Simulation analysis method for radio frequency package and related device
By analyzing the environmental stress of RF packaging and performing model reduction simulation, the problem of low simulation accuracy of multi-physics coupling in high-power RF packaging was solved, enabling more accurate analysis and process optimization, and improving the reliability and service life of RF packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-07
- Publication Date
- 2026-03-27
AI Technical Summary
Existing multiphysics coupling analysis methods cannot guarantee the accuracy of simulation analysis of high-power RF packages, especially in multi-scale and complex environments where accurate multiphysics coupling simulation is difficult to achieve.
By analyzing the application environment of RF packaging, environmental stress results are obtained, and model reduction simulation is performed. First, an overall equivalent model is established, and then component equivalent model simulation is performed. Combining stress distribution and failure time, the process of weak structure is optimized.
It improves the accuracy of simulation analysis for RF packaging, enabling more accurate prediction of the failure time and lifespan of weak structures, providing process optimization suggestions, and improving the reliability and lifespan of the package.
Smart Images
Figure CN121744598A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of component testing technology, and in particular to a simulation analysis method and related apparatus for radio frequency packaging. Background Technology
[0002] Currently, multiphysics coupling analysis methods for various electronic components include the finite element method and the finite volume method. These methods typically start with mechanical, temperature, and electromagnetic physical field models and simplification techniques. However, for high-power radio frequency (RF) packages, none of these methods can guarantee accuracy in multiphysics coupling analysis. Summary of the Invention
[0003] In view of this, the purpose of this application is to propose a simulation analysis method and related apparatus for radio frequency packaging to solve the problem of decreased accuracy in multiphysics simulation analysis of radio frequency packaging.
[0004] To achieve the above objectives, this application provides a simulation analysis method for radio frequency packaging, including: The radio frequency package to be analyzed is obtained, and the application environment of the radio frequency package to be analyzed is analyzed to obtain the environmental stress analysis results. Based on the environmental stress analysis results, a model reduction simulation analysis is performed on the RF package to be analyzed to obtain the simulation analysis results of the RF package to be analyzed. The model reduction simulation refers to reducing the overall equivalent model simulation of the RF package to be analyzed to the component equivalent model simulation.
[0005] Furthermore, the step of performing model reduction simulation analysis on the RF package to be analyzed based on the environmental stress analysis results to obtain the simulation analysis results of the RF package to be analyzed includes: Establish an overall equivalent model of the RF package to be analyzed; The environmental stress analysis results are used as boundary conditions to simulate the overall equivalent model, and the first simulation result is obtained. Based on the first simulation results, establish the component equivalent model of the RF package to be analyzed and the simulation boundary conditions of the component equivalent model; The equivalent model of the component is simulated and analyzed based on the boundary conditions of the component equivalent model to obtain the simulation analysis results of the radio frequency package to be analyzed.
[0006] Furthermore, the first simulation result includes stress distribution, and the establishment of the equivalent model of the RF package to be analyzed and the simulation boundary conditions of the equivalent model based on the first simulation result includes: Based on the stress distribution, the weak structure of the RF package to be analyzed is determined; An equivalent model of the component corresponding to the weak structure is established, and the stress distribution corresponding to the weak structure is used as the simulation boundary condition of the component equivalent model.
[0007] Furthermore, the simulation analysis of the equivalent model of the component based on the simulation boundary conditions to obtain the simulation analysis results of the RF package to be analyzed includes: The equivalent model of the component is simulated and analyzed based on the boundary conditions of the equivalent model to obtain the stress and strain distribution of the equivalent model. The failure time of the equivalent model of the component is determined based on the stress and strain distribution of the equivalent model of the component. The stress-strain distribution and failure time are used as the simulation analysis results of the RF package to be analyzed.
[0008] Furthermore, the method also includes: The lifespan of the RF package under analysis is determined based on the simulation analysis results.
[0009] Furthermore, the method also includes: Based on the weak structure and its stress distribution, process optimization suggestions for the weak structure are determined.
[0010] Furthermore, the analysis of the application environment of the RF package to be analyzed, to obtain environmental stress analysis results, includes: The task profile of the RF package to be analyzed is determined, and the stress profile of the RF package to be analyzed is constructed in combination with the application environment of the RF package to be analyzed.
[0011] Furthermore, the process optimization suggestions for the weak structure based on the weak structure and its stress distribution include: Based on the stress distribution of the weak structure, the target modified structural parameters of the weak structure are determined; Based on the target, modify the structural parameters and establish an equivalent model of the modified component corresponding to the weak structure; The stress distribution corresponding to the weak structure is used as the simulation boundary condition for the equivalent model of the modified component to perform simulation analysis, and a second simulation result is obtained. Based on the second simulation results, process optimization suggestions are determined for the weak results.
[0012] Based on the same inventive concept, this disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.
[0013] Based on the same inventive concept, this disclosure also provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform the method described above.
[0014] Based on the same inventive concept, this disclosure also provides a computer program product, including computer program instructions, which, when run on a computer, cause the computer to perform the method described above.
[0015] As can be seen from the above, the simulation analysis method for RF packaging provided in this application obtains environmental stress analysis results by analyzing the application environment of the RF package to be analyzed, and performs model reduction simulation analysis on the RF package to be analyzed based on the environmental stress analysis results. This realizes the analysis of the RF package to be analyzed from high-order model simulation to low-order model simulation, and realizes simulation analysis from macro to micro. This can improve the analysis accuracy of the RF package to be analyzed and avoid the problem of reduced analysis accuracy caused by directly using multi-physics coupling analysis of the RF package to be analyzed. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a flowchart illustrating a simulation analysis method for radio frequency packaging according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the simulation analysis device for radio frequency packaging according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.
[0019] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0020] With the rapid development of technologies such as 5G / 6G communication, the Internet of Things, autonomous driving, and wearable devices, electronic systems are gradually evolving towards thinner, smaller, more efficient, and more functional designs. Traditional single-chip or discrete component assembly methods based on printed circuit boards are gradually encountering bottlenecks in performance, size, and power consumption. System-in-Package (SiP) technology has emerged to address this, integrating multiple chips with different functions (such as RF transceivers, power amplifiers, and digital processors) into a single package using high-density interconnect technology, forming a fully functional "system." However, reliability research on high-power-density SiP faces severe multi-scale challenges: 1) The physical and mathematical differences between nanoscale circuits and centimeter-scale packaging models make seamless coupling difficult; 2) The computational load for full-system simulation is enormous, making it difficult to balance accuracy and efficiency; 3) The interaction of multiple physical fields such as electricity, heat, and force creates complex coupling effects, making it difficult to accurately reproduce the influence mechanisms of the actual environment.
[0021] Radio frequency (RF) SiPs are system-in-package (SiP) applications in the radio frequency (RF) field. Due to their transmission of RF signals, high power density, and significant thermal resistance, they operate in complex environments involving high temperatures, temperature cycling, and vibration. This multi-physics environment significantly impacts RF SiPs with parasitic effects, electromagnetic coupling, skin effect, dielectric loss, and radiation, leading to severe reliability issues. The effects of the mutually influencing and coupled multi-physics environment on RF SiPs differ greatly from the superposition of single fields. For example, thermal expansion of the device causes mechanical deformation, and impedance changes in the RF path due to heating and deformation. With the continuous development of computational technology and numerical simulation methods, computer models can be used to simulate and analyze multi-physics coupling. This requires more detailed analysis of the physical field models to obtain more accurate results.
[0022] Existing simulation analysis methods for multiphysics coupling processes in various devices, such as the finite element method and finite volume method, mostly start with mechanical, temperature, and electromagnetic physical field models and simplification methods. However, the multi-scale multiphysics analysis challenges brought about by high-power-density radio frequency SiPs not only lead to the "curse of scale" in mesh generation and bottlenecks in computational efficiency and resources, but also make it difficult to guarantee accuracy in solving the complexity of multiphysics coupling. Therefore, it is urgent to solve the cross-scale and multiphysics problems of high-power-density radio frequency SiPs.
[0023] Based on this, this application proposes a simulation analysis method and related apparatus for radio frequency packaging to overcome the problem that the complexity of solving multi-physics coupling problems caused by the structural issues of radio frequency packaging makes it difficult to guarantee accuracy.
[0024] The embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0025] In some embodiments, a simulation analysis method for radio frequency packaging, such as Figure 1 As shown, the method includes: Step S101: Obtain the RF package to be analyzed and analyze the application environment of the RF package to be analyzed to obtain the environmental stress analysis results; Specifically, before performing simulation analysis of the RF package, the model of the RF package to be analyzed needs to be determined in order to identify its application environment. Obtaining the RF package to be analyzed means determining the model and style of the RF package to be analyzed. It should be noted that the RF package to be analyzed is a package containing multiple chips with different functions (such as RF transceivers, power amplifiers, digital processors, etc.).
[0026] Based on the model of the RF package to be analyzed, its application environment is determined. Then, by analyzing the application environment, the various stress conditions that the RF package to be analyzed is subjected to during the application process can be obtained, such as the changes in mechanical stress, thermal stress and electromagnetic stress during use. The various stress conditions are the results of the environmental stress analysis.
[0027] Step S102: Based on the environmental stress analysis results, perform model reduction simulation analysis on the RF package to be analyzed to obtain the simulation analysis results of the RF package to be analyzed; wherein, the model reduction simulation is to reduce the overall equivalent model simulation of the RF package to be analyzed to the component equivalent model simulation.
[0028] Specifically, the environmental stress analysis results are used as the environmental conditions (i.e., boundary conditions) for simulation analysis to perform model reduction simulation analysis on the RF package to be analyzed, thereby obtaining the simulation analysis results of the RF package to be analyzed. The model reduction simulation analysis involves first establishing a macroscopic model of the RF package to be analyzed and performing simulation analysis to obtain the macroscopic model simulation results. Based on the macroscopic model simulation results, the substructures for microscopic model simulation analysis of the RF package to be analyzed are determined to obtain the microscopic model simulation results. This method realizes the simulation analysis of the RF package to be analyzed from large to small, and achieves the analysis method of determining the microscopic from the macroscopic, and then performing further simulation analysis on the microscopic, which is beneficial to improving the analysis accuracy of the RF package to be analyzed.
[0029] It should be noted that macroscopic model simulation analysis of the RF package to be analyzed can identify the weak points of the RF package to be analyzed. By identifying the weak points, the structure for microscopic model simulation can be determined, thereby realizing the simulation analysis of the RF package to be analyzed from macroscopic to microscopic, that is, model reduction simulation analysis.
[0030] In this embodiment, environmental stress analysis results are obtained by analyzing the application environment of the RF package to be analyzed, and a model reduction simulation analysis is performed on the RF package to be analyzed based on the environmental stress analysis results. This realizes the analysis of the RF package to be analyzed from high-order model simulation to low-order model simulation, and realizes simulation analysis from macro to micro. This can improve the analysis accuracy of the RF package to be analyzed and avoid the problem of reduced analysis accuracy caused by directly using multi-physics coupling analysis of the RF package to be analyzed.
[0031] In some embodiments, step S102: performing model reduction simulation analysis on the RF package to be analyzed based on the environmental stress analysis results to obtain the simulation analysis results of the RF package to be analyzed includes: Step S201: Establish the overall equivalent model of the RF package to be analyzed; Specifically, based on the overall structure of the RF package to be analyzed and the structure of the various functional chips included, a simplified model equivalent to the overall structure of the RF package to be analyzed is established. This model is the macroscopic model of the RF package to be analyzed, so as to realize the macroscopic simulation analysis of the RF package to be analyzed.
[0032] For example, an overall equivalent model is established based on the chip types included in the RF package to be analyzed and the positional relationships between the chips.
[0033] Step S202: Use the environmental stress analysis results as boundary conditions to perform simulation analysis on the overall equivalent model to obtain the first simulation result; Specifically, the environmental stress analysis results include the various stresses experienced by the RF package under analysis in the application environment. The environmental stress analysis results are used as boundary conditions for simulation analysis to complete the simulation analysis of the overall equivalent model. The first simulation result obtained is the stress distribution of the overall equivalent model. The first simulation result is the macroscopic situation of the RF package under analysis that is prone to stress concentration and other factors affecting the reliability of the RF package under analysis in the application environment.
[0034] It should be noted that analyzing the simulation results of the overall equivalent model can determine the location where the RF package under analysis will experience stress concentration in the application environment, that is, the location where the RF package under analysis can be damaged or have its normal operation affected. This location is the weak point.
[0035] In addition, the simulation results of the overall equivalent model include both stress distribution and strain distribution. When no strain affecting reliability, such as fracture, occurs at any location, the stress concentration location is determined as the weak point location based on the stress distribution. When there is a strain location that affects reliability, such as fracture, that location is determined as the weak point location.
[0036] Step S203: Based on the first simulation results, establish the component equivalent model and component equivalent model simulation boundary conditions of the RF package to be analyzed; Specifically, based on the first simulation results, the weak points of the RF package to be analyzed are determined, and an equivalent model of the corresponding component is established based on the weak points. The stress distribution at the weak points is determined based on the first simulation results, and the stress distribution at the weak points is used as the simulation boundary condition for the equivalent model of the component. The equivalent model of the component is then subjected to simulation analysis.
[0037] Step S204: Based on the simulation boundary conditions of the component equivalent model, perform component equivalent model simulation analysis on the component equivalent model to obtain the simulation analysis results of the radio frequency package to be analyzed.
[0038] Specifically, the simulation boundary conditions of the component equivalent model are used as the boundary conditions for the simulation of the component equivalent model. The simulation analysis of the component equivalent model is then performed, and the simulation results obtained are the simulation analysis results of the radio frequency package to be analyzed.
[0039] It should be noted that when it is determined that there is more than one weak point in the RF package to be analyzed, an equivalent component model is established for each weak point to perform component equivalent model simulation analysis. By comparing the simulation analysis results of the multiple component equivalent models, the simulation analysis results of the RF package to be analyzed are obtained.
[0040] Furthermore, the simulation analysis of the equivalent model of the component yields the stress and strain distribution at its corresponding weak points. By analyzing the stress and strain distribution at the weak points, the failure time at the weak points can be determined, thereby determining the failure time and service life of the RF package under analysis. Based on this, support can be provided for structural improvements to the RF package under analysis to enhance its service life.
[0041] In this embodiment, an overall equivalent model is established based on the RF package to be analyzed, and the environmental stress analysis structure is used as a boundary condition to perform simulation analysis on the overall equivalent model to obtain the first simulation result. Based on the first simulation result, the component equivalent model is established, and the simulation boundary conditions of the component equivalent model are determined. The component equivalent model is then simulated and analyzed based on the simulation boundary conditions of the component equivalent model to obtain the simulation analysis result of the RF package to be analyzed. This realizes the simulation analysis of the RF package to be analyzed from the whole to the component, which is beneficial to improving the simulation analysis accuracy of the RF package to be analyzed.
[0042] In some embodiments, the first simulation result includes stress distribution. Step S203: Establishing the equivalent model of the RF package to be analyzed and the simulation boundary conditions of the equivalent model based on the first simulation result includes: Step S301: Determine the weak structure of the RF package to be analyzed based on the stress distribution. Specifically, the stress concentration region in the equivalent model of the component is determined based on the stress distribution, and the location of the RF package to be analyzed corresponding to the stress concentration region is the weak structure of the RF package to be analyzed.
[0043] For example, the stress distribution includes the stress at different locations in the component equivalent model. Based on the stress distribution, the region in the component equivalent model where the stress is concentrated is determined. The structure of the RF package to be analyzed corresponding to this region is the weak structure, such as a chip in the RF package to be analyzed, or the welding position between the chip and another chip.
[0044] Step S302: Establish an equivalent model of the component corresponding to the weak structure, and use the stress distribution corresponding to the weak structure as the simulation boundary condition of the equivalent model of the component.
[0045] Specifically, after identifying the weak structure, a component equivalent model of the weak structure is established based on the specific settings of the weak structure in the RF package to be analyzed. The stress condition of the weak structure during the simulation of the overall equivalent model, i.e. the stress distribution corresponding to the weak structure, is the simulation boundary condition of the component equivalent model, so as to complete the simulation of the component equivalent model of the weak structure under this condition.
[0046] In this embodiment, the weak structure is determined based on the first simulation result, and an equivalent model of the component is established based on the weak structure. The simulation boundary conditions of the equivalent model of the component are determined based on the stress distribution of the weak structure in the first simulation result, thereby realizing the simulation analysis of the equivalent model of the component. Linking the simulation of the overall equivalent model and the simulation of the equivalent model of the component is beneficial to improving the accuracy of the simulation analysis method.
[0047] In some embodiments, step S204: performing simulation analysis on the equivalent model of the component based on the simulation boundary conditions of the equivalent model to obtain the simulation analysis results of the RF package to be analyzed includes: Step S401: Based on the simulation boundary conditions of the component equivalent model, perform simulation analysis on the component equivalent model to obtain the stress and strain distribution of the component equivalent model; Specifically, the simulation boundary conditions of the equivalent model of the component are used as the conditions for simulation analysis of the equivalent model of the component, thereby realizing the simulation analysis of the equivalent model of the component. After the simulation analysis is completed, the stress and strain distribution of the equivalent model of the component is obtained.
[0048] Step S402: Determine the failure time of the equivalent model of the component based on the stress and strain distribution of the equivalent model of the component; Specifically, based on the stress-strain distribution, the time point corresponding to the strain that causes the equivalent model of the component to fail can be determined, and this time point is the failure time.
[0049] It should be noted that the earliest time point at which the strain that causes the equivalent model of the component to fail is taken as the failure time.
[0050] Step S403: The stress-strain distribution and failure time are used as the simulation analysis results of the RF package to be analyzed.
[0051] Specifically, the stress and strain distribution obtained after simulating the equivalent model of the component and the failure time determined based on the stress and strain distribution are stored as simulation analysis results of the RF package to be analyzed, so as to provide a basis for process improvement of the RF package to be analyzed.
[0052] In this embodiment, the failure time of the equivalent model of the component is determined based on the stress and strain distribution obtained by simulation analysis of the equivalent model of the component. The stress and strain distribution and failure time are used as the simulation analysis results of the RF package to be analyzed, which can provide a basis for the subsequent process improvement of the RF package to be analyzed.
[0053] In some embodiments, the method further includes: Step S501: Determine the lifespan of the RF package to be analyzed based on the simulation analysis results.
[0054] Specifically, the simulation analysis results of the RF package to be analyzed include the failure time of the RF package to be analyzed, and the service life of the RF package to be analyzed is determined based on the failure time.
[0055] It should be noted that the failure time is the failure time of the RF package to be analyzed under its corresponding environmental stress distribution. The service life of the RF package to be analyzed can be obtained by performing an equivalent calculation on the failure time based on the environmental stress distribution.
[0056] In this embodiment, the lifespan of the RF package under analysis can be determined based on the simulation analysis results, providing guidance for the lifespan of the RF package under analysis, assisting in the specific use of the RF package under analysis, and improving the practicality of the simulation analysis method.
[0057] In some embodiments, the method further includes: Step S601: Based on the weak structure and its stress distribution, determine process optimization suggestions for the weak structure.
[0058] Specifically, for locations in the weak structure where stress distribution is concentrated, the direction for improving the process is determined based on the current process. For locations in the weak structure where stress distribution is dispersed, the direction for simplification is determined based on the current process. Based on the direction for improving and simplifying the process of the weak structure, process optimization suggestions for the weak structure are determined.
[0059] In this embodiment, the stress distribution of the weak structure is determined based on the simulation results of the equivalent model of the component corresponding to the weak structure. Based on the stress distribution of the weak structure, process optimization suggestions are made for the weak structure to avoid unnecessary process waste or improve the process at the corresponding position of the weak structure, thereby reducing the failure probability of the weak structure and improving the service life of the RF package under analysis.
[0060] In some embodiments, step S101: analyzing the application environment of the RF package to be analyzed to obtain environmental stress analysis results includes: Step S701: Determine the task profile of the RF package to be analyzed, and analyze and construct the stress profile of the RF package to be analyzed in combination with the application environment of the RF package to be analyzed.
[0061] Specifically, the application environment is related to the mission profile. Based on the typical mission profile of the RF package to be analyzed, the environmental stress conditions experienced by the RF package under various missions are considered to analyze the stress profile during the product application process. The mission profile refers to the mission events and stress conditions experienced by the RF package to be analyzed during its lifespan. For example, after the RF package to be analyzed is manufactured and delivered to the user, it first undergoes approximately two years of storage with a satellite, then is launched with the satellite, and subsequently operates continuously on the satellite. During satellite storage, the RF package to be analyzed is in a well-controlled storage environment; during launch, it experiences relatively severe stress conditions, including high temperature, vibration, and shock, but the launch process is relatively short, and the reliability issue during this stage is mainly environmental adaptability; after the RF package to be analyzed begins operation on the satellite, it faces long-term reliability issues, with temperature being the main environmental stress. However, due to the temperature control system, the product's operating conditions on the satellite are: no significant temperature changes and no significant mechanical stress. The stress profile refers to the various stress conditions experienced by the RF package to be analyzed during its lifespan based on the mission profile and application environment. The stress profile is the result of the environmental stress analysis.
[0062] In this embodiment, by analyzing the task profile and application environment of the RF package to be analyzed, the stress profile of the RF package to be analyzed is obtained. The stress profile is the environmental stress condition of the RF package to be analyzed under the application environment, that is, the environmental stress analysis result. The environmental stress analysis result provides conditions for the simulation analysis of the RF package to be analyzed, which is beneficial to improving the simulation analysis accuracy of the RF package to be analyzed.
[0063] In some embodiments, step S601: determining process optimization suggestions for the weak structure based on the weak structure and its stress distribution includes: Step S801: Based on the stress distribution of the weak structure, determine the target modified structural parameters of the weak structure; Specifically, based on the stress distribution of the weak structure, stress concentration areas in the weak structure are determined, and target structural parameters are modified to modify the structural parameters of the stress concentration areas, thereby improving the structural stability of the weak structure and extending its service life during application.
[0064] Step S802: Based on the target modified structural parameters, establish an equivalent model of the modified component corresponding to the weak structure; Specifically, in order to verify the feasibility and effectiveness of the target modified structural parameters, an equivalent model of the modified component of the weak structure is established based on the target modified structural parameters. Through simulation analysis of the equivalent model of the modified component, it is determined whether the target modified structural parameters have the effect of extending the failure time of the weak structure.
[0065] For example, the stress concentration area is a welding point, and the target modified structural parameter is to increase the welding strength of the welding point to a target value. In order to verify the effectiveness of the target modified structural parameter, an equivalent model of the modified component corresponding to the weak structure is established for simulation analysis to determine the effectiveness of the target modified structural parameter.
[0066] Step S803: Use the stress distribution corresponding to the weak structure as the simulation boundary condition for the equivalent model of the modified component to perform simulation analysis on the equivalent model of the modified component, and obtain the second simulation result; Specifically, the stress distribution corresponding to the weak point in the first simulation result is used as the boundary condition for the simulation analysis of the equivalent model of the modified component, and the simulation analysis of the equivalent model of the modified component is completed to obtain the second simulation result.
[0067] Step S804: Based on the second simulation results, determine process optimization suggestions for the weak structure.
[0068] Specifically, the second simulation result includes the strain distribution of the equivalent model of the modified component. If there is no strain in the strain distribution that can affect the service life of the weak structure, then the target modified structural parameters are determined to be feasible, the target modified structural parameters are accepted, and the target modified structural parameters are determined as the process optimization suggestion for the weak structure. If there is still strain that can affect the service life of the weak structure, then the target modified structural parameters are re-determined, and the above steps are repeated until there is no strain that can affect the service life of the weak structure.
[0069] In this embodiment, the stress distribution of the weak structure determines the target modified structural parameters of the weak structure, and an equivalent model of the modified component is established based on the target modified structural parameters. The equivalent model of the component is then simulated and analyzed to verify the effectiveness of the target modified structural parameters. If the target modified structural parameters are found to be effective, they are used as the process optimization suggestion, which helps to improve the effectiveness and practicality of the process optimization suggestion.
[0070] It should be noted that the method in this embodiment can be executed by a single device, such as a computer or server. The method can also be applied in a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method in this embodiment, and the multiple devices will interact with each other to complete the method described.
[0071] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0072] Based on the same inventive concept, and corresponding to any of the above embodiments, this application also provides a simulation analysis device for radio frequency packaging.
[0073] refer to Figure 2 The simulation analysis device for the radio frequency packaging includes: The acquisition module 100 is configured to acquire the RF package to be analyzed and analyze the application environment of the RF package to be analyzed to obtain the environmental stress analysis results. The simulation module 200 is configured to perform model reduction simulation analysis on the radio frequency package to be analyzed based on the environmental stress analysis results, and obtain the simulation analysis results of the radio frequency package to be analyzed. The model reduction simulation refers to reducing the overall equivalent model simulation of the RF package to be analyzed to the component equivalent model simulation.
[0074] For ease of description, the above devices are described in terms of function, divided into various modules. Of course, in implementing this application, the functions of each module can be implemented in one or more software and / or hardware.
[0075] The apparatus of the above embodiments is used to implement the simulation analysis method of the corresponding radio frequency package in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.
[0076] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the simulation analysis method for radio frequency packaging described in any of the above embodiments.
[0077] Figure 3 This embodiment illustrates a more specific hardware structure of an electronic device. The device may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.
[0078] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.
[0079] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.
[0080] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.
[0081] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).
[0082] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.
[0083] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.
[0084] The electronic devices described above are used to implement the simulation analysis method of the corresponding radio frequency package in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.
[0085] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a non-transitory computer-readable storage medium that stores computer instructions for causing the computer to execute the RF packaging simulation analysis method as described in any of the above embodiments.
[0086] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.
[0087] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the RF packaging simulation analysis method as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.
[0088] Based on the same concept, corresponding to any of the above embodiments, this application also provides a computer program product, including computer program instructions, which, when run on a computer, cause the computer to perform the method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.
[0089] It is understood that before using the technical solutions of the various embodiments in this disclosure, users will be informed of the type, scope of use, and usage scenarios of the personal information involved in an appropriate manner, and user authorization will be obtained.
[0090] For example, upon receiving a user's active request, a prompt message is sent to the user to explicitly inform them that the requested operation will require the acquisition and use of the user's personal information. This allows the user to independently choose, based on the prompt message, whether to provide personal information to the software or hardware such as electronic devices, applications, servers, or storage media performing the operations of this disclosed technical solution.
[0091] As an optional but not limited implementation, in response to a user's active request, sending a prompt message to the user can be done via a pop-up window, where the prompt message can be presented in text format. Furthermore, the pop-up window can also include a selection control allowing the user to choose "agree" or "disagree" to provide personal information to the electronic device.
[0092] It is understood that the above notification and user authorization process are merely illustrative and do not constitute a limitation on the implementation of this disclosure. Other methods that comply with relevant laws and regulations may also be applied to the implementation of this disclosure.
[0093] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in detail for the sake of brevity.
[0094] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.
[0095] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.
[0096] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the claims of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.
Claims
1. A simulation analysis method for radio frequency packaging, characterized in that, include: The radio frequency package to be analyzed is obtained, and the application environment of the radio frequency package to be analyzed is analyzed to obtain the environmental stress analysis results. Based on the environmental stress analysis results, a model reduction simulation analysis is performed on the RF package to be analyzed to obtain the simulation analysis results of the RF package to be analyzed. The model reduction simulation refers to reducing the overall equivalent model simulation of the RF package to be analyzed to the component equivalent model simulation.
2. The method according to claim 1, characterized in that, The step of performing a model reduction simulation analysis on the RF package to be analyzed based on the environmental stress analysis results, to obtain the simulation analysis results of the RF package to be analyzed, includes: Establish an overall equivalent model of the RF package to be analyzed; The environmental stress analysis results are used as boundary conditions to simulate the overall equivalent model, and the first simulation result is obtained. Based on the first simulation results, establish the component equivalent model of the RF package to be analyzed and the simulation boundary conditions of the component equivalent model; The equivalent model of the component is simulated and analyzed based on the boundary conditions of the component equivalent model to obtain the simulation analysis results of the radio frequency package to be analyzed.
3. The method according to claim 2, characterized in that, The first simulation results include stress distribution. The establishment of the equivalent model of the RF package to be analyzed and the simulation boundary conditions of the equivalent model based on the first simulation results includes: Based on the stress distribution, the weak structure of the RF package to be analyzed is determined; An equivalent model of the component corresponding to the weak structure is established, and the stress distribution corresponding to the weak structure is used as the simulation boundary condition of the component equivalent model.
4. The method according to claim 2, characterized in that, The simulation analysis of the equivalent model of the component based on the simulation boundary conditions of the equivalent model of the component, to obtain the simulation analysis results of the RF package to be analyzed, includes: The equivalent model of the component is simulated and analyzed based on the boundary conditions of the equivalent model to obtain the stress and strain distribution of the equivalent model. The failure time of the equivalent model of the component is determined based on the stress and strain distribution of the equivalent model of the component. The stress-strain distribution and failure time are used as the simulation analysis results of the RF package to be analyzed.
5. The method according to claim 1, characterized in that, The method further includes: The lifespan of the RF package under analysis is determined based on the simulation analysis results.
6. The method according to claim 3, characterized in that, The method further includes: Based on the weak structure and its stress distribution, process optimization suggestions for the weak structure are determined.
7. The method according to claim 1, characterized in that, The analysis of the application environment of the RF package to be analyzed, and the resulting environmental stress analysis, includes: The task profile of the RF package to be analyzed is determined, and the stress profile of the RF package to be analyzed is constructed in combination with the application environment of the RF package to be analyzed.
8. The method according to claim 6, characterized in that, The process optimization suggestions for the weak structure based on the weak structure and its stress distribution include: Based on the stress distribution of the weak structure, the target modified structural parameters of the weak structure are determined; Based on the target, modify the structural parameters and establish an equivalent model of the modified component corresponding to the weak structure; The stress distribution corresponding to the weak structure is used as the simulation boundary condition for the equivalent model of the modified component to perform simulation analysis, and a second simulation result is obtained. Based on the second simulation results, process optimization suggestions are determined for the weak results.
9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the program, it implements the method as described in any one of claims 1 to 8.
10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that, The computer instructions are used to cause the computer to perform the method according to any one of claims 1 to 8.
11. A computer program product comprising computer program instructions, characterized in that, When the computer program instructions are executed on a computer, the computer causes the computer to perform the method as described in any one of claims 1-8.