Heat dissipation module and electronic equipment

Abstract

The invention provides a heat dissipation module and electronic equipment. A heat dissipation module comprises a first heat conduction assembly, a second heat conduction assembly and a third heat conduction assembly. The first heat conduction assembly is in heat conduction connection with the heating assembly, the second heat conduction assembly is in heat conduction connection with the first heat conduction assembly, and the third heat conduction assembly is in heat conduction connection with the second heat conduction assembly. The heat dissipation module comprises a fourth heat conduction assembly, the fourth heat conduction assembly is in heat conduction connection with at least one of the first heat conduction assembly, the second heat conduction assembly and the third heat conduction assembly and conducts heat with the connected heat conduction assembly in a latent heat exchange mode, and the fourth heat conduction assembly is arranged inside or outside the connected heat conduction assembly. According to the heat dissipation module, latent heat is absorbed through the fourth heat conduction assembly, heat released after the heating assembly enters short-time turbo power consumption is absorbed, and the sustaining capacity of the short-time turbo power consumption of the heating assembly is improved.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a heat dissipation module and an electronic device. Background Technology

[0002] With the continuous development of laptop manufacturing technology, thinner and lighter laptops have become the mainstream market demand. However, users' demands for laptop performance are also increasing, especially for software response time, which is a crucial indicator of laptop performance in thin and light laptops. There is a close synergy between software response time limitations and the short-term turbo boost power consumption (PL2) of the central processing unit (CPU), making the requirements for CPU PL2 very high. To improve the CPU PL2 capability of laptops, traditional designs enhance the laptop's heat dissipation capacity to improve the CPU's sustained PL2 capability. For example, improving heat dissipation can be achieved by increasing the weight of materials such as heat pipes and copper blocks, using sensible heat (sensible heat refers to heat absorbed or released during temperature changes without chemical or phase changes) to increase the CPU's PL2 capability. However, this design approach offers limited improvement in PL2 capability, and the added weight of heat pipes and copper blocks contradicts the original design goals of thin and light laptops, while also increasing production costs. Summary of the Invention

[0003] This disclosure provides a heat dissipation module and an electronic device to at least solve one of the technical problems existing in the prior art.

[0004] In a first aspect, this application provides a heat dissipation module, including a first heat conduction component, a second heat conduction component, and a third heat conduction component; the first heat conduction component is thermally connected to a heat-generating component, the second heat conduction component is thermally connected to the first heat conduction component, and the third heat conduction component is thermally connected to the second heat conduction component, the third heat conduction component being used for heat conduction with the outside environment; the heat dissipation module further includes a fourth heat conduction component, the fourth heat conduction component being thermally connected to at least one of the first, second, and third heat conduction components, and being used for heat conduction with the heat conduction component connected to it via latent heat exchange, and the fourth heat conduction component being disposed inside or outside the connected heat conduction component.

[0005] In one embodiment, the first heat conduction component is a heat-conducting block, the second heat conduction component is a heat pipe, and the third heat conduction component is a heat sink fin or a combination of a heat sink fin and a fan.

[0006] In one embodiment, the heat pipe has a first cavity, and the fourth heat conduction component is disposed within the first cavity.

[0007] In one embodiment, the heat dissipation fins include an air outlet area and a non-air outlet area, and the grid of the heat dissipation fins located in the air outlet area is used to communicate with the fan; the grid of the heat dissipation fins located in the non-air outlet area has a second cavity, and the fourth heat conduction component is disposed in the second cavity.

[0008] In one embodiment, the fourth heat conduction component is attached to the outer surface of the heat conduction block and / or the outer surface of the heat pipe.

[0009] In one embodiment, the fourth heat-conducting component includes a phase change material.

[0010] In one possible embodiment, the phase change material is obtained by the following method: The temperature rise curve of the first heat conduction component was measured after the heat-generating component entered the short-term turbo frequency power consumption. The total heat required to be absorbed by the phase change material is obtained based on the temperature rise curve. Based on the fact that the total heat is the sum of the total sensible heat and the total latent heat that the phase change material needs to absorb, the functional relationship between the specific latent heat, density and specific heat capacity of the phase change material is obtained; Based on the functional relationship between the latent heat, density, and specific heat capacity, a phase change material that satisfies the functional relationship is obtained.

[0011] In one embodiment, the total heat required to be absorbed by the phase change material is the difference between the heat released and the heat lost; The heat release refers to the total heat released by the heating component under short-term turbo frequency power consumption from the time the temperature of the heating component first reaches the theoretical phase change temperature until the temperature of the heating component drops back to the theoretical phase change temperature. The heat loss refers to the total heat lost during the process of heat transfer from the heating component to the phase change material within the same time interval.

[0012] In one embodiment, the temperature rise curve of the first heat conduction component is based on the measurement of the temperature rise curve of the first heat conduction component after the heat-generating component enters a short-term turbo frequency power consumption, under the premise of no phase change material.

[0013] Secondly, this application provides an electronic device, including a heat-generating component, and also includes a heat dissipation module as described in any of the above-described possible embodiments.

[0014] Compared with the prior art, the advantages of this application are: 1) This application utilizes a fourth heat conduction component to conduct heat to a heat conduction component connected to it via latent heat exchange. Latent heat refers to the heat absorbed or released by a substance during a phase transition from one phase to another under constant temperature conditions. Therefore, by utilizing this characteristic, when the heat-generating component enters short-term turbo frequency power consumption, in addition to heat conduction and heat dissipation through sensible heat exchange between the first, second, and third heat conduction components, the fourth heat conduction component also absorbs latent heat to absorb the large amount of heat released by the heat-generating component after entering short-term turbo frequency power consumption, delaying the time for the temperature of the heat-generating component to rise to its threshold, thereby improving the short-term turbo frequency power consumption sustainability of the heat-generating component.

[0015] 2) In one embodiment of this application, the first heat conduction component is a heat-conducting block, the second heat conduction component is a heat pipe, the third heat conduction component is a heat sink fin, or a combination of a heat sink fin and a fan, the fourth heat conduction component includes a phase change material, and the heat-generating component is a chip. This embodiment of the application utilizes the characteristic that the phase change material absorbs heat but the phase change temperature remains unchanged during the phase change process, and applies it to the heat dissipation module of this application. The phase change material is thermally connected to at least one of the heat-conducting block, heat pipe, and heat sink fin. After the chip enters the short-term turbo power consumption period, it can help absorb the excess heat that the heat sink fin and heat sink fan cannot dissipate during the short-term turbo power consumption period, delay the time for the chip temperature to rise to the chip threshold, and thus effectively improve the chip's short-term turbo power consumption sustainability.

[0016] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0017] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which: In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0018] Figure 1 This diagram illustrates a first structural schematic of a phase change material applied to a heat dissipation module according to an embodiment of the present disclosure. Figure 2 A schematic diagram of a second structure of phase change material applied to a heat dissipation module according to an embodiment of the present disclosure is shown; Figure 3 This diagram illustrates a third structural schematic of a phase change material applied to a heat dissipation module according to an embodiment of the present disclosure. Figure 4A schematic diagram of the structure of the first cavity of the heat pipe in an embodiment of the present disclosure is shown; Figure 5 A schematic diagram of the structure of the second cavity in which the phase change material is embedded in the heat dissipation fin grid according to an embodiment of the present disclosure is shown; Figure 6 It shows Figure 5 A magnified view of a portion of the image; Figure 7 The temperature rise curve of the heat-conducting block is shown.

[0019] The numbers in the diagram are explained as follows: 1-heat dissipation module, 11-heat conduction block, 12-heat pipe, 13-heat dissipation fins, 14-thin film layer, 15-phase change material, 16-non-air outlet area, 17-air outlet area, 121-first cavity, 131-second cavity. Detailed Implementation

[0020] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0021] Taking a laptop as an example, the heatsink (such as a copper block) in the laptop is thermally connected to the surface of the chip. The heatsink acts as a heat transfer medium, conveying the heat generated during chip operation to the heat pipe. The heat pipe then transfers this heat to the cooling fins, which, in conjunction with a connected cooling fan, conduct the heat to the outside, achieving heat dissipation. Currently, related technologies enhance the chip's short-term turbo boost power consumption (PL2) by improving the laptop's heat dissipation capabilities. For example, improving heat dissipation can be achieved by increasing the weight of the heat pipe or heatsink, using sensible heat (sensible heat refers to heat absorbed or released during temperature changes without chemical or phase changes) to improve the chip's short-term turbo boost power consumption. However, this method has limited ability to improve short-term turbo boost power consumption, and when the heat dissipation module is applied to thin and light laptops, the increased weight of the heat pipe and heatsink contradicts the thin and light design philosophy. Therefore, this application improves the chip's short-term turbo boost power consumption by incorporating a phase change material into the heat dissipation module, utilizing the latent heat of the phase change material. The so-called latent heat (short for latent heat of phase change) refers to the heat absorbed or released by a substance during a phase change process from one phase to another under constant temperature conditions.

[0022] Firstly, such as Figure 1-6As shown, this application provides a heat dissipation module 1, including a first heat conduction component, a second heat conduction component, and a third heat conduction component; the first heat conduction component is thermally connected to a heat-generating component, the second heat conduction component is thermally connected to the first heat conduction component, and the third heat conduction component is thermally connected to the second heat conduction component, and the third heat conduction component is used for heat conduction with the outside; the heat dissipation module also includes a fourth heat conduction component, which is thermally connected to at least one of the first, second, and third heat conduction components, and is used for heat conduction with the heat conduction component connected to it through latent heat exchange, and the fourth heat conduction component is disposed inside or outside the connected heat conduction component.

[0023] For example, taking the thermal conduction connection between the first heat conduction component and the heating component as an example, the so-called thermal conduction connection refers to the connection method that enables thermal conduction between the heating component and the first heat conduction component, including but not limited to surface attachment, wrapping, full coverage / partial coverage, etc.

[0024] This application utilizes a fourth heat conduction component to conduct heat to a heat conduction component connected to it via latent heat exchange. Latent heat refers to the heat absorbed or released by a substance during a phase transition from one phase to another under constant temperature conditions. The first, second, and third heat conduction components conduct heat through sensible heat exchange. Therefore, in addition to using sensible heat exchange to conduct heat dissipation between the third heat conduction component and the outside environment, the heat dissipation module of this application also utilizes latent heat characteristics. After the heat-generating component enters a short-term turbo frequency power consumption period, the fourth heat conduction component helps absorb the excess heat that the third heat conduction component cannot dissipate during the short-term turbo frequency power consumption period, delaying the time for the temperature of the heat-generating component to rise to its threshold, thereby improving the short-term turbo frequency power consumption sustainability of the heat-generating component.

[0025] Latent heat exchange refers to the process where a substance undergoes a phase change while maintaining a constant temperature during heat exchange. Sensible heat exchange refers to the process where the temperature of a substance increases or decreases during heat exchange.

[0026] In one embodiment, the first heat conduction component is a heat-conducting block 11, the second heat conduction component is a heat pipe 12, the third heat conduction component is a heat sink 13 or a combination of a heat sink 13 and a cooling fan (hereinafter referred to as a fan), the fourth heat conduction component includes, but is not limited to, a phase change material 15, and the heat-generating component is a chip.

[0027] For example, the first heat conduction component and the second heat conduction component can be two independent components or they can form a single independent component, such as an integrally molded structure. However, whether they are two independent components or a single independent component, they should fall within the protection scope of this application, as long as they are used for heat conduction between the heating component and the third heat conduction component, serving as their heat conduction medium or channel.

[0028] In one embodiment, the first and second heat conduction components constitute a single, integrally molded component. This single component is a heat spreader. A first end of the heat spreader is thermally connected to a heat-generating component (including, but not limited to, using thermal grease, hot glue, or soldering), and a second end of the heat spreader is thermally connected to a third heat conduction component. The third heat conduction component is a heat sink fin, or a combination of a heat sink fin and a fan. A fourth heat conduction component includes, but is not limited to, a phase change material, and the heat-generating component is a chip. The phase change material is thermally connected to at least one of the heat spreader and heat sink fins, and is used for heat conduction through latent heat exchange with the heat spreader and / or heat sink fins connected to it. The phase change material is disposed inside or outside the heat spreader and / or heat sink fins.

[0029] In one embodiment, a detailed description is given using the following example: the first heat conduction component is a heat-conducting block 11, the second heat conduction component is a heat pipe 12, the third heat conduction component is a combination of heat dissipation fins 13 and a cooling fan, the fourth heat conduction component uses a phase change material 15, and the heat-generating component is a chip. The heat-conducting block 11 is used to cover the upper surface of the chip. The upper surface of the heat-conducting block 11 is thermally connected to the first end of the heat pipe 12, and the second end of the heat pipe 12 is thermally connected to the heat sink 13. The heat pipe 12 is used to conduct the heat released by the chip to the heat sink 13. The heat sink 13 is used to cooperate with the cooling fan to conduct the heat to the outside. The phase change material 15 is thermally connected to at least one of the heat-conducting block 11, the heat pipe 12 and the heat sink 13. It is used to help absorb the excess heat that the heat sink 15 and the cooling fan cannot dissipate during the short-term turbo power consumption period after the chip enters the short-term turbo power consumption period.

[0030] For example, the heat-conducting block 11 fully covers the upper surface of the chip, conducting the heat released by the chip to the heat pipe 12. This chip includes, but is not limited to, a CPU chip, and the heat-conducting block 11 includes, but is not limited to, copper or aluminum blocks. The materials of the heat pipe 12 and the heat dissipation fins 13 include, but are not limited to, copper and aluminum.

[0031] The heat absorption process of the phase change material 15 includes the following stages: First stage: absorption of sensible heat before phase change, that is, the phase change material absorbs external heat before phase change, and the temperature continues to rise during the heat absorption process until the material temperature reaches the theoretical phase change temperature. The heat absorbed in this first stage is sensible heat. Second stage: after the material temperature reaches the theoretical phase change temperature, if it continues to absorb heat, the material will undergo a physical phase change. During this process, the temperature remains constant at the phase change temperature. The heat absorbed in this second stage is latent heat. Therefore, this application utilizes the characteristic of the phase change material to absorb only heat but maintain a constant phase change temperature during the phase change process in the second stage. It applies this characteristic to the heat dissipation module 1 of this application and connects the phase change material 15 to at least one of the heat conduction block 11, heat pipe 12, and heat dissipation fins 13. This can help absorb excess heat that the heat dissipation fins and cooling fan cannot dissipate during the short-term turbo frequency power consumption period after the chip enters the short-term turbo frequency power consumption period, delaying the time for the chip temperature to rise to the chip threshold, thereby effectively improving the chip's short-term turbo frequency power consumption sustainability.

[0032] In one possible implementation, such as Figure 4 As shown, the heat pipe 12 has a sealed first cavity 121, and the phase change material is built into the first cavity 121.

[0033] For example, such as Figure 4 As shown, the Figure 4 This is a cross-sectional view of the heat pipe 12 after the phase change material 15 is installed in the first cavity 121. The heat pipe 12 has a sealed first cavity 121, and the phase change material 15 is installed in the first cavity 121 of the heat pipe 12.

[0034] Regardless of whether the phase change material is solid or liquid before and after the phase change, the phase change material 15 can be built into the first cavity 121 of the heat pipe 12. After the chip enters the short-term turbo frequency power consumption period, it can exchange latent heat with the heat pipe 12 to help absorb the excess heat that the heat sink fins and heat sink fan cannot dissipate during the short-term turbo frequency power consumption period, while also preventing the phase change material from leaking.

[0035] In one possible implementation, such as Figure 5-6 As shown, the heat dissipation fins 13 include an exhaust area 17 and a non-exhaust area 16. The grid of the heat dissipation fins located in the exhaust area 17 is used to communicate with the cooling fan. The grid of the heat dissipation fins located in the non-exhaust area 16 has a sealed second cavity 131. The phase change material 15 is built into the second cavity 131.

[0036] like Figure 5-6 As shown, Figure 5 This is a schematic diagram of a heat dissipation fin grid with a built-in phase change material. Figure 6 for Figure 5A partially enlarged schematic diagram. For ease of display, the outer surface of the grid portion has been removed to show the phase change material 15 contained in the internal second cavity 131. Figure 5 In this design, the grids of the heat dissipation fins located in the non-airflow area 16 are generally positioned at both ends of the heat dissipation fins. The grids of the heat dissipation fins located in the airflow area 17 have channels for airflow, allowing the cooling fan to dissipate heat from the heat dissipation fins to the outside. The length of the heat dissipation fins is greater than the length of the cooling fan, allowing the heat dissipation fins to be divided into two areas: the airflow area 17 and the non-airflow area 16.

[0037] Regardless of whether the phase change material is solid or liquid before and after the phase change, the phase change material 15 can be embedded within the second cavity 131 of the grid. This allows it to exchange latent heat with the heat sink fins after the chip enters a short-term turbo frequency power consumption period. This helps absorb excess heat that the heat sink fins and cooling fan cannot dissipate during the short-term turbo frequency power consumption period, while also preventing leakage of the phase change material. Therefore, in this application, it is preferable to embed the phase change material within the first cavity 121 of the heat pipe 12 and / or the second cavity 131 of the heat sink fin grid. This method does not occupy additional internal space in the electronic device and also prevents leakage, thus avoiding affecting the normal operation of the electronic device.

[0038] In one embodiment, the phase change material is attached to the outer surface of the heat-conducting block 11 and / or the outer surface of the heat pipe 12.

[0039] For example, when the phase change material is in a solid state both before and after the phase change, it can be attached to the upper surface of the heat-conducting block 11 or the outer surface of the heat pipe 12 in an external manner, which is simple and convenient.

[0040] For example, taking a CPU chip as an example, to directly enhance the short-term turbo boost power consumption capability of the CPU chip, the phase change material should be placed as close as possible to the heat source of the CPU chip, such as on the heatsink and heat pipe. Since the PL2 threshold of a typical CPU chip is below 100℃, phase change materials are mostly paraffin wax and esters, which have low thermal conductivity. Therefore, in the design of heat pipe and heat dissipation fin structures, materials with high thermal conductivity, such as high-purity copper or industrial pure aluminum, can be considered for reinforcement.

[0041] For example, when the phase change material is in a solid state before and after the phase change, the phase change material can also be first constructed as a solid-solid phase change material, and then the solid-solid phase change material can be attached to the upper surface of the heat-conducting block 11 or the outer surface of the heat pipe 12.

[0042] Solid-solid phase change materials (SCLs) are phase change materials that achieve a phase transition effect through the conversion between different crystal forms. During the phase transition, they remain in a solid state. Specifically, when the temperature exceeds the phase transition temperature of the SCL, a phase transition reaction occurs, and the material remains in a solid state while the temperature remains constant. In SCLs, the phase change material is encapsulated through molecular-level confinement or composite carrier shaping. The preparation of SCLs can be achieved using existing known technologies, which will not be described in detail here.

[0043] Since solid-solid phase change materials remain macroscopically solid throughout the phase change process, their core mechanism is the internal restructuring of the crystal structure (lattice), rather than a change in physical state (such as from solid to liquid). Therefore, when a phase change material remains macroscopically solid throughout the phase change process, it can be fabricated using existing known technologies. The solid-solid phase change material is then attached to the upper surface of the heat-conducting block 11 and positioned on both sides of the heat pipe 12; or it can be attached to the lower surface of one end of the heat pipe 12, away from the heat-conducting block 11; or it can be attached to the upper surface of the heat pipe 12 above the heat dissipation fins.

[0044] For example, when the phase change material is in a liquid state before or after the phase change, the phase change material can be first constructed into a microcapsule phase change material, which is then attached to the upper surface of the heat-conducting block 11 or the outer surface of the heat pipe 12.

[0045] When the phase change material is in a liquid state before or after the phase change, it can be placed outside the heat-conducting block or heat pipe without the need for a metal framework such as a heat pipe or heat sink fins. This requires first constructing the phase change material into a microcapsule, and then attaching the microcapsule to the upper surface of the heat-conducting block 11 or the outer surface of the heat pipe 12.

[0046] Of course, it is also possible that the phase change material 15 is first constructed as a microcapsule phase change material, and then the microcapsule phase change material is embedded in the first cavity 121 of the heat pipe 12, or the microcapsule phase change material is embedded in the second cavity 131 of the heat dissipation fin 13 grid in the non-air outlet area 16.

[0047] Microencapsulated phase change materials (PCCs) are micro-core-shell structured composite materials formed by encapsulating solid or liquid PCC materials (core materials) within organic, inorganic, or metallic wall materials using microencapsulation technology. In other words, PCCs are micro-core-shell structures formed by encapsulating core materials within wall materials, with the core material being a PCC material and the wall material being an organic or inorganic polymer. The preparation of PCCs can be achieved using existing, well-known technologies, which will not be described in detail here.

[0048] For example, in this application, graphite and resin can be used as the composite wall material, and phase change material as the core material, to fabricate microcapsule phase change material using existing known technologies. The microcapsule phase change material is then dispersed in UV-curable resin (ultraviolet-curable photosensitive resin) and sprayed or scraped onto the upper surface of the heatsink 11 and / or the outer surface of the heat pipe 12. After curing, a thin film layer containing the microcapsule phase change material is formed. This thin film layer can exchange latent heat with the heatsink 11 and / or heat pipe 12 after the chip enters short-term turbo frequency power consumption, helping to absorb excess heat that the heat sink fins and cooling fan cannot dissipate during the short-term turbo frequency power consumption period, effectively delaying the time it takes for the chip temperature to rise to the chip threshold, thereby improving the chip's short-term turbo frequency power consumption sustainability. Figure 1 As shown, the thin film layer 14 containing microcapsule phase change material, formed after curing, is attached to the upper surface of the heat-conducting block 11 and positioned on both sides of the heat pipe 12. Alternatively, as... Figure 2 As shown, the thin film layer 14 is attached to the lower surface of one end of the heat pipe 12 and is disposed away from the heat-conducting block 11. Alternatively, as... Figure 3 As shown, the thin film layer 14 is attached to the upper surface of the heat pipe 12 above the heat dissipation fins.

[0049] For example, phase change materials such as paraffin wax, sodium acetate trihydrate, magnesium nitrate-lithium nitrate hexahydrate mixture, and indium bismuth-tin alloy can be used. These materials undergo a phase change process, transitioning from solid to liquid. Therefore, when placed on the outer surface of a heat pipe or heat-conducting block, to effectively prevent leakage and support the phase change material during the transition, it is necessary to first shape it with a sizing material to create a solid-liquid shaped phase change material. Sizing materials include, but are not limited to, polyethylene, polypropylene, and polyvinyl chloride. Taking paraffin wax as the phase change material and polyethylene as the sizing material as an example, paraffin wax and polyethylene are blended and melted at a temperature above their melting points, then cooled. Polyethylene solidifies before paraffin wax, and the still-liquid paraffin wax is bound within the spatial network structure formed by the polyethylene, thus forming a paraffin-high-density polyethylene composite material. Because polyethylene has a high degree of crystallinity, even if the paraffin in the paraffin-high-density polyethylene composite material has melted, as long as the operating temperature does not exceed the softening point of polyethylene, the supporting effect of polyethylene is sufficient to maintain the overall shape of the material. Furthermore, the spatial network formed by polyethylene encapsulates the internally dispersed paraffin, preventing it from seeping out in its liquid state. This paraffin-high-density polyethylene composite material can also be referenced... Figure 1-3 As shown, it is attached to the upper surface of the heat-conducting block 11, or to the lower surface of the end of the heat pipe 12 away from the heat-conducting block, or to the upper surface of the heat pipe 12 above the heat dissipation fins.

[0050] In one possible embodiment, the phase change material of this application is obtained by the following method: Step 1), measure the temperature rise curve of the heatsink after the chip enters short-term turbo boost power consumption; Step 2), based on the temperature rise curve, obtain the total heat Q required for the phase change material to absorb; Step 3), based on the fact that the total heat Q is the sum of the total sensible heat and the total latent heat that the phase change material needs to absorb, obtain the functional relationship between the specific latent heat, density and specific heat capacity of the phase change material; Step 4) Based on the functional relationship between latent heat, density, and specific heat capacity, a phase change material that satisfies this functional relationship is obtained.

[0051] For example, in step 1), the temperature rise curve of the heat-conducting block 11 should be obtained based on the premise of no phase change material. For instance, taking a copper block as the heat-conducting block and a CPU chip as the chip, the temperature rise curve of the copper block in the heat dissipation module without phase change material is measured several seconds after the CPU chip enters PL2. Figure 7 As shown, this figure is a temperature rise curve of the copper block after the CPU chip enters PL2. Figure 7 The Tpeak and T0 values ​​can be further obtained, where Tpeak is the highest temperature and T0 is the stable temperature of the thermal design power.

[0052] For example, in step 2), the total heat Q that the phase change material needs to absorb is the difference between the released heat and the lost heat. The released heat refers to the total heat released by the chip under short-term turbo frequency power consumption from the time interval from when the chip temperature first reaches the theoretical phase change temperature to when the chip temperature drops back to the theoretical phase change temperature. The lost heat refers to the total heat lost during the process of heat transfer from the chip to the phase change material within the same time interval.

[0053] The core sub-period within this short-term turbo boost power consumption period is the time interval from when the chip temperature first reaches the theoretical phase transition temperature until it drops back to that temperature. Specifically, after the chip enters short-term turbo boost power consumption, its temperature gradually rises to the theoretical phase transition temperature of the phase change material. At this point, the phase change material initiates its phase transition process and begins to absorb latent heat, efficiently absorbing excess heat that the cooling fan and heat sink fins cannot dissipate in time. As the phase change material continues to absorb latent heat, the chip temperature is gradually controlled and drops to the theoretical phase transition temperature, at which point the phase transition heat absorption process of the phase change material is essentially complete. When the chip temperature drops below the theoretical phase transition temperature, the phase transition process of the phase change material stops, and it only absorbs sensible heat to assist in heat dissipation (the amount of sensible heat absorbed is much lower than the latent heat, and the heat absorption capacity weakens). At this point, the heat dissipation capacity of the cooling fan and heat sink fins can match the current heat release of the chip, and the heat dissipation task is dominated by the cooling fan and heat sink fins. Therefore, by incorporating phase change materials into the heat dissipation module of this application, the time it takes for the chip temperature to rise to the threshold can be effectively delayed, providing a longer stable window period for the chip to maintain short-term turbo power consumption PL2, thereby improving the chip's short-term turbo power consumption sustainability and operational stability.

[0054] Specifically, taking the phase change material embedded in the first cavity 121 of the heat pipe 12 or the second cavity 131 of the heat dissipation fin grid, and the chip as a CPU chip as an example, the following is a detailed explanation: In step 2), the total heat Q required to be absorbed by the phase change material is obtained based on the temperature rise curve using formula (1): The calculation yields the following: the lower limit of integration t=0 represents the moment when the CPU chip temperature first reaches the theoretical phase transition temperature; the upper limit of integration t represents the total time it takes for the CPU chip temperature to drop to the theoretical phase transition temperature; P(t) represents the power consumption of the CPU chip's short-term turbo boost power PL2; T(t) represents the temperature of the target structure where the phase change material is located at a certain moment; and Rth represents the sum of thermal resistances along the heat conduction path from the CPU chip to the target structure where the phase change material is located.

[0055] When the phase change material 15 is embedded in the first cavity 121 of the heat pipe 12, Rth includes the sum of the thermal resistances along the heat conduction path from the CPU chip to the heat pipe. Furthermore, when the phase change material is embedded in the first cavity 121 of the heat pipe 12, Rth includes at least the sum of the contact thermal resistance between the CPU chip and the heat-conducting block 11, the thermal resistance of the heat-conducting block 11, the interfacial thermal resistance between the heat-conducting block 11 and the heat pipe 12, and the thermal resistance of the heat pipe 12.

[0056] When the phase change material 15 is embedded in the second cavity 131 of the heat sink fin 13 grid, Rth includes the sum of the thermal resistances along the heat conduction path from the CPU chip to the heat sink fin. Furthermore, when the phase change material 15 is embedded in the second cavity 131, Rth includes at least the sum of the contact thermal resistance between the CPU chip and the heat-conducting block 11, the thermal resistance of the heat-conducting block 11, the interface thermal resistance between the heat-conducting block 11 and the heat pipe 12, the thermal resistance of the heat pipe 12, the contact thermal resistance between the heat pipe 12 and the heat sink fin 13, and the thermal resistance of the heat sink fin 13.

[0057] The aforementioned phase change material 15 can be incorporated into the first cavity 121 of the heat pipe or the second cavity 131 of the heat sink fin grid, with the heat pipe or heat sink fins acting as a metal framework to constrain the phase change material. When the chip enters short-term turbo power consumption PL2 and generates a large amount of heat, in addition to cooling the heat on the heat sink fins and heat pipes through the cooling fan, the phase change material embedded in the heat pipes and heat sink fins can also absorb some latent heat through phase change, assisting in absorbing the excess heat that the heat sink fins and cooling fan cannot dissipate during the short-term turbo power consumption period. This allows for efficient absorption of the heat released by the chip, delaying the time it takes for the chip temperature to rise to the chip threshold, thereby effectively improving the chip's short-term turbo power consumption PL2 capability.

[0058] For example, in step 3), based on the fact that the total heat Q is equal to the sum of the total sensible heat and the total latent heat that the phase change material needs to absorb, the functional relationship between specific latent heat, density, and specific heat capacity is obtained. Specifically: The total heat Q can be divided into two parts Q 显 and Q 潜 Q 显 Q represents the total sensible heat absorbed by the phase change material. 显 =m×Cp×(Tx-T0), Q 潜 Total latent heat absorbed by phase change materials: Q 潜 =m×ΔH. Therefore, the total heat Q = Q. 显 +Q 潜 =m×Cp×(Tx-T0)+m×ΔH, thus obtaining formula (2): ΔH =[Q / (ρ×V0)]-Cp×(Tx-T0); Where m is the mass of the phase change material, ΔH represents the specific latent heat of the phase change material, ρ represents the density of the phase change material, V0 represents the volume, and its constraint condition satisfies that it does not exceed the maximum volume of the phase change material during the phase change process allowed by the target structural component, Cp represents the specific heat capacity of the phase change material before the phase change occurs, Tx is the phase change temperature selection point of the phase change material, and T0 is the stable temperature of the thermal design power consumption.

[0059] In step 3), when the target structural component containing the phase change material is determined, the V0 value can be adaptively adjusted to satisfy the functional relationship between the latent heat ΔH, density ρ, and specific heat capacity Cp when selecting a suitable phase change material.

[0060] The boundary condition for the phase change temperature selection point Tx of the phase change material is that it is greater than the steady-state temperature T0 of the thermal design power consumption and less than the highest temperature value Tpeak on the temperature rise curve.

[0061] The phase transition temperature Tx of a phase change material can be predetermined based on empirical values, such as Tx = T0 + 2. The boundary conditions for Tx must satisfy the condition of being greater than the stable temperature T0 of the thermal design power and less than the highest temperature Tpeak on the temperature rise curve, while also ensuring that it is less than the PL2 threshold of the chip (for example, the PL2 threshold of a CPU chip is 100℃).

[0062] For example, phase change materials include one of the following: paraffin wax, hydrated salts, metal alloys, and organic polymers.

[0063] Among them, the density ρ of paraffin is 800~912 kg / m³. 3 Its specific latent heat ΔH is 150~250kJ / kg, and its phase transition temperature range is 20~80℃.

[0064] The density ρ of this hydrated salt is 1400~1600 kg / m³. 3 Its specific latent heat ΔH is 200~300kJ / kg, and its phase transition temperature range is 30~90℃.

[0065] The density ρ of this metal alloy is 6000~8000 kg / m³. 3 The specific latent heat ΔH is 50~100kJ / kg, and the phase transition temperature range is 50~100℃.

[0066] The density ρ of this organic polymer is 900~1100 kg / m³. 3 The specific latent heat ΔH is 100~200kJ / kg, and the phase transition temperature range is 0~100℃.

[0067] For example, when applying phase change materials to the heat dissipation module of a laptop computer, an adaptive selection of phase change materials can be made according to the phase change materials shown in Table 1 below.

[0068] Table 1 Parameters of different types of phase change materials

[0069] For example, when the phase change material is externally placed on a heat pipe or heat dissipation fin (i.e., the phase change material is constructed as a microcapsule phase change material, which is attached to the upper surface of the heat-conducting block or the outer surface of the heat pipe; or the phase change material is constructed as a solid-solid phase change material, which is attached to the upper surface of the heat-conducting block or the outer surface of the heat pipe), the volume V0 in the above formula (2) can be determined according to the actual system design requirements of the electronic device. For example, when the phase change material is constructed as a microcapsule phase change material or a solid-solid phase change material and placed outside the heat-conducting block, heat pipe, or heat dissipation fin, V0 can be determined according to the actual system design requirements of the laptop computer.

[0070] Taking the microcapsule phase change material as an example, Rth in the above formula (1) includes the sum of thermal resistances along the heat conduction path from the chip to the wall material of the microcapsule phase change material. Taking the microcapsule phase change material disposed on the outer surface of the heat pipe as an example, Rth includes at least the contact thermal resistance between the CPU chip and the heat-conducting block, the thermal resistance of the heat-conducting block, the interfacial thermal resistance between the heat-conducting block and the heat pipe, the thermal resistance of the heat pipe, and the contact thermal resistance between the heat pipe and the wall material of the microcapsule phase change material. T(t) represents the temperature of the microcapsule phase change material at a certain moment.

[0071] For example, in step 4), according to formula (2) in step 3), the functional relationship between the latent heat ΔH, density ρ, and specific heat capacity Cp of the phase change material can be determined. Since the latent heat ΔH describes the heat absorbed or released per unit mass of material during a phase change at the phase change point, it exists only during the phase change process. Therefore, latent heat is an inherent strength property of a substance during phase change, and like density ρ and specific heat capacity Cp, it is also an inherent property of the substance. Therefore, for a given phase change material, its latent heat, density, specific heat capacity, and phase change temperature selection point Tx are also determined. Based on this characteristic, the phase change temperature selection point Tx and V0 value can be predetermined (which can be calculated based on the maximum volume of the phase change material allowed by the target structural component during the phase change process). Then, based on the total heat Q and the above formula (2), the functional relationship between the latent heat ΔH, density ρ, and specific heat capacity Cp is determined. Then, combined with Tx, phase change materials that meet the functional relationship are screened out, and the V0 value can be adaptively adjusted during the screening process to meet the above function, thereby finally determining the screened phase change material and the weight of the phase change material.

[0072] Taking paraffin wax as an example of phase change material in Table 1, since paraffin wax is a type of material, different carbon chains can lead to significant differences in specific heat capacity. However, the phase change temperature, density, and specific latent heat of the same type of paraffin wax change relatively little, ranging from 800 to 912 kg / m³. 3 The range is 150~250kJ / kg. Therefore, when applying phase change materials to heat dissipation modules, paraffins with different carbon chains can be selected according to actual needs.

[0073] Thirdly, such as Figure 5-6 As shown, this application also provides an electronic device, including a heat-generating component and a heat dissipation module. The heat dissipation module includes a first heat conduction component, a second heat conduction component, and a third heat conduction component. The first heat conduction component is thermally connected to the heat-generating component, the second heat conduction component is thermally connected to the first heat conduction component, and the third heat conduction component is thermally connected to the second heat conduction component. The third heat conduction component is used for heat conduction with the outside environment. The heat dissipation module also includes a fourth heat conduction component, which is thermally connected to at least one of the first, second, and third heat conduction components and is used for heat conduction with the heat conduction component connected to it via latent heat exchange. The fourth heat conduction component is disposed inside or outside the connected heat conduction component.

[0074] For example, the electronic device includes, but is not limited to, a laptop computer, and the heat-generating component is a chip, which includes, but is not limited to, a CPU chip. The first heat conduction component is a heat-conducting block 11; the second heat conduction component is a heat pipe 12; the third heat conduction component is a heat sink 13, or a combination of a heat sink 13 and a cooling fan; the fourth heat conduction component includes, but is not limited to, a phase change material 15.

[0075] For example, the heat dissipation module 1 is thermally connected to at least one of the heat-conducting block 11, heat pipe 12, and heat dissipation fins 13 via a phase change material 15. This allows it to utilize the latent heat exchange between the phase change material and the thermally connected components to it after the chip enters a short-term turbo frequency power consumption period. This helps absorb excess heat that the heat dissipation fins and cooling fan cannot dissipate during the short-term turbo frequency power consumption period. Therefore, an electronic device with the aforementioned heat dissipation module can, after the chip enters a short-term turbo frequency power consumption period, help absorb excess heat that the heat dissipation fins and cooling fan cannot dissipate during the short-term turbo frequency power consumption period, delaying the time it takes for the chip temperature to rise to the chip threshold, thereby effectively improving the chip's ability to sustain short-term turbo frequency power consumption and effectively extending the stable operating time of the chip under short-term turbo frequency power consumption conditions.

[0076] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this disclosure can be achieved, and this is not limited herein.

[0077] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise expressly and specifically defined.

[0078] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A heat dissipation module, characterized in that, The heat dissipation module includes a first heat conduction component, a second heat conduction component, and a third heat conduction component. The first heat conduction component is thermally connected to a heat-generating component, the second heat conduction component is thermally connected to the first heat conduction component, and the third heat conduction component is thermally connected to the second heat conduction component. The third heat conduction component is used for heat conduction with the outside environment. The heat dissipation module also includes a fourth heat conduction component, which is thermally connected to at least one of the first, second, and third heat conduction components and is used for heat conduction with the heat conduction component connected to it via latent heat exchange. The fourth heat conduction component is disposed inside or outside the connected heat conduction component.

2. The heat dissipation module according to claim 1, characterized in that, The first heat conduction component is a heat-conducting block, the second heat conduction component is a heat pipe, and the third heat conduction component is a heat sink fin or a combination of a heat sink fin and a fan.

3. The heat dissipation module according to claim 2, characterized in that, The heat pipe has a first cavity, and the fourth heat conduction component is disposed within the first cavity.

4. The heat dissipation module according to claim 2, characterized in that, The heat dissipation fins include an air outlet area and a non-air outlet area, and the grid of the heat dissipation fins located in the air outlet area is used to communicate with the fan; The grid of the heat dissipation fins located in the non-air outlet area has a second cavity, and the fourth heat conduction component is disposed in the second cavity.

5. The heat dissipation module according to claim 2, characterized in that, The fourth heat conduction component is attached to the outer surface of the heat conduction block and / or the outer surface of the heat pipe.

6. The heat dissipation module according to any one of claims 1-5, characterized in that, The fourth heat conduction component includes a phase change material.

7. The heat dissipation module according to claim 6, characterized in that, The phase change material is obtained using the following method: The temperature rise curve of the first heat conduction component was measured after the heat-generating component entered the short-term turbo frequency power consumption. The total heat required to be absorbed by the phase change material is obtained based on the temperature rise curve. Based on the fact that the total heat is the sum of the total sensible heat and the total latent heat that the phase change material needs to absorb, the functional relationship between the specific latent heat, density and specific heat capacity of the phase change material is obtained; Based on the functional relationship between the latent heat, density, and specific heat capacity, a phase change material that satisfies the functional relationship is obtained.

8. The heat dissipation module according to claim 7, characterized in that, The total heat required to be absorbed by the phase change material is the difference between the heat released and the heat lost. Wherein, the released heat is the total heat released by the heating component under short-term turbo frequency power consumption from the time interval from when the temperature of the heating component first reaches the theoretical phase change temperature to when the temperature of the heating component drops back to the theoretical phase change temperature; The heat loss refers to the total heat lost during the process of heat transfer from the heating component to the phase change material within the same time interval.

9. The heat dissipation module according to claim 7, characterized in that, The temperature rise curve of the first heat conduction component is based on the premise of no phase change material, and is the temperature rise curve of the first heat conduction component after the heat generation component enters short-term turbo frequency power consumption.

10. An electronic device, comprising a heating element, characterized in that, It also includes the heat dissipation module as described in any one of claims 1-9.

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