Composition, sheet-like article, laminate, method for producing composition, and chip-type laminated electronic component

Abstract

The present invention provides a composition comprising a glass transition temperature regulator capable of increasing the Tg of a binder resin. The composition contains an inorganic powder, a binder resin, and a glass transition temperature regulator, and the glass transition temperature regulator contains a compound having a structure represented by general formula (1). (In general formula (1), R1 represents a hydrocarbon group having 1-12 carbon atoms. In general formula (1), R2 represents a hydrocarbon group having 1-12 carbon atoms other than a benzene ring. In general formula (1), R3 represents a hydrogen atom or a hydrocarbon group having 1-12 carbon atoms. ).

Description

TECHNICAL FIELD

[0001] The present application relates to a composition, a sheet, a laminate, a method for manufacturing a composition, and a chip-type laminated electronic component. BACKGROUND

[0002] Generally, a ceramic green sheet for a laminated ceramic electronic component is manufactured by molding a slurry of mixed ceramic particles and a binder resin into a sheet shape. As the binder resin, for example, a vinyl acetate resin can be used.

[0003] A plasticizer is added to the slurry for the purpose of improving moldability when the slurry is molded into a sheet shape, and for the purpose of improving adhesion when the molded sheet shape is laminated. By adding the plasticizer, the glass transition temperature (Tg) of the binder resin is lowered, and the plasticity of the slurry is improved.

[0004] As such a plasticizer, a phthalate ester is used.

[0005] Patent Document 1 discloses a ceramic green sheet characterized by containing a ceramic powder, a binder resin, a plasticizer added in an amount exceeding a saturated amount with respect to the binder resin, and a solvent, and discloses the use of a phthalate ester as the plasticizer.

[0006] Prior Art Documents

[0007] Patent Documents

[0008] Patent Document 1: Japanese Patent Application Laid-Open (kokai) No. 2002-179925 SUMMARY

[0009] If the plasticizer described in Patent Document 1 is used, the Tg of the binder resin is lowered, but from the viewpoint of moldability and the like, there is a demand for increasing the Tg of the binder resin (binder resin).

[0010] In addition, Patent Document 1 has the following problem: there is a concern that the phthalate ester used as the plasticizer has an adverse effect on human health, and if such a compound is used, the environmental load is large.

[0011] The present application was made in order to solve the above-described problems, and an object of the present application is to provide a composition containing a glass transition temperature adjusting agent capable of increasing the Tg of a binder resin.

[0012] The composition of the present application contains an inorganic powder, a binder resin, and a glass transition temperature adjusting agent, and the glass transition temperature adjusting agent contains a compound having a structure represented by the following general formula (1).

[0013]

[0014] (in General Formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms.

[0015] (in General Formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring.

[0016] (in General Formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

[0017] The sheet of the present application contains the above-mentioned composition of the present application.

[0018] The laminate of the present application is obtained by laminating the above-mentioned sheet of the present application.

[0019] The method for producing the composition of the present application includes a pulverization step of pulverizing an inorganic material to produce an inorganic powder, and a mixing step of mixing the above-mentioned inorganic powder, a binder resin, and a glass transition temperature adjusting agent; the above-mentioned glass transition temperature adjusting agent contains a compound having a structure represented by the following General Formula (1).

[0020]

[0021] (in General Formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms.

[0022] (in General Formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring.

[0023] (in General Formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

[0024] The chip-type laminated electronic component of the present application has a green body obtained by laminating a plurality of ceramic calcined sheets, and when the above-mentioned green body is observed from a side surface, a stripe pattern perpendicular to a laminating direction is formed on the above-mentioned green body.

[0025] According to the present application, it is possible to provide a composition containing a glass transition temperature adjusting agent capable of increasing the Tg of a binder resin. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1A is a cross-sectional view schematically showing one example of the sheet of the present application.

[0027] Figure 1B is an enlarged view of the dotted line portion of Figure 1A

[0028] Figure 2A is a schematic view of one example of a process for producing a laminate using the sheet of the present application. ​

[0029] Figure 2B is a schematic view of one example of a process of manufacturing a laminate using the sheet of the present application.

[0030] Figure 3 is a side view schematically showing one example of a green body in which a plurality of calcined sheets are laminated.

[0031] Explanation of symbols

[0032] 10 calcined sheet 10

[0033] 10a sheet

[0034] 11 air hole

[0035] 11a adhesive resin

[0036] 20 green body

[0037] 20a mother block DETAILED DESCRIPTION

[0038] Hereinafter, the composition, the sheet, the laminate, the method of manufacturing the composition, and the chip-type laminated electronic component of the present application will be described.

[0039] However, the present application is not limited to the following embodiments, and can be applied with appropriate modifications within the scope of the gist of the present application. The present application described in the following embodiments can also be applied to a case in which two or more of the preferred configurations of the present application described in the following embodiments are combined.

[0040] The drawings shown below are schematic views, and the scale of the size, the ratio of the length to the width, and the like can be different from those of the actual products.

[0041] In addition, the following embodiments are examples, and the configurations shown in the embodiments can be partially replaced or combined arbitrarily, of course.

[0042] The composition of the present application contains an inorganic powder, an adhesive resin, and a glass transition temperature adjusting agent, and the glass transition temperature adjusting agent contains a compound having a structure represented by the following general formula (1).

[0043]

[0044] (In the general formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms.

[0045] In the general formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring.

[0046] In the general formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

[0047] The compound represented by the above general formula (1) can increase the Tg of the binder resin. Therefore, the composition comprising the inorganic powder, the binder resin, and the glass transition temperature adjusting agent becomes easy to adjust the plasticity, and the moldability is improved. Therefore, if the composition of the present application is used, a sheet can be appropriately molded. In addition, the molded sheet is not easily deformed.

[0048] Further, in the case where the sheet is layered to produce a laminate, the laminate can be prevented from being deformed. Therefore, when the laminate is calcined to produce a green sheet of a chip-type laminated electronic component, the deviation of the appearance quality and the electrical characteristics of the green sheet is reduced. As a result, the yield is improved.

[0049] The principle by which the Tg of the binder resin is considered to be thus increased is as follows.

[0050] The binder resin is generally composed of molecules having a polar group.

[0051] The molecule of the compound having the structure represented by the above general formula (1) has low polarity, and the compound having the structure represented by the above general formula (1) is not easily oriented to the polar group of the molecule constituting the binder resin. Therefore, the compound having the structure represented by the above general formula (1) is not easily interposed between the molecules constituting the binder resin. Therefore, the molecules constituting the binder resin are easily aggregated with each other. Thus, the Tg of the binder resin is increased.

[0052] In addition, if R 1 , R 2 , and R 3 are the above structure, the compound having the structure represented by general formula (1) is a liquid at normal temperature (25°C), and thus is easy to handle.

[0053] Hereinafter, each component of the composition of the present application is described in detail.

[0054] (Inorganic powder)

[0055] In the composition of the present application, the inorganic powder can also be a ceramic powder.

[0056] In this case, a ceramic green sheet can be produced by molding the composition of the present application into a sheet.

[0057] In the composition of the present application, the inorganic powder preferably contains at least one selected from the group consisting of zirconia, titania, alumina, barium titanate, ferrite, lead zirconate titanate, zinc oxide, glass, and glass-ceramics.

[0058] These materials are suitable for use in the production of a chip-type laminated electronic component using the composition of the present application.

[0059] The inorganic powder in the composition of the present application is not particularly limited in size, and the average particle diameter is preferably from 0.01 μm to 50 μm.

[0060] The inorganic powder in the composition of the present application is preferably contained in a proportion of from 65% by weight to 96% by weight, more preferably from 74% by weight to 95% by weight.

[0061] The composition of the present application is used to produce a sheet, which is laminated and calcined to become a green sheet of a chip-type laminated electronic component.

[0062] If the inorganic powder is contained in the above range, the green sheet produced becomes an appropriate density and strength on the basis of functioning as a part of a chip-type laminated electronic component.

[0063] (Binder resin)

[0064] The binder resin in the composition of the present application preferably contains at least one selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic acid, polyurethane, polyvinyl pyrrolidone, polyethylene glycol, ethylene-vinyl acetate copolymer, and cellulose ether, and more preferably contains polyvinyl acetate.

[0065] These binder resins can bond the inorganic powders to each other, and are therefore preferable in terms of molding the composition of the present application into a prescribed shape.

[0066] In particular, if the binder resin is polyvinyl acetate, the compound having the structure represented by the above general formula (1) is less likely to orient to the acetoxy group of the molecule constituting the polyvinyl acetate, because the polarity is low.

[0067] Therefore, the compound having the structure represented by the above general formula (1) is less likely to enter between the molecules constituting the polyvinyl acetate, and thus the polyvinyl acetate is easily aggregated to each other. As a result, the Tg of the polyvinyl acetate is increased.

[0068] Therefore, the Tg of the polyvinyl acetate can be adjusted using a glass transition temperature adjusting agent, and the moldability of the composition of the present application is improved.

[0069] The binder resin is preferably contained in the composition of the present application in an emulsion state.

[0070] In this case, the inorganic powder in the composition of the present application is not partially concentrated, and is easily dispersed.

[0071] The composition of the present application preferably contains the binder resin in a proportion of from 5 parts by weight to 50 parts by weight, more preferably from 5 parts by weight to 30 parts by weight, and further preferably from 10 parts by weight to 20 parts by weight, with respect to 100 parts by weight of the inorganic powder.

[0072] If the binder resin is less than 5 parts by weight relative to 100 parts by weight of the inorganic powder, the content of the binder resin is small, and thus the inorganic powder is not easily bonded to each other sufficiently. As a result, when the composition is molded into a prescribed shape, the molded product is easily collapsed.

[0073] If the binder resin is more than 50 parts by weight relative to 100 parts by weight of the inorganic powder, the content of the inorganic powder is relatively small, and thus the dimensional change at the time of calcination becomes large, and the stress due to shrinkage becomes large, and thus cracks are easily generated.

[0074] (Glass transition temperature adjusting agent)

[0075] In the composition of the present application, R 1 may be a linear or branched hydrocarbon group having 1 to 12 carbon atoms. In addition, R 1 may contain an unsaturated bond, or can be composed of only a saturated bond, and is preferably composed of only a saturated bond.

[0076] If R 1 contains an unsaturated bond, the rotation within the molecule is restricted, and the portion having the unsaturated bond becomes a rigid planar structure. On the other hand, if R 1 is composed of only a saturated bond, the rotation within the molecule is not restricted, and thus the rise in Tg is gentle compared to the case where the unsaturated bond is contained. It is only necessary to select the presence or absence of the unsaturated bond according to the required Tg. It should be noted that, in addition to the viewpoint of Tg, the case where the saturated bond is contained is more stable in substance compared to the case where the unsaturated bond is contained, and is easy to manage as a material.

[0077] It should be noted that R 1 is preferably 2-ethylhexyl.

[0078] In the composition of the present application, R 2 may be a linear, branched, or cyclic hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring.

[0079] R 2 is a cyclic hydrocarbon group, it can also be a heterocycle.

[0080] In addition, R 2 is preferably a linear hydrocarbon group having 4 carbon atoms.

[0081] In addition, R 2 may contain an unsaturated bond, or can be composed of only a saturated bond.

[0082] In the composition of the present application, R 3 may be a linear or branched hydrocarbon group having 1 to 12 carbon atoms. In addition, R 3It can contain unsaturated bonds, or can be composed of only saturated bonds, and is preferably composed of only saturated bonds.

[0083] Note that R 3 is preferably 2-ethylhexyl.

[0084] The compound having the structure represented by General Formula (1) in the composition of the present application can contain derivatives of succinic acid, adipic acid, sebacic acid, azelaic acid, maleic acid, dodecanedioic acid, glutaric acid, fumaric acid, cyclohexene dicarboxylic acid, 1,2-cyclohexane dicarboxylic acid, 1,2-cyclopentane dicarboxylic acid, itaconic acid, and the like.

[0085] As such derivatives of dicarboxylic acids, there can be mentioned alkyl succinates, alkyl adipates, alkyl sebacates, alkyl azelates, alkyl maleates, alkyl dodecanedioates, alkyl glutarates, alkyl fumarates, alkyl cyclohexene dicarboxylates, alkyl 1,2-cyclohexane dicarboxylates, alkyl 1,2-cyclopentane dicarboxylates, alkyl itaconates, and the like.

[0086] Note that in this case, there can also be a residue of a carboxyl group in the structure represented by General Formula (1) (i.e., R 3 is a hydrogen atom).

[0087] The compound having the structure represented by General Formula (1) in the composition of the present application is preferably adipic acid bis(2-ethylhexyl) ester represented by the following General Formula (2).

[0088]

[0089] The above-mentioned alkyl dicarboxylates are inexpensive, and enable reduction of the manufacturing cost of the composition of the present application.

[0090] In the composition of the present application, it is preferable to contain a glass transition temperature adjusting agent in an amount of 0.01 parts by weight to 1.5 parts by weight, and more preferable to contain the same in an amount of 0.1 parts by weight to 1.0 parts by weight, with respect to 100 parts by weight of the inorganic powder.

[0091] If the glass transition temperature adjusting agent is less than 0.01 parts by weight with respect to 100 parts by weight of the inorganic powder, the Tg of the binder resin does not easily rise sufficiently.

[0092] If the glass transition temperature adjusting agent exceeds 1.5 parts by weight with respect to 100 parts by weight of the inorganic powder, the effect of the rise in the Tg of the binder resin approaches the upper limit, and is not economical.

[0093] (Solvent)

[0094] The composition of the present application can further contain a solvent.

[0095] As the solvent, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-l,3-pentanediol monoisobutyrate (Texanol), eugenol, terpineol, dihydrotepineol, benzyl alcohol, ethanol, methyl ethyl ketone, diethyl ketone, and the like can be given.

[0096] These solvents are useful in the composition of the present application in uniformly mixing the inorganic powder, the binder resin, and the plasticizer.

[0097] The proportion of the solvent contained in the composition of the present application is preferably 0.05 to 20% by weight.

[0098] (Other additives)

[0099] The composition of the present application can contain a dispersant, a plasticizer, an antifoaming agent, a wetting agent as the other additives.

[0100] As the dispersant, an ammonium salt of polycarboxylic acid, a maleic anhydride-styrene copolymer can be given.

[0101] As the plasticizer, diglycerin, polyglycerin, alkyl ester of hydroxy acid can be given.

[0102] As the antifoaming agent, polyalkylene glycol, dimethylpolysiloxane, octadecanol can be given.

[0103] As the wetting agent, polyalkylene glycol, polyglycerin can be given.

[0104] (Proportions of each component, etc.)

[0105] In the composition of the present application, it is preferable to contain the binder resin in an amount of 5 to 50 parts by weight with respect to 100 parts by weight of the inorganic powder, and to contain the glass transition temperature adjusting agent in an amount of 0.01 to 1.5 parts by weight with respect to 100 parts by weight of the inorganic powder, more preferably to contain the binder resin in an amount of 5 to 30 parts by weight with respect to 100 parts by weight of the inorganic powder, and to contain the glass transition temperature adjusting agent in an amount of 0.01 to 1.5 parts by weight with respect to 100 parts by weight of the inorganic powder, further preferably to contain the binder resin in an amount of 10 to 20 parts by weight with respect to 100 parts by weight of the inorganic powder, and to contain the glass transition temperature adjusting agent in an amount of 0.1 to 1.0 parts by weight with respect to 100 parts by weight of the inorganic powder.

[0106] If the composition of the present application contains the inorganic powder, the binder resin, and the glass transition temperature adjusting agent in such proportions, the Tg of the binder resin is appropriately increased. Therefore, the moldability of the composition of the present application is improved.

[0107] In the composition of the present application, the proportion of the weight of the binder resin with respect to the weight of the glass transition temperature adjusting agent (wt%) is preferably 2 to 5000, more preferably 2.5 to 200.

[0108] Next, a method for producing the composition of the present application will be described.

[0109] The method for producing the composition of the present application includes a pulverization step of pulverizing an inorganic material to produce an inorganic powder, and a mixing step of mixing the inorganic powder, a binder resin, and a glass transition temperature adjusting agent. The plasticizer includes a compound having a structure represented by the following general formula (1).

[0110]

[0111] (In the general formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms.

[0112] In the general formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring.

[0113] In the general formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

[0114] The Tg of the binder resin can be increased by using the glass transition temperature adjusting agent including the compound having the structure represented by the above general formula (1). That is, by using the glass transition temperature adjusting agent, the plasticity of the produced composition can be adjusted.

[0115] In the method for producing the composition of the present application, in the mixing step, the inorganic powder, the binder resin, and the plasticizer are preferably mixed at 5 to 50 parts by weight of the binder resin and 0.01 to 1.5 parts by weight of the plasticizer with respect to 100 parts by weight of the inorganic powder. Further, in the mixing step, the inorganic powder, the binder resin, and the plasticizer are more preferably mixed at 5 to 30 parts by weight of the binder resin and 0.01 to 1.5 parts by weight of the plasticizer with respect to 100 parts by weight of the inorganic powder, and further preferably mixed at 10 to 20 parts by weight of the binder resin and 0.1 to 1.0 parts by weight of the plasticizer with respect to 100 parts by weight of the inorganic powder.

[0116] If the produced composition contains the inorganic powder, the binder resin, and the glass transition temperature adjusting agent in such proportions, the Tg of the binder resin is appropriately increased. Therefore, the moldability of the produced composition is improved.

[0117] Next, a chip-type laminated electronic component produced using the composition of the present application will be described. The chip-type laminated electronic component produced using the composition of the present application is also one embodiment of the present application.

[0118] In addition, when a chip-type laminated electronic component is produced, a sheet-shaped article obtained using the composition of the present application and a laminate obtained by laminating the sheet-shaped article are produced, and these sheet-shaped article and laminate are also one embodiment of the present application.

[0119] Figure 1A is a cross-sectional view schematically showing one example of a sheet-shaped article of the present application.

[0120] Figure 1B is an enlarged view of the broken line portion of Figure 1A

[0121] When a chip-type laminated electronic component of the present application is produced, first, as shown in Figure 1A , a composition of the present application is molded into a sheet shape to produce a sheet-shaped article 10a.

[0122] The method of molding the composition of the present application into a sheet shape is not particularly limited, and, for example, a method using a bar coater, a method of performing printing, and the like, which are conventionally known, can be used.

[0123] Note that when the sheet-shaped article 10a is produced, since the specific gravity of the binder resin is lower than the specific gravity of the inorganic powder, as shown in Figure 1B , the density of the binder resin 11a becomes higher as it approaches the upper surface of the sheet-shaped article 10a.

[0124] After the sheet-shaped article 10a is molded, a through hole (not shown) can be formed on the sheet-shaped article 10a as needed, and in addition, a conductor paste (not shown) can be disposed on the sheet-shaped article 10a.

[0125] The through hole and the conductor paste can use conventionally known materials, and the method of forming and disposing them can also use conventionally known methods.

[0126] Figure 2A and Figure 2B is a schematic view of one example of a process of producing a laminate using a sheet-shaped article of the present application.

[0127] Next, as shown in Figure 2A , a plurality of sheet-shaped articles 10a are prepared.

[0128] Then, as shown in Figure 2B , the sheet-shaped articles 10a are laminated and crimped to produce a mother block 20a as a laminate.

[0129] The conditions of the crimping are not particularly limited, and conventionally known methods can be used.

[0130] Then, the mother block 20a can be cut into a prescribed shape to form a chip-shaped article.

[0131] Furthermore, R chamfering processing can be performed on the edges of the chip-shaped article as needed.​

[0132] Note that the mother sheet 20a and the chips are both included in the laminate of the present application.

[0133] These laminates are made by using the composition of the present application, and thus are less likely to be deformed. Therefore, the appearance quality of the green sheet made by the process described later, and the deviation of the electrical characteristics are reduced.

[0134] Next, the chips are subjected to debinding and calcination. Thereby, the sheet 10a becomes a calcined sheet 10, and a green sheet 20 in which a plurality of calcined sheets 10 are laminated can be made as shown in Figure 3

[0135] Figure 3 is a side view schematically showing one example of a green sheet in which a plurality of calcined sheets are laminated.

[0136] Note that at the time of calcination, the conductor paste formed on the sheet 10a becomes an internal electrode.

[0137] In addition, at the time of calcination, the binder resin 11a contained in the sheet 10a is thermally decomposed to become a pore 11.

[0138] As described above, in the sheet 10a, the density of the binder resin 11a becomes higher as it approaches the upper surface. Therefore, the density of the pore 11 is also high in the portion where the density of the binder resin 11a is high. Therefore, as shown in Figure 3

[0139] As shown in Figure 3 The green sheet 20 is a plurality of calcined sheets 10 laminated, and thus when the green sheet 20 is observed from the side, a stripe pattern perpendicular to the lamination direction is formed in the green sheet 20.

[0140] The green sheet 20 can be formed with an external electrode or the like as needed.

[0141] The chip-type laminated electronic component of the present application can be made by such a method.

[0142] Note that as described above, when the green sheet 20 is observed from the side, a stripe pattern perpendicular to the lamination direction is formed in the green sheet 20, and thus in the chip-type laminated electronic component of the present application having the green sheet 20, the stripe pattern can be recognized as a mark to identify the side of the chip-type laminated electronic component.

[0143] That is, when the chip-type laminated electronic component is observed, the observer can recognize the surface on which the stripe pattern is formed as the side, and the surface on which the stripe pattern is not formed as the upper surface or the lower surface, in the green sheet of the chip-type laminated electronic component. ​​

[0144] Therefore, in the chip-type laminated electronic component of the present application, no other identification mark needs to be formed on the side surface, upper surface, or lower surface of the green body.

[0145] Therefore, the manufacturing cost can be reduced.

[0146] The following invention is described in this specification.

[0147] The present application (1) is a composition comprising an inorganic powder, a binder resin, and a glass transition temperature adjusting agent, the glass transition temperature adjusting agent comprising a compound having a structure represented by the following general formula (1).

[0148]

[0149] (In the general formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms.

[0150] In the general formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring.

[0151] In the general formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

[0152] The present application (2) is the composition according to the present application (1), wherein the glass transition temperature adjusting agent is a derivative of at least one kind of dicarboxylic acid selected from the group consisting of succinic acid, adipic acid, sebacic acid, azelaic acid, maleic acid, dodecanedioic acid, glutaric acid, fumaric acid, cyclohexene dicarboxylic acid, 1,2-cyclohexane dicarboxylic acid, 1,2-cyclopentane dicarboxylic acid, and itaconic acid.

[0153] The present application (3) is the composition according to the present application (1) or (2), wherein the composition further comprises a solvent.

[0154] The present application (4) is the composition according to any one of the present applications (1) to (3), wherein the binder resin comprises at least one kind selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic acid, polyurethane, polyvinyl pyrrolidone, polyethylene glycol, ethylene-vinyl acetate copolymer, and cellulose ether.

[0155] The present application (5) is the composition according to any one of the present applications (1) to (4), wherein the inorganic powder comprises a ceramic powder.

[0156] The present application (6) is the composition according to any one of the present applications (1) to (4), wherein the inorganic powder comprises at least one kind selected from the group consisting of zirconium oxide, titanium dioxide, aluminum oxide, barium titanate, ferrite, lead zirconate titanate, zinc oxide, glass, and glass-ceramics.

[0157] The present application (7) is the composition described in any one of the present application (1) to (6), wherein 5 to 50 parts by weight of the above-mentioned binder resin and 0.01 to 1.5 parts by weight of the above-mentioned glass transition temperature adjusting agent are contained with respect to 100 parts by weight of the above-mentioned inorganic powder.

[0158] The present application (8) is a sheet-shaped article comprising the composition described in any one of the present application (1) to (7).

[0159] The present application (9) is a laminate in which a plurality of the sheet-shaped articles described in the present application (8) are laminated.

[0160] The present application (10) is a method for producing a composition, comprising: a pulverization step of pulverizing an inorganic material to produce an inorganic powder, and a mixing step of mixing the above-mentioned inorganic powder, a binder resin, and a glass transition temperature adjusting agent; the above-mentioned glass transition temperature adjusting agent comprising a compound having a structure represented by the following general formula (1).

[0161]

[0162] (In the general formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms.

[0163] In the general formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring.

[0164] In the general formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

[0165] The present application (11) is the method for producing a composition described in the present application (10), wherein in the above-mentioned mixing step, the above-mentioned inorganic powder, the above-mentioned binder resin, and the above-mentioned glass transition temperature adjusting agent are mixed at 5 to 50 parts by weight of the above-mentioned binder resin and 0.01 to 1.5 parts by weight of the above-mentioned glass transition temperature adjusting agent with respect to 100 parts by weight of the above-mentioned inorganic powder.

[0166] The present application (12) is a chip-type laminated electronic component, comprising a green body in which a plurality of ceramic sintered sheets are laminated, and a stripe pattern perpendicular to a lamination direction is formed in the green body when the green body is observed from a side surface.

[0167] Examples

[0168] Hereinafter, examples in which the composition and the like of the present application are more specifically disclosed. It should be noted that the present application is not limited to the following examples.

[0169] (Examples)

[0170] 50 parts by weight of pure water, 0.5 parts by weight of polycarboxylic acid ammonium salt (dispersant) relative to 100 parts by weight of ferrite, and the ferrite were mixed, and the mixture was pulverized using a ball mill to produce a ferrite powder (inorganic powder).

[0171] Next, the ferrite powder, polyvinyl acetate (binder resin), and adipic acid bis(2- ethylhexyl) ester (glass transition temperature adjuster) were mixed in the proportions shown in Table 1 to produce the slurry composition of the example.

[0172] Next, after the composition of the example was subjected to a defoaming treatment, the composition was coated on a PET film in a sheet shape, and hot air drying was performed, whereby a sheet (thickness: about 50 μm) of the example was produced.

[0173] (Comparative Example)

[0174] The slurry composition was produced without using adipic acid bis(2-ethylhexyl) ester (glass transition temperature adjuster), and the ferrite powder and polyvinyl acetate (binder resin) were mixed in the proportions shown in Table 1, and a sheet (thickness: about 50 μm) of the comparative example was produced in the same manner as the example, except for this.

[0175] (Determination of Dynamic Viscoelasticity and Calculation of Tg)

[0176] Next, the sheets of the example and the comparative example were subjected to press bonding to produce laminates having a thickness of 500 μm.

[0177] Next, the laminates of the example and the comparative example were cut into a width x length = 10 mm x 50 mm to serve as test samples.

[0178] Next, using the test samples of the example and the comparative example, determination of dynamic viscoelasticity was performed.

[0179] The determination of dynamic viscoelasticity was performed using a viscoelasticity measuring device (model name: DMA7000, manufacturer: Hitachi High-Technologies Corporation) at a measurement temperature of -30 to 100°C.

[0180] Based on the results of the determination of dynamic viscoelasticity, the Tg of the binder resin contained in the compositions of the example and the comparative example was calculated.

[0181] The results are shown in Table 1.

[0182] [Table 1]

[0183]

[0184] As shown in Table 1, it was ascertained that if adipic acid bis(2-ethylhexyl) ester is used as a glass transition temperature adjuster, the Tg of the polyvinyl acetate contained in the composition rises.

[0185] (Relationship between the amount of use of the glass transition temperature adjusting agent and Tg)

[0186] The ferrite powder, polyvinyl acetate (binder resin) and adipic acid bis (2- ethylhexyl) ester (glass transition temperature adjusting agent) were mixed in the proportions shown in Table 2, and otherwise, the Tg of the polyvinyl acetate in each mixture was calculated in the same manner as in the above "Measurement of dynamic viscoelasticity and calculation of Tg". Then, the extent to which the Tg of the polyvinyl acetate had risen relative to the Tg of the polyvinyl acetate in the above comparative example was evaluated according to the following criteria. The results are shown in Table 2.

[0187] (Evaluation criteria for the rise in Tg)

[0188] The Tg of the polyvinyl acetate in the above comparative example was taken as "T0", and the Tg of the polyvinyl acetate in each of the examples was taken as "T x ", and Evaluation Al and Evaluation A2 were evaluated to satisfy the following relational expressions.

[0189] Al: 5°C ≤ (T x - T0)

[0190] A2: (T x - T0) < 5°C

[0191] [Table 2]

[0192]

[0193] In addition, the proportion of the rise in the Tg of the polyvinyl acetate relative to the amount of use of adipic acid bis (2-ethylhexyl) ester was evaluated according to the following criteria. The results are shown in Table 3.

[0194] (Evaluation criteria for the proportion of the rise in Tg)

[0195] The weight proportion of adipic acid bis (2-ethylhexyl) ester relative to the ferrite powder was taken as "W x ", and Evaluation Bl, Evaluation B2 and Evaluation B3 were evaluated to satisfy the following relational expressions.

[0196] Bl: 16 ≤ (T x - T0) / W x

[0197] B2: 7 ≤ (T x - T0) / W x < 16

[0198] B3: (T x - T0) / W x < 7

[0199] [Table 3]

[0200]

[0201] Among the above evaluations, the examples which satisfy both Evaluation Al and Evaluation Bl can be evaluated as "Excellent", the examples which satisfy both Evaluation A2 and Evaluation Bl or both Evaluation Al and Evaluation B2 can be evaluated as "Good", and the examples other than the above can be evaluated as "Available". The evaluation is shown in Table 4.

[0202] [Table 4]

[0203]

[0204] As shown in Tables 2 to 4, it was ascertained that by adjusting the ratio of polyvinyl acetate and bis(2-ethylhexyl) adipate, the Tg of the polyvinyl acetate of the composition of the examples could be adjusted.

Claims

1. A composition comprising an inorganic powder, a binder resin, and a glass transition temperature adjusting agent, the glass transition temperature adjusting agent comprises a compound having a structure represented by the following general formula (1), In General Formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms, In General Formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring, In General Formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

2. The composition of claim 1, wherein, the glass transition temperature adjusting agent is a derivative of at least one dicarboxylic acid selected from the group consisting of succinic acid, adipic acid, sebacic acid, azelaic acid, maleic acid, dodecanedioic acid, glutaric acid, fumaric acid, cyclohexene dicarboxylic acid, 1,2-cyclohexane dicarboxylic acid, 1,2-cyclopentane dicarboxylic acid, itaconic acid.

3. The composition according to claim 1 or 2, wherein, the composition further comprises a solvent.

4. The composition according to any one of claims 1 to 3, wherein, the binder resin comprises at least one selected from the group consisting of polyvinyl acetate, polyvinyl butyral, polyvinyl alcohol, acrylic acid, polyurethane, polyvinyl pyrrolidone, polyethylene glycol, ethylene-vinyl acetate copolymer, cellulose ether.

5. The composition according to any one of claims 1 to 4, wherein, the inorganic powder comprises a ceramic powder.

6. The composition according to any one of claims 1 to 4, wherein, the inorganic powder comprises at least one selected from the group consisting of zirconia, titania, alumina, barium titanate, ferrite, lead zirconate titanate, zinc oxide, glass, glass-ceramics.

7. The composition according to any one of claims 1 to 6, wherein, 5 to 50 parts by weight of the binder resin and 0.01 to 1.5 parts by weight of the glass transition temperature adjusting agent are contained with respect to 100 parts by weight of the inorganic powder.

8. A sheet comprising the composition according to any one of claims 1 to 7.

9. A laminate obtained by laminating a plurality of the sheet according to claim 8.

10. A method for producing a composition, comprising: a pulverization step of pulverizing an inorganic material to produce an inorganic powder, and a mixing step of mixing the inorganic powder, a binder resin, and a glass transition temperature adjusting agent; the glass transition temperature adjusting agent comprises a compound having a structure represented by the following general formula (1), In General Formula (1), R 1 is a hydrocarbon group having 1 to 12 carbon atoms, In General Formula (1), R 2 is a hydrocarbon group having 1 to 12 carbon atoms other than a benzene ring, In General Formula (1), R 3 is a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms.

11. The method of manufacturing a composition according to claim 10, wherein, in the mixing step, the inorganic powder, the binder resin, and the glass transition temperature adjusting agent are mixed at 5 to 50 parts by weight of the binder resin and 0.01 to 1.5 parts by weight of the glass transition temperature adjusting agent with respect to 100 parts by weight of the inorganic powder.

12. A chip-type laminated electronic component comprising a green body obtained by laminating and calcining a plurality of ceramic sheets, when the green body is observed from a side surface, a stripe pattern perpendicular to a lamination direction is formed on the green body.

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