Method of forming a power module connection

Abstract

A method of forming a power module connection includes: removing an electrically insulating coating from each of a first section and a second section of an elongated electrical conductor; bending the elongated conductor in one or more dimensions to form a bent section of the elongated conductor; cutting off the curved sections of the elongated electrical conductor from the block of elongated electrical conductor such that each of the first and second sections of the elongated electrical conductor is at or between the ends of the cut-off curved sections; fixing the curved section to a frame of the power module; attaching the frame to a substrate of the power module; attaching at least one power semiconductor die to the substrate; and attaching the first section to the substrate or the power semiconductor die.

Description

Background Technology

[0001] Demand for electronic modules (commonly known as power modules) for power applications continues to grow rapidly across numerous industries, including automotive, consumer electronics, renewable energy, manufacturing, and medical. Advances in semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) have enabled the manufacture of such power modules, offering advantages such as smaller footprint, higher voltage and current capabilities, and faster switching speeds.

[0002] A power module typically includes one or more power semiconductor dies attached to a substrate and encapsulated in a housing, and one or more power module connections providing an externally accessible electrical interface to the power semiconductor dies. Specifically, each power module connection includes an internal end attached to the substrate (e.g., to a trace or pad) or the power semiconductor die, and an external end providing an external connection interface (e.g., pins, nuts, a section of wire), wherein the internal and external ends are connected by an elongated conductor, or in some cases, they are themselves ends of the elongated conductor. Some applications of power modules require specific layouts for the external connection interfaces, and some substrates used in power modules have a fixed layout of pads and / or traces electrically coupled to the power semiconductor dies. Power modules with fixed locations for both the external connection interfaces and the substrate pads / traces therefore require the power module connections to be designed and constructed accordingly to accommodate these fixed layouts, which typically necessitates changes in design and tooling to manufacture these connections, potentially increasing manufacturing cycle time and cost. In addition, methods for electrically isolating the power modules connected inside the housing of the power module (e.g., applying an electrically insulating gel) may increase manufacturing costs and, in some cases, be associated with reliability issues.

[0003] Therefore, there is a need for a cost-effective and short-cycle solution to form reliable power module connections that can be customized for various external connection interfaces and internal pad / trace layouts. Summary of the Invention

[0004] According to an embodiment of a method for forming a power module connection, the method includes: removing an electrically insulating coating from each of a first segment and a second segment of an elongated conductor; bending the elongated conductor in one or more dimensions to form a bent segment of the elongated conductor; cutting the bent segment of the elongated conductor from a block of the elongated conductor such that each of the first segment and the second segment of the elongated conductor is located at an end of the cut bent segment or between the ends of the cut bent segment; securing the bent segment to a frame of the power module; attaching the frame to a substrate of the power module; attaching at least one power semiconductor die to the substrate; and attaching the first segment of the elongated conductor to the substrate or one of the power semiconductor dies.

[0005] According to an embodiment of a power module, the power module includes: at least one power semiconductor die attached to a substrate; a frame attached to the substrate; and an elongated conductive segment fixed to the frame and including: a first exposed segment; a second exposed segment; an unexposed segment bent in one or more dimensions; and an electrically insulating material that coats the unexposed segment but not the first or second exposed segment, wherein the first exposed segment of the elongated conductive segment is attached to the substrate.

[0006] Those skilled in the art will recognize additional features and advantages upon reading the following detailed description and upon viewing the accompanying drawings. Attached Figure Description

[0007] The elements in the accompanying drawings are not necessarily proportional to each other. The same reference numerals denote corresponding identical parts. Features of the various illustrated embodiments can be combined unless they are mutually exclusive. Embodiments are shown in the accompanying drawings and described in detail below.

[0008] FIGS. 1A-1D A view of a power module according to an embodiment is shown.

[0009] FIGS. 2A-2F A bent section forming a power module connection according to an embodiment is shown.

[0010] FIGS. 3A-3G A bent section forming a power module connection according to an embodiment is shown.

[0011] FIGS. 4A-4D A bent section forming a power module connection according to an embodiment is shown.

[0012] FIG. 5 A bent section forming a power module connection according to an embodiment is shown.

[0013] FIG. 6A and FIG. 6B A bent section forming a power module connection according to an embodiment is shown.

[0014] FIGS. 7A-7E A cross-sectional view of an elongated conductor according to an embodiment is shown.

[0015] FIG. 8 A substrate for attaching a power semiconductor die to a power module is shown according to an embodiment.

[0016] FIGS. 9A-9E The diagram illustrates a bent section, according to an embodiment, securing the power module to a frame.

[0017] FIG. 10 The illustration shows a section of a frame and an elongated conductor, bent and fixed to the frame, attached to a substrate to generate a power module, according to an embodiment.

[0018] FIG. 11 An example is shown of adding insulating gel to the volume of a power module according to an embodiment. Detailed Implementation

[0019] This document describes a power module having power module connections with each of its bent segments including pre-insulated elongated conductors, and a method for manufacturing such power module connections. According to the embodiments described herein, each pre-insulated elongated conductor segment of the power module connection includes one or more bends that allow the segment to span the distance between internal and external connection points of the power module. Hereinafter, these segments will be referred to as bent segments. The term "bend profile" is used herein to describe the shape, location, angle, number, and other properties of the bends of a particular bent segment. One or more power module connections of a particular power module may include one or more bent segments having a bend profile that differs from the bend profiles of one or more other bent segments to accommodate the layout of the external and internal connections of the particular power module.

[0020] According to the embodiments described herein, curved segments with different bending profiles can be sequentially formed using a single manufacturing tool. This method provides the ability to rapidly change the design of the curved segments with simple procedural variations, enabling faster manufacturing of power module connections to accommodate power modules with different external and internal connection layouts. This reduces processing and manufacturing costs and manufacturing cycle times, for example, by reducing or eliminating the time required for design, production, and / or process modification. The ability to sequentially produce curved segments with different designs simplifies manufacturing by enabling the production of all power module connections for a given power module within a shorter timeframe (e.g., compared to batch processing of power module connections of a single design), potentially providing further cost and cycle time advantages. Furthermore, using a programmable manufacturing tool to form curved segments allows for greater complexity and / or improved accuracy in the arrangement of the curved segments in the power module connection design compared to other methods of producing power module connections, and allows for greater flexibility in the shape (e.g., cross-section) of the elongated conductors used to form the curved segments.

[0021] Next, with reference to the accompanying drawings, exemplary embodiments of the power module and the method for forming a connection between the power modules are described.

[0022] FIGS. 1A-1D A view of a power module 100 according to an embodiment is shown. Specifically, FIG. 1A A perspective view of the power module 100 is shown. FIGS. 1B-1D A cross-sectional side view of the power module 100 is shown.

[0023] The power module 100 includes at least one power semiconductor die 110 attached to a substrate 120. For illustrative purposes, in FIGS. 1A-1D Two power semiconductor dies 110 are shown in the power module 100 described herein, but any example of the power module 100 described herein (including...) FIGS. 1A-1D The examples shown may include only one power semiconductor 110 or two or more power semiconductor dies 110. The power semiconductor dies 110 are encapsulated within a volume 105 defined by a substrate 120 and a frame 130. In this example, the frame 130 may be attached to the substrate 120 along its outer perimeter using glue, tape, or other adhesives, soldering, etc. Alternatively, the substrate may be mounted to a base plate (not shown) via solder, adhesive, sintering, etc., and the frame 130 may be mounted to the base plate via threaded fasteners, adhesives, or other suitable fastening methods. The power module 100 may include a top, cover, cap, or other structure defining the opposite side of the volume 105 from the substrate 120. This top, cover, cap, or other structure may be integrated with the frame 130 or may be provided as a separate component, but its... FIGS. 1A-1DThe details are omitted to better illustrate the features enclosed in volume 105.

[0024] Each power semiconductor die 110 may include one or more devices, such as one or more transistors, diodes, resistors, capacitors, and / or other types of active or passive devices. One or more power semiconductor dies included in the power module 100 may be vertical power semiconductor dies (e.g., vertical power transistor dies). For a vertical power transistor die, the primary current flow path is between the front and back sides of the power semiconductor die 110 (along...). FIG. 1A (in the z-direction). In one embodiment, one or more power semiconductor dies 110 are SiC transistor dies, such as SiC power MOSFETs (metal-oxide-semiconductor field-effect transistors). One or more power semiconductor dies 110 included in the power module 100 may be Si power MOSFET dies, HEMT (high electron mobility transistor) dies, IGBT (insulated-gate bipolar transistor) dies, JFET (junction field-effect transistor) dies, etc. If the power module 100 includes more than one power semiconductor die 110, the power semiconductor dies 110 may all have similar or identical designs (e.g., device type, structure, material, size, etc.), or some or each of the power semiconductor dies 110 may have different designs. Various arrangements of the power semiconductor dies 110 of the power module 100 are considered. Each power semiconductor die 110 included in the power module 100 and / or its constituent parts may be arranged to form all or part of the circuitry of the power module 100, such as a DC / AC inverter, DC / DC converter, AC / DC converter, DC / AC converter, AC / AC converter, multiphase inverter, H-bridge, motor driver, etc. In some examples, the power module 100 includes more than one power semiconductor die 110, and the circuitry including the power semiconductor die 110 is a half-bridge or full-bridge circuit.

[0025] Examples of substrate 120 include DCB (Direct Copper Bond) or AMB (Active Metal Brazing) substrates, printed circuit boards (PCBs), lead frames, or other substrates (e.g., insulated metal substrates (IMS)). The substrate 120 shown herein includes a metallization layer 122 comprising metal (e.g., copper, aluminum, alloy) pads, traces, and / or islands that can be electrically coupled (e.g., directly coupled, electrically coupled via bonding wires, metal strips, or other conductors) to one or more power semiconductor dies in power semiconductor die 110.

[0026] Frame 130 may comprise one or more pieces of metal, plastic, composite material, and / or other suitable materials. In some examples, frame 130 is an electrically insulating frame, such as an electrically insulating molded frame. In one embodiment, frame 130 is an electrically insulating molded frame formed of a molding compound. The molding compound is typically a plastic sealant formed of an organic resin such as epoxy resin. The plastic sealant may include fillers such as non-molten inorganic materials. A catalyst may be used to accelerate the curing reaction of the organic resin. Other materials such as flame retardants, adhesion promoters, ion trapping agents, stress relievers, colorants, etc., may be suitably added to the plastic sealant. The molding compound may be formed by injection molding, compression molding, film-assisted molding (FAM), reaction injection molding (RIM), resin transfer molding (RTM), blow molding, etc.

[0027] According to an embodiment, the power module 100 includes a plurality of power module connections, each power module connection including an elongated conductive segment 140 (e.g., a section of wire or strip, an elongated strip, or other elongation) fixed to a frame 130. Each elongated conductive segment 140 includes a first exposed segment 141, a second exposed segment 142, and an unexposed segment 144, and is bent in one or more dimensions. An electrical insulating material 145 (e.g., polyetheretherketone (PEEK), polyimide (PI), polyphenylene sulfide (PPS), etc.) coats the unexposed segment 144, but not the first exposed segment 141 or the second exposed segment 142.

[0028] The first exposed segment 141 of each elongated conductive segment 140 is attached to a power semiconductor die in the substrate 120 or power semiconductor die 110, and thus electrically couples each elongated conductive segment 140 to one or more power semiconductor dies 110. FIG. 1A In the example of power module 100, the first exposed segments 141 of the elongated conductive segments 140 are each attached to the metallization layer 122 of the substrate 120. However, examples are considered where one or more of the first exposed segments 141 are attached to other features of the substrate 120 or even directly attached to one or more power semiconductor dies 110. The metallization layer 122 of the substrate 120 may be patterned as an island structure (e.g., as shown in the image). FIGS. 1B-1D As shown), to support different potentials (e.g., source, drain, and gate potentials).

[0029] Each elongated conductive segment 140 is secured to the frame 130 such that the second exposed segment 142, or optionally the connection interface 150 attached to the second exposed segment 142, is at least partially exposed from the surface 130 of the frame 130. SExposure. In such an arrangement, each second exposed section 142 or connection interface 150 provides an externally accessible interface for attaching the power module 100 to an external component or assembly (e.g., a busbar or printed circuit board) and electrically coupling one or more power semiconductor dies 110 of the power module 100 to the external component or assembly via the extended conductive section 140.

[0030] As described above, the connection interface 150 shown herein is optional and not a requirement for power module connection. That is, in some examples, the second exposed section 142 of one or more extended conductive sections 140 of the power module 100 may be at least partially exposed from surface 130. S The second exposed section 142 of such an elongated conductive section 140 is exposed, and external parts or components can be directly attached to it (e.g., by welding or press-fit connection). In the example of the power module 100 described herein, each connection interface 150 is a nut, such as a screw-type terminal for the power module 100. Other examples of connection interfaces 150 include rivets, screws, connecting tabs, or pins. The connection interfaces 150 of the power module 100 may all be of a single type, or they may be of different types.

[0031] FIGS. 1B-1D Cross-sectional side views of the elongated conductor segment 140 and its arrangement in the power module 100 are shown. However, it should be understood that the examples presented herein are not limiting, and other configurations and / or arrangements can be considered (e.g., FIGS. 1B-1D Various combinations of the elongated conductive segment 140 shown in the figure).

[0032] exist FIG. 1A In each example, the first exposed segment 141 of each elongated conductive segment 140 is attached to the substrate 120, specifically to the metallization layer 122 of the substrate 120. (See reference...) FIG. 1B The description considers examples of one or more first exposed segments 141 being attached to the substrate 120 or directly attached to one or more power semiconductor dies 110.

[0033] exist FIG. 1B In this example, the first exposed segment 141 and the second exposed segment 142 are each located at the end of the conductive segment 140, wherein an unexposed segment 144 extends between the first exposed segment 141 and the second exposed segment 142. A connection interface 150 (a nut in this example) is attached to each of the second exposed segments 142 and extends at least partially from the surface 130 of the frame 130. S While exposed, as mentioned earlier, other types of connection interfaces 150 can be used. Additionally, besides connection interface 150, FIG. 1CThe second exposed section 142 of one or more elongated conductive sections 140 of the power module 100 shown can be at least partially exposed from the surface 130. S Exposure.

[0034] exist FIG. 1C In the example, the first exposed section 141 is an intermediate section located between the ends of the conductive section 140. FIG. 1C Each conductive segment 140 includes a third exposed segment 143 located at the end of the conductive segment 140, wherein each first exposed segment 141 is located between a second exposed segment 142 and a third exposed segment 143 of the corresponding conductive segment 140. A connection interface 150 (a nut in this example) is attached to each third exposed segment 143 and at least partially extends from the surface 130 of the frame 130. S While exposed, as mentioned earlier, other types of connection interfaces 150 can be used. Additionally, besides connection interface 150, FIG. 1D The third exposed section 143 of one or more elongated conductive sections 140 of the power module 100 shown can be at least partially exposed from the surface 130. S Exposure.

[0035] exist FIG. 1D In this example, the first exposed section 141 and the second exposed section 142 are each located at the end of the corresponding conductive section 140. Each conductive section 140 includes a third exposed section 143, which is an intermediate section located between the first exposed section 141 and the second exposed section 142. A connection interface 150 (a nut in this example) is attached to each third exposed section 143 and is at least partially exposed from the surface 130 of the frame 130. S While exposed, as mentioned earlier, other types of connection interfaces 150 can be used. Additionally, besides connection interface 150, FIG. 1D The third exposed section 143 of one or more elongated conductive sections 140 of the power module 100 shown can be at least partially exposed from the surface 130. S Exposure. In FIGS. 1A-1D In the example, both the first exposed segment 141 and the second exposed segment 142 of each elongated conductive segment 140 are attached to the substrate 120, specifically to the metallization layer 122 of the substrate 120. Examples are also considered where one or more of the first exposed segment 141 and / or the second exposed segment 142 are attached to other features of the substrate 120 or directly attached to one or more power semiconductor dies 110.

[0036] exist FIGS. 9A-9D In the example of power module 100, a portion of each elongated conductor segment 140 and a portion of each connection interface 150 are embedded in frame 130. (See reference...)FIG. 9E In more detail, securing the elongated conductive segment 140 to the frame 130 in this manner can be achieved by forming the frame 130 with a molding compound (i.e., forming a molded frame 130) and inserting portions of the elongated conductive segment 140 and the connection interface 150 into the mold while forming the molded frame 130. Other methods of securing the elongated conductive segment 140 to the frame 130 are also considered. (See reference...) FIGS. 1B-1D To describe some of these methods.

[0037] like FIG. 1D As shown, the power module 100 may include an insulating gel 160 that at least partially fills a volume 105. The insulating gel 160 is disposed in the volume 105 such that the substrate 120 and the first exposed section 141 of each elongated conductive segment 140 are at least partially covered by the gel 160. FIGS. 1A-1D In the example, the second exposed section 142 of each elongated conductive segment 140 is also at least partially covered by the gel 160. Since the unexposed sections 144 of each elongated conductive segment 140 are coated with an electrically insulating material 145, at least the upper portions of both the unexposed sections 144 and the second exposed section 142 may not be covered by the gel 160. The insulating gel 160 is made of a different material than the electrically insulating material 145 coating the elongated conductive segments 140. For example, the insulating gel 160 may be a potting compound.

[0038] This includes insulating gels (e.g., insulating gel 160 of power module 100) to electrically insulate those features of the power module that have exposed electrical conductors (e.g., the substrate with traces and / or contact pads, the semiconductor die itself, and any non-insulated power module connections). Non-insulated power module connections are used (e.g., those non-insulated power module connections made by stamping or punching metal sheets) but are otherwise similar. FIGS. 1A-1D The exemplary power module of power module 100 may require an amount of insulating gel sufficient to cover most of the non-insulated power module connections. Conversely, as... FIGS. 1A-1D The power module connection of the power module 100, which is formed from an elongated conductive segment 140 partially coated with an electrically insulating material 145 and incorporating a portion of the elongated conductive segment 140 into the frame 130, allows for the use of less insulating gel 160. Specifically, the frame 130 of the power module 100 provides electrical isolation for the exposed second segment 142, and the electrically insulating material 145 provides electrical isolation for the unexposed segment 144 of the elongated conductive segment 140.

[0039] Therefore, for FIGS. 1A-1DIn the power module 100, besides the power semiconductor die 110 and the metallization layer 122 of the substrate 120, only insulating gel 160 is needed to cover and electrically isolate the first exposed section 141 of the elongated conductive section 140. In some examples, the insulating gel 160 is used to fill the volume 105 to a depth d of less than 10 mm, which is sufficient to cover and electrically isolate the first exposed section 141, wherein the depth d is from the surface 120 of the substrate 120 to which the first exposed section 141 is attached. S (In this example, the surface 120 of the metallization layer 122) S (Measured). In some examples of the power module 100, an insulating gel 160 is used to fill the volume 105 to a depth d of less than 5 mm, sufficient to cover and electrically isolate the first exposed section 141 of the elongated conductive section 140. Therefore, FIGS. 1A-1D The power module 100 shown can provide adequate insulation for the power module connections by requiring less insulating gel 160, thereby providing material cost savings. Additionally, using less insulating gel 160 can reduce the risk of failure associated with cracking and / or overflow of the insulating gel 160, potentially providing reliability advantages in addition to material cost savings.

[0040] The remainder of this disclosure describes and illustrates the formation FIGS. 2A-2F An exemplary method for connecting the power module 100 in the diagram is shown. It should be noted that the x, y, and z axes are included in the following figures for reference, but do not necessarily correspond to the axes in the diagram. FIGS. 2A-2F The x, y, and z axes in the diagram.

[0041] FIGS. 1A-1D A method for forming a bent segment 140 of a power module connection according to an embodiment is shown. FIGS. 1A-1D The method for forming the curved segment 140 is to form FIGS. 1A-1D An example of an elongated conductive segment 140 (e.g., bending the elongated conductive segment 140 in one or more dimensions) is given below, and the term "bent segment" is used hereinafter in place of "elongated conductive segment" for simplicity in the following description. Therefore, it should be understood that any bent segment 140 described herein can be... FIGS. 2A-2F An example of the elongated conductive segment 140 of the power module 100. Furthermore, any feature of the bent segment 140 may correspond to... FIG. 2A The elongated conductive segment 140 in the middle has similar numbered features. Additionally, FIG. 2A The steps can be performed in a different order than those shown. Some such examples will be described.

[0042] FIGS. 2A-2FAn elongated conductor 40 with an electrically insulating coating 145 is shown. The elongated conductor 40 can be any conductive wire, strip, elongated bar, or other elongation. The elongated conductor 40 can be formed of a metal such as copper, aluminum, alloy, etc., and can be provided on a spool or in other bulk form. FIG. 2A In the example, the end of the elongated conductor 40 passes through and extends from the opening of the machine 10. As will be described in more detail later, the machine 10 may be configured to complete... FIG. 2B All steps shown can be performed using any equipment, from manual or automatic wire feeders to manufacturing tools. FIG. 2B The elongated conductor 40 shown may be referred to as the block of the elongated conductor 40 in subsequent steps.

[0043] FIGS. 2A-2F A first segment 141 and a second segment 142 of the elongated conductor 40, which will be referenced in this step and subsequent steps, are identified. In this example, the second segment 142 is located at the end of the elongated conductor 40 extending from the opening of the machine 10, and the first segment 141 is positioned inward from the second segment 142 along the elongated conductor 40.

[0044] FIG. 2C The image shows the elongated conductor 40 after the electrical insulating coating 145 has been removed from the second segment 142 of the elongated conductor 40 by tool 10 (e.g., using wire stripping techniques). At this point, the second segment 142 is located in the position after the... FIG. 2C The method shown will result in the position of the second end 42 of the curved segment 140.

[0045] FIG. 2C The attachment of the connection interface 150 to the second segment 142 of the elongated conductor 40 is shown. As previously mentioned, the connection interface 150 is optional, and therefore FIG. 2C The steps shown are also optional. Additionally, although in FIGS. 2C-2F The steps show attaching the connection interface 150 to the second segment 142 of the elongated conductor 40, but at any step after the electrical insulating coating 145 is removed from the second segment 142 of the elongated conductor 40, the connection interface 150 may be attached to the second segment 142.

[0046] like FIG. 1A The second segment 142 of attaching the connection interface 150 to the elongated conductor 40 may include welding, diffusion welding, sintering, gluing, soldering, crimping, etc., of the connection interface 150 to the second end 42. FIG. 1B The connection interface 150 shown is a nut, but as previously referenced FIG. 2D and FIG. 2E The connection interface 150 can be a rivet, screw, tab, pin or other type.

[0047] FIGS. 2A-2F The diagram illustrates bending an elongated conductor 40 in one or more dimensions (x, y, and / or z) to form a bent segment 140. Bending may include twisting the elongated conductor 40 in any of the x, y, and / or z dimensions.

[0048] FIG. 2F The image shows the elongated conductor 40 after the electrical insulating coating 145 has been removed from the first segment 141 of the elongated conductor 40 by tool 10 (e.g., using wire stripping techniques). At this point, the first segment 141 is located in the position after the removal of the electrical insulating coating 145 from the first segment 141 of the elongated conductor 40. FIGS. 1A-1D The method shown will be the location of the first end 41 of the bent segment 140. In some examples, the electrically insulating coating 145 may be removed from the first segment 141 before or simultaneously with the removal of the electrically insulating coating 145 from the second segment 142 of the elongated conductor 40.

[0049] FIGS. 1A-1D The diagram shows a bent section 140 cut from the block of the elongated conductor 40. At this point, the bent section 140 becomes... FIGS. 1A-1D An example of the elongated conductive segment 140 in which the first segment 141 (corresponding to) has its electrical insulating coating 145 removed. FIGS. 1A-1D The first exposed section 141 or the second exposed section 142), and the second section 142 where the electrical insulating coating 145 is removed (corresponding to) FIGS. 1A-1D The first exposed section 141 or the second exposed section 142), the unexposed section 144, and the electrical insulating material 145 coated on the unexposed section 144 (i.e., FIGS. 1A-1D (145) Electrically insulating coating in the middle.

[0050] Unless otherwise stated, for example when describing the attachment of the bent segment 140 to the substrate 120, the first segment 141 and the second segment 142 of the bent segment 140 will be described and explained below, respectively, to correspond to FIGS. 4A-4D The first exposed section 141 and the second exposed section 142 of the elongated conductive section 140 in the document. However, it should be noted that the first section 141 and the second section 142 of the curved section 140 shown herein may each correspond to... FIGS. 2A-2F Any one of the exposed sections 141, 142, or 143 of the extended conductive section 140 of the power module 110. (Refer to...) FIGS. 3A-3G Describe an example of this.

[0051] As mentioned earlier, in some examples, FIGS. 3A-3GThe steps in the diagram may be performed in a different order than those shown. Additionally, forming the bent segment 140 may include variations of the steps shown and / or may include additional steps. For example, instead of attaching the connection interface 150 to the second segment 142 of the bent segment 140, or in addition to attaching the connection interface 150 to the second segment 142 of the bent segment 140, the connection interface 150 may be attached to the first segment 141 of the bent segment 140. Forming the bent segment 140 may include processing one or both of the first segment 141 and / or the second segment 142 of the bent segment 140. Examples include: processing the first segment 141 and / or the second segment 142 for soldering (e.g., hot air solder leveling (HASL or HAL) process), plating the first segment 141 and / or the second segment 142, pre-attaching solder to the first segment 141 and / or the second segment 142, and adding a second conductive layer or other metallic body to expand the contact. Other examples will be described with reference to the following figures.

[0052] FIGS. 2A-2F A bent section 140 forming a power module connection according to an embodiment is shown. Specifically, FIGS. 2A-2F The steps shown illustrate the formation FIGS. 3A-3G An alternative example of the steps in the bent segment 140 shown. (Compared to...) FIGS. 3A-3G The steps are the same as in the previous one. FIGS. 2A-2F The steps can be completed in a different order than shown. Unless otherwise stated, complete... FIG. 3A The details of the steps are similar to FIG. 2A The corresponding steps in the process.

[0053] FIG. 3B (corresponding to) FIG. 2B The diagram shows an elongated conductor 40 having an electrically insulating coating 145. FIG. 3C (corresponding to) FIG. 2D This shows the removal of the electrically insulating coating 145 from the second segment 142 of the elongated conductor 40. FIG. 3D (corresponding to) FIG. 3E This illustrates bending the elongated conductor 40 in one or more dimensions to form a bent segment 140. FIG. 2E The second segment 142 of the elongated conductor 40 is shown to bend in one or more dimensions (x, y and / or z). FIG. 3F (corresponding to) FIG. 3G This shows the removal of the electrically insulating coating 145 from the first segment 141 of the elongated conductor 40. FIG. 2F The diagram illustrates bending the first segment 141 in one or more dimensions, which may include the torsion of the elongated conductor 40. FIG. 3D (corresponding to) FIG. 3F The diagram shows a bent segment 140 cut from the block of the elongated conductor 40.

[0054] like FIGS. 4A-4D and FIGS. 4A-4D The bending of the second segment 142 and the first segment 141 of the elongated conductor 40, as shown, can be accomplished to form the respective first segment 141 and second segment 142 for contact during subsequent processing (e.g., with the substrate 120 having external parts or components). For example, one or both of the first segment 141 and the second segment 142 can be bent into a helix to form a thread, a U-shape, a V-shape, or a radial helix, spring-loaded contact, etc., for a flat contact geometry.

[0055] FIGS. 2A-2F A bent section forming a power module connection according to an embodiment is shown. Specifically, FIGS. 3A-3G The steps shown illustrate the formation FIG. 2E and FIG. 3E An alternative example of the steps of the bent segment 140 shown is that the electrically insulating coating 145 is removed from the third segment 143 of the elongated conductor 40.

[0056] Corresponding to FIG. 4A and FIGS. 4B-4C , FIGS. 4A-4D The image shows the elongated conductor 40 after the tool 10 has removed the electrically insulating coating 145 from both the second section 142 and the first section 141 of the elongated conductor 40.

[0057] FIG. 4B The image shows the elongated conductor 40 after the electrical insulating coating 145 has been removed from the third segment 143 of the elongated conductor 40 by tool 10 (e.g., using wire stripping techniques). At this point, the third segment 143 is in the position of having completed... FIG. 1C The method shown will become the location of the first end 41 of the bent section 140, and the first section 141 becomes the middle section of the bent section 140 between the second section 142 and the third section 143. The electrical insulating coating 145 can be removed from the third section 143 before, after, or simultaneously with the removal of the electrical insulating coating 145 from the first section 141 and the second section 142 of the elongated conductor 40. FIG. 4C In this example, connection interface 150 is attached to third segment 143. This exemplary step can correspond to forming FIG. 1D The elongated conductor 40 in the middle. FIG. 4C An example is shown where the connection interface 150 is attached to the first segment 141 instead of the second segment 142. This exemplary step can correspond to the formation of FIG. 1D The elongated conductor 40 in the middle, wherein, FIG. 4D The first segment 141 in the middle corresponds to FIG. 1CThe third exposed section 143. Other steps may be performed on the third section 143, such as welding the third section 143 and / or bending the third section 143 in one or more dimensions for contact, as previously described.

[0058] FIG. 1D The diagram shows a bent section 140 cut from the block of the elongated conductor 40. At this point, the bent section 140 becomes... FIG. 1C and FIG. 1D An example of the elongated conductive segment 140 in which the first segment 141 (corresponding to) has its electrical insulating coating 145 removed. FIG. 1C The first exposed section 141 or FIG. 1D The third exposed section 143 and the second section 142 (corresponding to the section where the electrical insulating coating 145 is removed) are exposed. FIG. 1C The second exposure segment 142 or the third exposure segment 143, or FIG. 1D The second exposed section 142 or the first exposed section 141, and the third exposed section where the electrical insulating coating is removed (corresponding to...) FIG. 1C The third exposure segment 143 or the second exposure segment 142, or FIG. 1D The first exposed section 141 or the second exposed section 142), the unexposed section 144, and the electrically insulating coating 145 covering the unexposed section 144 (i.e., FIG. 5 and FIG. 5 (145) Electrically insulating coating in the middle.

[0059] FIG. 2D A bent section 140 forming a power module connection according to an embodiment is shown. Specifically, FIG. 3C An example is shown of bending the elongated conductor 40 in one or more dimensions to form a bent segment 140 (e.g., in...). FIG. 6A and FIG. 6B (During the steps shown). In this example, bending the elongated conductor 40 in one or more dimensions includes twisting the elongated conductor 40 about its longitudinal axis L. In this example, a segment along the longitudinal axis L parallel to the x-direction forms a first twist t1 and a second twist t2 in opposite directions, causing the segment of the elongated conductor 40 that initially extends parallel to the z-direction to be bent to extend parallel to the y-direction. This is only one example, and other variations and combinations of bending positions, angles, directions, etc., can be considered.

[0060] FIG. 6A and FIG. 6B A bent section forming a power module connection according to an embodiment is shown. Specifically, FIGS. 2A-2F and FIGS. 3A-3G A first curved segment 1401 with a first curved profile is identified, which may be in FIG. 6A orFIG. 6B The diagram shows a curved segment 140 formed in the first curved segment 1401, and a second curved segment 1402 having a second curved profile different from the first curved segment 1401. The second curved segment 1402 can be formed from the same elongated conductor 40 using the same method as that used to form the first curved segment 1401, and can be formed sequentially with the first curved segment 1401. FIG. 6A The diagram illustrates the removal of the electrically insulating coating 145 from the third and fourth segments 147 and 148 of the elongated conductor 40, and the bending of the elongated conductor 40 in one or more dimensions to form a second bent segment 1402. At this point, the fourth segment 148 is located at the position of the second end 42 that will become the second bent segment 1402 when the method shown herein is completed.

[0061] Similar to the first bend 1401, the same method used to attach the connection interface 150 to one or both of the second section 142 or the first section 141 of the first bend 1401 can be used to attach the connection interface 150 to one or both of the fourth section 148 or the third section 147 of the second bend 1402.

[0062] FIG. 6B The diagram shows a second bent segment 1402 cut from the block of the elongated conductor 40, such that a third segment 147 is located at a first end 41 of the second bent segment 1402, and a fourth portion 148 is located at a second end 42 of the second bent segment 1402.

[0063] exist FIGS. 2A-5 and FIGS. 4A-4D The formation of the second curved segment 1402 may include the previously referenced FIGS. 2A-6B Any variations thereof. For example, the third segment 147 and / or the fourth segment 148 may be intermediate segments located between the first end 41 and the second end 42 of the second curved segment 1402. Furthermore, the second curved segment 1402 may include one or more additional segments where the electrical insulating coating 145 has been removed, for example, as... FIGS. 2A-6B As shown.

[0064] As mentioned above, FIGS. 4A-4D Machine 10 in the middle can be constructed to complete FIGS. 6A-6B A single manufacturing tool is used for all the steps shown. That is, from the section of the elongated conductor 40 ( FIG. 6A The first section 141, the second section 142, and the third section 143 are described. FIG. 6BThe electrical insulating coating 145 is removed from the third section 147 and the fourth section 148 (e.g., in the third section and fourth section 148), causing the elongated conductor 40 to bend in one or more dimensions to form a bent section 140. The bent section 140 can be cut from the block of the elongated conductor 40 using a machine 10. Using such a manufacturing tool to form the bent section 140 can offer numerous manufacturing cost and cycle time advantages. As an example, the machine 10 can perform program-based steps to bend the elongated conductor 40, and thus can produce bent sections 140 with different shapes, sizes, bending positions, and orientations; remove the electrical insulating coating 145 at different locations; sequentially remove different amounts of the electrical insulating coating 145 from different sections, etc., without changing the tooling (e.g., stamping or punching). For example, such a process can be used to sequentially produce... FIGS. 7A-7E and FIGS. 7A-7E The first curved segment 1401 and the second curved segment 1402 in the middle.

[0065] FIG. 7A A cross-sectional view of the elongated conductor 40 according to an embodiment is shown. Specifically, FIG. 7B Each of these illustrates an exemplary cross-section of the elongated conductor 40 used to form the bent segment 140 using the methods described herein.

[0066] FIG. 7C An elongated conductor 40 with a circular cross-section is shown, for example, similar to a circular wire. FIG. 7D An elongated conductor 40 with a square cross-section is shown, for example, similar to a square wire. FIG. 7E An elongated conductor 40 with a rectangular cross-section is shown, for example, similar to a rectangular wire. FIG. 8 An elongated conductor 40 with an elliptical cross-section is shown, for example, similar to an elliptical wire.

[0067] FIG. 8 An elongated conductor 40 with a flat profile is shown, for example, resembling a strip. This example elongated conductor has a width w in a first direction d1 perpendicular to the longitudinal axis L of the elongated conductor 40, and a height h in a second direction d2 perpendicular to both the first direction d1 and the longitudinal axis L of the elongated conductor 40, wherein the width w is greater than the height h.

[0068] FIGS. 9A-9E A substrate 120 is shown attached to a power semiconductor die 110 according to an embodiment. As described above, the power module 100 may include two or more power semiconductor dies 110, which may also use... FIGS. 9A-9C The steps shown are attached to the substrate 120. Attaching the power semiconductor die 110 to the substrate 120 may include welding, diffusion welding, soldering, gluing, etc., to the metallization layer of the substrate 120.

[0069] FIGS. 1A-1D A frame 130 is shown that secures a bent section 140, which connects to the power module, to the power module 100 according to an embodiment.

[0070] FIGS. 9A-9C This illustrates fixing the first bent segment 1401 and the second bent segment 1402 to... FIG. 9A The molding frame 130 is introduced in the description. Specifically, FIG. 9B The diagram shows the first bent segment 1401 and the second bent segment 1402 being secured to the molded frame 130 during the formation of the molded frame 130.

[0071] FIG. 9C It is shown that a portion of the first curved segment 1401 and a portion of the second curved segment 1402 are inserted into the mold 20 that is molded to form the molded frame 130.

[0072] FIG. 9D The illustration shows the injection of liquefied molding compound 30 into mold 20, such that portions of the first curved segment 1401 and the second curved segment 1402 are embedded in the liquefied molding compound 30. In this example, the portion of each of the first curved segment 1401 and the second curved segment 1402 embedded in the liquefied molding compound includes a second segment 142 and a second portion 1442 of an unexposed segment 144. In this example, the first segment 141 of each of the first curved segment 1401 and the first portion 1441 of the unexposed segment 144 is not embedded in the liquefied molding compound 30.

[0073] FIGS. 3A-3G A completed molded frame 130 is shown, having a portion of a first curved segment 1401 embedded in the molded frame 130 and a portion of a second curved segment 1402 embedded in the molded frame 130. In this example, the first curved segment 1401 and the second curved segment 1402 are fixed to (in this example, embedded in) the frame 130 such that the connection interface 150 of the second segment 142 attached to each of the first curved segment 1401 and the second curved segment 1402 is at least partially exposed from the surface 130 of the frame 130. S Exposure.

[0074] FIG. 9E An alternative arrangement of the molded frame 130 is shown. In this example, a portion of the unattached connection interface of the bent segment 140 (e.g., using...) FIG. 10 The curved segment formed in the steps shown is embedded in the molded frame 130 such that the second segment 142 of the curved segment 140 is at least partially exposed from the surface 130 of the frame 130. S Exposure.

[0075] FIG. 10 The diagram illustrates securing the bent segment 140 to the frame 130. In this example, the bent segment 140 is secured to the frame 130 after it has been formed. The frame 130 includes a pre-formed support 132 to which the bent segment 140 is secured. The pre-formed support 132 may include elements formed on the inner wall 130 of the frame 130. W Upper and / or inner wall 130 W The notch, ring, clamp, loop, wire harness, recess, and / or other structure. The pre-formed support 132 may be part of the frame 130. In one example of the molded frame 130, the pre-formed support 132 may be formed during the molding process used to form the molded frame 130. In this example, the bent segment 140 is attached to the frame 130 such that the connection interface 150 extends from the surface 130 of the frame 130. S Partially exposed.

[0076] FIG. 10 The illustration shows the attachment of the ends of the frame 130 and the bent segments 1401 and 1402, which are fixed to the frame 130, to a substrate 120 to create a power module 100, according to an embodiment. The substrate 120 to which the frame 130 is attached to the power module 100 may include, for example, gluing or adhesiveting the frame 130 to the substrate 120 along the outer periphery of the substrate 120.

[0077] FIG. 10 The example illustrates attaching a first segment 141 of a first bent segment 1401 and a second bent segment 1402 to a substrate 120, specifically to a metallization layer 122 of the substrate 120. However, FIG. 1C The attachment steps shown may additionally or alternatively include attaching a second segment 142 of the first bent segment 1401 and / or the second bent segment 1402 to the substrate 120, or attaching any segment 141, 142 of the bent segments 1401, 1402 to an exposed contact of the power semiconductor die 110. Furthermore, refer to... FIG. 1D The described steps are not limited to attaching only the first segment 141 at the end of the bent section 140 to the substrate 120. For example, the steps described herein can be used to attach intermediate segments located between the ends of the bent section (e.g., in the formation of...). FIG. 11 (When the power module 100 is in the middle) and multiple sections at the ends of the bent section 140 are attached to the substrate 120 (for example, in the formation of the power module 100) FIG. 11 (Power module 100 in the middle).

[0078] Attaching the first segment 141 or the second segment 142 of each of the first bent segment 1401 and the second bent segment 1402 to the contact pads of the substrate 120 or the power semiconductor die 110 may include soldering (e.g., preformed or solder paste soldering), diffusion soldering, sintering, gluing, bonding (e.g., ultrasonic bonding, narrow-gap bonding, resistance bonding, laser bonding) or other attachment methods. For example, the first segment 141 or the second segment 142 of the first bent segment 1401 and / or the second bent segment 1402 may be press-fitted or interface-fitted into a soldered or bonded interface (e.g., a rivet).

[0079] ​ The illustration shows the addition of insulating gel 160 to volume 105 of power module 100 according to an embodiment. Specifically, ​ The illustration shows the addition of insulating gel 160 to volume 105 after the frame 130 is attached to the substrate 120 of the power module 100. The insulating gel 160 is added to volume 105 such that a first segment 141 of each of the substrate 120 and the first curved segment 1401 and the second curved segment 1402 is at least partially covered by the gel 160. Furthermore, an unexposed segment 144 of each of the first curved segment 1401 and the second curved segment 1402 is at least partially not covered by the insulating gel 160. The insulating gel 160 has a portion extending from the surface 120 of the substrate 120. S The measured depth d, the first segment 141 of each of the first curved segment 1401 and the second curved segment 1402 is attached to the surface 120 of the substrate 120. S In some examples, the depth d is less than or equal to 10 millimeters. For example, the depth d can be less than or equal to 5 millimeters.

[0080] Although this disclosure is not limited thereto, the examples numbered below illustrate one or more aspects of this disclosure.

[0081] Example 1: A method for forming a power module connection includes: removing an electrically insulating coating from each of a first segment and a second segment of an elongated conductor; bending the elongated conductor in one or more dimensions to form a bent segment of the elongated conductor; cutting the bent segment of the elongated conductor from a block of the elongated conductor such that each of the first segment and the second segment of the elongated conductor is located at an end of the cut bent segment or between the ends of the cut bent segment; securing the bent segment to a frame of the power module; attaching the frame to a substrate of the power module; attaching at least one power semiconductor die to the substrate; and attaching the first segment of the elongated conductor to the substrate or one of the power semiconductor dies.

[0082] Example 2: According to the method of Example 1, wherein the bent segment is fixed to the frame such that the second segment of the elongated conductor is at least partially exposed from the surface of the frame.

[0083] Example 3: According to the method of Example 1 or 2, it further includes: attaching the connection interface to a second segment of the elongated conductor, wherein the bent segment is fixed to the frame such that the connection interface is at least partially exposed from the surface of the frame.

[0084] Example 4: According to the method of Example 3, the connection interface is one of a nut, rivet, screw or pin.

[0085] Example 5: According to the method of Example 3 or 4, the attachment of the connection interface to the second section of the elongated conductor includes welding, diffusion welding, sintering, gluing, soldering or crimping.

[0086] Example 6: The method according to any one of Examples 1 to 5 further includes: bending a second segment of the elongated conductor in one or more dimensions.

[0087] Example 7: The method according to any one of Examples 1 to 6, wherein attaching the first segment of the elongated conductor to the substrate includes welding, diffusion welding, sintering, gluing or soldering.

[0088] Example 8: The method according to any one of Examples 1 to 7 further includes: bending a first segment of the elongated conductor in one or more dimensions.

[0089] Example 9: The method according to any one of Examples 1 to 8 further includes: removing the electrically insulating coating from a third segment of the elongated conductor, wherein the third segment of the elongated conductor is located at the end of the curved segment or between the ends of the curved segment after the curved segment of the elongated conductor is cut from the block of the elongated conductor.

[0090] Example 10: The method according to Example 9 further includes: attaching a third segment of the elongated conductor to the substrate.

[0091] Example 11: According to the method of Example 9, wherein the bent segment is fixed to the frame such that the third segment of the elongated conductor is at least partially exposed from the surface of the frame.

[0092] Example 12: The method according to Example 9 or 10 further includes: attaching the connection interface to a third segment of the elongated conductor, wherein the bent segment is fixed to the frame such that the connection interface is at least partially exposed from the surface of the frame.

[0093] Example 13: The method according to any one of Examples 1 to 12 further includes: after attaching the frame to the substrate of the power module, adding an insulating gel to the volume defined by the substrate and the frame, such that the first segment of the substrate and the elongated conductor is at least partially covered by the gel, and the portion of the bent segment between the ends of the bent segment is at least partially not covered by the gel.

[0094] Example 14: According to the method of Example 13, the insulating gel has a depth of less than or equal to 5 mm from the surface of the substrate to which the first segment of the elongated conductor is attached.

[0095] Example 15: According to any of Examples 1 to 14, where the frame is an electrically insulating molded frame.

[0096] Example 16: According to the method of Example 15, wherein fixing the curved segment to the molding frame includes: inserting a portion of the curved segment into a mold forming the molding frame during the molding process; and injecting a liquefied molding compound into the mold such that a portion of the curved segment is embedded in the liquefied molding compound.

[0097] Example 17: The method according to any one of Examples 1 to 16, wherein securing the curved segment to the frame includes securing the curved segment to one or more pre-formed notches, rings, clamps, loops, wire harnesses and / or recesses on the inner wall of the frame.

[0098] Example 18: A method according to any one of Examples 1 to 17, wherein bending the elongated conductor in one or more dimensions to form a bent segment comprises: twisting the elongated conductor about the longitudinal axis of the elongated conductor.

[0099] Example 19: According to any one of Examples 1 to 18, wherein the cross-section of the elongated conductor is circular, square, rectangular or elliptical.

[0100] Example 20: According to the method of any one of Examples 1 to 19, the elongated conductor has a flat profile having a width in a first direction perpendicular to the longitudinal axis of the elongated conductor and a height in a second direction perpendicular to both the first direction and the longitudinal axis of the elongated conductor, and wherein the width is greater than the height.

[0101] Example 21: A method according to any one of Examples 1 to 20, wherein the bent segment is a first bent segment, and wherein the method further comprises: removing an electrically insulating coating from each of the third and fourth segments of the elongated conductor; bending the elongated conductor in one or more dimensions to form a second bent segment of the elongated conductor; cutting the second bent segment of the elongated conductor from the block of the elongated conductor such that each of the third and fourth segments of the elongated conductor is at an end of the second bent segment or between the ends of the second bent segment; securing the second bent segment to the frame of the power module; and attaching the third segment of the elongated conductor to a substrate.

[0102] Example 22: According to the method of Example 21, wherein the first curved segment has a first curved profile and the second curved segment has a second curved profile different from the first curved profile.

[0103] Example 23: According to the method of Example 21 or 22, wherein the frame is an electrically insulating molded frame, and wherein securing the first curved segment and the second curved segment to the molded frame comprises: inserting portions of the first curved segment and portions of the second curved segment into a mold shaped to form the molded frame during the formation of the molded frame; and injecting a liquefied molding compound into the mold such that portions of the first curved segment and portions of the second curved segment are embedded in the liquefied molding compound.

[0104] Example 24: The method according to any one of Examples 1 to 23, wherein removing the electrically insulating coating from the first and second segments of the elongated conductor, bending the elongated conductor in one or more dimensions to form a curved segment of the elongated conductor, and cutting the curved segment of the elongated conductor from the block of the elongated conductor are accomplished using a single manufacturing tool.

[0105] Example 25: A power module includes: at least one power semiconductor die attached to a substrate; a frame attached to the substrate; and an elongated conductive segment fixed to the frame, and including: a first exposed segment; a second exposed segment; an unexposed segment bent in one or more dimensions; and an electrically insulating material coating the unexposed segment but not the first or second exposed segment, wherein the first exposed segment of the elongated conductive segment is attached to the substrate.

[0106] Example 26: The power module according to Example 25 further includes: an insulating gel that at least partially fills the volume defined by the substrate and the frame, such that a first exposed section of the substrate and the elongated conductive section is at least partially covered by the gel, and a portion of the unexposed section and a portion of the second exposed section are at least partially not covered by the gel, wherein the insulating gel is made of a material different from the electrically insulating material coating of the elongated conductive section.

[0107] Terms such as "first," "second," etc., are used to describe various elements, regions, sections, etc., and are not intended to be limiting. Throughout the specification, the same term refers to the same element.

[0108] As used herein, the terms “having,” “containing,” “including,” “comprising,” etc., are open-ended terms indicating the presence of the said element or feature, but do not exclude additional elements or features. Unless the context clearly indicates otherwise, the articles “a” and “said” are intended to include both plural and singular forms.

[0109] Unless otherwise expressly stated, the expression "and / or" shall be interpreted to include all possible joint and separate combinations. For example, the expression "A and / or B" shall be interpreted to mean only A, only B, or both A and B. Unless otherwise expressly stated, the expression "at least one" shall be interpreted in the same manner as "and / or". For example, the expression "at least one of A and B" shall be interpreted to mean only A, only B, or both A and B.

[0110] It should be understood that, unless otherwise specifically indicated, the features of the various examples described herein can be combined with each other.

[0111] Although specific embodiments have been shown and described herein, those skilled in the art will understand that various alternative and / or equivalent implementations can be used in place of the shown and described specific embodiments without departing from the scope of the invention. This application is intended to cover any modifications or variations of the specific embodiments discussed herein. Therefore, the invention is intended to be limited only by the claims and their equivalents.

Claims

1. A method for forming a power module connection, comprising: Remove the electrical insulating coating from each of the first and second sections of the elongated conductor; The elongated conductor is bent in one or more dimensions to form a bent segment of the elongated conductor; The curved segment of the elongated conductor is cut from the block of the elongated conductor such that each of the first segment and the second segment of the elongated conductor is at the end of the cut curved segment or between the ends of the cut curved segment. The bent section is fixed to the frame of the power module; The frame is attached to the substrate of the power module; At least one power semiconductor die is attached to the substrate; as well as The first segment of the elongated conductor is attached to the substrate or one of the power semiconductor dies.

2. The method according to claim 1, wherein, The bent section is fixed to the frame such that the second section of the elongated conductor is at least partially exposed from the surface of the frame.

3. The method according to claim 1, further comprising: The connection interface is attached to the second section of the elongated conductor. The curved section is fixed to the frame such that the connection interface is at least partially exposed from the surface of the frame.

4. The method according to claim 3, wherein, The connection interface is one of a nut, rivet, screw, or pin.

5. The method according to claim 3, wherein, Attaching the connection interface to the second section of the elongated conductor includes welding, diffusion welding, sintering, gluing, soldering, or crimping.

6. The method according to claim 1, further comprising: The second segment of the elongated conductor is bent in one or more dimensions.

7. The method according to claim 1, wherein, Attaching the first segment of the elongated conductor to the substrate includes welding, diffusion welding, sintering, gluing, or soldering.

8. The method according to claim 1, further comprising: The first segment of the elongated conductor is bent in one or more dimensions.

9. The method according to claim 1, further comprising: The electrically insulating coating is removed from the third section of the elongated conductor, wherein the third section of the elongated conductor is located at the end of the curved section or between the ends of the curved section after the curved section is cut from the block of the elongated conductor.

10. The method of claim 9, further comprising: The third segment of the elongated conductor is attached to the substrate.

11. The method according to claim 9, wherein, The bent section is fixed to the frame such that the third section of the elongated conductor is at least partially exposed from the surface of the frame.

12. The method according to claim 9, further comprising: The connection interface is attached to the third section of the elongated conductor. The curved section is fixed to the frame such that the connection interface is at least partially exposed from the surface of the frame.

13. The method according to claim 1, further comprising: After the frame is attached to the substrate of the power module, an insulating gel is added to the volume defined by the substrate and the frame, such that the first segment of the substrate and the elongated conductor is at least partially covered by the gel, and the portion of the curved segment between the ends of the curved segment is at least partially not covered by the gel.

14. The method according to claim 13, wherein, The insulating gel has a depth of less than or equal to 5 mm from the surface of the substrate to which the first segment of the elongated conductor is attached.

15. The method according to claim 1, wherein, The frame is an electrically insulating molded frame.

16. The method according to claim 15, wherein, Securing the curved segment to the molded frame includes: During the formation of the molded frame, a portion of the bent section is inserted into a mold that forms the molded frame; and A liquefied molding compound is injected into the mold, such that the portion of the curved section is embedded in the liquefied molding compound.

17. The method according to claim 1, wherein, Securing the curved segment to the frame includes securing the curved segment to one or more pre-formed notches, rings, clamps, loops, wire harnesses, and / or recesses on the inner wall of the frame.

18. The method according to claim 1, wherein, Bending the elongated conductor in one or more dimensions to form the bent segment includes: twisting the elongated conductor about its longitudinal axis.

19. The method according to claim 1, wherein, The cross-section of the elongated conductor is circular, square, rectangular, or elliptical.

20. The method according to claim 1, wherein, The elongated conductor has a flat profile, the flat profile having a width in a first direction perpendicular to the longitudinal axis of the elongated conductor and a height in a second direction perpendicular to both the first direction and the longitudinal axis of the elongated conductor, wherein the width is greater than the height.

21. The method according to claim 1, wherein, The curved segment is a first curved segment, and the method further includes: Remove the electrically insulating coating from each of the third and fourth segments of the elongated conductor; The elongated conductor is bent in one or more dimensions to form a second bent segment of the elongated conductor; Cut the second curved segment of the elongated conductor from the block of the elongated conductor, such that each of the third and fourth segments of the elongated conductor is at the end of the second curved segment or between the ends of the second curved segment; Secure the second bent segment to the frame of the power module; and The third segment of the elongated conductor is attached to the substrate.

22. The method according to claim 21, wherein, The first curved segment has a first curved profile, and the second curved segment has a second curved profile that is different from the first curved profile.

23. The method according to claim 21, wherein, The frame is an electrically insulating molded frame, and wherein fixing the first bent segment and the second bent segment to the molded frame includes: During the formation of the molded frame, portions of the first bent section and the second bent section are inserted into a mold shaped to form the molded frame; and A liquefied molding compound is injected into the mold such that the portion of the first curved segment and the portion of the second curved segment are embedded in the liquefied molding compound.

24. The method according to claim 1, wherein, Removing the electrically insulating coating from the first and second sections of the elongated conductor, bending the elongated conductor in one or more dimensions to form a curved segment of the elongated conductor, and cutting the curved segment of the elongated conductor from the block of the elongated conductor are all accomplished using a single manufacturing tool.

25. A power module, comprising: At least one power semiconductor die attached to a substrate; A frame attached to the substrate; as well as An elongated conductive segment, the elongated conductive segment being fixed to the frame, and comprising: First exposed section; Second exposure zone; Unexposed segments that bend in one or more dimensions; and An electrical insulating material is applied to the unexposed sections but not to the first or second exposed sections. The first exposed section of the elongated conductive segment is attached to the substrate.

26. The power module according to claim 25, further comprising: An insulating gel at least partially fills the volume defined by the substrate and the frame, such that the first exposed section of the substrate and the elongated conductive segment is at least partially covered by the gel, and a portion of the unexposed section and a portion of the second exposed section are at least partially not covered by the gel. The insulating gel is made of a material different from the electrically insulating material coating of the elongated conductive segment.

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