Circuit board laser processing system and circuit board processing method thereof

Abstract

The invention provides a circuit board laser processing system and a circuit board processing method, and the system comprises a detection part which is provided on laser processing equipment or in a transmission path of the laser processing system and is configured to detect a circuit board to be processed so as to obtain the existing feature information of the circuit board to be processed; the main control part is in communication coupling with the detection part and is configured to receive the existing feature information, generate laser processing information based on the existing feature information and output a control instruction based on the laser processing information; and the laser processing equipment is in communication coupling with the main control part and is configured to respond to the control instruction and perform laser processing on the circuit board to be processed according to the laser processing information. The system realizes full-automatic generation of laser processing information, does not need more manual preset operations in advance, reduces the time cost, and improves the automation degree and the processing efficiency of circuit board processing.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a circuit board laser processing system and a circuit board processing method thereof. Background Technology

[0002] Currently, common PCB manufacturing systems typically require manual parameter pre-setting to define various processing conditions before processing the PCB, in order to achieve normal production and the expected processing goals. However, manually setting parameters is time-consuming and requires a large amount of test data and time to determine the pre-set parameters. This cumbersome and time-consuming operation severely impacts the processing efficiency of the PCB manufacturing control system. Summary of the Invention

[0003] In view of this, the present application provides a circuit board laser processing system and a circuit board processing method thereof, which can realize the fully automatic generation of laser processing information, without the need for a lot of manual preset operations in advance, and without the need for a lot of test data and test time to complete the preset data collection, thereby reducing time costs and improving the automation level and processing efficiency of circuit board processing.

[0004] A first aspect of this application provides a circuit board laser processing system, comprising: a detection unit provided on a laser processing device or in the transmission path of the laser processing system, configured to detect the circuit board to be processed to obtain existing feature information of the circuit board; a main control unit communicatively coupled to the detection unit, configured to receive the existing feature information, generate laser processing information based on the existing feature information, and output control commands based on the laser processing information; and a laser processing device communicatively coupled to the main control unit, configured to perform laser processing on the circuit board to be processed according to the laser processing information in response to the control commands.

[0005] In one possible implementation, the existing feature information includes at least composition information and thickness information, and the detection unit includes: a composition detection unit configured to detect the composition of the circuit board to be processed to obtain the composition information; and a thickness detection unit configured to detect the thickness of the circuit board to be processed to obtain the thickness information.

[0006] In one possible implementation, the component detection unit is configured to detect the component of a predetermined area of ​​the circuit board to be processed to obtain regional component information; the thickness detection unit is configured to detect the thickness of the predetermined area of ​​the circuit board to be processed to obtain regional thickness information.

[0007] In one possible implementation, the thickness detection unit is one of a non-contact profilometer, an optical interferometer, a laser rangefinder, a contact thickness gauge, or an ultrasonic thickness gauge; and / or, the composition detection unit is one of an energy dispersive spectrometer, a wavelength dispersive spectrometer, an electron energy loss spectrometer, an X-ray fluorescence spectrometer, or a combination of an optical microscope and an image recognition unit.

[0008] In one possible implementation, the main control unit includes: an analysis unit configured to perform the step of generating laser processing information; and a control unit configured to perform the step of outputting control commands.

[0009] In one possible implementation, the analysis unit is configured to generate laser processing information based on a combined analysis of the thickness information and the composition information, the laser processing information including at least one set of laser parameters.

[0010] In one possible implementation, the at least one set of laser parameters includes one or more parameters from the following group: laser power, number of laser shots, laser pulse energy, laser pulse frequency, laser wavelength, laser spot size, laser speed, and number of processing operations.

[0011] In one possible implementation, the analysis unit is further configured to generate the laser processing information by accessing a pre-stored database, the database storing the correlation between the thickness information, the composition information and their corresponding laser parameter sets.

[0012] In one possible implementation, the analysis unit is further configured to generate the laser processing information by accessing a pre-stored database, the database storing processing program information, target feature information, and also storing the thickness information, the composition information and the corresponding processing program information, the relationship between the target feature information and the corresponding laser parameter set.

[0013] In one possible implementation, the analysis module is further configured to use machine learning algorithms to dynamically update the relationships within the database based on historical processing results.

[0014] In one possible implementation, the laser processing equipment includes a laser, an optical path system, and a processing table; the laser is configured to emit a laser beam; the optical path system is configured to adjust the laser beam to a preset state through optical elements and emit the adjusted laser beam onto the circuit board to be processed; the processing platform is configured to support the circuit board to be processed.

[0015] In one possible implementation, the laser processing system further includes: a conveying device configured to transport the circuit board to be processed to a target location; and an identification device provided in the transport path of the conveying device to identify the circuit board to be processed during transport.

[0016] A second aspect of this application provides a circuit board processing method applied to a circuit board laser processing system, characterized by comprising: detecting the circuit board to be processed to obtain existing feature information of the circuit board to be processed; receiving the existing feature information; generating laser processing information based on the existing feature information; outputting control commands based on the laser processing information; and, in response to the control commands, performing laser processing on the circuit board to be processed according to the laser processing information; wherein the existing feature information includes at least composition information and thickness information.

[0017] A third aspect of this application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the electronic device. When the processor executes the computer program, it implements the functions of various components of the circuit board laser processing system provided in the first aspect or the steps of the circuit board processing method provided in the second aspect.

[0018] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the functions of various components of the circuit board laser processing system as provided in the first aspect or the steps of the circuit board processing method as provided in the second aspect.

[0019] A fourth aspect of this application provides a computer program product that, when run on an electronic device, causes the electronic device to perform the functions of the components of the circuit board laser processing system as provided in the first aspect or the steps of the circuit board processing method as provided in the second aspect.

[0020] The circuit board laser processing system and method provided in this application have the following beneficial effects: The detection department inspects the circuit board to be processed on the laser processing equipment or in the transmission path of the laser processing system to obtain the existing feature information of the circuit board to be processed. The main control unit communicates with the detection department to receive the existing feature information, generate laser processing information based on the existing feature information, and output control commands based on the laser processing information. The laser processing equipment communicates with the main control unit to respond to the control commands and perform laser processing on the circuit board to be processed according to the laser processing information. This realizes the fully automatic generation of laser processing information, without the need for a lot of manual preset operations in advance, and without the need for a lot of test data and test time to complete the preset data collection, reducing time costs and improving the automation level and processing efficiency of circuit board processing. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a basic structural block diagram of a circuit board laser processing system provided in an embodiment of this application.

[0023] Figure 2 This is a structural block diagram of another circuit board laser processing system provided in an embodiment of this application.

[0024] Figure 3 This is a schematic flowchart of a laser processing method for circuit boards provided in an embodiment of this application.

[0025] Figure 4 This is a basic structural block diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0026] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of this application with unnecessary detail.

[0027] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0028] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0029] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0030] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" means "two or more."

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0033] Existing PCB processing systems require manual parameter setting, necessitating extensive testing data and time to determine these parameters. This results in cumbersome and time-consuming operations, significantly impacting processing efficiency. Therefore, this application aims to provide a fully automated PCB laser processing system that generates laser processing information, reducing time costs and improving system automation and processing efficiency. It should be noted that the PCB laser processing system provided in this application is primarily applied to the laser processing of PCBs. This laser processing includes, but is not limited to, drilling and grooving.

[0034] In some embodiments of this application, please refer to Figure 1 , Figure 1 This is a basic structural block diagram of a circuit board laser processing system provided in an embodiment of this application. Figure 1 As shown, the circuit board laser processing system specifically includes a detection unit 10, a main control unit 20, and a laser processing device 30.

[0035] The detection unit 10 is provided in the transmission path of the laser processing equipment or laser processing system and is configured to detect the circuit board to be processed to obtain the existing feature information of the circuit board to be processed.

[0036] It is understood that the detection unit can be installed outside the laser processing equipment, integrated into the laser processing equipment, or installed at any suitable position on the transmission path of the processing system to detect the circuit board to be processed during the transfer. The circuit board to be processed during the transfer can be in a continuous movement state, for example, the detection unit is fixedly installed to detect the circuit board to be processed passing by, or the detection unit and the circuit board to be processed during the transfer move synchronously to perform detection; it can also be in a paused state, for example, the transmission path includes at least one buffer, the circuit board to be processed can stay in the buffer to wait for the completion of the previous circuit board processing program, and the detection unit can also be installed in the buffer to detect the circuit board to be processed staying in the buffer.

[0037] The existing feature information includes, but is not limited to, composition information, thickness information, warpage information, stacking hierarchy information, and existing structural information. This existing feature information can be used to provide a basis for the subsequent automated generation of laser processing information, which is used to perform laser processing on the circuit board to be processed. In some embodiments, please refer to... Figure 2 , Figure 2 This is a structural block diagram of another circuit board laser processing system provided in an embodiment of this application. Figure 2As shown, the detection unit 10 may include a composition detection unit 11 and a thickness detection unit 12. The composition detection unit 11 is configured to detect the composition of the circuit board to be processed to obtain compositional information, such as the elements, elemental percentages, elemental distribution, compound / crystal phase composition, chemical valence state, molecular structure, and functional groups of the material. The thickness detection unit 12 is configured to detect the thickness of the circuit board to be processed to obtain thickness information. The composition detection unit 11 can be installed on the laser processing equipment or in the transmission path of the laser processing system; the thickness detection unit 12 can be installed on the processing equipment or in the transmission path of the laser processing system. When performing detection, the composition detection unit 11 and the thickness detection unit 12 can perform area scanning detection of the circuit board to be processed, linear scanning detection, or single-point detection based on the processing position of the circuit board. The specific scanning method depends on the actual detection purpose, the circuit board condition, and the capabilities of the detection equipment, and is not limited here.

[0038] In some embodiments, the component detection unit 11 is an instrument capable of energy dispersive spectroscopy (EDS), an elemental analysis technique based on scanning electron microscopy (SEM) or transmission electron microscopy (TEM). EDS uses an electron beam to excite a sample to generate characteristic X-rays, and identifies the types of elements and determines their content based on the X-ray energy. Exemplarily, the component detection unit 11 is one of an energy dispersive spectrometer, a wavelength dispersive spectrometer, an electron energy loss spectrometer, an X-ray fluorescence spectrometer, or a combination of an optical microscope and an image recognition unit. The thickness detection unit 12 is an instrument capable of thickness measurement. Specifically, the thickness detection unit can be one of a non-contact profilometer, an optical interferometer, a laser rangefinder, a contact thickness gauge, or an ultrasonic thickness gauge.

[0039] In some embodiments, considering that the circuit board to be processed may have uneven surfaces, thickness fluctuations, or obvious regional distribution characteristics of the existing structure on the circuit board, the component detection unit 11 can also be configured to detect the components of a predetermined area of ​​the circuit board to be processed to obtain regional component information. The thickness detection unit 12 can also be configured to detect the thickness of a predetermined area of ​​the circuit board to be processed to obtain regional thickness information. Specifically, the circuit board to be processed can be pre-divided into multiple predetermined areas. Then, the component detection unit 11 and the thickness detection unit 12 can perform component detection and thickness detection according to the predetermined areas to obtain more accurate thickness information and avoid the thickness fluctuation of the circuit board to be processed from affecting the accuracy of the laser processing information generated by the main control unit 20. It is understood that the size and shape of the multiple predetermined areas can be adaptively selected according to processing requirements, circuit board characteristics, processing equipment capabilities, detection unit capabilities, etc. The size and shape of the multiple predetermined areas can be consistent or different.

[0040] For example, in one specific implementation, the circuit board to be processed can be divided into regions according to a preset region division rule. This preset rule can be based on a fixed shape, dividing the circuit board into multiple regions of the same size as that fixed shape, thus dividing the circuit board into multiple predetermined regions. Taking laser processing as an example, the size of the laser galvanometer's action area can be used as a shape standard to divide the circuit board into multiple predetermined regions of the same size as the laser galvanometer's action area. The component detection unit 11 and the thickness detection unit 12 perform detection according to the predetermined regions, obtaining multiple combinations of component and thickness information; that is, one predetermined region corresponds to one combination of component and thickness information.

[0041] For example, in another specific embodiment, when dividing the circuit board to be processed into regions, the circuit board can be divided into three predetermined regions—a central region, a transition region, and an edge region—based on the influence of the laser processing on material deformation. The central region is the melting zone, where laser energy is most concentrated, causing the material to melt or even vaporize instantaneously, forming a molten pool. The transition region is the heat-affected zone, where a significant temperature gradient occurs, and the material undergoes rapid heating and cooling. The edge region is the substrate region, which is not directly affected by the laser but may experience slight thermal deformation due to heat conduction. The composition detection unit 11 and the thickness detection unit 12 perform detection according to the predetermined regions, obtaining three combinations of composition and thickness information: one combination for the central region, one for the transition region, and one for the edge region.

[0042] The main control unit 20 and the detection unit 10 are communicatively coupled and configured as follows: a) Receive the existing feature information; b) Generate laser processing information based on the existing feature information; and c) Output control commands based on the laser processing information.

[0043] The main control unit 20, through communication coupling with the detection unit 10, can receive existing feature information of the circuit board to be processed detected by the detection unit 10. The main control unit 20 can analyze this existing feature information to generate corresponding laser processing information. Furthermore, the main control unit 20 can also output control commands based on the generated laser processing information, which are used to control the laser processing equipment 30 to perform laser processing operations. For example, the main control unit 30 can be host computer software with motion control and parameter adjustment functions. The host computer software can control the laser processing equipment 30 to perform laser processing on the circuit board to be processed according to the adapted laser processing information by issuing control commands.

[0044] It is understandable that communication coupling refers to the ability of two components to establish a communication link directly or indirectly for data exchange, including but not limited to communication connections achieved through wired connections (such as USB, Ethernet cable), wireless connections (such as Wi-Fi, Bluetooth, ZigBee), or network connections (such as TCP / IP).

[0045] In some embodiments, such as Figure 2 As shown, the main control unit 20 may include an analysis unit 21 and a control unit 22. The analysis unit 21 is configured to execute the step of generating laser processing information. The control unit 22 is configured to execute the step of outputting control commands. Specifically, the analysis unit 21 receives the composition and thickness information of the circuit board to be processed, detected by the detection unit 10, through communicative coupling with the detection unit 10. The analysis unit 21 is configured to generate laser processing information based on the combined analysis of the thickness and composition information, and the laser processing information includes at least one set of laser parameters. It is understood that if the composition detection unit 11 and the thickness detection unit 12 in the detection unit 10 perform detection according to a predetermined area, multiple combinations of thickness and composition information can be obtained. The analysis unit 21 can generate a laser parameter set based on the analysis of each combination of thickness and composition information; that is, multiple combinations of thickness and composition information can correspondingly generate multiple laser parameter sets. Further, the laser parameter set includes, but is not limited to, one or more parameters from the following group: laser power, number of laser pulses, laser pulse energy, laser pulse frequency, laser wavelength, laser spot size, laser speed, and number of processing operations.

[0046] In some embodiments, the analysis unit 21 may be configured to generate laser processing information by accessing a pre-stored database.

[0047] For example, in one specific implementation, a correlation between thickness information, composition information, and their corresponding laser parameter sets can be established based on historical and empirical data, and this correlation can be pre-stored in a database. Therefore, when the analysis unit 21 receives the composition information and thickness information of the circuit board to be processed detected by the detection unit 10, it can query the pre-stored correlation in the database based on the combination of the composition information and thickness information to obtain a matching correlation. Then, based on this matching correlation, it obtains the corresponding laser parameter set and generates laser processing information from the laser parameter set. In another specific implementation, the analysis unit 21 can determine the matching correlation by performing a similarity calculation between the received combination of composition information and thickness information and the combination of composition information and thickness information in the pre-stored correlation.

[0048] For example, in another specific implementation, the database may also store processing program information and target feature information. It should be noted that the processing program information includes, but is not limited to, processing trajectory, target position, etc., and the target feature information includes, but is not limited to, target hole size / shape / depth, target groove size / shape / depth, hole wall / groove wall roughness, etc. Furthermore, based on historical and empirical data, a correlation can be established between thickness information, composition information, and their corresponding processing program information, target feature information, and the corresponding laser parameter set, and this established correlation can be pre-stored in the database. The analysis unit 21 can also access the MES system to obtain the processing program information and target feature information of the circuit board to be processed. It is understood that the MES system is a production information management system for the workshop execution layer of manufacturing enterprises. The processing program information and target feature information of the circuit board to be processed are pre-set by the user based on the processing requirements of the circuit board to be processed. This information can be stored in the MES system by retrieving stored processing program files and target feature files, or by scanning work orders. Therefore, when the analysis unit 21 receives the composition and thickness information of the circuit board to be processed detected by the detection unit 10, as well as the processing program information and target feature information of the circuit board to be processed obtained from the MES system, it can query the pre-stored association relationships in the database based on the combination of the composition and thickness information, combined with the processing program information and target feature information of the circuit board to be processed, to obtain a matching association relationship from the database. Then, based on the matching association relationship, it obtains the corresponding laser parameter set and generates laser processing information from the laser parameter set. In a specific embodiment, the analysis unit 21 can determine the matching association relationship by performing similarity matching between the obtained combination of composition and thickness information, the processing program information and target feature information of the circuit board to be processed, and the combination of composition and thickness information, the processing program information and target feature information in the association relationship.

[0049] In some embodiments, material parameters such as damage threshold and laser ablation rate can be obtained based on composition information. Then, by combining these material parameters, a correlation is established between thickness information, composition information and its corresponding processing procedure information, target feature information, and the corresponding laser parameter set. For example, taking drilling as an example, the energy density and laser energy required for laser drilling can be calculated by combining the material's damage threshold and hole size / shape / depth. Then, by combining the required energy density and laser energy with the material thickness, relevant historical and empirical data are searched to determine the most suitable laser parameters for the specific working condition. These most suitable laser parameters are packaged into a laser parameter set, and then mapped and associated with the thickness information, composition information, and corresponding processing procedure information and target feature information characterizing the working condition, thereby obtaining a set of correlation relationships. In the database, a large number of different correlation relationships can be established for different material compositions, different material thicknesses, different processing procedure information, and different target feature information, for analysis by the analysis unit 21.

[0050] In one specific implementation, the analysis unit 21 can also be configured to dynamically update the relationships within the database based on historical processing results using a machine learning algorithm. The machine learning algorithm can be pre-constructed using a convolutional neural network (CNN) model, for example, a CNN or VGG CNN model. Model training data samples are constructed based on past laser processing experience and historical data. Each model training data sample includes a combination of component and thickness information as input to the model, and / or processing procedure information and target feature information, as well as laser processing information as output. The convolutional neural network model is trained to a convergent state using the constructed model training data samples, enabling it to generate corresponding matching laser processing information based on the combination of component and thickness information and / or processing procedure information and target feature information. By inputting historical processing results into the converged convolutional neural network model for matching, new relationships are obtained. These new relationships are then used to update / iterate the relationships within the database, establishing more accurate relationships between thickness information, component information, and their corresponding laser parameter sets. This achieves dynamic optimization of laser processing information and improves processing quality.

[0051] In some embodiments, if the composition detection unit 11 and the thickness detection unit 12 perform detection according to a predetermined area, obtaining combinations of three sets of composition and thickness information corresponding to the central region, transition region, and edge region respectively, the analysis unit 21 can access a pre-stored database based on the combination of composition and thickness information corresponding to the central region, combined with the processing program information and target feature information of the circuit board to be processed, to obtain the laser processing information corresponding to the central region, i.e., the first laser parameter set; and based on the combination of composition and thickness information corresponding to the edge region, combined with the processing program information and target feature information of the circuit board to be processed, to access a pre-stored database to obtain the laser processing information corresponding to the edge region, i.e., the second laser parameter set. For the transition region, a third laser parameter set can be generated based on the first and second laser parameter sets. It should be noted that the values ​​of each laser parameter in the third laser parameter set are between the values ​​of each laser parameter in the first laser parameter set and the values ​​of each laser parameter in the second laser parameter set. In this way, different laser processing information can be used to laser process the circuit board to be processed according to the material deformation differences at different locations of the circuit board to be processed during laser processing. For example, suppose the detection unit 10 detects that the composition information of the central region, transition region, and edge region is FR4, containing foil (Br) and copper (Cu) elements, the thickness of the central region is 5µm, and the thickness of the edge region is 3µm. Based on the above information, the analysis unit 21 in the main control unit 20 performs information analysis and can automatically generate the laser power parameters corresponding to the central region as 14W and the laser number parameters as 50, the laser power parameters corresponding to the edge region as 12W and the laser number parameters as 35, and the laser power parameters corresponding to the transition region as a value between 14W and 12W and the laser number parameters as a value between 50 and 35.

[0052] In one specific implementation, considering the significant differences in material deformation at different locations in the transition region, the analysis unit 21 can also generate each laser parameter in the third laser parameter set corresponding to the transition region as dynamic parameters. This enables the use of different laser parameters at different locations in the transition region to perform laser processing on the circuit board to be processed based on the differences in material deformation at different locations in the transition region, thereby improving the automation and accuracy of circuit board laser processing.

[0053] For example, dynamic parameters can be characterized by establishing a linear functional relationship between laser parameters and positional distances, where positional distances are the distances of different locations in the transition region relative to the central region. Positional distances are used as the independent variable in this linear functional relationship, and laser parameters are used as the dependent variable. This allows the laser parameters in the third laser parameter set corresponding to the transition region to be automatically generated as dynamic parameters that change with the distance from the central region. As illustrated in the example above, assuming the distance between the boundary position furthest from the central region in the transition region and the central region is 3mm, and since the laser power parameter corresponding to the central region is 14W and the laser power parameter corresponding to the edge region is 12W, the linear functional relationship between the laser power parameter in the third laser parameter set and the positional distance can be automatically generated as Y = 14 - 2 / 3X (0 ≤ X ≤ 3), where Y represents the laser power parameter corresponding to the transition region, and X represents the positional distance. It is understood that other laser parameters in the third laser parameter set corresponding to the transition region can also be automatically generated as dynamic parameters in a similar manner.

[0054] For example, dynamic parameters can also be represented using an ordered one-dimensional array. This is achieved by dividing the distance between each location in the transition region and the central region into multiple distance segments, with each segment corresponding to a value in the one-dimensional array. As illustrated in the example above, assuming the distance between the boundary location furthest from the central region in the transition region and the central region is 3mm, this 3mm can be divided into six equal distance segments: 0.0-0.5mm, 0.5-1.0mm, 1.0-1.5mm, 1.5-2.0mm, 2.0-2.5mm, and 2.5-3.0mm. Since the laser power parameter corresponding to the central region is 14W and the laser power parameter corresponding to the edge region is 12W, the laser power parameter in the third laser parameter set corresponding to the transition region... It can be automatically generated as an ordered one-dimensional array [13.71W, 13.42W, 13.13W, 12.84W, 12.55W, 12.26W], where 13.71W corresponds to a distance of 0.0-0.5mm, 13.42W to 0.5-1.0mm, 13.13W to 1.0-1.5mm, 12.84W to 1.5-2.0mm, 12.55W to 2.0-2.5mm, and 12.26W to 2.5-3.0mm. It is understandable that other laser parameters in the third laser parameter set corresponding to the transition region can also be automatically generated as dynamic parameters in a similar manner.

[0055] The laser processing equipment 30 is communicatively coupled to the main control unit 20 and can receive control commands output by the main control unit 20. The laser processing equipment 30 can respond to the control commands and then perform laser processing on the circuit board to be processed according to the laser processing information carried in the control commands.

[0056] Upon receiving a control command, the laser processing equipment 30 parses the command to obtain the laser processing information it carries. Then, the laser processing equipment 30 can automatically set parameters according to this information and operate the equipment accordingly to perform laser processing on the circuit board to be processed.

[0057] In some embodiments, if the component detection unit 11 and the thickness detection unit 12 perform detection according to a predetermined area, the laser processing information generated by the analysis unit 21 in the main control unit 20 includes multiple laser parameter sets, wherein one predetermined area corresponds to one laser parameter set. After receiving the control command, the laser processing equipment 30 can monitor the current focusing position of the laser beam in the laser processing equipment 30 through monitoring devices such as cameras or sensors during the laser processing process. Based on the predetermined area to which the processing position belongs, the laser parameters of the laser processing equipment 30 are automatically adjusted according to the laser parameter set corresponding to the predetermined area, thereby realizing the automatic adjustment of the laser parameters in the laser processing equipment and improving the automation and accuracy of laser processing.

[0058] In some embodiments, such as Figure 2 As shown, the laser processing equipment 30 may include a laser 31, an optical path system 32, and a processing table 33. Wherein: Laser 31 is configured to emit a laser beam; The optical path system 32 is configured to adjust the laser beam to a preset state through optical elements and then emit the adjusted laser beam onto the circuit board to be processed. The processing platform 33 is configured to support the circuit board to be processed.

[0059] The laser 31 can be a solid-state laser, such as a nanosecond laser, picosecond laser, or femtosecond laser. It can also be a gas laser, such as a CO2 laser. Alternatively, it can be other types of lasers, specifically selected based on processing requirements to provide suitable laser pulse wavelength and frequency parameters. The laser 31 is communicatively coupled to the control unit 22 in the main control unit 20, receiving control commands output by the control unit 22. Laser parameters such as power, number of pulses, pulse energy, pulse frequency, wavelength, spot size, speed, and number of pulses emitted by the laser 31 can be automatically set according to the laser processing information carried in the control commands. The optical components in the optical path system 32 may include, but are not limited to, beam shapers (e.g., beam expanders), mirrors, and focusing lenses. Specifically, the beam shaper is used to shape the laser beam to control the spot size and laser power. The mirror is used to change the laser beam's optical path. A focusing lens is used to adjust the focal length, thereby affecting the energy density distribution of the laser spot formed by the laser beam at the processing position on the circuit board to be processed. The various optical elements in the optical path system 32 cooperate with each other to transmit and control the laser beam according to the dynamically changing laser processing information, forming a laser spot with specific laser parameters to perform laser processing on the circuit board to be processed.

[0060] In some embodiments, the laser processing system may further include a conveying device and an identification device. Wherein: A conveying device is configured to transport the circuit board to be processed to a target position; An identification device is provided in the transport path of the conveying device to identify the circuit board to be processed during the transfer.

[0061] The conveying device may include a drive component and a moving component. The drive component drives the moving component, and the moving component controls the movement and / or rotation of the processing platform. The conveying device, through the cooperation of the drive component and the moving component, transports the circuit board to be processed to the target position. The identification device may be a barcode scanner installed in the conveying path of the conveying device. When the conveying device transports the circuit board to be processed past the identification device, the identification device can obtain the processing program information and target feature information of the circuit board by scanning the work order QR code on the circuit board, and then store the processing program information and target feature information of the circuit board in the MES system.

[0062] Based on the aforementioned circuit board laser processing system, this application also provides a circuit board processing method, wherein the circuit board processing method is applied to the aforementioned circuit board laser processing system. Please refer to... Figure 3 , Figure 3 This is a schematic flowchart illustrating a laser processing method for circuit boards provided in an embodiment of this application. Figure 3As shown, the laser processing method for circuit boards may specifically include the following steps: S301: Inspect the circuit board to be processed to obtain existing feature information of the circuit board to be processed; S302: Receive existing feature information; S303: Generate laser processing information based on existing feature information; S304: Output control commands based on laser processing information; S305: Responds to control commands and performs laser processing on the circuit board to be processed based on laser processing information.

[0063] In this embodiment, based on the aforementioned circuit board laser processing system, the detection unit 10 detects the circuit board to be processed to obtain existing feature information, which includes at least composition information and thickness information. The analysis unit 21 in the main control unit 20 receives the existing feature information and generates laser processing information based on it. The control unit 22 in the main control unit 20 generates and outputs control commands carrying the laser processing information. The laser processing equipment 30, in response to the control commands, performs laser processing on the circuit board to be processed according to the laser processing information.

[0064] It is understood that the execution order of each process in the above embodiments should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0065] In some embodiments of this application, please refer to Figure 4 , Figure 4 This is a basic structural block diagram of an electronic device provided in an embodiment of this application. Figure 4 As shown, the electronic device 4 in this embodiment includes a processor 41, a memory 42, and a computer program 43 stored in the memory 42 and executable on the processor 41, such as a control program for a circuit board laser processing system. When the processor 41 executes the computer program 43, it implements the functions of each component / unit in the embodiment corresponding to the circuit board laser processing system described above. Please refer to the relevant descriptions in the embodiments for details, which will not be repeated here.

[0066] For example, the computer program 43 can be divided into one or more modules (units) for performing the aforementioned component / unit information interaction, processing control, and other functions. One or more modules are stored in the memory 42 and executed by the processor 41 to complete this application. The one or more modules can be a series of computer program instruction segments capable of performing specific functions, which describe the execution process of the computer program 43 in the electronic device 4.

[0067] The electronic device may include, but is not limited to, a processor 41 and a memory 42. Those skilled in the art will understand that... Figure 4 This is merely an example of electronic device 4 and does not constitute a limitation on electronic device 4. It may include more or fewer components than shown, or combine certain components, or different components. For example, the electronic device may also include input / output devices, network access devices, buses, etc.

[0068] The processor 41 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0069] The memory 42 can be an internal storage unit of the electronic device 4, such as a hard disk or memory. The memory 42 can also be an external storage device of the electronic device 4, such as a plug-in hard disk, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card. Furthermore, the memory 42 can include both internal and external storage units of the electronic device 4. The memory 42 is used to store the computer program and other programs and data required by the electronic device. The memory 42 can also be used to temporarily store data that has been output or will be output.

[0070] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, can implement the steps in the various method embodiments described above. In this embodiment, the computer-readable storage medium can be either non-volatile or volatile.

[0071] This application provides a computer program product that, when run on a mobile terminal, enables the mobile terminal to implement the steps described in the various method embodiments.

[0072] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above device can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0073] If the integrated module / unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, recording media, USB flash drives, portable hard drives, magnetic disks, optical disks, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the content included in the computer-readable medium can be appropriately added or removed according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electrical carrier signals and telecommunication signals.

[0074] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0075] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A circuit board laser processing system, characterized in that, include: A detection unit, provided on a laser processing device or in the transmission path of the laser processing system, is configured to detect the circuit board to be processed to obtain existing feature information of the circuit board to be processed. The main control unit, which is communicatively coupled to the detection unit, is configured as follows: a) Receive the existing feature information; b) Generate laser processing information based on the existing feature information; and c) Output control commands based on the laser processing information; A laser processing device, which is communicatively coupled to the main control unit, is configured to perform laser processing on the circuit board to be processed in response to the control command and according to the laser processing information.

2. The circuit board laser processing system according to claim 1, characterized in that, The existing feature information includes at least composition information and thickness information; The detection unit includes: The component detection unit is configured to detect the components of the circuit board to be processed to obtain the component information; The thickness detection unit is configured to detect the thickness of the circuit board to be processed to obtain the thickness information.

3. The circuit board laser processing system according to claim 2, characterized in that, The component detection unit is configured to detect the components of a predetermined area of ​​the circuit board to be processed to obtain regional component information; The thickness detection unit is configured to detect the thickness of the predetermined area of ​​the circuit board to be processed to obtain regional thickness information.

4. The circuit board laser processing system according to claim 3, characterized in that, The thickness detection unit is one of a non-contact profilometer, an optical interferometer, a laser rangefinder, a contact thickness gauge, or an ultrasonic thickness gauge. and / or The component detection unit is one of the following: an energy dispersive spectrometer, a wavelength dispersive spectrometer, an electron energy loss spectrometer, an X-ray fluorescence spectrometer, or a combination of an optical microscope and an image recognition unit.

5. The circuit board laser processing system according to claim 2, characterized in that, The main control unit includes: The analysis unit is configured to perform the step of generating laser processing information; and The control unit is configured to execute the steps of the output control command.

6. The circuit board laser processing system according to claim 5, characterized in that, The analysis unit is configured to generate laser processing information based on a combined analysis of the thickness information and the composition information, the laser processing information including at least one set of laser parameters.

7. The circuit board laser processing system according to claim 6, characterized in that, The at least one set of laser parameters includes one or more parameters from the following group: Laser power, number of laser shots, laser pulse energy, laser pulse frequency, laser wavelength, laser spot size, laser speed, and number of processing cycles.

8. The circuit board laser processing system according to claim 6, characterized in that, The analysis unit is further configured to generate the laser processing information by accessing a pre-stored database. The database stores the correlation between the thickness information, the composition information and their corresponding laser parameter sets.

9. The circuit board laser processing system according to claim 6, characterized in that, The analysis unit is further configured to generate the laser processing information by accessing a pre-stored database. The database stores processing program information and target feature information. The database also stores the thickness information, the composition information and its corresponding processing program information, the correlation between the target feature information and the corresponding laser parameter set.

10. The circuit board laser processing system according to claim 8 or 9, characterized in that, The analysis unit is further configured to use machine learning algorithms to dynamically update the relationships within the database based on historical processing results.

11. The circuit board laser processing system according to claim 1, characterized in that, The laser processing equipment includes a laser, an optical path system, and a processing table; The laser is configured to emit a laser beam; The optical path system is configured to adjust the laser beam to a preset state through optical elements and then emit the adjusted laser beam onto the circuit board to be processed. The processing platform is configured to support the circuit board to be processed.

12. The circuit board laser processing system according to claim 1, characterized in that, The laser processing system also includes, A conveying device is configured to transport the circuit board to be processed to a target position; An identification device is provided in the transport path of the conveying device to identify the circuit board to be processed during the transfer.

13. A circuit board processing method, applied to a circuit board laser processing system, characterized in that, include: The circuit board to be processed is inspected to obtain its existing feature information; Receive the existing feature information; Laser processing information is generated based on the existing feature information; Output control commands based on the laser processing information; In response to the control command, the circuit board to be processed is laser-processed according to the laser processing information; The existing feature information includes at least composition information and thickness information.

Images