Assembly device of framework chip assembly

Abstract

The invention discloses a framework chip assembly assembling device which comprises a workbench, a rotating disc, a framework feeding module, a chip feeding module, a press-fitting module, a third moving mechanism and a welding module, the framework feeding module, the chip feeding module and the press-fitting module are arranged around the rotating disc, and the third moving mechanism and the welding module are arranged on the workbench. A first station, a second station, a third station, a fourth station and a fifth station are sequentially arranged on the workbench; the rotary table is rotationally connected to the upper portion of the workbench, and the rotary table can rotate relative to the workbench so that the profiling tools can move to the positions below the framework feeding module, the chip feeding module and the press-fitting module correspondingly; the framework feeding module is arranged above the workbench and is close to the first station; the chip feeding module is arranged above the workbench and is close to the second station; the press-fitting module is arranged above the workbench and is close to the third station; and the welding module is arranged at the fifth station. The assembly time can be shortened, the assembly efficiency is improved, and the labor intensity of workers is reduced.

Description

Technical Field

[0001] This invention relates to the field of sensor technology, and in particular to an assembly apparatus for a skeleton chip assembly. Background Technology

[0002] Wheel speed sensors are core components of automotive anti-lock braking systems (ABS) and vehicle stability control systems. A wheel speed sensor mainly consists of a frame, two chips, and a bushing. The two chips are fixed to the frame, and their pins are soldered to the frame's pins to form a frame-chip assembly. This assembly, along with the bushing, is then injection molded into a mold to create the finished wheel speed sensor.

[0003] Currently, chip and frame assembly is primarily done manually. The specific assembly method is as follows: Since the chips arrive in paper tape and have relatively long leads, before assembly, the chips must be manually removed from the paper tape. Two chips are then placed on a cutting device to cut the leads to the appropriate length. Next, the two chips are manually placed into the mounting slots of the frame, and the assembly quality is visually inspected. The frame and chips are then taken together to a soldering machine for soldering to form the frame-chip assembly. After soldering, the soldering quality is visually inspected, and if the soldering quality is acceptable, the frame-chip assembly is manually placed into a material tray.

[0004] Because the chips are small and difficult to handle, the current assembly methods involve time-consuming, inefficient, and labor-intensive processes such as chip pin cutting, chip and frame assembly, and soldering. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of long assembly time, low efficiency, and high labor intensity caused by the small size and difficulty in handling existing wheel speed sensor frames and chips. This invention provides an assembly device for a frame-chip assembly that can automate frame loading, chip loading, mechanical assembly, and welding, effectively solving the problem of inconvenient chip handling during manual operation. This shortens assembly time, improves assembly efficiency, and reduces the labor intensity of workers.

[0006] To address the aforementioned problems, embodiments of the present invention disclose an assembly device for a skeleton chip assembly. The skeleton has two chip mounting slots for mounting chips. The assembly device includes a worktable, a turntable, and a skeleton feeding module, a chip feeding module, a pressing module arranged around the turntable, as well as a third moving mechanism and a welding module disposed on the worktable.

[0007] The workbench is equipped with the first workstation, the second workstation, the third workstation, the fourth workstation, and the fifth workstation in sequence;

[0008] The turntable is rotatably connected above the worktable. The turntable has at least one contouring fixture with a skeleton receiving groove. The shape of the skeleton receiving groove matches the shape of the skeleton. The turntable can rotate relative to the worktable, driving the contouring fixture to switch between the first and fourth workstations, so that the contouring fixture can move to the bottom of the skeleton feeding module, the chip feeding module and the pressing module respectively.

[0009] The skeleton feeding module includes a first moving mechanism for conveying the skeleton to the contouring tooling located below it.

[0010] The chip feeding module includes a second moving mechanism that can move along a first direction and is used to feed two chips to the contouring fixture located below it.

[0011] The pressing module includes a pressing head that can move vertically and is used to apply pressure to two chips in a contouring fixture located below it, so as to press the two chips into the chip mounting slot.

[0012] The third moving mechanism is located between the fourth and fifth workstations. The third moving mechanism can move along the first direction to move the skeleton and two chips from the fourth workstation to the fifth workstation.

[0013] The welding module, located at the fifth workstation, includes a welding machine positioned above the worktable. The welding machine is used to weld the skeleton and two chips located below it to form a skeleton-chip assembly.

[0014] The assembly process of the skeleton chip assembly disclosed in this application is as follows: The skeleton feeding module delivers the skeleton to the contouring fixture located at the first station; then the turntable rotates, driving the contouring fixture to the second station, where the chip feeding module delivers two chips to the contouring fixture located at the second station; then the turntable rotates again, driving the contouring fixture to the third station, where the pressing module presses the two chips in the contouring fixture located at the third station into the two chip mounting slots of the skeleton, realizing the mechanical assembly of the skeleton and the two chips; then the turntable continues to rotate, driving the contouring fixture to the fourth station, so that the third moving mechanism can move the skeleton and the two chips at the fourth station to the fifth station; at the fifth station, the welding machine welds the pins of the skeleton and the two chips located below it to realize the conductive connection between the skeleton and the chips, finally forming the skeleton chip assembly.

[0015] By adopting the above technical solution, the chip feeding module automatically feeds the chip to the frame, which can solve the problem of the chip being small and difficult to handle. In addition, the frame feeding, chip feeding, mechanical assembly of the frame and chip, and welding are all automated. Compared with manual assembly, this can shorten the assembly time, improve the assembly efficiency, and reduce the labor intensity of workers.

[0016] According to another specific embodiment of the present invention, a sixth station is also provided on the workbench, which is located downstream of the fifth station; the assembly device also includes a material unloading module located at the sixth station, which is used to pick up the skeleton chip assembly on the fifth station.

[0017] According to another specific embodiment of the present invention, four contouring fixtures are provided on the turntable, and the four contouring fixtures are equally spaced along the circumference of the turntable; one contouring fixture is provided for each of the first station, the second station, the third station and the fourth station.

[0018] The workbench is also equipped with a turntable drive mechanism. The drive end of the turntable drive mechanism is connected to the turntable. The turntable drive mechanism drives the turntable to rotate intermittently so that the turntable stops for a set time after rotating a preset angle.

[0019] According to another specific embodiment of the present invention, the skeleton feeding module further includes a skeleton placement component disposed on the workbench. The skeleton placement component is used to place the skeleton, and the lower end of the skeleton placement component is provided with a skeleton discharge port. The first moving mechanism is used to receive the skeleton in the skeleton discharge port and move it to the contouring fixture located at the first station.

[0020] According to another specific embodiment of the present invention, a plurality of skeletons are disposed in vertical skeleton tubes open at both ends, a skeleton placement assembly is provided with a vertical skeleton tube receiving groove extending in the vertical direction, the vertical skeleton tubes are disposed in the vertical skeleton tube receiving groove, and a skeleton outlet is provided at the lower end of the skeleton placement assembly; the first moving mechanism includes:

[0021] The first horizontal telescopic cylinder is mounted on the worktable and can move along the first direction.

[0022] The first vertical telescopic cylinder is connected to the telescopic end of the first horizontal telescopic cylinder. The telescopic end of the first vertical telescopic cylinder is provided with a receiving plate. The receiving plate is provided with a skeleton receiving groove, which is used to receive the skeleton at the skeleton discharge port.

[0023] The first clamping component is located between the skeleton receiving groove and the contouring fixture of the first station. The first clamping component is used to clamp the skeleton in the skeleton receiving groove and move it to the contouring fixture of the first station.

[0024] According to another specific embodiment of the present invention, the first gripping component includes:

[0025] The second vertical telescopic cylinder is located downstream of the frame receiving groove along the first direction;

[0026] The second horizontal telescopic cylinder is connected to the telescopic end of the second vertical telescopic cylinder. The second horizontal telescopic cylinder can move along the first direction and its telescopic end is provided with a first gripper. The first gripper is used to grab the skeleton in the skeleton receiving groove.

[0027] The motor is mounted on the second vertical telescopic cylinder, and the output end of the motor is connected to the second horizontal telescopic cylinder. The motor is used to drive the first gripper to rotate 90°.

[0028] The third horizontal telescopic cylinder is located downstream of the second horizontal telescopic cylinder. The third horizontal telescopic cylinder extends along the second direction. The telescopic end of the third horizontal telescopic cylinder is provided with a third vertical telescopic cylinder. The lower end of the third vertical telescopic cylinder is provided with a second gripper. The second gripper is used to move the skeleton in the first gripper to the contouring fixture of the first station.

[0029] According to another specific embodiment of the present invention, the chip loading module includes a feeder disposed on a worktable, the feeder being used to transport at least two chips to a chip placement slot;

[0030] The workbench is provided with a first fixed seat and a second fixed seat in sequence. The first fixed seat is provided with a first chip fixture, which is used to fix two chips. The bottom of the first fixed seat is connected to a first horizontal rotary cylinder, which is used to rotate the two chips in the first chip fixture by 180°.

[0031] The second fixing base is provided with a second chip fixture, which is used to fix two chips; a cutting component is provided above the second fixing base, which can move vertically to cut the pins of each chip in the second chip fixture.

[0032] The second moving mechanism includes:

[0033] A mounting plate is placed on the workbench and can slide along a first direction. A first transplanting component, a second transplanting component, and a third transplanting component are sequentially mounted on the mounting plate. These three components move synchronously with the mounting plate.

[0034] The first transfer assembly includes two third grippers, which are used to grip two chips in the chip placement slot and move them to the first chip fixture.

[0035] The second transfer assembly includes two fourth grippers, which are used to grip two chips in the first chip fixture and move them to the second chip fixture.

[0036] The third transfer assembly includes two negative pressure nozzles, which are used to pick up two chips from the second chip fixture and move them onto the skeleton in the contouring fixture of the second station.

[0037] According to another specific embodiment of the present invention, the first transplanting assembly further includes a fourth vertical telescopic cylinder disposed on the mounting plate, and two third grippers disposed on the telescopic end of the fourth vertical telescopic cylinder.

[0038] The second transplanting assembly also includes a fifth vertical telescopic cylinder mounted on the mounting plate. The telescopic end of the fifth vertical telescopic cylinder is connected to a fourth horizontal telescopic cylinder, and two fourth grippers are mounted on the telescopic end of the fourth horizontal telescopic cylinder.

[0039] The third transplanting assembly also includes a sixth vertical telescopic cylinder mounted on the mounting plate, and two negative pressure suction nozzles located at the telescopic ends of the fifth horizontal telescopic cylinder.

[0040] According to another specific embodiment of the present invention, the chip loading module further includes a first pressure plate, which is disposed above the second station. The first pressure plate can move vertically to drive the negative pressure suction nozzle to press at least partially the two chips in the contouring fixture located at the second station into the two corresponding chip mounting slots.

[0041] According to another specific embodiment of the present invention, the press-fit module further includes:

[0042] The sixth horizontal telescopic cylinder is located on the worktable and can move along the first direction.

[0043] The positioning rod is located at the telescopic end of the sixth horizontal telescopic cylinder. The sixth horizontal telescopic cylinder drives the positioning rod to move along the first direction so that the end of the positioning rod contacts the ends of the two chips in the contouring fixture of the third station.

[0044] The seventh vertical telescopic cylinder is located on the workbench. The telescopic end of the seventh vertical telescopic cylinder is equipped with a pressure head. The pressure head is used to apply a downward force to the two chips in the contouring fixture of the third station, so that the two chips are pressed into the two chip mounting slots respectively.

[0045] According to another specific embodiment of the present invention, at least one contouring fixture is provided at the fifth station, and the third moving mechanism includes:

[0046] The seventh horizontal telescopic cylinder is located on the workbench and can move along the first direction.

[0047] The eighth vertical telescopic cylinder is located at the telescopic end of the seventh horizontal telescopic cylinder. The telescopic end of the eighth vertical telescopic cylinder is equipped with a fifth gripper. The fifth gripper is used to move the skeleton and two chips in the contouring fixture of the fourth station to the contouring fixture of the fifth station.

[0048] According to another specific embodiment of the present invention, it further includes:

[0049] The first box is set on the workbench and is located near the fourth work station;

[0050] The first inspection mechanism is located at the fourth station. The inspection end of the first inspection mechanism is set downward. The first inspection mechanism is used to inspect the assembly quality of the skeleton and two chips in the contouring fixture at the fourth station.

[0051] The control module is electrically connected to the first detection mechanism, which is used to send a first signal and a second signal to the control module.

[0052] When the first testing mechanism sends the first signal to the control module, the control module controls the fifth gripper to grab the skeleton and two chips on the fourth station and move them to the fifth station.

[0053] When the first testing mechanism sends a second signal to the control module, the control module controls the fifth gripper to grab the skeleton and two chips on the fourth station and move them into the first housing.

[0054] According to another specific embodiment of the present invention, the welding module includes:

[0055] The third fixed seat is located on the workbench, and at least one contouring fixture is provided on the third fixed seat; the welding machine is located above the third fixed seat;

[0056] The second pressure plate is located between the welding machine and the third fixed base. The second pressure plate can move along the first direction and the vertical direction. The second pressure plate can apply a downward force to the two chips in the contouring fixture located below it, so that the pins of the skeleton contact the pins of the two chips.

[0057] According to another specific embodiment of the present invention, the fifth station has two contouring fixtures, and a contouring fixture is provided at both the first and second ends of the third fixed base. The welding machine and the second pressure plate are disposed near the first end of the third fixed base. The welding module further includes:

[0058] The second horizontal rotary cylinder is located between the worktable and the third fixed seat. The second horizontal rotary cylinder is used to drive the third fixed seat to rotate 180°.

[0059] The second inspection mechanism is located above the second end of the third fixed base, with the inspection end of the second inspection mechanism facing downwards. The second inspection mechanism is used to inspect the welding quality of the skeleton chip assembly in the contour tooling located below it.

[0060] According to another specific embodiment of the present invention, the feeding module includes:

[0061] A servo motor module is mounted on the worktable, and the servo motor module can move along a first direction;

[0062] The ninth vertical telescopic cylinder is mounted on the servo motor module;

[0063] The third horizontal rotary cylinder is located at the extension end of the ninth vertical telescopic cylinder;

[0064] The eighth horizontal telescopic cylinder is located at the lower end of the third horizontal rotary cylinder. The telescopic end of the eighth horizontal telescopic cylinder is equipped with a sixth gripper. The sixth gripper is used to grip the skeleton chip assembly at the second end of the third fixed seat and move it to the qualified product placement position or the second box.

[0065] According to another specific embodiment of the present invention, the assembly apparatus further includes:

[0066] The second box is located on the workbench and near the sixth workstation.

[0067] The control module is also electrically connected to the second detection mechanism, which is used to send the third and fourth signals to the control module.

[0068] When the second testing mechanism sends a third signal to the control module, the control module controls the sixth gripper to grasp the skeleton chip assembly in the contouring tooling at the second end of the third fixed base and move it to the qualified product placement position.

[0069] When the second detection mechanism sends the fourth signal to the control module, the control module controls the sixth gripper to grasp the skeleton chip assembly in the contouring tooling at the second end of the third fixed seat and move it into the second housing.

[0070] According to another specific embodiment of the present invention, the feeding module further includes:

[0071] A placement board is placed on the workbench. The placement board extends along a second direction, which is perpendicular to both the first direction and the vertical direction. The placement board has a designated place for qualified products.

[0072] The ninth horizontal telescopic cylinder is mounted on the placement plate and can move in the second direction;

[0073] The push plate is connected to the telescopic end of the ninth horizontal telescopic cylinder. The ninth horizontal telescopic cylinder drives the push plate to move along the second direction to push the skeleton chip assembly in the qualified product placement position into the qualified product material tube.

[0074] According to another specific embodiment of the present invention, the feeding module further includes:

[0075] The feeding assembly is located downstream of the qualified product placement position along the second direction. The feeding assembly is provided with a qualified product material tube receiving groove, in which the qualified product material tube is located, and the opening of the qualified product material tube faces the qualified product placement position. Attached Figure Description

[0076] Figure 1 A schematic diagram of the skeleton chip assembly assembled using the assembly apparatus disclosed in the embodiments of the present invention is shown.

[0077] Figure 2 A schematic diagram of the assembly device in an embodiment of the present invention is shown;

[0078] Figure 3 This diagram illustrates the structure of the turntable in an embodiment of the present invention.

[0079] Figure 4 A schematic diagram of the skeleton feeding module in an embodiment of the present invention is shown;

[0080] Figure 5 A schematic diagram of the structure of the first clamping component in an embodiment of the present invention is shown;

[0081] Figure 6 This diagram illustrates the structure of the chip loading module in an embodiment of the present invention. Figure 1 ;

[0082] Figure 7 This diagram illustrates the structure of the chip loading module in an embodiment of the present invention. Figure 2 ;

[0083] Figure 8 A schematic diagram of the press-fit module in an embodiment of the present invention is shown;

[0084] Figure 9 A schematic diagram of the structure of the third moving mechanism in an embodiment of the present invention is shown;

[0085] Figure 10 A schematic diagram of the welding module in an embodiment of the present invention is shown;

[0086] Figure 11 A schematic diagram of the feeding module in an embodiment of the present invention is shown. Figure 1 ;

[0087] Figure 12 A schematic diagram of the feeding module in an embodiment of the present invention is shown. Figure 2 .

[0088] Reference numerals: 10. Skeleton; 11. Chip mounting slot; 12. Skeleton pin; 20. Chip; 21. Sensing head; 22. Chip pin; 100. Worktable; 110. First fixed base; 111. First chip fixture; 112. First horizontal rotary cylinder; 120. Second fixed base; 121. Second chip fixture; 130. Cutting assembly; 131. Cutter; 140. First housing; 150. First detection mechanism; 160. Second housing; 170. Skeleton fixture; 200. Turntable; 210. Contouring fixture; 300. Skeleton feeding module; 310. First moving mechanism; 3 11. First horizontal telescopic cylinder; 312. First vertical telescopic cylinder; 313. Receiving plate; 3131. Frame receiving groove; 314. First gripping assembly; 3142. Second horizontal telescopic cylinder; 3143. First gripper; 3144. Motor; 3145. Third horizontal telescopic cylinder; 3146. Third vertical telescopic cylinder; 3147. Second gripper; 320. Frame placement assembly; 321. Vertical frame material tube receiving groove; 400. Chip loading module; 410. Second moving mechanism; 411. Mounting plate; 412. First transfer assembly; 4121. Third gripper; 4122. 413. Second transplanting assembly; 4131. Fourth gripper; 4132. Fifth vertical telescopic cylinder; 4133. Fourth horizontal telescopic cylinder; 414. Third transplanting assembly; 4141. Negative pressure nozzle; 4142. Sixth vertical telescopic cylinder; 420. Feeder; 421. Chip placement slot; 422. Detection element; 430. First pressure plate; 500. Pressing module; 510. Pressure head; 520. Sixth horizontal telescopic cylinder; 530. Positioning rod; 540. Seventh vertical telescopic cylinder; 600. Third moving mechanism; 610. Seventh horizontal telescopic cylinder; 620. Eight vertical telescopic cylinders; 630. Fifth gripper; 700. Welding module; 710. Welding machine; 720. Third fixed base; 730. Second pressure plate; 740. Second horizontal rotary cylinder; 750. Second detection mechanism; 800. Unloading module; 810. Servo motor module; 820. Ninth vertical telescopic cylinder; 830. Third horizontal rotary cylinder; 840. Eighth horizontal telescopic cylinder; 850. Sixth gripper; 860. Placement plate; 861. Qualified product placement position; 870. Ninth horizontal telescopic cylinder; 880. Push plate; 890. Unloading assembly; 891. Qualified product material tube receiving slot. Detailed Implementation

[0089] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a deep understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0090] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0091] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of the invention is usually placed in during use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0092] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0093] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0094] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0095] Figure 1 A schematic diagram of a skeleton chip assembly assembled using the assembly apparatus disclosed in an embodiment of the present invention is shown. Figure 1As shown, the skeleton chip assembly includes a skeleton 10 and two chips 20. The skeleton 10 has two chip mounting slots 11, the shape of which matches the shape of the chips 20. The two chips 20 are respectively mounted in the two chip mounting slots 11 to achieve a mechanical connection between the skeleton 10 and the chips 20. Each chip 20 has two chip pins 22, and the skeleton 10 has four skeleton pins 12. The four chip pins 22 and the four skeleton pins 12 are soldered together to achieve an electrical connection between the two chips 20 and the skeleton 10, ultimately forming... Figure 1 The skeleton chip assembly shown.

[0096] Figure 2 A schematic diagram of the assembly device in an embodiment of the present invention is shown. The assembly device is used to assemble... Figure 1 The two chips 20 are mechanically assembled and pin-soldered with a frame 10. For example... Figure 2 As shown, the assembly device includes a worktable 100, a turntable 200, and a skeleton feeding module 300, a chip feeding module 400, a pressing module 500 arranged around the turntable 200, as well as a third moving mechanism 600 and a welding module 700 arranged on the worktable 100.

[0097] in, Figure 3 A schematic diagram of the turntable 200 in an embodiment of the present invention is shown. Figure 2 and Figure 3 As shown, the workbench 100 is sequentially equipped with the first workstation (e.g., Figure 2 and Figure 3 As shown in area A), the second workstation (as shown in the image). Figure 2 and Figure 3 As shown in area B), the third workstation (as shown in the image). Figure 2 and Figure 3 As shown in area C), the fourth workstation (as shown in the image). Figure 2 and Figure 3 (as shown in area D) and the fifth station (as shown in the image) Figure 2 (As shown in region E).

[0098] refer to Figure 3 The turntable 200 is rotatably connected above the worktable 100. At least one contouring fixture 210 is provided on the turntable 200. The contouring fixture 210 has a skeleton receiving groove (not shown in the figure), the shape of which is adapted to the shape of the skeleton 10, for accommodating and fixing the skeleton 10. The turntable 200 can rotate clockwise relative to the worktable 100 to drive the contouring fixture 210 to switch between the first and fourth work positions, so that the contouring fixture 210 on the turntable 200 moves to below the skeleton loading module 300, the chip loading module, and the pressing module 500, respectively.

[0099] Figure 4This shows a schematic diagram of the skeleton feeding module 300 in an embodiment of the present invention. Figure 5 A schematic diagram of the structure of the first gripping component 314 in an embodiment of the present invention is shown. Figure 2 , Figure 4 and Figure 5 As shown, the skeleton loading module 300 is positioned above the workbench 100 and close to the first workstation. Furthermore, the skeleton loading module 300 includes a first moving mechanism 310, which is used to transport the skeleton 10 to the contouring fixture 210 located below it. In other words, the skeleton loading module 300 is used to load the skeleton 10.

[0100] Figure 6 This diagram illustrates the structure of the chip loading module 400 in an embodiment of the present invention. Figure 1 , Figure 7 This diagram illustrates the structure of the chip loading module 400 in an embodiment of the present invention. Figure 2 .like Figure 2 , Figure 6 and Figure 7 As shown, the chip loading module 400 is positioned above the workbench 100 and close to the second workstation. The chip loading module 400 includes a second moving mechanism 410, which is capable of moving along a first direction (e.g., ...). Figure 2 and Figure 6 The second moving mechanism 410 moves in the X direction (as shown) and is used to transport two chips 20 to the contouring fixture 210 located below it. In other words, the chip loading module 400 is used to load the two chips 20.

[0101] Figure 8 A schematic diagram of the pressing module 500 in an embodiment of the present invention is shown. (Reference) Figure 2 and Figure 8 The pressing module 500 is located above the workbench 100 and near the third station. The pressing module 500 includes a pressing head 510, which can move vertically (e.g., ...). Figure 8 Moving in the Z direction (as shown), the pressure head 510 applies pressure to the two chips 20 in the contour tooling 210 located below it, so that the two chips 20 are pressed into the two chip mounting slots 11 respectively. That is, the press-fit module 500 is used to complete the mechanical assembly of the skeleton 10 and the two chips 20.

[0102] Figure 9 A schematic diagram of the structure of the third moving mechanism 600 in an embodiment of the present invention is shown. (Reference) Figure 2 and Figure 9 The third moving mechanism 600 is located between the fourth and fifth workstations. The third moving mechanism 600 can move along the first direction to move the skeleton 10 and the two chips 20 of the fourth workstation to the fifth workstation.

[0103] Figure 10 A schematic diagram of the welding module 700 in an embodiment of the present invention is shown. (See reference) Figure 2 and Figure 10 The welding module 700 is located at the fifth station, which has at least one contouring fixture 210 to facilitate the pre-welding fixation of the mechanically assembled skeleton 10 and two chips 20. The welding module 700 includes a welding machine 710, which is located above the worktable 100. The welding machine 710 is used to weld the pins of the skeleton 10 and the pins of the two chips 20 in the contouring fixture 210 located below it, so as to achieve a conductive connection between the skeleton 10 and the chips 20, and finally form a skeleton-chip assembly.

[0104] The assembly process of the skeleton chip assembly disclosed in this application is as follows: The skeleton feeding module 300 feeds the skeleton 10 to the contouring fixture 210 located at the first station; then the turntable 200 rotates clockwise, driving the contouring fixture 210 to rotate to the second station, where the chip feeding module 400 feeds two chips 20 to the contouring fixture 210 located at the second station; then the turntable 200 rotates clockwise again, driving the contouring fixture 210 to rotate to the third station, where the pressing module 500 presses the two chips 20 in the contouring fixture 210 located at the third station into the two chip mounting slots 11 of the skeleton 10, thereby realizing the mechanical assembly of the skeleton 10 and the two chips 20. Then the turntable 200 continues to rotate clockwise, driving the contouring fixture 210 to the fourth station. The third moving mechanism 600 moves the mechanically assembled skeleton 10 and two chips 20 from the fourth station to the fifth station. At the fifth station, the welding machine 710 welds the pins of the skeleton 10 and the pins of the two chips 20 located below it to achieve a conductive connection between the skeleton 10 and the chips 20, ultimately forming a skeleton-chip assembly.

[0105] By adopting the above technical solution, the chip loading module 400 automatically feeds two chips 20 to the frame 10, thereby solving the problem that the chips 20 are small and difficult to handle. In addition, the processes of loading the frame 10, loading the chips 20, mechanically assembling the frame 10 and the chips 20, and soldering the pins of the frame 10 and the chips 20 are all automated. Compared with manual assembly, this can shorten the assembly time, improve the assembly efficiency, and reduce the labor intensity of workers.

[0106] According to another specific embodiment of the present invention, reference is made to... Figure 2 The workbench 100 also has a sixth workstation (such as...) Figure 2 and Figure 3 (As shown in area F), the sixth station is located downstream of the fifth station. (Reference) Figure 2The assembly device also includes a material unloading module 800, located at the sixth station. The material unloading module 800 is used to pick up the skeleton chip assembly at the fifth station for unloading.

[0107] By adopting the above technical solution, the unloading module 800 can realize the automated unloading of the skeleton chip assembly, thereby realizing the entire assembly process of the skeleton chip assembly from loading to unloading, further improving assembly efficiency and reducing the labor intensity of workers.

[0108] According to another specific embodiment of the present invention, reference is made to... Figure 3 The turntable 200 is equipped with four contouring fixtures 210, which are evenly spaced along the circumference of the turntable 200. One contouring fixture 210 is respectively located at the first, second, third, and fourth workstations. By setting up these four contouring fixtures 210, as the turntable 200 rotates, the four fixtures move to the area below the skeleton loading module 300, the chip loading module 400, the pressing module 500, and at the fourth workstation, respectively. This allows for simultaneous assembly of the four skeletons 10 at different stages, thereby improving assembly efficiency.

[0109] Furthermore, the workbench 100 is also equipped with a turntable drive mechanism (not shown in the figure). The drive end of the turntable drive mechanism is connected to the turntable 200. The turntable drive mechanism drives the turntable 200 to rotate clockwise intermittently so that the turntable 200 stops for a set time after rotating a preset angle, so as to facilitate the feeding of the skeleton 10, the feeding of the chip 20, the pressing of the skeleton 10 and the chip 20, and the welding of the skeleton 10 and the chip 20.

[0110] According to another specific embodiment of the present invention, reference is made to... Figure 4 The skeleton feeding module 300 also includes a skeleton placement assembly 320, which is mounted on the worktable 100. The skeleton placement assembly 320 is used to place skeletons 10, and its lower end has a skeleton discharge port (not shown in the figure). The skeletons 10 placed in the skeleton placement assembly 320 can be output from the skeleton discharge port. The first moving mechanism 310 is used to receive the skeletons 10 in the skeleton discharge port and move them to the contouring fixture 210 located at the first station. Further, before the skeletons 10 are fed, multiple skeletons 10 are placed in vertical skeleton tubes (not shown in the figure) with openings at both ends. The skeleton placement assembly 320 has a vertical skeleton tube receiving groove 321 extending in the vertical direction. The vertical skeleton tubes are inserted into the vertical skeleton tube receiving groove 321, and the opening at the lower end of the vertical skeleton tube is aligned with the skeleton discharge port. The skeleton 10 can fall onto the first moving mechanism 310 through the lower opening and the skeleton discharge port, and the first moving mechanism 310 moves the skeleton 10 into the contouring fixture 210 located at the first station.

[0111] Those skilled in the art will understand that a sealing plate (not shown in the figure) can be provided at the bottom of the skeleton placement assembly 320. The sealing plate is used to block the skeleton outlet after one skeleton 10 is output from the skeleton outlet to prevent other skeletons 10 from falling from the skeleton outlet. When the next skeleton 10 needs to be output from the skeleton outlet, the sealing plate automatically opens the skeleton outlet. The specific structure of the sealing plate is not limited, as long as it achieves the function of opening and closing.

[0112] According to another specific embodiment of the present invention, reference is made to... Figure 4 The first moving mechanism 310 includes: a first horizontal telescopic cylinder 311, a first vertical telescopic cylinder 312, a receiving plate 313, and a first clamping assembly 314. The first horizontal telescopic cylinder 311 is mounted on the worktable 100 and is movable along a first direction. The first vertical telescopic cylinder 312 is connected to the telescopic end of the first horizontal telescopic cylinder 311, and the telescopic end of the first vertical telescopic cylinder 312 is provided with the receiving plate 313. The first vertical telescopic cylinder 312 is used to drive the receiving plate 313 to move vertically. The receiving plate 313 is provided with a skeleton receiving groove 3131, which is adapted to the shape of the skeleton 10 and is used to receive the skeleton 10 output from the skeleton discharge port. Specifically, the skeleton 10 is in a vertical state on the vertical skeleton tube (that is, the chip mounting slot 11 on the skeleton 10 is not facing upwards, but facing to the side). Therefore, the cross-sectional shape of the skeleton receiving groove 3131 is adapted to the cross-sectional shape of the skeleton 10 to facilitate receiving, fixing and accommodating the skeleton 10. The first clamping assembly 314 is disposed between the skeleton receiving groove 3131 and the contouring fixture 210 of the first station. The first clamping assembly 314 is used to clamp the skeleton 10 in the skeleton receiving groove 3131 and move it into the contouring fixture 210 of the first station.

[0113] According to another specific embodiment of the present invention, reference is made to... Figure 5 The first gripping assembly 314 includes: a second vertical telescopic cylinder (not shown in the figure), a second horizontal telescopic cylinder 3142, a first gripper 3143, a motor 3144, a third horizontal telescopic cylinder 3145, a third vertical telescopic cylinder 3146, and a second gripper 3147. These structures are arranged sequentially or in connection to realize the continuous conveying and transfer of the skeleton 10 from the skeleton receiving groove 3131 to the contouring fixture 210 at the first station.

[0114] The second vertical telescopic cylinder is located downstream of the skeleton receiving groove 3131 along the first direction and can move vertically. The second horizontal telescopic cylinder 3142 is connected to the telescopic end of the second vertical telescopic cylinder 3141. The second horizontal telescopic cylinder 3142 can move along the first direction, and its telescopic end is equipped with a first gripper 3143, which is used to grip the skeleton 10 in the skeleton receiving groove 3131. In other words, the second vertical telescopic cylinder and the second horizontal telescopic cylinder 3142 drive the first gripper 3143 to grip the skeleton 10 in the skeleton receiving groove 3131.

[0115] Motor 3144 is mounted on the second vertical telescopic cylinder, and the output end of motor 3144 is connected to the second horizontal telescopic cylinder 3142. Motor 3144 is used to drive the first gripper 3143 to rotate 90°. That is, after the first gripper 3143 grips the skeleton 10, motor 3144 drives the first gripper to rotate 90°, so that the skeleton 10 gripped by the first gripper 3143 rotates 90°, thereby setting the chip mounting slot 11 vertically upward, which facilitates the subsequent process of placing the chip 20 into the chip mounting slot 11.

[0116] The third horizontal telescopic cylinder 3145 is located downstream of the second horizontal telescopic cylinder 3142, and the third horizontal telescopic cylinder 3145 can move along the second direction (e.g., Figure 2 and Figure 5 As shown in the Y direction (the second direction is perpendicular to both the first and vertical directions), the movement is as follows: The telescopic end of the third horizontal telescopic cylinder 3145 is equipped with a third vertical telescopic cylinder 3146, which can move vertically. The lower end of the third vertical telescopic cylinder 3146 is equipped with a second gripper 3147, which is used to grip the skeleton 10 in the first gripper 3143 and move it to the contouring fixture 210 at the first station. In other words, the third horizontal telescopic cylinder 3145 and the third vertical telescopic cylinder 3146 drive the second gripper 3147 to grip the skeleton 10 on the first gripper 3143.

[0117] Furthermore, the telescopic end of the third vertical telescopic cylinder 3146 is provided with two second grippers 3147, and a skeleton fixture 170 is also provided on the worktable 100. The skeleton fixture 170 is used to support, fix, and transfer the skeleton 10. The skeleton fixture 170 is located between the first gripper 3143 and the contouring fixture 210 of the first station. Specifically, the third horizontal telescopic cylinder 3145 and the third vertical telescopic cylinder 3146 drive the two second grippers 3147 to move simultaneously. When the second gripper 3147 close to the first gripper 3143 grabs the skeleton 10 on the first gripper 3143, the second gripper 3147 away from the first gripper 3143 grabs the skeleton 10 from the skeleton fixture 170 and places it in the contouring fixture 210 of the first station, thereby improving the conveying efficiency of the skeleton 10.

[0118] According to another specific embodiment of the present invention, reference is made to... Figure 6 and Figure 7 The chip loading module 400 includes a feeder 420, which is mounted on the worktable 100. The feeder 420 has a chip placement slot 421, used to transport at least two chips 20 to the chip placement slot 421. Since thousands of chips 20 are simultaneously loaded onto a reel when they arrive, and the reel is wrapped in plastic film, the feeder 420 allows the plastic film to be removed from the reel, enabling the chips 20 to be sequentially transported to the chip placement slot 421. Preferably, the chip placement slot 421 accommodates at least two chips 20 simultaneously to improve assembly efficiency. Furthermore, two detection elements 422 can be provided on the upper part of the chip placement slot 421 to detect whether two chips 20 are present simultaneously in the chip placement slot 421. Those skilled in the art will understand that the detection elements 422 can be sensors capable of detecting the presence of objects, such as infrared sensors, photoelectric sensors, distance sensors, and gravity sensors.

[0119] Further reference Figure 6 and Figure 7 The workbench 100 is provided with a first fixed seat 110 and a second fixed seat 120 in sequence. The first fixed seat 110 is provided with a first chip fixture 111, and the second fixed seat 120 is provided with a second chip fixture 121. Both the first chip fixture 111 and the second chip fixture 121 are provided with chip fixing grooves (not shown in the figure). The shape of the chip fixing grooves is adapted to the shape of the incoming chip. The first chip fixture 111 and the second chip fixture 121 are used to fix two chips 20. The second moving mechanism 410 includes: a mounting plate 411, a first transfer assembly 412, a second transfer assembly 413, and a third transfer assembly 414.

[0120] The mounting plate 411 is mounted on the worktable 100 and can slide along a first direction. A first transfer assembly 412, a second transfer assembly 413, and a third transfer assembly 414 are sequentially mounted on the mounting plate 411. When the mounting plate 411 moves along the first direction, the first transfer assembly 412, the second transfer assembly 413, and the third transfer assembly 414 move synchronously with the mounting plate 411 to move the two chips 20 in the chip placement slot 421 step-by-step onto the skeleton 10 in the contouring fixture 210 of the second station.

[0121] Specifically, the first transfer assembly 412 includes two third grippers 4121, which are used to grip two chips 20 in the chip placement slot 421 and move them into the first chip fixture 111. The second transfer assembly 413 includes two fourth grippers 4131, which are used to grip two chips 20 in the first chip fixture 111 and move them into the second chip fixture 121. The third transfer assembly 414 includes two negative pressure suction nozzles 4141, which are used to pick up two chips 20 in the second chip fixture 121 and move them onto the skeleton 10 in the contour fixture 210 of the second station.

[0122] Those skilled in the art will understand that the negative pressure nozzle 4141 can be connected to a negative pressure system through a negative pressure pipeline, and a solenoid valve can be installed on the negative pressure pipeline to control the suction action of the negative pressure nozzle 4141. The above are conventional technologies, and this application will not elaborate on them further.

[0123] According to another specific embodiment of the present invention, reference continues to be made. Figure 6 and Figure 7 The first transplanting assembly 412 also includes a fourth vertical telescopic cylinder 4122 disposed on the mounting plate 411, and two third grippers 4121 disposed at the telescopic ends of the fourth vertical telescopic cylinder 4122. The fourth vertical telescopic cylinder 4122 is used to drive the two third grippers 4121 to move in the vertical direction.

[0124] The second transplanting assembly 413 also includes a fifth vertical telescopic cylinder 4132 mounted on the mounting plate 411. The telescopic end of the fifth vertical telescopic cylinder 4132 is connected to a fourth horizontal telescopic cylinder 4133, and two fourth grippers 4131 are located at the telescopic end of the fourth horizontal telescopic cylinder 4133. The fifth vertical telescopic cylinder 4132 is used to drive the two fourth grippers 4131 to move vertically, and the fourth horizontal telescopic cylinder 4133 is used to drive the two fourth grippers 4131 to move in a second direction.

[0125] The third transplanting assembly 414 also includes a sixth vertical telescopic cylinder 4142 disposed on the mounting plate 411. The telescopic end of the sixth vertical telescopic cylinder 4142 is provided with two negative pressure suction nozzles 4141. The sixth vertical telescopic cylinder 4142 is used to drive the two negative pressure suction nozzles 4141 to move in the vertical direction.

[0126] Furthermore, since the pin orientation of the chip 20 is exactly opposite to that of the pin orientation of the frame 10 when the chip arrives, a first horizontal rotary cylinder 112 is connected to the bottom of the first fixing base 110. The first horizontal rotary cylinder 112 is used to rotate the first chip fixture 111 by 180°, thereby rotating the two chips 20 in the first chip fixture 111 by 180° so that the pin orientation of the chip 20 is the same as that of the pin orientation of the frame 10. Also, since the pins of the chip 20 are relatively long when the chip arrives, a cutting assembly 130 is provided above the second fixing base 120. The cutting assembly 130 is provided with four cutters 131. The cutting assembly 130 can move vertically to drive the four cutters 131 to cut the four pins of the chip 20 in the second chip fixture 121, so that the pin length of the chip 20 matches the pin length of the frame 10, which facilitates the subsequent process of soldering the pins of the chip 20 to the pins of the frame 10.

[0127] refer to Figure 6 and Figure 7 The specific working process of the chip loading module 400 is as follows:

[0128] First, the first transfer assembly 412 moves as follows: When there are two chips 20 in the chip placement slot 421, the fourth vertical telescopic cylinder 4122 drives the two third grippers 4121 to move vertically upwards, and moves to the right along the first direction under the influence of the mounting plate 411. When the two third grippers 4121 move above the chip placement slot 421, the fourth vertical telescopic cylinder 4122 drives the two third grippers 4121 to move downwards vertically, so that the two third grippers 4121 respectively grip the two chips 20 in the chip placement slot 421. Then, the fourth vertical telescopic cylinder 4122 drives the two third grippers 4121 to move vertically upwards, and moves to the left along the first direction under the influence of the mounting plate 411, so that the two third grippers 4121 move above the first chip fixture 111. Subsequently, the fourth vertical telescopic cylinder 4122 drives the two third grippers 4121 to move downwards in the vertical direction, so that the two third grippers 4121 respectively place the two chips 20 into the first chip fixture 111. After this, the first horizontal rotary cylinder 112 drives the first fixed base 110 to rotate 180°, so that the two chips 20 in the first chip fixture 111 rotate 180°, so that the pin orientation of the chip 20 is the same as the pin orientation of the frame 10.

[0129] Simultaneously with the operation of the first transfer assembly 412, the second transfer assembly 413 operates at the same time. The specific working process of the second transfer assembly 413 is as follows: the fifth vertical telescopic cylinder 4132 drives the two fourth grippers 4131 to move vertically upwards, and under the influence of the mounting plate 411, moves to the right along a first direction. When the two fourth grippers 4131 move above the first chip fixture 111, the fifth vertical telescopic cylinder 4132 drives the two fourth grippers 4131 to move vertically downwards, so that the two fourth grippers 4131 respectively grip the two chips 20 in the first chip fixture 111. Afterwards, the fifth vertical telescopic cylinder 4132 drives the two fourth grippers 4131 to move vertically upwards, and under the influence of the mounting plate 411, moves to the left along a first direction, so that the two fourth grippers 4131 move above the second chip fixture 121. Subsequently, the fifth vertical telescopic cylinder 4132 drives the two fourth grippers 4131 to move downwards in the vertical direction, so that the two fourth grippers 4131 respectively place the two chips 20 into the second chip fixture 121. After this, the cutting assembly 130 moves downwards in the vertical direction to cut the pins of the chips 20 in the second chip fixture 121, and then the cutting assembly 130 moves upwards to reset.

[0130] Simultaneously with the operation of the first transfer assembly 412 and the second transfer assembly 413, the third transfer assembly 414 operates synchronously. The specific working process of the third transfer assembly 414 is as follows: the sixth vertical telescopic cylinder 4142 drives the two negative pressure suction nozzles 4141 to move vertically upwards, and under the influence of the mounting plate 411, moves to the right along the first direction. When the two negative pressure suction nozzles 4141 move above the first chip fixture 111, the sixth vertical telescopic cylinder 4142 drives the two negative pressure suction nozzles 4141 to move vertically downwards, so that the two fourth grippers 4131 respectively grip the two chips 20 in the second chip fixture 121. Afterwards, the sixth vertical telescopic cylinder 4142 drives the two negative pressure suction nozzles 4141 to move vertically upwards, and under the influence of the mounting plate 411, moves to the left along the first direction, so that the two negative pressure suction nozzles 4141 move above the second chip fixture 121. Then, the sixth vertical telescopic cylinder 4142 drives the two negative pressure suction nozzles 4141 to move downward in the vertical direction, so that the two negative pressure suction nozzles 4141 respectively place the two chips 20 onto the skeleton 10 in the second chip tooling 121.

[0131] According to another specific embodiment of the present invention, reference continues to be made. Figure 7The chip loading module 400 also includes a first pressure plate 430, which is located above the second station. The first pressure plate 430 can move vertically to bring the negative pressure suction nozzle 4141 into contact with the two chips 20 in the contouring fixture 210 located at the second station and apply a downward force to the two chips 20, so that the two chips 20 in the contouring fixture 210 located at the second station are at least partially pressed into the two corresponding chip mounting slots 11. In this embodiment, the movement of the first pressure plate 430 can be driven by a vertical cylinder, or by a hydraulic cylinder, connecting rod, lead screw, or other structures; this application does not limit this.

[0132] By adopting the above technical solution, by setting the first pressure plate 430, at least a portion of the two chips 20 can be installed in the two chip mounting slots 11 at the second station, preventing the two chips 20 from detaching from the frame 10 due to centrifugal force or other reasons when the turntable 200 rotates to the third station, thereby improving the reliability of the device.

[0133] According to another specific embodiment of the present invention, reference is made to... Figure 8 The press-fit module 500 also includes: a sixth horizontal telescopic cylinder 520, a positioning rod 530, and a seventh vertical telescopic cylinder 540.

[0134] The sixth horizontal telescopic cylinder 520 is mounted on the worktable 100 and can move along the first direction. A positioning rod 530 is located at the telescopic end of the sixth horizontal telescopic cylinder 520. The sixth horizontal telescopic cylinder 520 drives the positioning rod 530 to move along the first direction, so that the end of the positioning rod 530 contacts the sensing heads 21 of the two chips 20 in the contouring fixture 210 of the third station, thereby axially positioning the chips 20 so that the chips 20 are installed axially with the frame 10.

[0135] The seventh vertical telescopic cylinder 540 is mounted on the worktable 100. The telescopic end of the seventh vertical telescopic cylinder 540 is equipped with a pressure head 510. The seventh vertical telescopic cylinder 540 is used to drive the pressure head 510 to move in the vertical direction, so as to apply a downward force to the two chips 20 in the contour tooling 210 of the third station, so that the two chips 20 are completely pressed into the two chip mounting slots 11 respectively, thereby realizing the mechanical assembly of the skeleton 10 and the chip 20.

[0136] According to another specific embodiment of the present invention, reference is made to... Figure 9The third moving mechanism 600 includes a seventh horizontal telescopic cylinder 610 and an eighth vertical telescopic cylinder 620. The seventh horizontal telescopic cylinder 610 is mounted on the worktable 100 and can move along a first direction. Preferably, since the fourth and fifth workstations are far apart, the stroke of a single seventh horizontal telescopic cylinder 610 is insufficient. Therefore, in this embodiment, two seventh horizontal telescopic cylinders 610 are provided, connected together, and move synchronously along the first direction. The eighth vertical telescopic cylinder 620 is located at the telescopic end of the seventh horizontal telescopic cylinder 610 and can move vertically. The telescopic end of the eighth vertical telescopic cylinder 620 is provided with a fifth gripper 630. The seventh horizontal telescopic cylinder 610 and the eighth vertical telescopic cylinder 620 drive the fifth gripper 630 to move the skeleton 10 and the two chips 20 in the contouring fixture 210 of the fourth workstation to the contouring fixture 210 of the fifth workstation. In other words, the third moving mechanism 600 realizes the transfer of the mechanically assembled skeleton 10 and the two chips 20 from the fourth station to the fifth station.

[0137] According to another specific embodiment of the present invention, reference continues to be made. Figure 9 The assembly device also includes a first housing 140, a first inspection mechanism 150, and a control module (not shown in the figure). The first housing 140 is located on the workbench 100 and near the fourth workstation, and is used to hold the skeleton 10 and chips 20 that have failed mechanical assembly quality tests. The first inspection mechanism 150 is located at the fourth workstation, with its inspection end facing downwards. The first inspection mechanism 150 is used to perform mechanical assembly quality inspection on the skeleton 10 and the two chips 20 in the contouring fixture 210 located below it at the fourth workstation.

[0138] The control module is electrically connected to the first detection mechanism 150, which sends a first signal indicating that the mechanical assembly quality is acceptable and a second signal indicating that the mechanical assembly quality is unacceptable to the control module. When the first detection mechanism 150 sends the first signal to the control module, the control module controls the fifth gripper 630 to grasp the skeleton 10 and two chips 20 in the contouring fixture 210 at the fourth station and move them to the fifth station, so that the welding module 700 at the fifth station can perform pin welding on the skeleton 10 and the two chips 20. When the first detection mechanism 150 sends the second signal to the control module, the control module controls the fifth gripper 630 to grasp the skeleton 10 and the two chips 20 at the fourth station and move them into the first housing 140, thereby collecting the skeleton 10 and chips 20 that are unacceptable in terms of mechanical assembly quality.

[0139] In this embodiment, the first detection mechanism 150 can be a commonly used image detection module such as an AI camera or a CCD detection module. The first detection mechanism 150 can compare the captured mechanical assembly quality pixels with standard assembly pixels to automatically check the mechanical assembly quality of the skeleton 10 and the two chips 20.

[0140] According to another specific embodiment of the present invention, reference is made to... Figure 10 The welding module 700 also includes a third fixing base 720 and a second pressure plate 730. The third fixing base 720 is mounted on the worktable 100 and has at least one contouring fixture 210 for receiving the skeleton 10 and chip 20 transported from the fourth station. A welding machine 710 is positioned above the third fixing base 720, with its welding end facing downwards, facilitating the emission of a welding laser towards the pins of the skeleton 10 and chip 20 below it, thereby welding the pins of the skeleton 10 and chip 20. The second pressure plate 730 is positioned between the welding machine 710 and the third fixing base 720. The second pressure plate 730 is movable in a first direction and a vertical direction, and it applies a downward force to the two chips 20 in the contouring fixture 210 below it, causing the pins of the skeleton 10 to contact the pins of the two chips 20.

[0141] Furthermore, the second pressure plate 730 is provided with a welding window (not shown in the figure) to facilitate observation of whether the pins of the skeleton 10 are in contact with the pins of the two chips 20. When it is observed through the welding window that the pins of the skeleton 10 are in contact with the pins of the two chips 20, the welding machine 710 welds the pins of the skeleton 10 to the pins of the two chips 20 to achieve a conductive connection between the skeleton 10 and the chips 20.

[0142] According to another specific embodiment of the present invention, reference is made to... Figure 10 The fifth station has two contouring fixtures 210. A contouring fixture 210 is provided at both the first and second ends of the third fixed base 720. The welding machine 710 and the second pressure plate 730 are positioned near the first end of the third fixed base 720. The welding module 700 also includes a second horizontal rotary cylinder 740 and a second inspection mechanism 750. The second horizontal rotary cylinder 740 is located between the worktable 100 and the third fixed base 720, and is used to rotate the third fixed base 720 180°. The second inspection mechanism 750 is located above the second end of the third fixed base 720, with its inspection end facing downwards. The second inspection mechanism 750 is used to inspect the welding quality of the skeleton 10 chip 20 assembly located in the contouring fixture 210 below it.

[0143] In other words, after the skeleton 10 and chip 20 in the contouring fixture 210 at the first end of the third fixed seat 720 are welded, the second pressure plate 730 moves away from one of the contouring fixtures 210 on the third fixed seat 720 along the first direction and the vertical direction to avoid it, so that the second horizontal rotary cylinder 740 can drive the third fixed seat 720 to rotate 180°, so that the contouring fixtures 210 at the first end and the second end of the third fixed seat 720 can interchange positions, so that the second detection mechanism 750 can detect the welding quality of the skeleton 10 and chip 20 in the contouring fixture 210 at the first end of the third fixed seat 720.

[0144] Figure 11 This diagram illustrates the structure of the feeding module 800 in an embodiment of the present invention. Figure 1 , Figure 12 This diagram illustrates the structure of the feeding module 800 in an embodiment of the present invention. Figure 2 According to another specific embodiment of the present invention, refer to Figure 11 and Figure 12 The unloading module 800 includes: a servo motor module 810, a ninth vertical telescopic cylinder 820, a third horizontal rotary cylinder 830, an eighth horizontal telescopic cylinder 840, and a sixth gripper 850.

[0145] The servo motor module 810 is mounted on the worktable 100 and can move along the first direction. A ninth vertical telescopic cylinder 820 is mounted on the servo motor module 810 and moves along the first direction along with the servo motor module 810, while also being able to move vertically. A third horizontal rotary cylinder 830 is located at the telescopic end of the ninth vertical telescopic cylinder 820 and can rotate horizontally. An eighth horizontal telescopic cylinder 840 is located at the lower end of the third horizontal rotary cylinder 830, and its telescopic end is equipped with a sixth gripper 850. The sixth gripper 850 is used to grip the skeleton chip assembly at the second end of the third fixed base 720 and move it to the qualified product placement position 861 or the second housing 160.

[0146] According to another specific embodiment of the present invention, reference continues to be made. Figure 11 and Figure 12The assembly device also includes a second housing 160, which is located on the workbench 100 and near the sixth work station. The second housing 160 is used to hold the skeleton 10 and chip 20 that have failed the welding assembly quality test. The control module is also electrically connected to the second detection mechanism 750, which is used to send a third signal indicating that the welding quality is acceptable and a fourth signal indicating that the welding quality is unacceptable to the control module. When the second detection mechanism 750 sends the third signal to the control module, the control module controls the sixth gripper 850 to grasp the skeleton chip assembly in the contour tooling 210 at the second end of the third fixed base 720 and move it to the acceptable product placement position 861. When the second detection mechanism 750 sends the fourth signal to the control module, the control module controls the sixth gripper 850 to grasp the skeleton chip assembly in the contour tooling 210 at the second end of the third fixed base 720 and move it into the second housing 160.

[0147] According to another specific embodiment of the present invention, the unloading module 800 further includes: a placement plate 860, a ninth horizontal telescopic cylinder 870, and a push plate 880. The placement plate 860 is slidably disposed on the worktable 100, extends along a second direction, and has a qualified product placement position 861 for temporarily storing qualified skeleton chip assemblies. The ninth horizontal telescopic cylinder 870 is disposed on the placement plate 860 and is movable along the second direction. The push plate 880 is connected to the telescopic end of the ninth horizontal telescopic cylinder 870, and the ninth horizontal telescopic cylinder 870 drives the push plate 880 to move along the second direction to push the skeleton chip assembly in the qualified product placement position 861 into the qualified product material tube for storage.

[0148] According to another specific embodiment of the present invention, the feeding module 800 further includes a feeding assembly 890, which is disposed downstream of the qualified product placement position 861 along the second direction. The feeding assembly 890 is provided with a qualified product tube receiving groove 891, in which a qualified product tube (not shown in the figure) is disposed. Further, the qualified product tube is provided with an opening facing the qualified product placement position 861, so that the qualified skeleton chip assembly can be smoothly pushed into the qualified product tube under the pushing action of the pusher plate 880.

[0149] By adopting the above technical solution, and by setting up the unloading module 800 and the unloading component 890, qualified skeleton chip assemblies can be automatically loaded into qualified product tubes, preventing the qualified skeleton chip assemblies from being placed in a disorderly manner, and facilitating the next stage of injection molding with bushings to form a wheel speed sensor. At the same time, skeleton chip assemblies with unqualified welding quality can also be automatically clamped directly into the second box 160 for storage, so as to facilitate centralized management, prevent on-site chaos, and reduce the labor intensity of workers.

[0150] The skeleton chip assembly apparatus disclosed in this invention can automatically feed two chips 20 to the skeleton 10 using the chip feeding module 400, thereby solving the problem that the chips 20 are small and difficult to handle. In addition, the processes of feeding the skeleton 10, feeding the chips 20, mechanically assembling the skeleton 10 and the chips 20, soldering the pins of the skeleton 10 and the chips 20, and unloading the product are all automated. Compared with manual assembly, it can shorten the assembly time, improve the assembly efficiency, and reduce the labor intensity of workers.

[0151] While the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the invention to these descriptions. Various changes in form and detail can be made by those skilled in the art, including several simple deductions or substitutions, without departing from the spirit and scope of the invention.

Claims

1. An assembly device for a skeleton chip assembly, wherein the skeleton is provided with two chip mounting slots, the chip mounting slots being used to mount chips, characterized in that, The assembly device includes a worktable, a turntable, and a skeleton feeding module, a chip feeding module, a pressing module arranged around the turntable, as well as a third moving mechanism and a welding module provided on the worktable. The workbench is provided with a first workstation, a second workstation, a third workstation, a fourth workstation, and a fifth workstation in sequence; The turntable is rotatably connected above the worktable. The turntable has at least one contouring fixture with a skeleton receiving groove. The shape of the skeleton receiving groove matches the shape of the skeleton. The turntable can rotate relative to the worktable, causing the contouring fixture to switch between the first station and the fourth station, so that the contouring fixture moves to the bottom of the skeleton feeding module, the chip feeding module and the pressing module respectively. A skeleton feeding module, the skeleton feeding module including a first moving mechanism, the first moving mechanism being used to feed the skeleton to the contouring tooling located below it; The chip loading module includes a second moving mechanism, which is capable of moving along a first direction and is used to transport two chips to the contouring fixture located below it. The pressing module includes a pressing head that is movable in a vertical direction. The pressing head is used to apply pressure to two chips in the contouring fixture located below it, so as to press the two chips into the chip mounting slot. A third moving mechanism is located between the fourth station and the fifth station. The third moving mechanism is capable of moving along the first direction to move the skeleton and the two chips from the fourth station to the fifth station. A welding module is located at the fifth workstation. The welding module includes a welding machine, which is located above the worktable. The welding machine is used to weld the skeleton and two chips located below it to form the skeleton-chip assembly.

2. The assembly apparatus for the skeleton chip assembly as described in claim 1, characterized in that, The workbench is also provided with a sixth station, which is located downstream of the fifth station; the assembly device also includes a material unloading module located at the sixth station, which is used to pick up the skeleton chip assembly on the fifth station.

3. The assembly apparatus for the skeleton chip assembly as described in claim 1, characterized in that, The turntable is provided with four contouring fixtures, which are equally spaced along the circumference of the turntable; one contouring fixture is provided for each of the first, second, third, and fourth workstations. The workbench is also equipped with a turntable drive mechanism. The drive end of the turntable drive mechanism is connected to the turntable. The turntable drive mechanism drives the turntable to rotate intermittently so that the turntable stops for a set time after rotating a preset angle.

4. The assembly apparatus for the skeleton chip assembly as described in claim 3, characterized in that, The skeleton feeding module further includes a skeleton placement component, which is disposed on the workbench. The skeleton placement component is used to place the skeleton, and the lower end of the skeleton placement component is provided with a skeleton discharge port. The first moving mechanism is used to receive the skeleton in the skeleton discharge port and move it to the contouring fixture located at the first work station.

5. The assembly apparatus for the skeleton chip assembly as described in claim 4, characterized in that, Multiple skeletons are disposed in vertical skeleton tubes open at both ends. The skeleton placement assembly has a vertical skeleton tube receiving groove extending along the vertical direction. The vertical skeleton tubes are disposed in the vertical skeleton tube receiving groove. The lower end of the skeleton placement assembly has a skeleton outlet. The first moving mechanism includes: A first horizontal telescopic cylinder is disposed on the worktable, and the first horizontal telescopic cylinder can move along the first direction; The first vertical telescopic cylinder is connected to the telescopic end of the first horizontal telescopic cylinder. The telescopic end of the first vertical telescopic cylinder is provided with a receiving plate. The receiving plate is provided with a skeleton receiving groove, which is used to receive the skeleton at the skeleton discharge port. A first clamping component is disposed between the skeleton receiving groove and the contouring fixture at the first station. The first clamping component is used to clamp the skeleton in the skeleton receiving groove and move it into the contouring fixture at the first station.

6. The assembly apparatus for the skeleton chip assembly as described in claim 5, characterized in that, The first gripping component includes: The second vertical telescopic cylinder is located downstream of the frame receiving groove along the first direction; The second horizontal telescopic cylinder is connected to the telescopic end of the second vertical telescopic cylinder. The second horizontal telescopic cylinder can move along the first direction and its telescopic end is provided with a first gripper. The first gripper is used to grip the skeleton in the skeleton receiving groove. A motor is mounted on the second vertical telescopic cylinder, and the output end of the motor is connected to the second horizontal telescopic cylinder. The motor is used to drive the first gripper to rotate 90°. A third horizontal telescopic cylinder is located downstream of the second horizontal telescopic cylinder. The third horizontal telescopic cylinder extends along a second direction. The telescopic end of the third horizontal telescopic cylinder is provided with a third vertical telescopic cylinder. The telescopic end of the third vertical telescopic cylinder is provided with a second gripper. The second gripper is used to move the skeleton in the first gripper to the contouring fixture at the first workstation.

7. The assembly apparatus for the skeleton chip assembly as described in claim 1, characterized in that, The chip loading module includes a feeder, which is disposed on the worktable. The feeder is used to transport at least two chips to the chip placement slot. The workbench is provided with a first fixed seat and a second fixed seat in sequence. The first fixed seat is provided with a first chip fixture, which is used to fix two chips. The bottom of the first fixed seat is connected to a first horizontal rotary cylinder, which is used to rotate the two chips in the first chip fixture by 180°. The second fixing base is provided with a second chip fixture, which is used to fix two chips; a cutting component is provided above the second fixing base, which can move vertically to cut the pins of each chip in the second chip fixture; The second moving mechanism includes: A mounting plate is disposed on the workbench, and the mounting plate is slidable along the first direction; a first transplanting component, a second transplanting component, and a third transplanting component are sequentially disposed on the mounting plate, and the first transplanting component, the second transplanting component, and the third transplanting component move synchronously with the mounting plate; wherein... The first transfer assembly includes two third grippers, which are respectively used to grip two chips in the chip placement slot and move them into the first chip fixture; The second transfer assembly includes two fourth grippers, which are used to grip two chips in the first chip fixture and move them to the second chip fixture; The third transfer assembly includes two negative pressure suction nozzles, which are used to pick up two chips from the second chip fixture and move them to the skeleton in the contouring fixture of the second station.

8. The assembly apparatus for the skeleton chip assembly as described in claim 7, characterized in that, The first transplanting assembly also includes a fourth vertical telescopic cylinder disposed on the mounting plate, and two third grippers are disposed on the telescopic end of the fourth vertical telescopic cylinder; The second transplanting assembly also includes a fifth vertical telescopic cylinder disposed on the mounting plate, the telescopic end of the fifth vertical telescopic cylinder being connected to a fourth horizontal telescopic cylinder, and two fourth grippers being disposed on the telescopic end of the fourth horizontal telescopic cylinder. The third transplanting assembly also includes a sixth vertical telescopic cylinder mounted on the mounting plate, and two negative pressure suction nozzles are located at the telescopic ends of the sixth vertical telescopic cylinder.

9. The assembly apparatus for the skeleton chip assembly as described in claim 8, characterized in that, The chip loading module also includes a first pressure plate, which is located above the second station. The first pressure plate can move vertically to drive the negative pressure suction nozzle to press at least partially the two chips in the contouring fixture located at the second station into the two corresponding chip mounting slots.

10. The assembly apparatus for the skeleton chip assembly as described in claim 1, characterized in that, The press-fit module also includes: A sixth horizontal telescopic cylinder is provided on the worktable, and the sixth horizontal telescopic cylinder can move along the first direction; A positioning rod is provided at the telescopic end of the sixth horizontal telescopic cylinder. The sixth horizontal telescopic cylinder drives the positioning rod to move along the first direction so that the end of the positioning rod contacts the ends of the two chips in the contouring fixture of the third station. A seventh vertical telescopic cylinder is provided on the worktable. The telescopic end of the seventh vertical telescopic cylinder is provided with the pressure head. The pressure head is used to apply a downward force to the two chips in the contouring fixture of the third station, so that the two chips are pressed into the two chip mounting slots respectively.

11. The assembly apparatus for the skeleton chip assembly as described in claim 2, characterized in that, The fifth workstation is equipped with at least one of the aforementioned contouring fixtures, and the third moving mechanism includes: A seventh horizontal telescopic cylinder is provided on the worktable, and the seventh horizontal telescopic cylinder can move along the first direction; The eighth vertical telescopic cylinder is located at the telescopic end of the seventh horizontal telescopic cylinder. The telescopic end of the eighth vertical telescopic cylinder is provided with a fifth gripper. The fifth gripper is used to move the skeleton and the two chips in the contouring fixture of the fourth station to the contouring fixture of the fifth station.

12. The assembly apparatus for the skeleton chip assembly as described in claim 11, characterized in that, Also includes: The first housing is disposed on the workbench and is located near the fourth workstation; A first inspection mechanism is located at the fourth workstation, with its inspection end facing downwards. The first inspection mechanism is used to inspect the assembly quality of the skeleton and the two chips in the contouring fixture at the fourth workstation. A control module is electrically connected to the first detection mechanism, and the first detection mechanism is used to send a first signal and a second signal to the control module. When the first detection mechanism sends the first signal to the control module, the control module controls the fifth gripper to grasp the skeleton and the two chips on the fourth station and move them to the fifth station; When the first detection mechanism sends the second signal to the control module, the control module controls the fifth gripper to grasp the skeleton and the two chips on the fourth station and move them into the first housing.

13. The assembly apparatus for the skeleton chip assembly as described in claim 12, characterized in that, The welding module includes: A third fixed base is provided on the workbench, and at least one of the contouring fixtures is provided on the third fixed base; the welding machine is located above the third fixed base; The second pressure plate is disposed between the welding machine and the third fixed base. The second pressure plate is movable along the first direction and the vertical direction. The second pressure plate is capable of applying a downward force to the two chips in the contouring fixture located below it, so that the pins of the skeleton contact the pins of the two chips.

14. The assembly apparatus for the skeleton chip assembly as described in claim 13, characterized in that, The fifth station has two contouring fixtures, and each of the first and second ends of the third fixed base is provided with one contouring fixture. The welding machine and the second pressure plate are located near the first end of the third fixed base. The welding module also includes: The second horizontal rotary cylinder is located between the worktable and the third fixed seat. The second horizontal rotary cylinder is used to drive the third fixed seat to rotate 180°. The second inspection mechanism is located above the second end of the third fixed base, with the inspection end of the second inspection mechanism facing downward. The second inspection mechanism is used to inspect the welding quality of the skeleton chip assembly in the contouring fixture located below it.

15. The assembly apparatus for the skeleton chip assembly as described in claim 14, characterized in that, The feeding module includes: A servo motor module is mounted on the worktable, and the servo motor module is capable of moving along the first direction; The ninth vertical telescopic cylinder is mounted on the servo motor module; The third horizontal rotary cylinder is located at the extension end of the ninth vertical telescopic cylinder; The eighth horizontal telescopic cylinder is located at the lower end of the third horizontal rotary cylinder. The telescopic end of the eighth horizontal telescopic cylinder is provided with a sixth gripper. The sixth gripper is used to grip the skeleton chip assembly at the second end of the third fixed seat and move it to the qualified product placement position or the second box.

16. The assembly apparatus for the skeleton chip assembly as described in claim 15, characterized in that, The assembly device further includes: The second housing is located on the workbench and near the sixth workstation. The control module is also electrically connected to the second detection mechanism, which is used to send a third signal and a fourth signal to the control module. When the second detection mechanism sends the third signal to the control module, the control module controls the sixth gripper to grasp the skeleton chip assembly in the contouring fixture at the second end of the third fixed base and move it to the qualified product placement position. When the second detection mechanism sends the fourth signal to the control module, the control module controls the sixth gripper to grasp the skeleton chip assembly in the contouring tooling at the second end of the third fixed base and move it into the second housing.

17. The assembly apparatus for the skeleton chip assembly as described in claim 16, characterized in that, The feeding module also includes: A placement plate is provided on the workbench, the placement plate extends along a second direction, the second direction is perpendicular to both the first direction and the vertical direction, and the placement plate is provided with a qualified product placement position; A ninth horizontal telescopic cylinder is disposed on the placement plate, and the ninth horizontal telescopic cylinder is capable of moving along the second direction; The push plate is connected to the telescopic end of the ninth horizontal telescopic cylinder. The ninth horizontal telescopic cylinder drives the push plate to move along the second direction to push the skeleton chip assembly in the qualified product placement position into the qualified product material tube.

18. The assembly apparatus for the skeleton chip assembly as described in claim 17, characterized in that, The feeding module also includes: The feeding assembly is located downstream of the qualified product placement position along the second direction. The feeding assembly is provided with a qualified product material tube receiving groove, and the qualified product material tube is located in the qualified product material tube receiving groove. The opening of the qualified product material tube faces the qualified product placement position.

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