi-automatic equipment is replaced, realizing the full automation of wafer glass paste coating, scraping and station switching. This solves the problems of low efficiency and poor consistency of manual scraping and the inability of semi-automatic equipment to operate continuously, and significantly improves production efficiency and product quality stability. The first fixing member 6 moves up and down along the guide member 17, which provides stable guidance for the first fixing member 6 and avoids deviation during the movement. The reset member 18 can realize the automatic and accurate reset of the first fixing member 6, ensuring the stability of the bonding and separation process between the first coating member 8 and the wafer, solving the coating deviation problem caused by mechanical structure shaking in semi-automatic equipment, and improving the overall operational reliability of the device.
[0034] Please see Figure 1 A conveyor 19 is added to the outside of the support 1, and the upper surface of the conveyor 19 is designed with a slope. Buffers 20 are installed on the front and back of the inner wall of the conveyor 19.
[0035] The conveyor 19 carries the object along the inclined plane on its upper surface; when the object is conveyed in the conveyor 19, the buffer 20 comes into contact with the object and plays a buffering role in the conveying movement of the object through its own structural characteristics. The inclined design of the conveyor 19 can reduce the resistance during the conveying process, help the object move smoothly, and improve the conveying efficiency; the buffer 20 can prevent the object from directly colliding with the inner wall of the conveyor 19, effectively protect the integrity of the object, and reduce the probability of wear and tear on the object during conveying.
[0036] Please see Figure 6 A guide 21 is installed on the upper surface of the feed end of the conveyor 19, and the guide 21 is located on the upper outer side of the top of the rotating part 2. The height of the lower surface of the guide 21 is the same as the height of the placement area 4.
[0037] The rotating component 2 drives the placement area 4 and the objects to rotate. When the placement area 4 rotates to the corresponding position of the guide component 21, the guide component 21 guides the objects in the placement area 4 from the placement area 4 into the feed end of the conveyor 19. The positioning of the guide component 21 and its height design that are consistent with the placement area 4 can accurately connect the placement area 4 of the rotating component 2 and the conveyor component 19, avoiding the problem of objects falling or shifting when they are transferred from the placement area 4 to the conveyor component 19, and ensuring the stability and continuity of the object transfer.
[0038] A heating element 22 is provided at the discharge end of the conveyor 19, and the feed end of the heating element 22 corresponds to the discharge end of the conveyor 19. A heating component is provided at the corresponding position in the inner cavity of the heating element 22.
[0039] The conveyor 19 carries the object from its discharge end to the feed end of the heating element 22, so that the object enters the heating element 22; the heating component inside the heating element 22 is activated to heat the object that has entered the heating element 22. The heating element 22 corresponds to the feeding end of the conveyor 19, achieving seamless connection between object conveying and heating. No additional manual or equipment is needed to transfer objects, shortening the operation process and improving overall processing efficiency. The heating component can heat objects in a targeted manner to meet the specific heating process requirements of the objects and ensure the stability of the heating effect.
[0040] Please see Figure 1 A feeding component 23 is added to the front end of the upper surface of the support component 1, and the center of the back side of the feeding component 23 slides and fits against the center of the front side of the rotating component 2.
[0041] The feeding component 23 carries the object to be fed. When the rotating component 2 rotates, the feeding component 23 slides against the center of its back side and the center of the front side of the rotating component 2. In coordination with the rotation of the rotating component 2, the feeding component 23 transfers the object it carries to the placement area 4 of the rotating component 2. The sliding contact design of the feeding component 23 and the rotating component 2 can ensure the contact and stability of the two during relative movement, avoid the failure of object transfer due to misalignment during the feeding process, ensure that the object can be accurately and stably transferred to the placement area 4 of the rotating component 2, and improve the reliability of feeding.
[0042] Please see Figure 4 A lifting component 29 is provided directly below the loading component 23, and the bottom end of the lifting component 29 is connected to the support component 1. A forked component is installed at the lifting end of the lifting component 29, and the top end of the forked component is connected to both sides of the lower surface of the loading component 23.
[0043] When the lifting component 29 is activated, it drives the forked component connected to its lifting end to move up and down; during the lifting and down movement, the forked component drives the loading component 23 connected to its top to move up and down synchronously. The lifting component 29 and the fork component work together to flexibly adjust the height of the feeding component 23, so that the feeding component 23 can adapt to different feeding needs, or achieve precise height docking with the placement area 4 of the rotating component 2, thereby improving the versatility of the equipment. The fork component connects to the feeding component 23 on both sides, which can ensure that the force on the feeding component 23 is balanced when it is raised and lowered, avoid the feeding component 23 from tilting, and ensure the smoothness of the raising and lowering movement of the feeding component 23.
[0044] Positioning members 24 are provided on both sides of the upper surface of the feeding member 23, and the discharge end of the positioning member 24 corresponds to the position of the placement area 4. A pushing member 25 is slidably connected to the inner cavity of the positioning member 24.
[0045] When the object to be loaded is placed in the positioning member 24, the pushing member 25 slides in the inner cavity of the positioning member 24. During the sliding process, the pushing member 25 drives the object in the positioning member 24 to move towards the discharge end of the positioning member 24, and then pushes the object to the placement area 4 corresponding to the discharge end of the positioning member 24. The positioning component 24 can position and constrain the object, preventing it from moving randomly on the feeding component 23 and ensuring the accuracy of the object's position before feeding. The sliding push of the pushing component 25 can replace manual feeding, enabling the object to be accurately pushed to the placement area 4, thus improving feeding efficiency and accuracy.
[0046] The inner cavity center of the feeding component 23 is rotatably connected to the second transmission component 26, and the end of the second transmission component 26 is coaxially connected to the fourth driving component 28. The first driving component 5, the second driving component 10, the third driving component 16 and the fourth driving component 28 are respectively connected to the corresponding support component 1, the first fixing component 6 and the feeding component 23.
[0047] The fourth driving component 28 is activated, driving the second transmission component 26, which is coaxially connected to it, to rotate in the center of the inner cavity of the loading component 23; the connecting components respectively fix the first driving component 5 to the support component 1, fix the second driving component 10 to the first fixing component 6, fix the fourth driving component 28 to the loading component 23, and fix the third driving component 16 to the first fixing component 6, ensuring the stable position of each driving component during operation; The fourth driving component 28 provides stable power for the rotation of the second transmission component 26, ensuring that the second transmission component 26 can operate continuously and stably, and providing a power basis for the movement of subsequent related components; the connecting component can firmly fix each driving component to the corresponding structure, preventing the driving component from shaking or displacing due to vibration during operation, ensuring the operating accuracy of each driving component, and thus improving the working stability and reliability of the overall equipment.
[0048] The second sliding member 27 is sleeved on the center of the surface of the second transmission member 26, and the outer surface of the second sliding member 27 slides and fits against the inner wall of the feeding member 23.
[0049] When the second transmission member 26 rotates, it drives the second sliding member 27, which is sleeved at the center of its surface, to slide along the surface of the second transmission member 26; during the sliding process, the outer surface of the second sliding member 27 remains in sliding contact with the inner wall of the feeding member 23. The cooperation between the second transmission component 26 and the second sliding component 27 realizes the transmission and conversion of power, transforming the rotational motion of the second transmission component 26 into the sliding motion of the second sliding component 27; the sliding contact design between the second sliding component 27 and the inner wall of the feeding component 23 can guide the sliding direction of the second sliding component 27, prevent the second sliding component 27 from deviating or jamming during sliding, and ensure the smoothness and accuracy of the sliding motion of the second sliding component 27.
[0050] A limiting element is provided at the center of the corresponding inner wall of the positioning element 24, and the two sides of the second sliding element 27 extend outward along the limiting element and connect with the corresponding pusher element 25.
[0051] When the second sliding member 27 slides, the limiting members on both sides of it extend outward along the center of the inner wall of the positioning member 24, thereby driving the pusher 25 connected to the extended part of the second sliding member 27 to slide in the inner cavity of the positioning member 24. The limiting component can guide and limit the extension movement on both sides of the second sliding component 27, preventing directional deviation when the second sliding component 27 drives the pusher component 25 to move, and ensuring that the pusher component 25 can slide stably along the preset trajectory of the inner cavity of the positioning component 24. The second sliding component 27 is directly connected to the pusher component 25, reducing the power transmission links, reducing power loss, improving transmission efficiency and the pushing response speed of the pusher component 25, and further ensuring the accuracy of object pushing.
[0052] In this scheme: the lifting component 29 on the support base 1 (i.e., the telescopic electric rod) drives the forked component (i.e., the Y-shaped rod) to move up and down. The forked component drives the loading component 23 (i.e., the loading plate) to move up and down synchronously. When the object to be loaded is placed in the positioning component 24 (i.e., the positioning groove), the fourth driving component 28 (i.e., the fourth driving motor) drives the second transmission component 26 to rotate in the center of the inner cavity of the loading component 23. The second lead screw of the second transmission component 26 drives the second sliding component 27 (i.e., the second sliding block) to slide along the surface of the second transmission component 26. The two sides of the second sliding component 27 extend outward along the limiting component, driving the pushing component 25 (i.e., the I-shaped push plate) to slide in the inner cavity of the positioning component 24. The pushing component 25 drives the object in the positioning component 24 to move towards the discharge end, pushing the object to the placement area 4 of the placement component 3 (i.e., the placement plate). After the wafer to be processed is placed in the placement area 4 of the placement component 3, the first driving component 5, i.e. the first driving motor, drives the rotating component 2, i.e. the turntable, to rotate. The rotating component 2 drives the placement component 3 to rotate synchronously, so that the wafer to be processed in the placement area 4 moves to the working position corresponding to the first coating component 8, i.e. the coating screen. The third driving component 16, i.e., the third driving motor, drives the extrusion component 15, i.e., the cam, to rotate. The extrusion component 15 extrudes the first fixing component 6, i.e., the fixing frame plate. The first fixing component 6 moves downward along the guide component 17, i.e. the guide rod. The first fixing component 6 drives the second fixing component 7, i.e. the fixing plate, to move synchronously, so that the first coating component 8 is in contact with the surface of the wafer to be processed in the placement area 4. The glass slurry is transported by the external equipment and guided to the spraying component 12, i.e. the spraying head, by the guide component 13, i.e. the diversion conduit. At the same time, the second driving component 10, i.e., the second driving motor, i.e. the first lead screw, drives the first transmission component 9 to rotate. The first transmission component 9 drives the first sliding component 11, i.e. the first sliding block, to move. The first sliding component 11 drives the spraying component 12 to move synchronously. The spraying component 12 sprays the glass slurry onto the first coating component 8. The first sliding component 11 drives the scraper component 14, i.e. the scraper plate, to move synchronously. The scraper component 14 slides along the upper surface of the second fixing component 7 to uniformly scrape the glass slurry on the first coating component 8. The third driving member 16 continues to drive the extrusion member 15 to rotate, the extrusion member 15 separates from the first fixing member 6, and the reset member 18 at the lower part of the guide member 17, i.e. the reset spring, drives the first fixing member 6 to move upward along the guide member 17 to reset. The first fixing member 6 drives the second fixing member 7 and the first coating member 8 to move synchronously, so that the first coating member 8 separates from the wafer surface after the coating is completed. The first driving component 5 drives the rotating component 2 to rotate again, and the rotating component 2 drives the placement component 3 to rotate synchronously, so as to remove the wafer that has been coated from the working position corresponding to the first coating component 8, and at the same time move the wafer to be processed in another placement area 4 on the placement component 3 to the working position corresponding to the first coating component 8. The rotating component 2 drives the placement area 4, where the coated wafer is located, to rotate. When the placement area 4 rotates to the position corresponding to the guide component 21, i.e. the semi-circular guide plate, the guide component 21 guides the coated wafer in the placement area 4 from the placement area 4 into the feed end of the conveyor 19, i.e. the conveyor plate. The conveyor 19 drives the coated wafer to move along the inclined surface of its upper surface. When the coated wafer is conveyed in the conveyor 19, the buffer component 20, i.e. the elastic buffer plate, contacts the coated wafer and buffers the conveying movement of the coated wafer. The conveyor 19 drives the coated wafer from its discharge end to the heating element 22, i.e., the feed end of the heating box, so that the coated wafer enters the heating element 22; the heating component inside the heating element 22 is activated to heat the coated wafer that has entered the heating element 22, and then the wafer is taken out from the heating element 22; the above steps are repeated to realize the continuous fully automatic coating operation of wafer glass paste; The connecting parts, namely the motor bases, respectively fix the first driving component 5 to the support component 1, fix the second driving component 10 to the first fixing component 6, fix the fourth driving component 28 to the feeding component 23, and fix the third driving component 16 to the first fixing component 6, thereby ensuring the stable position of each driving component during operation.
Claims
1. A fully automatic wafer glass paste coating device, characterized in that, include: Support (1), and rotating part (2) rotatably connected to the center of the upper surface of support (1), and a placement part (3) is installed at the front and rear ends of the upper surface of rotating part (2), and a placement area (4) is opened on both sides of the upper surface of placement part (3), and a first driving part (5) is installed at the center of the lower surface of support (1), and the driving end of the first driving part (5) is coaxially connected to the bottom end of rotating part (2); The first fixing member (6) is located above the rear end of the upper surface of the rotating member (2), and the second fixing member (7) is installed in the center of the inner cavity of the first fixing member (6), and the first coating member (8) is provided on both sides of the upper surface of the second fixing member (7), and the positional relationship between the first coating member (8) and the placement area (4) is corresponding. The first transmission component (9) is rotatably connected above the first fixing component (6), and the end of the first transmission component (9) is coaxially connected to the second driving component (10). A first sliding component (11) is sleeved on the center of the surface of the first transmission component (9), and spraying components (12) are installed on both sides of the first sliding component (11). A guide component (13) is connected to the feed end of the spraying component (12), and a scraping component (14) is installed on the lower surface of the first sliding component (11). The lower surface of the scraping component (14) slides and fits against the upper surface of the second fixing component (7). The extrusion piece (15) is rotatably connected to the upper rear end of the support piece (1), and the rotating end of the extrusion piece (15) is coaxially connected to the third drive piece (16), and is attached to the lower surface of the extrusion piece (15) and the lower center of the back of the first fixing piece (6). The guide (17) is disposed on both sides of the upper surface of the support (1), and the back sides of the first fixing member (6) are sleeved on the upper part of the guide (17), and the reset member (18) is sleeved on the lower part of the guide (17).
2. The fully automatic wafer glass paste coating device according to claim 1, characterized in that: A conveyor (19) is added to the outside of the support (1), and the upper surface of the conveyor (19) is designed with an incline. Buffers (20) are installed on the inner wall of the conveyor (19) before and after.
3. The fully automatic wafer glass paste coating device according to claim 2, characterized in that: The upper surface of the conveyor (19) is equipped with a guide (21) at the feed end, and the guide (21) is located on the upper outer side of the top of the rotating part (2). The height of the lower surface of the guide (21) is consistent with the height of the placement area (4).
4. The fully automatic wafer glass paste coating device according to claim 2, characterized in that: The discharge end of the conveying component (19) is provided with a heating element (22), and the inlet end of the heating element (22) corresponds to the outlet end of the conveying component (19), and a heating component is provided at the corresponding position in the inner cavity of the heating element (22).
5. The fully automatic wafer glass paste coating device according to claim 1, characterized in that: The upper surface of the support member (1) is provided with a feeding member (23), and the back center of the feeding member (23) slides and fits with the front center of the rotating member (2).
6. The fully automatic wafer glass paste coating device according to claim 5, characterized in that: A lifting component (29) is provided directly below the loading component (23), and the bottom end of the lifting component (29) is connected to the support component (1). A forked component is installed at the lifting end of the lifting component (29), and the top end of the forked component is connected to both sides of the lower surface of the loading component (23).
7. The fully automatic wafer glass paste coating device according to claim 6, characterized in that: Positioning elements (24) are provided on both sides of the upper surface of the feeding element (23), and the discharge end of the positioning element (24) corresponds to the position of the placement area (4), and a pusher element (25) is slidably connected to the inner cavity of the positioning element (24).
8. The fully automatic wafer glass paste coating device according to claim 7, characterized in that: The inner cavity center of the feeding component (23) is rotatably connected to the second transmission component (26), and the end of the second transmission component (26) is coaxially connected to the fourth driving component (28). The first driving component (5), the second driving component (10), the third driving component (16) and the fourth driving component (28) are respectively connected to the corresponding support component (1), the first fixing component (6) and the feeding component (23) by connecting components.
9. The fully automatic wafer glass slurry coating device according to claim 8, characterized in that: The second sliding member (27) is sleeved on the center of the surface of the second transmission member (26), and the outer surface of the second sliding member (27) slides and fits against the inner wall of the feeding member (23).
10. The fully automatic wafer glass paste coating device according to claim 9, characterized in that: The positioning member (24) has a limiting member at the center of its inner wall, and the two sides of the second sliding member (27) extend outward along the limiting member and connect with the corresponding pusher member (25).