Plasma generating device

Abstract

A plasma generating device comprises an ionization structure, a plasma collecting chamber, a shunt cooling structure, a secondary cooling structure and an air knife structure which are communicated in sequence, and the ionization structure is used for ionizing compressed air introduced into the ionization structure so as to generate plasma; the plasma collection chamber is used for collecting plasma generated by the ionization structure; the shunting cooling structure is used for carrying out primary cooling on the plasma, and is also used for shunting the plasma into first temperature plasma and second temperature plasma, and enabling the first temperature plasma to flow into the secondary cooling structure; the secondary cooling structure is used for cooling the first temperature plasma for the second time; and the air knife structure is used for blowing the first temperature plasma cooled by the secondary cooling structure to the surface of the to-be-treated product. According to the plasma generating device provided by the invention, surface treatment of normal-temperature plasma can be realized, and the surface treatment quality and the treatment efficiency of the to-be-treated product can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of plasma surface treatment, and in particular to a plasma generating device. BACKGROUND

[0002] The working principle of plasma surface treatment technology is that compressed air is ionized by high voltage to generate plasma, and then the plasma is sprayed out by a spray gun to physically and chemically modify the surface of a material. By using high-energy particles of plasma to physically and chemically react with the surface of the material, the surface of the material can be activated, etched, and cleaned, and various surface properties of the material such as friction coefficient, adhesion, and hydrophilicity can be improved.

[0003] However, the conventional plasma generating device has high temperature and poor uniformity of air ionized by high voltage, which leads to unsatisfactory product surface treatment and side effects such as oxidation and ink evaporation of the product caused by high temperature. SUMMARY

[0004] Therefore, it is necessary to provide a plasma generating device to overcome at least one of the above-mentioned defects.

[0005] The present application provides a plasma generating device, which comprises, in sequence, an ionization structure, a plasma collection chamber, a shunt cooling structure, a secondary cooling structure, and an air knife structure, wherein the ionization structure is configured to ionize compressed air introduced therein to generate plasma; the plasma collection chamber is configured to collect the plasma generated by the ionization structure; the shunt cooling structure is configured to cool the plasma for the first time, and further configured to divide the plasma into first-temperature plasma and second-temperature plasma, and to flow the first-temperature plasma into the secondary cooling structure, wherein the first temperature is lower than the second temperature; the secondary cooling structure is configured to cool the first-temperature plasma for the second time; and the air knife structure is configured to blow the first-temperature plasma cooled by the secondary cooling structure to the surface of a product to be treated.

[0006] In some possible embodiments, the shunt cooling structure is a turbine air flow separation mechanism, which comprises a turbine around pipe, a shunt top pipe, and a connecting pipe connecting the turbine around pipe and the shunt top pipe, the inlet of the turbine around pipe is in communication with the plasma collection chamber, the outlet of the turbine around pipe is in communication with the secondary cooling structure, the first-temperature plasma is separated by the shunt top pipe and then enters the secondary cooling structure through the connecting pipe and the outlet, and the end of the shunt top pipe away from the connecting pipe is provided with a separation outlet configured to communicate with a recovery structure for recovering the second-temperature plasma.

[0007] In some possible embodiments, the shunt top pipe comprises a shunt cavity in communication with the connecting pipe, and a conical shunt body located in the shunt cavity, the conical shunt body has a gap between the conical shunt body and the inner wall of the shunt cavity, and the conical surface of the conical shunt body faces the connecting pipe, the conical surface of the conical shunt body is used to reflect the first temperature plasma back to the connecting pipe, and the gap is in communication with the separation outlet to discharge the second temperature plasma from the shunt top pipe.

[0008] In some possible embodiments, the secondary cooling structure comprises a cooling cavity, a cooling fin assembly arranged in the cooling cavity, and a liquid cooling pipeline connected with the cooling fin assembly, the cooling cavity is in communication with the shunt cooling structure and the air knife structure respectively, and the liquid cooling pipeline is used to cool the cooling fin assembly.

[0009] In some possible embodiments, the cooling fin assembly comprises a plurality of cooling fins arranged at intervals, and the plurality of cooling fins are arranged side by side along the extension direction of the cooling cavity.

[0010] In some possible embodiments, the cooling fin assembly comprises two rows of cooling fins, and the two rows of cooling fins are arranged on opposite sides of the liquid cooling pipeline.

[0011] In some possible embodiments, the cooling cavity is a long strip-shaped cavity, and the shunt cooling structure and the air knife structure are respectively connected to opposite ends of the cooling cavity.

[0012] In some possible embodiments, the air knife structure comprises an air knife cavity in communication with the cooling cavity and an air knife arranged in the air knife cavity, the air knife cavity is arranged side by side with the cooling cavity, the extension direction of the air knife cavity is consistent with the extension direction of the cooling cavity, and the air knife extends along the extension direction of the air knife cavity.

[0013] In some possible embodiments, the plasma generating device has a plurality of ionization cavities in communication with the plasma collection chamber, each of the ionization cavities is provided with one of the ionization structures, the plurality of ionization cavities are arranged side by side on the same side of the plasma collection chamber, and the extension direction of the ionization cavities is perpendicular to the extension direction of the plasma collection chamber.

[0014] In some possible embodiments, the plasma collection chamber, the shunt cooling structure, the secondary cooling structure, and the air knife structure are arranged side by side in sequence in a direction away from the ionization structure.

[0015] Compared with the prior art, the plasma generating device provided by the embodiment of the application can realize preliminary cooling and separation of high and low temperature plasma through the design of the shunt cooling structure, can realize secondary cooling of the first temperature plasma through the design of the secondary cooling structure, so that the plasma blown out by the air knife structure can reach room temperature, and the problems such as surface damage (for example, high temperature oxidation or surface ink volatilization) of the product to be processed caused by high temperature are reduced, in addition, through the design of the air knife structure, the room temperature plasma can be uniformly blown to the surface of the product to be processed, and the uniformity of surface treatment is improved. Therefore, the plasma generating device provided by the embodiment of the application can realize surface treatment of room temperature plasma, and can improve the surface treatment quality and treatment efficiency of the product to be processed. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The structure schematic diagram of the plasma generating device provided by an embodiment of the application is shown without the shell.

[0017] Figure 2 The structure schematic diagram of the plasma generating device provided by an embodiment of the application is shown without the shell.

[0018] Figure 3 The structure schematic diagram of the plasma generating device provided by an embodiment of the application is shown without the shell. Figure 2 The top view of the turbine around the pipe.

[0019] Figure 4 The structure schematic diagram of the plasma generating device provided by an embodiment of the application is shown without the shell. Figure 2 The schematic diagram of the plasma generating device provided by an embodiment of the application for processing plasma.

[0020] Figure 5 The structure schematic diagram of the plasma generating device provided by an embodiment of the application is shown without the shell.

[0021] Main element symbol explanation

[0022] Plasma generating device 100

[0023] Ionization cavity 10

[0024] Ionization structure 1

[0025] Positive electrode 11

[0026] Negative electrode 12

[0027] Plasma collection chamber 2

[0028] Collection cavity 21

[0029] Inlet 22, 311

[0030] Outlet 23, 312

[0031] Shunt cooling structure 3

[0032] turbine around pipe 31

[0033] turbine cavity 313

[0034] turbine 314

[0035] outlet pipe 315

[0036] split top pipe 32

[0037] split cavity 321

[0038] conical splitter 322

[0039] gap 323

[0040] conical surface 324

[0041] connection pipe 33

[0042] separation outlet 34

[0043] recycling pipeline 35

[0044] secondary cooling structure 4

[0045] cooling cavity 41

[0046] cooling fin assembly 42

[0047] liquid cooling pipeline 43

[0048] cooling fin 44

[0049] air knife structure 5

[0050] air knife cavity 51

[0051] air knife 52

[0052] housing 6

[0053] extension direction a, b

[0054] product to be processed 200

[0055] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0056] The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.

[0058] It should be noted that, in the present application, the terms "first", "second", etc. are used only for descriptive purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. The orientation terms "upper", "lower", "left", "right", etc. are defined relative to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components shown in the drawings. The term "direction" includes the single direction or the bidirectional direction along the straight line in the direction, and cannot be simply understood as the single direction along the straight line in the direction.

[0059] In the present application, unless otherwise specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0060] It can be understood that when a layer, region or component is referred to as "on" another layer, region or component, it can be directly or indirectly on the other layer, region or component. That is, for example, there can be an intervening layer, region or component.

[0061] Please refer to Figure 1 and Figure 2 shown, and in combination with Figure 4 and Figure 5The embodiment of the present application provides a kind of plasma generating device 100, the plasma generating device 100 includes: ionization structure 1, plasma collection chamber 2, shunt cooling structure 3, secondary cooling structure 4 and air knife structure 5 in turn.The ionization structure 1 is used to ionize compressed air into it, to generate plasma.The plasma collection chamber 2 is used to collect the plasma generated by the ionization structure 1.The shunt cooling structure 3 is used to cool the plasma for the first time, and the shunt cooling structure 3 is also used to shunt the plasma into first temperature plasma and second temperature plasma, and make the first temperature plasma flow into the secondary cooling structure 4, wherein the first temperature is lower than the second temperature.The secondary cooling structure 4 is used to cool the first temperature plasma for the second time.The air knife structure 5 is used to blow the first temperature plasma cooled by the secondary cooling structure 4 to the surface of product 200 to be processed.

[0062] The plasma generating device 100 has a plurality of ionization cavities 10 communicated with the plasma collection chamber 2, each of the ionization cavities 10 is provided with one ionization structure 1, the plurality of ionization cavities 10 are arranged side by side on the same side of the plasma collection chamber 2, and the extension direction a of the ionization cavities 10 is perpendicular to the extension direction b of the plasma collection chamber 2.By arranging a plurality of ionization structures 1 for generating plasma, the ionization efficiency can be improved.The plurality of ionization cavities 10 are arranged side by side on the same side of the plasma collection chamber 2, which is convenient for layout and is also conducive to reducing the volume of the plasma generating device 100.In some embodiments, the ionization cavities 10 are communicated with an air compression device (not shown in the figure), and compressed air can be introduced into the ionization cavities 10 by the air compression device.

[0063] In some embodiments, the ionization structure 1 includes a positive electrode 11 and a negative electrode 12 arranged in the ionization cavity 10, and the compressed air entering the ionization cavity 10 can be high-voltage ionized by applying high-voltage to the positive electrode 11 and the negative electrode 12 to generate plasma.The voltage applied between the positive electrode 11 and the negative electrode 12 is about 10kV.

[0064] The plasma collection chamber 2 includes an elongated collection cavity 21, a plurality of inlets 22 arranged on the same side of the collection cavity 21, and an outlet 23 arranged on the side opposite to the collection cavity 21 and the inlets 22, each inlet 22 is communicated with one ionization cavity 10, and the outlet 23 is communicated with the shunt cooling structure 3.

[0065] In some embodiments, the outlet is located at the end of the collection cavity 21.

[0066] As Figures 1 to 3As shown, the shunt cooling structure 3 is a turbine air flow separation mechanism, which can realize the shunting of different temperature plasmas. The shunt cooling structure 3 includes a turbine winding pipe 31, a shunt top pipe 32, and a connecting pipe 33 connecting the turbine winding pipe 31 and the shunt top pipe 32. The inlet 311 of the turbine winding pipe 31 is in communication with the plasma collection chamber 2, and the outlet 312 of the turbine winding pipe 31 is in communication with the secondary cooling structure 4. The first temperature plasma separated by the shunt top pipe 32 enters the secondary cooling structure 4 through the connecting pipe 33 and the outlet 312. The end of the shunt top pipe 32 away from the connecting pipe 33 is provided with a separation outlet 34, and the separation outlet 34 is provided with a recovery pipeline 35 for connecting a recovery device (not shown in the figure) for recovering the second temperature plasma. Specifically, the turbine winding pipe 31 can make the plasma rotate at high speed along the pipe wall, thereby preparing for the shunting of high and low temperature plasmas. The plasma accelerated by the turbine winding pipe 31 enters the shunt top pipe 32 through the connecting pipe 33, and is separated by the shunt top pipe 32, so that the first temperature plasma at low temperature returns to the connecting pipe 33 and enters the secondary cooling structure 4 through the outlet 312, while the second temperature plasma at high temperature enters the high temperature plasma recovery device through the separation outlet 34 and the recovery pipeline 35.

[0067] In some embodiments, the turbine winding pipe 31 has a turbine cavity 313 and a turbine 314 located in the turbine cavity 313. The inlet 311 and the outlet 312 of the turbine winding pipe 31 are both formed on the turbine cavity 313, and the connecting pipe 33 is in communication with the turbine cavity 313. The plasma in the plasma collection chamber 2 enters the turbine cavity 313 through the inlet 311, and under the high-speed rotation of the turbine 314, the plasma entering the turbine cavity 313 can rotate at high speed along the inner wall of the turbine cavity 313. The accelerated plasma enters the connecting pipe 33 and further enters the shunt top pipe 32 to realize high and low temperature classification.

[0068] In some embodiments, the outlet 312 of the turbine winding pipe 31 is provided with an outlet pipe 315 coaxial with the connecting pipe 33, the outlet pipe 315 is located inside the connecting pipe 33 and has a gap with the connecting pipe 33, and the end of the connecting pipe 33 close to the outlet pipe 315 is designed as an open end to realize communication with the turbine cavity 313. By designing the outlet pipe 315 extending into the connecting pipe 33 at the outlet 312, the first temperature plasma separated by the shunt top pipe 32 can smoothly enter the secondary cooling structure 4 through the outlet pipe 315 and the outlet 312, reducing the re-entry of the separated first temperature plasma into the turbine cavity 313 and improving the separation efficiency.

[0069] In some embodiments, the shunt top pipe 32 comprises a shunt cavity 321 in communication with the connecting pipe 33, and a tapered shunt body 322 located in the shunt cavity 321, wherein a gap 323 is formed between the tapered shunt body 322 and the inner wall of the shunt cavity 321, and the tapered surface 324 of the tapered shunt body 322 faces the connecting pipe 33. The tapered surface 324 of the tapered shunt body 322 is used to reflect the first temperature plasma back to the connecting pipe 33, and the gap 323 is in communication with the separation outlet 34 to discharge the second temperature plasma out of the shunt top pipe 32. Specifically, the tapered shunt body 322 can be a cold end to reduce the temperature of the high-temperature plasma. When the plasma flows into the shunt top pipe 32 at high speed from the connecting pipe 33, part of the high-temperature plasma will contact the tapered surface 324 of the tapered shunt body 322, and the temperature will be reduced to form the first temperature plasma. Another part of the high-temperature plasma does not contact the tapered shunt body 322, but enters the gap 323 of the shunt cavity 321 to form the second temperature plasma. Subsequently, the first temperature plasma (i.e. low-temperature plasma) after temperature reduction is reflected back to the connecting pipe 33 by the tapered surface 324, and further enters the secondary cooling structure 4 through the outlet pipe 325 and the outlet 312. The second temperature plasma (i.e. high-temperature plasma) in the gap 323 enters the high-temperature plasma recovery device through the separation outlet 34 and the recovery pipeline 35, and the combination of Figure 4

[0070] In some embodiments, the extension direction of the connecting pipe 33 is consistent with the extension direction b of the plasma collection chamber 2, and the connecting pipe 33 is arranged substantially in parallel with the plasma collection chamber 2, which is convenient for layout and is beneficial to further reduce the overall volume of the device.

[0071] Please refer again to Figure 1 Figure 2 , and combine Figure 4 Figure 5 , the secondary cooling structure 4 comprises a cooling cavity 41, a cooling fin assembly 42 arranged in the cooling cavity 41, and a liquid cooling pipeline 43 connected with the cooling fin assembly 42. The cooling cavity 41 is in communication with the shunt cooling structure 3 and the air knife structure 5, respectively. The liquid cooling pipeline 43 is used to cool the cooling fin assembly 42. Through the secondary cooling structure 4, the first temperature plasma can be cooled twice to become normal temperature plasma, thereby reducing the damage (such as high-temperature oxidation or surface ink volatilization) to the surface of the product to be processed 200 caused by high temperature.

[0072] ​​​In some embodiments, the cooling cavity 41 is substantially a long strip-shaped cavity, and the shunt cooling structure 3 and the air knife structure 5 are respectively connected to opposite ends of the cooling cavity 41. By arranging a long strip-shaped cavity and arranging the inlet and outlet of the plasma at the two ends, the first temperature plasma can pass through the entire long strip-shaped cavity, thereby achieving sufficient cooling.

[0073] In some embodiments, the cooling cavity 41 can be arranged in parallel with the plasma collection chamber 2, which is convenient for layout and is conducive to further reducing the overall volume of the device.

[0074] In some embodiments, the cooling sheet assembly 42 includes a plurality of spaced cooling sheets 44, and the plurality of cooling sheets 44 are arranged side by side along the extension direction b of the cooling cavity 41. By arranging a plurality of spaced cooling sheets 44 side by side, the cooling area can be increased to improve the cooling efficiency.

[0075] In some embodiments, the cooling sheet assembly 42 includes two rows of cooling sheets 44, and the two rows of cooling sheets 44 are arranged on opposite sides of the liquid cooling pipeline 43. By arranging a set of cooling sheets 44 side by side on opposite sides of the liquid cooling pipeline 43, the cooling area can be further increased to improve the cooling efficiency.

[0076] In some embodiments, the liquid cooling assembly 43 can be a water cooling pipeline, and condensed water is introduced into the pipeline to cool the cooling sheets 44.

[0077] Please refer to Figure 1 and Figure 2 , in combination Figure 4 and Figure 5 , the air knife structure 5 includes an air knife cavity 51 communicating with the cooling cavity 41 and an air knife 52 arranged in the air knife cavity 51. The air knife cavity 51 is arranged side by side with the cooling cavity 41 and has the same extension direction, and the air knife 52 extends along the extension direction b of the air knife cavity 51. The air knife 52 can uniformly blow the room temperature plasma after secondary cooling to the surface of the product to be treated 200, thereby improving the uniformity of plasma treatment.

[0078] Please refer to Figure 1 and Figure 2 , in the direction away from the ionization structure 1, the plasma collection chamber 2, the shunt cooling structure 3, the secondary cooling structure 4 and the air knife structure 5 are arranged side by side in sequence, which is more reasonable in layout, can make full use of space, and is conducive to realizing the miniaturization of the plasma generating device 100.

[0079] The plasma generating device 100 further comprises a shell 6, and the ionization structure 1, the plasma collection chamber 2, the shunt cooling structure 3, the secondary cooling structure 4 and the air knife structure 5 are integrated in the shell 6.

[0080] Compared with the prior art, the plasma generating device 100 provided by the embodiment of the application can realize the preliminary cooling and separation of high and low temperature plasma through the design of the shunt cooling structure 3, can realize the secondary cooling of the first temperature plasma through the design of the secondary cooling structure 4, so that the plasma blown out by the air knife structure 5 can reach room temperature, and the problems such as surface damage (for example, high temperature oxidation or surface ink volatilization) of the product to be treated 200 caused by high temperature can be reduced, in addition, through the design of the air knife structure 5, the room temperature plasma can be uniformly blown to the surface of the product to be treated 200, and the uniformity of the surface treatment is improved. Therefore, the plasma generating device 100 provided by the embodiment of the application can realize the surface treatment of room temperature plasma, and can improve the surface treatment quality and treatment efficiency of the product to be treated 200.

[0081] The above description is merely one optimized specific embodiment of the application, but in the actual application process, it cannot be limited to this embodiment.

Claims

1. A plasma generating device, characterized in that, include: The ionization structure, plasma collection chamber, shunt cooling structure, secondary cooling structure, and air knife structure are connected in sequence. The ionization structure is used to ionize compressed air introduced therein to generate plasma; The plasma collection chamber is used to collect the plasma generated by the ionization structure; The diversion cooling structure is used to perform a first cooling of the plasma. The diversion cooling structure is also used to divert the plasma into a first temperature plasma and a second temperature plasma, and to allow the first temperature plasma to flow into the second cooling structure, wherein the first temperature is lower than the second temperature. The secondary cooling structure is used to cool the plasma at the first temperature a second time. The air knife structure is used to blow the first-temperature plasma, which has been cooled by the secondary cooling structure, toward the surface of the product to be treated.

2. The plasma generating device according to claim 1, characterized in that, The diversion cooling structure is a turbine-type airflow separation mechanism, including a turbine winding tube, a diversion top tube, and a connecting pipe connecting the turbine winding tube and the diversion top tube. The inlet of the turbine winding tube is connected to the plasma collection chamber, and the outlet of the turbine winding tube is connected to the secondary cooling structure. The first temperature plasma is separated by the diversion top tube and then enters the secondary cooling structure through the connecting pipe and the outlet. The end of the diversion top tube away from the connecting pipe is provided with a separation outlet, which is used to connect to the recovery structure for recovering the second temperature plasma.

3. The plasma generating device according to claim 2, characterized in that, The diversion top tube includes a diversion cavity communicating with the connecting pipe and a conical diversion fluid located within the diversion cavity. The conical diversion fluid has a gap with the inner wall of the diversion cavity, and the conical surface of the conical diversion fluid faces the connecting pipe. The conical surface of the conical diversion fluid is used to reflect the first temperature plasma back to the connecting pipe. The gap communicates with the separation outlet so that the second temperature plasma can be discharged from the diversion top tube.

4. The plasma generating device according to claim 1, characterized in that, The secondary cooling structure includes a cooling cavity, a cooling plate assembly disposed in the cooling cavity, and a liquid cooling pipeline connected to the cooling plate assembly. The cooling cavity is connected to the diversion cooling structure and the air knife structure, respectively. The liquid cooling pipeline is used to cool the cooling plate assembly.

5. The plasma generating device according to claim 4, characterized in that, The cooling plate assembly includes multiple cooling plates spaced apart, arranged side by side along the extension direction of the cooling cavity.

6. The plasma generating apparatus according to claim 5, characterized in that, The cooling assembly includes two rows of cooling plates, which are arranged on opposite sides of the liquid cooling pipeline.

7. The plasma generating apparatus according to claim 4, characterized in that, The cooling cavity is a long, narrow cavity, and the diversion cooling structure and the air knife structure are respectively connected to opposite ends of the cooling cavity.

8. The plasma generating apparatus according to claim 7, characterized in that, The air knife structure includes an air knife chamber communicating with the cooling chamber and an air knife disposed in the air knife chamber. The air knife chamber and the cooling chamber are arranged side by side, the extension direction of the air knife chamber is consistent with the extension direction of the cooling chamber, and the air knife extends along the extension direction of the air knife chamber.

9. The plasma generating apparatus according to claim 1, characterized in that, The plasma generating device has multiple ionization chambers connected to the plasma collection chamber. Each ionization chamber contains one ionization structure. The multiple ionization chambers are arranged side by side on the same side of the plasma collection chamber, and the extending direction of the ionization chambers is perpendicular to the extending direction of the plasma collection chamber.

10. The plasma generating apparatus according to claim 1, characterized in that, Along a direction away from the ionization structure, the plasma collection chamber, the shunt cooling structure, the secondary cooling structure, and the air knife structure are arranged side by side in sequence.

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