Heat dissipation type ceramic electronic board assembly

Abstract

The invention relates to the technical field of ceramic electronic boards, in particular to a heat dissipation type ceramic electronic board assembly which comprises a board body and a heat dissipation body arranged below the board body. A heat conduction layer is arranged between the plate body and the heat dissipation body; wherein a cooling water channel is formed in the heat dissipation body, a fin part is formed below the heat dissipation body, a turbofan directly facing the fin part is fixedly installed below the heat dissipation body, and a temperature sensing mechanism for controlling start and stop of the turbofan is further installed below the heat dissipation body. By adopting the dual-mode heat dissipation design of the integrated cooling water channel and the turbofan, flexible switching between a water cooling mode and an air cooling mode is achieved, and the requirements of different use scenes can be met; and secondly, the configured temperature sensing mechanism can monitor the temperature in real time in the passive heat dissipation process and can automatically control starting and stopping of the turbofan according to temperature changes, and the heat dissipation scheme combining active heat dissipation and passive heat dissipation is adopted.

Description

Technical Field

[0001] This invention relates to the field of heat-dissipating ceramic electronic board assembly technology, and more particularly to a heat-dissipating ceramic electronic board assembly. Background Technology

[0002] Ceramic electronic boards are widely used in power electronics, high-frequency communication and other fields due to their excellent electrical properties and high-temperature stability. However, they generate a lot of heat during operation. If the heat is not dissipated in a timely and effective manner, it will seriously affect their performance, reliability and service life. Therefore, it is essential to equip ceramic electronic boards with an efficient heat dissipation system.

[0003] Currently, heat dissipation technologies for ceramic electronic boards are mainly divided into two types: air cooling and water cooling. Air cooling has a simple structure and low cost, but its heat dissipation capacity is limited and it is difficult to cope with the extreme heat dissipation requirements under high power density. Water cooling has high heat dissipation efficiency, but the system is complex, there is a risk of leakage, and the installation and maintenance requirements are high.

[0004] Existing heat dissipation solutions are usually fixed single-mode designs, meaning that once the equipment is manufactured, its heat dissipation method is determined. This design cannot be flexibly switched according to the actual working environment or load conditions.

[0005] For example, under low load or low temperature conditions, a powerful water cooling system will waste resources; while under high load or high temperature conditions, a simple air cooling system may not be able to dissipate heat. The lack of this mode switching makes the existing heat dissipation solution inflexible and unable to achieve the best balance between heat dissipation performance and energy consumption control, making it difficult to meet the complex and ever-changing application requirements.

[0006] Therefore, there is an urgent need for a solution that can adapt to different operating conditions and flexibly switch heat dissipation modes. Summary of the Invention

[0007] The purpose of this invention is to address the aforementioned shortcomings in the prior art by proposing a heat-dissipating ceramic electronic board assembly.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: Design a heat-dissipating ceramic electronic board assembly, including: The plate and the heat sink located below the plate; A heat-conducting layer is provided between the plate and the heat sink; The heat sink has a cooling water channel inside, a finned portion is formed below the heat sink, and a turbine fan is fixedly installed facing the finned portion. A temperature sensing mechanism for starting and stopping the turbine fan is also installed below the heat sink.

[0009] Furthermore, the temperature sensing mechanism includes; A bimetallic strip fixedly installed below the heat sink; Two deformable portions are formed by cutting on the end face of the bimetallic sheet. A bracket is fixedly installed on the upper end of the bimetallic sheet, and a switch assembly that cooperates with the deformable portions is provided inside the bracket.

[0010] Furthermore, the switching assembly includes; A conductive rod is movably inserted into the end face of the bracket, and a spring is fixedly connected between the conductive rod and the bracket; The bottom of the conductive rod is fixedly installed with an insulating part that contacts the deformed part above it. A conductive sheet is installed above the bracket. The upper end of the conductive rod and the bottom of the conductive sheet are initially separated by a predetermined distance. The conductive sheet is electrically connected to the turbine fan.

[0011] Furthermore, the cooling water channel is formed in a continuous curved structure inside the heat sink, and the heat sink has an inlet and an outlet on both sides that connect to the cooling water channel. In particular, a feedback bend is continuously formed along the path of the cooling water channel near the outlet, and the feedback bend is located directly below the bimetallic sheet.

[0012] Furthermore, it also includes an air duct switching mechanism; The air duct switching mechanism is installed at the air outlet of the turbine fan. The air duct switching mechanism is used to switch the air volume of the turbine fan to the fin section and / or the cooling water circuit. A sealing mechanism is also provided in the cooling water circuit opposite to the air duct switching mechanism.

[0013] Furthermore, the air duct switching mechanism includes an air guide frame; Two guide plates are fixedly installed on the air outlet side of the turbine fan, and the air guide frame is slidably connected between the two guide plates; The air guide frame has an opening on its end face near the turbine fan. An upper air chamber and a lower air chamber are separated in the opening by a partition. The back end of the air guide frame has several air outlets that connect to the upper air chamber, and the air outlets are directly opposite the fin portion.

[0014] Furthermore, multiple air guide columns are fixedly installed at the lower end of the air guide frame. The air guide columns are connected to the lower air chamber. Several air holes are opened on the outer side of the air guide columns. In the initial state, the air guide columns are located on the lower side of the heat sink.

[0015] Furthermore, at least two grooves are provided on the end face of the guide plate, and a guide post that slides in the groove is fixedly installed on the side of the air guide frame. A compression spring is fixedly connected between the air guide frame and the heat sink, and a self-locking structure is provided between the air guide frame and the guide plate.

[0016] Furthermore, the self-locking structure includes; A self-locking ring groove is formed on the end face of the guide plate, and a self-locking rod is rotatably connected to the side of the air guide frame. The end face of the self-locking rod is slidably connected in the self-locking ring groove.

[0017] Furthermore, the sealing mechanism includes; A sleeve is fixedly installed in the cooling water circuit. A sealing post is movably inserted into the inside of the sleeve through a spring. A switching hole communicating with the cooling water circuit is opened on the end face of the heat sink. The end of the sealing post stops and seals below the switching hole. The end of the air guide column abuts against the sealing post and disengages from the switching hole.

[0018] The heat-dissipating ceramic electronic board assembly proposed in this invention has the following advantages: First, by adopting a dual-mode heat dissipation design integrating a cooling water circuit and a turbine fan, this invention achieves flexible switching between water cooling and air cooling modes, which can adapt to the needs of different usage scenarios. Second, the configured temperature sensing mechanism can monitor the temperature in real time during passive heat dissipation and automatically control the start and stop of the turbine fan according to temperature changes. This combination of active and passive heat dissipation effectively ensures the heat dissipation reliability of the ceramic electronic board in various complex environments, and improves the stability and adaptability of the overall system. Attached Figure Description

[0019] Figure 1 This is a perspective view of the present invention; Figure 2 This is a schematic diagram of the explosive structure of the present invention. Figure 1 ; Figure 3 This is a schematic diagram of the explosive structure of the present invention. Figure 2 ; Figure 4 This is a schematic diagram of the turbine fan structure of the present invention; Figure 5 This is a schematic diagram of the temperature sensing mechanism of the present invention; Figure 6 This is a schematic diagram of the switching assembly structure of the present invention; Figure 7 This is a schematic diagram of the cooling water circuit structure of the present invention; Figure 8 This is a schematic diagram of the air duct switching mechanism of the present invention; Figure 9 This is a schematic diagram of the air guide column structure of the present invention; Figure 10 This is a schematic cross-sectional view of the heat sink structure of the present invention; Figure 11 for Figure 10 A magnified structural diagram of area A.

[0020] In the diagram: 1. Plate; 2. Heat sink; 21. Cooling water channel; 211. Feedback bend channel; 22. Fin section; 23. Turbine fan; 24. Switching hole; 3. Heat-conducting layer; 4. Temperature sensing mechanism; 41. Metal sheet; 42. Deformation part; 43. Bracket; 44. Switch assembly; 441. Conductive rod; 442. Spring; 443. Insulation part; 444. Conductive sheet; 5. Air duct switching mechanism; 51. Air guide frame; 511. Guide column; 52. Guide plate; 521. Slide groove; 53. Partition; 54. Upper air chamber; 55. Lower air chamber; 56. Air outlet; 57. Air guide column; 571. Air hole; 58. Compression spring; 59. Self-locking structure; 591. Self-locking ring groove; 592. Self-locking rod; 6. Sealing mechanism; 61. Sleeve; 62. Spring; 63. Sealing column. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0022] Reference Figure 1-11 As an embodiment of the present invention, a heat-dissipating ceramic electronic board assembly is disclosed. Specifically, the electronic board assembly includes a board body 1 and a heat sink 2 placed below the board body 1, and a thermally conductive layer 3 is disposed between the board body 1 and the heat sink 2. Specifically, in this embodiment of the invention, the board 1 is a ceramic circuit board, and the thermal conductive layer 3 is set as a thermally conductive adhesive layer, which is used for heat conduction and insulation. The working heat of the board 1 is transferred to the heat sink 2 through the thermal conductive layer 3 to achieve the heat dissipation and cooling effect of the board 1. The heat sink 2 has a cooling water channel 21 inside, a finned portion 22 is formed below the heat sink 2, and a turbine fan 23 is fixedly installed facing the finned portion 22. A temperature sensing mechanism 4 for starting and stopping the turbine fan 23 is also installed below the heat sink 2.

[0023] In other words, by adopting a dual-mode heat dissipation design integrating a cooling water circuit 21 and a turbine fan 23, this invention achieves flexible switching between water cooling and air cooling modes, which can adapt to the needs of different usage scenarios. Secondly, the configured temperature sensing mechanism 4 can monitor the temperature in real time during passive heat dissipation and can automatically control the start and stop of the turbine fan 23 according to temperature changes. This combination of active and passive heat dissipation effectively ensures the heat dissipation reliability of the ceramic electronic board in various complex environments and improves the stability and adaptability of the overall system.

[0024] Reference Figure 5 , Figure 6 In some embodiments, the temperature sensing mechanism 4 of the present invention includes; The bimetallic strip 41, which is fixedly installed below the heat sink 2, is specifically described as being composed of two metals or alloys with different coefficients of thermal expansion. Optionally, in this embodiment of the invention, the active layer can be a manganese-nickel-copper alloy, which has a large coefficient of thermal expansion, is sensitive to temperature changes of around 50°C, and has reliable operation. The passive layer can be a nickel-iron alloy with a small and stable coefficient of thermal expansion. When combined with manganese-nickel-copper, the bending action is precise, repeatable, and suitable for operating points of around 50°C. That is, by adopting the design of bimetallic strip 41 in this invention, when the conduction temperature of heat sink 2 reaches about 50°C, bimetallic strip 41 can be activated. Two deformable portions 42 are formed by cutting on the end face of the bimetallic strip 41. A bracket 43 is fixedly installed on the upper end of the bimetallic strip 41. A switch assembly 44 that cooperates with the deformable portions 42 is provided inside the bracket 43.

[0025] In other words, by employing two deformation portions 42 on the end face of the bimetallic strip 41, when the temperature of the heat sink 2 reaches approximately 50°C, the two deformation portions 42 will bend due to heat. The bending deformation force of the deformation portions 42 is used to control the aforementioned switch assembly 44 to close, thereby enabling the turbine fan 23 to be turned on. Conversely, the turbine fan 23 will not be turned on if the ambient temperature is too high. This design satisfies the requirement that if the ambient temperature is too high during passive heat dissipation, the turbine fan 23 will actively engage in heat dissipation, thereby ensuring the reliability of heat dissipation for the ceramic electronic board. At the same time, the temperature sensing strategy can also effectively reduce the amount of electricity used, achieving the purpose of energy saving and environmental protection.

[0026] Reference Figure 6 Based on the above embodiments, the switch assembly 44 in this invention includes: A conductive rod 441 is movably inserted into the end face of the bracket 43, and a spring 442 is fixedly connected between the conductive rod 441 and the bracket 43; Specifically, the bracket 43 in this invention has a U-shaped structure. Both the bracket 43 and the bimetallic sheet 41 are fixed to the lower side of the heat sink 2 by bolts. Two ring platforms are formed on the outer side of the conductive rod 441. The spring 442 is connected between the lower ring platform and the bracket 43. The upper ring platform is used to stop and position the downward movement of the conductive rod 441. Optionally, the conductive rod 441 in this invention is set as a copper rod. The bottom of the conductive rod 441 is fixedly installed with an insulating part 443 that contacts the deformable part 42. A conductive sheet 444 is installed above the bracket 43. The upper end of the conductive rod 441 and the bottom of the conductive sheet 444 are initially separated by a predetermined distance. The conductive sheet 444 is electrically connected to the turbine fan 23.

[0027] Of course, in this invention, the two conductive rods 441 should be connected to the positive and negative terminals of the power supply, respectively. In order to improve the protection of the conductive rods 441 and the conductive sheet 444, an insulating adhesive layer can be included on the outer side of both the conductive rods 441 and the conductive sheet 444. This can reduce the occurrence of contact problems. Only metal contact points need to be pre-set at the upper end of the conductive rods 441 and the lower side of the conductive sheet 444.

[0028] In actual operation, when the bimetallic strip 41 is heated and deformed, the deformed part 42 on its end face will abut against the insulating part 443 and move upward, thereby controlling the entire conductive rod 441 to move upward. When the conductive rod 441 moves upward and contacts the conductive sheet 444, the circuit of the external power supply, conductive rod 441, conductive sheet 444 and turbine fan 23 can be completed. After being powered on, the turbine fan 23 enters the working state and blows air towards the side of the finned part 22, thereby blowing the heat on the finned part 22 outward, thereby improving the heat dissipation efficiency of the entire heat sink 2 and realizing rapid heat dissipation of the ceramic electronic board.

[0029] Conversely, when the temperature is lower than the predetermined temperature, the deformable part 42 bends downward and resets, the end of the conductive post 441 separates from the conductive sheet 444, and the turbine fan 23 stops rotating, thus entering the passive heat dissipation state.

[0030] Reference Figure 7 Furthermore, in this embodiment of the invention, the cooling water channel 21 is formed in a continuously curved structure inside the heat sink 2, and the heat sink 2 has an inlet and an outlet on both sides that connect to the cooling water channel 21. In particular, a feedback bend channel 211 is continuously bent and formed along the path of the cooling water channel 21 near the outlet, and the feedback bend channel 211 is located directly below the bimetallic sheet 41.

[0031] Specifically, the cooling water path 21 described in this invention has a continuous serpentine bend structure, and the feedback bend channel 211 is also set as a continuous serpentine bend structure. The design of the feedback bend channel 211 is to enhance the flow length at the water outlet, so as to ensure the automatic start and stop control of the bimetallic strip 41 in water cooling mode.

[0032] In water-cooling mode, when circulating water flows through the cooling water path 21, if the bimetallic strip 41 detects the temperature at the feedback bend 211, and the temperature at the outlet is too high, exceeding the operating temperature of the bimetallic strip 41, the bimetallic strip 41 will also activate and start the turbine fan 23. This design allows for further control of the turbine fan 23's start and stop in water-cooling mode, accelerating the heat dissipation efficiency of the heat sink 2 through air cooling intervention. This avoids the problem that water cooling alone cannot quickly and effectively cool the ceramic electronic board.

[0033] Of course, by using the feedback bending channel 211 in this invention, the accuracy of the bimetallic strip 41 in detecting the cooling water circuit 21 can be ensured, while not affecting the passive temperature detection of the heat sink 2 by the bimetallic strip 41, so as to realize the control operation of multiple heat dissipation modes.

[0034] Reference Figure 8 , Figure 9 In some embodiments, the present invention also includes a duct switching mechanism 5; The air duct switching mechanism 5 is installed at the air outlet of the turbine fan 23. The air duct switching mechanism 5 is used to switch the air volume of the turbine fan 23 to the fin section 22 and / or the cooling water passage 21. A sealing mechanism 6 is also provided in the cooling water passage 21 opposite to the air duct switching mechanism 5.

[0035] Reference Figure 9 In an optional embodiment, the air duct switching mechanism 5 of the present invention includes an air guide frame 51; Two guide plates 52 are fixedly installed on the air outlet side of the turbine fan 23, and the air guide frame 51 is slidably connected between the two guide plates 52. The air guide frame 51 has an opening on its end face near the turbine fan 23. An upper air chamber 54 and a lower air chamber 55 are separated in the opening by a partition 53. The back end of the air guide frame 51 has several air outlets 56 that communicate with the upper air chamber 54. The air outlets 56 are directly opposite the fin portion 22.

[0036] When the turbine fan 23 is working, its airflow enters the interior of the air guide frame 51. Since the interior of the air guide frame 51 is divided into an upper air chamber 54 and a lower air chamber 55, the airflow entering the upper air chamber 54 will be blown outward from the air outlet 56 until it passes through the fin section 22 to carry away the heat on the fin section 22, thereby achieving active and rapid heat dissipation. The airflow, along with some of the airflow, will enter the lower air chamber 55 for the next step.

[0037] Reference Figure 9Based on the above embodiments, in this embodiment of the invention, a plurality of air guide columns 57 are fixedly installed at the lower end of the air guide frame 51. The air guide column 57 has a hollow structure inside and the bottom is sealed. The air guide column 57 is connected to the lower air chamber 55. A plurality of air holes 571 are opened on the outside of the air guide column 57. In the initial state, the air guide column 57 is located on the lower side of the heat sink 2.

[0038] In other words, in the initial state, the air guide column 57 is located on the lower side of the heat sink 2, that is, the air hole 571 is exposed at this time. When the air volume enters the lower air chamber 55, it will enter the air guide column 57 and then be discharged outward along the air hole 571 on the outside of the air guide column 57. Since the air hole 571 is located below the heat sink 2 at this time, the air volume discharged from the air hole 571 will also blow towards the fin section 22, thus realizing the full air volume heat dissipation mode for the fin section 22.

[0039] It should be noted that at least two sliding grooves 521 are provided on the end face of the guide plate 52 in this invention, and a guide post 511 that slides in the sliding groove 521 is fixedly installed on the side of the air guide frame 51. A compression spring 58 is fixedly connected between the air guide frame 51 and the heat sink 2, and a self-locking structure 59 is provided between the air guide frame 51 and the guide plate 52.

[0040] The air guide frame 51 described in this invention is slidably connected up and down. The self-locking structure 59 is designed to position it in its downward movement and reset state. The compression spring 58 is to improve the movement control capability of the air guide frame 51. When the air guide frame 51 moves downward, the air guide column 57 will cooperate with the sealing mechanism 6 to insert the air guide column 57 into the cooling water channel 21 to realize the internal air cooling operation of the cooling water channel 21. This mode can be adapted to environments where it is not convenient to connect to a water source for heat dissipation operation.

[0041] Reference Figure 8 In an optional embodiment, the self-locking structure 59 of the present invention includes; The self-locking ring groove 591 is formed on the end face of the guide plate 52. The self-locking ring groove 591 refers to a continuous stepped groove structure in the ring shape. Its specific structure can be referred to the pressing card slot structure of TF card in the prior art. Since it is a conventional design method for those skilled in the art, it will not be described in detail here. A self-locking rod 592 is rotatably connected to the side of the air guide frame 51, and the end face of the self-locking rod 592 is slidably connected to the self-locking ring groove 591.

[0042] In other words, the present invention uses the cooperation of self-locking ring groove 591 and rotating self-locking rod 592 to limit the vertical movement of air guide frame 51. In the initial state, the air guide frame 51 is located above the compression spring 58, and the self-locking rod 592 is located below the self-locking ring groove 591. When airflow switching is required, the airflow guide frame 51 can be pressed to move it upward. At this time, the self-locking rod 592 slides to the upper locking point of the self-locking ring groove 591, thus locking and fixing the pressed position of the airflow guide frame 51. After pressing, the airflow guide column 57 moves toward the interior of the heat sink 2 to cooperate with the sealing mechanism 6.

[0043] Reference Figure 11 Specifically, the sealing mechanism 6 in this embodiment of the invention includes; The sleeve 61 is fixedly installed in the cooling water channel 21. It should be noted that the diameter of the sleeve 61 in this invention should be smaller than the diameter of the cooling water channel 21. This design is to avoid the sleeve 61 blocking the water flow. The sleeve 61 is movably inserted with a sealing post 63 through a spring 62. In this embodiment, the spring 62 can also be set as a compression spring. A switching hole 24 communicating with the cooling water channel 21 is opened on the end face of the heat sink 2. The end of the sealing post 63 stops and seals below the switching hole 24. The end of the air guide column 57 abuts against the sealing post 63 and disengages from the switching hole 24.

[0044] In other words, when the air guide frame 51 is pressed down in this invention, the air guide column 57 will move downward against the sealing column 63. At this time, the air hole 571 of the air guide column 57 will sink into the cooling water channel 21. When the turbine fan 23 is working, the air volume in the upper air chamber 54 will be blown into the fin section 22 through the air outlet 56, while the air volume in the lower air chamber 55 will enter the cooling water channel 21 through the air guide column 57 along the air hole 571. At this time, a dual heat dissipation mode for the cooling water channel 21 and the fin section 22 of the heat sink 2 can be formed.

[0045] In summary, this invention has multiple working modes, as detailed below; I. Passive cooling mode In passive mode, heat is passively dissipated from board 1 via heat sink 2; II. Air-cooled heat dissipation mode In the air-cooled heat dissipation mode, the start and stop of the turbine fan 23 is controlled by the temperature sensing mechanism 4, and the turbine fan 23 can quickly blow air to the finned part 22 to dissipate heat at full volume. Meanwhile, the airflow of the turbine fan 23 can be switched and controlled by the air duct switching mechanism 5, so that part of the airflow is blown into the fin section 22 along the air guide frame 51, and the other part of the airflow enters the cooling water passage 21. By means of the internal passage of the cooling water passage 21, dual rapid heat dissipation can be achieved on the outside and inside of the heat sink 2 to optimize the heat dissipation efficiency. This method is mainly suitable for situations where it is inconvenient to connect to circulating cooling water. III. Water Cooling Mode In this mode, cooling water is effectively dissipated by connecting the cooling water circuit 21 to the circulating cooling water. It should be noted that the air duct switching mechanism 5 cannot switch in this mode to avoid water leakage. Of course, in the water cooling mode, the start and stop of the turbine fan 23 can also be automatically controlled by the temperature sensing mechanism 4 to ensure the heat dissipation efficiency of the ceramic electronic board.

[0046] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A heat-dissipating ceramic electronic board assembly, characterized in that, include: The plate (1) and the heat sink (2) located below the plate (1); A heat-conducting layer (3) is provided between the plate (1) and the heat sink (2); The heat sink (2) has a cooling water channel (21) inside. A finned part (22) is formed below the heat sink (2) and a turbine fan (23) is fixedly installed facing the finned part (22). A temperature sensing mechanism (4) for starting and stopping the turbine fan (23) is also installed below the heat sink (2).

2. The heat-dissipating ceramic electronic board assembly according to claim 1, characterized in that: The temperature sensing mechanism (4) includes; A bimetallic sheet (41) is fixedly installed below the heat sink (2). Two deformable portions (42) are formed by cutting on the end face of the bimetallic sheet (41). A bracket (43) is fixedly installed on the upper end of the bimetallic sheet (41). A switch assembly (44) that cooperates with the deformable portions (42) is provided inside the bracket (43).

3. The heat-dissipating ceramic electronic board assembly according to claim 2, characterized in that: The switching assembly (44) includes; A conductive rod (441) is movably inserted into the end face of the bracket (43), and a spring (442) is fixedly connected between the conductive rod (441) and the bracket (43). The bottom of the conductive rod (441) is fixedly installed with an insulating part (443) that contacts the deformable part (42). A conductive sheet (444) is installed above the bracket (43). The upper end of the conductive rod (441) and the bottom of the conductive sheet (444) are initially separated by a predetermined distance. The conductive sheet (444) is electrically connected to the turbine fan (23).

4. The heat-dissipating ceramic electronic board assembly according to claim 2, characterized in that: The cooling water passage (21) is formed in a continuous curved structure inside the heat sink (2), and the heat sink (2) has an inlet and an outlet on both sides that connect to the cooling water passage (21). Among them, a feedback bend channel (211) is continuously bent and formed on the path of the cooling water channel (21) near the outlet, and the feedback bend channel (211) is located directly below the bimetallic sheet (41).

5. A heat-dissipating ceramic electronic board assembly according to claim 1, characterized in that: It also includes a duct switching mechanism (5); The air duct switching mechanism (5) is installed at the air outlet of the turbine fan (23). The air duct switching mechanism (5) is used to switch the air volume of the turbine fan (23) to the fin section (22) and / or the cooling water passage (21). A sealing mechanism (6) is also provided in the cooling water passage (21) opposite to the air duct switching mechanism (5).

6. The heat-dissipating ceramic electronic board assembly according to claim 5, characterized in that: The air duct switching mechanism (5) includes an air guide frame (51); Two guide plates (52) are fixedly installed on the air outlet side of the turbine fan (23), and the air guide frame (51) is slidably connected between the two guide plates (52); The air guide frame (51) is located near the end face opening of the turbine fan (23). The upper air chamber (54) and the lower air chamber (55) are separated in the opening by a partition (53). The back end of the air guide frame (51) is provided with a plurality of air outlets (56) that communicate with the upper air chamber (54). The air outlets (56) are directly opposite the fin portion (22).

7. A heat-dissipating ceramic electronic board assembly according to claim 6, characterized in that: Multiple air guide columns (57) are fixedly installed at the lower end of the air guide frame (51). The air guide columns (57) are connected to the lower air chamber (55). Several air holes (571) are opened on the outside of the air guide columns (57). In the initial state, the air guide columns (57) are located on the lower side of the heat sink (2).

8. A heat-dissipating ceramic electronic board assembly according to claim 6, characterized in that: At least two grooves (521) are provided on the end face of the guide plate (52), and a guide post (511) that slides in the groove (521) is fixedly installed on the side of the air guide frame (51). A compression spring (58) is fixedly connected between the air guide frame (51) and the heat sink (2), and a self-locking structure (59) is provided between the air guide frame (51) and the guide plate (52).

9. A heat-dissipating ceramic electronic board assembly according to claim 8, characterized in that: The self-locking structure (59) includes; A self-locking ring groove (591) is formed on the end face of the guide plate (52), and a self-locking rod (592) is rotatably connected to the side of the air guide frame (51). The end face of the self-locking rod (592) is slidably connected to the self-locking ring groove (591).

10. A heat-dissipating ceramic electronic board assembly according to claim 7, characterized in that: The sealing mechanism (6) includes; A sleeve (61) is fixedly installed in the cooling water circuit (21). A sealing post (63) is movably inserted into the inside of the sleeve (61) through a spring (62). A switching hole (24) communicating with the cooling water circuit (21) is opened on the end face of the heat sink (2). The end of the sealing post (63) stops and seals below the switching hole (24). The end of the air guide column (57) abuts against the sealing post (63) and disengages from the switching hole (24).

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