Substrate bearing sheet, wafer boat and furnace tube equipment
By designing trenches and vias on the substrate carrier, the surface roughness is changed and a gas flow path is formed, which solves the problem of wafer adhesion to the substrate carrier under high-temperature processes and improves the yield of semiconductor products.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2026-03-27
AI Technical Summary
Under high-temperature processing conditions, wafers and substrate carriers are prone to adhesion, making them difficult to separate and affecting the yield of semiconductor products.
The substrate carrier sheet is designed with multiple grooves and through holes to change the surface roughness, reduce the effective contact area, and form a gas flow path through the through holes to avoid adhesion.
It reduces the adhesion between the substrate and the substrate carrier sheet, improves the yield of substrate processing, ensures easy separation after high-temperature processing, and reduces the risk of breakage.
Smart Images
Figure CN121752006A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing equipment, specifically to a substrate carrier, a crystal boat, and a furnace tube device. Background Technology
[0002] Furnace tube equipment is currently the main equipment for semiconductor diffusion, oxidation, annealing and other processes. The accuracy and uniformity of its reaction gas flow control are key performance indicators of the equipment.
[0003] Traditional semiconductor vapor deposition processes operate at temperatures around 800-1100℃. However, with the development of semiconductor power devices and more advanced semiconductor process technologies, the requirements for furnace tube process temperatures are becoming increasingly stringent, and traditional process temperatures can no longer meet these requirements.
[0004] In semiconductor manufacturing, higher process temperatures are required to increase the diffusion rate of doped atoms in silicon wafers, improve the deposition rate of oxide films, and increase equipment output.
[0005] Wafers are typically made of silicon and placed on a wafer boat. However, in high-temperature environments, due to the small contact area with the wafer boat, the wafer will deform under the influence of gravity. Severe deformation can lead to process failure.
[0006] To address this issue, existing technologies have proposed a method that places the wafer on a substrate carrier and then places the substrate carrier on a crystal boat to increase the contact area. The substrate carrier can control the deformation of the wafer under gravity.
[0007] However, the surfaces between the wafer and the substrate carrier are typically quite smooth, which introduces new problems under high-temperature conditions. At high temperatures, strong adhesion forces easily form at the contact surfaces between the wafer and the substrate carrier, leading to wafer sticking. This adhesion makes it difficult to separate the wafer from the substrate carrier after cooling. Forcibly separating it increases the risk of wafer breakage, thereby affecting the yield of semiconductor products. Summary of the Invention
[0008] This application provides a substrate carrier sheet, a crystal boat, and a furnace tube device, which helps to avoid the problem that the substrate and the substrate carrier sheet are not easy to separate after high-temperature processing.
[0009] This application solves the above-mentioned technical problems through the following technical solution:
[0010] A substrate carrier sheet for supporting a substrate includes at least one trench, at least one through hole, and a substrate contact area. The at least one trench is formed on the upper surface of the substrate carrier sheet, the at least one through hole penetrates the substrate carrier sheet, and the substrate contact area is used to contact the substrate when supporting the substrate. The at least one trench and the at least one through hole are both disposed within the substrate contact area.
[0011] A crystal boat includes a support frame and substrate carrier sheets as described above. The substrate carrier sheets are disposed on the support frame and spaced apart along the vertical direction of the support frame for supporting multilayer substrates.
[0012] A furnace tube apparatus comprising a crystal boat as described above.
[0013] The positive advancements of this application are as follows: Firstly, the trench and via design alter the smooth surface of the substrate carrier, making the carrier surface relatively rough and reducing the effective contact area between the substrate and the carrier, thus decreasing the possibility of adhesion. Secondly, the trench and via design provide more gas flow paths, allowing gas to enter the substrate contact area through the vias, thereby forming an air layer between them. In summary, the trench and via design helps prevent the substrate from adhering to the carrier after high-temperature processing, improving the substrate processing yield. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the substrate carrier sheet structure of Embodiment 1 of this application;
[0015] Figure 2 This is a schematic diagram of the structure of the substrate carrier sheet of Embodiment 1 of this application;
[0016] Figure 3a for Figure 1 Enlarged structural diagram at point A;
[0017] Figure 3b This is a second schematic diagram of a partial structure of the substrate carrier sheet in Embodiment 1 of this application;
[0018] Figure 3c This is a third schematic diagram of a partial structure of the substrate carrier sheet in Embodiment 1 of this application;
[0019] Figure 3d This is a fourth schematic diagram of a partial structure of the substrate carrier sheet in Embodiment 1 of this application;
[0020] Figure 4 This is a schematic diagram of the structure of the crystal boat in Embodiment 2 of this application;
[0021] Figure 5 This is a schematic diagram of the support frame for the crystal boat in Embodiment 2 of this application;
[0022] Figure 6 This is a partial structural schematic diagram of the crystal boat of Embodiment 2 of this application;
[0023] Figure 7 for Figure 6 A magnified structural diagram at point B in the middle. Detailed Implementation
[0024] The present application is further illustrated below by way of embodiments, but this does not limit the present application to the scope of the embodiments.
[0025] like Figure 1 and Figure 2 As shown, this embodiment provides a substrate carrier sheet 100 for carrying a substrate 200 in a furnace tube device. It includes multiple grooves 110, multiple through holes 120, and a substrate contact area. The multiple grooves 110 are formed on the upper surface of the substrate carrier sheet 100, and the multiple through holes 120 penetrate the substrate carrier sheet 100. The substrate contact area is used to contact the substrate 200 when carrying the substrate 200. The multiple grooves 110 and the multiple through holes 120 are all disposed in the substrate contact area.
[0026] Existing substrates 200 and substrate carrier 100 typically have smooth surfaces and large contact areas. Smooth surfaces facilitate tight contact, increasing adhesion between surfaces. This smooth contact reduces the air layer between the surfaces, making adhesion more pronounced. In this design, the design of multiple trenches 110 and multiple through-holes 120 alters the smooth surface of the substrate carrier 100, making it relatively rough and reducing the effective contact area between the substrate 200 and the substrate carrier 100, thus decreasing the possibility of adhesion. Furthermore, the multiple trenches 110 and through-holes 120 provide more gas flow paths, allowing gas to enter the substrate contact area through the through-holes 120, thereby forming an air layer between them. In summary, the design of the trenches 110 and through-holes 120 helps prevent the substrate 200 from adhering to the substrate carrier 100 after high-temperature processing, improving the yield of substrate 200 processing.
[0027] In this embodiment, the multiple trenches 110 also extend beyond the substrate contact area. The multiple trenches 110 are not limited to the substrate contact area, but extend beyond the substrate contact area, which can further improve the airflow. Gas can also enter between the substrate carrier 100 and the substrate 200 through the trenches 110, which helps to further reduce the occurrence of adhesion problems.
[0028] In other embodiments, the multiple trenches 110 may also be provided only within the substrate contact area and not extend beyond the substrate contact area. For example... Figure 3aAs shown, the through-hole 120 passes through the trench 110. Because the through-hole 120 is integrated with the trench 110, gas can enter the trench 110 through the through-hole 120 and flow within the trench 110, providing good gas flow. This design effectively promotes the formation of an air layer between the substrate 200 and the substrate carrier 100, thereby further preventing adhesion problems of the substrate 200.
[0029] In some embodiments, the number of trenches 110 and through holes 120 is not limited thereto, and at least one trench 110 and at least one through hole 120 may be provided as needed. Wherein, at least one of the through holes 120 passes through at least one of the trenches 110.
[0030] In this embodiment, multiple trenches 110 are distributed alternately on the upper surface of the substrate carrier 100. The alternately distributed trenches 110 form multiple small grid structures on the surface of the substrate carrier 100. Compared with simply parallel trenches 110, the area in contact between the substrate 200 and the substrate carrier 100 is divided into small grid structures. The different grid structures are independent of each other, dividing the large contact area between the substrate 200 and the substrate carrier 100 into multiple small contact areas, thereby reducing the possibility that the substrate 200 will be adsorbed onto the substrate carrier 100 after high-temperature processing.
[0031] In other embodiments, the multiple grooves 110 may not intersect each other.
[0032] In this embodiment, multiple through holes 120 are disposed at the intersection of multiple trenches 110. The through holes 120 located at the intersection form a multidirectional gas flow node, which is conducive to the rapid formation of an air layer and facilitates the quick removal of the adhesive force between the substrate 200 and the substrate carrier sheet 100.
[0033] In some embodiments, only a portion of the through holes 120 may be provided at the intersection of the multiple grooves 110.
[0034] In other embodiments, such as Figure 3b As shown, the through hole 120 can also be located at a non-intersection point of the groove 110. Or as... Figure 3c As shown, the through hole 120 may also not pass through the groove 110. For example... Figure 3d As shown, through holes can also be set at the groove 110 and within the grid formed by the groove 110.
[0035] In some embodiments, the through holes 120 are uniformly distributed on the substrate carrier sheet 100. During high-temperature processes, substrate sticking is often caused by strong adsorption forces in localized areas. By uniformly distributing the through holes 120, these localized adsorption forces can be effectively dispersed. This reduces the possibility of strong adsorption forces forming in localized areas, allowing the substrate 200 to detach from the substrate carrier sheet 100 more easily after cooling, avoiding breakage caused by forced separation.
[0036] In some embodiments, the substrate carrier 100 is made of silicon carbide. Silicon carbide has excellent high-temperature resistance and will not soften or deform during high-temperature processes. In other embodiments, the substrate carrier 100 may also be made of other high-temperature resistant materials.
[0037] like Figure 1 As shown, the substrate carrier sheet 100 also includes a first carrier portion 140 and a second carrier portion 130. The first carrier portion 140 is disposed in the middle of the substrate carrier sheet 100, and the second carrier portion 130 is disposed on both sides of the first carrier portion 140. A first slot 150 is provided between the first carrier portion 140 and the second carrier portion 130. The first slot 150 extends from the edge of the substrate carrier sheet 100 toward the interior of the substrate carrier sheet 100.
[0038] The design of the first slot 150 provides clearance space for the robot to pick up and place the substrate 200, making it easier to pick up and place the substrate 200. In addition, the first slot 150 reduces the contact area between the substrate 200 and the substrate carrier 100, which helps to reduce the sticking phenomenon. During the process of the robot picking up the substrate 200, the substrate 200 and the substrate carrier 100 are more easily separated.
[0039] In this embodiment, the substrate carrier 100 further includes a second slot 160, which is disposed on the first carrier portion 140 and extends from the edge of the first carrier portion 140 toward the interior of the first carrier portion 140. By providing the second slot 160, the corresponding robotic arm can also be configured with a corresponding picking and placing structure, forming three support parts when picking and placing the substrate 200, making the picking and placing process of the substrate 200 more stable.
[0040] Furthermore, along the extending direction of the first slot 150, the length of the first support portion 140 is greater than the length of the second support portion 130. Since the length of the first support portion 140 is greater than that of the second support portion 130, the middle part of the substrate 200 receives stronger support, thereby effectively reducing the possibility of the middle part of the substrate 200 sagging or bending under high temperature conditions and maintaining the overall flatness of the substrate 200.
[0041] Example 2
[0042] like Figure 4As shown, a crystal boat includes a support frame 300 and substrate carrier sheets 100 as in Embodiment 1. The substrate carrier sheets 100 are spaced apart along the vertical direction of the support frame 300 and are used to support multilayer substrates 200.
[0043] Using the crystal boat of this application, the substrate 200 is not easily deformed or warped during high-temperature processing, and it is easier to separate after high-temperature processing, and it is less likely to stick together.
[0044] like Figure 5 and Figure 6 As shown, the support frame 300 includes multiple support columns 320a, 320b, and 320c. The multiple support columns 320a, 320b, and 320c are distributed along the outer periphery of the substrate 200. Each support column is provided with multiple placement slots 310 in the vertical direction. Each placement slot 310 is used to support a corresponding substrate support piece 100.
[0045] Specifically, such as Figure 1 and Figure 6 As shown, the area S (where the substrate carrier 100 contacts the placement groove 310) Figure 6 (Only one location is shown in the image) that matches the bearing surface 311 of the placement groove 310. In this embodiment, the bearing surface 311 of the placement groove 310 has a square structure, and the area S in contact between the substrate support piece 100 and the placement groove 310 is square, which helps to increase the contact area and makes the placement of the substrate support piece 100 more stable. In some embodiments, if the placement groove 310 has an arc-shaped structure, the shape of the area in contact between the substrate support piece 100 and the placement groove 310 can also be set to arc shape.
[0046] In this embodiment, as Figure 1 and Figure 7 The substrate carrier 100 shown also includes a notch 170, which is embedded in a corresponding placement groove 310. With the cooperation of the notch 170 and the placement groove 310, the substrate carrier 100 is less prone to shaking, which can further improve the stability of the substrate carrier 100.
[0047] Specifically, such as Figure 6 As shown, the support frame 300 includes three support pillars 320a, 320b, and 320c, which are distributed along the outer periphery of the substrate 200. One support pillar 320b is located in the middle, and the other two support pillars 320a and 320c are located on either side of the support pillar 320b. The placement grooves 310 on the support pillars 320a and 320c are used to contact the area S on the substrate carrier sheet 100, and the placement groove 310 on the support pillar 320b is used for embedding and engaging the notch 170.
[0048] This embodiment also provides a furnace tube device, which includes the crystal boat as described above.
[0049] While specific embodiments of this application have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this application is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this application, but all such changes and modifications fall within the scope of protection of this application.
Claims
1. A substrate carrier sheet for supporting a substrate, characterized in that, It includes at least one trench, at least one through hole, and a substrate contact area. The at least one trench is formed on the upper surface of the substrate carrier sheet, the at least one through hole penetrates the substrate carrier sheet, and the substrate contact area is used to contact the substrate when carrying the substrate. The at least one trench and the at least one through hole are both disposed within the substrate contact area.
2. The substrate carrier sheet as described in claim 1, characterized in that, At least one of the through holes passes through at least one of the trenches.
3. The substrate carrier sheet as described in claim 1, characterized in that, Multiple grooves are distributed interlaced on the upper surface of the substrate carrier sheet.
4. The substrate carrier sheet as described in claim 3, characterized in that, At least one of the through holes is located at the intersection of the plurality of trenches.
5. The substrate carrier sheet as described in claim 1, characterized in that, The multiple through holes are evenly distributed on the substrate carrier sheet.
6. The substrate carrier sheet as described in claim 1, characterized in that, At least one of the trenches extends beyond the substrate contact area.
7. The substrate carrier sheet as described in claim 1, characterized in that, The substrate carrier sheet is made of silicon carbide.
8. The substrate carrier sheet as described in claim 1, characterized in that, The substrate carrier sheet further includes a first carrier portion and a second carrier portion. The first carrier portion is disposed in the middle of the substrate carrier sheet, and the second carrier portion is disposed on both sides of the first carrier portion. A first slot is provided between the first carrier portion and the second carrier portion. The first slot extends from the edge of the substrate carrier sheet toward the interior of the substrate carrier sheet.
9. The substrate carrier sheet as described in claim 8, characterized in that, The substrate carrier sheet further includes a second slot, which is disposed in the first carrier portion and extends from the edge of the first carrier portion toward the interior of the first carrier portion.
10. The substrate carrier sheet as described in claim 9, characterized in that, Along the extension direction of the first slot, the length of the first support portion is greater than the length of the second support portion.
11. A crystal boat, characterized in that, It includes a support frame and a substrate carrier sheet as described in any one of claims 1-10, wherein the substrate carrier sheet is disposed on the support frame and is spaced apart along the vertical direction of the support frame for supporting multilayer substrates.
12. The crystal boat as described in claim 11, characterized in that, The support frame includes multiple support columns distributed along the outer periphery of the substrate. Each support column is provided with multiple placement slots in the vertical direction, and each placement slot is used to support a corresponding substrate support piece.
13. The crystal boat as described in claim 12, characterized in that, The placement groove includes a bearing surface for contacting the substrate carrier sheet, and the area of the substrate carrier sheet in contact with the placement groove matches the bearing surface.
14. The crystal boat as described in claim 12, characterized in that, The substrate carrier sheet also includes a notch, which is embedded in the corresponding placement groove.
15. A furnace tube device, characterized in that, It includes the crystal boat as described in any one of claims 11-14.