Efficient product replacement equipment integrating multiple actions of extraction, stripping, pressing, jacking and rotating in three-dimensional space
By designing a highly efficient product replacement device in three-dimensional space, the problem of automating the replacement of iron rings with plastic rings on 8-inch wafers was solved, realizing automated replacement of iron rings with plastic rings, improving operational efficiency and protecting wafer quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-11
- Publication Date
- 2026-03-27
AI Technical Summary
In the existing technology, 8-inch wafer products lack automated hardware support when replacing the iron ring with a plastic ring, resulting in inconvenience in operation.
A highly efficient product replacement device integrating multiple actions such as extraction, depressurization, and top rotation in three-dimensional space was designed. It includes a feeding module, a ring transfer module, an iron ring transfer module, and a plastic ring transfer module. These modules enable the automated replacement of iron rings and plastic rings, and precise operation is achieved using components such as suction nozzles and pressure rollers.
It enables automated replacement of the iron ring to the plastic ring of 8-inch wafer products, improving operational efficiency, avoiding wafer damage, and enhancing product quality.
Smart Images
Figure CN121733831A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of wafers, in particular to wafer production equipment. BACKGROUND
[0002] The iron ring on the 8-inch wafer product (including iron ring, blue film, wafer) is replaced with a plastic ring of the same size. When assembling the plastic ring, it needs to be rotated and pressed to ensure that the blue film and the plastic ring are effectively attached. SUMMARY
[0003] The technical problem solved by the present application is to provide a structure of an equipment, which can provide a hardware basis for the automation of replacing the iron ring on the 8-inch wafer product with a plastic ring of the same size.
[0004] To solve the above technical problems, the present application provides the following technical scheme: a high-efficiency product replacement equipment with multiple actions of extraction, pressure relief and top rotation in three-dimensional space, comprising a feeding module, a ring removal and transfer module, an iron ring transfer module and a plastic ring transfer module; The ring removal and transfer module can obtain products from the feeding module and transfer the products to the iron ring separation station and the plastic ring assembly station; The iron ring transfer module moves between the iron ring collection station and the iron ring separation station; The plastic ring transfer module moves between the plastic ring supply station and the plastic ring assembly station; The ring removal and transfer module includes a product carrier and a wafer carrier, and a product ejector pin, the wafer carrier is located inside the product carrier, and the ejector pin is located outside the wafer after the ring is removed; The iron ring transfer module includes a middle limiting platform, a first suction nozzle arranged outside the middle limiting platform, and the outer diameter of the middle limiting platform is smaller than the inner diameter of the iron ring on the product, and the first suction nozzle is used for adsorbing the iron ring; The plastic ring transfer module includes a plurality of second suction nozzles capable of lifting, and a plurality of pressure wheels capable of lifting, the plurality of second suction nozzles and the plurality of pressure wheels are arranged in a circular shape, the second suction nozzles can adsorb the plastic ring, and the pressure wheels can press the plastic ring, and all the pressure wheels are arranged on a pressure wheel turntable.
[0005] According to the above technical solution, the ring removal and transfer module obtains the product from the feeding module and transfers it to the iron ring removal station. The iron ring transfer module descends above the product, with the central limiting platform facing the wafer. The first suction nozzle picks up the iron ring of the product. The product push rod of the ring removal and transfer module rises, pushing the iron ring off the wafer, causing the wafer to fall onto the rising wafer carrier. The iron ring transfer module transfers the picked-up iron ring to the iron ring collection station. Then, the ring removal and transfer module transfers the wafer to the plastic ring assembly station. The second suction nozzle of the plastic ring transfer module obtains the plastic ring from the plastic ring supply station and transfers it to the plastic ring assembly station. The second suction nozzle descends, placing the plastic ring around the wafer. Then, the pressure roller descends, simultaneously rotating with the turntable, pressing the plastic ring down to the periphery of the wafer, embedding the wafer within the plastic ring. Finally, the product with the plastic ring installed is returned to the feeding module by the ring removal and transfer module.
[0006] The product platform of the ring-detaching and transfer module is connected to a longitudinal robot on one side and a longitudinal guide rail on the other. Driven by the longitudinal robot, the ring-detaching and transfer module moves linearly between the iron ring detachment station, the plastic ring assembly station, and the feeding module. Driven by the longitudinal robot, the ring-detaching and transfer module moves linearly between the feeding module, the iron ring detachment station, and the plastic ring assembly station.
[0007] The wafer stage is located inside the product stage. The wafer stage is connected to a cylinder carrier plate via a wafer stage support rod. A wafer stage lifting cylinder is mounted on the bottom of the cylinder carrier plate, and the piston of the wafer stage lifting cylinder is fixedly connected to the bottom of the product stage. A push rod carrier plate is movably fitted onto the wafer stage support rod. A product push rod is mounted on the push rod carrier plate, and a push rod lifting cylinder is mounted on the cylinder carrier plate. The piston of the push rod lifting cylinder passes upward through the bottom of the product stage and is fixedly connected to the push rod carrier plate. The wafer stage rises to receive the wafer detached from the iron ring. The product push rod rises to detach the iron ring from the wafer.
[0008] The product stage has a pair of product supports on its top sides. The inner side of each product support has a first positioning tooth structure, and the sides of the wafer stage have second positioning tooth structures. When the wafer stage rises, the second positioning tooth structures engage with the first positioning tooth structures. The product is supported by the pair of product supports on the product stage. The engagement of the first and second positioning tooth structures ensures the stability of the product supports and the wafer stage, preventing wafer damage during the disengagement of the iron ring and the assembly of the plastic ring, thus improving product quality.
[0009] The product loading platform of the de-looping and transferring module is provided with a material taking manipulator, the material taking manipulator is connected with a material dragging plate, a product gripper cylinder is installed on the material dragging plate, and a product gripper is installed on the product gripper cylinder; under the driving of the material taking manipulator, the product gripper can drag the product on the feeding module to a pair of product supports on the product loading platform. The feeding module comprises a product frame and a vertical lifting manipulator, a plurality of layers of loading plates distributed in up and down directions are arranged in the product frame, and the product is placed on the loading plates. The product gripper takes away one product, the vertical lifting manipulator is lifted by the height of one loading plate, and the product on the next layer of loading plates is at a taking height.
[0010] The iron ring transferring module is provided with a plurality of pressing heads, the plurality of pressing heads are distributed on the periphery of the middle limiting platform, are located on the same circle as the first suction nozzle, and the bottom end face of the pressing head is higher than the bottom end face of the middle limiting platform and the first suction nozzle. The iron ring on the product lifting rod lifts the product, the wafer of the product is limited by the middle limiting platform and cannot be lifted, the iron ring lifted by the first suction nozzle is lifted, the first suction nozzle is elastically deformed, the iron ring is separated from the wafer and abuts against the pressing head, excessive lifting of the iron ring is avoided, and the failure of the first suction nozzle to adsorb the iron ring is avoided. The iron ring transferring module is connected with the iron ring transferring module cylinder through the iron ring transferring module vertical rod and the iron ring transferring module cylinder plate. The iron ring transferring module cylinder is installed on the iron ring transferring module moving seat, the iron ring transferring module moving seat is connected with the iron ring transferring module manipulator, and under the driving of the iron ring transferring module manipulator, the iron ring transferring module linearly displaces between the iron ring separation station and the iron ring collection station.
[0011] The pressing wheel disc of the plastic ring transferring module is connected with a disc motor, the disc motor is installed on the pressing wheel lifting plate, the pressing wheel lifting plate is connected with the plastic ring transferring module cylinder through the plastic ring transferring module vertical rod and the plastic ring transferring module cylinder plate. The second suction nozzle is installed on a suction nozzle plate, the suction nozzle plate is movably connected with the plastic ring transferring module vertical rod, the suction nozzle plate is provided with a second suction nozzle lifting cylinder, and a piston of the second suction nozzle lifting cylinder is fixedly connected with the pressing wheel lifting plate. The plastic ring transferring module cylinder is installed on the plastic ring transferring module moving seat, the plastic ring transferring module moving seat is connected with the plastic ring transferring module manipulator, and under the driving of the plastic ring transferring module manipulator, the plastic ring transferring module linearly displaces between a plastic ring assembly station and a plastic ring feeding station.
[0012] The present application provides structural support for the automation of replacing the iron ring on the 8-inch wafer product with a plastic ring of the same size, and is beneficial to realizing the automation of replacing the iron ring with a plastic ring of the same size. BRIEF DESCRIPTION OF DRAWINGS
[0013] The present application will be further described below with reference to the drawings: Figure 1 It is a schematic view of a high-efficiency product replacement device with multiple actions in a three-dimensional space; Figure 2 It isFigure 1 Enlarged view at A; Figure 3 For Figure 1 Enlarged view at B; Figure 4 For Figure 1 Schematic view of the efficient product replacement equipment performing multiple actions of disengaging, lifting, pressing, rotating, and moving within a three-dimensional space, viewed from the rear; Figure 5 For Figure 4 Schematic view of the efficient product replacement equipment performing multiple actions of disengaging, lifting, pressing, rotating, and moving within a three-dimensional space, viewed from the right side; Figure 6 Front view of the ring disengaging and moving module 20; Figure 7 Perspective view of the ring disengaging and moving module 20; Figure 8 Schematic view of the ring disengaging and moving module carrying products 90.
[0014] Explanation of symbols in the figure: 10, feeding module; 11, product frame; 111, carrier plate; 12, vertical lifting manipulator; 20, ring disengaging and moving module; 21, product carrier; 211, product support; 212, first positioning tooth structure; 22, longitudinal manipulator; 221, longitudinal guide rail; 23, material taking manipulator; 231, material dragging plate; 232, product clamping jaw cylinder; 233, product clamping jaw; 25, wafer carrier; 251, wafer carrier vertical rod; 252, cylinder carrier plate; 253, wafer carrier lifting cylinder; 254, second positioning tooth structure; 27, product ejector rod; 271, ejector rod carrier plate; 272, ejector rod lifting cylinder; 30, ring moving module; 31, middle limiting platform; 32, first suction nozzle; 33, pressing head; 34, ring moving module vertical rod; 35, ring moving module cylinder plate; 36, ring moving module cylinder; 37, ring moving module moving seat; 371, ring moving module manipulator; 40, plastic ring moving module; 41, second suction nozzle; 411, suction nozzle plate; 412, second suction nozzle lifting cylinder; 42, pressing wheel; 43, pressing wheel turntable; 44, turntable motor; 45, pressing wheel lifting plate; 46, plastic ring moving module cylinder; 461, plastic ring moving module vertical rod; 462, plastic ring moving module cylinder plate; 47, plastic ring moving module moving seat; 471, plastic ring moving module manipulator; 51, ring disengaging station; 52, plastic ring assembling station; 53, ring collecting station; 54, plastic ring feeding station; 90, product; 91, iron ring; 92, wafer. DETAILED DESCRIPTION
[0015] REFERENCE Figures 1 to 3 , and Figures 6 to 7 An efficient product replacement device for three-dimensional space set extraction pressure top spin multi-action includes a feeding module 10, a ring removal and transfer module 20, an iron ring transfer module 30, and a plastic ring transfer module 40. The ring removal and transfer module 20 can obtain products from the feeding module and transfer the products to the iron ring separation station 51 and the plastic ring assembly station 52. The iron ring transfer module 30 moves between the iron ring collection station 53 and the iron ring separation station 51. The plastic ring transfer module 40 moves between the plastic ring supply station 54 and the plastic ring assembly station 52. The ring removal and transfer module 20 includes a product carrier 21 and a wafer carrier 25, and a product ejector pin 27, the wafer carrier is located inside the product carrier, and the product ejector pin is located outside the wafer after the ring is removed. The iron ring transfer module 30 includes a middle limiting platform 31, a first suction nozzle 32 arranged on the periphery of the middle limiting platform, and the outer diameter of the middle limiting platform is smaller than the inner diameter of the iron ring 91 on the product. The first suction nozzle is used to adsorb the iron ring. The plastic ring transfer module 40 includes a plurality of second suction nozzles 41 capable of lifting, and a plurality of pressure wheels 42 capable of lifting, the plurality of second suction nozzles and the plurality of pressure wheels are arranged in a circular shape, the second suction nozzles can adsorb the plastic ring, and the pressure wheels can press the plastic ring. All pressure wheels are arranged on the pressure wheel turntable 43.
[0016] REFERENCE Figure 6 , Figure 7 The product carrier 21 of the ring removal and transfer module is connected to the longitudinal manipulator 22 on one side and cooperates with the longitudinal guide rail 221 on the other side. Under the drive of the longitudinal manipulator, the ring removal and transfer module 20 linearly moves between the iron ring separation station 51, the plastic ring assembly station 52, and the feeding module 10.
[0017] The wafer carrier 25 is connected to the cylinder carrier plate 252 through the wafer carrier vertical rod 251, and the bottom of the cylinder carrier plate is provided with a wafer carrier lifting cylinder 253. The piston of the wafer carrier lifting cylinder is fixedly connected to the bottom of the product carrier 21. The top rod carrier plate 271 is movably matched on the wafer carrier vertical rod 251, and the product ejector pin 27 is arranged on the top rod carrier plate. The top rod lifting cylinder 272 is arranged on the cylinder carrier plate 252, the piston of the top rod lifting cylinder penetrates through the bottom of the product carrier 21 upwards, and is fixedly connected to the top rod carrier plate.
[0018] A pair of product supports 211 is arranged on the top of the product carrier 21, and a first positioning tooth structure 212 is arranged on the inner side of the product support. A second positioning tooth structure 254 is arranged on the two sides of the wafer carrier 25, and the second positioning tooth structure cooperates with the first positioning tooth structure when the wafer carrier is lifted.
[0019] The product carrier 21 of the wafer separation and transfer module 20 is provided with a material taking manipulator 23 connected with a material dragging plate 231, a product clamping jaw cylinder 232 is installed on the material dragging plate, and a product clamping jaw 233 is installed on the product clamping jaw cylinder; under the driving of the material taking manipulator, the product clamping jaw can drag the product on the feeding module 10 to a pair of product supports 211 of the product carrier.
[0020] In combination Figure 1 , Figure 2 , the iron ring transfer module 30 is provided with a plurality of pressing heads 33 distributed on the periphery of the middle limiting platform 31 and located on the same circle as the first suction nozzle 32, and the bottom end face of the pressing head is higher than the bottom end face of the middle limiting platform and the first suction nozzle. The iron ring 91 on the product ejector pin 27 is used to top the product, the wafer 92 of the product is limited by the middle limiting platform and cannot rise, the iron ring rises and is adsorbed by the first suction nozzle, the first suction nozzle is elastically deformed, and the iron ring is separated from the wafer and abuts against the pressing head. The iron ring transfer module 30 is connected with the iron ring transfer module cylinder 36 through the iron ring transfer module stand 34 and the iron ring transfer module cylinder plate 35.
[0021] In combination Figure 1 , Figure 3 , the pressing wheel rotating disc 43 of the plastic ring transfer module is connected with the rotating disc motor 44, the rotating disc motor is installed on the pressing wheel lifting plate 45, the pressing wheel lifting plate is connected with the plastic ring transfer module cylinder 46 through the plastic ring transfer module stand 461 and the plastic ring transfer module cylinder plate 462. The second suction nozzle 41 is installed on the suction nozzle plate 411, the suction nozzle plate is movably connected with the plastic ring transfer module stand 461, the second suction nozzle lifting cylinder 412 is installed on the suction nozzle plate, and the piston of the second suction nozzle lifting cylinder is fixedly connected with the pressing wheel lifting plate 45.
[0022] The wafer separation and transfer module 20 obtains the product from the feeding module 10 and transfers the product to the iron ring separation station 51. The iron ring transfer module 30 is lowered above the product 90, the middle limiting platform 31 faces the wafer 92 of the product, and the first suction nozzle 32 adsorbs the iron ring 91 of the product. The product ejector pin 27 of the wafer separation and transfer module 20 rises and tops the iron ring of the product, so that the iron ring is separated from the wafer 92, and the wafer falls on the rising wafer carrier 25. The iron ring transfer module 30 transfers the adsorbed iron ring to the iron ring collection station 53. Then, the wafer separation and transfer module 20 transfers the wafer 92 to the plastic ring assembly station 52. The second suction nozzle 41 of the plastic ring transfer module 40 obtains the plastic ring from the plastic ring supply station 54 and transfers it to the plastic ring assembly station 52, and the second suction nozzle 41 is lowered to place the plastic ring on the periphery of the wafer 92. Then, the pressing wheel 42 is lowered, and the pressing wheel rotates with the rotating disc 43 to press the plastic ring to the periphery of the wafer, and the wafer is embedded in the plastic ring. Then, the wafer separation and transfer module 20 sends the product with the plastic ring back to the feeding module 10.
[0023] The de-looping and transferring module 20 is linearly displaced between the feeding module 10, the iron ring de-looping station 51 and the plastic ring assembling station 52 under the driving of the longitudinal mechanical hand 22.
[0024] The wafer carrier 25 is raised for receiving the wafer 92 from which the iron ring 91 is de-looped.
[0025] The product 90 is supported by a pair of product supports 211 of the product carrier 21, and the first positioning tooth structure 212 cooperates with the second positioning tooth structure 254 to stabilize the pair of product supports and the wafer carrier 25, so that the wafer is not damaged during the de-looping of the iron ring and the assembling of the plastic ring, and the quality of the product is improved.
[0026] The feeding module 10 comprises a product frame 11 and a vertical lifting mechanical hand 12, and a plurality of layers of carrier plates 111 are arranged in the product frame in an up-down distribution, and the products are placed on the carrier plates. The product gripper 233 takes away one product, and the vertical lifting mechanical hand is raised by the height of one carrier plate, so that the product on the next layer of carrier plates is at the taking height.
[0027] The iron ring transferring module cylinder 36 is installed on the iron ring transferring module moving seat 37, and the iron ring transferring module moving seat is connected with the iron ring transferring module mechanical hand 371, which is driven to linearly displace the iron ring transferring module between the iron ring de-looping station 51 and the iron ring collecting station 53.
[0028] The plastic ring transferring module cylinder 46 is installed on the plastic ring transferring module moving seat 47, and the plastic ring transferring module moving seat is connected with the plastic ring transferring module mechanical hand 471, which is driven to linearly displace the plastic ring transferring module between the plastic ring assembling station 52 and the plastic ring feeding station 54.
[0029] The above is only the preferred embodiment of the present application, and for those skilled in the art, the specific embodiment and application range can be changed according to the idea of the present application, and the content of the description should not be understood as the limitation of the present application.
Claims
1. A high-efficiency product replacement device integrating multiple actions of extraction, depressurization, top rotation, etc. in three-dimensional space, including a feeding module (10), a ring transfer module (20), an iron ring transfer module (30), and a plastic ring transfer module (40). The ring removal and transfer module (20) can obtain products from the feeding module and transfer the products to the iron ring removal station (51) and the plastic ring assembly station (52). The iron ring transfer module (30) moves between the iron ring collection station (53) and the iron ring release station (51); The plastic ring transfer module (40) is displaced between the plastic ring supply station (54) and the plastic ring assembly station (52); Its features are: The ring removal and transfer module (20) includes a product stage (21) and a wafer stage (25), as well as a product push rod (27). The wafer stage is located inside the product stage, and the product push rod is located on the periphery of the wafer after ring removal. The iron ring transfer module (30) includes a central limiting platform (31) and a first suction nozzle (32) disposed around the central limiting platform. The outer diameter of the central limiting platform is smaller than the inner diameter of the iron ring (91) on the product. The first suction nozzle is used to adsorb the iron ring. The plastic ring transfer module (40) includes several second suction nozzles (41) that can be raised and lowered, and several pressure rollers (42) that can be raised and lowered. The several second suction nozzles and several pressure rollers are arranged in a circle. The second suction nozzles can adsorb plastic rings, and the pressure rollers can press plastic rings. All pressure rollers are set on the pressure roller turntable (43).
2. The high-efficiency product replacement device with multiple actions including extraction, depressurization, and rotation in three-dimensional space as described in claim 1, characterized in that: The product platform (21) of the ring removal and transfer module is connected to the longitudinal robot (22) on one side and the longitudinal guide rail (221) on the other side. Driven by the longitudinal robot, the ring removal and transfer module (20) moves linearly between the iron ring removal station (51), the plastic ring assembly station (52) and the feeding module (10).
3. The high-efficiency product replacement device with multiple actions including extraction, depressurization, and rotation in three-dimensional space as described in claim 1, characterized in that: The wafer stage (25) is connected to the cylinder carrier plate (252) via the wafer stage support rod (251). A wafer stage lifting cylinder (253) is installed at the bottom of the cylinder carrier plate. The piston of the wafer stage lifting cylinder is fixedly connected to the bottom of the product stage (21). The wafer stage support rod (251) is movably fitted with a top rod carrier plate (271), and the product top rod (27) is installed on the top rod carrier plate. The cylinder carrier plate (252) is equipped with a top rod lifting cylinder (272), and the piston of the top rod lifting cylinder passes upward through the bottom of the product stage and is fixedly connected to the top rod carrier plate.
4. The high-efficiency product replacement device with multiple actions including extraction, depressurization, and rotation in three-dimensional space as described in claim 3, characterized in that: The product stage (21) has a pair of product supports (211) on both sides of the top. The product supports have a first positioning tooth structure (212) on the inner side. The wafer stage (25) has a second positioning tooth structure (254) on both sides. When the wafer stage rises, the second positioning tooth structure cooperates with the first positioning tooth structure.
5. The high-efficiency product replacement device with multiple actions including extraction, depressurization, and rotation in three-dimensional space as described in claim 4, characterized in that: The product platform (21) of the detachment and transfer module (20) is equipped with a picking robot (23), which is connected to a drag plate (231). A product gripper cylinder (232) is installed on the drag plate, and a product gripper (233) is installed on the product gripper cylinder. Driven by the picking robot, the product gripper can drag the product on the feeding module (10) to a pair of product supports (211) on the product platform.
6. The high-efficiency product replacement device with multiple actions including extraction, depressurization, and rotation in three-dimensional space as described in claim 1, characterized in that: The iron ring transfer module (30) is provided with several top pressure heads (33). The several top pressure heads are distributed around the central limiting platform (31) and are located on the same circle as the first suction nozzle (32). The bottom end face of the top pressure head is higher than the bottom end face of the central limiting platform and the first suction nozzle. The product push rod (27) pushes the product's iron ring (91), the product's wafer (92) is limited by the central limiting platform and cannot rise, the iron ring adsorbed by the first suction nozzle rises, the first suction nozzle undergoes elastic deformation, and the iron ring detaches from the wafer and abuts against the top pressure head. The iron ring transfer module (30) is connected to the iron ring transfer module cylinder (36) through the iron ring transfer module upright (34) and the iron ring transfer module cylinder plate (35).
7. The high-efficiency product replacement device with multiple actions including extraction, depressurization, and rotation in three-dimensional space as described in claim 1, characterized in that: The pressure roller turntable (43) of the plastic ring transfer module is connected to the turntable motor (44). The turntable motor is installed on the pressure roller lifting plate (45). The pressure roller lifting plate is connected to the plastic ring transfer module cylinder (46) through the plastic ring transfer module upright (461) and the plastic ring transfer module cylinder plate (462). The second suction nozzle (41) is installed on the suction nozzle plate (411). The suction nozzle plate is movably connected with the plastic ring transfer module upright (461). The suction nozzle plate is equipped with a second suction nozzle lifting cylinder (412). The piston of the second suction nozzle lifting cylinder is fixedly connected to the pressure roller lifting plate (45).