Substrate processing apparatus and substrate processing method

By designing a gas exhaust path and gas supply section at a specific angle in the substrate processing apparatus, a rotating airflow is formed, which solves the problem of processing liquid entanglement and improves the processing effect.

CN121751994APending Publication Date: 2026-03-27SCREEN HOLDINGS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-08
Publication Date
2026-03-27

AI Technical Summary

Technical Problem

During substrate processing, the processing solution can easily seep into the other main surface of the substrate, resulting in poor processing results.

Method used

By designing a gas exhaust path and a gas supply section at a specific angle in the substrate processing apparatus, a rotating airflow is formed to suppress the ingress of the processing liquid.

Benefits of technology

It effectively prevents the processing liquid from flowing from the upper surface of the substrate to the lower surface, thus improving the efficiency and effectiveness of the processing liquid.

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Abstract

The present invention provides a technique capable of suppressing a processing liquid supplied to one main surface of a substrate from entering the other main surface of the substrate. A substrate processing apparatus (100) includes a base plate (11), a stopper pin (13) that limits a substrate (9) above the base plate, a rotation mechanism (14) that rotates the base plate about a rotation axis (J1), a processing liquid supply unit (2) that supplies a processing liquid to an upper surface of the substrate, and a discharge path (32) that extends within the base plate from a first opening (32a) provided in the base plate to a second opening (32b) that opens on an upper surface (111) side of the base plate. And a gas supply unit (303) that causes the gas to flow into the first opening and discharges the gas from the second opening, and when viewed from above, the extension direction (K) of the discharge path from the first opening to the second opening is a direction inclined to the downstream side of the rotation direction (R) of the base plate with respect to an imaginary straight line (D) passing through the rotation axis and the first opening.
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Citation Information

Patent Citations

  • Substrate processing device and substrate processing method

    JP2018200977A