Temperature adjusting device for spray header, process chamber comprising temperature adjusting device and semiconductor processing equipment comprising temperature adjusting device

Abstract

The present invention relates to a temperature control device for a showerhead, a process chamber including the same, and a semiconductor processing apparatus, the temperature control device being simple in structure and easy to control, and being capable of improving the uniformity of a thin film formed on a substrate, the temperature control device for a showerhead comprising a plurality of temperature control units, the temperature adjusting units can be detachably arranged at the upper part of the spray head so as to respectively adjust the temperature of different parts of the spray head, and each of the temperature adjusting units comprises a pipeline which is arranged in the temperature adjusting unit and is used for accommodating and conveying temperature adjusting fluid; an injection port disposed on one side of the upper surface of the temperature control unit and configured to inject the temperature control fluid into one end of the conduit; and a discharge port disposed on the other side of the upper surface of the temperature control unit and discharging the temperature control fluid from the other end of the conduit.

Description

TECHNICAL FIELD

[0001] The present application relates to a temperature adjusting device for a showerhead, a process chamber and a semiconductor processing equipment comprising the same, in particular to a temperature adjusting device for a showerhead, a process chamber and a semiconductor processing equipment comprising the same, which has a simple structure, is easy to control, and can improve the uniformity of a film formed on a substrate. BACKGROUND

[0002] With the development of semiconductor technology, various semiconductor processing technologies and equipment emerge in an endless stream. Meanwhile, as the requirements for the fineness and yield of semiconductor products are gradually improved, the requirements for the stability and processing uniformity of semiconductor processing technologies and equipment are also increasing.

[0003] Taking chemical vapor deposition (CVD) as an example, in order to form a uniform film on a substrate, it is necessary to uniformly react at each position on the surface of the substrate. That is, on the one hand, it is necessary to uniformly heat the substrate carried by a carrier table to a specified temperature by using a carrier table having a heating function; on the other hand, it is also necessary to heat the showerhead by using a heater arranged on the showerhead to provide the substrate with process gas having a specified temperature.

[0004] Among them, the substrate is directly carried on the carrier table, so it is relatively easy to achieve uniform heating. However, the process gas is first heated by the showerhead, and then diffuses for a distance before it can contact the substrate. Therefore, even if the showerhead uniformly heats the process gas, as long as the process gas is disturbed by any slight interference during the diffusion process to the substrate, it is possible that different parts of the process gas finally contact different positions of the substrate at different temperatures, thereby causing the film formed at each position of the substrate to be non-uniform.

[0005] On the other hand, the existing heater for the showerhead often uses heating wires to heat, and such a structure has a relatively complex control system, and the number of hardware and software is large, which is difficult to simplify. In addition, since the heating wire itself needs to be powered, when the current flows through the heating wire, an induced magnetic field is formed, thereby interfering with the operation of the remote plasma source (FPR: Remote Plasma Resoure), the radio frequency (RF: Radio Frequency) source, etc. In order to eliminate such interference, it is necessary to further provide a structure for blocking the magnetic field, thereby making the structure of the heater for the showerhead more complex. Such a complex structure further increases the difficulty of maintenance and replacement of the equipment.

[0006] Therefore, there is currently a need for a heater for a showerhead which has a simple structure, is easy to control, and can make the substrate contact the process gas at the same temperature at each position thereof. SUMMARY

[0007] Technical problem

[0008] One object of the present application is to provide a temperature regulating device for a showerhead, which is simple in structure, easy to control, and convenient to maintain and replace.

[0009] Another object of the present application is to provide a process chamber including the temperature regulating device for a showerhead of the present application, so that a substrate contacts process gas of the same temperature at each position thereof.

[0010] Another object of the present application is to provide a semiconductor processing apparatus including the process chamber of the present application, so that a substrate contacts process gas of the same temperature at each position thereof.

[0011] Technical solution

[0012] One embodiment of the present application provides a temperature regulating device for a showerhead, which includes a plurality of temperature regulating units capable of being detachably arranged at an upper portion of the showerhead to respectively regulate temperatures of different portions of the showerhead, each of the temperature regulating units including a pipe arranged inside the temperature regulating unit for receiving and delivering a temperature regulating fluid, an injection port arranged at one side of an upper surface of the temperature regulating unit for injecting the temperature regulating fluid into one end of the pipe, and an exhaust port arranged at the other side of the upper surface of the temperature regulating unit for exhausting the temperature regulating fluid from the other end of the pipe.

[0013] In one embodiment of the present application, the pipe can be formed in a meandering manner in a horizontal direction.

[0014] In one embodiment of the present application, the pipe can be further formed in a wavy manner in a vertical direction.

[0015] In one embodiment of the present application, a cross section of the pipe at at least one position in the extending direction thereof can be smaller than that at other positions.

[0016] In one embodiment of the present application, a flow resistance member can be arranged in the pipe, the flow resistance member being provided with a through hole for the temperature regulating fluid to flow through.

[0017] In one embodiment of the present application, each of the plurality of temperature regulating units can further include a vacuum insulation cavity arranged inside the temperature regulating unit and located above the pipe.

[0018] In one embodiment of the present application, a heat reflecting layer can be formed on an inner wall of the vacuum insulation cavity.

[0019] In one embodiment of the present application, a temperature-adjusting fluid source for supplying temperature-adjusting fluid of a predetermined temperature to the plurality of temperature-adjusting units can be further included.

[0020] In one embodiment of the present application, the plurality of temperature-adjusting units can be connected to the temperature-adjusting fluid source in parallel or in series.

[0021] The plurality of temperature-adjusting units can be directly connected to the temperature-adjusting fluid source, respectively.

[0022] The temperature-adjusting fluid source can supply temperature-adjusting fluid of different temperatures to the plurality of temperature-adjusting units, respectively.

[0023] Another embodiment of the present application provides a process chamber, comprising: a showerhead for spraying process gas toward a substrate; a substrate access port configured to a sidewall of the process chamber for opening and closing an internal space of the process chamber to receive a substrate to be processed from outside or to output a processed substrate to outside; and the above-mentioned temperature-adjusting device for a showerhead, wherein, among the plurality of temperature-adjusting units of the temperature-adjusting device for a showerhead, a temperature of temperature-adjusting fluid injected to a temperature-adjusting unit relatively close to the substrate access port is higher than a temperature of temperature-adjusting fluid injected to a temperature-adjusting unit relatively far from the substrate access port.

[0024] Another embodiment of the present application provides a semiconductor processing apparatus, comprising a process chamber group including a plurality of the above-mentioned process chambers connected side by side, wherein, among the plurality of temperature-adjusting units of the temperature-adjusting device for a showerhead of the plurality of process chambers, a temperature of temperature-adjusting fluid injected to a temperature-adjusting unit relatively close to an edge of the process chamber group is higher than a temperature of temperature-adjusting fluid injected to a temperature-adjusting unit relatively far from the edge of the process chamber group.

[0025] Advantageous effects

[0026] The temperature-adjusting device for a showerhead of the present application has a simple structure and is easy to control, and is convenient for maintenance and replacement.

[0027] The process chamber of the present application can make the substrate contact process gas of the same temperature at each position thereof.

[0028] The semiconductor processing apparatus of the present application can make the substrate contact process gas of the same temperature at each position thereof. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a top view of a temperature-adjusting device for a showerhead of one embodiment of the present application.

[0030] Figure 2 is a top view of a showerhead provided with a temperature-adjusting device for a showerhead of one embodiment of the present application.

[0031] Figure 3 It is based on Figure 1 The section line AA in the figure shows a cross-sectional view of the temperature control device for the spray head.

[0032] Figure 4 It is based on Figure 3 The section line BB in the figure shows a cross-sectional view of the temperature control device for the spray head.

[0033] Figure 5 This is a schematic diagram of different cross-sections of a pipeline according to one embodiment of the present invention.

[0034] Figure 6 This is a schematic diagram of a flow-blocking component with mesh-like through holes according to one embodiment of the present invention.

[0035] Figure 7 This is a schematic diagram of a flow-blocking component with a semi-circular through-hole according to one embodiment of the present invention.

[0036] Figure 8 It is based on Figure 3 The section line CC in the figure shows a cross-sectional view of the temperature control device for the spray head.

[0037] Figure 9 This is a top view of the internal structure of a process chamber according to one embodiment of the present invention.

[0038] Figure 10 This is a top view of the internal structure of a semiconductor processing apparatus according to one embodiment of the present invention.

[0039] Figure Labels

[0040] 1000: Temperature control device for spray heads

[0041] 100: Temperature control unit

[0042] 100a: First temperature control unit

[0043] 100b: Second temperature control unit

[0044] 100c: Third temperature control unit

[0045] 100d: Fourth temperature control unit

[0046] 110: Piping

[0047] 111: Injection Port

[0048] 112: Discharge Port

[0049] 113: Flow throttling component

[0050] 120: Vacuum insulation cavity

[0051] 121: Vacuum valve

[0052] 200: Process Chamber

[0053] 200a: First process chamber

[0054] 200b: Second process chamber

[0055] 210: Sprayer head

[0056] 220: Baseboard entrance and exit

[0057] 230: Interior Space

[0058] 231: Process Space

[0059] 232: Teleportation Space

[0060] 300: Semiconductor processing equipment

[0061] 310: Process Chamber Group Detailed Implementation

[0062] The following describes one or more embodiments of the present invention in detail with reference to the accompanying drawings. Obviously, these embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0063] The terminology used in the following embodiments is for illustrative or explanatory purposes only and is not intended to limit the scope of protection of the present invention. Furthermore, the singular expressions used in this invention, such as "a," "an," "the," "the," "the," and "this," are intended to include plural forms such as "one or more," unless the context clearly indicates otherwise. It should also be understood that, in embodiments of the present invention, the use of terms such as "one or more," "at least one," and "more than one" is intended to include cases of one, two, and at least three.

[0064] Furthermore, when the terms "in one embodiment," "in some embodiments," or "in one or more embodiments" are used in the description of this invention, it is intended that one or more embodiments of the invention may include specific technical features described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," and "in one or more embodiments" appearing in different parts of this specification do not necessarily refer to the same embodiment, but may refer to both the same embodiment and different embodiments, unless the specific technical features described in those embodiments cannot be used alone or in combination.

[0065] Furthermore, in this invention, when an element is described as "comprising," "containing," or "having" another element, it is intended to be an open-ended definition, meaning that the element may include other elements besides the other element. Conversely, when an element is described as "comprising only," "containing only," "having only," or "consisting of another element," it is intended to be a closed-ended definition, meaning that the element does not include other elements besides the other element. However, it should be noted that when the term "formed by another element" is used to describe the formation relationship between multiple elements, this term is not intended to be a closed-ended definition; it should be considered that the other element forms part of the first element, and the first element may include other elements besides the other element.

[0066] It should be understood that when sequential terms such as "first" and "second" are used in this document to describe various elements, these sequential terms are only used to distinguish one element from another, and should not be interpreted as indicating a primary or secondary relationship, or a sequential relationship. Without departing from the scope of this invention, a first element may be labeled as a second element, and a second element may be labeled as a first element.

[0067] In this invention, when describing the positional relationship between two or more elements, if terms such as "above", "below", or "between" are used, it indicates that one or more other elements may be set between the two or more elements, unless terms such as "exactly" or "adjacent" are used.

[0068] Hereinafter, one or more embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can clearly and completely understand the present invention. When the description of well-known structures or features would unnecessarily obscure the main points of the present invention, the description of such well-known structures or features will be omitted.

[0069] The present invention provides a temperature control device for a spray head, which can appropriately adjust the temperature of different parts of the spray head (i.e., at least one of heating, cooling, and heat preservation) so that the process gas ejected through the nozzles of different parts of the spray head 210 is adjusted to an appropriate temperature, so that when the process gas reaches the upper surface of the substrate, each part contacts the substrate at the same temperature.

[0070] Figure 1 This is a top view of a temperature control device for a spray head according to one embodiment of the present invention. Figure 2 This is a top view of a spray head equipped with a temperature control device for a spray head according to one embodiment of the present invention.

[0071] like Figure 1 and Figure 2 As shown, the temperature control device 1000 for the spray head may include multiple temperature control units 100. The multiple temperature control units 100 are detachably disposed on the upper part of the spray head 210 to adjust the temperature of the spray head 210. Specifically, the multiple temperature control units 100 collectively cover the upper surface of the spray head 210 so as to appropriately adjust the temperature of different parts of the spray head 210 corresponding to the multiple temperature control units 100 respectively.

[0072] Typically, the upper surface of a spray head is circular, with a pipe for supplying process gas connected at its center. In a preferred embodiment, the plurality of temperature-regulating units 100 can collectively form a disc shape with a through-hole at its center, thus fully covering the upper surface of the spray head 210 while leaving space for the connection between the spray head 210 and the pipe for supplying process gas. Each of the plurality of temperature-regulating units 100 can, for example, be a fan-shaped ring with a predetermined central angle (e.g., 90°, 120°, 180°, etc.) to easily assemble the aforementioned disc shape. Furthermore, when the central angles of the plurality of temperature-regulating units 100 are the same, all temperature-regulating units 100 can be manufactured using the same process, shortening the time required to manufacture the temperature-regulating device 1000 for the spray head. Simultaneously, maintenance and replacement become easier. Of course, the shape of a single temperature-regulating unit 100 and the shape formed by multiple temperature-regulating units 100 are not limited to this; those skilled in the art can make appropriate selections based on the shape of the spray head, the location requiring temperature adjustment, and other practical considerations.

[0073] Figure 3 It is based on Figure 1 The section line AA in the figure shows a cross-sectional view of the temperature control device for the spray head.

[0074] like Figure 3As shown, each of the plurality of temperature-regulating units 100 may include a pipe 110 disposed inside the temperature-regulating unit 100. The pipe 110 is used to receive and transport temperature-regulating fluid. The temperature-regulating fluid may be a temperature-regulating fluid used for at least one of heating, cooling, and heat preservation; that is, a temperature-regulating fluid of appropriate temperature can be selected as needed. The following description uses heating as an example. For instance, when it is necessary to heat the spray head 210, a temperature-regulating fluid of a specified temperature can be injected into one end of the pipe 110, causing the temperature-regulating fluid to flow within the pipe 110 and contact the inner wall of the pipe 110, thereby exchanging heat with the spray head 210 (i.e., heating), and ultimately transferring the heat to the spray head 210. The temperature-regulating fluid that has completed the heat exchange flows out from the other end of the pipe 110, and can then be reheated and injected back into the same end of the pipe 110.

[0075] Furthermore, the temperature-regulating fluid can be selected in appropriate states (e.g., liquid or gas) and types (e.g., water, coolant, inert gas, etc.) as needed. Further, the pressure of the temperature-regulating fluid can be controlled as needed. For example, when a type of liquid is selected as the temperature-regulating fluid, if the boiling point of the liquid is slightly lower than the desired temperature, it can be pressurized during heating to maintain the desired temperature; conversely, if the boiling point of the liquid is slightly higher than the desired temperature, it can be depressurized during heating to maintain the desired temperature. In this way, the temperature-regulating fluid can be selected in various ways as needed, and the present invention is not limited thereto.

[0076] As described above, the present invention heats the spray head 210 through contact and heat exchange between the temperature-regulating fluid and the inner wall of the pipe 110; that is, the more sufficient the contact between the temperature-regulating fluid and the inner wall of the pipe 110, the higher the heat exchange efficiency. Therefore, to improve the heat exchange efficiency, the length of the pipe 110 should be as long as possible to increase the contact area. For this purpose, as... Figure 1As shown, the temperature control unit 100 may have an injection port 111 on one side of its upper surface for injecting the temperature control fluid into one end of the pipe 110, and an outlet port 112 on the other side for discharging the temperature control fluid from the other end of the pipe 110, thereby allowing the pipe 110 to extend from one side of the temperature control unit 100 to the other side, that is, allowing the temperature control fluid to flow through the entire length of the temperature control unit 100, thereby enabling more thorough heat exchange. The injection port 111 and the discharge port 112 can be, for example, one-way valves. Specifically, the injection port 111 can be a one-way valve that allows external temperature-regulating fluid to flow into the pipe 110 while preventing the temperature-regulating fluid in the pipe 110 from flowing out. The discharge port 112 can be a one-way valve that allows the temperature-regulating fluid in the pipe 110 to flow out while preventing external temperature-regulating fluid from flowing into the pipe 110. This avoids the reduction in heat exchange efficiency caused by backflow of the temperature-regulating fluid in the pipe 110.

[0077] Figure 4 It is based on Figure 3 The section line BB in the figure shows a cross-sectional view of the temperature control device for the spray head.

[0078] As a preferred embodiment, such as Figure 4 As shown, the conduit 110 can be formed in a zigzag pattern, or an S-shaped pattern, or an approximately right-angled pattern (as shown in...). Figure 4 middle).

[0079] In a more preferred embodiment, the conduit 110 can be formed by further undulating in the vertical direction (not shown), based on its horizontally tortuous extension as described above. For example, it can be further extended in a zigzag pattern, or in an S-shape, or in an approximately right-angled undulation. It can also be extended in a meandering, multi-layered manner between the injection port 111 and the discharge port 112.

[0080] On the other hand, when the length of the pipe 110 is the same, the flow rate of the temperature-regulating fluid in the pipe 110 can be slowed down by forming a structure in the pipe 110 that can impede the flow of the temperature-regulating fluid, so as to prolong its flow time, that is, to increase the contact time between the temperature-regulating fluid and the inner wall of the pipe 110, so as to fully carry out heat exchange and thereby improve the heating efficiency.

[0081] Therefore, as an embodiment of the present invention, the pipe 110 may have different cross-sections in its extension direction.

[0082] Figure 5 This is a schematic diagram of different cross-sections of a pipeline according to one embodiment of the present invention.

[0083] like Figure 5 As shown, the pipe 110 may have a smaller cross-section at at least one location along its extension direction, while having larger cross-sections elsewhere. When the temperature-regulating fluid flows through these two cross-sections sequentially, its flow rate slows down at the smaller cross-section due to obstruction by the inner wall of the pipe 110. Then, at the larger cross-section, negative pressure is generated against the inner wall of the pipe 110, causing another slowdown. This alternation continuously slows the flow rate of the temperature-regulating fluid within the pipe 110, extending the flow time and thus improving heat exchange efficiency. Of course, the aforementioned smaller cross-sections may not have only one area; they may have multiple areas of different sizes. Based on this, they can be further divided into a first smallest cross-section, a second smallest cross-section, a third smallest cross-section, etc. By using these smaller cross-sections in combination, for example, by sequentially arranging larger cross-sections, the first smallest cross-section, a larger cross-section, the second smallest cross-section, a larger cross-section, the third smallest cross-section, and a larger cross-section along the extension direction of the pipe 110, the flow rate of the temperature-regulating fluid can be further slowed down.

[0084] In addition, the cross-sectional shape of the pipe 110 can be more than just the circle mentioned above, such as ellipse, polygon, etc., and cross-sections of different shapes can also be mixed and arranged, as long as they can effectively slow down the flow rate of the temperature-regulating fluid in the pipe 110.

[0085] As another embodiment, a flow-blocking element 113 may be provided in the pipeline 110, and the flow-blocking element 113 may be provided with a through hole for the temperature-regulating fluid to flow through.

[0086] The following is for reference Figure 6 and Figure 7 Two examples of the flow-blocking element 113 are described in detail.

[0087] Figure 6 This is a schematic diagram of a flow-blocking component with mesh-like through holes according to one embodiment of the present invention.

[0088] like Figure 6 As shown, the mesh-like through-hole can be composed of seven small holes forming a hexagon. These small holes may have the same or different areas, and their shapes may also be the same or different, for example, they can be one or more of the following: circular, semi-circular, polygonal, etc. Those skilled in the art can make appropriate selections according to the actual situation.

[0089] When the temperature-regulating fluid flows through the flow-blocking member 113 with mesh-like through holes, it is blocked at the front of the flow-blocking member 113 and its flow rate slows down. Then, a negative pressure is generated at the back of the flow-blocking member 113 and its flow rate slows down again.

[0090] Figure 7 This is a schematic diagram of a flow-blocking component with a semi-circular through-hole according to one embodiment of the present invention.

[0091] like Figure 7 As shown, the semi-circular through hole can be formed on one half of the flow obstruction 113 with its arc side close to the edge of the flow obstruction 113. Depending on the setting angle of the flow obstruction 113 in the pipeline 110, the arc side of the semi-circular through hole can have different orientations, such as upward, downward, or even left or right (not shown).

[0092] Taking the flow-blocking member 113 with the arc side of the semi-circular through hole facing downward as an example, when the temperature-regulating fluid flows through the flow-blocking member 113, the lower half of the temperature-regulating fluid passes smoothly through the flow-blocking member 113, while the upper half is blocked by the front of the flow-blocking member 113 and its flow rate is slowed down. Then, the lower half that has passed through is subjected to the negative pressure generated by the back of the flow-blocking member 113 and generates upward rotating turbulence, thereby slowing down the flow rate.

[0093] Multiple flow-blocking elements 131 with semi-circular through holes can be provided in the pipeline 110. In this case, the arc sides of the semi-circular through holes of the multiple flow-blocking elements 131 can all have the same orientation, for example, all facing down, or facing up, or facing left, or facing right, etc. Alternatively, the arc sides of the semicircular through holes of the multiple flow-blocking elements 131 can have different orientations. Specifically, the arc sides of the semicircular through holes of two adjacent flow-blocking elements 131 can have different orientations. For example, along the extension direction of the pipe 110, they can be downward and upward, or left and right, or upward, downward, left and right, or upward, left, downward and right, etc., so that the two adjacent semicircular through holes are staggered, thereby further slowing down the flow rate of the temperature-regulating fluid. Alternatively, the pipe 110 can be divided into multiple segments along its extension direction, with multiple flow-blocking elements 131 provided in each segment, and the arc sides of their semicircular through holes having the same orientation. However, the arc sides of the semicircular through holes in two adjacent segments have different orientations, so that the semicircular through holes in two adjacent segments are staggered, thereby further slowing down the flow rate of the temperature-regulating fluid.

[0094] Furthermore, the semi-circular through holes can have different areas. When multiple flow-blocking elements 131 with semi-circular through holes are provided in the pipe 110, for example, the flow-blocking elements 131 with semi-circular through holes of different areas can be arranged sequentially along the extension direction of the pipe 110. Those skilled in the art can make appropriate selections regarding the area of ​​the semi-circular through holes, the orientation of the arc side, etc., according to actual conditions.

[0095] The structure for heat exchange according to the present invention has been described in detail above. The structure for heat insulation according to the present invention will now be described in detail.

[0096] Refer again Figure 3 Each of the plurality of temperature control units 100 may further include a vacuum insulation cavity 120. The vacuum insulation cavity 120 may be disposed inside the temperature control unit 100 and located above the pipe 110 to block the heat of the temperature control unit 100 from escaping through the upper surface of the temperature control unit 100 (i.e., the side not in contact with the spray head 210), and at the same time, to prevent the external temperature from affecting the spray head 210 downward through the upper surface of the temperature control unit 100.

[0097] Figure 8 It is based on Figure 3 The section line CC in the figure shows a cross-sectional view of the temperature control device for the spray head.

[0098] like Figure 8 As shown, in one embodiment, when the temperature regulating unit 100 is fan-shaped, the vacuum insulation cavity 120 can be fan-shaped concentric with the temperature regulating unit 100. In this case, the vacuum insulation cavity 120 can completely cover the upper surface of the temperature regulating unit 100 along its arc length, thereby effectively preventing heat from dissipating through the upper surface of the temperature regulating unit 100.

[0099] As a preferred embodiment, a heat-reflective layer (not shown) may be further formed on the inner wall of the vacuum insulation cavity 120 to reflect the heat radiated toward the upper side of the temperature control unit 100 to the lower side of the temperature control unit 100, that is, the side of the spray head 210.

[0100] The heat-reflective layer can be formed by surface treatment of the inner wall. For example, the inner wall can be processed to have a specified roughness to improve thermal insulation performance and / or heat radiation reflection performance. Alternatively, heat-reflective materials and / or thermal insulation materials can be coated or deposited on the inner wall to form a coating capable of reflecting heat radiation and / or providing thermal insulation.

[0101] On the other hand, such as Figure 1 and Figure 3As shown, a vacuum valve 121 communicating with the vacuum insulation cavity 120 can be formed on the upper surface of the temperature control unit 100. The vacuum valve 121 can be a commonly used valve in the art that can ensure vacuum (e.g., a one-way valve), as long as it can ensure the vacuum level in the vacuum insulation cavity 120.

[0102] When the temperature control unit 100 is under maintenance, the vacuum level in the vacuum insulation cavity 120 can be detected through the vacuum valve 121. If the vacuum level is insufficient, a vacuum pump (not shown) can be used to evacuate the vacuum insulation cavity 120 through the vacuum valve 121 to bring the vacuum level to a specified value. The vacuum pump can be a commonly used vacuum pump in the art, which may be equipped with a pressure gauge to confirm the vacuum level in real time during the evacuation process, so as to stop evacuation when the vacuum level reaches the specified value.

[0103] The structure of a single temperature control unit 100 of the present invention has been described in detail above. Hereinafter, the operation of the overall temperature control device 1000 for a spray head of the present invention will be described in detail with reference to the structure of the present invention for supplying temperature-controlled fluid.

[0104] The temperature control device 1000 for a spray head of the present invention may further include a temperature control fluid source (not shown). The temperature control fluid source is used to supply temperature control fluid at a predetermined temperature to the plurality of temperature control units 100. Specifically, the temperature control fluid source can inject the temperature control fluid into the temperature control unit 100 through the injection port 111, and receive the temperature control fluid from the temperature control unit 100 through the discharge port 112. More specifically, the temperature control fluid source may include: a supply port (not shown), connected to the injection port 111, for injecting temperature control fluid with a predetermined temperature into the temperature control unit 100; a receiving port (not shown), connected to the discharge port 112, for receiving the temperature control fluid that has undergone heat exchange from the temperature control unit 100; and a recovery section for restoring the temperature of the temperature control fluid that has undergone heat exchange to the predetermined temperature. Multiple supply ports and multiple receiving ports may be provided respectively.

[0105] On the other hand, the supply port can be connected to one or more of the injection ports 111. For example, the supply port can be connected one-to-one to one of the injection ports 111, or connected one-to-many to multiple injection ports 111 via a manifold or the like. Additionally, the receiving port can be connected to one or more of the discharge ports 112. For example, the receiving port can be connected one-to-one to one of the discharge ports 112, or connected one-to-many to multiple discharge ports 112 via a manifold or the like.

[0106] In one implementation, the temperature-regulating fluid source may use one of the supply ports, which supplies the temperature-regulating fluid at a predetermined temperature to one of the plurality of temperature-regulating units 100, i.e., it is connected to the injection port 111 of one temperature-regulating unit 100. At this time, the receiving port is connected to the discharge port 112 of another temperature-regulating unit 100, while the remaining injection ports 111 and discharge ports 112 are connected alternately to each other, thereby connecting the plurality of temperature-regulating units 100 in series. This allows the temperature-regulating fluid from the temperature-regulating fluid source to flow sequentially through all the temperature-regulating units 100 and return to the temperature-regulating fluid source. As the temperature-regulating fluid flows sequentially through all the temperature-regulating units 100, its temperature gradually decreases. Therefore, the order of the plurality of temperature-regulating units 100 can be arranged as needed, so that the temperature-regulating fluid at the desired temperature flows through each of the plurality of temperature-regulating units 100, thereby appropriately adjusting the temperature of different parts of the spray head 210.

[0107] In another embodiment, the temperature-regulating fluid source can use a single supply port, which simultaneously supplies temperature-regulating fluid at a predetermined temperature to each of the plurality of temperature-regulating units 100. Specifically, the supply port is connected to all the injection ports 111 of each of the plurality of temperature-regulating units 100. In this case, the receiving port is connected to all the discharge ports 112 of each of the plurality of temperature-regulating units 100, thereby connecting the plurality of temperature-regulating units 100 in parallel. This allows the temperature-regulating fluid from the temperature-regulating fluid source to simultaneously flow through all the temperature-regulating units 100 and return to the temperature-regulating fluid source. Since the temperature-regulating fluid at the same temperature flows simultaneously within each of the plurality of temperature-regulating units 100, the spray head 210 is uniformly heated as a whole.

[0108] In another embodiment, the temperature-regulating fluid source can use multiple supply ports, which supply temperature-regulating fluids of the same or different temperatures to multiple temperature-regulating units 100 respectively. When the process gas ejected through a nozzle at a certain part of the spray head 210 is relatively prone to cooling during diffusion towards the substrate, the temperature-regulating fluid source can supply a temperature-regulating fluid with a relatively higher temperature to the temperature-regulating unit 100 corresponding to that part, so that the process gas diffuses towards the substrate at a relatively higher temperature and ultimately contacts the substrate at the same temperature as the process gas in other parts. Alternatively, when a certain part of the spray head 210 itself is relatively prone to cooling, the temperature-regulating fluid source can supply a temperature-regulating fluid with a relatively higher temperature to the temperature-regulating unit 100 corresponding to that part, so that the part has the same temperature as other parts, so as to uniformly heat the process gas as a whole. In this case, the temperature-regulating fluid source can use multiple recovery sections to form temperature-regulating fluids of the same or different temperatures respectively.

[0109] The above describes various connection methods between the temperature-regulating fluid source and the plurality of temperature-regulating units 100. However, these connection methods are not mutually exclusive and can be used in combination as appropriate.

[0110] The following is for reference Figure 9 The process chamber of the present invention will be described in detail.

[0111] Figure 9 This is a top view of the internal structure of a process chamber according to one embodiment of the present invention.

[0112] like Figure 9 As shown, the present invention provides a process chamber 200, comprising: a spray head 210 for spraying process gases onto a substrate; a substrate inlet / outlet 220 disposed on a side wall of the process chamber 200 for opening and closing the internal space 230 of the process chamber 200 to receive a substrate to be processed from the outside or to output a processed substrate; and a temperature control device for the spray head of the present invention. Hereinafter, the content regarding the temperature control device for the spray head of the present invention, which is repeated above, will be omitted. Furthermore, the process chamber 200 of the present invention may also include structures such as a supporter, but these details, which are not relevant to the main points of the present invention, will also be omitted.

[0113] The internal space 230 may include a process space 231 and a transfer space 232. The process space 231 is a space for processing the substrate and is circular in a top-view perspective. The transfer space 232 is a space for transferring the substrate, which extends from the substrate entrance / exit 220 to the process space 231 with a predetermined width and is rectangular in a top-view perspective.

[0114] The process space 231 partially overlaps with the transfer space 232, while the portion of the transfer space 232 that does not overlap with the process space 231 protrudes from the process space 231 toward the substrate entrance / exit 220. Therefore, the process space 231 is redundant space.

[0115] When the spray head 210 injects process gas into the internal space 230 to process the substrate, the aforementioned excess space causes the process gas ejected through the nozzles of the spray head 210, which are relatively close to the substrate inlet / outlet 220, to lose temperature relatively easily during diffusion into the substrate.

[0116] To address this problem, as one embodiment of the present invention, in the plurality of temperature control units 100 of the spray head temperature control device, the temperature of the temperature control fluid injected into the temperature control unit 100 that is relatively close to the substrate inlet / outlet 220 may be higher than the temperature of the temperature control fluid injected into the temperature control unit 100 that is relatively far away from the substrate inlet / outlet 220.

[0117] To show Figure 9 Taking two temperature-regulating units 100, namely, a first temperature-regulating unit 100a and a second temperature-regulating unit 100b, as an example, the first temperature-regulating unit 100a is relatively close to the substrate inlet / outlet 220, while the second temperature-regulating unit 100b is relatively far from the substrate inlet / outlet 220. In this case, for example, when a temperature-regulating fluid of 80°C is supplied to the second temperature-regulating unit 100b, a temperature-regulating fluid of 100°C, higher than 80°C, can be supplied to the first temperature-regulating unit 100a.

[0118] In other embodiments, the number of temperature control units 100 may be three or more, and the above-mentioned 80°C and 100°C are just examples. Those skilled in the art can make appropriate selections according to actual conditions.

[0119] The following is for reference Figure 10 The semiconductor processing apparatus of the present invention will be described in detail.

[0120] Figure 10 This is a top view of the internal structure of a semiconductor processing apparatus according to one embodiment of the present invention.

[0121] like Figure 10 As shown, the present invention provides a semiconductor processing apparatus 300, which includes a process chamber assembly 310, wherein the process chamber assembly 310 may include a plurality of process chambers 200 of the present invention connected side by side. Hereinafter, the content regarding the temperature control device for the spray head and the process chambers 200 of the present invention, which is repeated above, will be omitted. Furthermore, the semiconductor processing apparatus 300 of the present invention also naturally includes structures such as an Equipment Front End Module (EFEM), but these contents, which are not relevant to the main points of the present invention, will also be omitted.

[0122] The plurality of process chambers 200 are connected side-by-side with their respective substrate inlets / outlets 220 facing the same direction. In this case, among all the sidewalls of the plurality of process chambers 200, the sidewalls located at the edges of the process chamber group 310 are relatively more susceptible to external temperature influences compared to the sidewalls of adjacent process chambers 200 that are in contact with each other. Therefore, when the spray head 210 injects process gas into the internal space 230 to process the substrate, the process gas ejected through the nozzles of the spray head 210 relatively close to the edge of the process chamber group 310 is relatively prone to heat loss during diffusion towards the substrate, or the portion of the spray head 210 relatively close to the edge of the process chamber group 310 is relatively prone to heat loss, resulting in uneven film formation on the substrate.

[0123] To address this problem, as one embodiment of the present invention, in the plurality of temperature control units 100 of the temperature control device for the spray head of the plurality of process chambers 200, the temperature of the temperature control fluid injected into the temperature control unit 100 relatively close to the edge of the process chamber group 310 may be higher than the temperature of the temperature control fluid injected into the temperature control unit 100 relatively far from the edge of the process chamber group 310.

[0124] To show Figure 10 Taking two process chambers 200 in the example, namely, a first process chamber 200a on the left and a second process chamber 200b on the right, the first process chamber 200a may include a first temperature regulating unit 100a relatively close to the left edge of the process chamber group 310 and a second temperature regulating unit 100b relatively far from the left edge of the process chamber group 310. The second process chamber 200b may include a third temperature regulating unit 100c relatively far from the right edge of the process chamber group 310 and a fourth temperature regulating unit 100d relatively close to the right edge of the process chamber group 310. In this case, for example, when a temperature regulating fluid of 80°C is supplied to the second temperature regulating unit 100b and the third temperature regulating unit 100c, a temperature regulating fluid of 100°C, higher than 80°C, may be supplied to the first temperature regulating unit 100a and the fourth temperature regulating unit 100d.

[0125] As another implementation, the number of process chambers 200 may be three or more, and the number of temperature control units 100 in the process chambers 200 may also be three or more. Moreover, the above-mentioned 80°C and 100°C are just examples, and those skilled in the art can make appropriate selections according to actual conditions.

[0126] If the influence of the substrate inlet / outlet 220 and the like is further considered in addition to the edge of the process chamber group 310, the number of temperature control units 100 arranged in each process chamber 200 and the temperature of the temperature control fluid supplied to each temperature control unit 100 can be appropriately adjusted, as long as the process gas that is relatively easy to lose temperature can diffuse to the substrate at a relatively higher temperature and finally contact the substrate at the same temperature as the process gas in other parts, thereby forming a uniform film on the substrate. The present invention is not limited to this.

[0127] The embodiments of the present invention have been described above, but this is only for the purpose of helping to fully understand the present invention. The present invention is not limited thereto, and those skilled in the art can make various modifications and variations based on these descriptions. Therefore, the technical concept of the present invention is not limited to the above-described embodiments, and the appended claims and their equivalents or variations are all within the scope of the present invention.

Claims

1. A temperature control device for a spray head, characterized in that, It includes multiple temperature control units, which are detachably mounted on the upper part of the spray head to adjust the temperature of different parts of the spray head individually. Each of the plurality of temperature control units includes: Pipelines, located inside the temperature control unit, are used to collect and transport temperature-controlled fluid; An injection port, located on one side of the upper surface of the temperature control unit, is used to inject the temperature-controlling fluid into one end of the pipeline; and The discharge port is located on the other side of the upper surface of the temperature control unit for discharging the temperature control fluid from the other end of the pipeline.

2. The temperature control device for a spray head according to claim 1, characterized in that, The pipeline is formed in a tortuous manner extending in the horizontal direction.

3. The temperature control device for a spray head according to claim 2, characterized in that, The conduit is formed by extending further in a vertically undulating manner.

4. The temperature control device for a spray head according to claim 1, characterized in that, The cross-section of the pipeline is smaller at at least one location along its extension direction than the cross-sections at other locations.

5. The temperature control device for a spray head according to claim 1, characterized in that, A flow-blocking element is provided inside the pipeline, and the flow-blocking element has a through hole for the temperature-regulating fluid to flow through.

6. The temperature control device for a spray head according to claim 1, characterized in that, Each of the plurality of temperature control units further includes a vacuum insulation cavity disposed inside the temperature control unit and located above the pipeline.

7. The temperature control device for a spray head according to claim 6, characterized in that, A heat-reflective layer is formed on the inner wall of the vacuum insulation cavity.

8. The temperature control device for a spray head according to claim 1, characterized in that, It further includes a temperature-regulating fluid source, which is used to supply temperature-regulating fluid at a specified temperature to the plurality of temperature-regulating units.

9. The temperature control device for a spray head according to claim 8, characterized in that, The multiple temperature control units are connected to the temperature control fluid source in parallel or in series with each other.

10. The temperature control device for a spray head according to claim 8, characterized in that, The plurality of temperature control units are each directly connected to the temperature control fluid source.

11. The temperature control device for a spray head according to claim 10, characterized in that, The temperature-regulating fluid source supplies temperature-regulating fluids of different temperatures to the plurality of temperature-regulating units respectively.

12. A process chamber, characterized in that, include: Spray nozzles are used to spray process gases onto the substrate. The substrate inlet / outlet is located on one side wall of the process chamber and is used to open and close the internal space of the process chamber to receive substrates to be processed from the outside or to output processed substrates to the outside. as well as Temperature control device for spray heads as described in any one of claims 1 to 11 in, In the multiple temperature control units of the spray head temperature control device, the temperature of the temperature control fluid injected into the temperature control unit that is relatively close to the substrate inlet / outlet is higher than the temperature of the temperature control fluid injected into the temperature control unit that is relatively far from the substrate inlet / outlet.

13. A semiconductor processing apparatus, characterized in that, The process chamber group includes a plurality of process chambers as described in claim 12, which are connected side by side. in, In the multiple temperature control units of the temperature control device for the spray heads of the multiple process chambers, the temperature of the temperature control fluid injected into the temperature control unit that is relatively close to the edge of the process chamber group is higher than the temperature of the temperature control fluid injected into the temperature control unit that is relatively far away from the edge of the process chamber group.

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