Method and system for dismantling an electronic board

Abstract

Method for dismantling an electronic board (S); wherein said electronic board (S) comprises a support circuit (Q) and a plurality of electrical and / or electronic components (c1, c2, c3) mounted on the support circuit (Q); the method provides performing an operating step of component removal (A2) of the electronic board (S), in which the components (c1, c2, c3) are removed from the support circuit (Q); wherein said component removal step (A2) provides for pulling the support circuit (Q) through a slot (f) defined by two blades (2) in such a manner that the components (c1, c2, c3) protruding from the support circuit (Q) are intercepted by the blades (2) and detached from the support circuit (Q).

Description

[0001] DESCRIPTION

[0002] METHOD AND SYSTEM FOR DISMANTLING AN ELECTRONIC BOARD

[0003] The present industrial invention patent application relates to a method and a system for dismantling an electronic board.

[0004] As is known, electronic boards comprise a printed circuit and a plurality of electrical components fixed to the printed circuit, such as for example a processor, capacitors, resistors, heat sinks, amplifiers, etc.

[0005] These components of the electronic boards are made of noble materials such as rare earths and critical raw materials which may possibly be reused in other applications.

[0006] In this regard, once such electronic boards are decommissioned, material recovery processes are carried out on them in order to extract such noble materials. Obviously, before recovering these materials, it is necessary to carry out a dismantling or disassembly process of the elements from the printed circuit. Currently, different methodologies exist for dismantling an electronic board; however, they all always involve applying heat to the printed circuit and therefore prove to be energy-consuming in terms of the energy used.

[0007] W02024009152 describes a system for dismantling electronic components from an electronic board. The system comprises a rotating drum screen having a first end for the inlet of boards, a second end for the outlet of boards, and a lateral screening wall having two or more sections, arranged one after the other, with holes of increasing size from the first end to the second end. The screen may be inclined in multiple configurations and is preferably arranged with a slope towards the second end. The rotating drum screen is placed inside a closed chamber which is heated by heating means. In use, the electronic boards are inserted inside the rotating screen through the first end. The screen is then rotated and at the same time the chamber is heated so that the air inside the chamber reaches a temperature higher than 250 °C.

[0008] Due to the temperature reached by the air and the mechanical impacts sustained by the boards during rotation of the rotating drum screen, the electronic components of the board tend to detach from the printed circuit. Because of the inclination, moreover, the boards and the components tend to move from the first end towards the second end. In this way, small-sized electronic components exit the screen through the holes located near the first end, while larger components tend to exit the rotating screen through the holes located closer to the second end. Finally, the electronic boards exit the rotating screen through an opening provided at the second end of the drum screen.

[0009] As mentioned previously, such a system and method, which rely on the combined use of heat and continuous rotation of the rotating screen, require a substantial amount of energy both to maintain the predetermined temperature inside the chamber and to keep the rotating screen continuously rotating.

[0010] IT202100026870A1 describes a method for dismantling components from an electronic board that uses “Vapor Phase” technology, which exploits the thermal energy generated by the change of state from gas to liquid of a heat-transfer fluid to melt the solder paste still present on the components of the electronic board. The method specifically provides placing the electronic board inside a hermetically sealed chamber with the face on which the components are soldered facing downward. The chamber is then filled with a heated heat-transfer fluid which, once it comes into contact with the board (at a lower temperature), condenses, generating a homogeneous layer of fluid that heats the board, causing the solder paste of the components to melt.

[0011] In this way, the components detach from the board and fall downward due to gravity. In order to remove even the smallest and lightest components, air is also extracted from inside the chamber so that even those light components detach from the electronic board.

[0012] The method described in IT202100026870A1 is expensive to apply and also requires a considerable amount of energy.

[0013] The purpose of the present invention is to overcome the drawbacks of the known art by devising a new method for dismantling an electronic board that is economical to perform and does not require the use of an excessive amount of energy.

[0014] A further purpose of the present invention is to devise a new method for dismantling or disassembling an electronic board that is efficient, effective, and simple to implement.

[0015] Another purpose of the present invention is to devise a new system that allows the method according to the invention to be carried out.

[0016] These purposes are achieved according to the invention with the features listed in the annexed independent claim 1.

[0017] Advantageous embodiments are apparent from the dependent claims.

[0018] The method according to the invention is defined by claim 1 while the system according to the invention is defined by claim 8.

[0019] For greater explanatory clarity, the description of the method and the system according to the invention continues with reference to the attached drawing sheets, which are merely illustrative and not limiting, wherein:

[0020] Fig. 1 is a flow diagram illustrating the steps of the method according to the invention;

[0021] Figs. 2 and 3 are two axonometric views of a processor removal station of a system that implements the method according to the invention;

[0022] Figs. 4-4D schematically show, step by step, the manner in which the processor is removed from an electronic board using the elements located on the processor removal station shown in Figures 2 and 3;

[0023] Figs. 5 and 6 are two axonometric views of a component removal station of the system that implements the method according to the invention;

[0024] Figs. 7 and 8 partially show the removal station of Figs. 5 and 6 from different angles;

[0025] Fig. 9 is an axonometric view of the guide groove and of the blades of the removal station;

[0026] Fig. 9A is an exploded view of the elements shown in Fig. 9;

[0027] Fig. 10 is an axonometric view of pulling means of the removal station;

[0028] Fig. 10A is a vertical section of the pulling means;

[0029] Fig. 10B is a horizontal sectional view of the pulling means sectioned along plane U-U of Fig. 10;

[0030] Fig. 11 is a horizontal sectional view of a part of the component removal station illustrating in particular the main elements of said component removal station;

[0031] Fig. 11 A is identical to Fig. 11 but supplemented with an electronic board intended to pass through a slot defined by two blades of the component removal station; Figs. 12 and 12A schematically show the manner in which the electrical or electronic components are removed from the electronic board using the elements located on the component removal station shown in Figs. 5, 11 A;

[0032] Fig. 13 schematically shows a selection and distribution station of the system that implements the method according to the invention.

[0033] With reference to the attached figures, a method and a system for dismantling or disassembling an electronic board are described.

[0034] It should be noted that hereinafter the term electronic board (S) refers to any electronic circuit comprising:

[0035] - a plate-shaped support circuit (Q), such as for example a printed circuit; and

[0036] - at least one processor (m) or microprocessor mounted on the support circuit (Q); and

[0037] - a plurality of types of components (c1 , c2, c3) such as for example resistors, capacitors, diodes, transistors, etc., also mounted on the support circuit (Q).

[0038] With reference to Fig. 1 , the method according to the invention provides two separate removal steps (A1 , A2), of which a first processor removal step (A1 ) in which the processor (m) is removed from the support circuit (Q) and a second component removal step (A2) in which the various components (c1 , c2, c3) are removed from the support circuit (Q).

[0039] The aforementioned processor removal step (A1) provides performing peripheral cuts (t1 , t2, t3, t4) on the support circuit (Q) around the processor (m) so as to physically separate the processor (m) from the support circuit (Q) and then move the processor (m) away from the support circuit (Q).

[0040] With reference to Figs. 2 and 3, this processor removal step (A1 ) is carried out in a dedicated processor removal station (H1 ) of the system.

[0041] The processor removal station (H1 ) comprises a frame (1) with a surface (10) on which a support (11 ) intended to house and support the electronic board (S) is placed with the processor (m) facing upwards.

[0042] The frame (1) comprises a column (12) protruding superiorly from the surface (10). An operating head (13) is located above the support (11 ) and is mounted movably up and down on the aforementioned column (12).

[0043] In particular, sliding and guiding means (G) are arranged between the operating head (13) and the column (12), which allow the operating head (13) to rise, moving away from the support (11 ), or descend, approaching the support (11 ).

[0044] The sliding and guiding means (G) comprise, for example, guide bars fixed to the column (12) and carriages fixed to the operating head (13).

[0045] The operating head (13) further comprises a lower terminal blade (14) adapted to impact the support circuit (Q) of the electronic board (S) in order to generate the aforementioned cuts (t1 , t2, t3, t4) whenever the operating head (13) is lowered. Thus, said blade (14) of the operating head (13) essentially performs the function of a guillotine, which, whenever it is lowered, impacts against the support circuit (Q) to cut it. The blade (14) may be a fixed blade or a vibrating blade. Said blade (14) may be used either cold or hot (i.e. heated).

[0046] In order to carry out the cuts (t1 , t2, t3, t4) around the entire perimeter of the microprocessor (m), it is necessary that the electronic board (S) be moved each time so that the blade (14) can impact, at each descent of the operating head (13), different points of the support circuit (Q).

[0047] The movement of the electronic board (S) may be performed manually by an operator who, after each cut (t1 , t2, t3, t4) carried out, rotates the electronic board (S) by 90°, or may be performed automatically by electromechanical actuators connected to the support (11 ) that move the support (11 ) and therefore the electronic board (S) supported by the support (11 ) itself.

[0048] The processor removal station (H1 ) further comprises a drive means (15) that actuates the up-and-down movement of the operating head (13) along the column (12).

[0049] The drive means (15) consists of a lever hinged to the column (12) and connected, through transmission means (not shown in the attached figures), to the operating head (13). The transmission means are shaped so as to convert a rotation of the lever of the drive means (15) into a translational movement of the operating head

[0050] (13).

[0051] Even though in the attached figures the operating head (13) is always shown as mounted sliding relative to the column (12) and moved by rotation of the lever of the drive means (15), nothing prevents providing different movement means that automatically move the operating head (13). For example, the operating head (13) may be supported by a robotic arm with four, five or six axes automatically managed by a control unit. The robotic arm is configured so as to orient the operating head (13) in space, and therefore in such case it would no longer be necessary to move the aforementioned electronic board (S), since the robotic arm may position the blade (14) in different configurations relative to the underlying electronic board (S) and thus may cause the blade (13) to travel along the entire perimeter around the processor (m).

[0052] Advantageously, the processor removal station (H1 ) further comprises a suction system (16) comprising a suction device (not shown in the attached figures) and suction mouths (160) in fluid connection with the suction device and mounted on board the operating head (13).

[0053] The suction system (16) is configured so as to vacuum the dust generated during cutting of the support circuit (Q) by the blade (14).

[0054] With reference to Figs. 4-4D, the aforementioned processor removal step (A1 ) carried out in the processor removal station (H1 ) of the system therefore provides: - placing the electronic board (S) on the support (11 ) with the microprocessor (m) facing upwards; and

[0055] - moving the operating head (13) closer to and away from the support (11 ) so that the blade (14) of the operating head (13) incises the support circuit (Q) of the electronic board (S) peripherally all around the microprocessor (m) (see Figs. 4- 4C).

[0056] Once the perimeter cuts (t1 , t2, t3, t4) on the support circuit (Q) around the processor (m) have been made, the processor (m) is extracted from the support circuit (Q), as shown in Fig. 4D, and then:

[0057] - the processor (m) is placed in a dedicated processor storage station; and

[0058] - the second component removal step (A2) is carried out on the support circuit (Q). This second component removal step (A2) provides causing the support circuit (Q) to pass through a slot (f) defined by two blades (2) so that the components (c1 , c2, c3) protruding from the support circuit (Q) are intercepted by the blades (2) and detached from the support circuit (Q).

[0059] The two blades (2) may be fixed or alternatively vibrating.

[0060] With reference to Figs. 5-12A, this component removal step (A2) is carried out in a dedicated component removal station (H2) of the system.

[0061] The component removal station (H2) comprises a frame (P) comprising a surface (PO) on which the two blades (2) are arranged vertically and in which a guide groove (D) is arranged, extending along an axis (X) passing through the slot (f) defined by the two blades (2). On the guide groove (D) there is a positioning area (B) located in front of the two blades (2), in which the support circuit (Q) is intended to be positioned with a peripheral edge of the printed circuit inserted into the guide groove (D), so that said support circuit (Q) remains substantially in a vertical configuration and aligned with the slot (f) defined by the two blades (2). The guide groove is obtained by means of two strips (D1 ) parallel to each other.

[0062] The two blades (2) are supported by two corresponding blade-holder supports (20), one fixed to one strip (D1 ) and the other fixed to the other strip (D1 ). Each strip (D1 ) and the corresponding blade-holder support define a strip-blade-holder support assembly.

[0063] The component removal station (H2) further comprises pulling means (3, 4) shaped so as to pull the support circuit (Q) along the guide groove (D) so that the support circuit (Q) completely passes through the slot (f) defined by the two blades (2), thereby facilitating the separation of the components (c1 , c2, c3) from the support circuit (Q).

[0064] The above-mentioned pulling means (3, 4) comprise:

[0065] - pushing means (3) positioned upstream of the blades (2) suitable for pushing the support circuit (Q) through the slot (f) defined by the two blades (2) until at least a part of the support circuit (Q) passes beyond the blades (2); and

[0066] - pulling means (4) positioned downstream of the two blades (2) and shaped so as to grasp the part of the support circuit (Q) that has passed through the slot (f) of the blades (2) in order to pull it always along the same direction so that the support circuit (Q) can completely pass through the slot (f) defined by the two blades (2). The pushing means (3) comprise a pusher. The pusher comprises a pushing carriage (30) slidably mounted on guides parallel to the axis (X) of the guide groove (D) and movement means (31 ) that move the pushing carriage (30) along the guides.

[0067] For example, the movement means (31 ) comprise a motor (310) with a shaft and transmission means that convert the rotational motion of the shaft of the motor (310) into a sliding movement of the pushing carriage (30).

[0068] With reference to Figs. 5, 5A, 10 and 10A, 10B, 11 , 11 A, the pulling means (4) instead comprise two counter-rotating motorized rollers (40) located behind the blades (2) and defining a space (g) aligned with the slot (f) between the two blades (2). Preferably, the two counter-rotating motorized rollers (40) are knurled rollers to increase the pulling force.

[0069] The counter-rotation of the two counter-rotating motorized rollers (40) allows the two rollers to grasp the support circuit (Q) that passes through the space (g) in order to pull it always in the same forward direction in which the support circuit (Q) advances, so that the support circuit (Q) can completely pass through the slot (f) defined by the two blades (2).

[0070] The motorized rollers (40) are driven in opposite rotation by a motor (M4) connected to the motorized rollers (40) through conventional and known transmission means (9).

[0071] In particular, with reference to Figs. 10, 10A and 10B, said transmission means (9) comprise:

[0072] - a main gear (90) integral with a shaft of the motor (M4);

[0073] - a first upper gear (91 ) meshing with said main gear (90) and fixed to an upper end (41 ) of one of the two motorized rollers (40);

[0074] - a second upper gear (92) meshing with said first upper gear (92) and fixed to an upper end (41 ) of the other roller (40);

[0075] - a first lower gear (93) fixed to a lower end (42) of one of said two rollers;

[0076] - a second lower gear (94) fixed to a lower end (42) of the other roller and meshing with the first lower gear (93). With reference to Figs. 9 and 9A, preferably said component removal station (H2) comprises adjustment means (R) shaped so as to adjust the distance between the two blades (2) as well as the width of the guide groove (D).

[0077] The adjustment means (R) comprise spacers (R1 , R2), of which a first spacer (R1 ) is placed between the two blade-holder supports (20) and a second spacer (R2) is placed between the two strips (D1 ) that define the guide groove (D).

[0078] Between said blade-holder supports (20) and between said strips (D1 ) there are locking means shaped so as to keep the two blade-holder supports (20) and the two strips (D1 ) locked in position once the above-mentioned spacers (R1 , R2) have been applied between them.

[0079] Even though in Figs. 9 and 9A adjustment means (R) are shown consisting of spacers (R1 , R2) manually applicable by a user, in an alternative embodiment of the invention it is possible to provide that the adjustment means (R) are motorized. For example, said motorized adjustment means (R) may comprise a screw-nut system comprising:

[0080] - a screw rotated by a motor and having a first right-hand thread and a second left-hand thread; and

[0081] - a first nut helically coupled with the first thread and integral with a corresponding strip-blade-holder support assembly; and

[0082] - a second nut helically coupled with the second thread and integral with the other strip-blade-holder support assembly.

[0083] Obviously in such case, by rotating the screw in one direction or the other, the two strip-blade-holder support assemblies move farther apart or closer together, and thus the slot between the two blades (2) and the guide groove (D) is widened or narrowed. Returning now to Figs. 10, 10A and 10B, regarding the motorized rollers (40), they are mounted so as to be able to move away from and closer to each other by the order of millimetres, so as to adapt the width (gu) of the space (g) between them according to the thickness of the support circuit (Q) that passes between the two rollers (40).

[0084] Retention means act on the two rollers (40) to constantly hold the two rollers (40) close to each other so that, at rest, the two rollers (40) are in contact with each other. The retention means comprise helical springs (T) that act on the rollers to keep them adjacent to each other. The helical springs (T) are springs positioned externally to the rollers (40) and loaded in compression.

[0085] In particular, the springs (T) are four in number, of which two upper springs (T) act on the upper ends (41 ) of the two rollers (40) and two lower springs (T) act on the lower ends (42) of the two rollers (40).

[0086] Associated with each spring (T) there is an adjustment screw (N) that allows the preload of the spring (T) to be adjusted. Associated with each adjustment screw (N) there also is a gripping knob (N1 ) to allow a user to tighten or loosen the adjustment screw (N) and therefore adjust the preload of the spring (T). It should be noted that the preload of the spring may also be performed through automatic means that act directly on the adjustment screws (N).

[0087] Thus, when a portion of the support circuit (Q) settles between the two motorized rollers (40), said motorized rollers (40) automatically move apart, adapting to the thickness of the support circuit (Q) while still remaining tightly adhered to the surfaces of the support circuit (Q) due to the pushing action of the springs (T).

[0088] The presence of the adjustment means (R) for said blades (2) and for said guide groove (D), and the fact that the rollers (40) may move apart from each other but are constantly subjected to the pushing action of the retention means, makes said component removal station (H2) versatile and suitable for use with printed circuits (Q) of different thicknesses.

[0089] Preferably, protective casings (C) are present at the sides of the guide groove (D) and at the blade supports (20).

[0090] On the surface (P0) and below the blades (2) there is an opening (not visible in the attached figures) intended to be crossed by the components (c1 , c2, c3) removed from the support circuit (Q).

[0091] Below the opening, a chute (SC) is provided that conveys the components (c1 , c2, c3) removed from the printed circuit into a first storage station (Z).

[0092] Downstream of the blades (2), a further opening (W) is provided, intended to be crossed by the printed circuits (Q) that have passed through the blades (2) and from which the aforementioned components (c1 , c2, c3) have been removed. Below the opening (W) there is a second storage station (Z2) for said printed circuits (Q).

[0093] With reference to Figs. 12 and 12A, therefore, in order to cause the aforementioned support circuit (Q) to pass through the slot (f) defined by the two blades (2), it is provided to:

[0094] - position the support circuit (Q) upstream of the two blades (2) with an edge inserted in the guide groove (D) so that the support circuit (Q) is arranged substantially vertically and aligned with the slot (f);

[0095] - push, by means of the aforementioned pushing means (3), the support circuit

[0096] (Q) toward the two blades (2) so that a portion of the support circuit (Q) partially passes through the slot (f) between the two blades (2), thus being positioned downstream of the two blades (2); and

[0097] - pull, by means of the aforementioned pulling means (4), the portion of the support circuit (Q) that has passed through the slot (f) defined by the two blades (2) so that the support circuit (Q) continues to advance along the direction of advancement completely passing through the slot (f).

[0098] More precisely, the aforementioned pushing action is carried out by the aforementioned pusher, while the pulling action downstream of the blades (2) is carried out by the two counter-rotating rollers (40) which are located behind the two blades (2) and between which the support circuit (Q) passes.

[0099] While the support circuit (Q) passes through the slot (f) located between the two blades (2), the components (c1 , c2, c3) are intercepted by the blades (2), thereby detaching them from the support circuit (Q).

[0100] Thus, once the aforementioned component removal step (A2) has been carried out, the result is that:

[0101] - the support circuit (Q) falls into the second storage station (Z2); and

[0102] - the different types of components (c1 , c2, c3) are all deposited in the first storage station (Z).

[0103] The different components (c1 , c2, c3) are then intended to be processed in subsequent stations, known to a person skilled in the art, which allow the components to be crushed and to subsequently separate the elements and powders that constitute such components (c1 , c2, c3).

[0104] Since the various types of components (c1 , c2, c3) are composed of different elements and powders, it is preferable to process each type of component (c1 , c2, c3) separately from the other types of components (c1 , c2, c3) so as to recover more easily the materials that constitute them.

[0105] In this regard, the method according to the invention comprises a final selection and distribution step (A3), shown in Fig. 1 , in which the various components (c1 , c2, c3) are selected by type and distributed into different stations so that the components belonging to a same type may be processed all together separately from the components of the other types.

[0106] For example, if among the pile of components (c1 , c2, c3) there are resistors (c1 ), capacitors (c2) and diodes (c3), in said selection and distribution step (A3) it is provided to place all the resistors (c1 ) in a dedicated storage station, the capacitors (c2) in another storage station, and the diodes (c3) in a further storage station.

[0107] With reference to Fig. 13, the selection and distribution step (A3) is carried out in a dedicated selection and distribution station (H3) comprising:

[0108] - a detection area (Y) in which a component (c1 ; c2; c3) is intended to be positioned,

[0109] - a camera (6) configured so as to detect images (Im) of the detection area (Y); and

[0110] - picking and transporting means (7) configured so as to pick up the component (c1 ; c2; c3) from the detection area (Y) and transport it to a corresponding storage station.

[0111] A control unit (8) of the system is operatively connected to the camera (6) and to the picking and transporting means (7) to receive the images (Im) from the camera (6) and to manage said picking and transporting means (7).

[0112] In particular, the control unit (8) comprises identification means (81 ), comprising for example conventional image recognition software, configured to identify from the image (Im) the type of component (c1 , c2, c3) placed in the detection area (Y) and command means (82) configured to send commands (Cc) to the picking and transporting means (7) according to the type of component identified so that said picking and transporting means (7) pick up the component (c1 , c2, c3) and transport it to the corresponding storage station associated with the type of component. Thus, the selection and distribution step (A3) carried out in the selection and distribution station (H3) provides:

[0113] - placing a component (c1 , c2, c3) on the detection area (Y);

[0114] - detecting, by means of the camera (6), images (Im) of the component placed in the detection area (Y);

[0115] - identifying, by means of the identification means (81 ), the type of component (c1 , c2, c3);

[0116] - picking up the component from the detection area (Y) and transporting it, by means of the picking and transporting means (7), to a storage station associated with that specific type of component.

[0117] In the preferred embodiment of the invention, a vibrating surface (5) is present on the detection area (Y), on which the component (c1 , c2, c3) to be detected and identified is placed.

[0118] The vibrating surface (5) is shaped so as to vibrate so that the component (c1 , c2, c3), solicited by the vibrations of the vibrating surface (5), may move and change its orientation with respect to the camera (6) until it reaches a position such that said identification means (81 ) of the control unit (8) may identify the type of component (c1 , c2, c3).

[0119] Once the type of component (c1 , c2, c3) has been identified, the command means (82) of the control unit (8) send commands to the picking and transporting means (7) so that said picking and transporting means (7) may pick up the component from the detection area (Y) and then transport it to the corresponding storage station.

[0120] Preferably, said picking and transporting means (7) comprise a gripping clamp supported by movement means such as, for example, a robotic arm. Following the above description, it is now obvious how the new method and the corresponding system allow electronic boards (S) to be dismantled solely through mechanical means without the use of chemical or thermal agents.

[0121] Precisely for this reason, the new method is economical and simple to carry out and furthermore requires a lower energy demand compared to that necessary to perform the methods currently available on the market.

[0122] It should finally be noted that there are cases in which the electronic board (S) is devoid of the above-mentioned processor (m).

[0123] In such case, the method according to the invention will not provide carrying out the processor removal step (A1 ) in the processor removal station (H1 ).

[0124] Thus, if the electronic board is without the above-mentioned processor (m), the method according to the invention will provide carrying out only the above- mentioned component removal step (A2) performed in the corresponding component removal station (H2). Numerous variations and detailed modifications may be made to the present embodiment of the invention, within the reach of a person skilled in the art, while still falling within the scope of the invention as expressed in the appended claims.

Claims

CLAIMS1 . Method for removing an electronic circuit board (S); wherein said electronic circuit board (S) comprises a support circuit (Q) and a plurality of electric and / or electronic components (c1 , c2, c3) mounted on the support circuit (Q); said method comprising a step (A2) for the removal of the components of the electronic circuit board (S), wherein said component removal step (A2) provides for removing the components (c1 , c2, c3) from the support circuit (Q); wherein said component removal step (A2) provides for pulling the support circuit (Q) through a slot (f) defined by two blades (2) in such a way that the components (c1 , c2, c3) protruding from the support circuit (Q) are intercepted by the blades (2) and detached from the support circuit (Q).

2. The method according to claim 1 , wherein said electronic board (S) comprises a microprocessor (m) mounted on the support circuit (Q); wherein said method provides for performing a processor removal step (A1 ) prior to the component removal step (A2), wherein said processor removal step (A1 ) provides for removing the processor (m) from the support circuit (Q); wherein said processor removal step (A1 ) provides for making peripheral cuts (t1 , t2, t3, t4) on the support circuit (Q) around the processor (m) in such a manner as to physically separate the processor (m) from the support circuit (Q) and then move the processor (m) away from the support circuit (Q).

3. The method according to claim 1 or 2, comprising a selection and distribution step (A3) after said component removal step (A2); wherein said selection and distribution step (A3) provides for selecting the components (c1 , c2, c3) by type and distributing the different types of components to different storage stations.

4. The method according to claim 2 or 3, wherein said processor removal step (A1 ) is performed in a processor removal station (H1 ) comprising a frame (1 ) with a surface (10) provided with a support (11 ) suitable for housing and supporting the electronic board (S) with the processor (m) facing upwards; wherein said processor removal station (H1 ) further comprises a movable operating head (13) placed above the support (11 ) and comprising a blade (14); wherein said processor removal step (A1 ) provides for the following operating steps: positioning the electronic board (S) on the support (11 ) with the processor (m) facing upwards; and moving the operating head (13) closer to and away from the support (11 ) so that the blade (14) of the operating head (13) peripherally cuts the support circuit (Q) of the electronic board (S) all around the processor (m).

5. The method according to any one of the previous claims, wherein said component removal step (A2) provides for performing the following steps: positioning the support circuit (Q) upstream of the two blades (2) in front of and parallel to the slot (f) defined by the two blades (2); pushing the support circuit (Q) toward the two blades (2) in such a way that a portion of the support circuit (Q) partially passes through the slot (f) between the two blades (2), thus being positioned downstream of the two blades (2); and pulling the portion of the support circuit (Q) that has passed through the slot (f) defined by the two blades (2) so that the support circuit (Q) continues to move along its forward direction, completely passing through the slot (f).

6. The method according to claim 5, wherein said step of positioning the support circuit (Q) upstream of the two blades (2) provides for inserting aperimeter edge of the support circuit (Q) into a guide groove (D) having an axis (X) that passes through the slot (f) defined by the two blades (2); wherein said pushing step of the support circuit (Q) toward the two blades (2) is performed by means of pushing means (3) placed upstream of the blades (2) and suitable for pushing the support circuit (Q) through the slot (f), wherein said pulling step is performed by means of pulling means (4) that grasp the portion of the support circuit (Q) that has passed through the slot (f) of the blades (2) in order to pull it along the same forward direction as the support circuit (Q).

7. The method according to any one of claims 3 to 6, wherein said selection and distribution step (A3) provides for the following operating steps: positioning a component (c1 , c2, c3) in a detection area (Y); detecting images (Im) of the component (c1 , c2, c3) positioned in the detection area (Y) by means of a camera (6); identifying the type of component (c1 , c2, c3) by means of identification means (81 ); picking up the component (c1 , c2, c3) from the detection area (Y) and transporting it to a storage station associated with the specific type of component by means of picking and transporting means (7).

8. System for removing an electronic board (S); wherein said electronic board (S) comprises a support circuit (Q) and a plurality of electric and / or electronic components (c1 , c2, c3) mounted on the support circuit (Q); wherein said system comprises a component removal station (H2) configured so as to remove the components (c1 , c2, c3) from the support circuit (Q); wherein said component removal station (H2) comprises:two blades (2) defining a slot (f) suitable for being crossed by the support circuit (Q); a guide groove (D) extending along an axis (X) passing through the slot (f) defined by the two blades (2); wherein an edge of the support circuit (Q) is suitable for being inserted into said guide groove (D); and pulling means (3, 4) configured in such a way as to pull the support circuit (Q) along the guide groove (D) in such a way that the support circuit (Q) completely passes through the slot (f) defined by the two blades (2) thereby favoring the separation of the components (c1 , c2, c3) from the support circuit (Q).

9. The system according to claim 8, wherein said electronic board (S) comprises at least one processor (m) mounted on the support circuit (Q); wherein said system comprises a processor removal station (H1 ) located upstream of the component removal station (H2) and configured so as to remove the processor (m) from the support circuit (Q); wherein said processor removal station (H1 ) comprises: a frame (1 ) with a surface (10) provided with a support (11 ) suitable for housing and supporting the circuit board (S) with the processor (m) facing upwards; and- a movable operating head (13) placed above the support (11 ); wherein said operating head (13) comprises a blade (14) suitable for interfering with the support circuit (Q) of the electronic board (S) to generate perimeter cuts (t1 , t2, t3, t4) all around the processor (m).

10. The system according to claim 9, wherein said processor removal station (H1 ) comprises a column (12) protruding superiorly from the surface (10) and whereon the operating head (13) is mounted in such a way to move up and down.11 . The system according to any one of the preceding claims, wherein said pulling means (3, 4) of the component removal station (H2) comprise:- pushing means (3) positioned upstream of the blades (2) and suitable for pushing the support circuit (Q) through the slot (f) defined by the two blades (2) until at least a portion of the support circuit (Q) passes beyond the blades (2); and- pulling means (4) positioned downstream of the blades (2) and configured in such a way as to grasp the portion of the support circuit (Q) that has passed through the slot (f) of the blades (2) to pull it along the same forward direction to let the support circuit (Q) completely pass through the slot (f) defined by the two blades (2).

12. The system according to claim 11 , wherein said pushing means (3) comprise a pusher (3); wherein the pusher comprises a pushing carriage (30) slidingly mounted on guides parallel to the axis (X) of the guide groove (D) and driving means (31 ) that move the pushing carriage (30) along the guides.

13. The system according to claim 12, wherein said pulling means (4) comprise two counter-rotating motorized rollers (40) placed behind the blades (2) and defining a space (g) aligned with the slot (f) defined by the two blades (2).

14. The system according to claim 13, wherein said component removal station (H2) comprises adjustment means (R) configured so as to adjust the distance between the two blades (2) as well as the width of the guide groove (D); wherein said motorized rollers (40) are mounted so as to move away from and close to each other; wherein said component removal station (H2) comprises retention means acting on the two rollers (40) to constantly retain the two rollers close to each other.

15. The system according to any one of claims 8 to 14, comprising a selectionand distribution station (H3) downstream of said component removal station (H2), said selection and distribution station (H3) comprising: a detection area (Y) wherein a component (c1 ; c2; c3) is suitable for being positioned, - a camera (6) configured to detect images (Im) of the detection area (Y); and picking and transporting means (7) configured in such a way as to pick up the component from the detection area (Y) and transport it to a designated storage station; wherein said system comprises a control unit (8) operatively connected to the camera (6) and to the picking and transporting means (7) to receive the images (Im) from the camera (6) and control said picking and transporting means (7); wherein said control unit (8) comprises identification means (81 ) configured to identify the type of component (c1 , c2, c3) positioned in the detection area (Y) from the image (Im) and control means (82) configured to send commands (Cc) to the picking and transporting means (7) according to the type of component so that said picking and transporting means (7) can pick up and transport the component (c1 , c2, c3) to the corresponding storage station associated with the type of component.

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