Quasi-free cutting milling cutter suitable for hard and brittle material machining and design and preparation method
By designing a quasi-free cutting milling cutter and using laser processing to form the front and rear cutting faces, combined with the rake angle and side rake angle, the problems of high cutting force, severe friction and easy tool damage in milling of hard and brittle materials are solved, thus improving the machining quality and tool life of hard and brittle materials.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-25
- Publication Date
- 2026-03-27
Smart Images
Figure CN121733032A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of cutting tools, in particular to a quasi-free cutting milling cutter suitable for hard and brittle material machining and a design and preparation method. BACKGROUND
[0002] The precision micro-milling technology of hard and brittle materials such as ceramics, sapphire and glass is a key challenge in the field of advanced manufacturing. Hard and brittle materials have the characteristics of high hardness and low fracture toughness. Traditional machining is prone to edge collapse and cracks due to stress concentration. At present, there are problems such as large cutting force, serious friction, difficult chip removal, easy damage and short tool life in the precision micro-milling of hard and brittle materials. In view of this, the application provides a quasi-free cutting milling cutter suitable for hard and brittle material machining and a design and preparation method to solve the above technical problems in the hard and brittle material milling. SUMMARY
[0003] The purpose of the application is to provide a quasi-free cutting milling cutter suitable for hard and brittle material machining and a design and preparation method to solve the above problems in the prior art, realize quasi-free cutting of hard and brittle materials, improve the machining quality of hard and brittle materials and prolong the service life of the tool.
[0004] To achieve the above purpose, the application provides the following scheme: The application provides a design and preparation method of a quasi-free cutting milling cutter suitable for hard and brittle material machining, which comprises the following steps: (1) A Z-axis is established along the cutting speed V direction, the unit vector of the cutting speed V is k, the base surface Pr is perpendicular to the cutting speed V, the unit vector of the chip removal direction is u, the straight line g in the u direction is the generatrix of the rake face, the plane S with the normal vector u+k is the Stabler plane, the workpiece arc-shaped contact profile s to be machined is projected on the Stabler plane along the k direction to obtain a cutting edge curve E, and the generatrix g is moved along the cutting edge curve E to obtain the design rake face and flank face; (2) The cutter blank is reduced in diameter by tangential laser processing to obtain a cutter intermediate body; (3) Laser scanning processing is performed on the end part of the cutter intermediate body to obtain a cylindrical rake face consistent with the shape of the design rake face and flank face; (4) The cutter intermediate body is rotated by an angle θ, and laser scanning processing is performed on the cylindrical rake face to obtain a cylindrical flank face consistent with the shape of the design rake face and flank face; the cylindrical flank face intersects with the cylindrical rake face to form a cutter cutting edge, and the intersection point of the cutter cutting edge is located on the rotation axis of the cutter intermediate body.
[0005] In an embodiment, the cutter blank is a single crystal diamond or a polycrystalline diamond material.
[0006] In an embodiment, in steps (2)-(4), a green nanosecond laser is used for laser processing.
[0007] The application also provides a quasi-free cutting milling cutter suitable for hard and brittle material processing, which is prepared by the design and preparation method of the quasi-free cutting milling cutter suitable for hard and brittle material processing.
[0008] The application has the following technical effects compared with the prior art: The quasi-free cutting milling cutter suitable for hard and brittle material processing and the design and preparation method provided by the application establish a Z axis along the cutting speed V direction, the unit vector of the cutting speed V is k, the base surface Pr is perpendicular to the cutting speed V, the unit vector of the chip removal direction is u, the straight line g in the u direction is the generatrix of the rake face, the plane S with the normal vector u+k is the Stabler plane, the workpiece arc-shaped contact profile s to be processed is projected on the Stabler plane along the k direction to obtain the cutting edge curve E, the generatrix g is moved along the cutting edge curve E to obtain the design rake face and the relief face, then the cylindrical rake face and the cylindrical relief face with the same shape as the design rake face and the relief face are obtained on the cutter blank by laser processing, so that when the cutter rotation axis and the workpiece have a rake angle and a side rake angle during the milling processing of the workpiece, the quasi-free cutting can be realized, the hard and brittle material processing quality is improved, and the service life of the cutter is prolonged. BRIEF DESCRIPTION OF DRAWINGS
[0009] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.
[0010] Figure 1 It is a tool design schematic diagram in the embodiments of the application; Figure 2 It is a tool preparation process schematic diagram in the embodiments of the application; Figure 3 It is a tool milling schematic diagram in the embodiments of the application; Figure 4 It is a structure schematic diagram of the milling cutter prepared in the embodiments of the application; Figure 5 It is a front view of the milling cutter prepared in the embodiments of the application.
[0011] In the drawings: 1-cutter blank, 2-cutter intermediate body, 3-cylindrical rake face, 4-cylindrical relief face, 5-cutter cutting edge, 6-intersection point, 7-rotation axis, 8-workpiece. DETAILED DESCRIPTION
[0012] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0013] The purpose of this invention is to provide a quasi-free cutting milling cutter suitable for machining hard and brittle materials and its design and manufacturing method, so as to solve the problems existing in the prior art, realize quasi-free cutting of hard and brittle materials, improve the machining quality of hard and brittle materials, and increase the service life of the cutting tool.
[0014] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0015] Example 1 like Figures 1-2 As shown, this embodiment provides a method for designing and manufacturing a quasi-free cutting end mill suitable for machining hard and brittle materials, including the following steps: (1) Establish the Z-axis along the cutting speed V direction, the unit vector of the cutting speed V is k, the base plane Pr is perpendicular to the cutting speed V, the unit vector of the chip removal direction is u, the straight line g in the u direction is the generatrix of the rake face, the plane S with the vector u+k as the normal is the Stabler plane, project the workpiece to be machined arc contact profile s along the k direction on the Stabler plane to obtain the cutting edge curve E, let the generatrix g scan and move along the cutting edge curve E to obtain the designed rake / flank face m; (2) The tool blank 1 is tangentially laser-machined to the target diameter size to obtain the tool intermediate body 2; (3) Laser scanning is performed on the end of the intermediate body 2 of the tool to obtain the front face 3 of the column that is consistent with the shape of the front / back face m of the design; during the laser processing, the intermediate body 2 of the tool is fixed. (4) Rotate the intermediate body 2 of the tool by an angle θ, where θ is 90°-120°, and perform laser scanning processing on the front face 3 of the cylindrical face to obtain a cylindrical back face 4 that is consistent with the shape of the designed front / back face m; the cylindrical back face 4 intersects with the front face 3 of the cylindrical face to form the cutting edge 5 of the tool, and the intersection point 6 of the cutting edge 5 is located on the rotation axis 7 of the intermediate body 2 of the tool.
[0016] The milling cutter prepared by the design and preparation method of this embodiment, such as Figure 3As shown, when the workpiece milling is performed, the rotation axis 7 of the cutter and the workpiece 8 have a rake angle alpha and a side rake angle beta (the rake angle alpha and the side rake angle beta can be set arbitrarily under the condition that overcut is not generated), the cutter rotates around the rotation axis 7 and performs linear feeding motion, the speed vector of any point of the cutting edge of the cutter and any vector on the surface of the workpiece are not collinear, so as to reduce the non-free cutting coefficient, the quasi-free cutting can be realized, the processing quality of the hard and brittle material is improved, and the service life of the cutter is improved. Figure 3 v s is the linear speed of the cutting edge of the cutter, v w is the milling feeding speed, v s and v w are the unit speed vectors of the cutter.
[0017] The cutter blank 1 is single crystal diamond or polycrystalline diamond material. In steps (2)-(4), a green light nanosecond laser is used for laser processing.
[0018] Embodiment two As Figures 4-5 shown, the embodiment provides a quasi-free cutting milling cutter suitable for hard and brittle material processing, which is prepared by the design and preparation method of the quasi-free cutting milling cutter suitable for hard and brittle material processing in embodiment one.
[0019] The principles and implementation manners of the present application are described by using specific examples in the present application, and the above embodiment is only used to help understand the method of the present application and the core idea thereof; meanwhile, for the general skilled in the art, according to the idea of the present application, the specific implementation manners and application ranges will be changed. In conclusion, the content of the present application should not be understood as the limitation of the present application.
Claims
1. A method for designing and manufacturing a quasi-free cutting end mill suitable for machining hard and brittle materials, characterized in that, Includes the following steps: (1) Establish the Z-axis along the cutting speed V direction, the unit vector of the cutting speed V is k, the base plane Pr is perpendicular to the cutting speed V, the unit vector of the chip removal direction is u, the straight line g in the u direction is the generatrix of the rake face, the plane S with the vector u+k as the normal is the Stabler plane, project the workpiece to be machined arc contact profile s along the k direction on the Stabler plane to obtain the cutting edge curve E, let the generatrix g scan and move along the cutting edge curve E to obtain the designed rake / flank face; (2) The tool blank is tangentially laser-machined to the target diameter to obtain the tool intermediate body; (3) Laser scanning is performed on the end of the intermediate body of the tool to obtain a cylindrical front face that is consistent with the design front / back face shape; (4) Rotate the intermediate body of the tool by an angle θ, where θ is 90°-120°, and perform laser scanning on the face of the cylindrical front cutting edge to obtain a cylindrical back cutting edge that is consistent with the design of the front / back cutting edge shape; the cylindrical back cutting edge intersects with the face of the cylindrical front cutting edge to form the cutting edge of the tool, and the intersection of the cutting edges of the tool is located on the rotation axis of the intermediate body of the tool.
2. The design and fabrication method of the quasi-free cutting end mill suitable for machining hard and brittle materials according to claim 1, characterized in that: The tool blank is made of single-crystal diamond or polycrystalline diamond.
3. The design and fabrication method of the quasi-free cutting end mill suitable for machining hard and brittle materials according to claim 1, characterized in that: In steps (2)-(4), a green nanosecond laser is used for laser processing.
4. A quasi-free cutting end mill suitable for machining hard and brittle materials, characterized in that: It is prepared using the design and preparation method of any one of claims 1 to 3 for quasi-free cutting end mills suitable for machining hard and brittle materials.