Impact recorder

Abstract

The invention provides an impact recorder. The impact recorder is light in weight. The impact recorder comprises: an acceleration sensor; a circuit element having a timer circuit for generating time data, a sensor circuit for processing an output signal of the acceleration sensor, and a storage circuit for storing processed data processed by the sensor circuit in association with the time data; and a package accommodating the acceleration sensor and the circuit element, the mass of the impact recorder being less than 20 g. Furthermore, when the mass of the impact measurement object is denoted by m1 and the mass is denoted by m2, the relationship m2 < = (1 / 50) * m1 is satisfied.

Description

Technical Field

[0001] This invention relates to an impact recorder. Background Technology

[0002] Patent Document 1 describes an impact detection device capable of detecting impacts applied to transported goods. Furthermore, this impact detection device is configured to house an accelerometer, a real-time clock, an operation switch, an LED, a storage unit, a wireless communication unit, a control unit, and a battery within a semi-transparent or transparent resin housing.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-152563

[0004] However, Patent Document 1 makes no mention of the mass of the impact detection device. If the mass of the impact detection device is not sufficiently light relative to the transported goods, the impact detection results may be affected. Therefore, an error may arise between the actual impact generated by the transported goods and the impact detected by the impact detection device, potentially reducing the accuracy of the impact detection. Summary of the Invention

[0005] The impact recorder of the present invention comprises: an acceleration sensor; circuitry having a timing circuit for generating time data, a sensor circuit for processing the output signal of the acceleration sensor, and a storage circuit for storing the processed data processed by the sensor circuit in correspondence with the time data; and a package for housing the acceleration sensor and the circuitry, wherein the impact recorder weighs less than 20g. Attached Figure Description

[0006] Figure 1 This is a top view of the impact recorder of the first embodiment.

[0007] Figure 2 yes Figure 1 Sectional view along line AA in the diagram.

[0008] Figure 3 It is an exploded three-dimensional view showing the configuration of the various parts within the recess.

[0009] Figure 4 This is a top view of the vibrating element.

[0010] Figure 5 This is a top view of the accelerometer sensor.

[0011] Figure 6 It is a block diagram that represents the circuitry of a circuit element.

[0012] Figure 7 This is a diagram representing an example of event data.

[0013] Figure 8 This is a top view of the impact recorder of the second embodiment.

[0014] Figure 9 yes Figure 8 BB line section view.

[0015] Figure 10 This is a cross-sectional view of the impact recorder of the third embodiment.

[0016] Figure 11 This is a top view of the impact recorder of the fourth embodiment.

[0017] Figure 12 yes Figure 11 The CC line section view.

[0018] Figure 13 This is a top view of the impact recorder of the fifth embodiment.

[0019] Figure 14 This is a top view of the impact recorder of the sixth embodiment.

[0020] Figure 15 This is a cross-sectional view of the impact recorder of the seventh embodiment.

[0021] Label Explanation

[0022] 1: Impact recorder; 2: Support substrate; 21: Wiring; 22: Wiring; 3: Vibration element; 30: Base; 31: Vibration arm; 32: Vibration arm; 33: Support arm; 34: Support arm; 4: Accelerometer; 41: Package; 411: Base; 413: Cover; 42x: X-axis accelerometer element; 42y: Y-axis accelerometer element; 42z: Z-axis accelerometer element; 5: Circuit element; 5A: First circuit element; 5B: Second circuit element; 5C: Third circuit element; 5D: Fourth circuit element; 5E: Fifth circuit element; 50: Active surface; 51: Oscillation circuit; 511: Temperature sensor circuit; 52: Timing circuit; 53: Sensor circuit; 54: Storage circuit; 55: Interface circuit; 6: Battery; 7: Package; 71: Base; 72: ... 1: Recess; 712: Bottom surface; 713: First step surface; 714: Second step surface; 719: Recess; 72: Cover; 73: Seam ring; 741: First internal terminal; 742: Second internal terminal; 743: External terminal; 78: Base; 79: Molded part; 8: Oscillator; 80: Package; 81: Circuit element; Ax: Acceleration; Ay: Acceleration; Az: Acceleration; B1: Connecting component; B2: Connecting component; B3: Connecting component; CLK: Clock signal; Da: Processed data; Di: Event data; Dt: Time data; Dtmp: Temperature data; E1: First excitation electrode; E2: Second excitation electrode; H: Laminate; P1: First connection terminal; P2: Second connection terminal; P3: Connection terminal; P4: Connection terminal; RTC: Real-time clock; W: Line. Detailed Implementation

[0023] The impact recorder of the present invention will now be described in detail based on the embodiments shown in the accompanying drawings. Additionally, for ease of explanation, except... Figure 6 and Figure 7 In the figures other than those shown, the three mutually perpendicular axes are represented as the X-axis, Y-axis, and Z-axis. The direction along the X-axis is also called the "X-axis direction," the direction along the Y-axis is also called the "Y-axis direction," and the direction along the Z-axis is also called the "Z-axis direction." Furthermore, the arrow side of each axis is also called the "positive side," and the opposite side is also called the "negative side." Additionally, the Z-axis is along the vertical direction, and the arrow side is also called the "up," and the opposite side is called the "down."

[0024] <First Implementation>

[0025] Figure 1 This is a top view of the impact recorder of the first embodiment. Figure 2 yes Figure 1 Sectional view along line AA in the diagram. Figure 3 It is an exploded three-dimensional view showing the configuration of the various parts within the recess. Figure 4 This is a top view of the vibrating element. Figure 5 This is a top view of the accelerometer sensor. Figure 6 It is a block diagram that represents the circuitry of a circuit element. Figure 7 This is a diagram representing an example of event data.

[0026] Figure 1 The impact recorder 1 shown is mounted on a transported commodity that is the object of impact measurement. It detects impacts applied to the commodity and stores the detected impacts along with the time of occurrence. Based on this impact recorder 1, it is possible to determine when and to what extent an impact was applied to the transported commodity.

[0027] Therefore, from the perspective of the transport consignor (here, for ease of explanation, let's call them the goods manufacturer), if, for example, the goods are damaged or malfunction during transport, the date and time of the damage or malfunction, the cause, and the responsibility can be clearly identified, making subsequent responses to the transporter easier. Furthermore, by identifying the impact exerted on the goods during transport, the mechanical design of the goods can be re-evaluated, allowing for improvements to make the goods less prone to malfunction. Additionally, the shape and size of the cushioning components used to protect the goods from impacts can be re-evaluated; for example, if the re-evaluation results in a reduction in the size of the cushioning components, the cost of the goods and transportation costs can be reduced accordingly.

[0028] On the other hand, from the perspective of the transporter of goods, it can be effectively used as evidence to prove that they did not cause damage or malfunction. In addition, by using the impact recorder 1 to prove that the impact applied during transportation is much less than that of their competitors, they can demonstrate higher transportation quality and thus differentiate themselves from other transporters.

[0029] Thus, the impact recorder 1 brings various advantages to both the consignor and the carrier. In particular, the impact recorder 1 of this embodiment is cheaper and smaller than conventional impact recorders (such as the impact detection device described in Patent Document 1), and there is almost no increase in cost or size due to the installation of the impact recorder 1. Therefore, it becomes an impact recorder 1 with extremely high convenience.

[0030] like Figure 1 As shown, the impact recorder 1 includes a support base plate 2, a vibration element 3, an acceleration sensor 4, circuit elements 5, a battery 6, and a package 7 for housing these components. Such an impact recorder 1 is mounted on a product, for example, with its Z-axis positive side facing upwards in the vertical direction during transport.

[0031] [Package 7]

[0032] First, let's explain package 7. For example... Figures 1 to 3As shown, the package 7 has: a chamber-shaped base 71 having a recess 711 with an opening on its upper surface; and a plate-shaped cover 72 that engages with the upper surface of the base 71 via a seam ring 73, sealing the opening of the recess 711. With this structure, the package 7 has a simple structure. Furthermore, the package 7 has an internal space housing a support substrate 2, a vibration element 3, an accelerometer 4, circuit elements 5, and a battery 6. The internal space is hermetically sealed, operating under reduced pressure, preferably closer to a vacuum. This reduces the viscous resistance of the internal space, enabling the vibration element 3 to oscillate efficiently. However, the environment of the internal space is not particularly limited.

[0033] The material of the base 71 is not particularly limited, but various ceramics such as alumina can be used. Similarly, the material of the cover 72 is not particularly limited, but any component with a coefficient of linear expansion similar to that of the base 71 can be used. For example, if the base 71 is made of ceramic, it is preferable to use an alloy such as Kovar alloy for the cover 72. This structure creates a rigid encapsulation 7, increasing the mechanical strength of the impact recorder 1. Furthermore, as described later, the various parts can be electrically connected via internal wiring (not shown) formed in the base 71, eliminating the need for wiring boards or similar components for electrical connections. This also allows for lightweighting and miniaturization of the impact recorder 1. With this structure, the natural vibration frequency of the impact recorder 1 can be easily increased, making it sufficiently higher than the vibration frequency of the impact generated during transportation. Therefore, resonance of the impact recorder 1 caused by impacts generated during transportation can be effectively suppressed, enabling high-precision detection of impacts generated during transportation.

[0034] In addition, such as Figure 2 As shown, the base 71 has a bottom surface 712 of a recess 711, a first step surface 713 located on the upper side (positive side in the Z-axis direction) of the bottom surface 712 and parallel to the bottom surface 712, and a second step surface 714 located on the upper side (positive side in the Z-axis direction) of the first step surface 713 and parallel to the bottom surface 712. Additionally, as... Figure 1 As shown, when viewed from the Z-axis direction, the first step surface 713 is a frame-like structure surrounding the bottom surface 712. Furthermore, when viewed from the Z-axis direction, the second step surface 714 is arranged in two opposing sections in the Y-axis direction, separated from the bottom surface 712. The second step surface 714 is also positioned towards the negative side of the X-axis direction. Circuit elements 5 and a battery 6 are arranged along the X-axis direction on the bottom surface 712. An accelerometer 4 is positioned on the upper surface of the circuit elements 5. A support substrate 2 is positioned on the second step surface 714, and a vibration element 3 is positioned on the upper surface of the support substrate 2. However, the shapes of the first and second step surfaces 713 and 714 are not particularly limited.

[0035] In addition, such as Figure 1 As shown, a plurality of first internal terminals 741 are arranged on the first stepped surface 713, and a plurality of second internal terminals 742 are arranged on the second stepped surface 714. Additionally, as... Figure 2 As shown, a plurality of external terminals 743 are disposed on the lower surface of the base 71. Furthermore, the plurality of first internal terminals 741 are electrically connected to designated second internal terminals 742 or designated external terminals 743 via internal wiring (not shown) formed within the base 71. Additionally, each first internal terminal 741 is electrically connected to the circuit element 5 via a conductive line W (connection line), and each second internal terminal 742 is electrically connected to the vibrating element 3 via wiring 21, 22 formed on the conductive connection member B1 and the support substrate 2 (described later). Furthermore, the number and arrangement of the first and second internal terminals 741, 742 and the external terminals 743 are not particularly limited, and can be appropriately set according to the number of terminals of the circuit element 5 and the vibrating element 3.

[0036] Furthermore, the size of the package 7 is not particularly limited; for example, it is preferable to set the length in the X-axis direction × the length in the Y-axis direction to be 10 mm or less × 10 mm or less. This makes the impact recorder 1 sufficiently small. In this embodiment, it is approximately 7 mm × 5 mm.

[0037] [Vibration Element 3]

[0038] like Figure 4 As shown, the vibrating element 3 is a tuning fork type quartz oscillator. The vibrating element 3 is patterned into a predetermined shape by etching or the like, using a Z-cut quartz substrate. It has a base 30, a pair of vibrating arms 31 and 32 extending from the base 30 towards the negative Y-axis direction, and a pair of L-shaped support arms 33 and 34 extending from the base 30. Furthermore, the vibrating element 3 is bonded to the upper surface of the support substrate 2 at the ends of the support arms 33 and 34 via a conductive bonding member B2. The vibrating element 3 also has: a first excitation electrode E1 disposed on the upper and lower surfaces of the vibrating arms 31 and on both sides of the vibrating arms 32; and a second excitation electrode E2 disposed on both sides of the vibrating arms 31 and on the upper and lower surfaces of the vibrating arms 32. The first excitation electrode E1 is electrically connected to a first connection terminal P1 disposed at the end of the support arm 33 via wiring (not shown), and the second excitation electrode E2 is electrically connected to a second connection terminal P2 disposed at the end of the support arm 34 via wiring (not shown). In such a vibrating element 3, when a drive signal (alternating voltage) is applied between the first and second excitation electrodes E1 and E2 via the first and second connection terminals P1 and P2, the vibrating arms 31 and 32 vibrate in-plane in a manner that repeatedly approaches and separates from each other.

[0039] The above describes the vibrating element 3, but there are no particular limitations on the structure of the vibrating element 3. For example, it can also be a structure using a quartz substrate cut at an angle other than Z-cut, such as AT-cut or SC-cut.

[0040] [Support substrate 2]

[0041] like Figure 1 As shown, the support substrate 2 is a generally rectangular plate with a thickness along the Z-axis, and its outer edge is joined to the second stepped surface 714 via a conductive bonding member B1. Furthermore, the support substrate 2 is located below the vibrating element 3 and supports the vibrating element 3 from below at its center. In addition to its function of electrically relaying the vibration element 3 and the base 71, this support substrate 2 also has the following function: absorbing or mitigating stress caused by deformation of the base 71 or thermal stress caused by the difference in linear expansion coefficients, making it difficult for such stress to be transmitted to the vibrating element 3.

[0042] The support substrate 2, like the vibrating element 3, is made of a quartz substrate. This results in a support substrate 2 with high mechanical strength. Furthermore, by using the same quartz substrate as the vibrating element 3, the coefficients of linear expansion of the support substrate 2 and the vibrating element 3 are approximately equal. Therefore, thermal stress caused by the difference in their coefficients of linear expansion is substantially not generated between the support substrate 2 and the vibrating element 3, and the vibrating element 3 is less susceptible to stress. Consequently, the operation of the vibrating element 3 is more stable. In particular, the support substrate 2 is made of the same Z-cut quartz substrate as the vibrating element 3. Furthermore, the orientation of the crystal axis is also consistent with that of the vibrating element 3. The coefficient of linear expansion of quartz differs in the X-axis (electrical axis), Y-axis (mechanical axis), and Z-axis (optical axis) directions. Therefore, by setting the support substrate 2 and the vibrating element 3 to the same cut angle and aligning their crystal axes, the aforementioned thermal stress is less likely to be generated between the support substrate 2 and the vibrating element 3. Therefore, the vibrating element 3 is less susceptible to stress, and the operation of the vibrating element 3 is more stable.

[0043] Furthermore, the support substrate 2 is not limited to this; for example, it may be formed from a quartz substrate with the same chamfer as the vibrating element 3, but with a different crystal axis direction than the vibrating element 3. Alternatively, the support substrate 2 may be formed from a quartz substrate with a different chamfer than the vibrating element 3. Furthermore, the support substrate 2 may not be formed from a quartz substrate; for example, it may be formed from a silicon substrate, a resin substrate, or the like. Additionally, it may be a substrate for TAB (Tape Automated Bonding) mounting, having a support substrate and leads extending from it.

[0044] Furthermore, two wirings 21 and 22 are disposed on the support substrate 2 for electrically connecting the first and second connection terminals P1 and P2 of the vibrating element 3 to the second internal terminal 742 disposed on the second step surface 714 of the base 71. Moreover, one end of the wirings 21 and 22 is electrically connected to the second internal terminal 742 via a conductive bonding member B1, and the other end of the wirings 21 and 22 is electrically connected to the first and second connection terminals P1 and P2 via a conductive bonding member B2. In addition, there are no particular limitations on the bonding members B1 and B2 as long as they have both conductivity and bonding properties. For example, various metal bumps such as gold bumps, silver bumps, copper bumps, and solder bumps can be used, as well as conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide-based, epoxy-based, silicone-based, and acrylic-based adhesives.

[0045] [Acceleration Sensor 4]

[0046] Accelerometer 4 is a triaxial accelerometer capable of detecting acceleration Ax in the X-axis direction, acceleration Ay in the Y-axis direction, and acceleration Az in the Z-axis direction. Accelerometer 4 is a silicon MEMS (Micro Electro Mechanical Systems). Therefore, miniaturization of accelerometer 4 is possible.

[0047] In addition, such as Figure 5 As shown, the accelerometer 4 includes a package 41 and an X-axis accelerometer element 42x, a Y-axis accelerometer element 42y, and a Z-axis accelerometer element 42z housed within the package 41. The package 41 includes a base 411 supporting the sensor elements 42x, 42y, and 42z, and a cover 413 that engages with the upper surface of the base 411 and houses the sensor elements 42x, 42y, and 42z between the base 411 and the base 411. The base 411 is larger than the cover 413, and a portion of its upper surface (the end on the positive side in the Y-axis direction) protrudes outward from the cover 413. Furthermore, a plurality of connection terminals P3, electrically connected to the sensor elements 42x, 42y, and 42z, are arranged on the portion of the upper surface of the base 411 that protrudes from the cover 413.

[0048] Such an accelerometer 4 can be formed, for example, by the following steps: forming a base 411 from a silicon layer (processing layer) of an SOI (silicon on insulator) substrate, forming sensor elements 42x, 42y, and 42z from another silicon layer (device layer); and bonding a cover 413 formed from the silicon substrate to the base 411. Based on this structure, the accelerometer 4 can be manufactured using a silicon semiconductor process.

[0049] The following is a brief description of the X-axis acceleration sensor element 42x, the Y-axis acceleration sensor element 42y, and the Z-axis acceleration sensor element 42z.

[0050] X-axis accelerometer element 42x has a fixed comb electrode fixed to a base 411 and a movable comb electrode configured to engage with the fixed comb electrode and capable of shifting relative to the base 411 in the X-axis direction. The fixed and movable comb electrodes are arranged opposite each other in the X-axis direction. Furthermore, if an X-axis acceleration Ax is applied to the X-axis accelerometer element 42x, the movable comb electrode shifts in the X-axis direction, and the electrostatic capacitance between the fixed and movable comb electrodes changes accordingly. Therefore, the change in electrostatic capacitance can be taken as an output signal from the connection terminal P3, and the acceleration Ax can be detected based on this output signal. However, the structure of the X-axis accelerometer element 42x is not particularly limited as long as it can detect acceleration Ax.

[0051] The Y-axis accelerometer element 42y is structured such that the X-axis accelerometer element 42x can be rotated 90° around the Z-axis. Specifically, the Y-axis accelerometer element 42y has a fixed comb electrode fixed to the base 411 and a movable comb electrode configured to engage with the fixed comb electrode and capable of shifting relative to the base 411 in the Y-axis direction. The fixed and movable comb electrodes are arranged opposite each other in the Y-axis direction. Furthermore, if an acceleration Ay in the Y-axis direction is applied to the Y-axis accelerometer element 42y, the movable comb electrode shifts in the Y-axis direction, and the electrostatic capacitance between the fixed and movable comb electrodes changes accordingly. Therefore, this change in electrostatic capacitance can be extracted as an output signal from the connection terminal P3, and the acceleration Ay can be detected based on this output signal. However, the structure of the Y-axis accelerometer element 42y is not particularly limited as long as it can detect the acceleration Ay.

[0052] Z-axis accelerometer element 42z has a fixed comb electrode fixed to a base 411 and a movable comb electrode configured to engage with the fixed comb electrode and capable of shifting relative to the base 411 in the Z-axis direction. Furthermore, if an acceleration Az in the Z-axis direction is applied to the Z-axis accelerometer element 42z, the movable comb electrode shifts in the Z-axis direction, and the electrostatic capacitance between the fixed and movable comb electrodes changes accordingly. Therefore, this change in electrostatic capacitance can be extracted as an output signal from the connection terminal P3, and the acceleration Az can be detected based on this output signal. However, the structure of the Z-axis accelerometer element 42z is not particularly limited as long as it can detect the acceleration Az.

[0053] like Figures 1 to 3As shown, the accelerometer 4 of this structure is bonded to the upper surface of the circuit element 5 via a bonding member (not shown). Furthermore, each connection terminal P3 is electrically connected to the circuit element 5 via a conductive wire W (bonding wire).

[0054] The accelerometer 4 has been described above, but its structure is not particularly limited. For example, the base 411 and cover 413 may be formed from materials other than silicon, such as glass. Alternatively, the package 41 may be divided into segments for each sensor element 42x, 42y, and 42z. In this case, for example, the sensor elements 42x, 42y, and 42z may be arranged overlapping in the Z-axis direction. Alternatively, two or more sensor elements selected from 42x, 42y, and 42z may be integrally formed into a single sensor element. In other words, it may be a structure capable of detecting two or more of the accelerations Ax, Ay, and Az using a single sensor element. Furthermore, the accelerometer 4 is not limited to a triaxial accelerometer with three acceleration detection axes; it may have a structure with two acceleration detection axes or a structure with one acceleration detection axis. In this case, it is preferable to have at least a Z-axis accelerometer sensor element 42z capable of detecting acceleration Az in the Z-axis direction. This allows for more reliable detection of vertical impacts, which are most likely to occur during transportation and are also prone to causing malfunctions. Furthermore, the accelerometer 4 may not have a package 41, with sensor elements 42x, 42y, and 42z exposed within the internal space of the package 7. This structure enables further miniaturization of the impact recorder 1.

[0055] [Circuit Component 5]

[0056] like Figures 1 to 3 As shown, circuit element 5 is joined to the bottom surface 712 of recess 711 via a joining member (not shown). Furthermore, circuit element 5 is composed of a single chip. Thus, by comprising circuit element 5 with a single chip, for example, compared to the case where multiple chips constitute circuit element 5 as described later, circuit element 5 can be miniaturized. Therefore, miniaturization of the impact recorder 1 is possible. Moreover, by miniaturizing the impact recorder 1, the natural vibration frequency of the impact recorder 1 can be further increased, thus more effectively suppressing resonance with impacts during transportation, thereby enabling higher precision impact detection.

[0057] Furthermore, the circuit element 5 is positioned such that the active surface 50, on which multiple connection terminals P4 are formed, faces upward (positive side in the Z-axis direction), and the accelerometer 4 is disposed on the active surface 50. That is, the circuit element 5 and the accelerometer 4 are stacked on the base 71. Several of the multiple connection terminals P4 are electrically connected via wires W to the first internal terminal 741 disposed on the first step surface 713 of the base 71, and the remaining wires W are electrically connected to the accelerometer 4. Hereinafter, the stack of the circuit element 5 and the accelerometer 4 will also be referred to as the stack H.

[0058] In this way, by placing the circuit element 5 on the bottom surface 712 and the acceleration sensor 4 on its upper surface, a larger configurable area for the circuit element 5 can be ensured, allowing for the mounting of a larger circuit element 5. Therefore, it is possible to mount a higher performance circuit element 5, or a circuit element 5 with more functions. In particular, when mounting a programmable circuit element 5 whose functions can be freely customized by the user, the size of the circuit element 5 can easily become larger, thus the structure of this embodiment is effective.

[0059] Such a circuit element 5 is, for example, a Microcontroller Unit (MCU), which uniformly controls the various parts of the impact recorder 1. Furthermore, as... Figure 6 As shown, circuit element 5 includes: a temperature-compensated oscillation circuit 51 that causes the vibration element 3 to oscillate; a timing circuit 52 that generates time data Dt; a sensor circuit 53 that processes the output signal of the accelerometer 4 to calculate accelerations Ax, Ay, and Az; a storage circuit 54 that stores the processed data Da containing the accelerations Ax, Ay, and Az calculated by the sensor circuit 53 and the time data Dt as event data Di; an interface circuit 55 for communicating with the outside; and a control circuit (not shown) that controls each of these circuits 51 to 55.

[0060] The temperature-compensated oscillation circuit 51 includes a temperature sensor circuit 511 for detecting the temperature of the vibrating element 3. While not particularly limited, the temperature sensor circuit 511 can be, for example, a circuit with an NTC thermistor whose resistance changes with temperature, and which detects the temperature of the vibrating element 3 by utilizing the change in resistance. Furthermore, the oscillation circuit 51 is electrically connected to the vibrating element 3, amplifies the output signal of the vibrating element 3, and feeds the amplified signal back to the vibrating element 3, thereby causing the vibrating element 3 to oscillate and generate a clock signal CLK. The frequency of the clock signal CLK is, for example, 32.768 kHz. In addition, the oscillation circuit 51 compensates for the frequency-temperature characteristics of the clock signal CLK based on the temperature of the vibrating element 3 detected by the temperature sensor circuit 511. That is, temperature compensation is performed in a manner that makes the frequency variation of the clock signal CLK less than the frequency-temperature characteristics of the vibrating element 3 itself. With this structure, frequency variations of the clock signal CLK caused by temperature changes can be suppressed, generating a high-precision clock signal CLK.

[0061] As the oscillator circuit 51, for example, a Pierce oscillator circuit, an inverter-type oscillator circuit, a Colpitts oscillator circuit, a Hartley oscillator circuit, or other oscillator circuits can be used. Furthermore, regarding temperature compensation, for example, the frequency of the clock signal CLK can be adjusted by adjusting the capacitance of the variable capacitor circuit connected to the oscillator circuit 51, or the frequency of the clock signal CLK generated by the oscillator circuit 51 can be adjusted by a PLL circuit or a direct digital synthesizer circuit.

[0062] The clock signal CLK generated by the oscillation circuit 51 is divided by a frequency divider circuit (not shown) and then input to the timing circuit 52. For example, the frequency division ratio of the frequency divider circuit is 32, and the frequency of the clock signal CLK after division is 1.024kHz. The timing circuit 52 performs timing based on the clock signal CLK and generates time data Dt. The time data Dt has seconds, minutes, hours, days, months, and years as time positions. That is, in the impact recorder 1, the oscillation circuit 51 causes the vibrating element 3 to oscillate to generate the clock signal CLK, and the timing circuit 52 performs timing based on the clock signal CLK to generate time data Dt, thereby constituting a real-time clock (RTC). According to this structure, high-precision time data Dt can be generated.

[0063] In addition, sensor circuit 53 controls the drive of accelerometer 4, calculates acceleration Ax based on the output signal of X-axis accelerometer element 42x, acceleration Ay based on the output signal of Y-axis accelerometer element 42y, and acceleration Az based on the output signal of Z-axis accelerometer element 42z. Then, these accelerations Ax, Ay, and Az are output as processed data Da.

[0064] In addition, for example Figure 7As shown, the storage circuit 54 stores the processed data Da (acceleration Ax, Ay, Az) output from the sensor circuit 53 and the temperature data Dtmp detected by the temperature sensor circuit 511 as event data Di corresponding to the time data Dt generated by the timing circuit 52. That is, the storage circuit 54 generates and stores event data Di that corresponds to the current moment with the impact generated at that time and the temperature at that time in each measurement cycle. Therefore, based on the event data Di, the history of impacts received during transportation can be easily confirmed. In particular, since the event data Di contains the temperature data Dtmp, it becomes an impact recorder 1 with a large amount of information.

[0065] Based on this structure, in addition to determining the cause of malfunctions based on shocks during transportation, it is also possible to easily confirm, for example, whether goods (especially those requiring refrigeration or freezing) have consistently maintained an appropriate temperature range during transportation based on temperature data Dtmp. Furthermore, it is possible to determine malfunctions caused by exposure to excessively high or low temperatures during transportation, or malfunctions caused by condensation resulting from rapid temperature changes during transportation. Moreover, the storage circuit 54 may not store event data Di for the entire measurement cycle; for example, it may only store event data Di when accelerations Ax, Ay, and Az above a preset threshold are detected. With this structure, the capacity of the storage circuit 54 can be reduced.

[0066] In addition, the interface circuit 55 transmits and receives signals, accepts input (instructions) from the outside, and outputs event data Di stored in the storage circuit 54. There are no particular limitations on the communication method; for example, SPI (Serial Peripheral Interface) communication can be used.

[0067] [Battery 6]

[0068] like Figures 1 to 3 As shown, the battery 6 is engaged with the bottom surface 712 of the recess 711 via a coupling member (not shown). Furthermore, the battery 6 and the circuit element 5 are arranged in the X-axis direction. Moreover, the battery 6 supplies power to the circuit element 5. That is, the circuit element 5 is driven by power supplied from the battery 6. Therefore, the impact recorder 1 can operate even without an external power supply. Additionally, the battery 6 is not particularly limited; for example, a solid-state battery, a coin-type battery, etc., can be used.

[0069] There are no particular limitations on the configuration of the battery 6. For example, it can be configured together with the acceleration sensor 4 on the upper surface of the circuit element 5, or it can be configured on the upper surface of the acceleration sensor 4.

[0070] The structure of the impact recorder 1 has been described above. In this impact recorder 1, the vibration element 3, the support substrate 2, the acceleration sensor 4, and the circuit element 5 are arranged in the Z-axis direction. Furthermore, when viewed from above in the Z-axis direction, the vibration element 3, the support substrate 2, the acceleration sensor 4, and the circuit element 5 overlap each other. With this structure, the planar expansion of the impact recorder 1 in the X-axis and Y-axis directions, i.e., the area occupied, can be suppressed, thereby achieving miniaturization of the impact recorder 1.

[0071] Furthermore, the mass m2 of the impact recorder 1 is less than 20g. Therefore, the impact recorder 1 becomes sufficiently light. Consequently, the impact applied to the product (impact measurement object) on which the impact recorder 1 is mounted is not easily amplified or reduced by the spring-mass system formed between the product's casing and the impact recorder 1, allowing the impact equivalent to the actual impact applied to the product to be transmitted to the impact recorder 1. Therefore, the impact recorder 1 enables high-precision detection of impacts applied to the product. Moreover, the light weight of the impact recorder 1 does not correspondingly reduce the impact detection accuracy, allowing it to be easily mounted on lighter products, such as digital cameras, smartphones, tablets, smartwatches, smart glasses, and other wearable devices.

[0072] Furthermore, the mass m2 of the impact recorder 1 only needs to be less than 20g, but is more preferably less than 10g, and even more preferably less than 1g. This makes the impact recorder 1 even lighter. Therefore, the impact detection accuracy of the impact recorder 1 is further improved. In addition, the impact recorder 1 can be installed in lighter products.

[0073] Here, when the mass of the commodity (impact measurement object) is set as m1 and the mass of the impact recorder 1 is set as m2, the impact recorder 1 preferably satisfies the relationship m2 ≤ (1 / 50) × m1. That is, the mass m2 of the impact recorder 1 is preferably less than 1 / 50 of the mass m1 of the commodity. By satisfying this relationship, the impact recorder 1 becomes sufficiently light relative to the commodity, and the installation of the impact recorder 1 does not substantially affect the resonant frequency of the commodity, thus achieving an impact detection accuracy error of ±1%. That is, the impact detected by the impact recorder 1 can be made to have an error of less than 1% relative to the actual impact applied to the commodity. Therefore, the impact recorder 1 becomes an impact recorder with superior impact detection accuracy.

[0074] To briefly explain, the resonant frequency f is represented by f = [1 / (2π)] × √(k / m1). Here, k is the spring constant, and m1 is the mass of the product. In this embodiment, if the impact recorder 1 is installed on the product, then f = [1 / (2π)] × √[k / (m1+m2)]. To ensure a detection accuracy error of ±1%, √(k / m1) / √[k / (m1+m2)] needs to be 0.99 or higher. Since 0.99 = √(1 / 1.02), it can be seen that if m2 ≤ 0.02 relative to m1 = 1, that is, if m2 is less than 1 / 50 of m1, a detection accuracy error of ±1% can be ensured. Therefore, if the mass of the impact recorder 1 is less than 20g, a detection accuracy error of 1% can be ensured for products weighing 1000g (20g × 50) or more. Furthermore, if the mass of the impact recorder 1 is less than 10g, a detection accuracy error of 1% can be ensured for products weighing 500g (10g×50) or more. If the mass of the impact recorder 1 is less than 1g, a detection accuracy error of 1% can be ensured for products weighing 50g (1g×50) or more. Therefore, the impact recorder 1 is a device with excellent impact detection accuracy that can be mounted on small products.

[0075] The impact recorder 1 has been described above. As described above, such an impact recorder 1 includes: an acceleration sensor 4; a circuit element 5 having a timing circuit 52 for generating time data Dt, a sensor circuit 53 for processing the output signal of the acceleration sensor 4, a storage circuit 54 for storing the processed data Da processed by the sensor circuit 53 in correspondence with the time data Dt; and a package 7 for housing the acceleration sensor 4 and the circuit element 5. The impact recorder 1 weighs less than 20g. With this structure, the impact recorder 1 becomes sufficiently lightweight. Therefore, the impact applied to the product (impact measurement object) on which the impact recorder 1 is mounted is not easily amplified or reduced by the spring-mass system formed between the product's casing and the impact recorder 1, and an impact equivalent to the actual impact applied to the product can be transmitted to the impact recorder 1. Therefore, with the impact recorder 1, the impact applied to the product can be detected with high precision. Furthermore, the impact recorder 1 is lightweight, which does not reduce the aforementioned impact detection accuracy. The impact recorder 1 can be easily installed on lighter products, such as small products like digital cameras, smartphones, tablets, smartwatches, smart glasses, and other wearable devices.

[0076] Furthermore, as mentioned above, the impact recorder 1 weighs less than 10g. With this structure, the impact recorder 1 is further made lighter. Therefore, the impact detection accuracy of the impact recorder 1 is further improved. In addition, the impact recorder 1 can be installed in lighter products.

[0077] Furthermore, as mentioned above, the impact recorder 1 weighs less than 1g. With this structure, the impact recorder 1 is further made lighter. Therefore, the impact detection accuracy of the impact recorder 1 is further improved. In addition, the impact recorder 1 can be installed in lighter products.

[0078] Furthermore, as described above, when the mass of the commodity being measured as impact is set as m1, and the mass of the impact recorder 1 is set as m2, the relationship m2 ≤ (1 / 50) × m1 is satisfied. Based on this structure, an impact recorder 1 is created that can ensure an impact detection error of 1%, has excellent impact detection accuracy, and can be mounted on small commodities.

[0079] Furthermore, as described above, the impact recorder 1 includes a battery 6 that supplies power to the circuit elements 5. With this configuration, the impact recorder 1 can operate even without an external power supply.

[0080] Furthermore, as described above, the impact recorder 1 has a vibrating element 3 housed in the package 7, and the circuit element 5 has an oscillation circuit 51 that oscillates the vibrating element 3. The oscillation circuit 51 oscillates the vibrating element 3 to generate a clock signal CLK, and the timing circuit 52 generates time data Dt based on the clock signal CLK, thereby constituting a real-time clock (RTC). With this structure, high-precision time data Dt can be generated.

[0081] Furthermore, as described above, the package 7 has a base 71 on which the accelerometer 4 and circuit elements 5 are disposed. The accelerometer 4 and circuit elements 5 are arranged in a stacked configuration on the base 71. With this structure, the planar expansion of the impact recorder 1 in the X-axis and Y-axis directions, i.e., the area it occupies, can be suppressed, thereby achieving miniaturization of the impact recorder 1.

[0082] Furthermore, as described above, a circuit element 5 is disposed on the base 71, and an acceleration sensor 4 is disposed on the circuit element 5. This structure allows for the mounting of a larger circuit element 5. Therefore, it is possible to mount a higher-performance circuit element 5, or a circuit element 5 with more functions.

[0083] Furthermore, as described above, the package 7 has a cover 72 that engages with the base 71, and the circuit elements 5 and the accelerometer 4 are housed between the cover 72 and the base 71. This structure simplifies the package's design.

[0084] Furthermore, as described above, circuit element 5 includes a temperature sensor circuit 511 for detecting temperature, and storage circuit 54 stores the temperature data Dtmp, processing data Da, and time data Dt detected by the temperature sensor circuit 511 in a corresponding manner. Based on this structure, temperature can also be stored along with the impact, thus creating an impact recorder 1 with a large amount of information.

[0085] <Second Implementation>

[0086] Figure 8 This is a top view of the impact recorder of the second embodiment. Figure 9 yes Figure 8 BB line section view.

[0087] The impact recorder 1 of this embodiment is the same as that of the first embodiment described above, except for the structure of the laminate H. Furthermore, in the following description, this embodiment will be described primarily for its differences from the first embodiment, and descriptions of identical items will be omitted. In addition, in the figures of this embodiment, structures identical to those in the above embodiment are labeled with the same reference numerals.

[0088] like Figure 8 and Figure 9 As shown, in the impact recorder 1 of this embodiment, the stacking order of the laminate H is reversed compared to the first embodiment. An acceleration sensor 4 is disposed on the bottom surface 712 of the recess 711, and a circuit element 5 is disposed on the upper surface of the acceleration sensor 4. That is, the acceleration sensor 4 is disposed on the base 71, and the circuit element 5 is disposed on the acceleration sensor 4. By disposing the acceleration sensor 4 below the circuit element 5, a larger configurable area for the acceleration sensor 4 can be ensured, allowing for the mounting of a larger acceleration sensor 4. Therefore, for example, compared to the first embodiment described above, the electrostatic capacitance formed between the fixed and movable comb electrodes of each sensor element 42x, 42y, and 42z can be increased, enabling higher precision detection of accelerations Ax, Ay, and Az.

[0089] As described above, in the impact recorder 1 of this embodiment, an acceleration sensor 4 is disposed on the base 71, and a circuit element 5 is disposed on the acceleration sensor 4. With this structure, a larger acceleration sensor 4 can be mounted, and impacts (accelerations Ax, Ay, Az) can be detected with higher accuracy.

[0090] This second implementation method can achieve the same effect as the first implementation method described above.

[0091] <Third Implementation>

[0092] Figure 10 This is a cross-sectional view of the impact recorder of the third embodiment.

[0093] The impact recorder 1 of this embodiment is the same as that of the first embodiment described above, except for the structure of the package 7 and the configuration of the battery 6. Furthermore, in the following description, this embodiment will be described primarily for its differences from the first embodiment, and descriptions of identical items will be omitted. Additionally, in the figures of this embodiment, structures identical to those in the above embodiments are labeled with the same reference numerals.

[0094] like Figure 10 As shown, in the impact recorder 1 of this embodiment, the base 71 of the package 7 has a recess 719 that opens on the lower surface in addition to the recess 711 that opens on the upper surface. Furthermore, the battery 6 is housed within the recess 719 and disposed on the bottom surface of the recess 719. Additionally, when viewed from above in the Z-axis direction, the battery 6 overlaps with the circuit element 5. Thus, by arranging the battery 6 and the circuit element 5 in an overlapping manner, for example, the planar expansion of the impact recorder 1 in the X-axis and Y-axis directions is further suppressed from the perspective of the first embodiment described above, enabling further miniaturization of the impact recorder 1. Furthermore, with this structure, the battery 6 is exposed outside the package 7, making battery replacement easy. Therefore, long-term continuous use and reuse of the battery-replaceable impact recorder 1 become easier.

[0095] As described above, in the impact recorder 1 of this embodiment, the battery 6 is exposed outside the package 7. With this structure, battery 6 replacement becomes easy, facilitating long-term continuous use and reuse of the impact recorder 1 based on battery replacement.

[0096] This third embodiment can achieve the same effect as the first embodiment described above.

[0097] <Fourth Implementation>

[0098] Figure 11 This is a top view of the impact recorder of the fourth embodiment. Figure 12 yes Figure 11 The CC line section view. Additionally, in Figure 11 For ease of explanation, the illustrations of the support base plate 2 and the vibrating element 3 are omitted.

[0099] The impact recorder 1 of this embodiment is the same as that of the first embodiment described above, except for the different mounting method of the circuit element 5. Furthermore, in the following description, this embodiment will be described primarily for its differences from the first embodiment, and descriptions of identical items will be omitted. Additionally, in the figures of this embodiment, structures identical to those in the above embodiment are labeled with the same reference numerals.

[0100] In the first embodiment described above, the circuit element 5 is coupled to the bottom surface 712 with the active surface 50 facing upwards. However, in this embodiment, as... Figure 11 and Figure 12 As shown, circuit element 5 is mounted on bottom surface 712 with its active surface 50 facing downwards via FCB (flip-chip bonding). Multiple first internal terminals 741 are arranged on bottom surface 712, and each connection terminal P4 of circuit element 5 is electrically connected to its corresponding first internal terminal 741 via a conductive bonding member B3 such as a gold ball. With this structure, the first stepped surface 713 can be omitted, thus enabling miniaturization of the impact recorder 1.

[0101] This fourth embodiment can achieve the same effect as the first embodiment described above.

[0102] <Fifth Implementation>

[0103] Figure 13 This is a top view of the impact recorder of the fifth embodiment.

[0104] The impact recorder 1 of this embodiment is the same as that of the first embodiment described above, except for the different configuration of the various parts within the package 7. Furthermore, in the following description, this embodiment will be described primarily for its differences from the first embodiment, and descriptions of identical items will be omitted. Additionally, in the figures of this embodiment, structures identical to those in the above embodiments are labeled with the same reference numerals.

[0105] like Figure 13 As shown, the impact recorder 1 of this embodiment omits the support substrate 2, and the vibration element 3, acceleration sensor 4, circuit element 5, and battery 6 are respectively disposed on the bottom surface 712 of the recess 711. That is, in the impact recorder 1 of this embodiment, the vibration element 3, acceleration sensor 4, circuit element 5, and battery 6 are arranged in a non-overlapping planar manner. With this structure, for example, compared with the first embodiment described above, the expansion in the XY plane direction is increased, but the thickness in the Z-axis direction can be kept small. Therefore, it becomes an impact recorder 1 suitable for environments where thinness takes precedence over small area. In addition, in this embodiment, the second stepped surface 714 is omitted from the base 71, and the second internal terminal 742 for the vibration element 3 is disposed on the bottom surface 712 of the recess 711.

[0106] This fifth embodiment can achieve the same effect as the first embodiment described above. However, the structure of the impact recorder 1 is not particularly limited. For example, it can be combined with the aforementioned embodiments to form a laminate H by stacking the circuit element 5 and the acceleration sensor 4. Furthermore, the base 71 can have a recess 719, and the battery 6 can be disposed on the bottom surface of the recess 719.

[0107] <Sixth Implementation>

[0108] Figure 14 This is a top view of the impact recorder according to the sixth embodiment. Furthermore, in Figure 14 For ease of explanation, the diagrams of components that do not require explanation, such as the connecting terminal P3 and the wire W, have been omitted.

[0109] The impact recorder 1 of this embodiment is the same as that of the fifth embodiment described above, except for the structure of the circuit element 5. Furthermore, in the following description, this embodiment will be described primarily for its differences from the first embodiment described above, and descriptions of identical items will be omitted. In addition, in the figures of this embodiment, structures identical to those in the above embodiments are labeled with the same reference numerals.

[0110] In the fifth embodiment described above, circuit element 5 is composed of a single chip; however, in this embodiment, circuit element 5 is composed of multiple chips. Specifically, as follows... Figure 14 As shown, circuit element 5 is configured as follows: a first circuit element 5A having an oscillation circuit 51 and a control circuit (not shown); a second circuit element 5B having a timing circuit 52; a third circuit element 5C having a sensor circuit 53; a fourth circuit element 5D having a storage circuit 54; and a fifth circuit element 5E having an interface circuit 55. Thus, by constructing circuit element 5 from multiple chips, the degree of freedom in the arrangement of circuit element 5 is increased.

[0111] This sixth embodiment achieves the same effects as the fifth embodiment described above. However, the structure of the impact recorder 1 is not particularly limited; for example, the circuit element 5 can be divided into 2 to 4 or more chips. Furthermore, the circuits included in each circuit element can be arbitrarily combined into one or more circuits.

[0112] <Seventh Implementation>

[0113] Figure 15 This is a cross-sectional view of the impact recorder of the seventh embodiment.

[0114] The impact recorder 1 in this embodiment is the same as that in the fifth embodiment described above, except for the difference in the structure of the real-time clock and the package 7. Furthermore, in the following description, this embodiment will be described primarily for its differences from the first embodiment described above, and descriptions of identical items will be omitted. Additionally, in the figures of this embodiment, structures identical to those in the above embodiments are labeled with the same reference numerals.

[0115] In the impact recorder 1 of this embodiment, the package 7 has a plate-shaped base 78 and a molding portion 79 for molding and sealing the various parts disposed on the base 78. With this structure, the package 7 becomes simple.

[0116] The base 78 is plate-shaped and may be made of materials such as ceramic or FPC (flexible printed circuit board). Furthermore, an oscillator 8, an accelerometer 4, a circuit element 5, and a battery 6 are disposed on the upper surface of the base 78. Here, the oscillator 8 is a real-time clock (RTC) with a package 80, and a vibrating element 3 and a circuit element 81 housed within the package 80. Additionally, an oscillation circuit 51 and a timing circuit 52 are formed in the circuit element 81. Therefore, the circuit element 5 includes a remaining sensor circuit 53, a storage circuit 54, an interface circuit 55, and a control circuit (not shown). As in the first embodiment described above, when the vibrating element 3 is exposed within the package 7, it is impossible to mold the vibrating element 3. However, as in this embodiment, by housing the vibrating element 3 within the package 80, a moldable structure is achieved.

[0117] The molding section 79 seals the oscillator 8, accelerometer 4, and circuit components 5, protecting them from moisture, dust, impact, and other harmful substances. There are no particular limitations on the molding material constituting the molding section 79; for example, thermosetting epoxy resin or other curing resin materials can be used. Furthermore, the molding section 79 can be formed, for example, by transfer molding.

[0118] With this structure, since the package 7 is a solid structure, the natural vibration frequency of the impact recorder 1 can be further increased, so the resonance with the impact during transportation can be suppressed more effectively, and the impact can be detected with higher precision.

[0119] As described above, in the impact recorder 1 of this embodiment, the package 7 has a molded portion 79 that seals the circuit element 5 and the acceleration sensor 4. With this structure, the package 7 becomes simple. Furthermore, since the package 7 is a solid structure, the natural vibration frequency of the impact recorder 1 can be further increased, thus more effectively suppressing resonance with impacts during transportation and enabling higher-precision impact detection.

[0120] This seventh embodiment can achieve the same effect as the fifth embodiment described above.

[0121] The impact recorder of the present invention has been described above based on the illustrated embodiments, but the present invention is not limited thereto. The structure of each part can be replaced with any structure having the same function. Furthermore, other arbitrary structures can be added to the present invention. For example, if an external power supply is available, the battery 6 can be omitted.

Claims

1. An impact recorder, characterized in that, have: Accelerometer; The circuit elements include a timing circuit for generating time data, a sensor circuit for processing the output signal of the accelerometer, and a storage circuit for storing the processed data processed by the sensor circuit in correspondence with the time data. as well as The package contains the accelerometer and the circuit components. The impact recorder weighs less than 20g.

2. The impact recorder according to claim 1, wherein, The mass is less than 10g.

3. The impact recorder according to claim 2, wherein, The mass is less than 1g.

4. The impact recorder according to claim 1, wherein, When the mass of the impact measurement object is m1 and the mass of the object is m2, The relationship that m2 ≤ (1 / 50) × m1 is satisfied.

5. The impact recorder according to claim 1, wherein, The impact recorder has a battery that supplies power to the circuit elements.

6. The impact recorder according to claim 5, wherein, The battery is exposed on the outside of the package.

7. The impact recorder according to claim 1, wherein, The impact recorder has a vibration element housed within the package. The circuit element has an oscillation circuit that causes the vibrating element to oscillate. The oscillation circuit causes the vibrating element to oscillate to generate a clock signal, and the timing circuit generates the time data based on the clock signal, thereby forming a real-time clock.

8. The impact recorder according to claim 1, wherein, The package has a base on which the accelerometer and the circuit elements are configured. The accelerometer and the circuit elements are arranged in a stacked manner on the base.

9. The impact recorder according to claim 8, wherein, The circuit elements are disposed on the base. The acceleration sensor is mounted on the circuit element.

10. The impact recorder according to claim 8, wherein, The acceleration sensor is mounted on the base. The circuit elements are mounted on the accelerometer.

11. The impact recorder according to any one of claims 8 to 10, wherein, The package has a cover that engages with the base, and the circuit elements and the acceleration sensor are housed between the cover and the base.

12. The impact recorder according to any one of claims 8 to 10, wherein, The package has a molded portion that seals the circuit elements and the accelerometer.

13. The impact recorder according to claim 1, wherein, The circuit element includes a temperature sensor circuit for detecting temperature. The storage circuit stores the temperature data detected by the temperature sensor circuit, the processed data, and the time data in a corresponding manner.

Images