Wafer optical identification device

By controlling the light emission mode of the light-emitting element through the light source refraction component and circuit board, and combining optical character recognition and AI artificial intelligence chip, the problem that existing devices cannot change the angle of light is solved, and accurate identification of wafer semiconductor markings and improved image clarity are achieved.

CN121747115APending Publication Date: 2026-03-27RORZE TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-25
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

Existing wafer marking identification devices cannot change the angle of light, which can easily lead to misjudgment and reflection problems when identifying wafer semiconductors of different sizes or marking positions, thus affecting the accuracy of identification.

Method used

By controlling the light emission modes of multiple light-emitting elements through light source refraction components and circuit boards, combined with optical character recognition technology and AI artificial intelligence chips, the angle and intensity of the light source are adjusted to ensure that graphic information is clearly visible. The light path is optimized by using light source unidirectional components and reflective components to enhance image clarity, and the light source enhancement light group is used to supplement insufficient light source.

Benefits of technology

It enables accurate identification of markings on different semiconductor wafers, reduces misjudgments, improves image clarity and identification efficiency, and enhances the stability and portability of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a wafer optical identification device. Comprising a camera device for shooting graphic and text information on a wafer semiconductor, a light-emitting device with a plurality of light-emitting elements, a circuit substrate capable of identifying the graphic and text information and controlling the light-emitting elements to act, and a light source refraction piece capable of refracting light sources emitted by the light-emitting elements, when the image-text information on the wafer semiconductor cannot be clearly shot by the camera device due to the angle relation, the light source emitted by the light-emitting element on the light-emitting device is utilized to strengthen or optimize the light source where the image-text information is located after passing through the light source refracting piece, and a user can pass through the circuit substrate to obtain the image-text information. And the starting mode of the light-emitting element is changed according to the requirement, so that any light source problem related to graphic and text information can be solved.
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Description

TECHNICAL FIELD

[0001] The present application relates to a wafer optical recognition device that can clearly and accurately detect the specified characters on a wafer semiconductor, and is built-in with AI image recognition and automatic training image functions, and through a plurality of different angle light sources, the characters on a plurality of different wafer semiconductors can be recognized. BACKGROUND

[0002] Generally, a wafer semiconductor will have a number engraved on the surface to indicate the identity of the wafer semiconductor, so as to facilitate subsequent related processes and inspection actions, such as Taiwan Patent No. M632730 "Number recognition device for wafer", the main structure includes an optical recognition element, one side of the optical recognition element is provided with a wafer carrying mechanism, one side of the wafer carrying mechanism is provided with an upper reflection element and a lower reflection element. In this way, the wafer can be placed on the wafer carrying mechanism, so that the upper surface image of the wafer is reflected to the optical recognition element through the upper reflection element, and the lower surface image of the wafer is reflected to the optical recognition element through the lower reflection element. The optical recognition element can recognize the upper surface number and the lower surface number from the upper surface image and the lower surface image, so that the numbers on the upper surface and the lower surface of the wafer can be read at the same time, thereby improving the convenience of use.

[0003] However, the above-mentioned number recognition device for wafer has the following problems and deficiencies that need to be improved when in use:

[0004] Although it has the function of recognizing the number, it cannot change the angle of light, that is, when different wafer semiconductors use the recognition device to recognize the number, due to the difference in size or the difference in the position of the number, the recognition device cannot correctly recognize, and even increases the risk of misjudgment, and it is also possible that the problem of environmental light source will form a reflection effect, thereby causing inaccurate recognition.

[0005] Therefore, how to solve the above-mentioned problems and deficiencies of the prior art is the research and improvement direction of the applicant and the related manufacturers in this industry. SUMMARY

[0006] The main purpose of the present application is to provide a light source folding member and a circuit board to control the light emitting mode of a plurality of light emitting elements, so that the light emitting mode of the light emitting elements can be changed according to the needs, and the light source folding member can make the emitted light spread to a wider area, so that the graphic information on the wafer semiconductor can be more clearly visible, that is, the image information captured by the camera device can be more clear, and the problem of reflection caused by insufficient light or incorrect light angle will not occur.

[0007] To achieve the above-mentioned main purpose, the wafer optical recognition device provided by the present application comprises: a camera device for shooting graphic information on a wafer semiconductor, a light-emitting device with a plurality of light-emitting elements, a circuit board capable of recognizing graphic information and capable of controlling the operation of the light-emitting elements, and a light source refraction element capable of refracting the light source emitted by the light-emitting elements. When the graphic information on the wafer semiconductor is not clear enough due to light source problems, the image information shot by the camera device can be strengthened or optimized by the light source refraction element after the light source emitted by the light-emitting elements on the light-emitting device is controlled by the instruction of the circuit board, and the operation mode of the light-emitting elements can be changed to adjust the light-emitting elements to the correct starting position, so that the graphic information will not have problems such as insufficient light source or reflection, and the image information will be clearer.

[0008] Through the above-mentioned technology, the existing wafer number recognition device has the function of recognizing the number, but cannot change the angle of light, that is, when different wafer semiconductors use the recognition device to recognize the number, the size or the position of the number is different, which leads to the recognition device cannot correctly recognize, even increases the risk of misjudgment, and also may cause reflection effect due to environmental light source problem, and further leads to the problem of inaccurate recognition. The present application breaks through the above-mentioned problems and achieves the practical progress of the above-mentioned advantages. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 It is a perspective view of the preferred embodiment of the present application.

[0010] Figure 2 It is a sectional view of the preferred embodiment of the present application.

[0011] Figure 3 It is an exploded view of the preferred embodiment of the present application.

[0012] Figure 3A It is a structure block diagram of the preferred embodiment of the present application.

[0013] Figure 4 It is an implementation schematic diagram of the preferred embodiment of the present application.

[0014] Figure 5 It is a sectional view of another preferred embodiment of the present application.

[0015] Figure 6 It is an exploded view of another preferred embodiment of the present application Figure 1 .

[0016] Figure 6A It is an exploded view of another preferred embodiment of the present application Figure 2 .

[0017] Figure 7A sectional view of another preferred embodiment of the present application.

[0018] Figure 8 An adjustment schematic view of another preferred embodiment of the present application.

[0019] Figure 9 An implementation schematic view of another preferred embodiment of the present application.

[0020] Figure 10 A light source intensification schematic view of another preferred embodiment of the present application.

[0021] BRIEF DESCRIPTION OF DRAWINGS 1 - camera device; 11 - image information; 2 - light emitting device; 21 - light emitting element; 211 - light source; 3 - circuit substrate; 31 - AI artificial intelligence chip; 32 - processing module; 4 - light source refracting member; 51 - support member; 52 - cover body; 6 - light source one-way member; 7 - focus adjustment device; 71 - adjustment driving member; 711 - fixed part; 712 - sliding groove part; 713 - driving member accommodating groove part; 714 - threaded adjustment part; 72 - limiting member; 721 - guide part; 722 - limiting member accommodating groove part; 73 - elastic element; 74 - adjustment member; 8 - reversing member; 91 - light source intensification light emitting group; 92 - power supply element; 93 - connector; A - wafer semiconductor; A1 - graphic information; B - manual tool; C - image information path. DETAILED DESCRIPTION

[0022] Referring to Figures 1 to 4 the drawings, the preferred embodiment of the present application includes:

[0023] a camera device 1 for photographing graphic information A1 on a wafer semiconductor A;

[0024] a light emitting device 2 disposed on one side of the camera device 1, having a plurality of light emitting elements 21;

[0025] a circuit substrate 3 disposed on one side of the light emitting device 2 and connected to the camera device 1 and the light emitting device 2, to obtain image information 11 photographed by the camera device 1 and to identify the graphic information A1 and control the operation of each light emitting element 21, so that each light emitting element 21 can operate independently or simultaneously;

[0026] an AI artificial intelligence chip 31 disposed on the circuit substrate 3, which can identify the graphic information A1 and can learn and record the graphic information A1 in the image information 11;

[0027] a light source refracting member 4 disposed on one side of the light emitting device 2 to refract the light source emitted by each light emitting element 21;

[0028] A support member 51, the camera 1 and the light emitting device 2 are disposed on a support member 51.

[0029] Wherein, the graphic information A1 and the image information 11 are the model of the wafer semiconductor A, including at least one of text, numbers or graphics.

[0030] Wherein, the camera 1 is one of a video camera or a still camera.

[0031] Wherein, the light emitting element 21 is an LED lamp, and eight are arranged in an example, and the camera 1 of the embodiment is disposed in the center of each light emitting element 21 arranged as an example.

[0032] Wherein, the light source folding member 4 is a convex lens.

[0033] Wherein, the graphic information A1 is identified as an optical character recognition (OCR) technology, which refers to the process of processing and recognizing images or videos containing text content, and extracting the text and layout information contained therein.

[0034] Wherein, the circuit board 3 has a processing module 32 which can be an integrated circuit or an IC chip, which can identify the graphic information A1 and receive user instructions to control the opening and closing of the light emitting element 21.

[0035] In order to identify the graphic information A1 on the wafer semiconductor A, the wafer semiconductor A is placed in front of the camera 1, at which time all the light emitting elements 21 are started to emit light source 211, which will produce a refraction effect through the light source folding member 4, similar to a kind of scattering function, making the light source 211 irradiation area become more wide, relatively, the image information 11 shot by the camera 1 will tend to the light source 211 irradiation area, in this way, taking the example of all the light emitting elements 21 being turned on, if the graphic information A1 in the image information 11 is clear and successfully identified by the optical character recognition technology of the processing module 32, it means that the graphic information A1 is correctly identified. If the graphic information A1 in the image information 11 cannot be identified by the optical character recognition technology of the processing module 32, it means that the light source 211 is insufficient or the reflection problem cannot be correctly identified, at which time the user can use the computer operation interface or the physical operation panel to operate and issue instructions to the processing module 32, so that the processing module 32 can control the light emitting element 21 to change the mode.

[0036] With the foregoing reflection condition as an example, due to the convex lens of the light source folding member 4, the light source 211 emitted by the light emitting element 21 will produce a refraction phenomenon, that is, based on the position of the camera device 1, the image information 11 photographed may be reflected by the light source 211, resulting in a reflection effect of the graphic information A1, when the reflection effect occurs, the graphic information A1 in the image information 11 becomes unclear, so that the processing module 32 cannot correctly identify. Therefore, the user needs to use the processing module 32 to control the action of the light emitting element 21, for example, only the upper row of three light emitting elements 21 in the eight light emitting elements 21 is started, or only the left row of three light emitting elements 21 in the longitudinal direction is started, or only two light emitting elements 21 in the upper row and two light emitting elements 21 in the lower row are started, and so on, which means that each light emitting element 21 of the present application can be controlled by the processing module 32. The purpose of changing the light emitting mode of the light emitting element 21 is to change the mode to start only the left row of three light emitting elements 21 in the longitudinal direction when the user starts the upper row of three light emitting elements 21, but still cannot clearly irradiate the graphic information A1. In other words, the user can freely control the opening and closing of each light emitting element 21 through the processing module 32 according to the needs, so as to achieve the most suitable angle of the light source 211, so that the graphic information A1 can be successfully recognized by the processing module 32.

[0037] In addition, the AI artificial intelligence chip 31 can record the graphic information A1 completed by the processing module 32 for optical character recognition, or the user can define the graphic information A1 (such as text) stored in the record, which is convenient for assisting to speed up the recognition result. In other words, the processing module 32 combined with the AI artificial intelligence chip 31 becomes an artificial intelligence optical character recognition (AIOCR), when the graphic information A1 recognized by the processing module 32 is slightly unclear, which may result in the need to increase the recognition processing time, the AI artificial intelligence chip 31 will assist in recognition comparison, and use the stored graphic information A1 record to compare with the unclear graphic information A1, when the AI artificial intelligence chip 31 compares the correct graphic information A1 record, the graphic information A1 record is extracted, and the advantage of speeding up the recognition result is further achieved.

[0038] Please refer to Figure 5As shown in the sectional view of another preferred embodiment of the present application, a light source one-way piece 6 is arranged between the light emitting device 2 and the light source folding piece 4. The camera device 1 of the present embodiment is arranged below the light source one-way piece 6. That is, the camera device 1 and the light emitting device 2 are arranged in a right angle vertical direction. As shown in the figure, the light source can pass through the light source one-way piece 6 from one side to the other side. The light source on the other side of the light source one-way piece 6 cannot pass through the light source one-way piece 6 to the other side. This means that the light emitted by the light emitting device 2 can pass through the light source one-way piece 6 and be irradiated on the graphic information through the light source folding piece 4. The camera device 1 can capture the graphic information through the light source one-way piece 6 on the other side by using the reflection effect. This means that the position of the camera device 1 of the present application is not limited. The design of the light source one-way piece 6 can move the camera device 1 away from the light emitting device 2. Thus, the clarity of the image information can be further enhanced.

[0039] Please refer to Figures 6 to 10 As shown in the exploded view of another preferred embodiment of the present application, a light source one-way piece 6 is arranged between the light emitting device 2 and the light source folding piece 4. The camera device 1 of the present embodiment is arranged below the light source one-way piece 6. That is, the camera device 1 and the light emitting device 2 are arranged in a right angle vertical direction. As shown in the figure, the light source can pass through the light source one-way piece 6 from one side to the other side. The light source on the other side of the light source one-way piece 6 cannot pass through the light source one-way piece 6 to the other side. This means that the light emitted by the light emitting device 2 can pass through the light source one-way piece 6 and be irradiated on the graphic information through the light source folding piece 4. The camera device 1 can capture the graphic information through the light source one-way piece 6 on the other side by using the reflection effect. This means that the position of the camera device 1 of the present application is not limited. The design of the light source one-way piece 6 can move the camera device 1 away from the light emitting device 2. Thus, the clarity of the image information can be further enhanced. Figure 1 As shown in the exploded view of another preferred embodiment of the present application, a light source one-way piece 6 is arranged between the light emitting device 2 and the light source folding piece 4. The camera device 1 of the present embodiment is arranged below the light source one-way piece 6. That is, the camera device 1 and the light emitting device 2 are arranged in a right angle vertical direction. As shown in the figure, the light source can pass through the light source one-way piece 6 from one side to the other side. The light source on the other side of the light source one-way piece 6 cannot pass through the light source one-way piece 6 to the other side. This means that the light emitted by the light emitting device 2 can pass through the light source one-way piece 6 and be irradiated on the graphic information through the light source folding piece 4. The camera device 1 can capture the graphic information through the light source one-way piece 6 on the other side by using the reflection effect. This means that the position of the camera device 1 of the present application is not limited. The design of the light source one-way piece 6 can move the camera device 1 away from the light emitting device 2. Thus, the clarity of the image information can be further enhanced.

[0040] The fixed part 711 can be a screw hole, and the camera 1 and the adjustment driving member 71 are fixed and combined with each other by a screw passing through the camera 1 and the fixed part 711.

[0041] The threaded adjustment part 714 is a screw hole, and the adjustment member 74 is a screw, so that the adjustment member 74 can be screwed and rotatably moved in the threaded adjustment part 714.

[0042] When the driving member accommodating groove part 713 corresponds to the limiting member accommodating groove part 722, a receiving space is formed, which can accommodate the elastic element 73. One end of the elastic element 73 abuts against the bottom of the limiting member accommodating groove part 722, and the other end abuts against the bottom of the driving member accommodating groove part 713, so that the adjustment driving member 71 and the limiting member 72 are reversely supported by the tension of the elastic element 73.

[0043] The reflecting member 8 is a mirror. In the present embodiment, the light emitting device 2, the light source unidirectional member 6, and the light source folding member 4 are arranged on the same plane and are horizontally arranged. The light source unidirectional member 6 and the reflecting member 8 are vertically and longitudinally arranged, and the reflecting member 8 and the camera 1 are horizontally arranged.

[0044] The camera 1 and the light emitting device 2 are arranged on the support member 51, which effectively increases the stability. For example, the camera 1 is more stable and does not shake through the design of the support member 51, which is beneficial to increase the clarity of the image information. Relatively, it can also accelerate the speed of the circuit board 3 in the identification of the image information, and the efficiency is significantly improved. As for the light emitting device 2, the light emitting device 2 can also stably output light, and the image information in the image information is not easy to produce reflection problems caused by the shaking of the light source 211. Even the image information arranged at the edge of the wafer semiconductor A is less likely to have the problem of insufficient light source.

[0045] When the support member 51 and the limiting member 72 are locked and combined with each other, the case 52 can be conveniently carried and moved without geographical restrictions.

[0046] For example, the focusing state of the camera 1 is adjusted.

[0047] When the focusing distance of the camera 1 is offset, a manual tool B can be used in combination with the adjusting member 74. When the manual tool B is rotated, the adjusting member 74 is also rotated, and the threaded adjusting portion 714 of the focusing adjusting device 7 is also rotated. At this time, the nut portion of the adjusting member 74 is abutted against the outer side portion of the limiting member 72, and the screw rod portion is deeply inserted into the limiting member 72 and the adjusting driving member 71. When the adjusting member 74 is rotated, it is limited by the cooperation between the nut and the limiting member 72 and cannot move forward. At the same time, the adjusting driving member 71 moves forward or backward by the rotation of the adjusting member 74, and the user can rotate more easily with the assistance of the elastic element 73. In this way, when the camera 1 is out of focus, the manual focusing adjustment can be performed by the focusing adjusting device 7, so that the image information can be kept in the best state at any time, and the text information is clear and visible.

[0048] In terms of the light source path and the path of the photographed image information:

[0049] The light source 211 emitted by the light emitting element 21 can sequentially pass through the light source one-way member 6 and the light source folding member 4, and irradiate on the text information of the wafer semiconductor A. The image information path C obtained by the camera 1 sequentially passes through the light source folding member 4, the light source one-way member 6, and the reflecting member 8 to reach the camera 1. In short, the camera 1 uses the longitudinal arrangement of the reflecting member 8 and the light source one-way member 6, so that when the camera 1 is arranged below the light emitting device 2, it can still photograph the environment outside the light source folding member 4. This position is designed to change the overall volume and meet the space requirements of the environment to achieve different design arrangements to meet the specific volume requirements.

[0050] In terms of insufficient light source:

[0051] When the text information on the wafer semiconductor A is too much at the corner, the light irradiated by the light emitting device 2 is still insufficient, or the original light source 211 brightness is insufficient. At this time, the light source strengthening light emitting group 91 controlled by the processing module 32 of the circuit board 3 can perform supplementary light irradiation. In other words, because the setting angle of the light source strengthening light emitting group 91 is biased to a certain angle, it can effectively irradiate the text information that is too much at the corner or insufficient in brightness, and make up for the problem of insufficient irradiation angle or insufficient brightness of the light emitting device 2. Of course, the light source strengthening light emitting group 91 of the present embodiment is taken as an example, and if there are multiple light source strengthening light emitting groups, they can be arranged around the light source folding member 4.

[0052] In addition, the power supply element 92, for example, a power socket, can provide external power to the necessary power supply of the circuit board 3. Of course, if there is no power supply element 92 that can provide external power, an internal battery can be used for driving.

[0053] In addition, any information received by the circuit board 3, including image information, can be transmitted to an external device, such as a computer system, via the connector 93, so that a user can remotely control it, which is highly convenient and practical. Of course, if there is no connector 93, a wireless transmission module can be added to the circuit board 3 to wirelessly transmit to an external device, such as a WIFI or Bluetooth antenna.

[0054] Therefore, the wafer optical recognition device of the present application can improve the key of the prior art:

[0055] First, the light-emitting mode of the light-emitting element 21 can be changed as needed by the light source folding member 4 and the circuit board 3, and the light source 211 can be emitted to a wider area by the light source folding member 4, so that the image information A1 on the wafer semiconductor A can be more clearly visible, that is, the image information 11 captured by the camera device 1 can be more clearly visible, and the problem of reflection caused by insufficient or incorrect angle of the light source 211 can be avoided.

[0056] Second, the optical character recognition (OCR) technology of the circuit board 3 can achieve fast, clear and stable recognition advantages.

[0057] Third, the design of the focusing adjustment device 7 can manually adjust the focal length when the image information 11 captured by the camera device 1 is not clear enough and has a defocus problem.

[0058] Fourth, the design of the adjustment driving member 71, the fixed part 711, the sliding groove part 712, the driving member slot part 713, the screw adjustment part 714, the limiting member 72, the guide part 721, the limiting member slot part 722, the elastic element 73 and the adjustment member 74 can make the user more comfortable when rotating, and the cooperation of the sliding groove part 712 and the guide part 721 has a certain sliding stability, so that the image information 11 can be kept in the best state at any time, and the image information A1 is clearly visible.

[0059] Fifth, the design of the support member 51 can make the camera device 1 more stable and not shake, which is beneficial to increase the clarity of the image information A1, and can also accelerate the identification speed of the circuit board 3 in the image information A1, and the efficiency is significantly improved. In addition, the design of the outer cover 52 can not only be beneficial to the position movement of the present application without geographical restrictions, but also can effectively protect the internal camera device 1, light-emitting device 2, circuit board 3, light source folding member 4, light source one-way member 6, reflection member 8 and light source reinforced light-emitting group 91, etc. from being impacted by the outside world and environmental pollution, etc.

[0060] Sixth, through the light source unidirectional piece 6 design, the camera device 1 can be moved out of the light emitting device 2, so that the design volume of the light emitting device 2 can be effectively reduced.

[0061] Seventh, through the longitudinal arrangement of the reflecting member 8 and the light source unidirectional piece 6, when the camera device 1 is arranged below the light emitting device 2, the environment outside the light source folding member 4 can still be photographed. This position design can change the overall volume and meet the space requirements of different designs to achieve specific volume requirements.

[0062] Eighth, through the AI artificial intelligence chip 31 design, it can be convenient to assist in speeding up the recognition result.

[0063] Ninth, through the light source strengthening light emitting group 91, the information A1 at the corner can be effectively irradiated, which makes up for the problem of insufficient irradiation angle of the light emitting device 2. In addition, the power supply element 92 can provide the necessary power supply to the circuit substrate 3, so as to achieve the advantages of stable power supply output. In addition, through the design of the connector 93, the user can remotely control, which has high convenience and practicality.

[0064] Although various embodiments of the present application have been shown and described in the specification, such embodiments are provided by way of example only, any operation theory or benefit provided in the present application is intended to be merely an aid in describing the present application; such theories and explanations do not bind or limit the claims of the organization remodeling achieved by practicing the present application. Those skilled in the art can now conceive many variations, changes or alternatives without departing from the present application. It should be understood that various alternatives of the embodiments of the invention described in the specification can be used in the practice of the present application. The scope of the present application, the methods and structures within the scope of the present application are intended to include equivalent forms.

[0065] In summary, the wafer optical recognition device of the present application can achieve its functions and purposes when in use, so the present application is a practical and excellent invention.

Claims

1. A wafer optical identification device, characterized in that, include: A camera device for capturing images and text information on a semiconductor wafer; A light-emitting device located on one side of the camera device has several light-emitting elements; A circuit board disposed on one side of the light-emitting device and connected to the camera device and the light-emitting device, so as to obtain the image information captured by the camera device and perform image and text information recognition, and control the operation of each light-emitting element, so that each light-emitting element operates independently or in parallel. and A light source refraction element is provided on one side of the light-emitting device to refract the light emitted by each of the light-emitting elements.

2. The wafer optical identification device as described in claim 1, characterized in that, The camera device has a focus adjustment device on one side for adjusting the focus distance of the camera device.

3. The wafer optical identification device as described in claim 2, characterized in that, The focusing adjustment device has an adjustment drive member fixedly connected to the camera device. The adjustment drive member has several fixing parts fixedly connected to the camera device, several sliding grooves on one side of each fixing part, a drive member receiving groove between each sliding groove, and a threaded adjustment part on one side of the drive member receiving groove. A limiting member is provided on the side of the adjustment drive member away from the camera device. The limiting member has several guide parts that can be accommodated in the sliding groove. A limiting member receiving groove is provided between each guide part, corresponding to the position of the drive member receiving groove. An elastic element is housed in the drive member receiving groove and the limiting member receiving groove. An adjustment member is passed through the limiting member, the adjustment drive member, and the elastic element.

4. The wafer optical identification device as described in claim 3, characterized in that, The camera device and the light-emitting device are mounted on a bracket, and the bracket and the limiting member are locked together with an outer cover.

5. The wafer optical identification device as described in claim 1, characterized in that, The camera and the light-emitting device are mounted on a support.

6. The wafer optical identification device as described in claim 1, characterized in that, A one-way light source component is provided between the light-emitting device and the light source refractive component.

7. The wafer optical identification device as described in claim 6, characterized in that, The unidirectional light source has a reflector on the opposite side of the light-emitting device and the light source refraction member, and the reflector is located in front of the camera device.

8. The wafer optical identification device as described in claim 1, characterized in that, The identification of the image and text information is performed by an AI artificial intelligence chip located on the circuit board. This AI artificial intelligence chip can learn and record the image and text information in the image.

9. The wafer optical identification device as described in claim 1, characterized in that, The light source refractor has a light source enhancement light-emitting group electrically connected to the circuit board on at least one side.

10. The wafer optical identification device as claimed in claim 1, characterized in that, The circuit board is electrically connected to a power supply element, and the circuit board is also informationally connected to a connector that conforms to a network communication protocol.