High-precision laser welding tool for blood glucose monitoring PCBA battery

Abstract

The invention relates to the technical field of welding tools, in particular to a high-precision laser welding tool for a blood glucose monitoring PCBA battery, which comprises a welding table, a clamping mechanism, a support plate, a temperature control device, a vacuum adsorption device and a control system, a plurality of first holes are formed in the supporting plate; the temperature control device comprises a first covering plate, a heating assembly and a cooling assembly, the first covering plate is used for covering a welding point of the blood glucose monitoring PCBA battery, the heating assembly is used for preheating the blood glucose monitoring PCBA battery, and the cooling assembly is used for reducing the peripheral temperature of the welding point; the vacuum adsorption device is used for providing adsorption force; the control system is used for controlling the temperature control device and the vacuum adsorption device to adjust positions; by arranging the clamping mechanism, the supporting plate, the temperature control device, the vacuum adsorption device and the control system, accurate preheating of the to-be-welded point and effective cooling of the area around the to-be-welded point are achieved.

Description

Technical Field

[0001] This invention application relates to the field of welding tooling technology, specifically to a high-precision laser welding tooling for blood glucose monitoring PCBA batteries. Background Technology

[0002] In the field of PCBA battery welding for blood glucose monitoring, traditional welding fixtures have many problems. During the welding process, traditional fixtures struggle to achieve precise positioning and stable clamping of the PCB board, leading to easy displacement of the PCB board during welding and affecting welding accuracy and quality.

[0003] Patent CN120734636B discloses a PCB board welding fixture and its welding method. It uses a welding table with a placement groove in the middle and a multi-directional clamping mechanism to accurately place and fix the PCB board, ensuring that the PCB board does not shift during the welding process. By optimizing the welding process parameters and adopting advanced welding technology, the temperature of the welding area is effectively controlled, so that the welding temperature is stabilized within a suitable range, reducing welding defects and reducing the thermal impact on surrounding components.

[0004] While the above solutions ensure the stability of the PCB board during the soldering process, the temperature control system is not precise or efficient enough. It cannot achieve precise zoned temperature control of the soldering point and the surrounding area, making it difficult to meet the high precision requirements of blood glucose monitoring PCBA batteries for soldering temperature. Summary of the Invention

[0005] To address the aforementioned issues, a high-precision laser welding fixture for blood glucose monitoring PCBA batteries is provided. By incorporating a clamping mechanism, a support plate, a temperature control device, a vacuum adsorption device, and a control system, it achieves precise preheating of the welding points and effective cooling of the surrounding area, thereby improving the overall welding quality of the blood glucose monitoring PCBA batteries.

[0006] To address the problems of existing technologies, this invention provides a high-precision laser welding fixture for blood glucose monitoring PCBA batteries. The fixture includes a welding table with a placement groove in the center and a clamping mechanism mounted on the welding table for holding the blood glucose monitoring PCBA batteries. It also includes a support plate, a temperature control device, a vacuum adsorption device, and a control system. The support plate is horizontally positioned within the placement groove and has multiple first holes arranged in a matrix. The temperature control device includes a first cover plate, a heating component, and a cooling component. The first cover plate is horizontally positioned below the support plate and covers the welding points of the blood glucose monitoring PCBA batteries. The heating component preheats the blood glucose monitoring PCBA batteries through the first holes corresponding to the welding points. The cooling component reduces the temperature around the welding points. The vacuum adsorption device applies adsorption force to the blood glucose monitoring PCBA batteries through the remaining first holes on the support plate. The control system controls the adjustment of the positions of the temperature control device and the vacuum adsorption device.

[0007] Preferably, a heating port is provided in the middle of the first cover plate, the heating component is installed in the heating port, and a plurality of cooling ports are provided around the heating port on the first cover plate, the cooling ports being connected to the cooling component.

[0008] Preferably, the heating assembly includes a flow guide and a heating element; the flow guide is installed inside the heating port, and the upper diameter of the flow guide is smaller than the inner diameter of the first hole; the heating element is disposed inside the flow guide.

[0009] Preferably, the cooling assembly includes a dust cover, a cooling fan, and multiple docking covers; the dust cover is disposed at the lower end of the first cover plate; the cooling fan is disposed inside the dust cover; the multiple docking covers are respectively installed in multiple cooling ports, and the upper diameter of the docking cover is smaller than the inner diameter of the first hole.

[0010] Preferably, the heating assembly further includes a base, which is disposed at the inlet end of the flow guide and has a plurality of second holes.

[0011] Preferably, the temperature control device further includes a waste heat recovery component, which is used to recover the air heated by the heating component.

[0012] Preferably, the waste heat recovery assembly includes a partition cover, a concentrator cover, and a return pipe; the partition cover is used to prevent hot air from escaping in all directions; the concentrator cover is used to concentrate the airflow towards the heating assembly; the two ends of the return pipe are respectively connected to the partition cover and the concentrator cover.

[0013] Preferably, the vacuum adsorption device includes a second cover plate and a vacuum hood; the second cover plate has a plurality of third holes arranged in a matrix; the vacuum hood is disposed at the lower end of the second cover plate.

[0014] Preferably, the control system includes a mounting plate and a lifting mechanism; the mounting plate is arranged parallel to the bottom of the welding table, and the temperature control device and the vacuum adsorption device are mounted on the mounting plate; the lifting mechanism is used to drive the mounting plate to move vertically.

[0015] Preferably, the control system further includes a first translation mechanism and a second translation mechanism; the first translation mechanism is used to drive the temperature control device and the vacuum adsorption device to move along the width direction of the mounting plate; the second translation mechanism is used to drive the temperature control device and the vacuum adsorption device to move along the length direction of the mounting plate.

[0016] The advantages of this invention application compared to the prior art are: 1. This invention application includes a clamping mechanism, a support plate, a temperature control device, a vacuum adsorption device, and a control system. The clamping mechanism clamps and fixes the circuit board from all sides, ensuring accurate positioning of the circuit board in the initial stage. The control system controls the movement of the temperature control device to accurately adjust the corresponding position of the heating component and the point to be soldered, ensuring accurate preheating. The vacuum adsorption device further enhances the stability of the circuit board, preventing shaking or displacement during the soldering process. The simultaneous operation of the heating and cooling components in the temperature control device achieves precise preheating of the point to be soldered and effective cooling of the area around the point to be soldered. The precise preheating of the point to be soldered by the heating component brings it to a suitable soldering temperature, which helps to improve the strength and reliability of the soldering and reduce the generation of soldering defects. At the same time, the cooling component cools the area around the point to be soldered, effectively avoiding the impact of high temperature on surrounding components, ensuring the performance and stability of the components, thereby improving the overall soldering quality of the blood glucose monitoring PCBA battery.

[0017] 2. This invention application provides a heating port and multiple cooling ports on the first cover plate. The heating port concentrates heat to the soldering point on the circuit board to achieve precise preheating. The multiple cooling ports simultaneously deliver cooling medium to the surrounding area of ​​the soldering point from multiple directions to form a uniform cooling area, effectively avoiding thermal damage to surrounding components caused by excessively high local temperatures.

[0018] 3. This invention application includes a flow guide and a heating element. The flow guide is accurately aligned with the first hole below the point to be welded, guiding the heat generated by the heating element directly into the first hole. The heating element dynamically adjusts its heating power in real time to ensure that the point to be welded stably reaches and maintains the welding temperature, thus ensuring the stability of the welding quality. Through the cooperation between the flow guide and the first hole, the heat generated by the heating element can be directly entered into the first hole under the guidance of the flow guide and concentratedly transferred to the point to be welded, effectively preventing the heat from spreading to the surroundings. Attached Figure Description

[0019] Figure 1 This invention application discloses a three-dimensional high-precision laser welding fixture for blood glucose monitoring PCBA batteries. Figure 1 .

[0020] Figure 2 This invention application discloses a three-dimensional high-precision laser welding fixture for blood glucose monitoring PCBA batteries. Figure 2 .

[0021] Figure 3 This is a perspective view of the support plate, temperature control device, and vacuum adsorption device in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to this invention application.

[0022] Figure 4 This is a three-dimensional sectional view of the temperature control device in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries, as described in this invention application.

[0023] Figure 5 This is a perspective view of the first cover plate, heating component, and docking cover in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to this invention application.

[0024] Figure 6 This is a perspective view of the heating component in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries, as described in this invention application.

[0025] Figure 7 This is a perspective view of the first cover plate and cooling component in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to this invention application.

[0026] Figure 8 This is a perspective view of a waste heat recovery component in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries, as described in this invention application.

[0027] Figure 9 This is a perspective view of the second cover plate and vacuum hood in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to this invention application.

[0028] Figure 10This is a perspective view of the temperature control device, vacuum adsorption device, and control system in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to this invention application.

[0029] Figure 11 This is a perspective view of the temperature control device, vacuum adsorption device, mounting plate, first translation mechanism, and second translation mechanism in a high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to this invention application.

[0030] The diagram is labeled as follows: 1. Welding table; 2. Clamping mechanism; 3. Support plate; 31. First hole; 4. Temperature control device; 41. First cover plate; 411. Heating port; 412. Cooling port; 42. Heating assembly; 421. Flow guide; 422. Heating element; 423. Base; 4231. Second hole; 43. Cooling assembly; 431. Dust cover; 432. Cooling fan; 433. Docking cover; 44. Waste heat recovery assembly; 441. Partition cover; 442. Flow concentrator; 443. 5. Return pipe; 6. Vacuum adsorption device; 7. Second cover plate; 8. Third hole; 9. Vacuum hood; 10. Control system; 11. Mounting plate; 12. Lifting mechanism; 13. First translation mechanism; 14. First translation driver; 15. First sliding assembly; 16. First guide rod; 17. First mounting block; 18. Second translation mechanism; 19. Second translation driver; 10. Second sliding assembly; 11. Second guide rod; 12. Second mounting block. Detailed Implementation

[0031] To further understand the features, technical means, and specific objectives and functions achieved by this invention application, the invention application will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0032] Reference Figures 1 to 11The image shows a high-precision laser welding fixture for blood glucose monitoring PCBA batteries. It includes a welding table 1 with a placement groove in the center and a clamping mechanism 2 mounted on the welding table 1 for holding the blood glucose monitoring PCBA batteries. It also includes a support plate 3, a temperature control device 4, a vacuum adsorption device 5, and a control system 6. The support plate 3 is horizontally positioned within the placement groove and has multiple first holes 31 arranged in a matrix. The temperature control device 4 includes a first cover plate 41, a heating component 42, and a cooling component 43. The first cover plate 41 is horizontally positioned below the support plate 3 and covers the welding points of the blood glucose monitoring PCBA batteries. The heating component 42 preheats the blood glucose monitoring PCBA batteries through the first holes 31 corresponding to the welding points. The cooling component 43 reduces the temperature around the welding points. The vacuum adsorption device 5 applies adsorption force to the blood glucose monitoring PCBA batteries through the remaining first holes 31 on the support plate 3. The control system 6 controls the adjustment of the positions of the temperature control device 4 and the vacuum adsorption device 5.

[0033] The blood glucose monitoring PCBA circuit board is placed horizontally on the support plate 3 in the central slot of the soldering station 1. The clamping mechanism 2 then clamps and secures the circuit board from all sides, ensuring precise positioning during subsequent operations. The control system 6 adjusts the position of the temperature control device 4 to accurately align the heating component 42 with the soldering points on the circuit board. The heating component 42 and cooling component 43 are activated simultaneously. The heating component 42 preheats the soldering points through the first holes 31 on the support plate 3 corresponding to the soldering points, gradually raising the temperature to the required soldering temperature. Simultaneously, the cooling component 43 cools the area surrounding the soldering points to prevent high temperatures from affecting surrounding components and ensuring they are not damaged during soldering. At the same time, the vacuum adsorption device 5 applies adsorption force to the entire circuit board through the remaining first holes 31 on the support plate 3, firmly adsorbing the circuit board onto the support plate 3, further enhancing the stability of the circuit board and preventing shaking or displacement during soldering. After the soldering of the points to be soldered is completed, the vacuum adsorption device 5 removes its adsorption force on the circuit board. Next, the control system 6 readjusts the positions of the temperature control device 4 and the vacuum adsorption device 5 to ensure that the heating component 42 accurately aligns with the next point to be soldered. The above soldering preparation process, including preheating, cooling, and vacuum adsorption, is then repeated to ensure that each soldering point is adequately preheated, guaranteeing the consistency and stability of the soldering quality. This cycle is repeated until all soldering points are completed. Precise preheating of the soldering points by the heating component 42 ensures that they reach the appropriate soldering temperature, improving the strength and reliability of the solder joints and reducing soldering defects. Simultaneously, the cooling component 43 cools the area surrounding the soldering points, effectively preventing the high temperature from affecting surrounding components, ensuring their performance and stability, and thus improving the overall soldering quality of the blood glucose monitoring PCBA circuit board.

[0034] Reference Figure 4 and Figure 5 As shown: A heating port 411 is provided in the middle of the first cover plate 41, and the heating component 42 is installed in the heating port 411. A plurality of cooling ports 412 are provided around the heating port 411 on the first cover plate 41, and the cooling ports 412 are connected to the cooling component 43.

[0035] Once the first cover plate 41 is positioned correctly, the heating assembly 42 and the cooling assembly 43 start simultaneously. The heating assembly 42, through the heating port 411 located in the center of the first cover plate 41, concentrates heat to the solder joints on the circuit board, preheating them and gradually raising their temperature to a suitable soldering temperature. Simultaneously, the cooling assembly 43, through multiple cooling ports 412 surrounding the heating port 411, delivers a cooling medium (such as cold air or coolant) to the area around the solder joint, quickly removing heat and lowering the temperature of that area. Throughout the preheating process, the heating assembly 42 dynamically adjusts its heating power to ensure the solder joints can stably reach and maintain the desired soldering temperature. The cooling assembly 43 ensures the area around the solder joints remains at a low temperature, preventing damage to surrounding components from high temperatures. At the same time, the vacuum adsorption device 5 applies adsorption force to the entire circuit board through the remaining first holes 31 on the support plate 3, firmly adhering the circuit board to the support plate 3 and preventing deformation or displacement of the circuit board due to stress caused by temperature changes during heating and cooling. With the reasonable arrangement of heating port 411 and cooling port 412 on the first cover plate 41, the heating component 42 can accurately preheat the welding point, while the cooling component 43 can cool the surrounding area of ​​the welding point from multiple directions at the same time, forming a uniform cooling area, effectively avoiding thermal damage to surrounding components caused by excessive local temperature.

[0036] Reference Figure 4 and Figure 6 As shown: The heating assembly 42 includes a flow guide 421 and a heating element 422; the flow guide 421 is installed inside the heating port 411, and the upper diameter of the flow guide 421 is smaller than the inner diameter of the first hole 31; the heating element 422 is disposed inside the flow guide 421.

[0037] When the control system 6 aligns the heating component 42 with the soldering point on the circuit board, it ensures that the flow guide 421 is accurately aligned with the first hole 31 below the soldering point. Since the upper diameter of the flow guide 421 is smaller than the inner diameter of the first hole 31, after the position is adjusted, the upper end of the flow guide 421 can extend into the first hole 31. Once the upper end of the flow guide 421 extends into the first hole 31, the heating element 422 begins to operate, generating heat. Guided by the flow guide 421, the heat generated by the heating element 422 directly enters the first hole 31 and is concentrated on the soldering point on the circuit board for preheating. During preheating, the heating element 422 dynamically adjusts its heating power in real time to ensure that the soldering point can stably reach and maintain a suitable soldering temperature. Simultaneously, the presence of the flow guide 421 effectively prevents heat from diffusing outwards, concentrating most of the heat in the soldering area and improving heat utilization efficiency. With the cooperation of the flow guide 421 and the first hole 31, the heat generated by the heating element 422 can be directly introduced into the first hole 31 under the guidance of the flow guide 421 and concentratedly transferred to the welding point, effectively preventing the heat from spreading to the surroundings.

[0038] Reference Figure 4 and Figure 7 As shown: The cooling assembly 43 includes a dust cover 431, a cooling fan 432, and multiple docking covers 433; the dust cover 431 is installed over the lower end of the first cover plate 41; the cooling fan 432 is disposed inside the dust cover 431; the multiple docking covers 433 are respectively installed in multiple cooling ports 412, and the upper diameter of the docking cover 433 is smaller than the inner diameter of the first hole 31.

[0039] The first cover plate 41 in the temperature control device 4 gradually moves towards the bottom of the circuit board, and during this process, the cooling component 43 also moves accordingly. When the guide shroud 421 is accurately aligned with the first hole 31 below the point to be soldered, multiple mating covers 433 are respectively aligned with the first holes 31 around the point to be soldered. Since the upper diameter of the mating cover 433 is smaller than the inner diameter of the first hole 31, after the position is adjusted, the upper end of the mating cover 433 can extend into the corresponding first hole 31. When the positions of the guide shroud 421 and the mating covers 433 are both adjusted, the heating component 42 and the cooling component 43 start simultaneously. The heat generated by the heating element 422 enters directly into the first hole 31 below the point to be soldered under the guidance of the guide shroud 421 to preheat the point to be soldered. At the same time, the cooling fan 432 starts working, drawing low-temperature external air into the dust cover 431. The drawn-in low-temperature air, driven by the cooling fan 432, is blown towards multiple mating covers 433 and then into the first holes 31 surrounding the solder joints. Upon entering the first holes 31, the low-temperature air exchanges heat with the circuit board, carrying away heat from the area around the solder joints and lowering the temperature of that area. Because there are gaps between the mating covers 433 and the interior of the first holes 31, hot air flows out through these gaps, forming an air circulation channel and preventing the air pressure inside the first holes 31 from rising. Throughout the cooling process, the cooling fan 432 automatically adjusts its speed according to the temperature changes in the area around the solder joints to control the flow of low-temperature air, ensuring that the area around the solder joints remains at a low temperature. By leaving gaps between the mating covers 433 and the interior of the first holes 31, the low-temperature air can smoothly flow out through the gaps after heat exchange with the circuit board, forming a stable air circulation channel and effectively preventing the air pressure inside the first holes 31 from rising during the cooling process.

[0040] Reference Figure 4 and Figure 6 As shown: The heating component 42 also includes a base 423, which is disposed at the inlet end of the flow guide shroud 421, and the base 423 has a plurality of second holes 4231.

[0041] Once the position of the flow guide 421 is adjusted, the heating assembly 42 and the cooling assembly 43 are activated simultaneously. The heating element 422 begins to work, generating heat to preheat the area to be welded. At the same time, the cooling fan 432 starts rotating, drawing in low-temperature external air into the dust cover 431. Part of the drawn-in low-temperature air is blown through the mating cover 433 into the first hole 31 around the area to be welded, cooling the surrounding area; the other part enters the flow guide 421 through the second hole 4231 on the base 423. The low-temperature air entering the flow guide 421 mixes with the heat generated by the heating element 422, gradually increasing in temperature under the heating effect of the heating element 422, and then directly enters the first hole 31 below the area to be welded, preheating the area. During this process, the low-temperature air entering the flow guide 421 effectively reduces the temperature of the air inside the flow guide 421, preventing excessively high temperatures that could damage the heating element 422 and the flow guide 421 itself. At the same time, the entry of low-temperature air also helps to regulate the airflow inside the guide shroud 421, so that heat can be transferred more evenly to the welding point and improve the preheating efficiency.

[0042] Reference Figure 4 and Figure 8 As shown: The temperature control device 4 also includes a waste heat recovery component 44, which is used to recover the air heated by the heating component 42.

[0043] During the operation of the heating element 422, the high-temperature air inside the guide shroud 421 flows towards the circuit board, exchanges heat with the circuit board, and transfers heat to the solder joints, gradually raising their temperature to a suitable soldering temperature. After heat exchange, the temperature of the high-temperature air decreases, but it still retains some heat. This heat-exchanged air flows out from between the guide shroud 421 and the inner wall of the first hole 31, entering the waste heat recovery assembly 44. The waste heat recovery assembly 44 returns the heat-exchanged air to the guide shroud 421. The returned air mixes again with the heat generated by the heating element 422 and continues to participate in the preheating process of the solder joints. By recovering the heat-exchanged high-temperature air inside the guide shroud 421 and returning it to the guide shroud 421 to participate in the preheating process of the solder joints again, the amount of heat required by the heating element 422 can be reduced, thereby reducing the energy consumption of the heating element 422.

[0044] Reference Figure 8 As shown: The waste heat recovery component 44 includes a partition cover 441, a flow-concentrating cover 442, and a return pipe 443; the partition cover 441 is used to prevent hot air from escaping in all directions; the flow-concentrating cover 442 is used to concentrate the air flow towards the heating component 42; the two ends of the return pipe 443 are respectively connected to the partition cover 441 and the flow-concentrating cover 442.

[0045] During the operation of the heating element 422, the high-temperature air inside the flow guide shroud 421 flows towards the circuit board, exchanges heat with the circuit board, and transfers heat to the solder joints, gradually raising their temperature to a suitable soldering temperature. This heat-exchanged air flows out from between the flow guide shroud 421 and the inner wall of the first hole 31, entering the partition shroud 441. The partition shroud 441 prevents the hot air from flowing towards the surrounding cooling areas, avoiding heat loss to the surrounding environment and improving the efficiency of waste heat recovery. While the air blown in by the cooling fan 432 enters the flow convergence shroud 442, the air pressure inside the flow convergence shroud 442 is relatively low, while the air pressure inside the partition shroud 441 is relatively high due to the accumulation of hot air, thus creating a pressure difference across the return pipe 443. Under the influence of this pressure difference, the airflow inside the partition shroud 441 flows through the return pipe 443 back to the flow convergence shroud 442, and then re-enters the flow guide shroud 421, mixing with the heat generated by the heating element 422 to continue participating in the preheating process of the solder joints. Through the cooperation of the partition cover 441, the flow-concentrating cover 442 and the return pipe 443 in the waste heat recovery component 44, the air after heat exchange can be effectively introduced into the flow guide cover 421.

[0046] Reference Figure 3 and Figure 9 As shown: The vacuum adsorption device 5 includes a second cover plate 51 and a vacuum hood 52; the second cover plate 51 has a plurality of third holes 511, which are arranged in a matrix; the vacuum hood 52 is disposed at the lower end of the second cover plate 51.

[0047] The first cover plate 41 in the temperature control device 4 gradually moves towards the bottom of the circuit board, preparing to preheat and cool the solder joints of the circuit board. Simultaneously, the second cover plate 51 of the vacuum adsorption device 5 also moves synchronously. While the first cover plate 41 covers part of the first holes 31 for preheating and cooling, the second cover plate 51 covers the remaining first holes 31 on the support plate 3. Since the second cover plate 51 has multiple third holes 511 arranged in a matrix, after the position is adjusted, the third holes 511 can accurately align with the first holes 31, forming a continuous and closed airflow channel. Air is expelled from the vacuum chamber 52 by a vacuum pump or other equipment connected to the vacuum chamber 52. As air is expelled from the vacuum chamber 52, the air pressure inside the vacuum chamber 52 gradually decreases. This pressure change is transmitted to the third holes 511 and the first holes 31, creating a low-pressure environment within them. Under the influence of this low-pressure environment, the circuit board is subjected to external atmospheric pressure and is firmly adsorbed onto the support plate 3. By setting multiple third holes 511 arranged in a matrix on the second cover plate 51 and connecting them with the first holes 31 on the support plate 3, a multi-point adsorption structure is formed. This multi-point adsorption method can apply adsorption force to the circuit board from multiple positions, so that the circuit board is more evenly subjected to the external atmospheric pressure, effectively preventing the circuit board from deforming or displacing due to the stress caused by temperature changes during heating and cooling.

[0048] Reference Figure 2 and Figure 10 As shown: The control system 6 includes a mounting plate 61 and a lifting mechanism 62; the mounting plate 61 is arranged parallel to the bottom of the welding table 1, and the temperature control device 4 and the vacuum adsorption device 5 are mounted on the mounting plate 61; the lifting mechanism 62 is used to drive the mounting plate 61 to move in the vertical direction.

[0049] Specifically, the lifting mechanism 62 has multiple lifting drivers, which synchronously drive the mounting plate 61 to lift.

[0050] Once the control system 6 aligns the heating component 42 with the welding point, it activates the lifting mechanism 62. Multiple lifting actuators operate synchronously, driving the mounting plate 61 to move vertically upwards. As the mounting plate 61 rises, the temperature control device 4 and vacuum adsorption device 5 mounted on it also move upwards. This ensures that the flow guide shroud 421, the docking shroud 433, and the third hole 511 can accurately extend into or abut against the first hole 31 on the support plate 3. During this process, the synchronous driving of multiple lifting actuators ensures the smooth rise of the mounting plate 61, preventing the flow guide shroud 421, the docking shroud 433, and the third hole 511 from failing to accurately align with the first hole 31 due to the tilt of the mounting plate 61.

[0051] Reference Figure 10 and Figure 11 As shown: The control system 6 further includes a first translation mechanism 63 and a second translation mechanism 64; the first translation mechanism 63 is used to drive the temperature control device 4 and the vacuum adsorption device 5 to move along the width direction of the mounting plate 61; the second translation mechanism 64 is used to drive the temperature control device 4 and the vacuum adsorption device 5 to move along the length direction of the mounting plate 61.

[0052] Specifically, the first translation mechanism 63 includes a first translation driver 631 and a first sliding component 632. The first sliding component 632 includes a first guide rod 6321 and a first mounting block 6322. The first guide rod 6321 is arranged parallel to the length direction of the mounting plate 61. The first mounting block 6322 is slidably disposed on the first guide rod 6321. The first translation driver 631 is mounted on the first mounting block 6322, and the output end of the first translation driver 631 is connected to the vacuum chamber 52. The second translation mechanism 64 includes a second translation driver 641 and a second sliding component 642. The second sliding component 642 includes a second guide rod 6421 and a second mounting block 6422. The second guide rod 6421 is arranged parallel to the width direction of the mounting plate 61. The second mounting block 6422 is slidably disposed on the second guide rod 6421. The second translation driver 641 is mounted on the second mounting block 6422, and the output end of the second translation driver 641 is connected to the vacuum chamber 52.

[0053] The control system 6 first determines the target position to which the temperature control device 4 needs to be moved based on the position information of the soldering points on the circuit board. Then, the control system 6 activates the first translation mechanism 63 and the second translation mechanism 64. For the first translation mechanism 63, the first translation driver 631 starts working, driving the second mounting block 6422 to slide along the width direction of the mounting plate 61 on the second guide rod 6421, while the vacuum chamber 52 and the temperature control device 4 move along the width direction of the mounting plate 61. The second translation mechanism 64 also starts working, with the second translation driver 641 driving the first mounting block 6322 to slide along the length direction of the mounting plate 61 on the first guide rod 6321, while the vacuum chamber 52 and the temperature control device 4 move along the length direction of the mounting plate 61. Through the coordinated work of the first translation mechanism 63 and the second translation mechanism 64, the temperature control device 4 can move flexibly in a two-dimensional plane on the mounting plate 61, enabling the temperature control device 4 to correspond to any first hole 31 on the support plate 3, thus achieving precise positioning of the temperature control device 4.

[0054] The above embodiments only illustrate one or more implementation methods of this invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this invention, and these all fall within the protection scope of this invention. Therefore, the protection scope of this invention should be determined by the appended claims.

Claims

1. A high-precision laser welding fixture for blood glucose monitoring PCBA batteries, comprising a welding table (1) with a placement groove in the middle and a clamping mechanism (2) disposed on the welding table (1) for clamping blood glucose monitoring PCBA batteries, characterized in that, It also includes a support plate (3), a temperature control device (4), a vacuum adsorption device (5), and a control system (6); The support plate (3) is horizontally arranged in the placement groove, and the support plate (3) has a plurality of first holes (31) arranged in a matrix. The temperature control device (4) includes a first cover plate (41), a heating component (42), and a cooling component (43). The first cover plate (41) is horizontally arranged below the support plate (3). The first cover plate (41) is used to cover the solder joints of the blood glucose monitoring PCBA battery. The heating component (42) is used to preheat the blood glucose monitoring PCBA battery through the first hole (31) corresponding to the solder joint. The cooling component (43) is used to reduce the temperature around the solder joint. The vacuum adsorption device (5) is used to apply adsorption force to the blood glucose monitoring PCBA battery through the remaining first holes (31) on the support plate (3); The control system (6) is used to control the temperature control device (4) and the vacuum adsorption device (5) to adjust their positions.

2. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 1, characterized in that, A heating port (411) is provided in the middle of the first cover plate (41), and the heating component (42) is installed in the heating port (411). A plurality of cooling ports (412) are provided around the heating port (411) on the first cover plate (41), and the cooling ports (412) are connected to the cooling component (43).

3. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 1, characterized in that, The heating assembly (42) includes a flow guide (421) and a heating element (422). The flow guide (421) is installed inside the heating port (411), and the upper diameter of the flow guide (421) is smaller than the inner diameter of the first hole (31); The heating element (422) is disposed inside the flow guide (421).

4. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 1, characterized in that, The cooling assembly (43) includes a dust cover (431), a cooling fan (432), and multiple docking covers (433). The dust cover (431) is installed on the lower end of the first cover plate (41); The cooling fan (432) is housed inside the dust cover (431); Multiple docking covers (433) are respectively installed in multiple cooling ports (412), and the upper diameter of the docking cover (433) is smaller than the inner diameter of the first hole (31).

5. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 3, characterized in that, The heating assembly (42) also includes a base (423), which is located at the inlet end of the flow guide (421) and has a plurality of second holes (4231) on it.

6. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 1, characterized in that, The temperature control device (4) also includes a waste heat recovery component (44), which is used to recover the air heated by the heating component (42).

7. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 6, characterized in that, The waste heat recovery assembly (44) includes a partition cover (441), a flow-concentrating cover (442), and a return pipe (443). The partition cover (441) is used to prevent hot air from escaping in all directions; The concentrator (442) is used to concentrate the airflow toward the heating component (42). The two ends of the return pipe (443) are connected to the partition cover (441) and the flow-concentrating cover (442), respectively.

8. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 1, characterized in that, The vacuum adsorption device (5) includes a second cover plate (51) and a vacuum hood (52); The second cover plate (51) has multiple third holes (511) arranged in a matrix; The vacuum hood (52) is located at the lower end of the second cover plate (51).

9. The high-precision laser welding fixture for blood glucose monitoring PCBA batteries according to claim 1, characterized in that, The control system (6) includes a mounting plate (61) and a lifting mechanism (62). The mounting plate (61) is arranged parallel to the bottom of the welding table (1), and the temperature control device (4) and the vacuum adsorption device (5) are mounted on the mounting plate (61). The lifting mechanism (62) is used to drive the mounting plate (61) to move in the vertical direction.

10. A high-precision laser welding fixture for a blood glucose monitoring PCBA battery according to claim 9, characterized in that, The control system (6) further includes a first translation mechanism (63) and a second translation mechanism (64); The first translation mechanism (63) is used to drive the temperature control device (4) and the vacuum adsorption device (5) to move along the width direction of the mounting plate (61); The second translation mechanism (64) is used to drive the temperature control device (4) and the vacuum adsorption device (5) to move along the length direction of the mounting plate (61).

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