High-power phase change cold plate and liquid cooling method
By introducing heat transfer teeth and heat transfer groove structures into the phase change cold plate, combined with liquid separation components and preheating components, the problem of large air bubble formation in the coolant is solved, improving cooling efficiency and flow stability, and adapting to multiple operating conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-03-27
AI Technical Summary
In existing phase change cooling plates, the coolant is prone to forming large bubbles in the flow channel, resulting in poor fluidity and affecting the cooling effect. Furthermore, the coolant temperature control requirements are strict, making it difficult to adapt to various operating conditions.
A high-power phase change cooling plate was designed, which uses heat transfer teeth and heat transfer grooves to increase the contact area of the coolant, and controls the steam discharge through liquid separation components and preheating components to avoid the formation of large bubbles and expand the temperature range of the coolant.
It improves cooling efficiency, prevents the accumulation of large air bubbles, enhances the flow stability of the coolant, reduces the precision requirements for coolant temperature control, and expands the range of applicable operating conditions.
Smart Images
Figure CN121752067A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of thermal management technology for electronic devices, and in particular to a high-power phase change cold plate and a liquid cooling method. Background Technology
[0002] With the continuous development of modern industries, the power density of chips is constantly increasing, and the problem of heat dissipation for high heat flux densities is becoming increasingly prominent. Traditional air-cooling technology, due to its limited cooling capacity and high noise, is unable to meet the heat dissipation requirements of current chips. Phase change cooling technology has thus become the main technical means to solve the problem of heat dissipation for high heat flux densities. Phase change cold plates utilize coolant to absorb the heat transferred from the chip, undergo a phase change, and carry away the heat, achieving rapid heat dissipation.
[0003] In existing technologies, the main cooling process involves the coolant flowing through a channel that contacts the heat-generating chip. The coolant boils within the channel, generating steam bubbles. These bubbles and liquid form a two-phase mixture, which is then discharged from the device, thus carrying away the heat from the chip. However, existing devices typically require strict control of the coolant temperature input to the phase change cold plate to prevent it from boiling and generating bubbles before being pumped into the plate. Simultaneously, it's crucial to ensure the coolant reaches its boiling point upon contact with the heat-generating chip, thus generating steam. Furthermore, during phase change cold plate operation, a large amount of steam easily forms in the channel, creating large bubbles. These large bubbles, due to their poor flowability, tend to stagnate in specific areas of the channel, hindering contact between the coolant and the heat-generating chip and affecting the cooling effect. Summary of the Invention
[0004] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a high-power phase change cold plate that can improve heat dissipation efficiency while effectively suppressing the formation of large bubbles.
[0005] This application also proposes a liquid cooling method for high-power phase change cold plates.
[0006] A high-power phase change cold plate according to a first aspect embodiment of this application includes: A heat dissipation substrate is provided with a heat transfer part; the heat transfer part is in contact with the heat-generating chip, and the heat transfer part is provided with heat transfer teeth; the heat transfer teeth are provided with heat transfer grooves for increasing the heat transfer area. The liquid distribution assembly includes an abutment member; the abutment member is adapted to the heat transfer teeth and forms a liquid flow channel with the heat transfer tank for the flow of coolant.
[0007] A high-power phase change cold plate according to an embodiment of this application has at least the following beneficial effects: The heat transfer section on the heat dissipation substrate contacts the heat-generating chip, transferring the heat from the heat-generating chip to the coolant between adjacent heat transfer teeth, causing the coolant to boil and generate steam, thereby reducing the temperature of the heat-generating chip. The contact member in the liquid distribution assembly and the heat transfer groove on the heat transfer teeth form a liquid flow channel for the coolant to circulate. The heat transfer groove can increase the contact area between the coolant and the heat transfer teeth, improving the overall heat exchange efficiency. On the other hand, the heat transfer groove can effectively prevent the steam generated when the coolant boils from accumulating and forming large bubbles. Optionally, the heat dissipation substrate is provided with a sealing shell; the sealing shell is provided with a steam trough for expanding the steam containment space.
[0008] Optionally, the heat dissipation substrate is provided with an extension portion, and the extension portion is evenly distributed with first fixing holes; the sealing shell is provided with second fixing holes that are adapted to the first fixing holes.
[0009] Optionally, the phase change cooling plate includes a preheating assembly; the preheating assembly has a connecting hole for conveying coolant to the liquid distribution assembly; the preheating assembly includes a first guide protrusion, a second guide protrusion, and an annular flow channel; the first guide protrusion and the second guide protrusion abut against the liquid distribution assembly and, together with the sealing shell, form an inflow chamber and an outflow chamber; the first guide protrusion and the second guide protrusion can guide the coolant through the connecting hole and guide the coolant through the inflow chamber into the liquid distribution assembly; the outflow chamber is used to discharge the steam generated by cooling.
[0010] Optionally, the annular flow channel can deliver coolant in contact with the heat transfer section; the annular flow channel is connected to a plurality of the communicating holes.
[0011] Optionally, the liquid separation assembly includes a liquid separation unit; the liquid separation unit includes a first channel and a second channel; the first channel and the second channel are arranged alternately; the first channel is connected to the inflow chamber; and the second channel is connected to the discharge chamber.
[0012] Optionally, the sealing shell is provided with an inlet pipe, a outlet pipe and an outlet; the preheating component is provided with an inlet that matches the outlet.
[0013] Optionally, the size of the heat transfer teeth gradually decreases in the direction away from the heat transfer part; the heat transfer teeth are provided with first side surfaces symmetrically on both sides.
[0014] Optionally, the heat transfer grooves are arranged on the first side surface in a direction away from the heat transfer part; the number of heat transfer grooves on a single first side surface is not less than two.
[0015] According to a second aspect embodiment of this application, a liquid cooling method for a high-power phase change cold plate is provided. The high-power phase change cold plate further includes a preheating component and a sealing shell. The preheating component is provided with a connecting hole and an inlet for conveying coolant to a liquid distribution component. The sealing shell is provided with an inlet pipe and an outlet pipe. Coolant is pumped into the inlet pipe through the pump body; Coolant enters the preheating component through the inlet on the preheating component; the heating chip preheats the coolant in the preheating component through the heat transfer section; The preheated coolant enters the liquid distribution assembly through the connecting hole; Coolant flows through the liquid flow channel in the liquid distribution assembly and evaporates to generate bubbles; The air bubbles are discharged through the discharge pipe on the sealed shell.
[0016] A liquid cooling method for a high-power phase change cold plate according to an embodiment of this application has at least the following beneficial effects: Using the high-power phase change cold plate of the first aspect of this application, the heat transfer portion on the heat dissipation substrate contacts the heating chip, and the heat transfer portion transfers the heat from the heating chip to the coolant between adjacent heat transfer teeth, causing the coolant to boil and generate steam; the contact member in the liquid distribution assembly and the heat transfer groove on the heat transfer teeth form a liquid flow channel for the coolant to circulate; the setting of the heat transfer groove, on the one hand, can increase the contact area between the coolant and the heat transfer teeth, improving the overall heat exchange efficiency; on the other hand, the heat transfer groove can effectively prevent the steam generated when the coolant boils from accumulating and forming large bubbles. This method eliminates the need to control the temperature of the input coolant near the boiling point, expands the applicable operating conditions of the phase change cold plate, and facilitates rapid steam discharge, effectively reducing the flow instability problem of high-power phase change. Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0017] The present application will be further illustrated below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments illustrated in the following drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.
[0018] Figure 1 This is a schematic diagram of the overall structure of a high-power phase change cold plate as described in Embodiment 1 of this application; Figure 2 This is a cross-sectional view of a high-power phase change cold plate as described in Embodiment 1 of this application; Figure 3 This corresponds to Embodiment 1 of this application. Figure 2 Enlarged view of part A in the middle; Figure 4This is a schematic diagram of the structure of the sealing shell described in Embodiment 1 of this application; Figure 5 This is a top view of the heat dissipation substrate, liquid distribution assembly, and preheating assembly described in Embodiment 1 of this application; Figure 6 This corresponds to Embodiment 1 of this application. Figure 5 Enlarged view of part B in the middle; Figure 7 This is a schematic diagram of the preheating component described in Embodiment 1 of this application.
[0019] Reference numerals: 100, sealing shell; 101, steam tank; 102, liquid inlet pipe; 103, discharge pipe; 104, liquid outlet; 105, second fixing hole; 106, sealing groove; 1061, sealing gasket; 200, heat dissipation base plate; 201, heat transfer part; 202, heat transfer teeth; 2021, first side surface; 203, heat transfer groove; 204, extension part; 2041, first fixing hole; 300, liquid distribution assembly; 301, abutment member; 302, liquid distribution unit; 3021, first channel; 3022, second channel; 303, liquid flow channel; 400, preheating assembly; 401, connecting hole; 402, first guide protrusion; 403, second guide protrusion; 404, annular flow channel; 405, inflow cavity; 406, discharge cavity; 407, liquid inlet. Detailed Implementation
[0020] The embodiments of this application are described in detail below with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0021] In the description of this application, it should be understood that the terms "center", "middle", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0022] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0023] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0024] In the description of this application, the use of terms such as "one embodiment," "some embodiments," "an example," "some instances," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples" indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0025] Example 1: Reference Figures 1-3 This application provides a high-power phase change cold plate, comprising: A heat dissipation substrate 200 is provided with a heat transfer section 201; the heat transfer section 201 is in contact with the heat-generating chip, and the heat transfer section 201 is provided with heat transfer teeth 202; the heat transfer teeth 202 are provided with heat transfer grooves 203 for expanding the heat transfer area. Liquid distribution assembly 300 includes abutment member 301; abutment member 301 is adapted to heat transfer teeth 202 and together with heat transfer tank 203 forms a liquid flow channel 303 for coolant to flow.
[0026] Specifically, refer to Figures 1-3The heat transfer section 201 on the heat dissipation substrate 200 can contact the heat-generating chip, allowing the coolant in the phase change cold plate to lower the temperature of the heat-generating chip. The heat dissipation substrate 200 can be made of a high thermal conductivity metal, such as copper or aluminum. The heat transfer teeth 202 on the heat transfer section 201 can increase the heat transfer surface area and reduce the heat flux density at the boiling surface. To further improve heat exchange efficiency and ensure the stability of coolant flow, the heat transfer teeth 202 can be evenly distributed on the heat transfer section 201. The evenly distributed heat transfer teeth 202 not only allow the coolant to fully contact the heat transfer teeth 202, improving heat exchange efficiency, but also make the temperature distribution of the heat dissipation substrate 200 more uniform, reducing the risk of local heat accumulation. The heat transfer groove 203 on the heat transfer teeth 202 further increases the contact area between the heat transfer teeth 202 and the coolant, improving the cooling effect. More importantly, the heat transfer groove 203 can effectively prevent the steam generated by the boiling of the coolant from accumulating in the phase change cold plate and generating large bubbles. The abutment member 301 on the liquid distribution assembly 300, which is adapted to the heat transfer teeth 202, can form a liquid flow channel 303 with the heat transfer groove 203 for the coolant to flow. The liquid flow channel 303 can effectively control the amount of coolant passing through, thereby controlling the amount of steam generated by the boiling of the coolant. The liquid distribution assembly 300 can be made of a microporous material, which facilitates the timely discharge of steam generated by the boiling of the coolant while preventing the coolant from flowing out. The liquid distribution assembly 300 made of a microporous material allows some bubbles to be discharged not only through the guiding effect of the liquid distribution assembly 300 after they are generated, but also through the micropores of the liquid distribution assembly 300 to be discharged from the phase change cold plate, improving the efficiency of bubble discharge.
[0027] Reference Figures 2-5 The heat dissipation substrate 200 is provided with a sealing shell 100 and a preheating component 400; wherein, the sealing shell 100 is provided with an inlet pipe 102, an outlet pipe 103 and an outlet 104; the preheating component 400 is provided with an inlet 407 adapted to the outlet 104. Coolant is pumped into the sealing housing 100 through the inlet pipe 102 on the sealing housing 100, and then discharged from the sealing housing 100 through the outlet 104. It then enters the preheating assembly 400 through the inlet 407 on the preheating assembly 400 to preheat the coolant. This relaxes the restrictions on the subcooling of the pumped coolant, expands the range of coolant input temperature, and reduces the requirements for the accuracy of external coolant temperature control. This means that the coolant temperature does not need to be controlled near the boiling point, effectively preventing the coolant from boiling in the pump body and causing cavitation. At the same time, after the coolant enters the phase change cold plate, the preheating assembly 400 can preheat the coolant, reduce the subcooling of the coolant, and facilitate the boiling and heat transfer of the coolant in the liquid flow channel 303. This ensures the cooling effect of the coolant in the phase change cold plate, which is of great value for industrial-scale applications.
[0028] Reference Figures 2-6The sealing shell 100 is provided with a sealing groove 106 and a steam groove 101 for expanding the steam carrying space. The sidewall of the steam groove 101 abuts against the first guide protrusion 402 and the second guide protrusion 403, further expanding the volume of the discharge cavity 406. This allows the phase change cold plate to still provide sufficient space for high-power heat-generating chips, reducing the flow resistance of steam and enabling steam to leave more quickly and smoothly. This prevents steam from accumulating in the phase change cold plate and forming a steam film, i.e., large bubbles, covering the surface of the heat transfer part 201 and affecting the contact between the coolant and the heat transfer part. At the same time, it can also effectively prevent the phase change cold plate structure from being damaged due to large fluctuations in pressure and temperature inside the phase change cold plate. The sealing groove 106 surrounds the circumference of the sealing shell 100, and a sealing gasket 1061 for sealing the phase change cold plate is provided in the sealing groove 106. The sealing gasket 1061 can be made of rubber.
[0029] Reference Figures 1-7 The preheating component 400 is arranged around the circumference of the liquid distribution component 300; the preheating component 400 is provided with a connecting hole 401 that can transport coolant to the liquid distribution component 300; the preheating component 400 includes a first guide protrusion 402, a second guide protrusion 403 and an annular flow channel 404; the first guide protrusion 402 and the second guide protrusion 403 abut against the liquid distribution component 300 and are arranged with the sealing shell 100 to form an inflow cavity 405 and an outlet cavity 406; the first guide protrusion 402 and the second guide protrusion 403 can guide the coolant through the connecting hole 401 and guide the coolant through the inflow cavity 405 into the liquid distribution component 300; the outlet cavity 406 is used to discharge the steam generated by cooling. The heat dissipation substrate 200 is provided with an extension 204. To facilitate maintenance of the phase change cold plate and replacement of the sealing shell 100, the extension 204 is provided with evenly distributed first fixing holes 2041. The sealing shell 100 is provided with second fixing holes 105 that are adapted to the first fixing holes 2041. The sealing shell 100 can be fixed to the heat dissipation substrate 200 by bolts passing through the first fixing holes 2041 and the second fixing holes 105. The extension 204 can be provided in the circumferential direction of the heat dissipation substrate 200 away from the heat-generating part. The space between the extension 204 and the heat-generating part facilitates the installation of a high-strength gasket, which enhances the locking force between the sealing shell 100 and the heat dissipation substrate 200. The sealing performance of the phase change cold plate is ensured by pressing the sealing gasket 1061. The high-strength gasket can be a gasket with a thickness of 1~3mm and a diameter of 4~6mm.
[0030] Reference Figures 2-7The liquid distribution assembly 300 includes a liquid distribution unit 302, which includes a first channel 3021 and a second channel 3022, which are arranged alternately. The first channel 3021 is connected to the inflow chamber 405, and the second channel 3022 is connected to the discharge chamber 406. The annular flow channel 404 can transport coolant that comes into contact with the heat transfer section 201; the annular flow channel 404 is connected to several connecting holes 401. Coolant flows out from the outlet 104 on the sealing shell 100 and enters the annular flow channel 404 through the inlet 407. The heat transfer unit 201 heats the coolant in the annular flow channel 404. The heated coolant exits the annular flow channel 404 through the connecting hole 401 and enters the inflow chamber 405. The first guide bump 402 and the second guide bump 403 guide the heated coolant from the inflow chamber 405 into the first channel 3021, and then into the liquid flow channel 303 to contact the heat transfer unit 201 and cool the heat-generating chip. The steam generated by the boiling of the coolant in the liquid flow channel 303 enters the discharge chamber 406 through the second channel 3022. Reference Figures 3-6 The heat transfer teeth 202 gradually decrease in size in the direction away from the heat transfer part 201; the heat transfer teeth 202 are symmetrically provided with first side surfaces 2021 on both sides; the end of the heat transfer teeth 202 away from the heat transfer part 201 is smaller than the end near the heat transfer part 201. This design not only expands the heat transfer surface area, but also facilitates the use of cutting tools to process heat transfer grooves 203 on the heat transfer teeth 202; the heat transfer grooves 203 are arranged on the first side surfaces 2021 in the direction away from the heat transfer part 201, so that the coolant entering from the connecting hole 401 can enter the liquid flow channel 303 and fully contact the heat transfer part 201 to cool the heat-generating chip; the number of heat transfer grooves 203 on a single first side surface 2021 is not less than two. On the one hand, it can further increase the contact area between the coolant and the heat transfer grooves 203 and improve the cooling effect. On the other hand, it can prevent steam bubbles from forming a steam film on the surface of the heat transfer teeth 202, so that the bubbles can be discharged more quickly, and can maintain efficient phase change heat transfer for high-power heat-generating chips. The height of the heat transfer tooth 202 can be set to 1.5~4mm, and the depth and width of the heat transfer groove 203 can be between 0.1~0.8mm; the cross-section of the heat transfer tooth 202 can be trapezoidal, and the cross-section of the heat transfer groove 203 can be triangular, rectangular or semi-circular, etc.
[0031] Example 2: This embodiment provides a liquid cooling method for a high-power phase change cold plate, applied to the aforementioned high-power phase change cold plate, including: Coolant is pumped into the inlet pipe 102 by the pump body; coolant is drawn from the storage tank by the filling pump. At this time, the temperature of the coolant does not need to be precisely controlled near the boiling point; during the process of pumping coolant into the phase change cold plate, the liquid level in the storage tank is observed, and pumping is stopped after the set position is reached.
[0032] Coolant enters the preheating component 400 through the inlet 407 on the preheating component 400; the annular flow channel 404 in the preheating component 400 guides the coolant to contact the heat transfer section 201 for a set time, and the heating chip preheats the coolant in the preheating component 400 through the heat transfer section 201, thereby improving the heat exchange efficiency of the coolant in the liquid distribution component 300.
[0033] The preheated coolant enters the liquid distribution assembly 300 through the connecting hole 401; the first guide bump 402 and the second guide bump 403 in the preheating assembly 400 guide the coolant flowing out of the connecting hole 401 through the inflow cavity 405 into the first channel 3021. The coolant in the first channel 3021 enters the liquid flow channel 303 under the action of gravity, and comes into contact with the heat transfer part 201 again to cool the heat-generating chip.
[0034] Coolant flows through the liquid flow channel 303 in the liquid distribution assembly 300 and evaporates to generate bubbles; when the coolant comes into contact with the heat transfer tank 203 in the liquid flow channel 303, the coolant absorbs heat and boils, and the generated steam enters the discharge chamber 406 through the second channel 3022. The steam tank 101 on the sealing shell 100 provides a larger space for the discharge chamber 406 to discharge steam.
[0035] The air bubbles are discharged through the discharge pipe 103 on the sealed shell 100.
[0036] The phase change cooling plate includes a heat dissipation substrate 200, a liquid distribution assembly 300, a preheating assembly 400, and a sealing shell 100. Coolant enters the sealing shell 100 through an inlet pipe 102. Subsequently, the coolant enters the preheating assembly 400 through an outlet 104 on the sealing shell 100 and an inlet 407 connected to the outlet 104. The annular flow channel 404 in the preheating assembly 400 guides the coolant to contact the heat transfer section 201, preheating the coolant and expanding the temperature range of the input coolant. This effectively prevents cavitation of the coolant in the pump before it enters the sealing shell 100, and also allows the coolant to... The coolant boils quickly, improving heat dissipation. After preheating, the coolant enters the inflow chamber 405 through the connecting hole 401. The first guide bump 402 and the second guide bump 403 in the preheating component 400 guide the coolant in the inflow chamber 405 into the first channel 3021. Then, under the action of gravity, it enters the liquid flow channel 303 and comes into contact with the heat transfer teeth 202, the heat transfer groove 203 and the heat transfer part 201 to cool the heating chip. The heating chip transfers heat to the coolant through the heat transfer part 201. After the coolant reaches the boiling point, it boils, and the generated steam enters the discharge chamber 406 through the second channel 3022 and is discharged from the phase change cold plate through the discharge pipe 103 on the sealing shell 100.
[0037] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.
Claims
1. A high-power phase change cold plate, characterized in that, include: A heat dissipation substrate is provided with a heat transfer part; the heat transfer part is in contact with the heat-generating chip, and the heat transfer part is provided with heat transfer teeth; the heat transfer teeth are provided with heat transfer grooves for increasing the heat transfer area. The liquid distribution assembly includes an abutment member; the abutment member is adapted to the heat transfer teeth and forms a liquid flow channel with the heat transfer tank for the flow of coolant.
2. The high-power phase change cold plate according to claim 1, characterized in that, The heat dissipation base plate is provided with a sealing shell; the sealing shell is provided with a steam trough for expanding the steam containment space.
3. A high-power phase change cold plate according to claim 2, characterized in that, The heat dissipation substrate is provided with an extension portion, and the extension portion is provided with first fixing holes evenly distributed thereon; the sealing shell is provided with second fixing holes that are adapted to the first fixing holes.
4. A high-power phase change cold plate according to claim 2, characterized in that, The device includes a preheating component; the preheating component has a connecting hole for conveying coolant to a distribution component; the preheating component includes a first guide protrusion, a second guide protrusion, and an annular flow channel; the first guide protrusion and the second guide protrusion abut against the distribution component and, together with the sealing shell, form an inflow chamber and an outflow chamber; the first guide protrusion and the second guide protrusion guide the coolant through the connecting hole and guide the coolant through the inflow chamber into the distribution component; the outflow chamber is used to discharge the steam generated during cooling.
5. A high-power phase change cold plate according to claim 4, characterized in that, The annular flow channel is capable of conveying coolant that comes into contact with the heat transfer section; the annular flow channel is connected to a plurality of the communicating holes.
6. A high-power phase change cold plate according to claim 4, characterized in that, The liquid separation assembly includes a liquid separation unit; the liquid separation unit includes a first channel and a second channel; the first channel and the second channel are arranged alternately; the first channel is connected to the inflow chamber; the second channel is connected to the discharge chamber.
7. A high-power phase change cold plate according to claim 4, characterized in that, The sealing shell is provided with an inlet pipe, a outlet pipe and an outlet; the preheating component is provided with an inlet that matches the outlet.
8. A high-power phase change cold plate according to claim 1, characterized in that, The heat transfer teeth gradually decrease in size in the direction away from the heat transfer part; the heat transfer teeth are provided with first side surfaces symmetrically on both sides.
9. A high-power phase change cold plate according to claim 8, characterized in that, The heat transfer grooves are arranged on the first side surface in a direction away from the heat transfer part; the number of heat transfer grooves on a single first side surface is not less than two.
10. A liquid cooling method for a high-power phase change cold plate as described in any one of claims 1-9, wherein the high-power phase change cold plate further comprises a preheating component and a sealing shell, the preheating component being provided with a connecting hole and an inlet for conveying coolant to a liquid distribution component, and the sealing shell being provided with an inlet pipe and an outlet pipe, characterized in that, include: Coolant is pumped into the inlet pipe through the pump body; Coolant enters the preheating assembly through the inlet on the preheating assembly; The heating chip preheats the coolant in the preheating component through the heat transfer section; The preheated coolant enters the liquid distribution assembly through the connecting hole; Coolant flows through the liquid flow channel in the liquid distribution assembly and evaporates to generate bubbles; The air bubbles are discharged through the discharge pipe on the sealed shell.