Photocatalysis-assisted ultrasonic atomization chemical mechanical polishing equipment and polishing method

Abstract

The invention discloses photocatalysis-assisted ultrasonic atomization chemical mechanical polishing equipment and a polishing method. The photocatalysis-assisted ultrasonic atomization chemical mechanical polishing equipment comprises a base and a cover body provided with an equipment sealing door, an ultrasonic atomization liquid applying module, a photocatalysis auxiliary module, a multi-degree-of-freedom polishing execution module and a self-adaptive control module are arranged in the cover body. The ultrasonic atomization module is used for atomizing a polishing solution containing a photocatalyst into micron-sized liquid drops and uniformly spraying the micron-sized liquid drops to the surface of a workpiece; the photocatalysis module excites the photocatalysis reaction of the polishing solution through irradiation of light beams with specific wavelengths, and the chemical effect is enhanced. The multi-degree-of-freedom execution module comprises a multi-degree-of-freedom main shaft, a three-jaw clamping structure and a grinding barrel, and workpiece clamping and controllable grinding are achieved. The self-adaptive control module integrates a laser scanning system, a CCD monitoring system and a master control system, the morphology and the process state of a workpiece are obtained in real time, the master control system dynamically coordinates parameters of all the modules, and closed-loop self-adaptive control over the polishing process is achieved. The polishing device is suitable for efficient and high-quality polishing of complex curved surface workpieces.

Description

Technical Field

[0001] This invention relates to the field of machining equipment, specifically a photocatalytic-assisted ultrasonic atomization chemical mechanical polishing device and polishing method. Background Technology

[0002] In modern manufacturing, ultra-precision machining technology plays a crucial role, especially in fields such as aerospace, electronic information, and optical instruments, where extremely high requirements are placed on the precision and surface quality of components.

[0003] Chemical mechanical polishing (CMP) is widely considered the ideal method for planarizing hard and brittle materials. It achieves uniform material removal through a combination of chemical reaction and mechanical grinding, resulting in high processing efficiency while maintaining global planarization. Traditional CMP technology has been widely used in semiconductor manufacturing, optical component processing, and other fields. However, with increasingly demanding requirements for polishing precision and efficiency, traditional CMP technology faces problems such as poor polishing uniformity and low material removal rates. Therefore, developing new polishing equipment and methods has become an important industry need.

[0004] Traditional surface polishing machines mostly use multi-point pneumatic pressurization, which can make the load plate evenly stressed, but controlling the speed of the polishing plate becomes a key challenge during the polishing process. When the polishing disc rotates at a low speed, the mechanical force provided by the abrasive is insufficient, which will result in more corrosion defects on the material surface. As the polishing disc rotates at a higher speed, the centrifugal force increases, and the abrasive in the mist is unevenly distributed between the polishing interfaces, which can easily lead to defects such as scratches and corrosion pits at the same time, thus reducing the surface quality.

[0005] Furthermore, when the rotation speed is too high, the number of abrasive grains participating in grinding per unit time increases, the mechanical action is enhanced, but the chemical action is not improved. The balance between the two is broken, which will lead to an increase in scratches and defects on the material surface, thus increasing its surface roughness.

[0006] Therefore, in order to overcome the inherent limitations of traditional chemical mechanical polishing in terms of uniformity, efficiency and process control balance, and to respond to the needs of green manufacturing, there is an urgent need for a polishing equipment and polishing method that can achieve precision, high efficiency, high quality, controllability and environmental protection. Summary of the Invention

[0007] The purpose of this invention is to address the shortcomings of existing technologies by providing a photocatalytically assisted ultrasonic atomization chemical mechanical polishing device and method. This method utilizes an ultrasonic atomization device to achieve uniform distribution of polishing slurry and abrasive particles at the polishing interface, solving problems such as uneven slurry distribution, large consumption, high waste rate, and environmental unfriendliness in traditional surface polishing machines. Furthermore, photocatalytic technology enhances the chemical reactivity of the polishing slurry, improving material removal rate. By combining the dual effects of physical grinding and chemical corrosion, this invention achieves efficient and high-quality polishing of complex curved workpieces.

[0008] The technical objective of this invention is achieved through the following technical solution: A photocatalytically assisted ultrasonic atomization chemical mechanical polishing device includes a base and a housing with a sealed door. The housing houses an ultrasonic atomization liquid application module, a photocatalytic assistance module, a multi-degree-of-freedom polishing execution module, and an adaptive control module. The ultrasonic atomization liquid application module atomizes a polishing liquid containing a photocatalyst into micron-sized droplets and sprays them onto the workpiece surface. The photocatalytic assistance module irradiates the workpiece surface and the polishing liquid droplets with a beam of a specific wavelength to excite a photocatalytic reaction. The multi-degree-of-freedom polishing execution module includes a multi-degree-of-freedom spindle, a three-jaw clamping structure disposed at the end of the multi-degree-of-freedom spindle, and an independently moving grinding barrel. The three-jaw clamping structure is positioned above the grinding barrel. The spindle drives the workpiece to achieve multi-axis linkage spatial motion. The grinding barrel contains abrasive and provides relative grinding motion with the workpiece surface. The adaptive control module includes a laser scanning system for real-time acquisition of the workpiece's three-dimensional morphology, a CCD monitoring system for monitoring the polishing process, and a central control system for data processing and collaborative control. The central control system is communicatively connected to the ultrasonic atomization liquid application module, the photocatalytic auxiliary module, and the multi-degree-of-freedom polishing execution module. Based on the information fed back from the laser scanning system and the CCD monitoring system, the central control system dynamically controls the operating parameters of the ultrasonic atomization liquid application module, the photocatalytic auxiliary module, and the multi-degree-of-freedom polishing execution module to achieve closed-loop adaptive control of the polishing process.

[0009] Preferably, the ultrasonic atomization liquid application module includes a polishing liquid supply device, an ultrasonic generator and atomizing device, and an atomizing nozzle; the polishing liquid supply device is connected to the ultrasonic generator and atomizing device through a polishing liquid delivery pipeline, and the atomizing nozzle is connected to the ultrasonic generator and atomizing device through a polishing liquid atomization pipeline. Furthermore, the atomizing nozzle is positioned towards the clamping center area of ​​the three-claw clamping structure.

[0010] Preferably, the photocatalytic auxiliary module includes a laser and a photocatalytic lamp, the laser and the photocatalytic lamp are connected by a light guide path, and the photocatalytic lamp is positioned towards the clamping center area of ​​the three-claw clamping structure.

[0011] Preferably, the laser scanning system and the CCD monitoring system are a 3D laser scanner and a CCD vision monitoring camera, respectively; the 3D laser scanner is connected to the central control system and is used to scan the 3D morphology of the workpiece and transmit the data to the central control system in real time to generate an initial polishing path and monitor morphology changes; the CCD vision monitoring camera is connected to the central control system and is used to capture and feed back the state image of the polishing area in real time; the central control system receives and fuses the data from the scanner and the camera for analysis and decision-making.

[0012] Preferably, the grinding barrel is driven by a rotating motor, and the speed controller of the rotating motor is communicatively connected to the main control system.

[0013] Preferably, the enclosure is further provided with a temperature and humidity monitoring system, which is communicatively connected to the central control system and is used to monitor the temperature and humidity inside the equipment in real time and feed the data back to the central control system.

[0014] Preferably, the temperature and humidity monitoring system is a temperature and humidity meter.

[0015] Preferably, the base is equipped with a polishing fluid quality detection system and an abrasive grain quality detection system that are connected to the central control system.

[0016] A polishing method using the photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment described above includes the following steps: Step 1: Equipment and Material Preparation Confirm that the equipment power supply and main control system are ready, and check the operation of the core components in sequence. Simultaneously, check that the CCD vision monitoring camera, temperature and humidity monitoring system, and 3D laser scanner are functioning properly. Prepare the polishing slurry according to the process requirements, inject it into the storage tank of the polishing slurry supply device, and confirm that the slurry level is sufficient. Verify the dimensions, shape, and surface condition of the workpiece to be polished to ensure it meets the processing requirements. Step 2: Equipment positioning confirmation Open the equipment's sealed door to ensure there is sufficient operating space inside the equipment to place the workpiece; then check whether the grinding barrel and the multi-degree-of-freedom spindle are in their initial state. Step 3: Workpiece cleaning and clamping Clean the workpiece surface, place the workpiece in the center of the three-jaw clamping structure of the multi-degree-of-freedom spindle, and perform automatic clamping to ensure that the workpiece is firmly fixed and aligned with the center; check the clamping status to prevent loosening or displacement during processing; Step 4: Initial State Scan The workpiece is initially scanned using the aforementioned 3D laser scanner to confirm its initial position and surface condition. Step 5: Enclose the processing environment After confirming that the workpiece is securely installed, close the equipment's sealing door and check the door's airtightness to ensure that there is no leakage of polishing fluid or mist during the processing. Step 6: Set process parameters Input and confirm the process parameters for this machining operation in the central control system, including: polishing time, polishing pressure, multi-degree-of-freedom spindle speed, ultrasonic frequency, wavelength and light intensity of the photocatalytic laser, and supply rate of polishing slurry; after confirming that the parameters are entered correctly, save the settings. Step 7: Start the monitoring system Start the temperature and humidity monitoring system to ensure that the temperature and humidity of the processing environment are within the set range; at the same time, start the CCD vision monitoring camera and the 3D laser scanner to prepare for real-time monitoring of the processing process. Step 8: Start the machining program Turn on the polishing slurry supply device to deliver polishing slurry to the atomizing nozzle; check if the atomizing nozzle is working properly; start the photocatalytic laser, grinding barrel, and multi-degree-of-freedom spindle in sequence to begin the polishing process; Step 9: Process monitoring and dynamic adjustment. The polishing status of the workpiece surface is observed in real time through a CCD vision monitoring camera, and the flatness and smoothness of the workpiece surface are monitored in real time through a 3D laser scanner. Based on the monitoring feedback, the central control system adjusts the polishing pressure, spindle speed, and ultrasonic frequency parameters in real time. If any abnormality is found, processing is immediately suspended and the problem is investigated. Step 10: Completion of processing and removal of workpiece When the polishing time reaches the set value or the workpiece surface reaches the expected finish, stop sequentially: the multi-degree-of-freedom spindle and grinding barrel, the photocatalytic laser, the ultrasonic generator and atomizing nozzle, and the polishing fluid supply device. After the equipment has completely stopped, open the sealed door, release the three-jaw clamping structure, and safely remove the workpiece.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention integrates an ultrasonic generator, atomizing nozzles, a photocatalytic laser, a grinding drum, and a multi-degree-of-freedom spindle, achieving automated operation through a central control system, reducing manual intervention. The CCD monitoring system and laser 3D scanning system can monitor the polishing process in real time and automatically adjust parameters through the central control system, ensuring the stability and controllability of the polishing process. The equipment can record various parameters and monitoring data during processing, facilitating subsequent analysis and optimization, improving production efficiency and product quality. This invention combines physical and chemical processes to achieve efficient polishing of complex workpieces. The grinding drum provides stable physical grinding action, while the photocatalytic laser generates active substances, enhancing the chemical reactivity of the polishing fluid. The synergistic effect of physical grinding and chemical reaction significantly improves polishing efficiency.

[0018] 2. The photocatalytic laser of the present invention generates specific wavelength light that can trigger a photocatalytic reaction in the polishing slurry, generating highly active substances (such as hydroxyl radicals), which can effectively decompose the microscopic unevenness of the workpiece surface and significantly improve the surface finish; the ultrasonic atomization technology ensures that the polishing slurry is evenly distributed on the workpiece surface in the form of tiny particles, avoiding the surface quality problems caused by uneven distribution of polishing slurry in traditional polishing methods, thereby obtaining workpieces with high precision and high surface quality.

[0019] 3. The ultrasonic atomization technology of this invention atomizes the polishing slurry into tiny particles, significantly reducing the amount of polishing slurry used and lowering resource consumption and costs. The active substances generated by the photocatalytic reaction can decompose organic pollutants in the polishing slurry, reducing the emission of harmful substances and minimizing environmental impact. The temperature and humidity monitoring system can monitor the temperature and humidity of the processing environment in real time, ensuring that the polishing process is carried out in an optimal environment and reducing energy waste caused by environmental changes.

[0020] 4. The grinding barrel and multi-degree-of-freedom spindle of this invention provide stable polishing pressure and relative motion, ensuring consistent polishing results for each process. The central control system can precisely control parameters such as polishing time, pressure, rotation speed, and ultrasonic frequency, ensuring repeatability for each process. Based on feedback from the monitoring system, the central control system can adjust polishing parameters in real time, ensuring consistency and stability of the processing. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the present invention; Reference numerals: 1—Cover; 2—Photocatalytic lamp; 3—CCD visual monitoring camera; 4—Multi-degree-of-freedom spindle; 5—Atomizing nozzle; 501—Polishing fluid atomization pipeline; 6—Polishing fluid delivery pipeline; 7—Ultrasonic generator and atomizing device; 8—Main control system; 9—Main control system operation panel; 10—Emergency stop button; 11—Operating status display window; 12—Hazard alarm light; 13—Fault status indicator light; 14—Operating status indicator light; 15—Polishing fluid supply device; 16—Grinding barrel; 17—Three-jaw clamping structure; 18—Light guide path; 19—Grinding barrel rotation matching motor; 20—Laser; 21—Base; 22—Sealed door; 23—Push-pull handle; 24—3D laser scanner; 25—Temperature and humidity meter. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0024] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] like Figure 1 As shown, a photocatalytically assisted ultrasonic atomization chemical mechanical polishing device includes a base 21 and a cover 1 with a sealing door 22. The cover 1 houses an ultrasonic atomization liquid application module, a photocatalytic assistance module, a multi-degree-of-freedom polishing execution module, and an adaptive control module. The ultrasonic atomization liquid application module atomizes polishing liquid containing a photocatalyst into micron-sized droplets and sprays them onto the workpiece surface. The photocatalytic assistance module irradiates the workpiece surface and polishing liquid droplets with a beam of a specific wavelength to excite a photocatalytic reaction. The multi-degree-of-freedom polishing execution module includes a multi-degree-of-freedom spindle 4, a three-jaw clamping structure 17 located at the end of the multi-degree-of-freedom spindle 4, and an independently moving grinding barrel 16. The three-jaw clamping structure 17 is positioned above the grinding barrel 16. The multi-degree-of-freedom spindle 4 is used to fix the workpiece, and drives the workpiece to achieve multi-axis linkage spatial motion. The grinding barrel 16 contains abrasive and provides relative grinding motion with the workpiece surface. The adaptive control module includes a laser scanning system for real-time acquisition of the workpiece's three-dimensional morphology, a CCD monitoring system for monitoring the polishing process, and a central control system 8 for data processing and collaborative control. The central control system 8 is communicatively connected to the ultrasonic atomization liquid application module, the photocatalytic auxiliary module, and the multi-degree-of-freedom polishing execution module. Based on the information fed back by the laser scanning system and the CCD monitoring system, the central control system 8 dynamically controls the operating parameters of the ultrasonic atomization liquid application module, the photocatalytic auxiliary module, and the multi-degree-of-freedom polishing execution module to achieve closed-loop adaptive control of the polishing process. The ultrasonic atomization device achieves uniform distribution of polishing fluid and abrasive particles at the polishing interface. By combining ultrasonic atomization and photocatalysis technology, the polishing efficiency and material removal rate can be significantly improved, enabling high-precision chemical mechanical polishing of planar and complex curved surface workpieces. It also features three-dimensional scanning of complex components and a multi-degree-of-freedom workpiece clamping mechanism. By adjusting the multi-degree-of-freedom workpiece clamping mechanism and polishing pad, chemical mechanical polishing is performed in conjunction with the polishing fluid. The entire polishing process avoids secondary clamping, enabling high-quality and high-efficiency precision machining of complex curved surfaces.

[0026] like Figure 1As shown, the base 21 is the basic support structure of the entire equipment. Inside it are installed a polishing fluid quality detection system and an abrasive particle quality detection system connected to the central control system 8. The polishing fluid quality detection system and the abrasive particle quality detection system can detect the atomized polishing fluid after the reaction is completed. Based on the detection results, the polishing fluid is recycled or treated as waste liquid under the control of the central control system 8 to reduce resource waste and environmental pollution.

[0027] The cover 1 is mounted on the base 21 and serves as the main frame of the equipment. Various devices are installed inside the cover 1. A sealing door 22 is located on the front left side of the cover 1, allowing workpieces to enter and exit. It also acts as a seal during polishing, preventing polishing fluid from splashing and external impurities from entering, thus ensuring a stable polishing environment. The sealing door 22 is equipped with a push-pull handle 23.

[0028] like Figure 1 As shown, the multi-degree-of-freedom polishing execution module includes a multi-degree-of-freedom spindle 4, a three-jaw clamping structure 17 set at the end of the multi-degree-of-freedom spindle 4, and an independently moving grinding barrel 16.

[0029] like Figure 1 As shown, the grinding barrel 16 is installed in the middle of the housing 1, and its bottom and circumference are provided with reinforcing ribs. The grinding barrel 16 is driven by the grinding barrel rotation motor 19, and the speed controller of the grinding barrel rotation motor 19 is communicatively connected to the main control system 8. During operation, the grinding barrel 16 is driven to rotate by the grinding barrel rotation motor 19, and the internal abrasive grains move together through the ribs, thereby providing stable polishing pressure and relative grinding motion to the workpiece surface, realizing a controllable physical grinding effect.

[0030] The multi-degree-of-freedom spindle 4 is installed inside the housing 1, near the grinding barrel 16. A three-jaw clamping structure 17, located at the end of the multi-degree-of-freedom spindle 4, is positioned above the grinding barrel 16. The three-jaw clamping structure 17 is used to fix the workpiece and drive its rotation. The three-jaw clamping structure 17 can clamp both flat and complex curved workpieces. Through precise motion control, it can meet the polishing requirements of the workpiece at different angles, ensuring the stability and accuracy of the workpiece during the polishing process and preventing workpiece wobbling from affecting the polishing quality.

[0031] During the polishing process, the rotation direction and speed of the grinding barrel 16 and the multi-degree-of-freedom spindle 4 can be coordinated and adjusted by the central control system 8 according to the specific process requirements of the complex workpiece, so that the abrasive grains apply appropriate tangential force to the workpiece surface, thereby achieving a high-precision polishing effect.

[0032] like Figure 1As shown, the ultrasonic atomization liquid application module includes a polishing slurry supply device 15, an ultrasonic generator and atomizing device 7, and an atomizing nozzle 5. The polishing slurry supply device 15 is connected to the ultrasonic generator and atomizing device 7 via a polishing slurry delivery pipeline 6, and the atomizing nozzle 5 is connected to the ultrasonic generator and atomizing device 7 via a polishing slurry atomization pipeline 501. The atomizing nozzle 5 is positioned towards the clamping center area of ​​the three-jaw clamping structure 17. The ultrasonic generator and atomizing device 7 atomize the polishing slurry by generating high-frequency vibrations. The polishing slurry is atomized into tiny particles by the atomizing nozzle 5 and evenly sprayed onto the surface of the workpiece to be polished.

[0033] The polishing slurry supply device 15 is installed inside the housing 1 to provide various polishing slurry formulations and to ensure thorough mixing of the polishing slurry. During the polishing process, the polishing slurry supply device 15 delivers the prepared polishing slurry to the polishing slurry atomizing device. The polishing slurry supply device 15 has multiple storage tanks inside to store polishing slurries with different formulations. Through the control of the polishing slurry delivery pipeline 6 and valves, the appropriate polishing slurry can be accurately selected and delivered according to different workpiece materials and polishing requirements.

[0034] like Figure 1 As shown, the photocatalytic auxiliary module includes a laser 20 and a photocatalytic lamp 2, and the laser 20 and the photocatalytic lamp 2 are connected by a light guide path 18.

[0035] Laser 20 is located inside the housing 1 on the left side and is used to generate light of a specific wavelength. Photocatalytic lamp 2 is positioned above the grinding barrel 16, facing the central clamping area of ​​the three-jaw clamping structure 17. Laser 20, transmitted through light guide path 18, ultimately irradiates the workpiece and polishing slurry, triggering a photocatalytic reaction to generate active substances and enhance the chemical reactivity of the polishing slurry.

[0036] like Figure 1 As shown, the laser scanning system and the CCD monitoring system are a 3D laser scanner 24 and a CCD vision monitoring camera 3, respectively. The 3D laser scanner 24 is connected to the central control system 8 and is used to scan the 3D morphology of the workpiece and transmit the data to the central control system 8 in real time to generate an initial polishing path and monitor morphology changes. The CCD vision monitoring camera 3 is also connected to the central control system 8 and is used to capture and feed back images of the polishing area in real time. The central control system 8 receives and fuses the data from the scanner and camera for analysis and decision-making.

[0037] The 3D laser scanner 24 is installed in the middle left side inside the housing 1. It is used to perform a full scan of the workpiece with unknown surface contours and transmit the measurement data back to the central control system 8 to form the workpiece clamping and polishing path and processing technology.

[0038] The CCD visual monitoring camera 3 is installed inside the housing 1 and is positioned close to the grinding barrel 16. The CCD visual monitoring camera 3 is used to monitor the polishing process of complex workpieces in real time. When abnormal operation of the equipment or abnormal situation occurs during the polishing process, it will promptly report to the central control system 8 to ensure the safety and stability of the polishing process.

[0039] like Figure 1 As shown, a temperature and humidity monitoring system is also installed inside the enclosure 1. The temperature and humidity monitoring system is connected to the main control system 8 for real-time monitoring of the temperature and humidity inside the equipment and feeding the data back to the main control system 8.

[0040] In this embodiment, the temperature and humidity monitoring system is a temperature and humidity meter 25. The temperature and humidity meter 25 is installed on the upper left side inside the enclosure 1 to record the temperature and humidity during equipment operation. The data will be fed back to the central control system 8, which will then adjust the polishing process.

[0041] like Figure 1 As shown, the main control system 8 is located on the upper right side of the front of the cover 1. The main control system 8 has a main control system operation panel 9 on its lower side. The main control system operation panel 9 also has an operation status display window 11, a hazard alarm light 12, a fault status indicator light 13, and an operation status indicator light 14 on its lower side.

[0042] The central control system 8 is used to receive feedback information from various modules, components, and systems in the equipment, and to analyze and process it. The central control system 8 is also connected to a fault detection system, a running status indicator 14, a fault status indicator 13, a hazard alarm light 12, and an emergency stop button 10. The fault detection system is used to monitor the operating status of various instruments and equipment in the equipment in real time, and to provide timely warnings and display fault information. The running status indicator 14 is used to display the operating status of the equipment, and the emergency stop button 10 can immediately stop the operation of the equipment in an emergency to ensure the safety of personnel and equipment.

[0043] The polishing method of this photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment includes the following steps: Step 1: Equipment and Material Preparation Confirm that the equipment power supply and main control system 8 are in a ready state, and check whether the core components are operating normally in sequence; at the same time, check whether the CCD monitoring system, temperature and humidity monitoring system, and laser 3D scanning system are working properly, prepare the polishing slurry according to the process requirements, inject it into the storage tank of the polishing slurry supply device 15, and confirm that the liquid level is sufficient. Verify the size, shape, and surface condition of the workpiece to be polished to ensure that it meets the processing requirements; Specifically, after confirming that the equipment power supply and main control system 8 are in a ready state, check in sequence whether the ultrasonic generator and atomizing nozzle 5, photocatalytic lamp 2, grinding barrel 16, polishing slurry supply device 15, and other components are operating normally. Check whether the CCD vision monitoring camera 3, temperature and humidity meter 25, and 3D laser scanner 24 are working properly. According to the processing requirements, prepare the appropriate polishing slurry and pour it into the storage tank of the polishing slurry supply device 15. Check the level of polishing slurry in the storage tank to ensure that it is sufficient to complete this processing. Check the size, shape, and surface condition of the workpiece to be polished to ensure that it meets the processing requirements.

[0044] Step 2: Equipment positioning confirmation Open the equipment sealing door 22 to ensure that there is enough operating space inside the equipment to place the workpiece; then check whether the grinding barrel 16 and the multi-degree-of-freedom spindle 4 are in the initial state. Step 3: Workpiece cleaning and clamping Clean the workpiece surface, place the workpiece in the center of the three-jaw clamping structure 17 of the multi-degree-of-freedom spindle 4, and perform automatic clamping to ensure that the workpiece is firmly fixed and aligned with the center; check the clamping status to prevent loosening or displacement during processing; In practice, cleaning the workpiece surface includes removing impurities such as oil and dust to avoid affecting the polishing effect.

[0045] Step 4: Initial State Scan A preliminary scan of the workpiece is performed using a 3D laser scanner 24 to confirm the initial position and surface condition of the workpiece; Step 5: Enclose the processing environment After confirming that the workpiece is securely installed, close the equipment sealing door 22 and check the door's sealing performance to ensure that there is no leakage of polishing liquid or mist during the processing. Step 6: Set process parameters Input and confirm the process parameters for this processing in the main control system 8, including: polishing time, polishing pressure, multi-degree-of-freedom spindle speed 4, ultrasonic frequency, wavelength and light intensity of photocatalytic laser 20, and supply rate of polishing fluid; after confirming that the parameters are entered correctly, save the settings. Step 7: Start the monitoring system Start the temperature and humidity monitoring system (temperature and humidity meter 25) to ensure that the temperature and humidity of the processing environment are within the set range; at the same time, start the CCD vision monitoring camera 3 and the 3D laser scanner 24 to prepare for real-time monitoring of the processing process; Step 8: Start the machining program Turn on the switch of the polishing slurry supply device 15 to supply polishing slurry to the atomizing nozzle 5; check whether the atomizing nozzle 5 is working properly; start the photocatalytic laser 20, the grinding barrel 16 and the multi-degree-of-freedom spindle 4 in sequence to start the polishing process; Step 9: Process Monitoring and Dynamic Adjustment In practice, the polishing status of the workpiece surface is observed in real time by a CCD vision monitoring camera 3, and the flatness and smoothness of the workpiece surface are monitored in real time by a 3D laser scanner 24. The central control system 8 adjusts the polishing pressure, spindle speed and ultrasonic frequency parameters in real time based on the monitoring feedback. If any abnormality is found, the processing is immediately suspended and the problem is investigated. In practice, abnormalities usually include uneven spraying of polishing fluid or scratches on the workpiece surface.

[0046] Step 10: Completion of processing and removal of workpiece When the polishing time reaches the set value or the workpiece surface reaches the expected finish, the following components are stopped sequentially: multi-degree-of-freedom spindle 4 and grinding barrel 16, photocatalytic laser 20, ultrasonic generator and atomizing nozzle 5, and polishing fluid supply device 15. After the equipment has completely stopped, open the sealing door 22, release the three-jaw clamping structure 17, and safely remove the workpiece.

[0047] This method is applicable to polishing of various materials such as metals, ceramics, and semiconductors, and has wide applicability.

[0048] For example, it can be used for precision polishing of gas turbine compressor blades. The central control system allows for flexible adjustment of parameters such as polishing time, pressure, speed, ultrasonic frequency, and photocatalytic reaction wavelength, adapting to the polishing needs of different workpieces. The multi-degree-of-freedom spindle and grinding barrel design enable the equipment to handle workpieces with complex shapes, ensuring uniform polishing of all parts of their surface.

[0049] The technical solutions provided by the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of the present invention. The descriptions of the embodiments above are only for helping to understand the principles of the embodiments of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A photocatalytically assisted ultrasonic atomization chemical mechanical polishing device, characterized in that, It includes a base and a cover with a sealed door. The cover contains an ultrasonic atomization liquid application module, a photocatalytic auxiliary module, a multi-degree-of-freedom polishing execution module, and an adaptive control module. The ultrasonic atomizing liquid application module is used to atomize the polishing liquid containing photocatalyst into micron-sized droplets and spray them onto the surface of the workpiece. The photocatalytic auxiliary module is used to irradiate the workpiece surface and polishing liquid droplets with a light beam of a specific wavelength to stimulate the photocatalytic reaction; The multi-degree-of-freedom polishing execution module includes a multi-degree-of-freedom spindle, a three-jaw clamping structure set at the end of the multi-degree-of-freedom spindle, and an independently moving grinding barrel. The three-jaw clamping structure is set above the grinding barrel, the multi-degree-of-freedom spindle drives the workpiece to achieve multi-axis linkage spatial motion, and the grinding barrel contains abrasive and provides relative grinding motion with the workpiece surface. The adaptive control module includes a laser scanning system for real-time acquisition of the workpiece's three-dimensional shape, a CCD monitoring system for monitoring the polishing process, and a central control system for data processing and collaborative control. The overall control system is communicatively connected to the ultrasonic atomization liquid application module, the photocatalytic auxiliary module, and the multi-degree-of-freedom polishing execution module. The overall control system dynamically controls the operating parameters of the ultrasonic atomization liquid application module, the photocatalytic auxiliary module, and the multi-degree-of-freedom polishing execution module based on the information fed back from the laser scanning system and the CCD monitoring system, thereby achieving closed-loop adaptive control of the polishing process.

2. The photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment according to claim 1, characterized in that, The ultrasonic atomization liquid application module includes a polishing liquid supply device, an ultrasonic generator and atomization device, and an atomization nozzle. The polishing fluid supply device is connected to the ultrasonic generator and the atomizing device via a polishing fluid delivery pipeline, and the atomizing nozzle is connected to the ultrasonic generator and the atomizing device via a polishing fluid atomizing pipeline. Furthermore, the atomizing nozzle is positioned towards the clamping center area of ​​the three-claw clamping structure.

3. The photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment according to claim 1, characterized in that, The photocatalytic auxiliary module includes a laser and a photocatalytic lamp. The laser and the photocatalytic lamp are connected by a light guide path, and the photocatalytic lamp is positioned towards the clamping center area of ​​the three-claw clamping structure.

4. The photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment according to claim 1, characterized in that, The laser scanning system and CCD monitoring system are a 3D laser scanner and a CCD vision monitoring camera, respectively. The 3D laser scanner is connected to the central control system and is used to scan the 3D morphology of the workpiece and transmit the data to the central control system in real time to generate an initial polishing path and monitor morphology changes. The CCD vision monitoring camera is connected to the central control system and is used to capture and feed back the status images of the polishing area in real time. The central control system receives and fuses the data from the scanner and camera for analysis and decision-making.

5. The photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment according to claim 1, characterized in that, The grinding barrel is connected to a rotating motor, and the speed controller of the rotating motor is connected to the main control system.

6. The photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment according to claim 1, characterized in that, The enclosure is also equipped with a temperature and humidity monitoring system, which is connected to the main control system for real-time monitoring of the temperature and humidity inside the equipment and feeding the data back to the main control system.

7. The photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment according to claim 6, characterized in that, The temperature and humidity monitoring system is a temperature and humidity meter.

8. The photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment according to claim 1, characterized in that, The base is equipped with a polishing fluid quality detection system and an abrasive grain quality detection system that are connected to the central control system.

9. A polishing method using the photocatalytically assisted ultrasonic atomization chemical mechanical polishing equipment as described in any one of claims 1-8, characterized in that, Includes the following steps: Step 1: Equipment and Material Preparation Confirm that the equipment power supply and main control system are in a ready state, and check whether the core components are operating normally in turn; at the same time, check whether the CCD vision monitoring camera, temperature and humidity monitoring system and 3D laser scanner are working properly, prepare polishing fluid according to process requirements, inject it into the storage tank of polishing fluid supply device and confirm that the liquid level is sufficient. Verify the dimensions, shape, and surface condition of the workpiece to be polished to ensure it meets the processing requirements; Step 2: Equipment positioning confirmation Open the equipment's sealed door to ensure there is sufficient operating space inside the equipment to place the workpiece; then check whether the grinding barrel and the multi-degree-of-freedom spindle are in their initial state. Step 3: Workpiece cleaning and clamping Clean the workpiece surface, place the workpiece in the center of the three-jaw clamping structure of the multi-degree-of-freedom spindle, and perform automatic clamping to ensure that the workpiece is firmly fixed and aligned with the center; check the clamping status to prevent loosening or displacement during processing; Step 4: Initial State Scan The workpiece is initially scanned using the aforementioned 3D laser scanner to confirm its initial position and surface condition. Step 5: Enclose the processing environment After confirming that the workpiece is securely installed, close the equipment's sealing door and check the door's airtightness to ensure that there is no leakage of polishing fluid or mist during the processing. Step 6: Set process parameters Input and confirm the process parameters for this machining operation in the central control system, including: polishing time, polishing pressure, multi-degree-of-freedom spindle speed, ultrasonic frequency, wavelength and light intensity of the photocatalytic laser, and supply rate of polishing slurry; after confirming that the parameters are entered correctly, save the settings. Step 7: Start the monitoring system Start the temperature and humidity monitoring system to ensure that the temperature and humidity of the processing environment are within the set range; at the same time, start the CCD vision monitoring camera and the 3D laser scanner to prepare for real-time monitoring of the processing process. Step 8: Start the machining program Turn on the polishing slurry supply device to deliver polishing slurry to the atomizing nozzle; check if the atomizing nozzle is working properly; start the photocatalytic laser, grinding barrel, and multi-degree-of-freedom spindle in sequence to begin the polishing process; Step 9: Process monitoring and dynamic adjustment. The polishing status of the workpiece surface is observed in real time through a CCD vision monitoring camera, and the flatness and smoothness of the workpiece surface are monitored in real time through a 3D laser scanner. Based on the monitoring feedback, the central control system adjusts the polishing pressure, spindle speed, and ultrasonic frequency parameters in real time. If any abnormality is found, processing is immediately suspended and the problem is investigated. Step 10: Completion of processing and removal of workpiece When the polishing time reaches the set value or the workpiece surface reaches the expected smoothness, the following components are stopped in sequence: multi-degree-of-freedom spindle and grinding barrel, photocatalytic laser, ultrasonic generator and atomizing nozzle, and polishing fluid supply device. After the equipment has completely stopped, open the sealed door, release the three-jaw clamping structure, and safely remove the workpiece.

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